Scribd
Upload
33 views

PCB Design Guidelines For High Power Dissipation Packages: Application Note

PCB Design Guidelines for High Power Dissipation Packages

Uploaded by

kwangjin1980
Copyright
© © All Rights Reserved
Available Formats
Download as PDF, TXT or read online on Scribd
33 views

PCB Design Guidelines For High Power Dissipation Packages: Application Note

PCB Design Guidelines for High Power Dissipation Packages

Uploaded by

kwangjin1980
Copyright
© © All Rights Reserved
Available Formats
Download as PDF, TXT or read online on Scribd
You are on page 1/ 2

APPLICATION NOTE

PCB Design Guidelines for High Power Dissipation Packages


Introduction especially important when no heat sinks are attached to the
This Application Note provides PCB design guidelines for high PCB on the other side of the package.
power dissipation packages that ensure adequate solder coverage 3. Add as many thermal vias as possible directly under the
and optimize heat transfer. As a general rule, high power package ground pad to maximize the effective out-of-plane
dissipation packages can be defined as those that dissipate more thermal conductivity of the board.
than 1.5 W (note that this is not the same as the RF output 4. All thermal vias must be either plated (copper) shut or plugged
power). Such packages are generally those with an exposed and capped on both sides of the mother board (see Figure 2).
electrical/thermal ground pad, such as Multi-Chip Modules This prevents solder seeping in to the thermal vias resulting in
(MCMs), Quad Flat No-Leads (QFNs), etc. solder voids. Solder voids are highly detrimental to the
The amount of power dissipation depends on the RF output power thermal and electrical performance of the package.
and the Power-Added Efficiency (PAE). Power dissipation in the Skyworks recommends using paragraph 3.6.2.11.1 of the
form of heat is the difference between the combined DC and RF Qualification and Performance Specification for Rigid Printed
input power, and the RF output power. Good heat sinking is Boards [1] as the copper wrap plating specification.
absolutely essential to guarantee the long term reliability of these
parts. 5. To ensure reliability and performance, the solder coverage
should be at least 85 percent. This means the total voids on
the ground pad should be less than 15 percent with no single
Design Guidelines void larger than 1 mm. Several smaller voids are always
better than a few big voids.
1. The major heat flow path from the package to the ambient is
through the copper on the PCB (see Figure 1).
2. Maximize the copper coverage on all the layers to increase the
effective in-plane thermal conductivity of the board. This is

Package

Copper

Mother Board

Thermal Via on PCB (see Figure 2)


S1880

Figure 1. Major Heat Dissipation Path From The Die to Ambient

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
201211A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • January 8, 2010 1
APPLICATION NOTE • PCB DESIGN GUIDELINES FOR HIGH POWER DISSIPATION PACKAGES

Package Top

Package Bottom

 (a)
 (b)
x (c)
x (d)
S1881

Figure 2. Thermal Via on PCB


(a) & (b) = Correct Via Design; (c) & (d) = Incorrect Via Design

References
1. Qualification and Performance Specification for Rigid Printed Boards, IPC-6012B, Amendment 1, December 2006.
http://www.ipc.org/4.0_Knowledge/4.1_Standards/6012B-Amendment-1(12-06).pdf

Copyright © 2010 Skyworks Solutions, Inc. All Rights Reserved.

Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided by
Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the
information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to
update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes.

No license, whether express, implied, by estoppel or otherwise, is granted to any intellectual property rights by this document. Skyworks assumes no liability for any materials, products or
information provided hereunder, including the sale, distribution, reproduction or use of Skyworks products, information or materials, except as may be provided in Skyworks Terms and Conditions
of Sale.

THE MATERIALS, PRODUCTS AND INFORMATION ARE PROVIDED “AS IS” WITHOUT WARRANTY OF ANY KIND, WHETHER EXPRESS, IMPLIED, STATUTORY, OR OTHERWISE, INCLUDING FITNESS FOR A
PARTICULAR PURPOSE OR USE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY INTELLECTUAL PROPERTY RIGHT; ALL SUCH WARRANTIES ARE HEREBY EXPRESSLY
DISCLAIMED. SKYWORKS DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS
SHALL NOT BE LIABLE FOR ANY DAMAGES, INCLUDING BUT NOT LIMITED TO ANY SPECIAL, INDIRECT, INCIDENTAL, STATUTORY, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION,
LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THE MATERIALS OR INFORMATION, WHETHER OR NOT THE RECIPIENT OF MATERIALS HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGE.

Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications, or other equipment in which the failure of the Skyworks products could lead to personal injury,
death, physical or environmental damage. Skyworks customers using or selling Skyworks products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any
damages resulting from such improper use or sale.

Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of
products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for
applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of stated published specifications or parameters.

Skyworks, the Skyworks symbol, and “Breakthrough Simplicity” are trademarks or registered trademarks of Skyworks Solutions, Inc., in the United States and other countries. Third-party brands
and names are for identification purposes only, and are the property of their respective owners. Additional information, including relevant terms and conditions, posted at www.skyworksinc.com,
are incorporated by reference.

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
2 January 8, 2010 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 201211A

You might also like