STR2A100 SERIES APPLICATION NOTE Rev. 0.

STR2A100 Series
Application Note (Rev.0.3)

The contents in this application note are preliminary,

and are subject to changes without notice.

SANKEN ELECTRIC CO., LTD.

http://www.sanken-ele.co.jp

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 STR2A100 SERIES APPLICATION NOTE Rev. 0.3

Contents

1. General Descriptions -----------------------------------------------------------------------3

2. Features and Production lineup----------------------------------------------------------3

3. Functional Block Diagram and Terminal List ----------------------------------------4

4. Package Information -----------------------------------------------------------------------5

5. Electrical Characteristics ------------------------------------------------------------------6

6. Typical Application Circuit ---------------------------------------------------------------8

7. Functional Descriptions --------------------------------------------------------------------9

7.1 Startup Operation-------------------------------------------------------------------9
7.2 Constant Output Voltage Control --------------------------------------------- 11
7.3 Soft-Start Function---------------------------------------------------------------- 12
7.4 Automatic Standby Mode Function ------------------------------------------- 12
7.5 Random Switching Function---------------------------------------------------- 13
7.6 Latch Function --------------------------------------------------------------------- 13
7.7 Overcurrent Protection Function (OCP) ------------------------------------- 13
7.8 Overvoltage Protection Function (OVP) ------------------------------------- 14
7.9 Overload Protection Function (OLP) ----------------------------------------- 15
7.10 Thermal Shutdown Protection Function (TSD) ---------------------------- 15
8. Design Notes -------------------------------------------------------------------------------- 16

WARNING

The contents in this document are subject to changes, for improvement and other purposes, without notice.
Make sure that this is the latest version of the document before use.

The operation and circuit examples in this document are provided for reference purposes only. Sanken
assumes no liability for violation of industrial property, intellectual property, or other rights of Sanken or
third parties, that stem from these examples.

The user must take responsibility for considering and determining which objects the products in this
document are used with.

Although Sanken will continue to improve the quality and reliability of its products,
semiconductor products, by their nature, have certain fault and failure rates. The user must take
responsibility for designing and checking to secure the device and system so that a part failure may not lead
to human injury, fire, damages, or other losses.

The products in this document are intended for normal electronic devices (such as home appliances, office
equipment, communication terminals, or measurement devices).
If you are considering using Sanken’s products for a device that requires high reliability (such as transport
machines and their control units, traffic light control systems, disaster prevention, and security equipment
or any kind of safety equipment), make sure that you consult Sanken sales representative. Do not use these
products for devices that require extremely high reliability (such as aerospace instruments, nuclear power
control units, or life support systems) without Sanken’s written consent.

The products in this document are not designed to be radiation-proof.

The contents in this document must not be transcribed or copied without Sanken’s written consent.

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 STR2A100 SERIES APPLICATION NOTE Rev. 0.3

1. General Descriptions
The STR2A100 series are power ICs for switching power supplies, incorporating a power MOSFET and a
current mode PWM controller IC in one package. Including a startup circuit and a standby function in the
controller, the product achieves low power consumption, low standby power and high cost-effectiveness power
supply systems with few external components.

2. Features and Production lineup

Features and benefits include the following
• DIP8 package, connecting one side (pin5 to pin8) with a power MOSFET drain.
The distance between high voltage terminal and low voltage terminal is 0.762mm (0.3inches), and the wider
drain trace is available to enhance thermal dissipation of the IC.
• Current Mode PWM control
• Built-in Random Switching Function, reducing EMI noise, and simplifying EMI filters, by the slight random
change of PWM frequency, fOSC.
• Auto Standby Function (Input Power, PIN < 25mW at no load)
Normal load operation ----------- PWM mode
Light load operation -------------- Standby mode (Burst oscillation)
• Built-in Audible Noise Suppression Function for standby mode
• Built-in Startup Circuit, reducing power consumption in standby operation, and eliminating external
components.
• Bias Assist Function, improving startup operation, suppressing VCC voltage drop in operation, and allowing
use of smaller VCC capacitor.
Soft Start Function, reducing stress of a power MOSFET and secondary rectifiers at startup
• Built-in Leading Edge Blanking Function
• Built-in Slope Compensation Function, avoiding subharmonic oscillation.
• Two Chip Structure, with a controller and a power MOSFET guaranteed Avalanche Energy which is available
to simplify surge absorber circuits
• Protection Functions
−Overcurrent Protection Function (OCP) ------------------Pulse-by-pulse, built-in compensation circuit to
minimize OCP point variation for AC input voltage
−Overload Protection Function (OLP) ----------------------Auto restart, built-in delay timer to reduce tem-
perature rise
−Overvoltage Protection Function (OVP) -------------------Shutdown with latch mode
−Thermal Shutdown Protection Function (TSD)-----------Shutdown with latch mode

Product Lineup
fOSC MOSFET RDS(ON) ※2 POUT ※1 ※2
Part Number Status
(kHz) VDSS MIN (V) MAX 230VAC / 85VAC to 265VAC
STR2A152 3.0Ω 30W / 23W Planning
STR2A153 67 650 1.9Ω 36W / 30W Sample available
STR2A155 1.1Ω 43W / 35W Planning
※1 The open frame conditions.
The listed output power is based on the thermal ratings, and the peak output power is obtained by 120 to
140% of the value stated here. In low output voltage and narrow ON-duty cycle, the output power may be
less than the value stated here.
※2 The preliminary values on IC development

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 STR2A100 SERIES APPLICATION NOTE Rev. 0.3

3. Functional Block Diagram and Terminal List

Functional Block Diagram

2 5~8
VCC STRATUP D/ST

UVLO REG VREG OVP TSD

PWM OSC SQ
DRV
R

OCP

Drain Peak current

VCC OLP
Compensation

1
4 Feedback
LEB S/OCP
FB/OLP Control
3
Slop GND
Compensation

Terminal List Table

Number Name Functions

1 S/OCP MOSFET source / Overcurrent protection control pulse input

2 VCC Power supply input for control circuit

3 GND Ground

4 FB/OLP Constant voltage control signal input / Overload protection signal input

6
D/ST MOSFET drain / Startup current input
7

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 STR2A100 SERIES APPLICATION NOTE Rev. 0.3

4. Package Information
• DIP8 package

a
SK b
c

Material of terminal: Cu a. Type Number : 2AXXX

Treatment of terminal: solder plating b. Lot Number
Weight: Approx. 0.51g 1st letter : The last digit of year
Unit: mm 2nd letter : Month
1 to 9 for Jan. to Sept.
O for Oct.
N for Nov.
D for Dec.
3rd letter : Week
1st～10th : 1
11th～20th : 2
21st～31st : 3
c. Sanken Registration Number

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 STR2A100 SERIES APPLICATION NOTE Rev. 0.3

5. Electrical Characteristics
• The STR2A153 of STR2A100 series is used as an example.
• Certain details vary among the individual products.
• The preliminary values at IC development

5.1 Absolute Maximum Ratings Ta= 25°C, unless otherwise specified

Parameter Terminal Symbol Ratings Unit Notes
※1
Drain peak current 8−1 IDPEAK 4.4 A Single Pulse
EAS 72 mJ Single Pulse
※1
Avalanche energy 8−1 VDD=99V,
ILPEAK 2.46 A L=20mH
S/OCP terminal voltage 1−3 VOCP −2～6 V ―
Controller IC (MIC) input voltage 2−3 VCC 32 V ―
FB/OLP terminal voltage 4−3 VFB −0.3～14 V ―
FB/OLP terminal sink current 4−3 IFB 1.0 mA ―
※1
MOSFET power dissipation ※2
8−1 PD1 1.76 W ―

Controller IC (MIC) power dissipation 2−3 PD2 1.3 W ―

Recommended
internal frame
Operating ambient temperature ― TOP −20～+115 °C
temperature
TF= 115℃(Max)
Storage temperature ― Tstg −40～+125 °C ―
Channel temperature ― Tch +150 °C ―
※1 Refer to individual product datasheet for details because these values differ among the various product
types.
※2 The condition mounted on 15mm×15mm printed circuit board.
※ Current characteristics are defined based on IC as Sink:+, Source:－.

5.2 MOSFET Electrical Characteristics Ta= 25°C, unless otherwise specified

Ratings
Parameter Terminal Symbol Unit
MIN TYP MAX
※1
Drain-to-Source breakdown voltage 8−1 VDSS 650 ― ― V
Drain leakage current 8−1 IDSS ― ― 300 µA
※1
On-resistance 8−1 RDS(ON) ― ― 1.9 Ω
Switching time 8−1 tf ― ― 250 ns
※1 θch−F ― ― 20
Thermal resistance ※3
― °C/W
θch−C ― ― 30
※3 θch−F is the thermal resistance between channel and internal frame.
θch−C is the thermal resistance between channel and case. Case temperature (TC) is measured at the center
of the marking side.

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 STR2A100 SERIES APPLICATION NOTE Rev. 0.3

5.3 Electrical Characteristics Ta= 25°C, VCC= 18 V, unless otherwise specified

Ratings
Parameter Terminal Symbol Unit
MIN TYP MAX
Operation start voltage 2－3 VCC(ON) 13.8 15.3 16.8 V
※4 VCC(OFF) 7.3 8.1 8.9 V
Operation stop voltage 2－3
Circuit current in operation 2－3 ICC(ON) ― ― 2.5 mA
Minimum startup voltage 8－3 VST(ON) ― 40 ― V
Startup current 8－3 Istartup −3.9 −2.5 −1.1 mA
※4
Startup current supply threshold 2－3 VCC(BIAS) 8.5 9.5 10.5 V
Average switching frequency 8－3 fOSC(AVE) 60 67 74 kHz
Frequency modulation deviation 8－3 △f ― 5 ― kHz
Maximum on-duty cycle 8－3 DMAX 65 74 83 %
Leading edge blanking time ― tBW ― 350 ― ns
OCP compensation coefficient ― DPC ― 17 ― mV/µs
OCP compensation duty cycle limit ― DDPC ― 36 ― %
OCP threshold voltage at zero duty cycle 1－3 VOCP(L) 0.69 0.78 0.87 V
OCP threshold voltage at 36% duty cycle 1－3 VOCP(H) 0.79 0.88 0.97 V
Maximum feedback current 4－3 IFB(MAX) −280 −170 −90 µA
Minimum feedback current 4－3 IFB(MIN) −30 −15 −7 µA
Oscillation stop FB/OLP voltage 4－3 VFB(OFF) 1.05 1.15 1.25 V
OLP threshold voltage 4－3 VFB(OLP) 7.3 8.1 8.9 V
Operation current after OLP 2－3 ICC(OLP) ― 230 ― µA
OLP delay time ― tOLP 54 68 82 ms
FB/OLP terminal clamp voltage 4－3 VFB(CLAMP) 11 12.8 14 V
OVP threshold voltage 2－3 VCC(OVP) 26 29 32 V
Thermal shutdown operating temperature ― Tｊ(TSD) 135 ― ― ℃
※4 The relationship between VCC(BIAS) and VCC(OFF) consists of VCC(OFF) < VCC(BIAS).
※ Current characteristics are defined based on IC as Sink:+, Source:－.

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 STR2A100 SERIES APPLICATION NOTE Rev. 0.3

6. Typical Application Circuit

A typical application circuit is shown below. The following design features should be considered:
• D/ST terminals (pin 5 to pin8) are on one side of the IC. The PCB traces from them should be as wide as
possible, in order to enhance thermal dissipation.
• In applications having a power supply specified such that VDS voltage between D/T terminal and S/OCP
terminal has large transient surge voltages, a clamp snubber circuit of a capacitor-resistor-diode (CRD)
combination should be added between both sides of a winding P, or a damper snubber circuit of a capacitor
(C) or a resistor-capacitor (C, RC) combination should be added between D/ST terminal and S/OCP terminal.

CRD clamp snubber

T1
D2 L2 VOUT
VAC
R4 PC1
C1 C8 R1
C5 C6
P R6
D3 S R5
C7 R8

Z2
8 7 6 5 D1 R2 R7
C4 D/ST D/ST D/ST D/ST
Z1 GND
D
STR2A100 C2
S/OCP Vcc GND FB/OLP
Damper snubber
1 2 3 4

ROCP C3
PC1

C9

Figure 6 Typical application circuit example

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 STR2A100 SERIES APPLICATION NOTE Rev. 0.3

7. Functional Descriptions
The parameter values in this section are based on the STR2A153 specification, unless otherwise specified.
The polarity of current is shown as “+”for sink current and “−” for source current based on IC

7.1 Startup Operation

The startup circuit is connected to D/ST terminal.
During the startup process, the constant current, ISTARTUP= −2.5mA(TYP), VAC
charges C2 at VCC terminal in figure 7-1, and when VCC terminal voltage C1
increases to VCC(ON)= 15.3V(TYP), the control circuit starts switching P
operation. After switching operation begins, the startup circuit turns off
automatically, to zero its current consumption. 5～8
The approximate startup time, tSTART, is calculated as follows D/ST D1 R2
Vcc
2
VCC( ON )－VCC( INT ) C2 D
tSTART = C2 × ------(1)
ISTARTUP GND
3
where tSTART is in sec,
and VCC(INT) is the initial voltage on VCC terminal, in V.
STR2A100
Figure 7-1 VCC peripheral circuit
C2 value is 10 to 47µF for general power supply applications.

Figure 7-2 shows the relationship of VCC and ICC.

When VCC terminal voltage increases to VCC(ON)= 15.3V(TYP), the control circuit starts switching operation and
the circuit current, ICC, increases. In operation, when VCC terminal voltage decreases to VCC(OFF)= 8.1V(TYP), the
control circuit stops operation by UVLO (Undervoltage Lockout) circuit, and reverts to the state before startup.
The voltage from the auxiliary winding D in figure 7-1 becomes a power source to the control circuit in operation.
The auxiliary winding voltage needs to be adjusted to about 15 to 20 V, taking account of the winding turns of
the winding D so that VCC terminal voltage should become as follows within the specification of input voltage
range and the output load range of power supply.
VCC ( BIAS ) = 10.5V ( MAX ) < VCC < VCC ( ON ) = 26.0V ( MIN )
Circuit current
ICC Bias Assist period
2.5mA(MAX) VCC(ON)
15.3V(TYP)
9.5V(TYP) Target operating voltage
Startup

VCC(BIAS)
Stop

8.1V(TYP)
VCC(OFF) Startup failure event
Start of normal operation
VCC(OFF) VCC(ON) VAC ON Time
8.1V(TYP） 15.3V(TYP)
Figure 7-2 Relationship of VCC and ICC Figure 7-3 VCC behavior during startup
at startup and shutdown

Figure 7-3 shows VCC terminal voltage behavior during the startup period. After VCC terminal voltage increases
to VCC(ON) at startup, the auxiliary winding voltage on the winding D does not rise to the target operating voltage
immediately (which is set by the transformer ratio between the auxiliary winding and the secondary winding),
and may fall down. When VCC terminal voltage decreases to VCC(BIAS)= 9.5V(TYP), Bias Assist Function is
activated so that the decrease of VCC terminal voltage is suppressed by ISTARTUP provided from the startup circuit.
In addition, Bias Assist Function allows C2 value to be reduced and allows the startup time to be shorter, and this
function allows the response of overvoltage detection in VCC terminal to be faster.

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 STR2A100 SERIES APPLICATION NOTE Rev. 0.3

In actual power supply circuits, VCC voltage often fluctuates according to the output currents of power supply as
shown in figure 7-4. This happens because C2 is charged to a peak voltage on the winding D, which is caused by
the transient surge voltage coupled from the primary winding when a power MOSFET turns off.

Suppressing C2 peak charging, it is effective to add R2, of several ohms to several tenths of an ohm, in series
with D1 as shown in figure 7-5. The optimum value of R2 should be determined on actual operation with a
transformer matching the power supply application, because the variation of the auxiliary winding voltage is
determined by the transformer structure design.
The variation becomes worse on the following conditions,
• The coupling between the primary winding and the secondary winding of transformer get worse, for example,
a transformer for power supply specifications with low output voltage and/or large output current.
• The coupling between the auxiliary winding D and the stabilizing output winding (which is controlled as a
constant voltage) gets worse.

VCC Without R2
D1 R2
2
V CC D
STR2A100 C5 Addition
WithR2 GND
3
IOUT

Figure 7-4 Variation of VCC terminal voltage Figure 7-5 VCC external circuit that is not
and power supply output current susceptible to fluctuation
with / without R2 resistor in power supply output current

Figure 7-6 and figure 7-7 show alternative designs for the location of auxiliary winding D as examples of
transformer structural designs.
• Auxiliary winding D is away from the primary windings P1and P2 (sandwich structure) as shown in figure 7-6
(Transformer structure example ①).
• Auxiliary winding D is within a stabilizing winding S1 (which is controlled as a constant voltage) as shown in
figure 7-7 (Transformer structure example ②).

P1, P2: Primary winding P1, P2: Primary winding

P1, P2 are sandwich P1, P2 are sandwich
structure winding structure winding
S1: Secondary control winding S1: Secondary control winding
S2: Secondary output winding S2: Secondary output winding
D: Auxiliary winding D: Auxiliary winding

Figure 7-6 Transformer structure example ① Figure 7-7 Transformer structure example ②

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 STR2A100 SERIES APPLICATION NOTE Rev. 0.3

7.2 Constant Output Voltage Control

The constant output voltage control of the power supply uses
the current-mode control method (the peak current-mode), STR2A100
which enhances response speed and provides stable operation. S/OCP GND FB/OLP
1 3 4 PC1
When load conditions become smaller, the output voltage,
R OCP
VOUT, rises, and a feedback current from an error amplifier on
C3 IFB
the secondary side also rises. This current corresponded to the VR1
feedback current is sunk by a photo-coupler at FB/OLP
terminal as shown in figure 7-8, and thus FB/OLP terminal Figure 7-8 FB/OLP peripheral circuit
voltage decreases.
This voltage is fed to Feedback Control block in “3.
Functional Block Diagram and Terminal List” section, and Target voltage added slope
is added the slope compensation signal to create the target compensation signal
voltage, VSC, in figure 7-9. VSC is fed to the negative input
- VSC
of FB comparator.
The peak detection signal, VR1, converted from Drain
+ VR1
current, ID, with ROCP is fed to the positive input of FB S/OCP terminal voltage
comparator. (Both sides voltage of ROCP)
FB comparator
The control circuit performs to decrease the peak current of
ID so that VR1 comes close to VSC. Drain current
And this control prevents the output voltage from in- ID
creasing. Figure 7-9 Drain current, ID, and FB comparator
in steady operation
When load conditions become bigger, the control circuit per-
forms reverse operations to the former, and increases the peak
current of ID so that VR1 comes close to VSC. Target voltage
And this control prevents the output voltage from decreasing. without slope compensation

Generally, in the current-mode control method, some sub-

harmonic oscillations shown in figure 7-10 occur theoretically. ID
It is called the subharmonic phenomenon.
When the drain current waveform becomes a trapezoid in con- tON1
tON2
tinuous operating mode, the ON-duty cycle can not become
stable in each cycle, and thus subharmonic oscillations occur in Cycle Cycle Cycle
multiples of the fundamental operating frequency, according to
the initial value of drain current, even if the peak current level Figure 7-10 Drain current waveform
in subharmonic oscillation
set by the target voltage is constant.
In order to avoid this, the IC incorporates Slope Compensation Function.
Because the target voltage, VSC, in figure 7-9 is added the down-slope compensation signal, the wider the
ON-duty cycle becomes, the smaller the peak drain current becomes to suppress subharmonic oscillations..
Even if subharmonic oscillations occur when the IC has some excess supply being out of feedback control, such
as during startup and load shorted, this does not affect performance during normal operation.

In the current-mode control method, FB comparator and/or OCP comparator may respond to the surge voltage
resulting from the drain surge current in turning on a power MOSFET, and may turn off the power MOSFET
irregularly.
Leading Edge Blanking, tBW= 350ns(TYP), is built-in to prevent OCP comparator from malfunction caused by
surge voltage in turning on the power MOSFET.

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 STR2A100 SERIES APPLICATION NOTE Rev. 0.3

7.3 Soft-Start Function

Figure 7-11 shows the operation image waveform at startup.
Soft-Start Function is built-in to reduce stress of voltage and current of a power MOSFET, secondary rectifiers
and so on. The period of Soft-Start Function is fixed to 7ms internally. In this period, OCP threshold voltages
increase with five steps.
It is necessary to check or adjust the followings at startup;
• VCC terminal voltage should be more than VCC(OFF),
• The period when FB/OLP terminal voltage increases to OLP threshold voltage, VFB(OLP)= 8.1V(TYP),
should be shorter enough than OLP delay time, tOLP=68ms(TYP).

VCC terminal
voltage Startup Steady state
VCC(ON)
VCC(OFF)

Time

Drain current This ID is limited by OCP operation.

ID

Time
Soft-start period with 7ms fixed internally
Figure 7-11 Operation image waveform at startup

7.4 Automatic Standby Mode Function

Automatic Standby Mode is activated automatically when the drain current, ID, reduces in light load condition
and S/OCP terminal voltage decreases to less than 15% to 20% of the voltage of the maximum drain current (it is
overcurrent protection state). And this operation becomes the burst-oscillation as shown in figure 7-12.
The burst-oscillation reduces switching losses and improves power supply efficiency because there are interval
periods.
Generally the frequency of the burst-oscillation is set at just a few kHz, such frequencies are in the range of
human hearing, to improve the efficiency in light load condition, and thus it may cause audible noises from a
transformer.
Because the IC series limit the drain current to less than 15% to 20% during the burst-oscillation, audible noises
are well-suppressed.

Burst-oscillation
Output current
IOUT

Limit of less than 15% to 20 %

of the maximum drain current
Drain current
ID

Normal load Standby load Normal load

Figure 7-12 Automatic standby mode operation

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 STR2A100 SERIES APPLICATION NOTE Rev. 0.3

During the transition to the burst-oscillation, if VCC terminal voltage decreases to VCC(BIAS)= 9.5V(TYP), Bias
Assist Function is activated and stabilizes the standby mode operation, because ISTARTUP is provided to VCC
terminal so that VCC terminal voltage does not decrease to VCC(OFF).
However, if Bias Assist Function is always activated during standby mode, the power loss increases. Therefore
VCC terminal voltage should be more than VCC(BIAS), for example, by adjusting the turns ratio between auxiliary
winding and secondary winding and/or R2 in figure 7-5.

7.5 Random Switching Function

The IC modulates its switching frequency randomly within △f= 5kHz of Average Switching Frequency,
fOSC(AVE）= 67kHz(TYP), by superposing the modulating frequency on fOSC(AVE) in normal operation.
The conduction noise with this function is smaller than that without this function, and this function simplifies
noise filtering of the input lines of power supply.

7.6 Latch Function

The latch function stops switching operation and a protection state is latched when OVP and/or TSD protection
functions activate.
After stopping switching operation with latch mode, VCC terminal voltage drops. When VCC terminal voltage
decreases to VCC(BIAS)= 9.5V(TYP), Bias Assist Function is activated to prevent VCC terminal voltage from
reaching VCC(OFF), and then the latch function is maintained.
Releasing the latch function can be done when VCC terminal voltage reaches VCC(OFF) or less by simply turning
off the AC input.

7.7 Overcurrent Protection Function (OCP)

Overcurrent Protection Function (OCP) detects each drain peak current level of a power MOSFET on
pulse-by-pulse basis, and limits the output power. This function incorporates AC Input Compensation Function
to reduce OCP point variation for AC input voltage, without any additional external components.

This OCP function detects the drain current by a current detection resistor, ROCP, which is connected between
S/OCP terminal and GND terminal. When the voltage drop on both sides of ROCP increases to internal OCP
threshold voltage, the power MOSFET is turned off.

PWM control ICs usually have some detection delay time on

OCP detection. The steeper the slope of actual drain current in Variation resulting
high AC input voltage is, the longer the actual detection point is, from detection delay time
Output voltage, VOUT

compared with internal OCP threshold voltage. And thus the

actual OCP point limited the output current usually has some Low AC input
variation depending on AC input voltage as shown in figure 7-13.
The IC incorporates a built-in Input Compensation Function that
superposes a signal with a defined slope to the detection signal on High AC input
S/OCP terminal as shown in figure 7-14.
When AC input voltage is lower and the ON-duty cycle is wider, Output current, IOUT
the OCP compensation level increases. And thus the OCP point
in low AC input voltage increases to minimize the difference of Figure 7-13 Output current at OCP
without input compensation
OCP points between low AC input voltage and high AC input
voltage.

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 STR2A100 SERIES APPLICATION NOTE Rev. 0.3

Because the compensation signal level is designed to depend upon ON Time, OCP threshold voltage
after compensation, VOCP(ONTime), is calculated as follows.
VOCP( ONTime )( V ) = VOCP( Ｌ )( V ) + DPC( mV / µs ) × ONTime( µs ) ------(2)
where DPC is OCP compensation coefficient shown in Electrical Characteristics table.
However, in the ON Time when ON-duty cycle becomes 36% or more, OCP threshold voltage after com-
pensation remains VOCP(H)= 0.88V(TYP) constantly.
For example, when AC input voltage is 85VAC and the transformer is designed to become ON-duty cycle of
36% on maximum load condition, ON Time becomes about 5.6µs. And thus OCP threshold after compensation,
VOCP(5.6µs), becomes about 0.88V, resulting from the equation (2).

265VAC(for example) 85VAC(for example)

0.88V(TYP)

About 0.82V
After compensation
VOCP(ONTime) (V)

0.50

0
0% 15% 36% 80% 100%
ON-duty cycle

Figure 7-14 Relationship of ON-duty cycle and VOCP(ONTime)

at fOSC(AVE)= 67kHz(TYP)

7.8 Overvoltage Protection Function (OVP)

When a voltage between VCC terminal and GND terminal increases to VCC(OVP)= 29V(TYP) or more, OVP
Function is activated and stops switching operation by Latch Function.

When the auxiliary winding provides VCC terminal voltage, OVP Function is available to detect the overvoltage
of the output voltage, such as the detection circuit for output control is open in the secondary side, because VCC
terminal voltage is proportional to the output voltage.
The output voltage of the secondary side at OVP operation, VOUT(OVP), is calculated approximately as follows.
VOUT terminal voltage at normal operation
VOUT(OVP) ≒ × 29 Ｖ( TYP ) ----- (3)
VCC terminal voltage at normal operation

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 STR2A100 SERIES APPLICATION NOTE Rev. 0.3

7.9 Overload Protection Function (OLP)

When the drain peak current is limited by OCP operation, the output voltage, VOUT, decreases and the feedback
current from the secondary photo-coupler becomes zero. As a result, FB/OLP terminal voltage increases.
When FB/OLP terminal voltage increases to VFB(OLP)= 8.1V(TYP) or more and remains for OLP delay time,
tOLP= 68ms or more, OLP function is activated, stops switching operation and reduce stress of a power MOSFET,
secondary rectifiers and so on.
Each waveform on OLP Function is shown in figure 7-15.
When OLP Function is activated, Bias Assist Function is disabled and thus VCC terminal voltage decreases to
VCC(OFF)= 8.1V(TYP). After that, the IC reverts to the initial state by UVLO (Undervoltage Lockout) circuit, and
the IC starts operation when VCC terminal voltage increases to VCC(ON)= 15.3V(TYP).
And thus the intermittent operation by UVLO is repeated. This operation reduces power dissipation because the
switching period in this intermittent operation is short.
When such an abnormal condition is removed, the IC returns to normal operation automatically.

Oscillation turns off

VCC terminal voltage
V CC
STR2A100 2
VCC(OFF)= 8.1V(TYP)
Oscillation
VFB(OLP)= 8.1V(TYP) GND FB/OLP
interval period
FB/OLP terminal voltage 3 4
VFB IFB
C3 PC1
tOLP OLP delay time
Drain current
ID

Figure 7-15 Each waveform on OLP operation and FB/OLP peripheral circuit

7.10 Thermal Shutdown Protection Function (TSD)

When the temperature of the control part (MIC) of the IC increases to Tj(TSD)= 135°C(MIN) or more, Thermal
Shutdown Protection Function is activated and stops switching operation by Latch Function.

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 STR2A100 SERIES APPLICATION NOTE Rev. 0.3

8. Design Notes

8.1 Peripheral Components

Take care to use properly rating and proper type of components.
• Input and output electrolytic capacitors
Apply proper design margin to ripple current, voltage and temperature rise. Use of high ripple current and
low impedance types, designed for switch mode power supplies, is recommended.
• Transformer
Apply proper design margin to temperature rise by core loss and copper loss.
Because switching currents contain high frequency currents, the some temperature rise may result from the
skin-effect. If the influence of skin-effect can not be minimized, choose suitable wire gauge in consideration
of RMS current in the current density of about 3 to 4A/mm2.
If measures to further reduce temperature is still necessary, use paralleled wires or litz wires to increase
surface area of wires.
• Current detection resistor, ROCP
A high frequency switching current flows to ROCP, and may cause poor operation if a high inductance
resistor is used. Choose a low inductance and surge-proof type.

8.2 Phase Compensation

A typical error amplifier circuit with a shunt regulator (Z2) of secondary side is shown in figure 8-1.
C7 is recommended about 0.047 to 0.47µF, and should be adjusted on actual operation.
C3 between FB/OLP terminal and GND terminal shown in figure 8-2 is for high frequency noise reduction and
phase compensation. C3 is recommended about 470pF to 0.01µF.
C3 should be connected close to FB/OLP terminal and GND terminal, and should be adjusted on actual operation.

T1 L2 VOUT
D1 R2 T1
D2 R4 PC1 5～8 2
R6 D/ST VCC C2 D
C5 R5 C6 STR2A100
C7 R8
S S/OCP GND FB/OLP
1 3 4 PC1
Z2
R7 R OCP
C3

GND
Figure 8-1 Peripheral circuit Figure 8-2 FB/OLP peripheral circuit
around secondary shunt regulator

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 STR2A100 SERIES APPLICATION NOTE Rev. 0.3

8.3 EMI Measure of the secondary rectifier

A general EMI measure of the secondary rectifier is shown in figure 8-3.
A snubber capacitor, Cdi, in parallel to the secondary rectifier, is for noise reduction.
If ringing waveforms occur on the drain current, it is recommended to connect a damper resistor, Rdi, in series to
Cdi as shown in figure 8-4, in order to reduce ringing waveforms, and to stabilize switching operation.
It is necessary to check temperature rise of Rdi and Cdi.

Cdi Rdi Cdi

D2 D2
Drain current ID P S C5 Drain current ID P S C5

D1 R2 D1 R2

C2 D C2 D
T1 T1

Figure 8-3 Rectifier measure example Figure 8-4 Damper resistor example

8.4 PCB trace layout and Component placement

PCB circuit trace design and component layout affect proper
functioning during operation. Unless they are proper, mal-
function, large noise and large power dissipation may occur.
Circuit loop traces flowing high frequency current, as shown in
figure 8-5, should be designed as wide, short and small as
possible to reduce trace impedance.
In addition, earth ground traces affect radiation noise, and thus
it should be designed as wide and short as possible.
Switching mode power supplies consist of current traces with Figure 8-5 High frequency current
high frequency and high voltage, and thus trace design and loops (hatched areas)
component layout should be done to comply with all safety
guidelines.
Furthermore, because an integrated power MOSFET is being used as the switching device, take account of the
positive thermal coefficient of RDS(ON) for thermal design.

Figure 8-6 shows a circuit layout design example.

(1) S/OCP Trace Layout: S/OCP terminal to ROCP to C1 to T1 (winding P) to D/ST terminal
This is the main trace containing switching currents, and thus it should be as wide and short as possible.
If the trace distance between C1 and the IC is lengthy, an additional capacitor near the IC or the transformer is
recommended to reduce impedance of high frequency current loop, and is recommended either electrolytic or
film type capacitors, around 0.1µF, in the withstand voltage suitable for an applied maximum voltage.

(2) GND Trace Layout: GND terminal to C2 (negative terminal) and T1 (winding D) to R2 to D1 to C2 (positive
terminal) to VCC terminal
This trace also needs to be as wide and short as possible.
If the trace distance between C2 and the IC is lengthy, placing a capacitor around 0.1µF to 1uF (50V) with
high frequency property is recommended close to VCC terminal and GND terminal.

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 STR2A100 SERIES APPLICATION NOTE Rev. 0.3

(3) ROCP Trace Layout

ROCP should be placed as close as possible to S/OCP terminal. The connection between the power ground of
main trace and the control circuit ground should be connected by a single point (“A” mark in figure 8-6) to
remove common impedance, and to avoid interference of the control circuit resulting from switching currents.

Figure 8-6 also shows a circuit layout design example for the secondary side.
(1) Secondary Smoothing Circuit Trace Layout: T1 (winding S) to D2 to C5
This trace should be as wide and short as possible.
If the loop length is lengthy, surge voltage may increase at turning off a power MOSFET because leakage
inductance resulting from the long loop may increase.
Taking the secondary trace layout into account is available to increase the voltage strength margin of the
power MOSFET, and to reduce stress and power dissipation of the clamp snubber circuit.

T1

C8 R1 D2
P
C1 D3 C5
S
D1 R2

8 7 6 5 C2 D
C4 D/ST D/ST D/ST D/ST
Z1
STR2A100
S/OCP Vcc GND FB/OLP

1 2 3 4

C3 PC1 Main power circuit trace

ROCP
GND trace for the IC

A
C9

Figure 8-6 Peripheral circuit example around the IC

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