LIS2DW12

Datasheet

MEMS digital output motion sensor: high-performance ultra-low-power 3-axis

"femto" accelerometer

Features
• Ultra-low power consumption: 50 nA in power-down mode, below 1 µA in active
low-power mode
• Very low noise: down to 1.3 mg RMS in low-power mode
• Multiple operating modes with multiple bandwidths
• Android stationary detection, motion detection
• Supply voltage, 1.62 V to 3.6 V
• Independent IO supply
• ±2g/±4g/±8g/±16g full scale
• High-speed I²C/SPI digital output interface
• Single data conversion on demand
• 16-bit data output
• Embedded temperature sensor
• Self-test
• 32-level FIFO
• 10000 g high shock survivability
• ECOPACK, RoHS and “Green” compliant

Applications
• Motion detection for wearables
• Gesture recognition and gaming
Product status link
• Motion-activated functions and user interfaces
LIS2DW12
• Display orientation
Product summary • Tap/double-tap recognition
• Free-fall detection
Order code LIS2DW12 LIS2DW12TR
• Smart power saving for handheld devices
Temperature
-40 to +85 • Hearing aids
range [°C]

Package LGA-12 • Portable healthcare devices

Packing Tray Tape and reel
• Wireless sensor nodes
• Motion-enabled metering devices
Product label

Description
The LIS2DW12 is an ultra-low-power high-performance three-axis linear
accelerometer belonging to the “femto” family which leverages on the robust and
mature manufacturing processes already used for the production of micromachined
accelerometers.
The LIS2DW12 has user-selectable full scales of ±2g/±4g/±8g/±16g and is capable of
measuring accelerations with output data rates from 1.6 Hz to 1600 Hz.
The LIS2DW12 has an integrated 32-level first-in, first-out (FIFO) buffer allowing the
user to store data in order to limit intervention by the host processor.
The embedded self-test capability allows the user to check the functioning of the
sensor in the final application.

DS11811 - Rev 7 - May 2019 www.st.com

For further information contact your local STMicroelectronics sales office.
 LIS2DW12

The LIS2DW12 has a dedicated internal engine to process motion and acceleration
detection including free-fall, wakeup, highly configurable single/double-tap
recognition, activity/inactivity, stationary/motion detection, portrait/landscape
detection and 6D/4D orientation.
The LIS2DW12 is available in a small thin plastic land grid array package (LGA) and
it is guaranteed to operate over an extended temperature range from -40 °C to
+85 °C.

DS11811 - Rev 7 page 2/65

 LIS2DW12
Block diagram and pin description

1 Block diagram and pin description

1.1 Block diagram

Figure 1. Block diagram

X+
Y+ CHARG E
Z+ AMPLIFIE R CS
2
SCL/SPC
a MUX
A/D
CONVERTER
CONTROL
LOGIC
IC
SDA/SDO/SDI
Z- SPI
SDO/SA0
Y-
X-

TEMPERATURE SENSOR

32 Level CONTROL LOGIC INT1

TRIMMING
SELF TEST REFERENCE CLOCK &
CIRCUITS FIFO INTERRUPT GEN. INT2

DS11811 - Rev 7 page 3/65

 LIS2DW12
Pin description

1.2 Pin description

Figure 2. Pin connections

INT1
INT2
1
VDDIO 10 11 12 1 SCL/SPC

VDD 9 2 CS

GND 8 3 SDO/SA0

X Y
RES 7 6 5 4 SDA/SDI/SDO
(TOPVIEW)

GND

NC
DIRECTION OF THE
DETECTABLE
ACCELERATIONS (BOTTOM VIEW)

Table 1. Pin description

Pin# Name Function

SCL I²C serial clock (SCL)

1
SPC SPI serial port clock (SPC)
SPI enable
I²C/SPI mode selection
2(1) CS
(1: SPI idle mode / I²C communication enabled;
0: SPI communication mode / I²C disabled)
SDO SPI serial data output (SDO)
3(1)
SA0 I²C less significant bit of the device address (SA0)
SDA I²C serial data (SDA)
4 SDI SPI serial data input (SDI)
SDO 3-wire interface serial data output (SDO)
5 NC Internally not connected. Can be tied to VDD, VDDIO, or GND.
6 GND 0 V supply
7 RES Connect to GND
8 GND 0 V supply
9 VDD Power supply
10 VDD_IO Power supply for I/O pins
11 INT2 Interrupt pin 2. Clock input when selected in single data conversion on demand.
12 INT1 Interrupt pin 1

1. SDO/SA0 and CS pins are internally pulled up. Refer to Table 2. Internal pull-up values (typ.) for SDO/SA0 and CS pins for
the internal pull-up values (typ).

DS11811 - Rev 7 page 4/65

 LIS2DW12
Pin description

Table 2. Internal pull-up values (typ.) for SDO/SA0 and CS pins

Resistor value for SDO/SA0 and CS pins

Vdd_IO
Typ. (kΩ)

1.7 V 54.4
1.8 V 49.2
2.5 V 30.4
3.6 V 20.4

DS11811 - Rev 7 page 5/65

 LIS2DW12
Mechanical and electrical specifications

2 Mechanical and electrical specifications

2.1 Mechanical characteristics

@ Vdd = 1.8 V, T = 25 °C unless otherwise noted. The product is factory calibrated at 1.8 V. The operational
power supply range is from 1.62 V to 3.6 V.

Table 3. Mechanical characteristics

Symbol Parameter Test conditions Min. Typ.(1) Max. Unit

±2
±4
FS Measurement range g
±8
±16
@ FS ±2 g in High-Performance Mode and all low-power
0.244
modes except Low-Power Mode 1
@ FS ±4 g in High-Performance Mode and all low-power
0.488
modes except Low-Power Mode 1
@ FS ±8 g in High-Performance Mode and all low-power
0.976
modes except Low-Power Mode 1
So Sensitivity @ FS ±16 g in High-Performance Mode and all low- mg/digit
1.952
power modes except Low-Power Mode 1
@ FS ±2 g in Low-Power Mode 1 0.976
@ FS ±4 g in Low-Power Mode 1 1.952
@ FS ±8 g in Low-Power Mode 1 3.904
@ FS ±16 g in Low-Power Mode 1 7.808
Noise density - High-performance
An @ FS ±2 g 90 µg/√Hz
Mode(2)
Low-Power Mode 4 1.3

RMS noise - Low-Power Modes(3) Low-Power Mode 3 1.8

RMS mg(RMS)
@ FS ±2 g Low-Power Mode 2 2.4
Low-Power Mode 1 4.5

TyOff Zero-g level offset accuracy(4) ±20 mg

TCO Zero-g offset change vs. temperature ±0.2 mg/°C

TCS Sensitivity change vs. temperature 0.01 %/°C
ST Self-test positive difference 70 1500 mg

1. Typical specifications are not guaranteed.

2. Noise density is the same for all ODRs. Low-noise setting enabled.
3. RMS noise is the same for all ODRs. Low-noise setting enabled.
4. Values after factory calibration test and trimming.

DS11811 - Rev 7 page 6/65

 LIS2DW12
Electrical characteristics

2.2 Electrical characteristics

@ Vdd = 1.8 V, T = 25 °C unless otherwise noted. The product is factory calibrated at 1.8 V. The operational
power supply range is from 1.62 V to 3.6 V.

Table 4. Electrical characteristics

Symbol Parameter Test conditions Min. Typ. (1) Max. Unit

Vdd Supply voltage 1.62 1.8 3.6 V

Vdd_IO I/O pins supply voltage(2) 1.62 Vdd+0.1 V

@ ODR range
IddHR Current consumption in High-Performance Mode(3) 90 µA
12.5 Hz - 1600 Hz, 14-bit
ODR 100 Hz 5
ODR 50 Hz 3
IddLP Current consumption in Low-Power Mode(4) µA
ODR 12.5 Hz 1
ODR 1.6 Hz 0.38
Idd_PD Current consumption in power-down 50 nA
VIH Digital high-level input voltage 0.8*Vdd_IO V

VIL Digital low-level input voltage 0.2*Vdd_IO V

VOH Digital high-level output voltage IOH = 4 mA(5) VDD_IO - 0.2 V V

VOL Digital low-level output voltage IOL = 4 mA(5) 0.2 V V

1. Typical specifications are not guaranteed.

2. It is possible to remove Vdd maintaining Vdd_IO without blocking the communication busses. In this
condition the measurement chain is powered off.
3. Low-noise setting disabled.
4. Low-Power Mode 1. Low-noise setting disabled.
5. 4 mA is the maximum driving capability, ie. the maximum DC current that can be sourced/sunk by the digital
pad in order to guarantee the correct digital output voltage levels VOH and VOL.

DS11811 - Rev 7 page 7/65

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Temperature sensor characteristics

2.3 Temperature sensor characteristics

@ Vdd = 1.8 V, T = 25 °C unless otherwise noted

Table 5. Temperature sensor characteristics

Symbol Parameter Min. Typ. (1) Max. Unit

Top Operating temperature range -40 +85 °C

Toff Temperature offset(2) -15 +15 °C

1(3)
TSDr Temperature sensor output change vs. temperature LSB/°C
16(4)
Temperature refresh rate in High-Performance Mode for all ODRs
50
or in low-power modes for ODRs equal to 200/100/50 Hz

TODR Temperature refresh rate in low-power modes for ODR equal to 25 Hz 25 Hz

Temperature refresh rate in low-power modes for ODR equal to 12.5 Hz 12.5
Temperature refresh rate in low-power modes for ODR equal to 1.6 Hz 1.6

1. Typical specifications are not guaranteed.

2. The output of the temperature sensor is 0 LSB (typ.) at 25 °C.
3. 8-bit resolution.
4. 12-bit resolution.

DS11811 - Rev 7 page 8/65

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Communication interface characteristics

2.4 Communication interface characteristics

2.4.1 SPI - serial peripheral interface

Subject to general operating conditions for Vdd and Top.

Table 6. SPI slave timing values

Value (1)
Symbol Parameter Unit
Min Max

tc(SPC) SPI clock cycle 100 ns

fc(SPC) SPI clock frequency 10 MHz

tsu(CS) CS setup time 6

th(CS) CS hold time 8

tsu(SI) SDI input setup time 12

th(SI) SDI input hold time 15 ns

tv(SO) SDO valid output time 50

th(SO) SDO output hold time 9

tdis(SO) SDO output disable time 50

1. 10 MHz clock frequency for SPI with both 4 and 3 wires, based on characterization results, not tested in production.

Figure 3. SPI slave timing diagram

CS

tsu(CS) tc(SPC) th(CS)

SPC

tsu(SI) th(SI)

SDI MSB IN LSB IN

tv(SO) th(SO) tdis(SO)

SDO MSB OUT LSB OUT

Note: Measurement points are done at 0.2·Vdd_IO and 0.8·Vdd_IO, for both input and output ports.

DS11811 - Rev 7 page 9/65

 LIS2DW12
Communication interface characteristics

2.4.2 I²C - inter-IC control interface

Subject to general operating conditions for Vdd and Top.

Table 7. I²C slave timing values

I²C standard mode(1) I²C fast mode(1)

Symbol Parameter Unit
Min Max Min Max

f(SCL) SCL clock frequency 0 100 0 400 kHz

tw(SCLL) SCL clock low time 4.7 1.3 µs

tw(SCLH) SCL clock high time 4.0 0.6

tsu(SDA) SDA setup time 250 100 ns

th(SDA) SDA data hold time 0.01 3.45 0.01 0.9 µs

th(ST) START condition hold time 4 0.6

tsu(SR) Repeated START condition setup time 4.7 0.6

µs
tsu(SP) STOP condition setup time 4 0.6

tw(SP:SR) Bus free time between STOP and START condition 4.7 1.3

1. Data based on standard I²C protocol requirement, not tested in production.

Figure 4. I²C slave timing diagram

REPEATED
START
START

tsu(SR)
tw(SP:SR) START
SDA

tsu(SDA) th(SDA)

tsu(SP) STOP

SCL

th(ST) tw(SCLL) tw(SCLH)

Note: Measurement points are done at 0.2·Vdd_IO and 0.8·Vdd_IO, for both ports.

DS11811 - Rev 7 page 10/65

 LIS2DW12
Communication interface characteristics

Table 8. I²C high-speed mode specifications at 1 MHz and 3.4 MHz

Mode Symbol Parameter Min Max Unit

fSCL SCL clock frequency 0 1 MHz

tHD;STA Hold time (repeated) START condition 260 -

tLOW Low period of the SCL clock 500 -

tHIGH High period of the SCL clock 260 -

tSU;STA Setup time for a repeated START condition 260 -

tHD;DAT Data hold time 0 -

tSU;DAT Data setup time 50 - ns

trDA Rise time of SDA signal - 120

tfDA Fall time of SDA signal - 120

Fast mode plus(1)
trCL Rise time of SCL signal 20*Vdd/5.5 120

tfCL Fall time of SCL signal 20*Vdd/5.5 120

tSU;STO Setup time for STOP condition 260 -

Cb Capacitive load for each bus line - 550 pF

tVD;DAT Data valid time - 450 ns

tVD;ACK Data valid acknowledge time - 450

VnL Noise margin at low level 0.1Vdd - V

VnH Noise margin at high level 0.2Vdd -

tSP Pulse width of spikes that must be suppressed by the input filter 0 50 ns

fSCLH SCLH clock frequency 0 3.4 MHz

tSU;STA Setup time for a repeated START condition 160 -

tHD;STA Hold time (repeated) START condition 160 -

tLOW Low period of the SCLH clock 160 -

tHIGH High period of the SCLH clock 60 -

tSU;DAT Data setup time 10 -

tHD;DAT Data hold time 0 70

trCL ns
Rise time of SCLH signal 10 40
High-speed mode(1) Rise time of SCLH signal after a repeated START condition and after an
trCL1 10 80
acknowledge bit
tfCL Fall time of SCLH signal 10 40

trDA Rise time of SDAH signal 10 80

tfDA Fall time of SDAH signal 10 80

tSU;STO Setup time for STOP condition 160 -

Cb Capacitive load for each bus line - 100 pF

VnH Noise margin at high level 0.2Vdd - V

tSP Pulse width of spikes that must be suppressed by the input filter 0 10 ns

1. Data based on characterization, not tested in production.

DS11811 - Rev 7 page 11/65

 LIS2DW12
Absolute maximum ratings

2.5 Absolute maximum ratings

Stresses above those listed as “absolute maximum ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device under these conditions is not implied. Exposure to
maximum rating conditions for extended periods may affect device reliability.

Table 9. Absolute maximum ratings

Symbol Ratings Maximum value Unit

Vdd Supply voltage -0.3 to 4.8 V

Vdd_IO I/O pins supply voltage -0.3 to 4.8 V
Input voltage on any control pin
Vin -0.3 to Vdd_IO +0.3 V
(CS, SCL/SPC, SDA/SDI/SDO, SDO/SA0)
3000 g for 0.5 ms g
APOW Acceleration (any axis, powered, Vdd = 1.8 V)
10000 g for 0.2 ms g
3000 g for 0.5 ms g
AUNP Acceleration (any axis, unpowered)
10000 g for 0.2 ms g
TOP Operating temperature range -40 to +85 °C

TSTG Storage temperature range -40 to +125 °C

ESD Electrostatic discharge protection 2 (HBM) kV

Note: Supply voltage on any pin should never exceed 4.8 V.

This device is sensitive to mechanical shock, improper handling can cause permanent damage to the part.

This device is sensitive to electrostatic discharge (ESD), improper handling can cause permanent damage to the part.

DS11811 - Rev 7 page 12/65

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Terminology and functionality

3 Terminology and functionality

3.1 Terminology

3.1.1 Sensitivity
Sensitivity describes the gain of the sensor and can be determined by applying 1 g acceleration to it. As the
sensor can measure DC accelerations this can be done easily by pointing the axis of interest towards the center
of the Earth, noting the output value, rotating the sensor by 180 degrees (pointing to the sky) and noting the
output value again. By doing so, ±1 g acceleration is applied to the sensor. Subtracting the larger output value
from the smaller one, and dividing the result by 2, leads to the actual sensitivity of the sensor. This value changes
very little over temperature and time. The sensitivity tolerance describes the range of sensitivities of a large
population of sensors.

3.1.2 Zero-g level offset

Zero-g level offset describes the deviation of an actual output signal from the ideal output signal if no acceleration
is present. A sensor in a steady state on a horizontal surface will measure 0 g on the X-axis and 0 g on the Y-axis
whereas the Z-axis will measure 1 g. The output is ideally in the middle of the dynamic range of the sensor
(content of OUT registers 00h, data expressed as two’s complement number). A deviation from ideal value in this
case is called Zero-g level offset. Offset is to some extent a result of stress to the MEMS sensor and therefore the
offset can slightly change after mounting the sensor onto a printed circuit board or exposing it to extensive
mechanical stress. Offset changes little over temperature, see “Zero-g level offset change vs. temperature”.

DS11811 - Rev 7 page 13/65

 LIS2DW12
Functionality

3.2 Functionality

3.2.1 Operating modes

Two sets of operating modes have been designed to offer the customer a broad choice of noise/power
consumption combinations:
• Low-noise disabled (see Table 10. Operating modes - low-noise setting disabled)
• Low-noise enabled (see Table 11. Operating modes - low-noise setting enabled)
Writing the LOW_NOISE bit in CTRL6 (25h) selects the operating mode (low-noise).
From each of these two sets, five operating modes have been designed:
• 1 High-Performance Mode: focus on low noise
• 4 Low-Power Modes: trade-off between noise and power consumption
These operating modes are selected by writing the MODE[1:0] and LP_MODE[1:0] bits in CTRL1 (20h).

Table 10. Operating modes - low-noise setting disabled

High-Performance Low-Power Low-Power Low-Power Low-Power

Parameter
Mode Mode 4 Mode 3 Mode 2 Mode 1

Resolution [bit] 14-bit 14-bit 14-bit 14-bit 12-bit

ODR [Hz] 12.5 - 1600 1.6 - 200 1.6 - 200 1.6 - 200 1.6 - 200
ODR/2 (N/A for 180 360 720 3200
1600 Hz),
BW [Hz] ODR/4, ODR/4, ODR/4, ODR/4,
ODR/4, ODR/10, ODR/10, ODR/10, ODR/10, ODR/10,
ODR/20 ODR/20 ODR/20 ODR/20 ODR/20
Noise density [µg/√Hz]
110 160 210 300 550
@ FS = ±2 g, ODR=200 Hz
ODR=1.6 Hz - 0.65 0.55 0.45 0.38
ODR=12.5 Hz 90 4 2.5 1.6 1
ODR=25 Hz 90 8.5 4.5 3 1.5
Current consumption [µA] ODR=50 Hz 90 16 9 5.5 3
@ Vdd=1.8 V ODR=100 Hz 90 32 17.5 10.5 5
ODR=200 Hz 90 63 34.5 20.5 10
ODR=400, 800,
90 - - - -
1600 Hz

DS11811 - Rev 7 page 14/65

 LIS2DW12
Functionality

Table 11. Operating modes - low-noise setting enabled

High-Performance Low-Power Low-Power Low-Power Low-Power

Parameter
Mode Mode 4 Mode 3 Mode 2 Mode 1

Resolution [bit] 14-bit 14-bit 14-bit 14-bit 12-bit

ODR [Hz] 12.5 - 1600 1.6 - 200 1.6 - 200 1.6 - 200 1.6 - 200
ODR/2 (N/A for 180 360 720 3200
1600 Hz),
BW [Hz] ODR/4, ODR/4, ODR/4, ODR/4,
ODR/4, ODR/10, ODR/10, ODR/10, ODR/10, ODR/10,
ODR/20 ODR/20 ODR/20 ODR/20 ODR/20
Noise density [µg/√Hz]
90 130 180 240 450
@ FS = ±2 g, ODR=200 Hz
ODR=1.6 Hz - 0.7 0.6 0.5 0.4
ODR=12.5 Hz 120 5 3 2 1.1
ODR=25 Hz 120 10 6 3.5 2
Current consumption [µA] ODR=50 Hz 120 20 11 7 3.5
@ Vdd=1.8 V ODR=100 Hz 120 39 21.5 13 6
ODR=200 Hz 120 77 42 25 12
ODR=400, 800,
120 - - - -
1600 Hz

DS11811 - Rev 7 page 15/65

 LIS2DW12
Functionality

3.2.2 Single data conversion on-demand mode

The device features a single data conversion on-demand mode which is valid for both sets of operating modes
(low-noise disabled or enabled) in the 4 low-power modes. This mode is enabled by writing the MODE[1:0] bits to
'10' in CTRL1 (20h). Low power modes are selected by writing the LP_MODE[1:0] bits in CTRL1 (20h).
The trigger for output data generation can be managed through the I²C/SPI or by applying a clock signal on the
INT2 pin acting here as an input by writing the SLP_MODE_ SEL bit in CTRL3 (22h):
• When SLP_MODE_SEL = '0', output data generation is triggered by the clock signal on the INT2 pin (see
Figure 5. Single data conversion on-demand functionality).
• When SLP_MODE_SEL = '1', output data generation starts when the SLP_MODE_1 bit is set to '1' logic
through the I²C/SPI. When XL data are available in the registers, this bit is automatically set to '0' and the
device is ready for another triggered session.
Output data are generated according to the selected low-power mode.
When output data is saved in an output register or FIFO, the device goes to power-down mode and waits for a
new trigger.
All ODRs in the range from 0 to up to 200 Hz are supported due to the INT2 clock input.
A DRDY signal or FIFO flags are available on the INT1 pin.
Power consumption is the same as that of standard low-power modes for the same ODR.

Figure 5. Single data conversion on-demand functionality

Trigger Signal (INT2 pin)

T_on PD T_on

DRDY (INT1 pin)

At the end of turn-on time T_on, the DRDY interrupt is activated, output data are available to be read and the
device goes into power-down. T_on values depend on the low-power mode as follows:
T_on (typ.) =
• 1.20 ms for Low-Power Mode 1
• 1.70 ms for Low-Power Mode 2
• 2.30 ms for Low-Power Mode 3
• 3.55 ms for Low-Power Mode 4

3.2.3 Self-test
The self-test allows checking the sensor functionality without moving it. The self-test function is off when the self-
test bits (ST) are programmed to ‘00’. When the self-test bits are changed, an actuation force is applied to the
sensor, simulating a definite input acceleration. In this case the sensor outputs will exhibit a change in their DC
levels which are related to the selected full scale through the device sensitivity. When the self-test is activated, the
device output level is given by the algebraic sum of the signals produced by the acceleration acting on the sensor
and by the electrostatic test-force. If the output signals change within the amplitude specified in
Table 3. Mechanical characteristics, then the sensor is working properly and the parameters of the interface chip
are within the defined specifications.

DS11811 - Rev 7 page 16/65

 LIS2DW12
Functionality

3.2.4 Activity/Inactivity, Android stationary/motion-detection functions

The activity/inactivity function recognizes the device’s sleep state and allows reducing system power
consumption.
When the activity/inactivity function is activated by setting the INTERRUPTS_ENABLE bit in CTRL7 (3Fh) and the
SLEEP_ON bit in WAKE_UP_THS (34h), the LIS2DW12 automatically goes to 12.5 Hz ODR in the low-power
mode previously selected by the LP_MODE[1:0] bits in CTRL1 (20h) if the sleep state condition is detected and
wakes up as soon as the interrupt event has been detected, increasing the output data rate and bandwidth.
With this feature the system may be efficiently switched from low-power mode to full performance depending on
user-selectable positioning and acceleration events, thus ensuring power saving and flexibility.
The Android stationary/motion detection function only recognizes the device’s sleep state.
When the Android stationary/motion-detection function is activated by setting the STATIONARY bit in
WAKE_UP_DUR (35h), the LIS2DW12 detects acceleration below a fixed threshold but does not change either
ODR or operating mode (High-Performance mode or Low-Power mode) after sleep state detection.
The Activity/Inactivity recognition function can use the high-pass filter or the offset outputs, this choice can be
made through the USR_OFF_ON_OUT bit in CTRL7 (3Fh).
If the device is in sleep (inactivity/stationary) mode, when at least one of the axes exceeds the threshold in
WAKE_UP_THS (34h), the device goes into a sleep-to-wake state (as wake-up).
For the activity/inactivity function, the device, in a wake-up state, will return to the operating mode (HP or LP) and
ODR before sleep state detection.
Activity/Inactivity, Android stationary/motion-detection threshold and duration can be configured in the following
control registers:
WAKE_UP_THS (34h)
WAKE_UP_DUR (35h)

3.2.5 High tap/double-tap user configurability

The device embeds the possibility to select the following parameters:
• single axis or multiple axes in TAP_THS_Z (32h)
• axis priority in TAP_THS_Y (31h)
• threshold value of each axis in TAP_THS_X (30h), TAP_THS_Y (31h), and TAP_THS_Z (32h)
• max time threshold between 2 consecutive taps for double-tap recognition, min time threshold between 2
consecutive taps to detect a new tap event in INT_DUR (33h)

3.2.6 Offset management

The user can manage offset in the output or for wakeup detection using dedicated embedded hardware (see
Section 5.1 Block diagram of filters).

DS11811 - Rev 7 page 17/65

 LIS2DW12
Sensing element

3.3 Sensing element

A proprietary process is used to create a surface micromachined accelerometer. The technology allows
processing suspended silicon structures which are attached to the substrate in a few points called anchors and
are free to move in the direction of the sensed acceleration. In order to be compatible with the traditional
packaging techniques, a cap is placed on top of the sensing element to avoid blocking the moving parts during
the molding phase of the plastic encapsulation. When an acceleration is applied to the sensor the proof mass
displaces from its nominal position, causing an imbalance in the capacitive half-bridge. This imbalance is
measured using charge integration in response to a voltage pulse applied to the capacitor.
At steady-state the nominal value of the capacitors are a few pF and when an acceleration is applied, the
maximum variation of the capacitive load is in the fF range.

3.4 IC interface
The complete measurement chain is composed of a low-noise capacitive amplifier which converts the capacitive
unbalancing of the MEMS sensor into an analog voltage using an analog-to-digital converter.
The acceleration data may be accessed through an I²C/SPI interface thus making the device particularly suitable
for direct interfacing with a microcontroller.
The LIS2DW12 features a data-ready signal which indicates when a new set of measured acceleration data is
available, thus simplifying data synchronization in the digital system that uses the device.

3.5 Factory calibration

The IC interface is factory-calibrated for sensitivity (So) and Zero-g level offset.
The trim values are stored inside the device in nonvolatile memory. Any time the device is turned on, the trimming
parameters are downloaded into the registers to be used during active operation. This allows using the device
without further calibration. If an accidental write occurs in the registers where trimming parameters are stored, the
BOOT bit in CTRL2 (21h) can help to retrieve the correct trimming parameters from nonvolatile memory without
the need to switch on/off the device. This bit is automatically reset at the end of the download operation. Setting
this bit has no impact on the control registers.

3.6 Temperature sensor

The temperature is available in OUT_T_L (0Dh), OUT_T_H (0Eh) stored as two's complement data, left-justified
in 12-bit mode and in OUT_T (26h) stored as two's complement data, left-justified in 8-bit mode.
Refer to Table 5. Temperature sensor characteristics for the conversion factor.

DS11811 - Rev 7 page 18/65

 LIS2DW12
Application hints

4 Application hints

Figure 6. LIS2DW12 electrical connections (top view)

Vdd_IO

100nF
HOST

INT2 GND I2C / SPI (3/4-w)

INT1

Vdd

10µF LIS2DW12
SCL/SPC Vdd_IO
1 12 11 10

CS VDD
2 9 100nF
GND I2C configuration
SDO/SA0 GND
3 8 Vdd_IO

SDA/SDI/SDO RES
4 5 6 7
Rpu Rpu
GND
NC

SCL
SDA

Pull-up to be added
Rpu=10kOhm

The device core is supplied through the Vdd line while the I/O pads are supplied through the Vdd_IO line. Power
supply decoupling capacitors (100 nF ceramic, 10 µF aluminum) should be placed as near as possible to pin 9 of
the device (common design practice).
All the voltage and ground supplies must be present at the same time to have proper behavior of the IC (refer to
Figure 6. LIS2DW12 electrical connections (top view)). It is possible to remove Vdd while maintaining Vdd_IO
without blocking the communication bus, in this condition the measurement chain is powered off.
The functionality of the device and the measured acceleration data are selectable and accessible through the I²C
or SPI interfaces. When using the I²C, CS must be tied high (i.e. connected to Vdd_IO).
The functions, the threshold and the timing of the two interrupt pins (INT1 and INT2) can be completely
programmed by the user through the I²C/SPI interface.

DS11811 - Rev 7 page 19/65

 LIS2DW12
Application hints

Table 12. Internal pin status

Pin # Name Function Pin status

SCL I²C serial clock (SCL)

1 Default: open drain
SPC SPI serial port clock (SPC)
SPI enable
I²C/SPI mode selection
2 CS Default: input with internal pull-up(1)
1: SPI idle mode / I²C communication enabled
0: SPI communication mode / I²C disabled
SDO Serial data output (SDO)
3 Default: input with internal pull-up
SA0 I²C less significant bit of the device address (SA0)
SDA I²C serial data (SDA)
4 SDI SPI serial data input (SDI) Default: (SDA) input open drain
SDO 3-wire interface serial data output (SDO)
5 NC Internally not connected. Can be tied to VDD, VDDIO, or GND.
6 GND 0 V supply
7 RES Connect to GND
8 GND 0 V supply
9 VDD Power supply
10 VDD_IO Power supply for I/O pins
11 INT2 Interrupt pin 2. Clock input when selected in single data conversion on-demand. Default: push-pull output forced to Gnd
12 INT1 Interrupt pin 1 Default: push-pull output forced to Gnd

1. In order to disable the internal pull-up on the CS pin, write '1' to the CS_PU_DISC bit in CTRL2 (21h).

DS11811 - Rev 7 page 20/65

 LIS2DW12
Digital main blocks

5 Digital main blocks

5.1 Block diagram of filters

Figure 7. Accelerometer chain

Referring to Figure 7. Accelerometer chain, the first block is the Low-Pass Filter 1 (LPF1) whose behavior is a
function of the actual ODR and mode selected in CTRL1 (20h). The signal is then downsampled and can be
either directly sent to the output registers or to the Low-Pass Filter 2 (LPF2) or High-Pass-Filter (HP) using the
BW_FILT[1:0] bits and FDS bit in CTRL6 (25h).
In the low-pass path, it is possible to apply a user offset determined by the X_OFS_USR (3Ch), Y_OFS_USR
(3Dh), Z_OFS_USR (3Eh) register values and the USR_OFF_W bit in CTRL7 (3Fh) and send the result to the
output using the USR_OFF_ON_OUT bit in CTRL7 (3Fh).
In the high-pass path, it is possible to use the high-pass filter reference mode (HP) using the HP_REF_MODE bit
in CTRL7 (3Fh).

DS11811 - Rev 7 page 21/65

 LIS2DW12
Data stabilization time vs. ODR/device setting

5.2 Data stabilization time vs. ODR/device setting

Some data samples need to be discarded when changing the ODR in HP mode with ODR/2 bandwidth selection.
The table below provides the number of samples to be discarded in order to obtain valid usable data.

Table 13. Number of samples to be discarded

MODE[1:0] in BW_FILT[1:0] in
ODR [Hz] Samples to be discarded
CTRL1 (20h) CTRL6 (25h)

00 - 0
12.5 0
25 0
50 0
100 00 1
01
200 1
400 1
800 1
1600 2

DS11811 - Rev 7 page 22/65

 LIS2DW12
FIFO

5.3 FIFO
The LIS2DW12 embeds 32 slots of 14-bit data FIFO for each of the three output channels, X, Y and Z of the
acceleration data. This allows consistent power saving for the system, since the host processor does not need to
continuously poll data from the sensor, but it can wake up only when needed and burst the significant data out
from the FIFO.
The internal FIFO allows collecting 32 samples (14-bit size data) for each axis.
When the FIFO mode is other than Bypass, reading the output registers (28h to 2Dh) returns the oldest FIFO
sample set. In order to minimize communication between the master and slave, the address read may be
automatically incremented by the device by setting the IF_ADD_INC bit of CTRL2 (21h) to '1'; the device rolls
back to 0x28 when register 0x2D is reached.
This buffer can work according to the following 5 different modes:
• Bypass mode
• FIFO mode
• Continuous-to-FIFO
• Bypass-to-Continuous
• Continuous
Each mode is selected by the FMode[2:0] bits in the FIFO_CTRL (2Eh) register.
Programmable FIFO threshold is selected in FIFO_CTRL (2Eh). Status and FIFO overrun events are available in
the FIFO_SAMPLES (2Fh) register and can be used to generate dedicated interrupts on the INT1 and INT2 pins
using the CTRL4_INT1_PAD_CTRL (23h) and CTRL5_INT2_PAD_CTRL (24h) registers.
FIFO_SAMPLES (2Fh) (FIFO_FTH) goes to '1' when the number of unread samples FIFO_SAMPLES (2Fh)
(Diff[5:0]) is greater than or equal to FTH[4:0] in FIFO_CTRL (2Eh).
If FTH[4:0] is equal to '0', FIFO_SAMPLES (2Fh) (FIFO_FTH) goes to '0'.
FIFO_SAMPLES (2Fh) (FIFO_OVR) is equal to '1' if a FIFO slot is overwritten.
FIFO_SAMPLES (2Fh) (Diff[5:0]) contains stored data levels of unread samples. When Diff[5:0] is equal to
‘000000’, FIFO is empty. When Diff[5:0] is equal to ‘100000’, FIFO is full and the unread samples are 32.
To guarantee the correct acquisition of data during the switching into and out of FIFO, the first sample acquired
must be discarded.
When the FIFO threshold status flag is '0'-logic, FIFO filling is lower than the threshold level and when '1'-logic,
FIFO filling is equal to or higher than the threshold level.

DS11811 - Rev 7 page 23/65

 LIS2DW12
FIFO

5.3.1 Bypass mode

In Bypass mode (FIFO_CTRL (2Eh) (FMode [2:0])= 000), the FIFO is not operational, no data is collected in FIFO
memory, and it remains empty with the only actual sample available in the output registers.
Bypass mode is also used to reset the FIFO when in FIFO mode.
For each channel only the first address is used. When new data is available, the old data is overwritten.

5.3.2 FIFO mode

In FIFO mode (FIFO_CTRL (2Eh)(FMode [2:0])= 001) data from the X, Y and Z channels are stored in the FIFO
until it is full, when 32 unread samples are stored in memory, data collecting is stopped.
To reset the FIFO content, Bypass mode should be written in the FIFO_CTRL (2Eh) register, setting the FMODE
[2:0] bits to '000'. After this reset command, it is possible to restart FIFO mode, writing the value '001' in
FIFO_CTRL (2Eh)(FMODE [2:0]).
The FIFO buffer can memorize 32 slots of X, Y and Z data.

5.3.3 Continuous mode

Continuous mode (FIFO_CTRL (2Eh) (FMode[2:0] = 110) provides a continuous FIFO update: when 32 unread
samples are stored in memory, as new data arrives the oldest data is discarded and overwritten by the newer.
A FIFO threshold flag FIFO_SAMPLES (2Fh) (FIFO_FTH) is asserted when the number of unread samples in
FIFO is greater than or equal to (FIFO_CTRL (2Eh)FTH[4:0]).
It is possible to route FIFO_SAMPLES (2Fh)(FTH) to the INT1 pin by writing the INT1_FTH bit to '1' in register
CTRL4_INT1_PAD_CTRL (23h) or to the INT2 pin by writing the INT2_FTH bit to '1' in register
CTRL5_INT2_PAD_CTRL (24h).
If an overrun occurs, the oldest sample in FIFO is overwritten and the FIFO_OVR flag in FIFO_SAMPLES (2Fh) is
asserted.
In order to empty the FIFO before it is full, it is also possible to pull from FIFO the number of unread samples
available in FIFO_SAMPLES (2Fh) (Diff[5:0]).

DS11811 - Rev 7 page 24/65

 LIS2DW12
FIFO

5.3.4 Continuous-to-FIFO mode

In Continuous-to-FIFO mode FIFO_CTRL (2Eh)(FMode[2:0] = 011), FIFO operates in Continuous mode and FIFO
mode starts upon an internal trigger event. When the FIFO is full, data collecting is stopped. The trigger could be
a single or double tap, wake-up, free-fall, 6D interrupt or any combination of these events, but every interrupt has
to be routed on the corresponding pad to be used as a trigger.

Figure 8. Continuous-to-FIFO mode

xi,yi,zi xi,yi,zi
x0 y0 z0
x0 y0 z0

x1 y1 z1
x1 y1 z1
x2 y2 z2
x2 y2 z2
x30 y30 z30

x31 y31 z31

x31 y31 z31

Continuous Mode FIFO Mode

Trigger event

Figure 9. Trigger event to FIFO for Continuous-to-FIFO mode

DS11811 - Rev 7 page 25/65

 LIS2DW12
FIFO

5.3.5 Bypass-to-Continuous mode

In Bypass-to-Continuous mode (FIFO_CTRL (2Eh)(FMode[2:0] = '100'), data measurement storage inside FIFO
starts in Continuous mode upon an internal trigger event, then the sample that follows the trigger is available in
FIFO. The trigger could be a single or double tap, wake-up, free-fall, 6D interrupt or any combination of these
events, but every interrupt has to be routed on the corresponding pad to be used as a trigger.

Figure 10. Bypass-to-Continuous mode

xi,yi,zi xi,yi,zi
x0 y0 z0 x0 y0 z0

x1 y1 z1
x1 y1 z1
x2 y2 z2
x2 y2 z2
empty
x30 y30 z30

x31 y31 z31

x31 y31 z31

Bypass Mode Continuous Mode

Trigger event

Figure 11. Trigger event to FIFO for Bypass-to-Continuous mode

DS11811 - Rev 7 page 26/65

 LIS2DW12
Digital interfaces

6 Digital interfaces

The registers embedded inside the LIS2DW12 may be accessed through both the I²C and SPI serial interfaces.
The latter may be SW configured to operate either in 3-wire or 4-wire interface mode.
The serial interfaces are mapped to the same pins. To select/exploit the I²C interface, the CS line must be tied
high (i.e. connected to Vdd_IO).

Table 14. Serial interface pin description

Pin name Pin description

SPI enable
I²C/SPI mode selection
CS
(1: SPI idle mode / I²C communication enabled;
0: SPI communication mode / I²C disabled)
SCL I²C serial clock (SCL)
SPC SPI serial port clock (SPC)
SDA I²C serial data (SDA)
SDI SPI serial data input (SDI)
SDO 3-wire interface serial data output (SDO)
SA0 I²C address selection (SA0)
SDO SPI serial data output (SDO)

6.1 I²C serial interface

The LIS2DW12 I²C is a bus slave. The I²C is employed to write data into registers whose content can also be
read back.
The relevant I²C terminology is given in the table below.

Table 15. I²C terminology

Term Description

Transmitter The device which sends data to the bus

Receiver The device which receives data from the bus
Master The device which initiates a transfer, generates clock signals and terminates a transfer
Slave The device addressed by the master

There are two signals associated with the I²C bus: the serial clock line (SCL) and the Serial DAta line (SDA). The
latter is a bidirectional line used for sending and receiving the data to/from the interface. Both the lines must be
connected to Vdd_IO through an external pull-up resistor. When the bus is free, both the lines are high.
The I²C interface is compliant with fast mode (400 kHz) I²C standards as well as with normal mode.
In order to disable the I²C block, CTRL2 (21h) (I2C_DISABLE) = 1 must be set.

DS11811 - Rev 7 page 27/65

 LIS2DW12
I²C serial interface

6.1.1 I²C operation

The transaction on the bus is started through a START (ST) signal. A START condition is defined as a high-to-low
transition on the data line while the SCL line is held high. After this has been transmitted by the master, the bus is
considered busy. The next byte of data transmitted after the start condition contains the address of the slave in
the first 7 bits and the eighth bit tells whether the master is receiving data from the slave or transmitting data to
the slave. When an address is sent, each device in the system compares the first seven bits after a start condition
with its address. If they match, the device considers itself addressed by the master.
The Slave Address (SAD) associated to the LIS2DW12 is 001100xb where the x bit is modified by the SA0/SDO
pin in order to modify the device address. If the SA0/SDO pin is connected to the supply voltage, the address is
0011001b, otherwise if the SA0/SDO pin is connected to ground, the address is 0011000b. This solution permits
to connect and address two different accelerometers to the same I²C lines.
Data transfer with acknowledge is mandatory. The transmitter must release the SDA line during the acknowledge
pulse. The receiver must then pull the data line low so that it remains stable low during the high period of the
acknowledge clock pulse. A receiver which has been addressed is obliged to generate an acknowledge after each
byte of data received.
The I²C embedded inside the LIS2DW12 behaves like a slave device and the following protocol must be adhered
to. After the start condition (ST) a slave address is sent. Once a slave acknowledge (SAK) has been returned, an
8-bit sub-address (SUB) is transmitted: the 7 LSb represents the actual register address while the CTRL2 (21h)
(IF_ADD_INC) bit defines the address increment.
The slave address is completed with a Read/Write bit. If the bit is ‘1’ (Read), a repeated START (SR) condition
must be issued after the two sub-address bytes. If the bit is ‘0’ (Write) the master will transmit to the slave with
direction unchanged. Table 16 explains how the SAD+Read/Write bit pattern is composed, listing all the possible
configurations.

Table 16. SAD+Read/Write patterns

Command SAD[6:1] SAD[0] = SA0 R/W SAD+R/W

Read 001100 0 1 00110001 (31h)

Write 001100 0 0 00110000 (30h)
Read 001100 1 1 00110011 (33h)
Write 001100 1 0 00110010 (32h)

Table 17. Transfer when master is writing one byte to slave

Master ST SAD + W SUB DATA SP

Slave SAK SAK SAK

Table 18. Transfer when master is writing multiple bytes to slave

Master ST SAD + W SUB DATA DATA SP

Slave SAK SAK SAK SAK

Table 19. Transfer when master is receiving (reading) one byte of data from slave

Master ST SAD + W SUB SR SAD + R NMAK SP

Slave SAK SAK SAK DATA

DS11811 - Rev 7 page 28/65

 LIS2DW12
SPI bus interface

Table 20. Transfer when master is receiving (reading) multiple bytes of data from slave

SAD
Master ST SUB SR SAD+R MAK MAK NMAK SP
+W

Slave SAK SAK SAK DATA DATA DATA

Data are transmitted in byte format (DATA). Each data transfer contains 8 bits. The number of bytes transferred
per transfer is unlimited. Data is transferred with the Most Significant bit (MSb) first. If a receiver can’t receive
another complete byte of data until it has performed some other function, it can hold the clock line, SCL low to
force the transmitter into a wait state. Data transfer only continues when the receiver is ready for another byte and
releases the data line. If a slave receiver doesn’t acknowledge the slave address (i.e. it is not able to receive
because it is performing some real-time function) the data line must be left high by the slave. The master can then
abort the transfer. A low-to-high transition on the SDA line while the SCL line is high is defined as a STOP
condition. Each data transfer must be terminated by the generation of a STOP (SP) condition.
In the presented communication format MAK is Master acknowledge and NMAK is No Master Acknowledge.

6.2 SPI bus interface

The LIS2DW12 SPI is a bus slave. The SPI allows writing to and reading from the registers of the device.
The serial interface interacts with the application using 4 wires: CS, SPC, SDI and SDO.

Figure 12. Read and write protocol

CS

SPC

SDI
RW DI7 DI6 DI5 DI4 DI3 DI2 DI1 DI0
AD6 AD5 AD4 AD3 AD2 AD1 AD0

SDO
DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0

CS is the serial port enable and it is controlled by the SPI master. It goes low at the start of the transmission and
goes back high at the end. SPC is the serial port clock and it is controlled by the SPI master. It is stopped high
when CS is high (no transmission). SDI and SDO are respectively the serial port data input and output. Those
lines are driven at the falling edge of SPC and should be captured at the rising edge of SPC.
Both the read register and write register commands are completed in 16 clock pulses or in multiples of 8 in case
of multiple read/write bytes. Bit duration is the time between two falling edges of SPC. The first bit (bit 0) starts at
the first falling edge of SPC after the falling edge of CS while the last bit (bit 15, bit 23, ...) starts at the last falling
edge of SPC just before the rising edge of CS.
bit 0: RW bit. When 0, the data DI(7:0) is written into the device. When 1, the data DO(7:0) from the device is
read. In latter case, the chip will drive SDO at the start of bit 8.
bit 1-7: address AD(6:0). This is the address field of the indexed register.
bit 8-15: data DI(7:0) (write mode). This is the data that is written into the device (MSb first).
bit 8-15: data DO(7:0) (read mode). This is the data that is read from the device (MSb first).
In multiple read/write commands additional blocks of 8 clock periods will be added. When the CTRL2 (21h)
(IF_ADD_INC) bit is ‘0’, the address used to read/write data remains the same for every block. When the CTRL2
(21h) (IF_ADD_INC) bit is ‘1’, the address used to read/write data is increased at every block.
The function and the behavior of SDI and SDO remain unchanged.

DS11811 - Rev 7 page 29/65

 LIS2DW12
SPI bus interface

6.2.1 SPI read

Figure 13. SPI read protocol

CS

SPC

SDI
RW
AD6 AD5 AD4 AD3 AD2 AD1 AD0

SDO
DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0

The SPI read command is performed with 16 clock pulses. A multiple byte read command is performed by adding
blocks of 8 clock pulses to the previous one.
bit 0: READ bit. The value is 1.
bit 1-7: address AD(6:0). This is the address field of the indexed register.
bit 8-15: data DO(7:0) (read mode). This is the data that will be read from the device (MSb first).
bit 16-... : data DO(...-8). Additional data in multiple byte reads.

Figure 14. Multiple byte SPI read protocol (2-byte example)

CS

SPC

SDI
RW
AD6 AD5 AD4 AD3 AD2 AD1 AD0

SDO
DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0 DO15 DO14DO13DO12 DO11DO10 DO9 DO8

DS11811 - Rev 7 page 30/65

 LIS2DW12
SPI bus interface

6.2.2 SPI write

Figure 15. SPI write protocol

CS

SPC

SDI
RW DI7 DI6 DI5 DI4 DI3 DI2 DI1 DI0
AD6 AD5 AD4 AD3 AD2 AD1 AD0

The SPI write command is performed with 16 clock pulses. A multiple byte write command is performed by adding
blocks of 8 clock pulses to the previous one.
bit 0: WRITE bit. The value is 0.
bit 1 -7: address AD(6:0). This is the address field of the indexed register.
bit 8-15: data DI(7:0) (write mode). This is the data that is written inside the device (MSb first).
bit 16-... : data DI(...-8). Additional data in multiple byte writes.

Figure 16. Multiple byte SPI write protocol (2-byte example)

CS

SPC

SDI
DI7 DI6 DI5 DI4 DI3 DI2 DI1 DI0 DI15 DI14 DI13 DI12 DI11 DI10 DI9 DI8
RW
AD6 AD5 AD4 AD3 AD2 AD1 AD0

DS11811 - Rev 7 page 31/65

 LIS2DW12
SPI bus interface

6.2.3 SPI read in 3-wire mode

3-wire mode is entered by setting the CTRL2 (21h) (SIM) bit equal to ‘1’ (SPI serial interface mode selection).

Figure 17. SPI read protocol in 3-wire mode

CS

SPC

SDI/O
RW DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0
AD6 AD5 AD4 AD3 AD2 AD1 AD0

The SPI read command is performed with 16 clock pulses:

bit 0: READ bit. The value is 1.
bit 1-7: address AD(6:0). This is the address field of the indexed register.
bit 8-15: data DO(7:0) (read mode). This is the data that is read from the device (MSb first).
A multiple read command is also available in 3-wire mode.

DS11811 - Rev 7 page 32/65

 LIS2DW12
Register mapping

7 Register mapping

The table given below provides a list of the 8-bit registers embedded in the device and the corresponding
addresses.

Table 21. Register map

Register address
Name Type(1) Default Comment
Hex Binary

OUT_T_L R 0D 00001101 00000000

Temp sensor output
OUT_T_H R 0E 00001110 00000000
WHO_AM_I R 0F 00001111 01000100 Who am I ID
RESERVED - 10-1F - RESERVED
CTRL1 R/W 20 00100000 00000000
CTRL2 R/W 21 00100001 00000100
CTRL3 R/W 22 00100010 00000000
Control registers
CTRL4_INT1_PAD_CTRL R/W 23 00100011 00000000
CTRL5_INT2_PAD_CTRL R/W 24 00100100 00000000
CTRL6 R/W 25 00100101 00000000
OUT_T R 26 00100110 00000000 Temp sensor output
STATUS R 27 00100111 00000000 Status data register
OUT_X_L R 28 00101000 00000000
OUT_X_H R 29 00101001 00000000
OUT_Y_L R 2A 00101010 00000000
Output registers
OUT_Y_H R 2B 00101011 00000000
OUT_Z_L R 2C 00101100 00000000
OUT_Z_H R 2D 00101101 00000000
FIFO_CTRL R/W 2E 00101110 00000000 FIFO control register
FIFO_SAMPLES R 2F 00101111 00000000 Unread samples stored in FIFO
TAP_THS_X R/W 30 00110000 00000000
TAP_THS_Y R/W 31 00110001 00000000 Tap thresholds
TAP_THS_Z R/W 32 00110010 00000000
INT_DUR R/W 33 00110011 00000000 Interrupt duration
Tap/double-tap selection,
WAKE_UP_THS R/W 34 00110100 00000000 inactivity enable,
wakeup threshold
WAKE_UP_DUR R/W 35 00110101 00000000 Wakeup duration
FREE_FALL R/W 36 00110110 00000000 Free-fall configuration
STATUS_DUP R 37 00110111 00000000 Status register
WAKE_UP_SRC R 38 00111000 00000000 Wakeup source
TAP_SRC R 39 00111001 00000000 Tap source
SIXD_SRC R 3A 00111010 00000000 6D source

DS11811 - Rev 7 page 33/65

 LIS2DW12
Register mapping

Register address
Name Type(1) Default Comment
Hex Binary

ALL_INT_SRC R 3B 00111011 00000000

X_OFS_USR R/W 3C 00111100 00000000
Y_OFS_USR R/W 3D 00111110 00000000
Z_OFS_USR R/W 3E 00000100 00000000
CTRL7 R/W 3F 00000100 00000000

1. R = read-only register, R/W = readable/writable register

Registers marked as Reserved must not be changed. Writing to those registers may cause permanent damage to
the device.
The content of the registers that are loaded at boot should not be changed. They contain the factory calibration
values. Their content is automatically restored when the device is powered up.

DS11811 - Rev 7 page 34/65

 LIS2DW12
Register description

8 Register description

8.1 OUT_T_L (0Dh)

Temperature output register in 12-bit resolution (r).

Table 22. OUT_T_L register

TEMP3 TEMP2 TEMP1 TEMP0 0 0 0 0

Table 23. OUT_T_L register description

The 8 least significant bits of the temperature sensor output. Sensitivity = 16 LSB/°C.
TEMP[3:0]
Together with OUT_T_H (0Eh), it forms the output value expressed as a 16-bit word in 2's complement.

8.2 OUT_T_H (0Eh)

Temperature output register in 12-bit resolution (r).

Table 24. OUT_T_H register

TEMP11 TEMP10 TEMP9 TEMP8 TEMP7 TEMP6 TEMP5 TEMP4

Table 25. OUT_T_H register description

The 8 most significant bits of the temperature sensor output. Sensitivity = 16 LSB/°C.
TEMP[11:4]
Together with OUT_T_L (0Dh), it forms the output value expressed as a 16-bit word in 2's complement

8.3 WHO_AM_I (0Fh)

Who_AM_I register (r). This register is a read-only register. Its value is fixed at 44h.

Table 26. WHO_AM_I register default values

0 1 0 0 0 1 0 0

DS11811 - Rev 7 page 35/65

 LIS2DW12
CTRL1 (20h)

8.4 CTRL1 (20h)

Control register 1 (r/w)

Table 27. Control register 1

ODR3 ODR2 ODR1 ODR0 MODE1 MODE0 LP_MODE1 LP_MODE0

Table 28. Control register 1 description

ODR[3:0] Output data rate and mode selection (see Table 29. Data rate configuration)

MODE[1:0] Mode selection (see Table 30. Mode selection)

LP_MODE[1:0] Low-power mode selection (see Table 31. Low-power mode selection)

ODR[3:0] is used to set the power mode and ODR selection. The following table lists the bit settings for power-
down mode and each available frequency.

Table 29. Data rate configuration

ODR[3:0] Power mode / data rate configuration

0000 Power-down

0001 High-Performance / Low-Power mode 12.5/1.6 Hz

0010 High-Performance / Low-Power mode 12.5 Hz

0011 High-Performance / Low-Power mode 25 Hz

0100 High-Performance / Low-Power mode 50 Hz

0101 High-Performance / Low-Power mode 100 Hz

0110 High-Performance / Low-Power mode 200 Hz

0111 High-Performance / Low-Power mode 400/200 Hz

1000 High-Performance / Low-Power mode 800/200 Hz

1001 High-Performance / Low-Power mode 1600/200 Hz

Table 30. Mode selection

MODE[1:0] Mode and resolution

00 Low-Power Mode (12/14-bit resolution)

01 High-Performance Mode (14-bit resolution)

10 Single data conversion on demand mode (12/14-bit resolution)

11 -

Table 31. Low-power mode selection

LP_MODE[1:0] Power mode and resolution

00 Low-Power Mode 1 (12-bit resolution)

01 Low-Power Mode 2 (14-bit resolution)

10 Low-Power Mode 3 (14-bit resolution)

11 Low-Power Mode 4 (14-bit resolution)

DS11811 - Rev 7 page 36/65

 LIS2DW12
CTRL2 (21h)

8.5 CTRL2 (21h)

Control register 2 (r/w)

Table 32. Control register 2

SOFT_ CS_PU_ I2C_

BOOT 0(1) BDU IF_ADD_ INC SIM
RESET DISC DISABLE

1. This bit must be set to ‘0’ for the correct operation of the device.

Boot enables retrieving the correct trimming parameters from nonvolatile memory into registers where
trimming parameters are stored.
BOOT
Once the operation is over, this bit automatically returns to 0.
Default value: 0 (0: disabled; 1: enabled)
Soft reset acts as reset for all control registers, then goes to 0.
SOFT_RESET
Default value: 0 (0: disabled; 1: enabled)
Disconnect CS pull-up. Default value: 0
CS_PU_DISC (0: pull-up connected to CS pin;
1: pull-up disconnected to CS pin)
Block data update. Default value: 0
BDU
(0: continuous update; 1: output registers not updated until MSB and LSB read)
Register address automatically incremented during multiple byte access with a serial interface (I²C or SPI).
IF_ADD_INC
Default value: 1 (0: disabled; 1: enabled)
Disable I²C communication protocol. Default value: 0
I2C_DISABLE
(0: SPI and I²C interfaces enabled; 1: I²C mode disabled)
SPI serial interface mode selection. Default value: 0
SIM
0: 4-wire interface; 1: 3-wire interface

The BDU bit is used to inhibit the update of the output registers until both upper and lower register parts are read.
In default mode (BDU = ‘0’) the output register values are updated continuously. When the BDU is activated
(BDU = ‘1’), the content of the output registers is not updated until both MSB and LSB are read which avoids
reading values related to different sample times.

DS11811 - Rev 7 page 37/65

 LIS2DW12
CTRL3 (22h)

8.6 CTRL3 (22h)

Control register 3 (r/w)

Table 33. Control register 3

SLP_ SLP_
ST2 ST1 PP_OD LIR H_LACTIVE 0
MODE_SEL MODE_1

Table 34. Control register 3 description

Self-test enable. Default value: 00

ST[2:1]
(00: Self-test disabled; Other: see Table 35. Self-test mode selection)
Push-pull/open-drain selection on interrupt pad. Default value: 0
PP_OD
(0: push-pull; 1: open-drain)
Latched Interrupt. Switches between latched ('1'-logic) and pulsed ('0'-logic) mode for function source signals
LIR and interrupts routed to pins (wakeup, single/double-tap). Default value: 0
(0: interrupt request not latched; 1: interrupt request latched)
Interrupt active high, low. Default value: 0
H_LACTIVE
(0: active high; 1: active low)
Single data conversion on demand mode selection:
SLP_
0: enabled with external trigger on INT2;
MODE_SEL
1: enabled by I²C/SPI writing SLP_MODE_1 to 1.

SLP_ Single data conversion on demand mode enable. When SLP_MODE_SEL = '1' and this bit is set to '1' logic,
single data conversion on demand mode starts. When XL data are available in the registers, this bit is set to '0'
MODE_1 automatically and the device is ready for another triggered session.

Table 35. Self-test mode selection

ST2 ST1 Self-test mode

0 0 Normal mode
0 1 Positive sign self-test
1 0 Negative sign self-test
1 1 -

DS11811 - Rev 7 page 38/65

 LIS2DW12
CTRL4_INT1_PAD_CTRL (23h)

8.7 CTRL4_INT1_PAD_CTRL (23h)

Control register 4 (r/w)

Table 36. Control register 4

INT1_ INT1_ INT1_ INT1_

INT1_6D INT1_WU INT1_FF INT1_TAP
SINGLE_TAP DIFF5 FTH DRDY

Table 37. Control register 4 description

6D recognition is routed to INT1 pad. Default: 0

INT1_6D
(0: disabled; 1: enabled)
Single-tap recognition is routed to INT1 pad. Default value: 0
INT1_SINGLE_TAP
(0: disabled; 1: enabled)
Wakeup recognition is routed to INT1 pad. Default value: 0
INT1_WU
(0: disabled; 1: enabled)
Free-fall recognition is routed to INT1 pad. Default value: 0
INT1_FF
(0: disabled; 1: enabled)
Double-tap recognition is routed to INT1 pad. Default value: 0
INT1_TAP
(0: disabled; 1: enabled)
FIFO full recognition is routed to INT1 pad. Default value: 0
INT1_DIFF5
(0: disabled; 1: enabled)
FIFO threshold interrupt is routed to INT1 pad. Default value: 0
INT1_FTH
(0: disabled; 1: enabled)
Data-Ready is routed to INT1 pad. Default value: 0
INT1_DRDY
(0: disabled; 1: enabled)

DS11811 - Rev 7 page 39/65

 LIS2DW12
CTRL5_INT2_PAD_CTRL (24h)

8.8 CTRL5_INT2_PAD_CTRL (24h)

Control register 5 (r/w)

Table 38. Control register 5

INT2_ INT2_ INT2_ INT2_ INT2_ INT2_ INT2_ INT2_

SLEEP_STATE SLEEP_CHG BOOT DRDY_T OVR DIFF5 FTH DRDY

Table 39. Control register 5 description

Enable routing of SLEEP_STATE on INT2 pad. Default value: 0

INT2_SLEEP_STATE
(0: disabled; 1: enabled)
Sleep change status routed to INT2 pad. Default value: 0
INT2_SLEEP_CHG
(0: disabled; 1: enabled)
Boot state routed to INT2 pad. Default value: 0
INT2 _BOOT
(0: disabled; 1: enabled)
Temperature data-ready is routed to INT2. Default value: 0
INT2_DRDY_T
(0: disabled; 1: enabled)
FIFO overrun interrupt is routed to INT2 pad. Default value: 0
INT2 _OVR
(0: disabled; 1: enabled)
FIFO full recognition is routed to INT2 pad. Default value: 0
INT2_DIFF5
(0: disabled; 1: enabled)
FIFO threshold interrupt is routed to INT2 pad. Default value: 0
INT2 _FTH
(0: disabled; 1: enabled)
Data-ready is routed to INT2 pad. Default value: 0
INT2 _DRDY
(0: disabled; 1: enabled)

DS11811 - Rev 7 page 40/65

 LIS2DW12
CTRL6 (25h)

8.9 CTRL6 (25h)

Control register 6 (r/w)

Table 40. Control register 6

LOW_
BW_FILT1 BW_FILT0 FS1 FS0 FDS 0 0
NOISE

BW_FILT[1:0] Bandwidth selection (see Table 41. Digital filtering cutoff selection)
FS[1:0] Full-scale selection (see Table 42. Full-scale selection)
Filtered data type selection. Default value: 0
FDS (0: low-pass filter path selected;
1: high-pass filter path selected)
Low-noise configuration.
LOW_NOISE
(0: disabled; 1: enabled)

Table 41. Digital filtering cutoff selection

BW_FILT[1:0] Bandwidth selection

00 ODR/2 (up to ODR = 800 Hz, 400 Hz when ODR = 1600 Hz)
01 ODR/4 (HP/LP)
10 ODR/10 (HP/LP)
11 ODR/20 (HP/LP)

Table 42. Full-scale selection

FS[1:0] Full-scale selection

00 ±2 g
01 ±4 g
10 ±8 g
11 ±16 g

DS11811 - Rev 7 page 41/65

 LIS2DW12
OUT_T (26h)

8.10 OUT_T (26h)

Temperature output register in 8-bit resolution (r)

Table 43. OUT_T register

TEMP7 TEMP6 TEMP5 TEMP4 TEMP3 TEMP2 TEMP1 TEMP0

Table 44. OUT_T register description

Temperature sensor output data.

TEMP[7:0] The value is expressed as two’s complement sign. Sensitivity = 1°C/LSB
0 LSB represents T=25 °C ambient.

8.11 STATUS (27h)

Status register (r).

Table 45. STATUS register

SLEEP_ DOUBLE_ SINGLE_

FIFO_THS WU_IA 6D_IA FF_IA DRDY
STATE TAP TAP

Table 46. STATUS register description

FIFO threshold status flag.

FIFO_THS
(0: FIFO filling is lower than threshold level; 1: FIFO filling is equal to or higher than the threshold level.)
Wakeup event detection status.
WU_IA
(0: Wakeup event not detected; 1: Wakeup event detected)
SLEEP_ Sleep event status.
STATE (0: Sleep event not detected; 1: Sleep event detected)
DOUBLE_ Double-tap event status
TAP (0: Double-tap event not detected; 1: Double-tap event detected)
SINGLE_ Single-tap event status
TAP (0: Single-tap event not detected; 1: Single-tap event detected)
Source of change in position portrait/landscape/face-up/face-down.
6D_IA
(0: no event detected; 1: a change in position detected)
Free-fall event detection status.
FF_IA
(0: free-fall event not detected; 1: free-fall event detected)
Data-ready status.
DRDY
(0: not ready; 1: X-, Y- and Z-axis new data available)

DS11811 - Rev 7 page 42/65

 LIS2DW12
OUT_X_L (28h)

8.12 OUT_X_L (28h)

X-axis LSB output register (r).

Table 47. OUT_X_L register

X_L7 X_L6 X_L5 X_L4 X_L3(1) X_L2(1) 0 0

1. If Low-Power Mode 1 is enabled, this bit is set to 0.

The 8 least significant bits of linear acceleration sensor X-axis output. Together with the OUT_X_H (29h) register,
it forms the output value expressed as a 16-bit word in 2's complement.

8.13 OUT_X_H (29h)

X-axis MSB output register (r).

Table 48. OUT_X_H register

X_H7 X_H6 X_H5 X_H4 X_H3 X_H2 X_H1 X_H0

The 8 most significant bits of linear acceleration sensor X-axis output. Together with the OUT_X_L (28h) register,
it forms the output value expressed as a 16-bit word in 2's complement.

8.14 OUT_Y_L (2Ah)

Y-axis LSB output register (r).

Table 49. OUT_Y_L register

Y_L7 Y_L6 Y_L5 Y_L4 Y_L3(1) Y_L2(1) 0 0

1. If Low-Power Mode 1 is enabled, this bit is set to 0.

The 8 least significant bits of linear acceleration sensor Y-axis output. Together with the OUT_Y_H (2Bh) register,
it forms the output value expressed as a 16-bit word in 2's complement.

8.15 OUT_Y_H (2Bh)

Y-axis MSB output register (r).

Table 50. OUT_Y_H register

Y_H7 Y_H6 Y_H5 Y_H4 Y_H3 Y_H2 Y_H1 Y_H0

The 8 most significant bits of linear acceleration sensor Y-axis output. Together with the OUT_Y_L (2Ah) register,
it forms the output value expressed as a 16-bit word in 2's complement.

DS11811 - Rev 7 page 43/65

 LIS2DW12
OUT_Z_L (2Ch)

8.16 OUT_Z_L (2Ch)

Z-axis LSB output register (r).

Table 51. OUT_Z_L register

Z_L7 Z_L6 Z_L5 Z_L4 Z_L3(1) Z_L2(1) 0 0

1. If Low-power Mode 1 is enabled, this bit is set to 0.

The 8 least significant bits of linear acceleration sensor Z-axis output. Together with the OUT_Z_H (2Dh) register,
it forms the output value expressed as a 16-bit word in 2's complement.

8.17 OUT_Z_H (2Dh)

Z-axis MSB output register (r).

Table 52. OUT_Z_H register

Z_H7 Z_H6 Z_H5 Z_H4 Z_H3 Z_H2 Z_H1 Z_H0

The 8 most significant bits of linear acceleration sensor Z-axis output. Together with the OUT_Z_L (2Ch) register,
it forms the output value expressed as a 16-bit word in 2's complement.

8.18 FIFO_CTRL (2Eh)

FIFO control register (r/w).

Table 53. FIFO_CTRL register

FMode2 FMode1 FMode0 FTH4 FTH3 FTH2 FTH1 FTH0

Table 54. FIFO_CTRL register description

FMode[2:0] FIFO mode selection bits. Default: 000. For further details refer to Table 55. FIFO mode selection
FTH[4:0] FIFO threshold level setting.

Table 55. FIFO mode selection

FMode[2:0] Mode description

000 Bypass mode: FIFO turned off

001 FIFO mode: Stops collecting data when FIFO is full.
010 Reserved
011 Continuous-to-FIFO: Stream mode until trigger is deasserted, then FIFO mode
100 Bypass-to-Continuous: Bypass mode until trigger is deasserted, then FIFO mode
101 Reserved
110 Continuous mode: If the FIFO is full, the new sample overwrites the older sample.
111 Reserved

DS11811 - Rev 7 page 44/65

 LIS2DW12
FIFO_SAMPLES (2Fh)

8.19 FIFO_SAMPLES (2Fh)

FIFO_SAMPLES control register (r).

Table 56. FIFO_SAMPLES register

FIFO_ FIFO_
Diff5 Diff4 Diff3 Diff2 Diff1 Diff0
FTH OVR

Table 57. FIFO_SAMPLES register desription

FIFO threshold status flag.

FIFO_FTH (0: FIFO filling is lower than threshold level;
1: FIFO filling is equal to or higher than the threshold level.)
FIFO overrun status.
FIFO_OVR (0: FIFO is not completely filled;
1: FIFO is completely filled and at least one sample has been overwritten)
Represents the number of unread samples stored in FIFO.
Diff[5:0]
(000000 = FIFO empty; 100000 = FIFO full, 32 unread samples).

8.20 TAP_THS_X (30h)

4D configuration enable and TAP threshold configuration (r/w).

Table 58. TAP_THS_X register

TAP_ TAP_ TAP_ TAP_ TAP_

4D_EN 6D_THS1 6D_THS0
THSX_4 THSX_3 THSX_2 THSX_1 THSX_0

Table 59. TAP_THS_X register description

4D detection portrait/landscape position enable.

4D_EN (0: no position detected;
1: portrait/landscape detection and face-up/face-down position enabled).
6D_THS[1:0] Thresholds for 4D/6D function @ FS = ±2 g (refer to Table 60. 4D/6D threshold setting FS @ ±2 g)
TAP_THSX_[4:0] Threshold for TAP recognition @ FS = ±2 g on X direction

Table 60. 4D/6D threshold setting FS @ ±2 g

6D_THS[1:0] Threshold decoding (degrees)

00 6 (80 degrees)
01 11 (70 degrees)
10 16 (60 degrees)
11 21 (50 degrees)

DS11811 - Rev 7 page 45/65

 LIS2DW12
TAP_THS_Y (31h)

8.21 TAP_THS_Y (31h)

Table 61. TAP_THS_Y register

TAP_ TAP_ TAP_ TAP_ TAP_ TAP_ TAP_ TAP_

PRIOR_2 PRIOR_1 PRIOR_0 THSY_4 THSY_3 THSY_2 THSY_1 THSY_0

Table 62. TAP_THS_Y register description

TAP_PRIOR_[2:0] Selection of priority axis for tap detection (see Table 63. Selection of axis priority for tap detection).
TAP_THSY_[4:0] Threshold for tap recognition @ FS = ±2 g on Y direction.

Table 63. Selection of axis priority for tap detection

TAP_PRIOR_[2:0] Max priority Mid priority Min priority

000 X Y Z
001 Y X Z
010 X Z Y
011 Z Y X
100 X Y Z
101 Y Z X
110 Z X Y
111 Z Y X

8.22 TAP_THS_Z (32h)

Table 64. TAP_THS_Z register

TAP_X_ TAP_Y_ TAP_Z_ TAP_ TAP_ TAP_ TAP_ TAP_

EN EN EN THSZ_4 THSZ_3 THSZ_2 THSZ_1 THSZ_0

Table 65. TAP_THS_Z register description

Enables X direction in tap recognition.

TAP_X_EN
(0: disabled; 1: enabled)
Enables Y direction in tap recognition.
TAP_Y_EN
(0: disabled; 1: enabled)
Enables Z direction in tap recognition.
TAP_Z_EN
(0: disabled; 1: enabled)
TAP_THSZ_[4:0] Threshold for tap recognition @ FS = ±2 g on Z direction.

DS11811 - Rev 7 page 46/65

 LIS2DW12
INT_DUR (33h)

8.23 INT_DUR (33h)

Interrupt duration register (r/w).

Table 66. INT_DUR register

LATENCY3 LATENCY2 LATENCY1 LATENCY0 QUIET1 QUIET0 SHOCK1 SHOCK0

Table 67. INT_DUR register description

Duration of maximum time gap for double-tap recognition. When double-tap recognition is enabled, this
register expresses the maximum time between two successive detected taps to determine a double-tap event.
LATENCY[3:0]
Default value is LATENCY[3:0] = 0000 (which is 16 * 1/ODR)
1 LSB = 32 * 1/ODR
Expected quiet time after a tap detection: this register represents the time after the first detected tap in which
there must not be any overthreshold event.
QUIET[1:0]
Default value is QUIET[1:0] = 00 (which is 2 * 1/ODR)
1 LSB = 4 * 1/ODR
Maximum duration of over-threshold event: this register represents the maximum time of an over-threshold
signal detection to be recognized as a tap event.
SHOCK[1:0]
Default value is SHOCK[1:0] = 00 (which is 4 * 1/ODR)
1 LSB = 8 *1/ODR

8.24 WAKE_UP_THS (34h)

Wakeup threshold register (r/w).

Table 68. WAKE_UP_THS register

SINGLE_
DOUBLE_ SLEEP_ ON WK_THS5 WK_THS4 WK_THS3 WK_THS 2 WK_THS 1 WK_THS 0
TAP

Table 69. WAKE_UP_THS register description

Enable single/double-tap event. Default value: 0

SINGLE_DOUBLE_ TAP
(0: only single-tap event is enabled; 1: single and double-tap events are enabled)
Sleep (inactivity) enable. Default value: 0
SLEEP_ON
(0: sleep disabled; 1: sleep enabled)
WK_THS[5:0] Wakeup threshold, 6-bit unsigned 1 LSB = 1/64 of FS. Default value: 000000

DS11811 - Rev 7 page 47/65

 LIS2DW12
WAKE_UP_DUR (35h)

8.25 WAKE_UP_DUR (35h)

Wakeup and sleep duration configuration register (r/w).

Table 70. WAKE_UP_DUR register

WAKE_ WAKE_
FF_DUR5 STATIONARY SLEEP_ DUR3 SLEEP_ DUR2 SLEEP_ DUR1 SLEEP_ DUR0
DUR1 DUR0

Table 71. WAKE_UP_DUR register description

Free-fall duration. In conjunction with FF_DUR [4:0] bit in FREE_FALL (36h) register.
FF_DUR5
1 LSB = 1 * 1/ODR

WAKE_DUR[1:0] Wakeup duration. 1 LSB = 1 *1/ODR

Enable stationary detection / motion detection with no automatic ODR change when detecting stationary state.
STATIONARY Default value: 0
(0: disabled; 1: enabled)

Duration to go in sleep mode.

SLEEP_ DUR[3:0] Default value is SLEEP_ DUR[3:0] = 0000 (which is 16 * 1/ODR).
1 LSB = 512 * 1/ODR

8.26 FREE_FALL (36h)

Free-fall duration and threshold configuration register (r/w).

Table 72. FREE_FALL register

FF_DUR4 FF_DUR3 FF_DUR2 FF_DUR1 FF_DUR0 FF_THS2 FF_THS1 FF_THS0

Table 73. FREE_FALL register description

Free-fall duration. In conjunction with FF_DUR5 bit in WAKE_UP_DUR (35h) register.

FF_DUR [4:0]
1 LSB = 1 * 1/ODR

FF_THS [2:0] Free-fall threshold @ FS = ±2 g (refer to Table 74. FREE_FALL threshold decoding @ ± 2 g FS)

Table 74. FREE_FALL threshold decoding @ ± 2 g FS

FF_THS[2:0] Threshold decoding (LSB)

000 5

001 7

010 8

011 10

100 11

101 13

110 15

111 16

DS11811 - Rev 7 page 48/65

 LIS2DW12
STATUS_DUP (37h)

8.27 STATUS_DUP (37h)

Event detection status register (r).

Table 75. STATUS_DUP register

SLEEP_ DOUBLE_ SINGLE_

OVR DRDY_T 6D_IA FF_IA DRDY
STATE_IA TAP TAP

Table 76. STATUS_DUP register description

FIFO overrun status flag.

OVR (0: FIFO is not completely filled;
1: FIFO is completely filled and at least one sample has been overwritten)
Temperature status.
DRDY_T
(0: data not available; 1: a new set of data is available)
Sleep event status.
SLEEP_ STATE_IA
(0: Sleep event not detected; 1: Sleep event detected)
Double-tap event status:
DOUBLE_ TAP
(0: Double-tap event not detected; 1: Double-tap event detected)
Single-tap event status:
SINGLE_ TAP
(0: Single-tap event not detected; 1: Single-tap event detected)
Source of change in position portrait/landscape/face-up/face-down.
6D_IA
(0: no event detected; 1: a change in position is detected)
Free-fall event detection status.
FF_IA
(0: free-fall event not detected; 1: free-fall event detected)
Data-ready status.
DRDY
(0: not ready; 1: X-, Y- and Z-axis new data available)

DS11811 - Rev 7 page 49/65

 LIS2DW12
WAKE_UP_SRC (38h)

8.28 WAKE_UP_SRC (38h)

Wakeup source register (r).

Table 77. WAKE_UP_SRC register

SLEEP_
0 0 FF_IA WU_IA X_WU Y_WU Z_WU
STATE IA

Table 78. WAKE_UP_SRC register description

Free-fall event detection status.

FF_IA
(0: FF event not detected; 1: FF event detected)
Sleep event status.
SLEEP_ STATE IA
(0: Sleep event not detected; 1: Sleep event detected)
Wakeup event detection status.
WU_IA
(0: Wakeup event not detected; 1: Wakeup event is detected)
Wakeup event detection status on X-axis.
X_WU
(0: Wakeup event on X not detected; 1: Wakeup event on X-axis is detected)
Wakeup event detection status on Y-axis.
Y_WU
(0: Wakeup event on Y not detected; 1: Wakeup event on Y-axis is detected)
Wakeup event detection status on Z-axis.
Z_WU
(0: Wakeup event on Z not detected; 1: Wakeup event on Z-axis is detected)

DS11811 - Rev 7 page 50/65

 LIS2DW12
TAP_SRC (39h)

8.29 TAP_SRC (39h)

Tap source register (r).

Table 79. TAP_SRC register

SINGLE_ DOUBLE_
0 TAP_IA TAP_SIGN X_TAP Y_TAP Z_TAP
TAP TAP

Table 80. TAP_SRC register description

Tap event status.

TAP_IA
(0: tap event not detected; 1: tap event detected)
Single-tap event status.
SINGLE_TAP
(0: single-tap event not detected; 1: single-tap event detected)
Double-tap event status.
DOUBLE_TAP
(0: double-tap event not detected; 1: double-tap event detected)
Sign of acceleration detected by tap event.
TAP_SIGN
(0: positive sign of acceleration detected; 1: negative sign of acceleration detected)
Tap event detection status on X-axis.
X_TAP
(0: Tap event on X not detected; 1: Tap event on X-axis is detected)
Tap event detection status on Y-axis.
Y_TAP
(0: Tap event on Y not detected; 1: Tap event on Y-axis is detected)
Tap event detection status on Z-axis.
Z_TAP
(0: Tap event on Z not detected; 1: Tap event on Z-axis is detected)

DS11811 - Rev 7 page 51/65

 LIS2DW12
SIXD_SRC (3Ah)

8.30 SIXD_SRC (3Ah)

6D source register (r).

Table 81. SIXD_SRC register

0 6D_IA ZH ZL YH YL XH XL

Table 82. SIXD_SRC register description

Source of change in position portrait/landscape/face-up/face-down.

6D_IA
(0: no event detected; 1: a change in position is detected)
ZH over threshold.
ZH
(0: ZH does not exceed the threshold; 1: ZH is over the threshold)
ZL over threshold.
ZL
(0: ZL does not exceed the threshold; 1: ZL is over the threshold)
YH over threshold.
YH
(0: YH does not exceed the threshold; 1: YH is over the threshold)
YL over threshold.
YL
(0: YL does not exceed the threshold; 1: YL is over the threshold)
XH over threshold.
XH
(0: XH does not exceed the threshold; 1: XH is over the threshold)
XL over threshold.
XL
(0: XL does not exceed the threshold; 1: XL is over the threshold)

DS11811 - Rev 7 page 52/65

 LIS2DW12
ALL_INT_SRC (3Bh)

8.31 ALL_INT_SRC (3Bh)

Reading this register, all related interrupt function flags routed to the INT pads are reset simultaneously.

Table 83. ALL_INT_SRC register

SLEEP_ DOUBLE_ SINGLE_

0 0 6D_IA WU_IA FF_IA
CHANGE_IA TAP TAP

Table 84. ALL_INT_SRC register description

Sleep change status.

SLEEP_CHANGE_IA
(0: Sleep change not detected; 1: Sleep change detected)
Source of change in position portrait/landscape/face-up/face-down.
6D_IA
(0: no event detected; 1: a change in position detected)
Double-tap event status.
DOUBLE_TAP
(0: double-tap event not detected; 1: double-tap event detected)
Single-tap event status.
SINGLE_TAP
(0: single-tap event not detected; 1: single-tap event detected)
Wakeup event detection status.
WU_IA
(0: wakeup event not detected; 1: wakeup event detected)
Free-fall event detection status.
FF_IA
(0: free-fall event not detected; 1: free-fall event detected)

DS11811 - Rev 7 page 53/65

 LIS2DW12
X_OFS_USR (3Ch)

8.32 X_OFS_USR (3Ch)

Table 85. X_OFS_USR register

X_OFS_ X_OFS_ X_OFS_ X_OFS_ X_OFS_ X_OFS_ X_OFS_ X_OFS_

USR_7 USR_6 USR_5 USR_4 USR_3 USR_2 USR_1 USR_0

Table 86. X_OFS_USR register description

X_OFS_USR_[7:0] Two's complement user offset value on X-axis data, used for wakeup function.

8.33 Y_OFS_USR (3Dh)

Table 87. Y_OFS_USR register

Y_OFS_ Y_OFS_ Y_OFS_ Y_OFS_ Y_OFS_ Y_OFS_ Y_OFS_ Y_OFS_

USR_7 USR_6 USR_5 USR_4 USR_3 USR_2 USR_1 USR_0

Table 88. Y_OFS_USR register description

Y_OFS_USR_[7:0] Two's complement user offset value on Y-axis data, used for wakeup function.

8.34 Z_OFS_USR (3Eh)

Table 89. Z_OFS_USR register

Z_OFS_ Z_OFS_ Z_OFS_ Z_OFS_ Z_OFS_ Z_OFS_ Z_OFS_ Z_OFS_

USR_7 USR_6 USR_5 USR_4 USR_3 USR_2 USR_1 USR_0

Table 90. Z_OFS_USR register description

Z_OFS_USR_[7:0] Two's complement user offset value on Z-axis data, used for wakeup function.

DS11811 - Rev 7 page 54/65

 LIS2DW12
CTRL7 (3Fh)

8.35 CTRL7 (3Fh)

Table 91. CTRL7 register

DRDY_ INT2_ON_ INTERRUPTS USR_OFF USR_OFF USR_ HP_REF LPASS_

PULSED INT1 _ENABLE _ON_OUT _ON_WU OFF _W _MODE ON6D

Table 92. CTRL7 register description

Switches between latched and pulsed mode for data ready interrupt.
DRDY_PULSED
(0: latched mode is used; 1: pulsed mode enabled for data-ready)
Signal routing.
INT2_ON_INT1
(1: all signals available only on INT2 are routed on INT1)
INTERRUPTS_ENABLE Enable interrupts.
Enable application of user offset value on XL output data registers.
USR_OFF_ON_OUT
FDS bit in CTRL6 (25h) must be set to '0'-logic (low-pass path selected).
USR_OFF_ON_WU Enable application of user offset value on XL data for wakeup function only.
Selects the weight of the user offset words specified by X_OFS_USR_[7:0], Y_OFS_USR_[7:0] and
USR_OFF_W Z_OFS_USR_[7:0] bits.
(0: 977 µg/LSB; 1: 15.6 mg/LSB)
High-pass filter reference mode enable.
HP_REF_MODE (0: high-pass filter reference mode disabled (default);
1: high-pass filter reference mode enabled)
(0: ODR/2 low pass filtered data sent to 6D interrupt function (default);
LPASS_ON6D
1: LPF2 output data sent to 6D interrupt function)

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Package information

9 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.

9.1 Soldering information

The LGA package is compliant with the ECOPACK®, RoHS and “Green” standard.
It is qualified for soldering heat resistance according to JEDEC J-STD-020.
Land pattern and soldering recommendations are available at www.st.com.

9.2 LGA-12 package information

Figure 18. LGA-12 2.0 x 2.0 x 0.7 mm package outline and mechanical data

Dimensions are in millimeter unless otherwise specified

General Tolerance is +/-0.15mm unless otherwise specified

OUTER DIMENSIONS

ITEM DIMENSION [mm] TOLERANCE [mm]

Length [L] 2 ±0.1
Width [W] 2 ±0.1
Height [H] 0.7 MAX /
DM00170568_2

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 LIS2DW12
LGA-12 packing information

9.3 LGA-12 packing information

Figure 19. Carrier tape information for LGA-12 package

Figure 20. LGA-12 package orientation in carrier tape

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 LIS2DW12

Revision history

Table 93. Document revision history

Date Revision Changes

10-Feb-2017 1 Initial release

Updated Applications and Figure 7: Accelerometer chain
13-Apr-2017 2 Added Section 3.2.4: Activity/Inactivity, Android stationary/motion-detection functions
Renamed registers 3Ch, 3Dh, 3Eh, 3Fh
15-Jun-2017 3 Added bullet concerning Android to Features
Document status promoted to “production data”
Updated Description
12-Sep-2017 4 Updated Section 3.2.4: Activity/Inactivity, Android stationary/motion-detection functions
Added bit 7 to CTRL5_INT2_PAD_CTRL (24h)
Added bit 4 to WAKE_UP_DUR (35h)
01-Oct-2018 5 Added product label indicating participation in ST's sustainable technology program
Updated Section 3.2.4 Activity/Inactivity, Android stationary/motion-detection functions
06-Nov-2018 6 Updated Figure 6. LIS2DW12 electrical connections (top view)
Added Section 9.3 LGA-12 packing information
03-May-2019 7 Updated Figure 19. Carrier tape information for LGA-12 package

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 LIS2DW12
Contents

Contents
1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

2 Mechanical and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2.1 Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2 Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.3 Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.4 Communication interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.4.1 SPI - serial peripheral interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

2.4.2 I²C - inter-IC control interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

2.5 Absolute maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

3 Terminology and functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

3.1 Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.1.1 Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

3.1.2 Zero-g level offset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

3.2 Functionality. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.2.1 Operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

3.2.2 Single data conversion on-demand mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

3.2.3 Self-test. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

3.2.4 Activity/Inactivity, Android stationary/motion-detection functions . . . . . . . . . . . . . . . . . . . . 17

3.2.5 High tap/double-tap user configurability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

3.2.6 Offset management. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

3.3 Sensing element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

3.4 IC interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.5 Factory calibration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.6 Temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

4 Application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19

5 Digital main blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
5.1 Block diagram of filters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

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5.2 Data stabilization time vs. ODR/device setting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

5.3 FIFO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.3.1 Bypass mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

5.3.2 FIFO mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

5.3.3 Continuous mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

5.3.4 Continuous-to-FIFO mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

5.3.5 Bypass-to-Continuous mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

6 Digital interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27

6.1 I²C serial interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
6.1.1 I²C operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

6.2 SPI bus interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

6.2.1 SPI read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

6.2.2 SPI write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

6.2.3 SPI read in 3-wire mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

7 Register mapping. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33

8 Register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
8.1 OUT_T_L (0Dh). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
8.2 OUT_T_H (0Eh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
8.3 WHO_AM_I (0Fh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
8.4 CTRL1 (20h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
8.5 CTRL2 (21h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
8.6 CTRL3 (22h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
8.7 CTRL4_INT1_PAD_CTRL (23h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
8.8 CTRL5_INT2_PAD_CTRL (24h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
8.9 CTRL6 (25h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
8.10 OUT_T (26h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
8.11 STATUS (27h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
8.12 OUT_X_L (28h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
8.13 OUT_X_H (29h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
8.14 OUT_Y_L (2Ah). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
8.15 OUT_Y_H (2Bh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

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8.16 OUT_Z_L (2Ch). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

8.17 OUT_Z_H (2Dh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
8.18 FIFO_CTRL (2Eh). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
8.19 FIFO_SAMPLES (2Fh). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
8.20 TAP_THS_X (30h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
8.21 TAP_THS_Y (31h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
8.22 TAP_THS_Z (32h). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
8.23 INT_DUR (33h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
8.24 WAKE_UP_THS (34h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
8.25 WAKE_UP_DUR (35h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
8.26 FREE_FALL (36h). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
8.27 STATUS_DUP (37h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
8.28 WAKE_UP_SRC (38h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
8.29 TAP_SRC (39h). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
8.30 SIXD_SRC (3Ah). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
8.31 ALL_INT_SRC (3Bh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
8.32 X_OFS_USR (3Ch). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
8.33 Y_OFS_USR (3Dh). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
8.34 Z_OFS_USR (3Eh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
8.35 CTRL7 (3Fh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

9 Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56

9.1 Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
9.2 LGA-12 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
9.3 LGA-12 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58

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List of tables

List of tables
Table 1. Pin description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Table 2. Internal pull-up values (typ.) for SDO/SA0 and CS pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Table 3. Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 4. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 5. Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 6. SPI slave timing values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 7. I²C slave timing values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 8. I²C high-speed mode specifications at 1 MHz and 3.4 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 9. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 10. Operating modes - low-noise setting disabled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 11. Operating modes - low-noise setting enabled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 12. Internal pin status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 13. Number of samples to be discarded . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 14. Serial interface pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Table 15. I²C terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Table 16. SAD+Read/Write patterns . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 17. Transfer when master is writing one byte to slave. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 18. Transfer when master is writing multiple bytes to slave . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 19. Transfer when master is receiving (reading) one byte of data from slave . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 20. Transfer when master is receiving (reading) multiple bytes of data from slave . . . . . . . . . . . . . . . . . . . . . . . . . 29
Table 21. Register map. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Table 22. OUT_T_L register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Table 23. OUT_T_L register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Table 24. OUT_T_H register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Table 25. OUT_T_H register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Table 26. WHO_AM_I register default values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Table 27. Control register 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Table 28. Control register 1 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Table 29. Data rate configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Table 30. Mode selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Table 31. Low-power mode selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Table 32. Control register 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Table 33. Control register 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Table 34. Control register 3 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Table 35. Self-test mode selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Table 36. Control register 4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Table 37. Control register 4 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Table 38. Control register 5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Table 39. Control register 5 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Table 40. Control register 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Table 41. Digital filtering cutoff selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Table 42. Full-scale selection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Table 43. OUT_T register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Table 44. OUT_T register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Table 45. STATUS register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Table 46. STATUS register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Table 47. OUT_X_L register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Table 48. OUT_X_H register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Table 49. OUT_Y_L register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Table 50. OUT_Y_H register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Table 51. OUT_Z_L register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Table 52. OUT_Z_H register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

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 LIS2DW12
List of tables

Table 53. FIFO_CTRL register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

Table 54. FIFO_CTRL register description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Table 55. FIFO mode selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Table 56. FIFO_SAMPLES register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Table 57. FIFO_SAMPLES register desription . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Table 58. TAP_THS_X register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Table 59. TAP_THS_X register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Table 60. 4D/6D threshold setting FS @ ±2 g . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Table 61. TAP_THS_Y register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Table 62. TAP_THS_Y register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Table 63. Selection of axis priority for tap detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Table 64. TAP_THS_Z register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Table 65. TAP_THS_Z register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Table 66. INT_DUR register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Table 67. INT_DUR register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Table 68. WAKE_UP_THS register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Table 69. WAKE_UP_THS register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Table 70. WAKE_UP_DUR register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Table 71. WAKE_UP_DUR register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Table 72. FREE_FALL register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Table 73. FREE_FALL register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Table 74. FREE_FALL threshold decoding @ ± 2 g FS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Table 75. STATUS_DUP register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Table 76. STATUS_DUP register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Table 77. WAKE_UP_SRC register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Table 78. WAKE_UP_SRC register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Table 79. TAP_SRC register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Table 80. TAP_SRC register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Table 81. SIXD_SRC register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Table 82. SIXD_SRC register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Table 83. ALL_INT_SRC register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Table 84. ALL_INT_SRC register description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Table 85. X_OFS_USR register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Table 86. X_OFS_USR register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Table 87. Y_OFS_USR register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Table 88. Y_OFS_USR register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Table 89. Z_OFS_USR register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Table 90. Z_OFS_USR register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Table 91. CTRL7 register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Table 92. CTRL7 register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Table 93. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

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 LIS2DW12
List of figures

List of figures
Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Figure 2. Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Figure 3. SPI slave timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 4. I²C slave timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 5. Single data conversion on-demand functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 6. LIS2DW12 electrical connections (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 7. Accelerometer chain . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 8. Continuous-to-FIFO mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 9. Trigger event to FIFO for Continuous-to-FIFO mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 10. Bypass-to-Continuous mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Figure 11. Trigger event to FIFO for Bypass-to-Continuous mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Figure 12. Read and write protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 13. SPI read protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 14. Multiple byte SPI read protocol (2-byte example). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 15. SPI write protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Figure 16. Multiple byte SPI write protocol (2-byte example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Figure 17. SPI read protocol in 3-wire mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Figure 18. LGA-12 2.0 x 2.0 x 0.7 mm package outline and mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Figure 19. Carrier tape information for LGA-12 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Figure 20. LGA-12 package orientation in carrier tape. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

DS11811 - Rev 7 page 64/65

 LIS2DW12

IMPORTANT NOTICE – PLEASE READ CAREFULLY

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST
products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST
products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
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Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
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DS11811 - Rev 7 page 65/65