Service Manual Nb200
Service Manual Nb200
Service Manual Nb200
Hardware Overview
1 Hardware Overview
Chapter 1 Contents
Figures
Tables
1.1 Features
The Toshiba NB200 is a small-size PC notebook equipped with an Intel® AtomTM Processor,
providing high-speed processing capabilities and advanced features. The computer employs a
lithium ion battery that allows it to be battery-operated for long periods of time. The display uses
10.1-inch WSVGA LCD panel. Many features can be Built To Order (BTO) to customize the
system for each user.
Processor
The computer is equipped with an Intel® AtomTM Processor N270/280 that is XD bit
supported.
Memory (BTO)
The computer has one SODIMM slot which comes standard with 1GB/2GB, accepting BTO
for your memory requirements. It can incorporate up to 1 GB (XP) or 2 GB (Vista/Linux) of
main memory. It supports DDR2 at 533MHz.
The computer is powered by one rechargeable and removable lithium ion battery pack. The
capacity can be either 3-cell or 6-cell, depending on the model of the computer.
RTC Battery
The internal RTC battery backs up the Real Time Clock and calendar.
The computer accommodates a 9.5 mm HDD with the following storage capacities:
120/160 GB, S-ATA (5,400rpm)
Additional HDD sizes may be introduced.
The computer has a 9.5mm Toshiba SSD with the following capacities:
64 GB
Additional SSD sizes may be introduced.
Display
Graphics
Keyboard
The computer is equipped with a tile or flat keyboard. It comes with 85 or 86 keys
supported and with optional Windows and application keys (except for Linux models).
Pointing Device
The integrated Touch Pad and two control buttons in the palm rest allow control of the on-
screen pointer and support functions such as the scrolling of windows.
The analog VGA port provides support for VESA DDC2B compatible functions. A WDDM
driver is ready for Vista.
The computer has three USB 2.0 ports. It is supported to daisy-chain a maximum of 127
USB devices. The serial data transfer rate is 480 Mbps or 12 Mbps and 1.5 Mbps. These
ports support PnP installation and hot plugging. USB Sleep and Charge function can be
supported by only one port of the left side. (mode 1-4)
This slot allows you to insert SD/SDHC, MiniSD/ MicroSD (through adapter) and MMC
memory cards. This model does not support CF cards, SmartMedia cards and Memory
Sticks.
Sound system
The integrated sound system is composed of one 1.0W Zylux / FG internal speaker, an
internal microphone and standard MIC-IN ports.
Internal Camera
A VGA webcam supports 0.3M pixels and comes with an LED indicator. The camera is not
a rotation type.
Internal Microphone
Headphones/Line-out Jack
Microphone/Line-in Jack
LAN
The computer has built-in support for 10M/100M Ethernet LAN (10/100 megabits per
second, 10/100BASE-T). It employs a Realtek 8103EL for 10M/100Mbit LAN.
Some computers in this series are equipped with a Wireless LAN (WLAN) card. This
WLAN module may come with the following types (depending on the model):
Atheros 802.11 bg (HB95 1x1)
3G (BTO)
The 3G module employs a PCI Express Mini Card. It enables computer users to have
mobile access to the internet or to a corporate network. The computer is equipped with
either a Ericsson F3507g model (which supports HSPA) or with a Qualcomm Gobi model
(which supports HSPA and EVDO).
Bluetooth (BTO)
Some computers in this series offer Bluetooth wireless communication functionality which
eliminates the need for cables between electronic devices such as computers and printers.
When implemented, Bluetooth provides wireless communication in a small space. This
module is Version 2.1 + EDR (Antenna on Module type), basically Toshiba stack support it.
Figure 1-1A shows the computer and its system unit configuration.
A B C D E
Compal Confidential
Model Name : KAVAA Fan Control Intel Diamondville SC Thermal Sensor Clock Generator
page 28
File Name : LA-5121P EMC1402 SLG8SP556VTR
FCBGA8-437 Pins page 4 page 12
1
(22x22mm) page 4,5
1
FSB
H _ A # ( 3 ..31) 400/533MHz H _ D # ( 0..63)
page 6,7,8,9,10
2
DMI x 2 USB Conn X3 Int. Camera 2
3.3V 33 MHz
DC/DC Interface CKT. LPC BUS HDA Codec
page 30 ALC272-GR
page 22
AMP.
page 31~37 Int. TPA6017
MIC CONN MIC CONN HP CONN
page 23 page 23 page 23 page 23
Touch Pad Int.KBD SPI ROM GSENSOR
page 29 page 28 page 28 page 27
4 Power/B SPK CONN 4
page 29 page 23
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
Block Diagrams
Size Document Number R ev
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
1.A
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
KAVAA LA-5121P M/B
D ate: Monday, March 23, 2009 Sheet 2 of 42
A B C D E
Processor
Memory (BTO)
The computer has one SODIMM slot which comes standard with 1GB/2GB, accepting BTO
for your memory requirements. It can incorporate up to 1 GB (XP) or 2 GB (Vista/Linux) of
main memory. It supports DDR2 at 533MHz.
The system BIOS and Keyboard BIOS share one single 1024KB flash ROM. The flash
utility can be used to program both system and keyboard BIOS at the same time.
System Controllers
Graphics Controller
Audio Controller
The computer contains a low-profile and light-weight, high-performance HDD. The HDD
interface conforms to Serial ATA. Storage capacities supported are 120 and 160 GB.
The HDD is shown in Figure 1-2 and some of its specifications are listed in Table 1-1.
Item Specifications
The power supply unit provides constant voltage (19V) for the system board and performs the
following functions:
Checks whether the AC adapter (DC power supply) is connected to the computer.
Checks whether the battery pack is connected to the computer.
Monitors the DC power supply input voltage (AC Adapter output voltage).
4. Status display
5. External interface
Performs communication through the I2C bus (via the internal EC/KBC).
Transfers the power supply operation mode.
6. Output monitor
Monitors the voltage output to the system block (load/logic circuit side).
Monitors the voltage, over voltage, input/output current of the battery pack.
Monitors the internal temperature of the battery pack.
Monitors the supply voltage from the AC adapter.
1.4 Batteries
The main battery pack serves as the computer's main power source when the AC adapter is not
attached. The main battery maintains the state of the computer when the AC adapter is detached.
Battery charging is controlled by EC KB926. When the AC adapter and battery pack are attached
to the computer, the EC KB926 controls the charge on/off state and detects a full charge.
Battery Charge
When the AC adapter is attached, the battery is charged by off-state charge when the system
is powered off or by on-state charge when it is powered on.
NOTE: The time required for normal charge depends on the power consumption by the
system. Using a fluorescent lamp and frequently accessing the disk consumes more power and
lengthens the charge time.
A full charge is detected only when the battery is being charged by quick or normal charge.
A full charge is detected when either of the following conditions is met:
1. The current in the battery charging circuit drops below the predetermined value.
2. The charging time exceeds the fixed limit.
The RTC battery provides power to keep the current date, time and other system information in
memory while the computer is turned off.
Chapter 2 Contents
Figures
Tables
Chapter 2 describes how to determine if a Field Replaceable Unit (FRU) in the computer is
causing the computer to malfunction. The FRUs covered are:
If you know the location of the malfunction, turn directly to the appropriate section of this
chapter. If the problem is unspecified, use the flowchart in Figure 2-1 as a guide for
determining which troubleshooting procedures to execute. Before performing any
troubleshooting procedures, verify the following:
Ask the user if a password is registered, if it is, ask him or her to enter the password.
Verify with the customer that Toshiba Windows XP/Vista/Linux is installed on the hard
disk. Operating systems that were not preinstalled by Toshiba can cause the computer to
malfunction.
STA RT
C o n n e c t th e A C a d a p te r to th e D C -
IN s o c k e t
P e rfo rm th e P o w e r S u p p ly
T ro u b le s h o o tin g p ro c e d u re s
Is th e D C -IN L E D o n ? No
in s e c tio n 2 .3
Y es
P e rfo rm th e P o w e r S u p p ly
Is th e B a tte ry L E D o n ? No T ro u b le s h o o tin g p ro c e d u re s
in s e c tio n 2 .3
Y es
T u rn th e P o w e r s w itc h o n
Y es
P e rfo rm th e P o w e r S u p p ly
Is th e P o w e r O n L E D o n ? No T ro u b le s h o o tin g p ro c e d u re s
in s e c tio n 2 .3
Y es
P e rfo rm th e P o w e r S u p p ly
Is th e " T o s h ib a " lo g o m e s s a g e
No T ro u b le s h o o tin g p ro c e d u re s
d is p la y ?
in s e c tio n 2 .3
Y es
If th e " p a s s w o rd " m e s s a g e
d is p la y s , ty p e th e p a s s w o rd , th e n
p re s s E n te r.
P e rfo rm d ia g n o s tic s
Is T o s h ib a W in d o w s o r L in u x p ro g ra m . R u n C M 1 6 5 .E X E
No
b e in g lo a d e d ? a n d s e le c t th e H A R D D IS K
ite m .
Y es
Yes
Yes
No
System is normal
End
If the diagnostics program cannot detect an error, the problem may be intermittent. The test
program should be executed several times to isolate the problem. When a problem has been
located, perform the appropriate troubleshooting procedures as follows:
1. If an error is detected by the battery test, perform the Power Supply Troubleshooting
procedures in Section 2.3
Other problems that are not covered by the diagnostics program may be discovered by a
user.
1. If an error is detected when using an external USB device, perform the External USB
Devices Troubleshooting procedures in Section 2.6
2. If an error is detected when using the speakers, perform the Speaker Troubleshooting
procedures in Section 2.8
3. If an error is detected when using the Wireless LAN, perform the Wireless LAN
Troubleshooting procedures in Section 2.10
5. If an error is detected when using the MIC, perform the MIC troubleshooting
procedures in Section 2.16
ST A R T
Yes
No
Yes
END
The power supply controls many functions and components. To determine if the power
supply is functioning properly, start with Procedure 1 and continue with the other Procedures
as instructed. The flowchart in Figure 2-2 gives a summary of the process. The procedures
described in this section are:
Battery LED
DC-IN LED
The power supply controller displays the power supply status through the Battery and the DC-
IN LEDS as listed in the tables below.
To check the power supply status, install a battery pack and connect an AC adaptor to the
DC-IN port on the computer and to a power supply.
A faulty adaptor may not supply power or may not charge the battery. Perform Check 1.
Check 2 Insert a new battery. If the problem is still not resolved, go to Procedure 3.
AC adaptor cord
AC power cord
AC System
Battery
adaptor board
Check 1 Disconnect the AC power cord from wall outlet. Check the power cable for
breaks. If the power cord is damaged, connect a new AC power cord. If there is
no damage, go to Check 2.
Check 2 Make sure the AC adaptor cord and AC power cord are firmly plugged into the
DC-IN socket, AC adaptor inlet and wall outlet. If these cables are connected
correctly, go to Check 3.
Check 3 Make sure that the DC-IN input port socket is firmly secured to the system board
of the computer.
If the DC-IN input socket is loose, go to Procedure 5.
If it is not loose, go to Check 4.
Check 4 Use a multi-meter to make sure that the AC adaptor output voltage is close to 19
V. If the output is several percent lower than 19 V, go to Check 5. If the output
is close to 19 V, go to Check 6.
Check 6 Make sure the battery pack is installed in the computer correctly. If the battery is
properly installed and the battery LED still does not light, go to Procedure 4.
The power supply may not charge the battery pack. Perform the following procedures:
2. Attach the AC adaptor and turn on the power. If you cannot turn on the power, go to
Procedure 5.
3. Run the Diagnostic test following the procedures described in Chapter 3, Tests and
Diagnostics. If no problem is detected, the battery is functioning normally.
The system board may be disconnected or damaged. Disassemble the computer following the
steps described in Chapter 4, Replacement Procedures. Check the connection between the AC
adaptor and the system board. After checking the connection, perform Check 1:
Check 1 Use a multi-meter to make sure that the fuses on the system board are not blown.
If a fuse is not blown, go to Check 2. If a fuse is blown, go to Check 3.
Check 2 Make sure that the battery cable is firmly connected to the system board. If it is
connected firmly, go to Check 3.
Check 3 The system board may be damaged. Replace it with a new one following the
instructions in Chapter 4.
STA RT
P e r fo r m e x te r n a l d is p la y c h e c k
(P r o c e d u re 1 )
D o e s th e e x te r n a l
d is p la y f u n c tio n o k ?
No
P e r fo r m d ia g n o s tic c h e c k
( P ro c e d u r e 2 )
Y es
D is p la y is n o t
f a u lty . C o n tin u e
W a s a d is p la y No
p ro b le m d e te c te d ? tro u b le s h o o tin g -
re fe r to F ig u re 2 .1
Y es
P e r fo rm c o n n e c to r a n d
re p la c e m e n t c h e c k
( P ro c e d u r e 3 )
R e p la c e s y s te m b o a rd
END
This section describes how to determine if the computer’s display is functioning properly.
The process is outlined in Figure 2-3. Start with Procedure 1 and continue with the other
procedures as instructed.
Connect an external display to the computer’s external monitor port, and then boot the
computer. The computer automatically detects the external display.
If the external display works correctly, the internal LCD may be damaged. Go to Procedure 3.
If the external monitor appears to have the same problem as the internal monitor, the system
board may be damaged. Go to Procedure 2.
The Display Test program is stored on the computer’s Diagnostics disk. This program checks
the display controller on the system board. Insert the Diagnostics disk in the computer’s
floppy disk drive, turn on the computer and run the test. Refer to Chapter 3, Tests and
Diagnostics for details.
The LCD module and system board are connected to the display circuits. Any of these
components may be damaged. Refer to Chapter 4, Replacement Procedures, for instructions
on how to disassemble the computer and then perform the following checks:
Check 1 Make sure the DDR module is seated properly. Test display again. If the problem
still exits, replace the DDR RAM module. If the problem still exists, perform
Check 2.
Check 2 Replace the LCD module with a new one and test display again. If the problem
still exists, perform Check 4.
Check 3 Replace the LCD cable with a new one and test display again. If the problem still
exists, perform Check 5.
Check 4 The system board may be damaged. Replace it with a new one.
STA RT
P e r f o r m e x te r n a l k e y b o a r d c h e c k
(P ro c ed u re 1 )
D o e s th e e x te r n a l
k e y b o a r d f u n c tio n o k ?
Y es
P e r f o r m d ia g n o s tic c h e c k
(P ro ce d u re 2 )
No
K e y b o a r d is n o t
W as a k ey b o ard f a u lty . C o n tin u e
No
p r o b le m d e te c te d ? tr o u b le s h o o tin g - r e f e r
to F ig u r e 2 .1
Y es
P e r f o r m c o n n e c to r a n d
r e p la c e m e n t c h e c k
(P ro ce d u re 3 )
R e p la c e s y s te m b o a r d
END
Connect a USB keyboard to one of the computer’s USB ports, and then boot the computer.
The computer automatically detects the external keyboard.
If the external keyboard works correctly, the internal keyboard or its connections may be
faulty. Go to Procedure 2.
If the external keyboard appears to have the same problem as the internal keyboard, the
system board may be having some problem. Replace it with a new one and following the
instructions in Chapter 4.
Run the test and Diagnostics Program, which will automatically execute the Keyboard Test.
Refer to Chapter 3, Tests and Diagnostics for more information on how to run the program.
The keyboard and/or system board may be disconnected or damaged. Disassemble the
computer following the steps described in Chapter 4, Replacement Procedures and perform
the following checks.
Check 1 Make sure the keyboard cable is firmly connected to the system board.
If the connection is loose, reconnect firmly and repeat Procedure 2. If there is still
an error, go to Check 2.
Check 2 The keyboard may be damaged. Replace it with a new one following the
instructions in Chapter 4.
If the problem still exists, perform Check 3.
Check 3 The system board may be damaged. Replace it with a new one following the
instructions in Chapter 4.
START
P e r f o r m e x te r n a l d e v ic e a n d
c o n n e c tio n c h e c k
(P ro ce d u re 1 )
C heck U S B D o e s th e d e v ic e f u n c tio n
p o rt Y es w h e n c o n n e c te d to a
c o n n e c tio n d if f e r e n t U S B p o r t?
No
D o e s a n a lte r n a tiv e U S B O r ig in a l U S B
Y es
d e v ic e f u n c tio n c o r r e c tly ? d e v ic e is f a u lty
No
R e p la c e s y s te m b o a r d
(P ro ce d u re 2 )
END
To determine if the computer’s external USB devices are functioning properly, perform the
following procedures. Figure 2-6 outlines the process. Start with Procedure 1 and continue as
instructed.
The USB device may be damaged or the connection may be faulty. Perform Check 1.
Check 1 Make sure USB device cable is firmly plugged into one of the USB sockets. If the
cable is connected correctly, go to Check 2.
Check 2 Plug the USB device into another USB socket (there are three in all). If the USB
device still does not work, go to Check 4.
Check 3 Make sure that the USB socket is firmly secured to the system board of the
computer. If the malfunction remains, the system board or USB small board may
be damaged. Go to Procedure 2.
Check 4 Connect an alternative USB device to one of the computer’s USB ports, and then
boot the computer. The computer automatically detects the external device.
If the alternative USB device works correctly, the original device may be
damaged and should be replaced.
If the alternative USB device appears to have the same problem as the original
device, the system board or USB small board may be damaged. Go to Procedure
2.
If the error persists, the system board or USB small board may be damaged. Replace it with a
new one following the instructions in Chapter 4.
START
TouchPad connection
check (Procedure 1)
TouchPad replacement
check (Procedure 2)
END
21
2 Troubleshooting Procedures
The TouchPad is connected via the TouchPad FPC to the system board. Make sure the
TouchPad FPC cable is firmly connected to the TouchPad and system board. Refer to Chapter
4, Replacement Procedures, for instructions on how to disassemble the computer and then
perform the following checks.
If any of the connections are loose, reconnect firmly. If any of the connections is damaged, or
there is still an error, go to Procedure 2.
The TouchPad unit or FPC may be defective or damaged. Replace each with a new one
following the steps in Chapter 4. If the FDD is still not functioning properly, replace the
system board with a new one following the steps in Chapter 4.
22
232 Troubleshooting Procedures
START
P e r f o r m a u d io s o u r c e te s t
(P ro c ed u re 1 )
S p e a k ers are n o t
D o a ll s o u r c e s h a v e f a u lty . C o n tin u e
No
s a m e p r o b le m ? tr o u b le s h o o tin g -
s e e F ig u r e 2 - 1
Y es
P e r f o r m e a r p h o n e te s t
(P ro c ed u re 2 )
D o ea rp h o n e s
f u n c tio n c o r r e c tly ?
Y es
P e r f o r m c o n n e c tio n c h e c k
No
(P ro c ed u re 3 )
P e r f o r m r e p la c e m e n t
check
(P ro c ed u re 4 )
R e p la c e s y s te m b o a r d
END
23
242 Troubleshooting Procedures
To determine if the computer’s built-in speakers are functioning properly, perform the
following procedures. Figure 2-10 outlines the process. First adjust the speaker volume to an
appropriate level. Start with Procedure 1 and continue as instructed.
Try different audio sources (e.g. an audio CD and digital music file) to determine whether the
fault is in the speaker system or not. If not all sources have sound problem, the problem is in
the monaural devices. If all have the same problem, continue with Procedure 2.
If the monaural speakers don't sound properly, the monaural speakers may be defective or
damaged. Replace them with new ones. If the monaural speakers still do not work properly,
try replacing in turn the audio board and system board.
24
252 Troubleshooting Procedures
START
END
The wireless LAN antenna wire, wireless LAN unit or system board may each be the source
of a wireless LAN fault. Any of these components may be damaged. To determine if the
25
262 Troubleshooting Procedures
computer’s wireless LAN system is functioning properly, perform the following procedures.
Figure 2-15 outlines the process. Start with Procedure 1 and continue with the other
procedures as instructed.
Run the Diagnostic Program, which will automatically execute the wireless LAN test. Test
and Diagnostic for more information on the program.
If an error is located, go to Procedure 2. If an error is not located, the wireless LAN system is
functioning properly.
The wireless LAN antenna, wireless LAN unit or system board may be disconnected or
damaged. Disassemble the computer following the steps described in Chapter 4, Replacement
Procedures, and perform the following checks.
Check 1 Make sure that the wireless LAN antenna is firmly connected to the Wireless
LAN module (refer to Chapter 4 for instructions) and that the wireless LAN
module is securely slotted into the system board. If the problem persists, go to
Check 2.
Check 2 Check that the wireless communication function is enable by BIOS setup and
FN+F8 , and then make sure that the wireless communication LED on the front
panel is light. If the LED is light but the wireless LAN function is still faulty, the
antenna may be damaged. Replace with a new antenna following the steps in
Chapter 4, Replacement Procedures. If the problem persists, or if the wireless
LAN LED is not light when the wireless communication function is enabled by
BIOS setup and FN+F8, go to Check 3.
Check 3 The wireless LAN unit may be damaged. Replace it with a new one following the
instructions in Chapter 4. If the problem still exists, perform Check 4.
Check 4 The system board may be damaged. Replace it with a new one following the
instructions in Chapter 4.
26
272 Troubleshooting Procedures
27
282 Troubleshooting Procedures
The Camera board or system board may be the reason of a Camera fault. Either of these two
properly, perform the following procedures. Figure 2-14 outlines the process. Start with
Run the functioning Program in windows, which will display the Camera test result.
If tests and diagnostics result abnormal go to Procedure 2. If an error is not located, the
Camera system is functioning properly.
The Camera board or system board may be disconnected or damaged. Disassemble the
computer following the steps described in Chapter 4, Replacement Procedures, and perform
the following checks.
Check 1 Make sure that the Camera board cable is securely slotted into the system board.
If the problem persists, go to Check 2.
Check 2 The Camera board may be damaged. Replace it with a new one following the
instructions in Chapter 4. If the problem still exists, perform Check 3.
Check 3 The system board may be damaged. Replace it with a new one following the
instructions in Chapter 4.
28
292 Troubleshooting Procedures
29
302 Troubleshooting Procedures
The Bluetooth antenna wire, Bluetooth module or system board may be the reason of a
Bluetooth fault. Any of these components may be damaged. To determine if the computer’s
Bluetooth is functioning properly, perform the following procedures. Figure 2-16 outlines the
process. Start with Procedure 1 and continue with the other procedures as instructed.
Run the Diagnostic Program, which will automatically execute the Bluetooth test. Refer to
Chapter 3, Tests and Diagnostics for more information on the program.
Check 1 Make sure the Bluetooth cable is securely slotted into the system board. If the
problem persists, go to Check 2.
Check 2 Check the wireless communication function is enabled by BIOS setup and
FN+F8, then make sure that the communication LED on the left panel is lit. If the
problem persists, or if the Bluetooth communication LED is not lit when the
wireless communication function is enabled by BIOS setup and FN+F8 to “On”,
go to Check 3.
Check 3 The Bluetooth module may be damaged. Replace it with a new one following the
instructions in Chapter 4. If the problem still exists, perform Check 4.
30
312 Troubleshooting Procedures
Check 4 The system board may be damaged. Replace it with a new one following the
instructions in Chapter 4.
START
Yes
END
31
322 Troubleshooting Procedures
This section describes how to determine if the 2 IN 1 Card is functioning properly. The
process is summarized in Figure 2-16. Perform the steps below starting with Procedure 1 and
continuing with the other procedures as required.
The 2 in 1 Card test card contains a 2 in 1 card test program. Ensure the card in fully inserted
into the socket before running the program.
If an error occurs during the 2in 1 card test, perform Procedure 2. If no error occurs, it is
likely that the original 2 in 1 card was faulty.
The 2 in 1 Card socket may be damaged or defective, for instance the socket pins can be bent.
Disassemble the computer following the steps described in Chapter 4, Replacement
Procedures and check the socket. If the problem persists, the system board may be defective
or damaged. Replace the system board with a new one following the steps in Chapter 4.
32
332 Troubleshooting Procedures
33
342 Troubleshooting Procedures
The HDD or system board may be the reason of a HDD fault. Either of these two components
may be damaged. To determine if the computer’s HDD is functioning properly, perform the
following procedures. Figure 2-15 outlines the process. Start with Procedure 1 and continue
Run the Diagnostic Program, which will automatically execute the HDD R/W test. Refer to
Chapter 3, Tests and Diagnostics for more information on the program.
The HDD module or system board may be disconnected or damaged. Disassemble the
computer following the steps described in Chapter 4, Replacement Procedures, and perform
the following checks.
Check 1 Make sure that the HDD module is securely slotted into the system board. If the
problem persists, go to Check 2.
Check 2 The HDD module may be damaged. Replace it with a new one following the
instructions in Chapter 4. If the problem still exists, perform Check 3.
Check 3 The system board may be damaged. Replace it with a new one following the
instructions in Chapter 4.
34
352 Troubleshooting Procedures
35
362 Troubleshooting Procedures
ST A R T
P e rfo rm C R T c o n n e c tio n
check
(P ro c e d u re 1 )
D o e s re p la c e m e n t
R e p la c e C R T
C R T c a b le N o
c a b le
fu n c tio n p ro p e rly ?
Y ES
P e rfo rm C R T se t c h e c k
(P ro c e d u re 2 )
U s e d iffe re n t
C R T fu n c tio n in g o k ? No
C R T set
Y ES
C heck C R T
R e p la c e s y s te m b o a rd N O P o rt
c o n n e c tio n
E N D
To determine if the computer’s CRT port is functioning properly, perform the following
procedures. Figure 2-7 outlines the process. Start with Procedure 1 and continue as instructed.
36
372 Troubleshooting Procedures
The CRT cable may be damaged or the connections may be loose. Perform Check 1:
Check 1 Make sure CRT cable is firmly plugged into both the CRT set and the CRT port
of the computer. If the cable is connected correctly, go to Check 2.
Check 2 Make sure the CRT port is firmly secured to the system board of the computer. If
the malfunction remains, go to Check 3.
Check 3 The CRT cable may be damaged. Replace with a good cable. If the malfunction
remains, go to Procedure 2.
Check 1 Try using the set for CRT reception. If it does not work, the set may be damaged.
If the set does work, perform Check 2.
Check 2 Try connecting a different CRT to the computer. If the replacement CRT works,
the original set may be damaged. If the replacement set does not work the system
board may be damaged. Replace it with a new one following the instructions in
Chapter 4.
37
382 Troubleshooting Procedures
ST A R T
P e rfo rm L A N c o n n e c tio n
check
(P ro c e d u re 1 )
D o e s re p la c e m e n t
R e p la c e L A N
L A N c a b le N o
c a b le
fu n c tio n p ro p e rly ?
Y ES
P e rfo rm L A N se t c h e c k
(P ro c e d u re 2 )
U s e d iffe re n t
L A N fu n c tio n in g o k ? No
L A N c a b le
Y ES
C heck L A N
R e p la c e s y s te m b o a rd N O P o rt
c o n n e c tio n
E N D
To determine if the computer’s LAN port is functioning properly, perform the following
procedures. Figure 2-7 outlines the process. Start with Procedure 1 and continue as instructed.
38
392 Troubleshooting Procedures
The LAN cable may be damaged or the connections may be loose. Perform Check 1:
Check 1 Make sure LAN cable is firmly plugged into both the LAN set and the LAN port
of the computer. If the cable is connected correctly, go to Check 2.
Check 2 Make sure the LAN port is firmly secured to the system board of the computer. If
the malfunction remains, go to Check 3.
Check 3 The LAN cable may be damaged. Replace with a good cable. If the malfunction
remains, go to Procedure 2.
Check 1 Try using the set for LAN reception. If it does not work, the set may be damaged.
If the set does work, perform Check 2.
Check 2 Try connecting a different LAN cable to the computer. If the replacement LAN
cable works, the original set may be damaged. If the replacement set does not
work the system board may be damaged. Replace it with a new one following the
instructions in Chapter 4.
39
402 Troubleshooting Procedures
The MIC line or system board may be the reason of a MIC fault. Either of these two
perform the following procedures. Figure 2-15 outlines the process. Start with Procedure 1
40
412 Troubleshooting Procedures
Run the functioning Program on Windows model, which will display the MIC test result.
If tests and diagnostics result abnormal go to Procedure 2. If an error is not located, the MIC
module functioning is properly.
The MIC line or system board may be disconnected or damaged. Disassemble the computer
following the steps described in Chapter 4, Replacement Procedures, and perform the
following checks.
Check 1 Make sure that the MIC line is securely slotted into the system board. If the
problem remains, go to Check 2.
Check 2 The MIC line may be damaged. Replace it with a new one following the
instructions in Chapter 4. If the problem still exists, perform Check 3.
Check 3 The system board may be damaged. Replace it with a new one following the
instructions in Chapter 4.
41
422 Troubleshooting Procedures
The operation or system board may be the reason of 3D sensor fault. Either of these two may
following procedures. Figure 2-16 outlines the process. Start with Procedure 1 and continue
Run the functioning Program on Windows model, which will display the 3D test result.
If tests and diagnostics result abnormal go to Procedure 2. If an error is not located, the 3D
functioning is properly.
42
432 Troubleshooting Procedures
Check 2 The system board may be damaged. Replace it with a new one following the
instructions in Chapter 4.
43
442 Troubleshooting Procedures
2. 17 3G Troubleshooting
STA R T
3G system is not
faulty. C ontinue
W as a 3G problem detected? No
troubleshooting - refer
to Figure 2.1
Y es
R eplace 3G antenna/unit
EN D
The 3G antenna wire, 3G unit or system board may each be the source of a 3G fault. Any of
these components may be damaged. To determine if the computer’s wireless LAN system is
functioning properly, perform the following procedures. Figure 2-17 outlines the process.
Start with Procedure 1 and continue with the other procedures as instructed.
44
452 Troubleshooting Procedures
Run the Diagnostic Program, which will automatically execute the 3G test. Test and
Diagnostic for more information on the program.
The 3G antenna, 3G unit or system board may be disconnected or damaged. Disassemble the
computer following the steps described in Chapter 4, Replacement Procedures, and perform
the following checks.
Check 1 Make sure that the 3G antenna is firmly connected to the 3G module (refer to
Chapter 4 for instructions) and that the 3G module is securely slotted into the
system board. If the problem persists, go to Check 2.
Check 2 Check the wireless communication function is enabled by BIOS setup and
FN+F8, and then make sure that the wireless communication LED on the front
panel is light. If the LED is light but the 3G function is still faulty, the antenna
may be damaged. Replace with a new antenna following the steps in Chapter 4,
Replacement Procedures. If the problem persists, or if the wireless LAN LED is
not light when the wireless communication function is enabled by BIOS setup and
FN+F8, go to Check 3.
Check 3 3G unit may be damaged. Replace it with a new one following the instructions in
Chapter 4. If the problem still exists, perform Check 4.
Check 4 The system board may be damaged. Replace it with a new one following the
instructions in Chapter 4.
45
3. Tests and Diagnostics
Chapter 3
Tests and Diagnostics
1
3. Tests and Diagnostics
Contents
2
3. Tests and Diagnostics
You will need the following equipment to perform some of the Diagnostic test programs.
3
3. Tests and Diagnostics
Insert the diagnostics USB disk drive and turn on the computer. (The diagnostics diskette
contains the DOS boot files.) And then follow the instructions for T&D program installed in
RAM driver.
The T&D Program can run single test by you press corresponsive English letter of test item, and
it also asks you if you like to copy test log file to USB disk as reference at the end of test(s).
4
3. Tests and Diagnostics
If the test result passes, the following display will show up:
5
3. Tests and Diagnostics
Then press any key for next actions – the below display presented if copying test log file
onto diskette is necessary. This action will be executed when “Y” key pressed.
6
3. Tests and Diagnostics
And then it will check if it’s necessary to leave this program. Program will quit when “Y”
key pressed and it will go back main menu for next test if “N” key pressed.
7
3. Tests and Diagnostics
DDRAM SIZE
Panel ID
Wireless type
LAN Type
Bluetooth
8
3 Tests and Diagnostics
NOTE: Remember to tune up the volume as “Maximum” before this test starts.
The screen should display as below, indicating whether the test is passed or failed after the
question.
9
3. Tests and Diagnostics
The computer will let the fan be “ON” after any key pressed. Feel the wind or
listen the rotating sound to check whether the fan is working or not.
NOTE: Remember to approach fan outlet that is near right side of unit whether fan is
“ON”.
The computer will stop the fan working after any key pressed. Feel the wind or
listen the sound to check if the fan is “OFF”.
The screen should display as below, indicating whether the test is passed or failed after the
question.
10
3. Tests and Diagnostics
Manufacturer (Sanyo/Panasonic/Sony)
The screen should display as below, if the charge function is OK, will show:.
11
3. Tests and Diagnostics 3.7 Main Battery Change Test
3. 7 FDD Test
NOTE: Before running the FDD test, prepare a formatted work diskette (1.44 MB). Need
to insert FDD when power on machine. Otherwise the Floppy can be not detected.
The screen should display as below, indicating whether the subtests pass or fail when finished.
12
3. Tests and Diagnostics
13
3 Tests and Diagnostics
This test will check if the computer’s Memory Frequency and Size is correct in every slot.
3. 9 Keyboard Test
The keyboard test checks the all keys function.
NOTE: The Num Lock and the Overlay mode must be off to execute the keyboard test.
Before keyboard test starts, the keyboard matrix code should be chosen as below display:
14
3. Tests and Diagnostics
When you execute this test, the keyboard layout is drawn on the display. When any key is
pressed, the corresponding key on the screen changes to black as shown below.
It will indicate whether the sub test is passed or failed after the question.
US Keyboard
15
3 Tests and Diagnostics
Japan keyboard
UK keyboard
16
3. Tests and Diagnostics
NOTE: The “Fn” key cannot be tested in the keyboard test. To determine whether the “Fn”
key is working correctly, press “Fn+F6 ” or “Fn+F7 ” keys to check if LCD display
brightness change gradually.
NOTE: The Touch Pad test cannot be used to test an external USB mouse.
17
3. Tests and Diagnostics
The Touch Pad button subtest allows users to test their Touch Pad buttons. If the buttons are
clicked, the cursors should appear in the corresponding box of the button figure that is displayed
on the screen as below.
After checking T/Pad buttons and cursor’s function, use “Tab” key or use T/Pad cursor to click
the “OK” column will end this test.
It will indicate whether the subtests pass or fail after three questions.
NOTE: The above figure has three compartments although the Touch Pad installed may
only have two buttons. In this case, the central compartment in the figure does not
correspond to any button.
This LCD pixels mode test checks whether video display is fine.
1. Text Mode
2. VGA Mode
- including 320*200 (4/16/256 colors), 640*200 (2/16 colors), 640*350 (2/16 colors),
18
3. Tests and Diagnostics
640*480 (2/16/256 colors), 800*600 (256 colors) and 1024*768 (256 colors).
The screen should display as below, indicating whether the test is passed or failed after the
question.
1>. If the Magnetic switch test fail, it will show below display:
19
3. Tests and Diagnostics
2>. If the Magnetic switch test pass, it will show below display:
20
3. Tests and Diagnostics
21
3. Tests and Diagnostics
1. Speed1000
2. Speed100
3. Speed10
The screen should display as below, indicating whether the subtests pass or fail when finished.
22
3. Tests and Diagnostics
23
3. Tests and Diagnostics
The screen should display as below, indicating whether the test is passed or failed when finished.
24
3. Tests and Diagnostics
NOTE: please keep 90 degree between logic upper and LCD panel when test
The display of a test program and the set method of PC are shown below.
Upper
X
Test 2 :
Rear
Upper
Test 3:
Right
Upper
Test 4:
25
3. Tests and Diagnostics
Front
Upper
Test 5:
Left
Upper
Test Result
A test result is displayed when a test is completed. A display of result is O.K. or NG.
26
3. Tests and Diagnostics
27
3. Tests and Diagnostics
After you select the method, then input password: “hard disk”, if input password is Right, the
screen would display as below:
28
3. Tests and Diagnostics
The screen will display as below picture to show the subtest is passed or failed when finished:
29
3. Tests and Diagnostics
30
3. Tests and Diagnostics
2. Write Version
3. Write Serial
4. Write Product
31
3. Tests and Diagnostics
After write OK, you should reboot the system that can make the setting effective, or you can
write next data before reboot system, the figure below will displayed:
32
3. Tests and Diagnostics
NOTE: should input correct DMI data, and should reboot the system that can make the
setting effective.
33
3. Tests and Diagnostics
34
Chapter 4
Replacement Procedures
4 Replacement Procedures
Chapter 4 Contents
Figures
4.1 General
This chapter explains how to disassemble the laptop and replace Field Replaceable Units (FRUs).
Some replacement procedures may not require you to remove all the surrounding FRUs to
replace only one FRU. The chart below shows the FRUs in the order in which they should be
removed in a top-down manner, irrespective of their physical locations. The FRUs shown in the
top area of the chart should normally be removed before removing the FRUs shown in the
bottom area. To replace the FRUs, first identify the suspect FRU for the system failure. Next,
according to this chart, determine the FRUs that need to be removed before removing the suspect
FRU. After you determine those FRUs, go to the appropriate sections according to the section
numbers shown in the boxes. Then start removal and replacement.
4.18 Camera
4.8 Logic Upper module and
Assembly Microphone
Module:
First, remove Logic Upper
Assembly, then remove the
LCD Bezel Assembly.
Safety Precautions
Before you begin disassembly read the following safety precautions carefully. Be sure to follow
them while you are working.
DANGER:
1. Always use the original batteries or replacement batteries authorized by Toshiba.
Batteries other than those differ in specifications and are incompatible with the laptop.
They may burst or explode. To avoid leakage of alkaline solutions, never heat or
disassemble the battery packs. Never throw the battery packs into a fire. If this is
violated, they will explode.
2. The components such as the power supply and inverter carry high voltages. When you
partially disassemble the laptop and turn on the components, use extreme care not to
touch the connectors and components to avoid the risk of electrical shock. Do not
disassemble individual components during first-level maintenance.
WARNING:
1. To avoid the risk of electrical shock, turn the laptop off and remove the AC adapter from
the electrical outlet.
2. Because the battery in the laptop is left charged, the risk of electrical shock remains
even after the AC adapter is removed from the electrical outlet. To avoid the risk of
electrical shock, be sure to remove any metal jewelry or accessories such as necklaces,
bracelets, and rings before starting work. Never work with damp or wet hands.
3. To avoid personal injury, use care to avoid the sharp edges or corners of the
components.
CAUTION:
1. Before replacing a component, make sure that the replacement component meets the
required specifications. To avoid laptop failures, never use components that do not meet
the specifications.
2. To avoid internal damage such as short circuits and fire, never drop metal objects such
as screws, pins, paper clips, etc. into the components. When a screw is removed, be sure
to replace a screw that is the same size as the original screw. Make sure that all the
screws are fastened securely. Loose screws can cause short circuits, overheating,
smoke, or fire.
3. Before removing a FRU or other component, make sure that all the component cables
have been disconnected to avoid the risk of electrical shock caused by accidental
contact with the energized components.
4. For AC input, be sure to use the AC adapter and AC power cable that come with your
laptop or Toshiba-recommended equivalents.
5. To avoid the risk of electrical shock, make sure that all the replacement components
meet the specifications of the laptop and that all the cables and connectors are fastened
securely.
6. Inside the PC are components that become hot during operation (such as the CPU and
cooling module). To avoid burns, let the hot components cool down before starting
inspection or repair task.
Before you begin to disassemble the laptop, keep in mind the precautions and advice in this
section. Always begin disassembly by removing the AC adapter and battery pack. Remove the
optional parts and accessories as well. The procedures for removing the batteries will be
explained later.
To run and store the laptop, be sure to prepare a working environment that is free from:
Run the diagnostic tests explained in Chapter 2 of this manual to identify the FRU that has
probably caused the system failure.
Perform only the required machine operations. Use only the disassembly and reinstallation
procedures described in this manual.
Place the removed components in a safe place away from the laptop so that they are not damaged
or get in the way of you doing your work.
Normally, a number of screws need to be removed or replaced during disassembling. Place the
removed screws in a safe place so that you can easily find the right screws for the right
components.
When assembling the laptop, use the specified screws to fasten the parts to the specified
locations. See the appropriate explanations and figures for screw sizes.
To avoid personal injury, use care to handle components that have sharp edges or corners.
After you have replaced a FRU, check that the FRU works correctly to ensure normal laptop
operation.
Disassembly Procedures
To remove a pressure plate connector, pull up the tabs on either side of the connector's plastic
pressure plate and gently pull the cable out of the connector. To reconnect the cable to the
pressure plate's connector, raise the pressure plate up to a satisfactory height and slide the cable
into the connector. Secure the cable in the correct position by pressing down the sides of the
pressure plate so that the plate is flush with the sides of the connector. Grasp and pull the cable
gently to check that the cable is connected firmly. If the cable came off the connector, reinsert
the cable by raising the pressure plate up to a satisfactory height.
Normal pin connectors are used for all the other types of cables. These connectors can be
installed or removed by simply inserting them or pulling them out.
Assembly Procedures
You have to reassemble the laptop after you have disassembled the laptop and fixed the
component that caused the problem.
When reassembling the laptop, keep the following general guidelines in mind:
Take your time to carry out the suggested instructions completely. Hurried reassembly
can often cause problems.
Check that all the cable and connectors are fastened securely.
Before securing the FRUs or other parts, check that the cables are not caught by the
screws or FRUs.
Check that all the latches are closed securely.
Check that all the required screws are used to secure the FRUs. Using wrong screws can
damage the threads or heads of the screws or does not ensure that the FRUs are secure.
After installing a FRU, make sure that the FRU and laptop work normally.
For your safety and that of other people in the working environment, it is strongly recommended
that you use electrostatic discharge (ESD) equipment. The proper use of this equipment will
ensure successful repair work and reduce the costs for repairing damaged components. The
equipment and tools required for disassembly and reassembly are:
To secure screws, follow the torque values listed below. Over tightening can damage
components and screws. Under tightening can loosen the screw or cause screws to come off,
which may result in short circuits or other damage.
For easy identification of the correct screws, the screw shanks are colored according to their
lengths, as follows:
For easy maintenance, the screw types are shown on the laptop body as symbols. A symbol
consists of a letter representing the screw type and a numeral representing the screw length.
Symbol examples
6 mm bind screw B6
12 mm bind screw B12
5 mm stud U5
(The numeral represents the rounded length of the threaded portion regardless of the
entire stud length.)
4.2 Battery
Remove the battery pack according to the following procedures and Figure 4.1.
CAUTION: When handling the battery packs, use care not to short circuit the terminals. Do
not drop, hit, twist, or bend the battery packs. Do not scratch or break up their casing.
1. Turn the laptop upside down so that the bottom is facing you.
3. Slide the battery release latch and remove the battery pack from the laptop.
2 1
NOTE: Dispose of the used battery packs as required by local ordinances or regulations.
CAUTION: The battery packs contain a lithium ion battery, which can explode due to
improper replacement, use, handling, or disposal. Always dispose of the battery packs as
required by local ordinances or regulations. Use only replacement batteries recommended by
Toshiba.
NOTE: Visually check the battery's terminals. If they are dirty, clean them with a dry cloth.
1. Gently insert a new or recharged battery pack into place. Check that the battery release
latch slides in and stops with a click.
4.3 HDD
Remove the HDD (hard disk drive) according to the following procedures and Figure 4.2 and 4.3.
1. To remove the HDD, remove two M2.5x4 HDD door TORX screws that secure the
HDD door and then remove the HDD door.
M2.5x4 TORX*2
NOTE: Do not disassemble the HDD pack when it is working normally. Disassemble or
replace the HDD pack only if it fails.
5. To separate the plate from the HDD, remove four M3x3 screws.
M3x3*4
CAUTION: To avoid damage, always hold the HDD only by its sides.
2. Secure the HDD and its plate with four M3x3 screws.
CAUTION: To prevent the HDD plate from being distorted when installing the HDD pack
into the laptop, do not press the center of the HDD pack. Always hold the HDD pack by its
sides.
3. Install the HDD pack into the correct position in the laptop. Connect the HDD pack to
the laptop.
4. Secure the main HDD door by tightening two M2.5x4 TORX screws.
4.4 Memory
Remove the optional memory according to the following procedures and Figure 4.5 and 4.6 after
checking that the laptop is turned off.
CAUTION: Remove the optional memory after turning off the laptop. If this is violated, the
laptop or memory can be damaged.
CAUTION: Do not touch the connectors on the memory or in the laptop. Contaminated
connectors can cause memory access problems.
M2.5Dx4*1
4. Spread out the two memory lock latches so that the memory pops up. Please follow the
procedure as shown in Figure 4.6.
5. Pull the memory up and out at an angle, using care to avoid touching the connectors.
Install the optional memory according to the following procedures after checking that the laptop
is turned off.
CAUTION: Install the optional memory after turning off the laptop. If this is violated, the
laptop or memory can be damaged.
2. Press down on the memory module so that it is secured with both memory lock latches.
After the laptop is turned on, check the hardware configuration in the Hardware Setup or
TESTUP program to make sure that the installed memory has been recognized by the system. If
it has not been recognized yet, check the connections.
Remove the WLAN card according to the following procedures and Figure 4.7.
M2x3*2
WLAN Card
2. Press the card down and secure it with two M2x3 screws.
3. Attach the two antennas to the WLAN card. The white (MAIN) antenna to the #1 connector
and the black (AUX) antenna to the #2 connector.
Remove the Hinge Cover and Keyboard according to the following procedures and Figure 4.8,
4.9 and 4.10.
M2.5x4*5
M2.5x6*7
Figure 4.8 Removing the screws from the bottom of the laptop
1. Use your fingers to unclasp three hinge cap hooks as indicated in Figure 4.9.
3. Squeeze the hinge cover with both hands and remove in the direction of the arrows in
Figure 4.10.
Remove the Keyboard according to the following procedures and Figure 4.11.
2. Unfasten the four hooks on the sides of the keyboard. Lift up the keyboard and remove
the cable connecting it to the logic upper assembly.
Four hooks*
Install the hinge cover and keyboard according to the following procedures.
1. Attach the cable from the underside of the keyboard to the connector on the logic upper
assembly.
2. Seat the keyboard in its correct position making sure the four hooks on either side are
fastened.
4. Seat the hinge cover in the correct position and firmly click into place.
5. Turn the laptop upside down. Make sure all three hinge cap hooks are firmly in place.
Remove the power board according to the following procedures and Figure 4.12.
1. Carefully remove any adhesive tape covering the power board cable.
2. Use tweezers to release the latches on the left and right sides of the connector by pushing
in the direction of the arrows in Figure 4.12.
4. Press down the latch that protrudes to the power board on its right side. Push the power
board in the direction indicated in figure 4.12 and slide the power board out.
Note: Be careful not to damage the Power Board when connecting it with the cable. Make
sure the card is seated in the correct position.
1. Seat the power board in the correct position on the logic upper assembly.
2. Slide the power board to the end of the track until the latch clicks into place.
3. Place the power board cable into the connector on the motherboard.
4. Use tweezers and a finger to push down on the left and right latches of the connector.
Both latches must be pushed simultaneously to secure the power board cable.
Remove the logic upper assembly according to the following procedures and Figure 4.13, 4.14
and 4.15.
M2.5x6*4
2. Remove any tape and then gently free the camera cable, microphone cable and antennas
from their trough as indicated in Figure 4.14.
Figure 4.14 Freeing cables and antennas from the logic upper assembly
4. Take the cables and antennas from the left and right sides of the display hinge and move
out of the way from the hinge screws.
NOTE: When removing the hinge screws, the cables and antennas on the left and right sides
will be obstacles. Be sure to move any cables securely out of the way to ensure no scratching
or damage occurs.
5. Close the laptop. Remove two M2.5x6 screws from the hinge saddle as shown in Figure
4.15.
M2.5x6*2
Figure 4.15 Removing the first pair of screws from the hinge saddle
6. Open the laptop and remove two M2.5x6 screws from the hinge saddle as shown in
Figure 4.16.
M2.5x6*2
Figure 4.16 Removing the second pair of screws from the hinge saddle
8. Detach one Touch Pad cable and the Bluetooth cable as shown in Figure 4.17. (Detach
the touch pad cable by using tweezers to push the left and right latches of the connector
in the direction of the arrow.)
1. Seat the logic upper assembly to the front of the laptop, and adjust to the correct position.
3. To reconnect the touch pad cable, use tweezers and a finger to push down on the left and
right latches of the connector. Both latches must be pushed simultaneously to secure the
touch pad cable.
4. Secure the LCD display assembly with two M2.5x6 screws and attach the LVDS cable to
the motherboard as shown in Figure 4.16.
5. Close the laptop and secure two M2.5x6 screws as indicated in Figure 4.15.
6. Open the laptop and secure four 2.5x6 screws on the laptop as indicated in Figure 4.13.
7. Route first the WLAN antennas through the trough and then pull through the slot to the
underside of the computer.
8. Route the camera cable, microphone cable and Bluetooth cable through the trough and
secure in the logic upper assembly with adhesive tape.
NOTE: Take extra care in routing cables and antennas on Logic upper assembly. Improperly
routed cables can become pinched or damaged and cause malfunction.
4.9 Speaker
Remove the Speaker according to the following procedures and Figure 4.18.
2. Detach the speaker cable and remove the speaker from the motherboard.
M2.5x7.7*2
Remove the touch pad bracket according to the following procedures and Figure 4.19.
M2.5x2.5*2
Figure 4.19 Removing the screws from the touch pad bracket
2. Remove the touch pad bracket from the logic upper assembly.
Remove the Bluetooth card according to the following procedures as well as Figures 4.20 and
4.21.
1. Push the card from two sides in opposite directions so that the hook shifts the card out
of place.
2. Remove the Bluetooth card from the logic upper assembly by pulling up and to the left.
Figure 4.21 Removing the Bluetooth Card from the Logic Upper Assembly
Install the Bluetooth card according to the following procedures and Figure 4.22.
1. Seat the Bluetooth card in the correct position on the logic upper assembly.
2. Gently press the Bluetooth card down until the hooks click into position and hold the
card firmly.
4.12 Motherboard
1. Remove two M2.5x4 screws and FAN cable from the motherboard as indicated by the arrow
in Figure 4.23.
M2.5x4*2
3. Remove any tape covering the DC IN connector and gently pull the cable out of the logic
lower assembly from right to left, as shown in Figure 4.25.
4. Use your hands to pick up the motherboard in the direction of the arrows as shown in
figure 4.26.
1. Before seat the motherboard on the logic lower assembly, pull out the any cables to avoid
them being pressed.
2. Align the connectors on the left side to their corresponding holes in the logic lower
assembly as shown in Figure 4.27.
4. Put the DC IN connector in the lower DC IN trough and route the cable from left to right
under the ribs as shown in Figure 4.28 Fasten with tape.
6. Secure two M2.5x4 screws and attach FAN cable to the motherboard as indicated by the
arrow in Figure 4.23.
Remove the thermal fan module according to the following procedures and Figure 4.29, 4.30.
CAUTION:
When removing the thermal fan module, keep the following in mind:
1. The unit can become very hot during operation. Be sure to let it cool down before
starting the repair work.
2. Use care when removing and disassembling the unit in order to avoid damage.
3. If you remove the thermal module, please use a soft cloth with alcohol to clean the
thermal fan module. If you use a new module, please make sure to remove any release
paper first.
1. Remove three M2.5x3 screws securing the thermal fan module to the motherboard.
M2.5x3*3
1. Reapply Thermal grease on the thermal fan module as shown in Figure 4.30. If you use a
new thermal fan module, remove any release papers on the thermal pads first.
Thermal Pads
Figure 4.30 Reapply Thermal Pad on the thermal module and remove any release papers
2. Seat the thermal fan module in the correct position on the motherboard and secure it with
three M2.5x3 screws.
Remove the 3G module according to the following procedures and Figure 4.31.
M2x3*2
Remove the WiMax module according to the following procedures and Figure 4.32.
1. Disconnect the two antennas from their connectors on the WiMax card with balance
force.
M2x3*2
3. Attach the two antennas to their connectors on the WiMax card with balance force.
M2.5x5*2
TOBSHIBA
3. Remove the bezel from each side of the hinge wall in the order shown in Figure 4.34.
NOTE: The sides of the bezel are secured tightly. Remove slowly and take extra caution to
prevent your nails from becoming broken or from scratching the LCD surface.
2 1
4. Push the bezel from the left and right side as shown in Figure 4.35 and remove the bezel
from the display assembly.
NOTE: Take extra care in routing cables and antennas on the LCD module. Improperly
routed cables can become pinched or damaged and cause malfunction.
2. Press the bezel hinge wall against the cover hinge wall. Press the left and right side of
the bezel as shown in Figure 4.34. Make sure the bezel clicks into place.
Remove the LCD module according to the following procedures and Figure 4.36, 4.37 and 4.38.
1. Remove four M2.5x4 screws securing the LCD module to the LCD cover assembly.
M2.5x4*4
3. Remove four M2x3 screws that secure the LCD hinge assembly to the LCD panel and
then remove the LCD hinge assembly.
M2x3*4
4. Turn the LCD module over and place it face down on a protective surface, such as a
foam pad.
5. Remove the tape and LVDS cable connector. Then detach the LVDS cable.
NOTE:
Integrated Circuits (ICs) are fragile. Use extreme care not to apply pressure to the ICs along
the edges of the LCD module.
Dispose of used LCD panels (fluorescent (FL) tubes) as required by local ordinances or
regulations.
The LVDS cable must be carefully peeled away before disconnecting it from the LCD panel.
NOTE: Take extra care in routing cables and antennas on the LCD module. Improperly
routed cables can become pinched or damaged and cause malfunction.
1. Turn the LCD module cover and place it face down on a protective surface such as a
foam pad.
2. Connect the LVDS cable to the LCD panel connector and adhere with tape.
4. Seat the LCD hinge assembly in the correct position beside the LCD panel and secure it
with four M2x3 screws.
5. Seat the LCD module in the correct position in the LCD cover assembly.
6. Secure the LCD module to the LCD cover assembly with four M2.5x4 screws.
Remove the Camera module and Microphone according to the following procedures and
Figure 4.39.
1. Disconnect the Camera cable from the Camera module connector and remove the Camera
module.
Camera module
NOTE: Camera module is fastened by adhesive tape. Remove it slowly and carefully.
Install the Camera module and Microphone according to the following procedures.
NOTE: Take extra care in routing cables and antennas on the LCD module. Improperly
routed cables can become pinched or damaged and cause malfunction.
2. Seat the Camera module and microphone in the correct position on the LCD cover
assembly.
The LCD module can be easily damaged during assembly or disassembly. Observe the following
precautions when handling it to prevent damaging it.
1. When installing the LCD module in the display assembly, make sure that you seat it so
that it is properly aligned and maximum visibility of the display is maintained.
2. Be careful to align the holes at the four corners of the LCD module with the
corresponding holes in the LCD cover before securing the module with screws.
Do not force the module into place, because stress can affect its performance.
Note: The panel’s polarized surface is easily scratched and damaged, so handle it
carefully.
If the surface is very dirty, we recommend a CRT cleaning agent. Apply the agent to a
soft cloth and then wipe the panel’s surface. Do not apply cleanser directly to the panel.
CRT
Cleaner
4. If water or other liquid is left on the panel’s surface for a long period, it can change the
screen’s tint or stain it. Be sure to quickly wipe off any liquid.
6. CMOS-LSI circuits are used in the module, so guard against damage from electrostatic
discharge. Be sure to wear a wrist or ankle grounding device when handling the module.
8. Do not store the module at temperatures below its specifications. Cold can cause the
liquid crystals to freeze, lose their elasticity or otherwise suffer damage.
JMIC
JPOWER
U35
JBT JCAM
JKB
JFAN
U29
JCARD
JSPKR
U36 U31
PJP2 U3 U1
JCRT
PJP1
UA2
JEXMIC JWLAN
JLINE JSATA
JDDR1
JLAN JUSBA
JUSBC
JUSBB
U20 UC2
Figure B-2 System Board Layout (Bottom)
Number Name
U2 Thermal Sensor_EMC1402
U4 Clock Generator_SLG8SP556VTR
U15 South Bridge_Intel ICH7-M
U20 USB BUS SW_SN74CBT3125PWRG4
U29 EC_KB926QFC0
U31 G-sensor_TSH35TR
U35 FAN Control IC_APL5607KI-TRG
U36 BIOS ROM
UA2 Codec_ALC272-GR
UC2 Card Reader_RTS5159-GR
UL2 10/100 LAN_RTL8103EL-GR
Number Name
JLVDS LVDS conn.
JFAN Fan conn.
JDDR1 DDRII conn.
JCRT CRT conn.
JPOWER Power/B conn.
JSATA SATA HDD conn.
JCARD Card Reader conn.
JMIC Microphone conn.
System Board
C.1 JFAN
Pin No. Signal name I/O Pin No. Signal Name I/O
1 +FAN1 2 FAN_SPEED1
3 GND
C.2 JLVDS
Pin No. Signal name I/O Pin No. Signal Name I/O
1 +LEDVDD 2 NC
3 +LCDVDD_L 4 +3VS
5 LCD_PWM 6 BKOFF#
7 LVDS_SDA 8 LVDS_SCL
9 GND 10 LVDS_A0
11 LVDS_A0# 12 GND
13 LVDS_A1 14 LVDS_A1#
15 GND 16 LVDS_A2
17 LVDS_A2# 18 GND
19 LVDS_ACLK 20 LVDS_ACLK#
Pin No. Signal name I/O Pin No. Signal Name I/O
1 CRT_R_L 2 CRT_G_L
3 CRT_B_L 4 NC
5 GND 6 GND
7 GND 8 GND
9 +CRT_VCC 10 GND
11 NC 12 CRT_DDC_DAT
13 HSYNC 14 VSYNC
15 CRT_DDC_CLK
C.4 JSATA
Pin No. Signal name I/O Pin No. Signal Name I/O
1 GND 2 SATA_ITX_C_
DRX_P0
3 SATA_ITX_C_ 4 GND
DRX_N0
5 SATA_IRX_DT 6 SATA_IRX_DT
X_N0 X_P0
7 GND 8 +3VS
9 +3VS 10 +3VS
11 GND 12 GND
13 GND 14 +5VS
15 +5VS 16 +5VS
17 GND 18 NC
19 GND 20 NC
21 NC 22 NC
Pin No. Signal name I/O Pin No. Signal Name I/O
1 GND 2 USB20_P6
3 USB20_N6 4 WLAN_BT_CLK
5 BT_DET# 6 BT_RESET#
7 WLAN_BT_DATA 8 +BT_VCC
9 +3VS 10 GND
C.6 JCAM
Pin No. Signal name I/O Pin No. Signal Name I/O
1 +CAM_VDD 2 USB20_N1_R I/O
3 USB20_P1_R I/O 4 GND
5 GND
Pin No. Signal name I/O Pin No. Signal Name I/O
1 RJ45_MIDI0+ I/O 2 RJ45_MIDI0- I/O
3 RJ45_MIDI1+ I/O 4 NC
5 NC 6 RJ45_MIDI1- I/O
7 NC 8 NC
9 +3V_LAN 10 LAN_SK_LAN_LINK#
11 +3V_LAN 12 LAN_ ACTIVITY#
Pin No. Signal name I/O Pin No. Signal Name I/O
1 NC 2 +3VS
3 NC 4 GND
5 NC 6 +1.5VS
7 WWAN_CLKREQ 8 +UIM_PWR
#
9 GND 10 UIM_DATA
11 CLK_PCIE_WWA 12 UIM_CLK
N#
13 CLK_PCIE_WWA 14 UIM_RST
N
15 GND 16 UIM_VPP
17 NC 18 GND
19 NC 20 UWB_OFF#
21 GND 22 PLTRST#
23 PCIE_PTX_C_IR 24 +3VS
X_N4
25 PCIE_PTX_C_IR 26 GND
X_P4
27 GND 28 +1.5VS
29 GND 30 CLK_SMBCLK
31 PCIE_ITX_C_PR 32 CLK_SMBDATA
X_N4
33 PCIE_ITX_C_PR 34 GND
X_P4
35 GND 36 USB20_N5
37 GND 38 USB20_P5
39 +3VS 40 GND
41 +3VS 42 LED_WIMAX#
43 GND 44 NC
45 NC 46 NC
47 NC 48 +1.5VS
49 NC 50 GND
51 NC 52 +3VS
Pin No. Signal name I/O Pin No. Signal Name I/O
1 +DIMM_VREF 2 GND
3 GND 4 DDR_A_D4
5 DDR_A_D0 6 DDR_A_D5
7 DDR_A_D1 8 GND
9 GND 10 DDR_A_DM0
11 DDR_A_DQS#0 12 GND
13 DDR_A_DQS0 14 DDR_A_D6
15 GND 16 DDR_A_D7
17 DDR_A_D2 18 GND
19 DDR_A_D3 20 DDR_A_D20
21 GND 22 DDR_A_D21
23 DDR_A_D16 24 GND
25 DDR_A_D17 26 DDR_A_DM2
27 GND 28 GND
29 DDR_A_DQS#2 30 M_CLK_DDR0
31 DDR_A_DQS2 32 M_CLK_DDR#0
Pin No. Signal name I/O Pin No. Signal Name I/O
33 GND 34 GND
35 DDR_A_D18 36 DDR_A_D22
37 DDR_A_D19 38 DDR_A_D23
39 GND 40 GND
41 GND 42 GND
43 DDR_A_D9 44 DDR_A_D12
45 DDR_A_D8 46 DDR_A_D13
47 GND 48 GND
49 DDR_A_DQS#1 50 PM_EXTTS#0
51 DDR_A_DQS1 52 DDR_A_DM1
53 GND 54 GND
55 DDR_A_D10 56 DDR_A_D14
57 DDR_A_D11 58 DDR_A_D15
59 GND 60 GND
61 DDR_A_D24 62 DDR_A_D28
63 DDR_A_D25 64 DDR_A_D29
65 GND 66 GND
67 DDR_A_DM3 68 DDR_A_DQS#3
69 NC 70 DDR_A_DQS3
71 GND 72 GND
73 DDR_A_D26 74 DDR_A_D30
75 DDR_A_D27 76 DDR_A_D31
77 GND 78 GND
79 DDR_CKE0 80 DDR_CKE1
81 +1.8V 82 +1.8V
83 NC 84 NC
85 DDR_A_BS2 86 NC
87 +1.8V 88 +1.8V
89 DDR_A_MA12 90 DDR_A_MA11
91 DDR_A_MA9 92 DDR_A_MA7
93 DDR_A_MA8 94 DDR_A_MA6
95 +1.8V 96 +1.8V
Pin No. Signal name I/O Pin No. Signal Name I/O
97 DDR_A_MA5 98 DDR_A_MA4
99 DDR_A_MA3 100 DDR_A_MA2
101 DDR_A_MA1 102 DDR_A_MA0
103 +1.8V 104 +1.8V
105 DDR_A_MA10 106 DDR_A_BS1
107 DDR_A_BS0 108 DDR_A_RAS#
109 DDR_A_WE# 110 DDR_CS0#
111 +1.8V 112 +1.8V
113 DDR_A_CAS# 114 M_ODT0
115 DDR_CS1# 116 DDR_A_MA13
117 +1.8V 118 +1.8V
119 M_ODT1 120 NC
121 GND 122 GND
123 DDR_A_D32 124 DDR_A_D36
125 DDR_A_D33 126 DDR_A_D37
127 GND 128 GND
129 DDR_A_DQS#4 130 DDR_A_DM4
131 DDR_A_DQS4 132 GND
133 GND 134 DDR_A_D38
135 DDR_A_D34 136 DDR_A_D39
137 DDR_A_D35 138 GND
139 GND 140 DDR_A_D44
141 DDR_A_D40 142 DDR_A_D45
143 DDR_A_D41 144 GND
145 GND 146 DDR_A_DQS#5
147 DDR_A_DM5 148 DDR_A_DQS5
149 GND 150 GND
151 DDR_A_D42 152 DDR_A_D46
153 DDR_A_D43 154 DDR_A_D47
155 GND 156 GND
157 DDR_A_D48 158 DDR_A_D52
Pin No. Signal name I/O Pin No. Signal Name I/O
161 GND 162 GND
163 NC 164 M_CLK_DDR1
165 GND 166 M_CLK_DDR#1
167 DDR_A_DQS#6 168 GND
169 DDR_A_DQS6 170 DDR_A_DM6
171 GND 172 GND
173 DDR_A_D50 174 DDR_A_D54
175 DDR_A_D51 176 DDR_A_D55
177 GND 178 GND
179 DDR_A_D56 180 DDR_A_D60
181 DDR_A_D57 182 DDR_A_D61
183 GND 184 GND
185 DDR_A_DM7 186 DDR_A_DQS#7
187 GND 188 DDR_A_DQS7
189 DDR_A_D58 190 GND
191 DDR_A_D59 192 DDR_A_D62
193 GND 194 DDR_A_D63
195 CLK_SMBDATA 196 GND
197 CLK_SMBCLK 198 GND
199 +3VS 200 GND
C.11 JMIC
Pin No. Signal name I/O Pin No. Signal Name I/O
1 INT_MIC 2 GND
Pin No. Signal name I/O Pin No. Signal Name I/O
1 AGND 2 HP_L
3 HP_R 4 NBA_PLUG
5 AGND 6 NC
C.13 JKB
Pin No. Signal name I/O Pin No. Signal Name I/O
1 NC 2 NC
3 CAPS_LED# 4 +3VS
5 KSI1 6 KSI6
7 KSI5 8 KSI0
9 KSI4 10 KSI3
11 KSI2 12 KSI7
13 KSO15 14 KSO12
15 KSO11 16 KSO10
17 KSO9 18 KSO8
19 KSO13 20 KSO7
21 KSO6 22 KSO14
23 KSO5 24 KSO3
25 KSO4 26 KSO0
27 KSO1 28 KSO2
29 NC 30 NC
31 NC 32 NC
33 NC 34 NC
Pin No. Signal name I/O Pin No. Signal Name I/O
1 +USB_VCCA 2 USB20_N0_R
3 USB20_P0_R 4 GND
C.15 JUSBB
Pin No. Signal name I/O Pin No. Signal Name I/O
1 +USB_VCCA 2 USB20_N2_R
3 USB20_P2_R 4 GND
C.16 JUSBC
Pin No. Signal name I/O Pin No. Signal Name I/O
1 +USB_VCCB 2 USB20_N7_R_S
3 USB20_P7_R_S 4 GND
C.17 JPOWER
Pin No. Signal name I/O Pin No. Signal Name I/O
1 PWR_ON_LED# 2 PWR_ON_LED
3 ON/OFFBTN#_R 4 GND
Pin No. Signal name I/O Pin No. Signal Name I/O
1 SD_DATA3 2 SDCMD
3 GND 4 +VCC_3IN1
5 SDCLK 6 GND
7 SD_MS_DATA0 8 SD_DATA1
9 SD_DATA2 10 SDWP#
11 SDCD#
C.19 JEXMIC
Pin No. Signal name I/O Pin No. Signal Name I/O
1 GND 2 MIC1_L
3 MIC1_R 4 MIC_SENSE
5 GND 6 NC
C.20 JSPKR
Pin No. Signal name I/O Pin No. Signal Name I/O
1 SPK_R1 2 SPK_R2
3 NC 4 NC
Pin No. Signal name I/O Pin No. Signal Name I/O
1 GND 2 TP_SWR
3 TP_SWL 4 TP_DATA
5 TP_CLK 6 +5VS
Notes:
55 / E0 AA E0 35 E0 B5 E0 2A E0 F0 12 E0 4A E0 F0 4A E0 12
75 INS E0 AA E0 52 E0 D2 E0 2A E0 F0 12 E0 70 E0 F0 70 E0 12
76 DEL E0 AA E0 53 E0 D3 E0 2A E0 F0 12 E0 71 E0 F0 71 E0 12
79 E0 AA E0 4B E0 CB E0 2A E0 F0 12 E0 6B E0 F0 6B E0 12
80 Home E0 AA E0 47 E0 C7 E0 2A E0 F0 12 E0 6C E0 F0 6C E0 12
81 End E0 AA E0 4F E0 CF E0 2A E0 F0 12 E0 69 E0 F0 69 E0 12
83 E0 AA E0 48 E0 C8 E0 2A E0 F0 12 E0 75 E0 F0 75 E0 12
84 E0 AA E0 50 E0 D0 E0 2A E0 F0 12 E0 72 E0 F0 72 E0 12
85 PgUp E0 AA E0 49 E0 C9 E0 2A E0 F0 12 E0 7D E0 F0 7D E0 12
86 PgDn E0 AA E0 51 E0 D1 E0 2A E0 F0 12 E0 7A E0 F0 7A E0 12
89 E0 AA E0 4D E0 CD E0 2A E0 F0 12 E0 74 E0 F0 74 E0 12
X Win E0 AA E0 5B E0 DB E0 2A E0 F0 12 E0 1F E0 F0 1F E0 12
X App E0 AA E0 5D E0 DD E0 2A E0 F0 12 E0 2F E0 F0 2F E0 12
Note : The table above shows scan codes with the left Shift key. In combination
with the right Shift key, scan codes are changed as listed below:
With left Shift With right Shift
Set 1 E0 AA ___________ E0 B6
E0 2A ___________ E0 36
Set 2 E0 F0 12_________ E0 F0 59
E0 12____________ E0 59
75 INS E0 2A E0 52 E0 D2 E0 AA E0 12 E0 70 E0 F0 70 E0 F0 12
76 DEL E0 2A E0 53 E0 D3 E0 AA E0 12 E0 71 E0 F0 71 E0 F0 12
79 E0 2A E0 4B E0 CB E0 AA E0 12 E0 6B E0 F0 6B E0 F0 12
80 Home E0 2A E0 47 E0 C7 E0 AA E0 12 E0 6C E0 F0 6C E0 F0 12
81 End E0 2A E0 4F E0 CF E0 AA E0 12 E0 69 E0 F0 69 E0 F0 12
83 E0 2A E0 48 E0 C8 E0 AA E0 12 E0 75 E0 F0 75 E0 F0 12
84 E0 2A E0 50 E0 D0 E0 AA E0 12 E0 72 E0 F0 72 E0 F0 12
85 PgUp E0 2A E0 49 E0 C9 E0 AA E0 12 E0 7D E0 F0 7D E0 F0 12
86 PgDn E0 2A E0 51 E0 D1 E0 AA E0 12 E0 7A E0 F0 7A E0 F0 12
89 E0 2A E0 4D E0 CD E0 AA E0 12 E0 74 E0 F0 74 E0 F0 12
X Win E0 2A E0 5B E0 DB E0 AA E0 12 E0 1F E0 F0 1F E0 F0 12
X App E0 2A E0 5D E0 DD E0 AA E0 12 E0 2F E0 F0 2F E0 F0 12
Figure US keyboard
Figure CH keyboard
Figure TI keyboard
Figure KO keyboard
Figure UK keyboard
Figure HB keyboard
Figure SW keyboard
Figure CZ keyboard
Figure RU keyboard
Figure PO keyboard
Figure SL keyboard
Figure IT keyboard
Figure FR keyboard
Figure GR keyboard
Figure GK keyboard
Figure HG keyboard
Figure SP keyboard
Figure TR keyboard
Figure SD keyboard
Figure BE keyboard
Figure YU keyboard
Figure NW keyboard
Figure ND keyboard
Figure AC keyboard
Figure CB keyboard
Figure RO keyboard
Figure BU keyboard
Figure JP keyboard
Appendix G Reliability
The following table shows MTBF (Mean Time Between Failures) for each component.