LM358, LM258, LM158, LM2904 Dual Operational Amplifiers: 1 Features 2 Applications
LM358, LM258, LM158, LM2904 Dual Operational Amplifiers: 1 Features 2 Applications
LM358, LM258, LM158, LM2904 Dual Operational Amplifiers: 1 Features 2 Applications
IN+ + OUT
IN
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM2904, LM2904V
SLOS068U JUNE 1976 REVISED JANUARY 2017 www.ti.com
Table of Contents
1 Features .................................................................. 1 8.2 Functional Block Diagram ....................................... 12
2 Applications ........................................................... 1 8.3 Feature Description................................................. 13
3 Description ............................................................. 1 8.4 Device Functional Modes........................................ 13
4 Revision History..................................................... 2 9 Application and Implementation ........................ 14
9.1 Application Information............................................ 14
5 Pin Configuration and Functions ......................... 3
9.2 Typical Application ................................................. 14
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4 10 Power Supply Recommendations ..................... 15
6.2 ESD Ratings.............................................................. 4 11 Layout................................................................... 15
6.3 Recommended Operating Conditions....................... 4 11.1 Layout Guidelines ................................................. 15
6.4 Thermal Information .................................................. 5 11.2 Layout Examples................................................... 16
6.5 Electrical Characteristics for LMx58.......................... 5 12 Device and Documentation Support ................. 17
6.6 Electrical Characteristics for LM2904 ....................... 6 12.1 Documentation Support ........................................ 17
6.7 Electrical Characteristics for LM158A and LM258A . 7 12.2 Related Links ........................................................ 17
6.8 Electrical Characteristics for LM358A ....................... 7 12.3 Receiving Notification of Documentation Updates 17
6.9 Operating Conditions ................................................ 8 12.4 Community Resources.......................................... 17
6.10 Typical Characteristics ............................................ 9 12.5 Trademarks ........................................................... 17
7 Parameter Measurement Information ................ 11 12.6 Electrostatic Discharge Caution ............................ 17
12.7 Glossary ................................................................ 17
8 Detailed Description ............................................ 12
8.1 Overview ................................................................. 12 13 Mechanical, Packaging, and Orderable
Information ........................................................... 18
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Added Applications section, ESD Ratings table, Feature Description section, Device Functional Modes, Application
and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section ............................................................... 1
Converted this data sheet from the QS format to DocZone using the PDF on the web ........................................................ 1
Deleted Ordering Information table ........................................................................................................................................ 1
Updated Features to include Military Disclaimer .................................................................................................................... 1
Added Typical Characteristics section.................................................................................................................................... 9
Added ESD warning ............................................................................................................................................................. 17
Product Folder Links: LM158 LM258 LM258A LM358 LM358A LM2904 LM2904V
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM2904, LM2904V
www.ti.com SLOS068U JUNE 1976 REVISED JANUARY 2017
1OUT
V CC+
1OUT 1 8 VCC
NC
NC
NC
1IN 2 7 2OUT
3 2 1 20 19
1IN+ 3 6 2IN NC 4 18 NC
GND 4 5 2IN+ 1IN 5 17 2OUT
NC 6 16 NC
1IN+ 7 15 2IN
NC 8 14 NC
9 10 11 12 13
GND
2IN+
NC
NC
NC
NC - No internal connection
Pin Functions
PIN
SOIC, SSOP,
CDIP, PDIP I/O DESCRIPTION
NAME LCCC NO.
SO, TSSOP,
CFP NO.
1IN 5 2 I Negative input
1IN+ 7 3 I Positive input
1OUT 2 1 O Output
2IN 15 6 I Negative input
2IN+ 12 5 I Positive input
2OUT 17 7 O Output
GND 10 4 Ground
1
3
4
6
8
9
NC Do not connect
11
13
14
16
18
19
VCC 8 Power supply
VCC+ 20 Power supply
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
LMx58, LMx58x, LM2904 UNIT
LM2904V
MIN MAX MIN MAX
VCC Supply voltage (2) 0.3 16 or 32 0.3 13 or 26 V
VID Differential input voltage (3) 32 32 26 26 V
either
VI Input voltage 0.3 32 0.3 26 V
input
Duration of output short circuit (one amplifier) to ground at
(or below) TA = 25C, Unlimited Unlimited s
VCC 15 V (4)
LM158, LM158A 55 125
LM258, LM258A 25 85
TA Operating free air temperature C
LM358, LM358A 0 70
LM2904 40 125 40 125
TJ Operating virtual junction temperature 150 150 C
Case temperature for 60
FK package 260 C
seconds
Lead temperature 1.6 mm (1/16
JG package 300 300 C
inch) from case for 60 seconds
Tstg Storage temperature 65 150 65 150 C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values (except differential voltages and VCC specified for the measurement of IOS) are with respect to the network GND.
(3) Differential voltages are at IN+, with respect to IN.
(4) Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
Product Folder Links: LM158 LM258 LM258A LM358 LM358A LM2904 LM2904V
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM2904, LM2904V
www.ti.com SLOS068U JUNE 1976 REVISED JANUARY 2017
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
(1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX
VCC for testing purposes is 26 V for LM2902 and 30 V for the others.
(2) Full range is 55C to 125C for LM158, 25C to 85C for LM258, and 0C to 70C for LM358, and 40C to 125C for LM2904.
(3) All typical values are at TA = 25C
Copyright 19762017, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: LM158 LM258 LM258A LM358 LM358A LM2904 LM2904V
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM2904, LM2904V
SLOS068U JUNE 1976 REVISED JANUARY 2017 www.ti.com
Non-A-suffix 25C 3 7
VCC = 5 V to MAX, devices Full range 10
VIO Input offset voltage VIC = VICR(min), mV
VO = 1.4 V 25C 1 2
A-suffix devices
Full range 4
Average temperature coefficient
VIO Full range 7 V/C
of input offset voltage
25C 2 50
Non-V device
Full range 300
IIO Input offset current VO = 1.4 V nA
25C 2 50
V-suffix device
Full range 150
Average temperature coefficient
IIO Full range 10 pA/C
of input offset current
25C 20 250
IIB Input bias current VO = 1.4 V nA
Full range 500
0 to
25C
Common-mode input VCC 1.5
VICR VCC = 5 V to MAX V
voltage range 0 to
Full range
VCC 2
RL 10 k 25C VCC 1.5
(1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX
VCC for testing purposes is 26 V for LM2902 and 32 V for LM2902V.
(2) Full range is 55C to 125C for LM158, 25C to 85C for LM258, 0C to 70C for LM358, and 40C to 125C for LM2904.
(3) All typical values are at TA = 25C.
Product Folder Links: LM158 LM258 LM258A LM358 LM358A LM2904 LM2904V
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM2904, LM2904V
www.ti.com SLOS068U JUNE 1976 REVISED JANUARY 2017
Average temperature
VIO coefficient of input Full range 7 15 (3) 7 15 A/C
offset voltage
25C 2 10 2 15
IIO Input offset current VO = 1.4 V nA
Full range 30 30
Average temperature
IIO coefficient of input Full range 10 200 10 200 pA/C
offset current
25C 15 50 15 80
IIB Input bias current VO = 1.4 V nA
Full range 100 100
0 to 0 to
25C
Common-mode input VCC 1.5 VCC 1.5
VICR VCC = 30 V V
voltage range 0 to 0 to
Full range
VCC 2 VCC 2
RL 2 k 25C VCC 1.5 VCC 1.5
High-level output
VOH RL= 2k Full range 26 26 V
voltage VCC = 30 V
RL 10k Full range 27 28 27 28
Low-level output
VOL RL 10 k Full range 5 20 5 20 mV
voltage
Large-signal VCC = 15 V, VO = 1 V to 11 V, 25C 50 100 50 100
AVD differential voltage V/mV
RL 2 k Full range 25 25
amplification
Common-mode
CMRR 25C 70 80 70 80 dB
rejection ratio
Supply-voltage
kSVR rejection ratio 25C 65 100 65 100 dB
(VD /VIO)
Crosstalk
VO1/ VO2 f = 1 kHz to 20 kHz 25C 120 120 dB
attenuation
VCC = 15 V, 25C 20 30 60 20 30 60
VID = 1 V, Source
VO = 0 Full range 10 10
mA
IO Output current VCC = 15 V, 25C 10 20 10 20
VID = 1 V, Sink
VO = 15 V Full range 5 5
(1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX
VCC for testing purposes is 26 V for LM2904 and 30 V for others.
(2) All typical values are at TA = 25C.
(3) On products compliant to MIL-PRF-38535, this parameter is not production tested.
(1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX
VCC for testing purposes is 26 V for LM2904 and 30 V for others.
(2) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX
VCC for testing purposes is 26 V for LM2904 and 30 V for others.
(3) All typical values are at TA = 25C.
Copyright 19762017, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Links: LM158 LM258 LM258A LM358 LM358A LM2904 LM2904V
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM2904, LM2904V
SLOS068U JUNE 1976 REVISED JANUARY 2017 www.ti.com
Product Folder Links: LM158 LM258 LM258A LM358 LM358A LM2904 LM2904V
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM2904, LM2904V
www.ti.com SLOS068U JUNE 1976 REVISED JANUARY 2017
20 0.36
18 0.34 55C
16 0C
0.32
14 125C
12 0.3
10 0.28
8
0.26
6 5Vdc
15Vdc 0.24
4
30Vdc
2 0.22
0 0.2
55 35 15 5 25 45 65 85 105 125 0 5 10 15 20 25 30
Temperature (C) Supply Voltage (Vdc)
Figure 1. Input Current vs. Temperature Figure 2. Supply Current vs. Supply Voltage
160 100
RL=20K 90 CMRR
140
RL=2K 80
120
Avol Voltage Gain (dB)
70
100
CMRR (dB)
60
80 50
40
60
30
40
20
20 10
0 0
0 5 10 15 20 25 30 35 40 0.1 1 10 100 1000
V+ Supply Voltage (Vdc) Frequency (kHz) C001
Figure 3. Voltage Gain vs. Supply Voltage Figure 4. Common-mode Rejection Ratio vs. Frequency
3.5 0.50
VOUT
3.0 0.45
2.5
0.40
Voltage (V)
Voltage (V)
2.0
0.35
1.5
0.30
1.0
0.25
0.5
VOUT
0.0 0.20
0 4 8 12 16 20 24 28 32 36 40 0 2 4 6 8 10
Time ( s) C001
Time ( s) C001
Figure 5. Voltage Follower Large Signal Response (50 pF) Figure 6. Voltage Follower Small Signal Response (50 pF)
6
12.5
5
10
4
7.5
3
5
2.5 2
0 1
1 10 100 1k 0.001 0.01 0.1 1 10 100
Frequency (kHz) Output Sink Current (mAdc)
Figure 7. Maximum Output Swing vs. Frequency Figure 8. Output Sourcing Characteristics
(VCC = 15 V)
10 90
5Vdc
80
15Vdc
1 60
50
40
0.1 30
20
10
0.01 0
0.001 0.01 0.1 1 10 100 55 35 15 5 25 45 65 85 105 125
Output Sink Current (mAdc) Temperature (C)
Product Folder Links: LM158 LM258 LM258A LM358 LM358A LM2904 LM2904V
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM2904, LM2904V
www.ti.com SLOS068U JUNE 1976 REVISED JANUARY 2017
8 Detailed Description
8.1 Overview
These devices consist of two independent, high-gain frequency-compensated operational amplifiers designed to
operate from a single supply over a wide range of voltages. Operation from split supplies also is possible if the
difference between the two supplies is 3 V to 32 V (3 V to 26 V for the LM2904 device), and VCC is at least 1.5 V
more positive than the input common-mode voltage. The low supply-current drain is independent of the
magnitude of the supply voltage.
Applications include transducer amplifiers, DC amplification blocks, and all the conventional operational amplifier
circuits that now can be implemented more easily in single-supply-voltage systems. For example, these devices
can be operated directly from the standard 5-V supply used in digital systems and easily can provide the required
interface electronics without additional 5-V supplies.
VCC+
OUT
IN
IN+ 50-A
Current
Regulator
To Other Amplifier
COMPONENT COUNT
Epi-FET 1
Diodes 2
Resistors 7
Transistors 51
Capacitors 2
Product Folder Links: LM158 LM258 LM258A LM358 LM358A LM2904 LM2904V
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM2904, LM2904V
www.ti.com SLOS068U JUNE 1976 REVISED JANUARY 2017
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TIs customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
RI Vsup+
VOUT
+
VIN
Vsup-
(1)
(2)
Once the desired gain is determined, choose a value for RI or RF. Choosing a value in the kilohm range is
desirable because the amplifier circuit will use currents in the milliamp range. This ensures the part will not draw
too much current. This example will choose 10 k for RI which means 36 k will be used for RF. This was
determined by Equation 3.
(3)
Product Folder Links: LM158 LM258 LM258A LM358 LM358A LM2904 LM2904V
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM2904, LM2904V
www.ti.com SLOS068U JUNE 1976 REVISED JANUARY 2017
0.5
Volts
0
-0.5
-1
-1.5
-2
0 0.5 1 1.5 2
Time (ms)
CAUTION
Supply voltages larger than 32 V for a single supply (26 V for the LM2904), or outside
the range of 16 V for a dual supply (13 V for the LM2904) can permanently damage
the device (see the Absolute Maximum Ratings).
Place 0.1-F bypass capacitors close to the power-supply pins to reduce errors coupling in from noisy or high
impedance power supplies. For more detailed information on bypass capacitor placement, refer to the Layout.
11 Layout
RIN
VIN +
VOUT
RG
RF
Product Folder Links: LM158 LM258 LM258A LM358 LM358A LM2904 LM2904V
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM2904, LM2904V
www.ti.com SLOS068U JUNE 1976 REVISED JANUARY 2017
12.5 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
12.7 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms and definitions.
Product Folder Links: LM158 LM258 LM258A LM358 LM358A LM2904 LM2904V
PACKAGE OPTION ADDENDUM
www.ti.com 17-Mar-2017
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
5962-87710012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
87710012A
LM158FKB
5962-8771001PA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 8771001PA
LM158
5962-87710022A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
87710022A
LM158AFKB
5962-8771002PA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 8771002PA
LM158A
LM158AFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
87710022A
LM158AFKB
LM158AJG ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 LM158AJG
LM158AJGB ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 8771002PA
LM158A
LM158FKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
87710012A
LM158FKB
LM158JG ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 LM158JG
LM158JGB ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 8771001PA
LM158
LM258AD ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM258A
& no Sb/Br)
LM258ADGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS CU NIPDAU | Level-1-260C-UNLIM -25 to 85 (M3L ~ M3P ~ M3S ~
& no Sb/Br) CU NIPDAUAG M3U)
LM258ADGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -25 to 85 (M3L ~ M3P ~ M3S ~
& no Sb/Br) M3U)
LM258ADR ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU | CU SN Level-1-260C-UNLIM -25 to 85 LM258A
& no Sb/Br)
LM258ADRE4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM258A
& no Sb/Br)
LM258ADRG4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM258A
& no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 17-Mar-2017
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
LM258AP ACTIVE PDIP P 8 50 Pb-Free CU NIPDAU | CU SN N / A for Pkg Type -25 to 85 LM258AP
(RoHS)
LM258APE4 ACTIVE PDIP P 8 50 Pb-Free CU NIPDAU N / A for Pkg Type -25 to 85 LM258AP
(RoHS)
LM258D ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM258
& no Sb/Br)
LM258DE4 ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM258
& no Sb/Br)
LM258DG4 ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM258
& no Sb/Br)
LM258DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS CU NIPDAU | Level-1-260C-UNLIM -25 to 85 (M2L ~ M2P ~ M2S ~
& no Sb/Br) CU NIPDAUAG M2U)
LM258DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -25 to 85 (M2L ~ M2P ~ M2S ~
& no Sb/Br) M2U)
LM258DR ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU | CU SN Level-1-260C-UNLIM -25 to 85 LM258
& no Sb/Br)
LM258DRE4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM258
& no Sb/Br)
LM258DRG3 ACTIVE SOIC D 8 2500 Green (RoHS CU SN Level-1-260C-UNLIM -25 to 85 LM258
& no Sb/Br)
LM258DRG4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM258
& no Sb/Br)
LM258P ACTIVE PDIP P 8 50 Pb-Free CU NIPDAU | CU SN N / A for Pkg Type -25 to 85 LM258P
(RoHS)
LM258PE4 ACTIVE PDIP P 8 50 Pb-Free CU NIPDAU N / A for Pkg Type -25 to 85 LM258P
(RoHS)
LM2904 MWC ACTIVE WAFERSALE YS 0 1 Green (RoHS Call TI Level-1-NA-UNLIM -40 to 85
& no Sb/Br)
LM2904AVQDR ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV
& no Sb/Br)
LM2904AVQDRG4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV
& no Sb/Br)
LM2904AVQPWR ACTIVE TSSOP PW 8 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV
& no Sb/Br)
LM2904AVQPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV
& no Sb/Br)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com 17-Mar-2017
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
LM2904D ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904
& no Sb/Br)
LM2904DE4 ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904
& no Sb/Br)
LM2904DG4 ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904
& no Sb/Br)
LM2904DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS CU NIPDAU | Level-1-260C-UNLIM -40 to 125 (MBL ~ MBP ~ MBS ~
& no Sb/Br) CU NIPDAUAG MBU)
LM2904DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 (MBL ~ MBP ~ MBS ~
& no Sb/Br) MBU)
LM2904DR ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 LM2904
& no Sb/Br)
LM2904DRE4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904
& no Sb/Br)
LM2904DRG3 ACTIVE SOIC D 8 2500 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 LM2904
& no Sb/Br)
LM2904DRG4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904
& no Sb/Br)
LM2904P ACTIVE PDIP P 8 50 Pb-Free CU NIPDAU | CU SN N / A for Pkg Type -40 to 125 LM2904P
(RoHS)
LM2904PE4 ACTIVE PDIP P 8 50 Pb-Free CU NIPDAU N / A for Pkg Type -40 to 125 LM2904P
(RoHS)
LM2904PSR ACTIVE SO PS 8 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904
& no Sb/Br)
LM2904PW ACTIVE TSSOP PW 8 150 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904
& no Sb/Br)
LM2904PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904
& no Sb/Br)
LM2904PWR ACTIVE TSSOP PW 8 2000 Green (RoHS CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 L2904
& no Sb/Br)
LM2904PWRG3 ACTIVE TSSOP PW 8 2000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 L2904
& no Sb/Br)
LM2904PWRG4-JF ACTIVE TSSOP PW 8 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM L2904
& no Sb/Br)
LM2904QDR ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 2904Q1
& no Sb/Br)
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com 17-Mar-2017
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
LM2904QDRG4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 2904Q1
& no Sb/Br)
LM2904VQDR ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V
& no Sb/Br)
LM2904VQDRG4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V
& no Sb/Br)
LM2904VQPWR ACTIVE TSSOP PW 8 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V
& no Sb/Br)
LM2904VQPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V
& no Sb/Br)
LM358AD ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A
& no Sb/Br)
LM358ADE4 ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A
& no Sb/Br)
LM358ADG4 ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A
& no Sb/Br)
LM358ADGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS CU NIPDAU | Level-1-260C-UNLIM 0 to 70 (M6L ~ M6P ~ M6S ~
& no Sb/Br) CU NIPDAUAG M6U)
LM358ADGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 (M6L ~ M6P ~ M6S ~
& no Sb/Br) M6U)
LM358ADR ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU | CU SN Level-1-260C-UNLIM 0 to 70 LM358A
& no Sb/Br)
LM358ADRE4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A
& no Sb/Br)
LM358ADRG4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A
& no Sb/Br)
LM358AP ACTIVE PDIP P 8 50 Pb-Free CU NIPDAU | CU SN N / A for Pkg Type 0 to 70 LM358AP
(RoHS)
LM358APE4 ACTIVE PDIP P 8 50 Pb-Free CU NIPDAU N / A for Pkg Type 0 to 70 LM358AP
(RoHS)
LM358APW ACTIVE TSSOP PW 8 150 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 L358A
& no Sb/Br)
LM358APWE4 ACTIVE TSSOP PW 8 150 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 L358A
& no Sb/Br)
LM358APWR ACTIVE TSSOP PW 8 2000 Green (RoHS CU NIPDAU | CU SN Level-1-260C-UNLIM 0 to 70 L358A
& no Sb/Br)
Addendum-Page 4
PACKAGE OPTION ADDENDUM
www.ti.com 17-Mar-2017
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
Addendum-Page 5
PACKAGE OPTION ADDENDUM
www.ti.com 17-Mar-2017
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 6
PACKAGE OPTION ADDENDUM
www.ti.com 17-Mar-2017
Automotive: LM2904-Q1
Enhanced Product: LM258A-EP
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 7
PACKAGE MATERIALS INFORMATION
www.ti.com 13-Jan-2017
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 13-Jan-2017
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 13-Jan-2017
Pack Materials-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com 13-Jan-2017
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM2904DGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LM2904DR SOIC D 8 2500 333.2 345.9 28.6
LM2904DR SOIC D 8 2500 340.5 338.1 20.6
LM2904DR SOIC D 8 2500 364.0 364.0 27.0
LM2904DR SOIC D 8 2500 367.0 367.0 35.0
LM2904DRG3 SOIC D 8 2500 333.2 345.9 28.6
LM2904DRG3 SOIC D 8 2500 364.0 364.0 27.0
LM2904DRG4 SOIC D 8 2500 367.0 367.0 35.0
LM2904DRG4 SOIC D 8 2500 340.5 338.1 20.6
LM2904PSR SO PS 8 2000 367.0 367.0 38.0
LM2904PWR TSSOP PW 8 2000 364.0 364.0 27.0
LM2904PWR TSSOP PW 8 2000 367.0 367.0 35.0
LM2904PWRG3 TSSOP PW 8 2000 364.0 364.0 27.0
LM2904PWRG4-JF TSSOP PW 8 2000 367.0 367.0 35.0
LM2904QDR SOIC D 8 2500 367.0 367.0 38.0
LM2904VQDR SOIC D 8 2500 340.5 338.1 20.6
LM2904VQPWR TSSOP PW 8 2000 367.0 367.0 35.0
LM2904VQPWRG4 TSSOP PW 8 2000 367.0 367.0 35.0
LM358ADGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LM358ADR SOIC D 8 2500 340.5 338.1 20.6
LM358ADR SOIC D 8 2500 333.2 345.9 28.6
LM358ADR SOIC D 8 2500 367.0 367.0 35.0
LM358ADR SOIC D 8 2500 364.0 364.0 27.0
LM358ADRG4 SOIC D 8 2500 340.5 338.1 20.6
LM358ADRG4 SOIC D 8 2500 367.0 367.0 35.0
LM358APWR TSSOP PW 8 2000 364.0 364.0 27.0
LM358APWR TSSOP PW 8 2000 367.0 367.0 35.0
LM358APWRG4 TSSOP PW 8 2000 367.0 367.0 35.0
LM358DGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LM358DR SOIC D 8 2500 364.0 364.0 27.0
LM358DR SOIC D 8 2500 367.0 367.0 35.0
LM358DR SOIC D 8 2500 340.5 338.1 20.6
LM358DRG3 SOIC D 8 2500 333.2 345.9 28.6
LM358DRG3 SOIC D 8 2500 364.0 364.0 27.0
LM358DRG4 SOIC D 8 2500 367.0 367.0 35.0
LM358DRG4 SOIC D 8 2500 340.5 338.1 20.6
LM358PSR SO PS 8 2000 367.0 367.0 38.0
LM358PWR TSSOP PW 8 2000 364.0 364.0 27.0
LM358PWR TSSOP PW 8 2000 367.0 367.0 35.0
LM358PWRG3 TSSOP PW 8 2000 364.0 364.0 27.0
LM358PWRG4 TSSOP PW 8 2000 367.0 367.0 35.0
LM358PWRG4-JF TSSOP PW 8 2000 367.0 367.0 35.0
Pack Materials-Page 4
MECHANICAL DATA
0.400 (10,16)
0.355 (9,00)
8 5
0.280 (7,11)
0.245 (6,22)
1 4
0.065 (1,65)
0.045 (1,14)
0.023 (0,58)
015
0.015 (0,38)
0.100 (2,54) 0.014 (0,36)
0.008 (0,20)
4040107/C 08/96
C
6.6 SEATING PLANE
TYP
6.2
A PIN 1 ID 0.1 C
AREA
6X 0.65
8
1
3.1 2X
2.9
NOTE 3 1.95
4
5
0.30
8X
0.19
4.5 1.2 MAX
B 0.1 C A B
4.3
NOTE 4
(0.15) TYP
SEE DETAIL A
0.25
GAGE PLANE
0.75 0.15
0 -8 0.05
0.50
DETAIL A
TYPICAL
4221848/A 02/2015
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153, variation AA.
www.ti.com
EXAMPLE BOARD LAYOUT
PW0008A TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
8X (1.5)
8X (0.45) SYMM
(R0.05)
1 TYP
8
SYMM
6X (0.65)
5
4
(5.8)
4221848/A 02/2015
NOTES: (continued)
www.ti.com
EXAMPLE STENCIL DESIGN
PW0008A TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
8X (1.5)
SYMM (R0.05) TYP
8X (0.45)
1
8
SYMM
6X (0.65)
5
4
(5.8)
4221848/A 02/2015
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
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