SMD LED

Product Data Sheet

LTST-C19HE1WT
Spec No.: DS22-2008-0044
Effective Date: 10/03/2013

Revision: B

LITE-ON DCC

RELEASE

BNS-OD-FC001/A4

LITE-ON Technology Corp. / Optoelectronics

No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C.
Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660
http://www.liteon.com/opto
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Features
* Meet ROHS
* Extra Thin (0.35Hmm) Full Color SMD Chip LED.
* Package in 8mm tape on 7" diameter reels.
* EIA STD package.
* I.C. compatible.
* Compatible with automatic placement equipment.
* Compatible with infrared and vapor phase reflow solder process.

Package Dimensions

Part no. Lens Source Color Pin Assignment

AlInGaP Red 1

LTST-C19HE1WT White Diffused InGaN Green 2

InGaN Blue 3

Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ± 0.10 mm (.004") unless otherwise noted.

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Absolute Maximum Ratings At Ta=25℃

LTST-C19HE1WT
Parameter Unit
Blue Green Red

Power Dissipation 80 80 75 mW

Peak Forward Current

100 100 80 mA
(1/10 Duty Cycle, 0.1ms Pulse Width)

DC forward current 20 20 30 mA

Derating Linear From 25°C 0.25 0.25 0.4 mA/°C

Reverse Voltage Note A 5 5 5 V

Operating Temperature Range -20°C to + 80°C

Storage Temperature Range -30°C to + 85°C

Infrared Soldering Condition 260°C For 5 Seconds

Note A: Reverse Voltage can’t be continued operating

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Suggestion Profile:

Suggestion IR Reflow Profile For Pb Free Process

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Electrical Optical Characteristics At Ta=25℃

LTST-C19HE1WT Test
Parameter Symbol Unit
Blue Green Red Condition

MIN. 28.0 112.0 45.0

IF = 20mA
Luminous Intensity IV TYP. - - - mcd
Note 1
MAX. 180.0 450.0 180.0

Viewing Angle 2θ1/2 TYP. 130 deg Note 2 (Fig.6)

Measurement
Peak Emission Wavelength λPeak TYP. 468 520 632 nm
@Peak (Fig.1)

IF = 20mA
Dominant Wavelength λd TYP. 470 525 624 nm
Note 3

Spectral Line Half-Width Δλ TYP. 26 35 17 nm

MIN. 2.80 2.80 1.80

Forward Voltage VF TYP. - - - V IF = 20mA
MAX. 3.90 3.90 2.40

Reverse Current IR MAX. 10 10 10 μA VR = 5V

Notes: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the
CIE eye-response curve.
2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
3. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the
single wavelength which defines the color of the device.
4. Caution in ESD:
Static Electricity and surge damages the LED. It is recommend to use a wrist band or anti-electrostatic
glove when handling the LED. All devices, equipment and machinery must be properly grounded.

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Bin Code List

Luminous Intensity Color : Blue , Unit : mcd @20mA
Bin Code Min. Max.
N 28.0 45.0
P 45.0 71.0
Q 71.0 112.0
R 112.0 180.0
Tolerance on each Intensity bin is +/-15%

Luminous Intensity Color : Green , Unit : mcd @20mA

Bin Code Min. Max.
R 112.0 180.0
S 180.0 280.0
T 280.0 450.0
Tolerance on each Intensity bin is +/-15%

Luminous Intensity Color : Red , Unit : mcd @20mA

Bin Code Min. Max.
P 45.0 71.0

Q 71.0 112.0

R 112.0 180.0
Tolerance on each Intensity bin is +/-15%

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Typical Electrical / Optical Characteristics Curves

(25℃ Ambient Temperature Unless Otherwise Noted)

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Cleaning
Do not use unspecified chemical liquid to clean LED they could harm the package.
If clean is necessary, immerse the LED in ethyl alcohol or in isopropyl alcohol at normal temperature
for less one minute.

Suggest Soldering Pad Dimensions

Package Dimensions Of Tape And Reel

Notes:
1. All dimensions are in millimeters (inches).

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Notes:
1. Empty component pockets sealed with top cover tape.
2. 7 inch reel-3000 pieces per reel.
3. Minimum packing quantity is 500 pcs for remainders.
4. The maximum number of consecutive missing lamps is two.
5. In Accordance with ANSI/EIA 481 specifications

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CAUTIONS
1. Application
The LEDs described here are intended to be used for ordinary electronic equipment (such as office
equipment, communication equipment and household applications).Consult Liteon’s Sales in advance
for information on applications in which exceptional reliability is required, particularly when the failure
or malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation,
traffic control equipment, medical and life support systems and safety devices).
2. Storage
The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity.
It is recommended that LEDs out of their original packaging are IR-reflowed within one week.
For extended storage out of their original packaging, it is recommended that the LEDs be stored in a
sealed container with appropriate desiccant, or in a desiccators with nitrogen ambient.
LEDs stored out of their original packaging for more than a week should be baked at about 60 deg C
for at least 24 hours before solder assembly.
3. Cleaning
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED if necessary.
4. Soldering
Recommended soldering conditions:
Reflow soldering Soldering iron
Pre-heat 120~150°C Temperature 300°C Max.
Pre-heat time 120 sec. Max. Soldering time 3 sec. Max.
Peak temperature 260°C Max. (one time only)
Soldering time 5 sec. Max.
5. Drive Method
An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs
connected in parallel in an application, it is recommended that a current limiting resistor be incorporated
in the drive circuit, in series with each LED as shown in Circuit A below.
Circuit model A Circuit model B
LED LED

(A) Recommended circuit.

(B) The brightness of each LED might appear different due to the differences in the I-V characteristics
of those LEDs.
6. ESD (Electrostatic Discharge)
Static Electricity or power surge will damage the LED.
Suggestions to prevent ESD damage:
 Use of a conductive wrist band or anti-electrostatic glove when handling these LEDs.
 All devices, equipment, and machinery must be properly grounded.
 Work tables, storage racks, etc. should be properly grounded.
 Use ion blower to neutralize the static charge which might have built up on surface of the LED’s
plastic lens as a result of friction between LEDs during storage and handling.

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ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low forward
voltage, or “ no lightup ” at low currents.
To verify for ESD damage, check for “ lightup ” and Vf of the suspect LEDs at low currents.
The Vf of “ good ” LEDs should be >[email protected] for InGaN product and >[email protected] for AlInGaP product.

7. Reliability Test
Classification Test Item Test Condition Reference Standard
Ta= Under Room Temperature As Per Data Sheet MIL-STD-750D:1026
Operation Life Maximum Rating MIL-STD-883D:1005
*Test Time= 1000HRS (-24HRS,+72HRS). JIS C 7021:B-1
High Temperature IR-Reflow In-Board, 2 Times MIL-STD-202F:103B
Endurance High Humidity Ta= 65±5℃,RH= 90～95% JIS C 7021:B-11
Test Storage *Test Time= 240HRS±2HRS
High Temperature Ta= 105±5℃ MIL-STD-883D:1008
Storage *Test Time= 1000HRS (-24HRS,+72HRS) JIS C 7021:B-10

Low Temperature Ta= -55±5℃

JIS C 7021:B-12
Storage *Test Time=1000HRS (-24HRS,+72H RS)

MIL-STD-202F:107D
105℃ ～ 25℃ ～ -55℃ ～ 25℃
Temperature MIL-STD-750D:1051
30mins 5mins 30mins 5mins
Cycling MIL-STD-883D:1010
10 Cycles
JIS C 7021:A-4

IR-Reflow In-Board, 2 Times MIL-STD-202F:107D

Thermal
85 ± 5℃ ～ -40℃ ± 5℃ MIL-STD-750D:1051
Shock
10mins 10mins 10 Cycles MIL-STD-883D:1011

MIL-STD-202F:210A
Solder T.sol= 260 ± 5℃
MIL-STD-750D:2031
Resistance Dwell Time= 10 ± 1secs
JIS C 7021:A-1

Ramp-up rate(183℃ to Peak) +3℃/ second max MIL-STD-750D:2031.2

Temp. maintain at 125(±25)℃ 120 seconds max J-STD-020C
Temp. maintain above 183℃ 60-150 seconds
Environmental IR-Reflow
Peak temperature range 235℃+5/-0℃
Normal Process
Test Time within 5°C of actual Peak Temperature (tp)
10-30 seconds
Ramp-down rate +6℃/second max
Ramp-up rate(217℃ to Peak) +3℃/ second max MIL-STD-750D:2031.2
Temp. maintain at 175(±25)℃ 180 seconds max J-STD-020C
Temp. maintain above 217℃ 60-150 seconds
IR-Reflow
Peak temperature range 260℃+0/-5℃
Pb Free Process
Time within 5°C of actual Peak Temperature (tp)
20-40 seconds
Ramp-down rate +6℃/second max
MIL-STD-202F:208D
T.sol= 235 ± 5℃
MIL-STD-750D:2026
Immersion time 2±0.5 sec
Solderability MIL-STD-883D:2003
Immersion rate 25±2.5 mm/sec
IEC 68 Part 2-20
Coverage ≧95% of the dipped surface
JIS C 7021:A-2

8. Others
The appearance and specifications of the product may be modified for improvement without prior notice.

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9. Suggested Checking List

Training and Certification
1. Everyone working in a static-safe area is ESD-certified?
2. Training records kept and re-certification dates monitored?
Static-Safe Workstation & Work Areas
1. Static-safe workstation or work-areas have ESD signs?
2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V?
3. All ionizer activated, positioned towards the units?
4. Each work surface mats grounding is good?
Personnel Grounding
1. Every person (including visitors) handling ESD sensitive (ESDS) items wears wrist strap, heel
strap or conductive shoes with conductive flooring?
2. If conductive footwear used, conductive flooring also present where operator stand or walk?
3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*?
4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DLs?
5. All wrist strap or heel strap checkers calibration up to date?
Note: *50V for Blue LED.
Device Handling
1. Every ESDS items identified by EIA-471 labels on item or packaging?
2. All ESDS items completely inside properly closed static-shielding containers when not at
static-safe workstation?
3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items?
4. All flexible conductive and dissipative package materials inspected before reuse or recycles?
Others
1. Audit result reported to entity ESD control coordinator?
2. Corrective action from previous audits completed?
3. Are audit records complete and on file?

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