DG211, DG212

Data Sheet June 1999 File Number 3118.2

SPST 4-Channel Analog Switches Features

The DG211 and DG212 are low cost, CMOS monolithic, • Switches ±15V Analog Signals
Quad SPST analog switches. These can be used in general
• TTL Compatibility
purpose switching applications for communications,
instrumentation, process control and computer peripheral • Logic Inputs Accept Negative Voltages
equipment. Both devices provide true bidirectional • rON (Max) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175Ω
performance in the ON condition and will block signals to
30VP-P in the OFF condition. The DG211 and DG212 differ Functional Block Diagrams
only in that the digital control logic is inverted, as shown in DG211
the truth table.
S1
Ordering Information
IN1
TEMP. PKG.
D1
PART NUMBER RANGE (oC) PACKAGE NO.
S2
DG211CJ 0 to 70 16 Ld PDIP E16.3
IN2
DG212CJ 0 to 70 16 Ld PDIP E16.3 D2

DG211CY 0 to 70 16 Ld SOIC M16.15 S3

IN3
DG212CY 0 to 70 16 Ld SOIC M16.15
D3
S4
Pinout
IN4
DG211, DG212
(PDIP, SOIC) D4
TOP VIEW

IN1 1 16 IN2 DG212

D1 2 15 D2
S1
S1 3 14 S2
IN1
V- 4 13 V+ (SUB-
-
STRATE)
GND 5 12 VL (+5V) D1
S2
S4 6 11 S3
IN2
D4 7 10 D3

8 9 IN3 D2
IN4
S3

IN3

D3
S4

IN4

D4

SWITCHES SHOWN FOR LOGIC “1” INPUT

TRUTH TABLE
LOGIC DG211 DG212
0 ON OFF
1 OFF ON
Logic “0” ≤0.8V, Logic “1” ≥ 2.4V

1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
http://www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999
 DG211, DG212

Schematic Diagram
DG211 (1/4 AS SHOWN)

TTL IN
-15V

GND

+15V

-15V
+5V
V-
VL

-15V

+15V
IN OUT

2
 DG211, DG212

Absolute Maximum Ratings Thermal Information

V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44V Thermal Resistance (Typical, Note 1) θJA (oC/W)
VIN to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V- to V+ PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
VL to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 25V SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
VS or VD to V+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 to -36V Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . .150oC
VS or VD to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 to 36V Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC
V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25V Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC
V- to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -25V (SOIC - Lead Tips Only)
Current, any Terminal Except S or D . . . . . . . . . . . . . . . . . . . . 30mA
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . . 20mA
Peak Current, S or D (Pulsed 1ms, 10% Duty Cycle Max) . . . . . 70mA

Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 70oC

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

NOTE:
1. θJA is measured with the component mounted on an evaluation PC board in free air.

Electrical Specifications V+ = +15V, V- = -15V, VL = +5V, GND, TA = 25oC

(NOTE 2) (NOTE 3)
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS

DYNAMIC CHARACTERISTICS

Turn-ON Time, tON See Figure 1 - 460 - ns

VS = 10V, RL = 1kΩ, CL = 35pF
Turn-OFF Time,

tOFF1 - 360 - ns

tOFF2 - 450 - ns

OFF Isolation, OIRR (Note 5) VIN = 5V, RL = 1kΩ, CL = 15pF, VS = 1VRMS , - 70 - dB

f = 100kHz
Crosstalk (Channel to Channel), CCRR - -90 - dB

Source OFF Capacitance, CS(OFF) VD = VS = 0V, VIN = 5V, f = 1MHz - 5 - pF

Drain OFF Capacitance, CD(OFF) - 5 - pF

Channel ON Capacitance, CD(ON) + CS(ON) - 16 - pF

DIGITAL INPUT CHARACTERISTICS

Input Current with Voltage High, IIH VIN = 2.4V -1.0 -0.0004 - µA

VIN = 15V - 0.003 1.0 µA

Input Current with Voltage Low, IIL VIN = 0V -1.0 -0.0004 - µA

ANALOG SWITCH CHARACTERISTICS

Analog Signal Range, VANALOG -15 - 15 V

Drain-Source ON Resistance, rDS(ON) VD = ±10V, VIN = 2.4V (DG212) - 150 175 Ω

IS = 1mA, VIN = 0.8V (DG211)

Source OFF Leakage Current, IS(OFF) VIN = 2.4V (DG211) VS = 14V, VD = -14V - 0.01 5.0 nA
VIN = 0.8V (DG212)
VS = -14V, VD = 14V -5.0 -0.02 - nA

Drain OFF Leakage Current, ID(OFF) VS = -14V, VD = 14V - 0.01 5.0 nA

VS = 14V, VD = -14V -5.0 -0.02 - nA

Drain ON Leakage Current, ID(ON) VIN = 0.8V (DG211) VS = VD = 14V - 0.1 5.0 nA
(Note 4) VIN = 2.4V (DG212)
VS = VD = -14V -5.0 -0.15 - nA

3
 DG211, DG212

Electrical Specifications V+ = +15V, V- = -15V, VL = +5V, GND, TA = 25oC (Continued)

(NOTE 2) (NOTE 3)
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS

POWER SUPPLY CHARACTERISTICS

Positive Supply Current, I+ VIN = 0V or 2.4V - 0.1 10 µA

Negative Supply Current, I- - 0.1 10 µA

Logic Supply Current, IL - 0.1 10 µA

NOTES:
2. The algebraic convention whereby the most negative value is a minimum, and the most positive is a maximum, is used in this data sheet.
3. For design reference only, not 100% tested.
4. ID(ON) is leakage from driver into ON switch.
VS
5. OFF Isolation = 20 log -------
- , V = Input to OFF switch, V D = output .
VD S

Test Circuits and Waveforms

Switch output waveform shown for VS = constant with logic switch on. Feedthrough via gate capacitance may result in
input waveform as shown. Note the VS may be + or - as per spikes at leading and trailing edge of output waveform.
switching time test circuit. VO is the steady state output with

5V 15V
VL V+
LOGIC† SWITCH
INPUT (IN1) INPUT SWITCH
50% S1 D1 OUTPUT
tr < 20ns VO
0V VS = 10V
tf < 20ns
RL CL
tOFF1 IN1 1kΩ
SWITCH LOGIC 35pF
V
INPUT S INPUT
90% 90%

SWITCH 10% (REPEAT TEST FOR

OUTPUT (VO) GND V- IN2 , IN3 AND IN4)
tON tOFF2 -15V
RL
VO = VS
RL + rDS(ON)
† Logic shown for DG211. Invert for DG212.
FIGURE 1. SWITCHING TIME MEASUREMENT POINTS FIGURE 2. SWITCHING TIME TEST CIRCUIT

4
 DG211, DG212

Die Characteristics
DIE DIMENSIONS: PASSIVATION:
2159µm x 2235µm Type: PSG/Nitride
PSG Thickness: 7kÅ ±1.4kÅ
METALLIZATION:
Nitride Thickness: 8kÅ ±1.2kÅ
Type: Al
Thickness: 10kÅ ±1kÅ WORST CASE CURRENT DENSITY:
9.1 x 104 A/cm2

Metallization Mask Layout

DG211, DG212

PIN 1 PIN 16
IN 1 IN 2

PIN 2 PIN 15
D1 D2

PIN 3 PIN 14
S1 S2

PIN 4 PIN 13
V- V+ (SUBSTRATE)

PIN 5 PIN 12
GND VL

PIN 11
PIN 6 S3
S4

PIN 7
D4

PIN 8 PIN 9 PIN 10

IN 4 IN 3 D3

5
 DG211, DG212

Dual-In-Line Plastic Packages (PDIP)

E16.3 (JEDEC MS-001-BB ISSUE D)
N
16 LEAD DUAL-IN-LINE PLASTIC PACKAGE
E1
INDEX INCHES MILLIMETERS
AREA 1 2 3 N/2
SYMBOL MIN MAX MIN MAX NOTES
-B-
A - 0.210 - 5.33 4
-A-
D E A1 0.015 - 0.39 - 4
BASE A2 0.115 0.195 2.93 4.95 -
PLANE A2
-C- A
B 0.014 0.022 0.356 0.558 -
SEATING
PLANE L C B1 0.045 0.070 1.15 1.77 8, 10
L
D1 A1 eA C 0.008 0.014 0.204 0.355 -
D1
B1 e D 0.735 0.775 18.66 19.68 5
eC C
B
eB D1 0.005 - 0.13 - 5
0.010 (0.25) M C A B S
E 0.300 0.325 7.62 8.25 6
NOTES:
E1 0.240 0.280 6.10 7.11 5
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control. e 0.100 BSC 2.54 BSC -
2. Dimensioning and tolerancing per ANSI Y14.5M-1982. eA 0.300 BSC 7.62 BSC 6
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of eB - 0.430 - 10.92 7
Publication No. 95.
L 0.115 0.150 2.93 3.81 4
4. Dimensions A, A1 and L are measured with the package seated in JE-
DEC seating plane gauge GS-3. N 16 16 9
5. D, D1, and E1 dimensions do not include mold flash or protrusions. Rev. 0 12/93
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and eA are measured with the leads constrained to be perpendic-
ular to datum -C- .
7. eB and eC are measured at the lead tips with the leads unconstrained.
eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).

6
 DG211, DG212

Small Outline Plastic Packages (SOIC)

N M16.15 (JEDEC MS-012-AC ISSUE C)

INDEX 16 LEAD NARROW BODY SMALL OUTLINE PLASTIC
H 0.25(0.010) M B M
AREA PACKAGE
E
INCHES MILLIMETERS
-B-
SYMBOL MIN MAX MIN MAX NOTES

1 2 3
A 0.0532 0.0688 1.35 1.75 -
L
A1 0.0040 0.0098 0.10 0.25 -
SEATING PLANE B 0.013 0.020 0.33 0.51 9
-A- C 0.0075 0.0098 0.19 0.25 -
D A h x 45o
D 0.3859 0.3937 9.80 10.00 3
-C- E 0.1497 0.1574 3.80 4.00 4
α e 0.050 BSC 1.27 BSC -
e A1
C H 0.2284 0.2440 5.80 6.20 -
B 0.10(0.004)
h 0.0099 0.0196 0.25 0.50 5
0.25(0.010) M C A M B S
L 0.016 0.050 0.40 1.27 6
N 16 16 7
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of α 0o 8o 0o 8o -
Publication Number 95. Rev. 0 12/93
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm
(0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.

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Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
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