PCB Unit 1
PCB Unit 1
PCB Unit 1
UNIT-1
Dr. J.Manjula
Associate Professor
ECE/SRMIST
Introduction
What is PCB ?
⚫ A PCB- Printed Circuit Board is a thin board made of fiberglass,
composite epoxy, or other laminate material.
⚫ Conductive pathways are etched or "printed" onto board, connecting
different components on the PCB, such as transistors, resistors, and
integrated circuits.
Advantages of PCB
The size of components assembly is reduced with a corresponding decrease in weight
Ensure high level of repeatability and offer uniformity of electrical characteristics from assembly to
assembly
The location of parts is fixed, which simplifies identification and maintenance of electronic equipment
and systems
When the completed board provides mechanical support and all necessary electrical
connections to the components, it is essentially a Printed Wiring Board or Printed Circuit
Board. The term printed became popular because the conductive areas are usually
generated by means of a printing process like screen printing or photo-engraving, which
are commonly used to print drawings or inscriptions.
2. Classification of PCB
There are two ways of classifying printed circuit boards:
❖ Based on use and application of boards
❖ Based on number of planes or layers of wiring
A) CONSUMER
Used in consumer products such as television, radio, cheap tests and
measuring instruments.
Used less expensive base material.
Allowed greater tolerance.
Less importance given to electrical properties.
2.1 Classification-based On Use
B) PROFESSIONAL
Made of better quality material.
Better electrical and environmental specifications.
Tightly controlled fabrication techniques used.
C) HIGH-RELIABILITY
Best quality electrical specification.
High quality base material.
Highly controlled fabrication techniques used.
Normally used in strategic applications.
2.2 Classification-based On No. Of Layers
A) SINGLE-SIDED PCB
▪ Wiring available on only one side of the insulating
substrate.
▪ SOLDER SIDE- Side containing circuit pattern,
COMPONENT SIDE- Other side.
▪ Simple circuitry to keep cost low.
▪ Manufactured mostly using PRINT AND ETCH or
DIE-CUT METHOD.
▪ Single-Sided PCBs are used for simple and low
cost electrical/electronic devices like calculators,
power supplies, LED Lighting boards, FM Radios,
Timing Circuits etc.
2.2 Classification-based On No. Of Layers
B) DOUBLE-SIDED PCB
▪ Wiring on both sides of insulating material.
▪ Component density and conductor lines are higher than single-sided PCB.
▪ Are of 2 types-
i. Double-sided board with Plate Through Hole (PTH)
ii. Double-sided board without Plate Through Hole (non-PTH)
Double-Sided PCB
i. DOUBLE-SIDED PTH
⚫ Circuitry on both sides of insulating surface.
⚫ Connected by metallizing wall of a hole in the
substrate that intersects the circuitry on both sides.
⚫ Popular where circuit complexity and density is
high.
ii. DOUBLE-SIDED NON-PTH
⚫ Extension of single-sided board.
⚫ Cost considerably lower due to absence of plate.
⚫ Contacts are made by soldering component leads
on both sides of the board.
⚫ No. of solder joints to be kept minimal on
component side in case of removal.
Plate Through Hole Techniques
Configuration of plated through-hole
Interconnections with (a) funnel-flanged eyelet (b) split funnel-flanged eyelet (c) fused-in-place eyelet
C) MULTILAYER PCB
⚫ Used in situations where density of
connections is too high to be handled by
2 layers.
⚫ Other reasons- accurate control of line
impedance or for earth screening.
⚫ More than 2 PCBs with a thin layer in
between called PREPEG forming a
sandwich like structure.
⚫ Some boards have as many as 50 layers.
⚫ Top layer is similar to conventional
PCBs.
⚫ Circuit is completed by interconnecting
various layers by plated through holes.
Applications Of Multilayer PCB
⚫ Consumer Electronics use multilayer PCBs for their increased
functionality and smaller size.
⚫ Computer Electronics: Everything from servers to motherboards uses
multilayer PCBs, primarily for their space-saving attributes and high
functionality. With these applications, performance is one of the most
essential characteristics of a PCB, whereas cost is relatively low on the list
of priorities.
⚫ Telecommunications: Telecommunication devices often use multilayer
PCBs in numerous general applications, such as signal transmission, GPS
and satellite applications. The reason for this lies primarily in their
durability and functionality.
⚫ Industrial: Multilayer PCBs do prove more durable than several other options
currently on the market, making them a good choice for applications where
rough handling may be a daily occurrence such as industrial controls.
⚫ Medical Devices: Multilayer PCBs are particularly favored in Medical
industry for their small size, lightweight nature and impressive functionality
compared to single-layer alternatives.
⚫ Automobile: Due to their small size and durability, multilayer PCBs are also
highly functional and relatively heat-resistant, making them a good fit for the
internal environment of an automobile.
⚫ Aerospace: Multilayer PCBs present an ideal solution in this case, with plenty
of protective layers to keep heat and outside stress from damaging the
connections, as well as the ability to be made from flexible materials.
Rigid And Flexible PCB
⚫ Rigid- made up of variety of materials.
⚫ Flexible-
substrate- polyester or polyamide.
base- very thin, 0.1mm.
laminate- copper
⚫ Rigid-Flex- Combination of rigid and flexible , volumetrically efficient,
thus gaining popularity.
9884431270
Manufacture of PCB
SINGLE SIDED BOARD
Step 1- Artwork Generation
Step 2- Panel Preparation
Step 3- Image Transfer
Step 4- Etching
Step 5- Board Drilling
Step 6- Coating
Step 7- Testing
DOUBLE SIDED PTH BOARD
Almost all the steps are similar except the following:
⚫ Panel Preparation
⚫ Hole Drilling
⚫ Electroless copper plating
⚫ Image Transfer
⚫ Tin led plating
⚫ Etching
MULTI LAYER BOARD
Steps involved :
⚫ Laminating pattern layers, pre-etched layers and undrilled copper-clad layers
together.
⚫ Bounding inner and outer layers using prepreg.
⚫ Bounding is performed in hydraulic press or autoclave.
FLEXIBLE BOARD
⚫ They are normally punched and not drilled.
⚫ In addition to the print and etch process, there is an alternative technique called
‘additive process which is used for manufacturing printed circuit boards.
⚫ In this process, there is no copper on the laminate.
⚫ The copper is deposited selectively on the base laminate wherever required, as
per the design of the circuit.
Challenges in Manufacture of PCB
⚫ The concept stage defines the requirement and specifications, and entails deciding
on the overall architecture of the design.
⚫ The capture stage defines the design intent by describing its functionality.
⚫ The layout step includes determining optimum placements for the components on
the circuit boards and routing the tracks that connect them together, besides also
accounting for the cables and/or connectors that tie multiple circuit boards
together.
PCB standards
Extensive work has been done at the international level to develop standards and
specifications connected with PC boards.
component with
surface mount axial leads
through-hole component components with radial leads
component
• Many transistor packages are used for packaging SCRs and TRIACs. Special
packages have however, been also developed.
• The most common packages are TO-49, TO-118, TO-65 and TO-200.
Digital integrated circuits
⚫ Digital integrated circuits are used extensively in all branches of
electronics from computing to industrial control, electronic instruments,
communication systems and medical equipment.
⚫ Digital circuits cover a wide range of applications, from high current
industrial motors to microprocessors.
⚫ The basic elements of all digital circuits are logic gates that perform
logical operations on their inputs.
Logic circuits
⚫ Logic circuits are decision-making
elements in electronic circuits.
⚫ They are the basic building blocks of the
circuits that control data flow and
processing of standard signals.
⚫ In most systems, which use logic, the
output function represents a voltage
level, which is high or low.
Categories of Integrated Circuits Based on
Packing Density
⚫ SSI (Small scale integration) refers to integration levels typically having about
12 equivalent gates on chip. They are available in 14 or 16 pin DIP or Flat
packs.
⚫ MSI (Medium scale integration) means integration typically between 12 and
100 equivalent gates per IC package. It is available in 24-pin DIP or Flat pack
or 28-pin ceramic chip carrier package.
⚫ LSI (Large scale integration) implies integration typically up to 1000
equivalent gates per IC package.
⚫ VLSI (Very large scale integration) means integration levels with extra high
number of gates, up to 1,00,000 gates per chip.
⚫ For example, a RAM may have more than 4000 gates in a single chip, which is
why it comes under the category of VLSI device.
Random Access Memory (RAM)
⚫ Random Access Memory (RAM) is used in a micro processing system to store variable
information.
⚫ The CPU (central processing unit) under program control can read or change the contents
of a RAM location as desired.
⚫ RAMs constitute a generic category that encompasses all memory device in which the
contents of any address can be accessed at random in essentially the same time as any
other address.
⚫ There are two types of RAMs: static and dynamic.
⚫ In the dynamic RAM, information is stored as electrical charge on the gate
capacitance of MOS transistors.
⚫ Since these capacitors are not perfect, the charge will leak away and the
information is likely to be lost with time if the charge is not periodically
refreshed.
⚫ This can be done in several ways and depends upon the type of device in use.
⚫ Static RAM does not need to be refreshed, as the memory cells are bi-stable
and similar in design to conventional flip-flops.
⚫ In general, a static RAM consumes more power than its dynamic counterpart.
⚫ However, it requires less support circuitry.
⚫ Also, there are no problems of synchronizing the memory refresh cycles with
normal CPU read and write operations.
Read Only Memory (ROM)
⚫ In a microprocessor-based system, ROMs are normally used to hold the
program of instructions and data constants such as look-up tables.
⚫ Unlike the RAM, the ROM is non-volatile, i.e. the contents of the
memory are not lost when the power supply is removed.
⚫ Data stored in these chips is either unchangeable or requires a special
operation to change.
⚫ This means that removing the power source from the chip will not cause
it to lose any data.
⚫ The following are the five basic ROM types:
⚫ ROM;
⚫ PROM;
⚫ EPROM;
⚫ EEPROM; and
⚫ Flash Memory.
Mask-programmed ROMs
⚫ They are programmed by the manufacturer to the user’s requirements.
⚫ This type of ROM is only used if a fairly large number of units are required,
because the cost of preparation of creating the bit pattern on the chip is quite
high.
⚫ The contents of these ROMs cannot be altered after manufacture. Once the
chip is made, the actual chip can cost very little money.
⚫ They use very little power, are extremely reliable and, in the case of most small
electronic devices, contain all the necessary programming to control the device.
Programmable Read Only Memory
(PROM)
⚫ This is programmed by the user. Selectively fusing (open-circuiting) the
metal or polysilicon links in each memory cell sets that cell to a fixed
state.
⚫ The process is irreversible.
⚫ In one form of PROM, the information is stored as a charge in a
MOSFET cell.
⚫ Blank PROM chips can be coded by anyone with a programmer.
⚫ The process is known as ‘burning the PROM’.
Electrically Erasable Programmable Read
Only Memories (EEPROM) or Read-Mostly
Memories
(RMM)
⚫ They are designed such that the contents of these memories can be
altered electrically.
⚫ However, this is a fairly slow process.
⚫ It often requires voltages and circuit techniques that are not commonly
found in normal logic circuitry.
Flash Memory
⚫ This is a type of EEPROM that uses in-circuit wiring to erase by
applying an electrical field to the entire chip or pre-determined
sections of it called blocks.
⚫ Flash memory works much faster than traditional EEPROM
because it writes data in chunks, usually 512 bytes in size,
instead of a byte at a time.
Microcontroller
⚫ A microcontroller is basically a single-chip microcomputer provided in a
single integrated circuit package, which contains a CPU, clock circuitry,
ROM (flash), RAM, serial port, timer/counter and I/O circuitry.
⚫ As such, unlike conventional microprocessors it does not require a host of
associated chips for its operation.
⚫ Most of the microcontrollers come in 40-pin DIP packages; the pin-out
consists essentially of up to 32 I/O lines with the remainder being used for
power, reset interrupt and timing.
⚫ The instruction set of a single chip microcomputer generally bears a close
resemblance to that of the microprocessor family to which the microcontroller
belongs.
⚫ One of the popular microcontrollers available in the CMOS technology is
89C51, which has 4K bytes of Flash programmable and erasable read-only
memory (EEPROM). Its instruction set and pin-out are compatible with
industry standard MCS-51.
⚫ Flash allows the program memory to be re-programmed in-system or by a
conventional non-volatile memory programmer.
⚫ This microcontroller is available in both DIP or QUAD package.
Transformer
⚫ A transformer is an electrical device which, by electromagnetic induction,
transforms electric energy from one circuit to another at the same frequency,
but usually at a different voltage and current value.
⚫ In electronic equipment, transformers are generally used to provide the
required ac voltage to the circuit by appropriately transforming the mains
voltage.
⚫ When a transformer transfers electric energy at a different level, it is called
either a step-up (increase in the voltage ratio) or a step-down (decrease in the
voltage) transformer.
⚫ If there is no level change, then it is said to have a 1:1 voltage ratio.
⚫ A transformer is so constructed that one winding (primary) induces voltage
into a second winding or windings (secondary).
⚫ The windings are adjacent to each other to obtain magnetic or inductive
coupling.
⚫ The input voltage is applied to the primary winding, and the output is taken
from the secondary winding.
⚫ The primary is normally shown on the left, so that the signal flows from left
to right, with the output at the right.
⚫ The transformer may have either an air or an
iron core.
⚫ The air core transformer is used for coupling
signals between stages at higher frequencies.
⚫ The power transformer is usually of iron core
and has two or more secondary windings.
⚫ These windings are intended for generation of
different voltage levels required in some
electronic circuits.
Relays
⚫ A relay is an electromechanical device.
⚫ It depends upon the energizing of a magnetic coil (solenoid) in one
circuit to control the opening or closing of contacts in a completely
different circuit.
⚫ The relay solenoid and the contacts of that relay may appear in
different locations on the diagram.
Solid State Relays
⚫ With a sealed construction and no moving parts, the solid state relays are
particularly suited to ac switching applications requiring long life and
high reliability.
⚫ The switching is silent, causes no arcing and is unaffected by vibration
and corrosive atmospheres.
⚫ The control input is optically isolated from the zero voltage switching
circuit which produces virtually no RF interference.
⚫ They are operated by a TTL open collector.
⚫ The output circuit is ‘normally open’.
⚫ These relays are available as SIL) or DIL (dual-in-line) PCB mounting
type packages.
Reed Relays