Project report

On
TABLE OF CONTENTS: -
1. ABSTARCT
2. INTRODUCTION
3. MOTIVATION
4. BLOCK DIAGRAM
5. BLOCK DIGRAM DISCRIPATION
6. POWER SUPPLY
7. CUIRCUIT DISCRIPATION
8. PCB LAYOUT
9. APPLICATION
10. COMPONENT LIST
11. RESULTS AND CONCLUSIONS
12. REFERENCE

1) ABSTARCT

DEPT.
2 OF ELECTRICAL ENGG. SHREE SAI POLYTECHNIC, CHANDRAPUR
 2) INTRODUCTION

3) BLOCK DIAGRAM

2. POWER SUPPLY MODULE

1) TRANSFORMER:

Transformer is the main component of the power supply module. There are two types of
transformer namely Step up and Step Down. We have used Step down transformer as we have to
generate 5 volts and 12 volts DC supply from the 230 volts input AC supply so we have used 15
volts / 500 mA transformers which mean its output will be 15 volts AC with current rating of 500
mA.

Types of Transformer:

1. Core type Transformer

2. Shell type Transformer
3. Berry type Transformer

DEPT.
3 OF ELECTRICAL ENGG. SHREE SAI POLYTECHNIC, CHANDRAPUR
2) RECTIFIER:

Rectifieris used to rectify the negative half cycles of the output signal of the secondary of the
transformer. So at the input of the rectifier We have AC signal with both positive and negative
cycles and at the output of the rectifier We have signal with only positive cycles but as this signal
is also AC We have to use capacitor to filter out the AC of the output signal. There are mainly
three types of rectifiers namely half wave, Full wave and Bridge rectifier. Out of these three we
have used Bridge rectifier since it give more efficiency. A full wave rectifier converts the whole
of the input waveform to one of constant polarity (positive or negative) at its output by reversing
the negative (or positive) portions of the alternating current waveform .The positive (negative)
portions thus combine with the reversed negative (positive) portions to produce an entirely
positive (negative) voltage/current waveform. For single phase AC is center tapped, and then two
diodes back to back (i.e. anode to anode or cathode to cathode) form a full wave rectifier.

Rectifier designing 1N4007 diodes are used to build circuit of full wave bridge rectifier

Surge overload rating - 50 amperes peak

Ideal for printed circuit board
Reliable low cost construction utilizing molded plastic technique results in inexpensive
product
Mounting Position: Any

For diode design:-

PIV = Vm

Vm = E0 max + 2 Vf

= 10.7 + 1.4 V

= 12.1 V

I0 = Il/2

DEPT.
4 OF ELECTRICAL ENGG. SHREE SAI POLYTECHNIC, CHANDRAPUR
 = 116.2 mA/ 2

= 58.1 mA

Peak repetitive current

Ifm = [Il (t1+t2)]/t2

T2 = time for 90 - time for 1

= 5ms - 3.4ms

=1.2ms

Ifm = 116.2mA( 8.6ms+1.2ms) /1.2ms

= 833mA

From above specification diode 1N4007 is selected

3) FILTER CAPACITOR:

As mentionedabove we have to use filter capacitor to remove the AC signal from the
output of rectifier. Filter capacitor is used in order to remove ripples from the pulsating DC and
convert it to unregulated DC.

A capacitor is an electrical device that can store energy in the electric field between a pair of
closely spaced conductors (called plates). When voltage is applied to the capacitor, electric
charges of equal magnitude, but opposite polarity, build up on the plate.

Capacitors are used in electrical circuits as energy storage devices. They can also be used to
differentiate between high frequency and low frequency signals and this makes them useful in
electronic filters. These small deviations from the ideal behavior of the device can become
significant when it is operating under certain conditions, i.e. high frequency, high current, or
temperature extremes.

PIV =100V

I = 1A

For filter capacitor design :-

DEPT.
5 OF ELECTRICAL ENGG. SHREE SAI POLYTECHNIC, CHANDRAPUR
 C= (I1 * t1)/Vr

Vr= ripple voltage

Il = load current

T1= time during which the capacitor being discharge by load current

Vr = ripple voltage 10% of output voltage

Vr = 1.0 V

Frequency 50 HZ

T1 = 1/50 = 20 ms

T for 360 = 20ms

For 180= 10ms

For 60= 20ms * (60/360)

= 3.4ms

For bridge :-

T1 = [time for 90 + time for 1]

= 5ms + 3.4ms

= 8.4ms

I1 = load current supplied to various IC

I1 = current required for LCD + o/p current of 89S51 +

o/p current of max232 + current required for LM35 +

+ Current required for heart beat sensor + current required

For GPS SR-87

= 3mA + 40mA + 8mA + 0.060mA + 22mA + 40mA

DEPT.
6 OF ELECTRICAL ENGG. SHREE SAI POLYTECHNIC, CHANDRAPUR
 = 113.06Ma

C = I1 * T1/ Vr

= 113.06 * 8.4 * 10^-6 / 1

= 949.704 F

Thus this 949.704 F value can be approximated to 1000 F. Thus we will use 1000 F capacitor
before IC 7805, which is used for improving Frequency Response

4) VOLTAGE REGULATOR:

Two separate voltage regulators are used after the filter capacitor so as to generate
constant DC voltage supply of 5 volts and 12 volts. We have used 7805 and 7812 as a voltage
regulator. Both of them are three pin IC which are namely input, ground and output. We have to
give out put of filter capacitor to the input of regulator, and we get 5 volts and 12 volts supply at
the output pin of the respective regulator.

Transformer selection: we require 12V for min input for IC 7805

= Drop across IC 7805 + Required Output voltage

= 3 V+ 5V

=8V

So at Input of 7805 we required 8 V with margin

Consider drop across diode 0.7V so 2 diode conducts drop is 1.4 V

= 1.4 V +8 V

= 9.4 V

So at secondary we required 10 V

Fixed voltage regulator IC 7805 produces +5V regulated output voltage with respect to the
ground.

Output Current in Excess of 1.0 A

No External Components Required

DEPT.
7 OF ELECTRICAL ENGG. SHREE SAI POLYTECHNIC, CHANDRAPUR
 Internal Thermal Overload Protection
Internal Short Circuit Current Limiting
Output Transistor SafeArea Compensation
Output Voltage Offered in 2% and 4% Tolerance
Available in Surface MountD2PAK, DPAK and Standard 3Lead
Transistor Packages

Waveforms for Power supply module

We get 230 volts A.C. supply

from the power grid (Electricity
board). The voltage amplitude is
of 230 volts and the frequency is
50 Hz.

DEPT.
8 OF ELECTRICAL ENGG. SHREE SAI POLYTECHNIC, CHANDRAPUR
 By using a Step down tranformer
we are lowering the 230 volt AC
supply to a lower value (e.g., 15
V) using a transformer. This
lower voltage is still AC. The
voltage amplitude is reduced but
the frequency is same, which is
50 Hz

Then rectification is done by a

set of 4 diodes (Bridge rectifier),
this rectifier transforms this AC
voltage into pulsating voltage.
The negative half cycles of
transformer output are converted
to positive half cycles.

The next step is filtering, which

is done by an electrolytic
capacitor of 100microF, this filter
capacitor transforms this
pulsating voltage into almost DC.
This is having ripples.

DEPT.
9 OF ELECTRICAL ENGG. SHREE SAI POLYTECHNIC, CHANDRAPUR
 The voltage obtained after the
capacitor oscillates a little bit
(this oscillation is called ripple),
so a voltage regulating stage is
necessary, done by a voltage
regulator IC. After this stage the
output is true DC voltage

DEPT.
10 OF ELECTRICAL ENGG. SHREE SAI POLYTECHNIC, CHANDRAPUR
Power supply: -

Diagram: -

Working: - The power supply gives +5v and +12v supply to the circuit. The power supply
consists of four stages namely transformer, rectifier, filter, and regulator. Transformer is a step-
down transformer taking input of 230v AC and giving output of 15v at the secondary. This 15v
AC is rectified by bridge rectifier consisting of four diodes, which converts the AC wave into
fully rectified wave. The next stage is the filter stage consisting of capacitor, which converts the
fully rectified wave into the DC wave with some ripple. Last stage is the regulator stage.
Regulator removes the entire ripple and gives pure DC. The LED is connected to indicate that
power supply is ON.

DEPT.
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5. CIRCUIT DIAGRAM

6. Explanation of Circuit diagram

PCB LAYOUT

A printed circuit board, or PCB, is used to mechanically support and electrically

connect electronic components using conductive pathways, tracks or traces etched from
copper sheets laminated onto a non-conductive substrate. It is also referred to as printed
wiring board (PWB) or etched wiring board. A PCB populated with electronic
components is a printed circuit assembly (PCA), also known as a printed circuit board
assembly (PCBA).

Printed Circuit Boards play a vital role

here in determining the overall performance of
the electronic equipment. A good PCB design
ensures that the noise introduced as a result of
component placement and track layout is held
within limits while still providing components
years of assembly maintenance and performance reliability.

Where and Why are PCBs used?

Printed circuits boards are used to route electric signals through copper track which are
firmly bonded to an insulating base.

DEPT.
12 OF ELECTRICAL ENGG. SHREE SAI POLYTECHNIC, CHANDRAPUR
Advantages of PCB over common wiring are:

1. PCBs are necessary for connecting a large number of electronic components in a very
small area with minimum parasitic effects.

2. PCBs are simulated with mass production with less chance of writing error.

3. Small components are easily mounted.

Base Materials used for PCB

The base materials used for PCBs are glass epoxy, epoxy paper, polyester etc. Copper
foil used for copper clad is manufactured by the process of electronic deposition.

Preparation of Single Sided PCB

In single sided PCB conductor tracks are present on one side of copper clad
board. So crossing of conductors is not allowed. It is mechanically & chemically
cleansed. The photo resist is an organic solution which when exposed to light of proper
wavelength, changes their solubility in developer but after exposure to light is not
soluble.

Laminate coating of photo resist is done by: (i) Spray coating (ii) Dip coating (iii) Roller
coating.

The coated copper clad and laminated film negative is kept in intimate contact with each
other. The assembly is exposed to UV light and is rinsed in the developer tank. Proper
developer has to be used for a particular photo resist and then the PCB is dyed in a tray.
The dye reveals the flux to be used for a particular photo resist. Then the PCB is dyed in
a tray.

DEPT.
13 OF ELECTRICAL ENGG. SHREE SAI POLYTECHNIC, CHANDRAPUR
FABRICATION

The required circuit is designed and the layout of the circuit is done on the component
side as well as the copper clad side. Spaces are provided for holes to insert the respective
components. Etch resistant ink coatings are given on the interconnecting marks.

ETCHING

The copper clad PCB is

etched with ferrous chloride
solution containing a small
amount of Hydro Chloric Acid
for increasing activeness of
Ferric Chloride in etching.
Wherever the varnish coating
is there the copper remains.

The vast majority of

printed circuit boards are made by bonding a layer of copper over the entire substrate,
sometimes on both sides, (creating a "blank PCB") then removing unwanted copper after
applying a temporary mask (e.g. by etching), leaving only the desired copper traces. A
few PCBs are made by adding traces to the bare substrate (or a substrate with a very thin
layer of copper) usually by a complex process of multiple electroplating steps.

DEPT.
14 OF ELECTRICAL ENGG. SHREE SAI POLYTECHNIC, CHANDRAPUR
There are three common "subtractive" methods (methods that remove copper) used for
the production of printed circuit boards:

1. Silk screen printing uses etch-resistant inks to protect the copper foil. Subsequent
etching removes the unwanted copper. Alternatively, the ink may be conductive, printed
on a blank (non-conductive) board. The latter technique is also used in the manufacture of
hybrid circuits.

2. Photoengraving uses a photomask and chemical etching to remove the copper foil
from the substrate. The photomask is usually prepared with a photoplotter from data
produced by a technician using CAM, or computer-aided manufacturing software. Laser-
printed transparencies are typically employed for phototools; however, direct laser
imaging techniques are being employed to replace phototools for high-resolution
requirements.

4. PCB milling uses a two or three-axis mechanical milling system to mill away the
copper foil from the substrate. A PCB milling machine (referred to as a 'PCB
Prototyper') operates in a similar way to a plotter, receiving commands from the
host software that control the position of the milling head in the x, y, and (if
relevant) z axis. Data to drive the Prototyper is extracted from files generated in
PCB design software and stored in HPGL or Gerber file format.

DRILLING

Holes through a PCB are typically drilled with tiny drill bits made of solid
tungsten carbide. The drilling is performed by automated drilling machines with
placement controlled by a drill tape or drill file. These computer-generated files are also
called numerically controlled drill (NCD) files or "Excellon files".

DEPT.
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 The drill file describes the location and size of each drilled hole. These holes are
often filled with annular rings (hollow rivets) to create vias. Vias allow the electrical and
thermal connection of conductors on opposite sides of the PCB.

Plating and Coating

PCBs are plated with Solder, Tin, or Gold over Nickel as a resist for etching (removal)
away the (unneeded after plating) underlying copper. Matte solder is usually fused to
provide a better bonding surface or stripped to bare copper.

Treatments, such as benzimidazolethiol, prevent surface oxidation of bare copper. The

places to which components will be mounted are typically plated, because untreated bare
copper oxidizes quickly, and therefore is not readily solderable. Traditionally, any
exposed copper was coated with solder by hot air solder levelling (HASL). This solder
was a tin-lead alloy, however new solder compounds are now used to achieve compliance
with the RoHS directive in the EU and US, which restricts the use of lead. One of these
lead-free compounds is SN100CL, made up of 99.3% tin, 0.7% copper, 0.05% nickel,
and a nominal of 60ppm germanium.

SOLDERING

Soldering is the process of joining of two metals using an alloy solder consisting of Tin
and Lead (Sn-Pb). Tin determines the melting whereas the Lead is used to reduce the
cost. After the PCB fabrication is done, the various components are arranged at proper
locations on the PCB and then the soldering is done. All liquids consist of particles which
attract each other. The surface is always trying to shrink and this is because of surface
tension. The principle behind soldering is that when liquid particles are brought in contact
with the walls of the solid surface, it may happen that the solid attracts the liquid surface.
This property is called adhesive property. Care must be taken that the melting point of
solder is below that of the metal so that its surface is melted without melting without the
metal.

DEPT.
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5. WORKING

ADVANTAGES OF PROJECT

APPLICATION OF PROJECT

FUTURE SCOPE

CONCLUSION

DEPT.
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With the knowledge of new techniques in Electronics we are able to make our life more
comfortable. One such application of electronics is used in REMOTE CONTOLLING
OF HOME APPLIENCES. The same circuit finds its use in many more applications. By
this the intensity of light can be controlled using a remote. The intensity of light can be
controlled in five levels from off position to maximum intensity possible. So it finds use
as a night lamp by keeping the intensity of lamp in low level. The circuit also finds its use
for switching ON and OFF any electronic circuitry. Our normal T.V remote can be used
for all these purposes. So it is very useful or a real help to old age and sick people, since
they can control the speed from the place where they are sitting. We feel that our product
serves something good to this world and we like to present it before this prosperous
world.

14. REFERENCES

DEPT.
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Websites:

www.datasheetlocator.com

www.atmel.com

www.electronicsforu.com

Books:

Micro controller by Ayala

Embedded System by Mazidi

Microprocessor and micro controller: U. A. Bakshi

16. DATASHEETS

1) Microcontroller AT89s51
2) Voltage Regulator IC - 7805
3) Voltage Regulator IC - 7812
4) IC555
5) Liquid Crystal Display
6) Temperature sensor

DEPT.
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