VS-10CTQ150PbF, VS-10CTQ150-N3

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Vishay Semiconductors
Schottky Rectifier, 2 x 5 A
Base 2
FEATURES
common • 175 °C TJ operation
cathode
• Center tap configuration
• Low forward voltage drop
• High frequency operation
• High purity, high temperature epoxy
Anode 2 Anode
1 Common 3 encapsulation for enhanced mechanical strength
TO-220AB cathode and moisture resistance
• Guard ring for enhanced ruggedness and long
term reliability
PRODUCT SUMMARY
• Compliant to RoHS Directive 2002/95/EC
Package TO-220AB
• Designed and qualified according to JEDEC-JESD47
IF(AV) 2x5A
• Halogen-free according to IEC 61249-2-21 definition
VR 150 V
(-N3 only)
VF at IF 0.73 V
IRM max. 7 mA at 125 °C DESCRIPTION
This center tap Schottky rectifier series has been optimized
TJ max. 175 °C
for low reverse leakage at high temperature. The proprietary
Diode variation Common cathode barrier technology allows for reliable operation up to 175 °C
EAS 6.75 mJ junction temperature. Typical applications are in switching
power supplies, converters, freewheeling diodes, and
reverse battery protection.

MAJOR RATINGS AND CHARACTERISTICS

SYMBOL CHARACTERISTICS VALUES UNITS
IF(AV) Rectangular waveform 10 A
VRRM 150 V
IFSM tp = 5 μs sine 620 A
VF 5 Apk, TJ = 125 °C (per leg) 0.73 V
TJ Range - 55 to 175 °C

VOLTAGE RATINGS
PARAMETER SYMBOL VS-10CTQ150PbF VS-10CTQ150-N3 UNITS
Maximum DC reverse voltage VR
150 150 V
Maximum working peak reverse voltage VRWM

ABSOLUTE MAXIMUM RATINGS

PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum average per leg 5
forward current IF(AV) 50 % duty cycle at TC = 155 °C, rectangular waveform A
See fig. 5 per device 10

Maximum peak one cycle 5 μs sine or 3 μs rect. pulse Following any rated load 620
non-repetitive surge current per leg IFSM condition and with rated A
See fig. 7 10 ms sine or 6 ms rect. pulse VRRM applied 115

Non-repetitive avalanche energy per leg EAS TJ = 25 °C, IAS = 0.30 A, L = 150 mH 6.75 mJ
Current decaying linearly to zero in 1 μs
Repetitive avalanche current per leg IAR 0.30 A
Frequency limited by TJ maximum VA = 1.5 x VR typical

Revision: 22-Aug-11 1 Document Number: 94115

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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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ELECTRICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
5A 0.93
TJ = 25 °C
Maximum forward voltage drop per leg 10 A 1.10
VFM (1) V
See fig. 1 5A 0.73
TJ = 125 °C
10 A 0.86
Maximum reverse leakage current per leg TJ = 25 °C 0.05
IRM (1) VR = Rated VR mA
See fig. 2 TJ = 125 °C 7
Threshold voltage VF(TO) 0.468 V
TJ = TJ maximum
Forward slope resistance rt 28 m
Maximum junction capacitance per leg CT VR = 5 VDC (test signal range 100 kHz to 1 MHz) 25 °C 200 pF
Typical series inductance per leg LS Measured lead to lead 5 mm from package body 8.0 nH
Maximum voltage rate of change dV/dt Rated VR 10 000 V/μs
Note
(1) Pulse width < 300 μs, duty cycle < 2 %

THERMAL - MECHANICAL SPECIFICATIONS

PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum junction and storage
TJ, TStg - 55 to 175 °C
temperature range
Maximum thermal resistance,
3.50
junction to case per leg
RthJC DC operation
Maximum thermal resistance,
1.75 °C/W
junction to case per package
Typical thermal resistance,
RthCS Mounting surface, smooth and greased 0.50
case to heatsink (only for TO-220)
2 g
Approximate weight
0.07 oz.
minimum 6 (5) kgf · cm
Mounting torque
maximum 12 (10) (lbf · in)
Marking device Case style TO-220AB 10CTQ150

Revision: 22-Aug-11 2 Document Number: 94115

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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Vishay Semiconductors

100 100

TJ = 175 °C
IF - Instantaneous Forward

10

IR - Reverse Current (mA)

TJ = 150 °C
1
Current (A)

TJ = 125 °C
TJ = 175 °C
TJ = 125 °C
10 TJ = 25 °C 0.1
TJ = 100 °C

0.01 TJ = 75 °C

TJ = 50 °C
0.001
TJ = 25 °C
1 0.0001
0 0.5 1.0 1.5 2.0 2.5 3.0 0 25 50 75 100 125 150

VFM - Forward Voltage Drop (V) VR - Reverse Voltage (V)

Fig. 1 - Maximum Forward Voltage Drop Characteristics Fig. 2 - Typical Values of Reverse Current vs.
(Per Leg) Reverse Voltage (Per Leg)

1000
CT - Junction Capacitance (pF)

100
TJ = 25 °C

10
0 20 40 60 80 100 120 140 160

VR - Reverse Voltage (V)

Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage (Per Leg)

10
ZthJC - Thermal Impedance (°C/W)

D = 0.75
D = 0.50 PDM
0.1 D = 0.33
t1
D = 0.25
D = 0.20 t2

0.01
Notes:
Single pulse 1. Duty factor D = t1/t2 .
(thermal resistance) 2. Peak TJ = PDM x ZthJC + TC
.
0.001
0.00001 0.0001 0.001 0.01 0.1 1 10 100
t1 - Rectangular Pulse Duration (s)

Fig. 4 - Maximum Thermal Impedance ZthJC Characteristics (Per Leg)

Revision: 22-Aug-11 3 Document Number: 94115

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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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180 5
Allowable Case Temperature (°C)

D = 0.20
D = 0.25

Average Power Loss (W)

170
DC 4 D = 0.33
D = 0.50
160 D = 0.75
3 RMS limit
150 Square wave (D = 0.50) DC
80 % rated VR applied
2
140

1
130
See note (1)
120 0
0 2 4 6 8 0 1 2 3 4 5 6 7 8

IF(AV) - Average Forward Current (A) IF(AV) - Average Forward Current (A)
Fig. 5 - Maximum Allowable Case Temperature vs. Fig. 6 - Forward Power Loss Characteristics (Per Leg)
Average Forward Current (Per Leg)
IFSM - Non-Repetitive Surge Current (A)

1000
At any rated load condition and
with rated VRRM applied
following surge

100
10 100 1000 10 000

tp - Square Wave Pulse Duration (µs)

Fig. 7 - Maximum Non-Repetitive Surge Current (Per Leg)

High-speed
IRFP460 switch
D.U.T.

Rg = 25 Ω Freewheel
diode + Vd = 25 V
Current
monitor 40HFL40S02

Fig. 8 - Unclamped Inductive Test Circuit

Note
(1) Formula used: T = T - (Pd + Pd
C J REV) x RthJC;
Pd = Forward power loss = IF(AV) x VFM at (IF(AV)/D) (see fig. 6);
PdREV = Inverse power loss = VR1 x IR (1 - D); IR at VR1 = 10 V

Revision: 22-Aug-11 4 Document Number: 94115

For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
 VS-10CTQ150PbF, VS-10CTQ150-N3
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Vishay Semiconductors
ORDERING INFORMATION TABLE

Device code VS- 10 C T Q 150 PbF

1 2 3 4 5 6 7

1 - Vishay Semiconductors product

2 - Current rating (10 = 10 A)
3 - Circuit configuration
C = Common cathode
4 - Package
T = TO-220
5 - Schottky “Q” series
6 - Voltage rating (150 = 150 V)
7 - Environmental digit
PbF = Lead (Pb)-free and RoHS compliant
-N3 = Halogen-free, RoHS compliant, and totally lead (Pb)-free

ORDERING INFORMATION (Example)

PREFERRED P/N QUANTITY PER T/R MINIMUM ORDER QUANTITY PACKAGING DESCRIPTION
VS-10CTQ150PbF 50 1000 Antistatic plastic tube
VS-10CTQ150-N3 50 1000 Antistatic plastic tube

LINKS TO RELATED DOCUMENTS

Dimensions www.vishay.com/doc?95222
TO-220AB PbF www.vishay.com/doc?95225
Part marking information
TO-220AB -N3 www.vishay.com/doc?95028

Revision: 22-Aug-11 5 Document Number: 94115

For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
 Outline Dimensions
Vishay Semiconductors

TO-220AB

DIMENSIONS in millimeters and inches

B
(6) A Seating
E plane Thermal pad
ØP A
A (E)
E2 (7) 0.014 M B A M
A1
Q 1 2 3
(6) (H1) D D
H1 L1 (2)
(7) C C
D2 (6)
(6) D Detail B

D1
3xb 3 x b2
1 2 3
Detail B
C
E1 (6)

Base metal (b, b2) Plating

View A - A c c1 (4)
c A
2x e
A2 (4)
e1 b1, b3
0.015 M B A M Section C - C and D - D
Lead assignments
Lead tip
Diodes
Conforms to JEDEC outline TO-220AB
1. - Anode/open
2. - Cathode
3. - Anode

MILLIMETERS INCHES MILLIMETERS INCHES

SYMBOL NOTES SYMBOL NOTES
MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX.
A 4.25 4.65 0.167 0.183 E 10.11 10.51 0.398 0.414 3, 6
A1 1.14 1.40 0.045 0.055 E1 6.86 8.89 0.270 0.350 6
A2 2.56 2.92 0.101 0.115 E2 - 0.76 - 0.030 7
b 0.69 1.01 0.027 0.040 e 2.41 2.67 0.095 0.105
b1 0.38 0.97 0.015 0.038
4 e1 4.88 5.28 0.192 0.208
b2 1.20 1.73 0.047 0.068 H1 6.09 6.48 0.240 0.255 6, 7
b3 1.14 1.73 0.045 0.068
4 L 13.52 14.02 0.532 0.552
c 0.36 0.61 0.014 0.024 L1 3.32 3.82 0.131 0.150 2
c1 0.36 0.56 0.014 0.022
4 ØP 3.54 3.73 0.139 0.147
D 14.85 15.25 0.585 0.600
3 Q 2.60 3.00 0.102 0.118
D1 8.38 9.02 0.330 0.355  90° to 93° 90° to 93°
D2 11.68 12.88 0.460 0.507
6
Notes
(1) Dimensioning and tolerancing as per ASME Y14.5M-1994 (7) Dimensions E2 x H1 define a zone where stamping and
(2) Lead dimension and finish uncontrolled in L1 singulation irregularities are allowed
(3) Dimension D, D1 and E do not include mold flash. Mold flash (8) Outline conforms to JEDEC TO-220, except A2 (maximum) and
shall not exceed 0.127 mm (0.005") per side. These dimensions D2 (minimum) where dimensions are derived from the actual
are measured at the outermost extremes of the plastic body package outline
(4) Dimension b1, b3 and c1 apply to base metal only
(5) Controlling dimensions: inches
(6) Thermal pad contour optional within dimensions E, H1, D2 and
E1

Document Number: 95222 For technical questions within your region, please contact one of the following: www.vishay.com
Revision: 08-Mar-11 [email protected], [email protected], [email protected] 1
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Revision: 08-Feb-17 1 Document Number: 91000