nAN400-08 - QFN Soldering Reflow Guidelines PDF
nAN400-08 - QFN Soldering Reflow Guidelines PDF
nAN400-08 - QFN Soldering Reflow Guidelines PDF
nAN400-08
1 Introduction
The electronic manufacturing industry uses environmentally safe lead-free, or Green, assembly processes.
Factors that should be considered when switching to lead-free soldering materials are:
Note: The wetting of the package side wall is not guaranteed. This is because the QFN package is by
design a “contact down” package. The sidewalls of the leads are not plated since they are
exposed by the singulation step, which takes place after the plating. Depending on the
surface state of the bare copper the sidewalls of the leads may not wet during soldering.
Please see Figure 1 ”The QFN package is by design a “contact down” package”.
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QFN Soldering Reflow Guidelines v1.2
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QFN Soldering Reflow Guidelines v1.2
Note: • Package thickness < 2.5 mm and volume < 350 mm2.
• All temperatures refer to the center of the package, measured on the package body surface
that is facing up during assembly reflow (for example, live-bug).
• Actual board assembly profiles should be developed based on specific process needs and
board designs and should not exceed the parameters in this table.
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QFN Soldering Reflow Guidelines v1.2
Liability disclaimer
Nordic Semiconductor ASA reserves the right to make changes without further notice to the product to
improve reliability, function or design. Nordic Semiconductor ASA does not assume any liability arising out
of the application or use of any product or circuits described herein.
Contact details
For your nearest distributor, please visit http://www.nordicsemi.com.
Information regarding product updates, downloads, and technical support can be accessed through your
My Page account on our homepage.
Revision History
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