TLE4998C4 DataSheet v01 - 00 en

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Data Sheet, Rev 1.

0, December 2008

TLE4998C3
TLE4998C4
Programmable Linear Hall Sensor

Sensors

N e v e r s t o p t h i n k i n g .
Edition 2008-12
Published by Infineon Technologies AG,
Am Campeon 1-12,
85579 Neubiberg, Germany
© Infineon Technologies AG 2008.
All Rights Reserved.

Attention please!
The information herein is given to describe certain components and shall not be considered as a guarantee of
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding
circuits, descriptions and charts stated herein.

Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office (www.infineon.com).

Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support
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be endangered.
Revision History: 2008-12 Rev 1.0
Previous Version: Preliminary Data Sheet Rev 0.9
Page Subjects (major changes since last revision)

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Template: mc_a5_ds_tmplt.fm / 4 / 2004-09-15


1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.2 Target Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1.3 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.2 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.3 Principle of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.4 Transfer Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4 Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5 Electrical, Thermal, and Magnetic Parameters . . . . . . . . . . . . . . . . . . . 14
Calculation of the Junction Temperature . . . . . . . . . . . . . . . . . . . . . . 16
Magnetic Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
6 Signal Processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Magnetic Field Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Temperature Compensation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
6.1 Magnetic Field Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
6.2 Gain Setting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
6.3 Offset Setting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
6.4 DSP Input Low-Pass Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
6.5 Clamping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
7 Error Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
7.1 Voltages Outside the Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
7.2 EEPROM Error Correction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
8 Temperature Compensation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
8.1 Parameter Calculation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
9 Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
9.1 Calibration Data Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
9.2 Programming Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
9.3 Data Transfer Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
9.4 Programming of Sensors with Common Supply Lines . . . . . . . . . . . . . . . 30
10 Application Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
11 PG-SSO-3-10 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
12 PG-SSO-4-1 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
13 SPC Output Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Data Sheet 4 Rev 1.0, 2008-12


13.1 Basic SPC Protocol Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
13.2 Unit Time Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
13.3 Master Pulse Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
13.4 Synchronous Transmission . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
13.5 Synchronous Transmission Including Range Selection . . . . . . . . . . . . . . . 39
13.6 Synchronous Mode with ID Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
13.7 Checksum Nibble Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

Data Sheet 5 Rev 1.0, 2008-12


Programmable Linear Hall Sensor TLE4998C3

TLE4998C4
1 Overview

1.1 Features
• SPC (Short PWM Code) protocol with
enhanced interface features based on SENT (Single
Edge Nibble Transmission,defined by SAE J2716)
• 20-bit Digital Signal Processing (DSP)
• Digital temperature compensation
• 16-bit overall resolution
• Operates within automotive temperature range
• Low drift of output signal over temperature and lifetime
• Programmable parameters stored in EEPROM with
single-bit error correction:
– SPC protocol modes: synchronous transmission,
dynamic range selection, ID selection mode
– SPC unit time
– Magnetic range and sensitivity (gain), polarity of the
output slope
– Offset
– Bandwidth
– Clamping levels
– Customer temperature compensation coefficients
– Memory lock
• Re-programmable until memory lock
• Supply voltage 4.5 - 5.5 V (4.1 - 16 V in extended range)
• Operation between -200 mT and +200 mT within three ranges
• Reverse-polarity and overvoltage protection for all pins
• Output short-circuit protection
• On-board diagnostics (overvoltage, EEPROM error, start up)
• Output of internal magnetic field values and temperature
• Programming and operation of multiple sensors with common power supply
• Two-point calibration of magnetic transfer function without iteration steps
• High immunity against mechanical stress, EMC, ESD

Type Marking Ordering Code Package


TLE4998C3 4998C3 SP000476468 PG-SSO-3-10
TLE4998C4 4998C4 SP000440972 PG-SSO-4-1

Data Sheet 6 Rev 1.0, 2008-12


TLE4998C

Overview
1.2 Target Applications
• Robust replacement of potentiometers
– No mechanical abrasion
– Resistant to humidity, temperature, pollution and vibration
• Linear and angular position sensing in automotive applications such as pedal position,
suspension control, throttle position, headlight levelling, and steering torque sensing
• Sensing of high current for battery management, motor control, and electronic fuses

1.3 Pin Configuration


Figure 1 and Figure 2 show the location of the Hall element in the chip and the distance
between Hall probe and the surface of the package.

2.03 ±0.1 0.38 ±0.05

Center of
1.625 ±0.1

Hall Probe

Branded Side

Hall-Probe

1 2 3

AEP03717

Figure 1 Hall Cell Location and Pin Configuration of PG-SSO-3-10 package

Table 1 TLE4998C3 Pin Definitions and Functions


Pin No. Symbol Function
1 VDD Supply voltage / programming interface
2 GND Ground
3 OUT Output / programming interface

Data Sheet 7 Rev 1.0, 2008-12


TLE4998C

Overview

2.67
B
d
A 0.2 B
Center of
sensitive area
1.53

Branded Side

Hall-Probe
1 2 3 4
0.2 A

d : Distance chip to branded side of IC


PG-SSO-4-1: 0.3 ±0.08 mm

AEP03654

Figure 2 Hall Cell Location and Pin Configuration of PG-SSO-4-1 package

Table 2 TLE4998C4 Pin Definitions and Functions


Pin No. Symbol Function
1 TST Test pin (connection to GND is recommended)
2 VDD Supply voltage / programming interface
3 GND Ground
4 OUT Output / programming interface

Data Sheet 8 Rev 1.0, 2008-12


TLE4998C

General

2 General

2.1 Block Diagram


Figure 3 shows a simplified block diagram.

VDD

Supply *)
Bias EEPROM Interface TST

spinning A
HALL D
OUT
DSP
SPC
Temp. A
Sense D

GND
ROM
*) TLE4998 C4 only

Figure 3 Block diagramm

2.2 Functional Description


The linear Hall IC TLE4998C has been designed specifically to meet the requirements
of highly accurate angle and position detection as well as for current measurement
applications. The sensor provides a digital SPC (Short PWM Code) signal, based on the
standardized SENT (Single Edge Nibble Transmission, SAE J2716) protocol. The SPC
protocol allows transmissions initiated by the ECU. Two further operation modes are
available:
• “range selection” for dynamical switching of the measurement range during operation
• “ID selection” to build a bus system with up to 4 ICs on a single output line and a
common supply, which can be individually accessed by the ECU.
Each transmission sequence contains an adjustable number of nibbles representing the
magnetic field, the temperature value and a status information of the sensor. The
interface is further described in Chapter 13. The output stage is an open-drain driver

Data Sheet 9 Rev 1.0, 2008-12


TLE4998C

General
pulling the output pin to low only. Therefore, the high level needs to be obtained by an
external pull-up resistor. This output type has the advantage that the receiver may use
an even lower supply voltage (e.g. 3.3 V). In this case the pull-up resistor must be
connected to the given receiver supply.
The IC is produced in BiCMOS technology with high voltage capability, and it also has
reverse-polarity protection.
Digital signal processing using a 16-bit DSP architecture together with digital
temperature compensation guarantee excellent long-time stability compared to analog
compensation methods.
While the overall resolution is 16 bits, some internal stages work with resolutions up to
20 bits.

2.3 Principle of Operation


• A magnetic flux is measured by a Hall-effect cell
• The output signal from the Hall-effect cell is converted from analog to digital
• The chopped Hall-effect cell and continuous-time A/D conversion ensure a very low
and stable magnetic offset
• A programmable low-pass filter to reduce noise
• The temperature is measured and A/D converted, too
• Temperature compensation is done digitally using a second-order function
• Digital processing of output value is based on zero field and sensitivity value
• The output value range can be clamped by digital limiters
• The final output value is represented by the data nibbles of the SPC protocol

Data Sheet 10 Rev 1.0, 2008-12


TLE4998C

General
2.4 Transfer Functions
The examples in Figure 4 show how different magnetic field ranges can be mapped to
the desired output value ranges.

• Polarity Mode:

– Bipolar: Magnetic fields can be measured in both orientations. The limit points
do not necessarily have to be symmetrical around the zero field point

– Unipolar: Only north- or south-oriented magnetic fields are measured

• Inversion: The gain can be set to both positive and negative values

OUT12 / OUT12 / OUT12 /


B (mT) OUT16 B (mT) OUT16 B (mT) OUT16
4095 / 4095 / 4095 /
50 100 200
65535 65535 65535

0 0 0 0 0 0

-50 -100 -200

Example 1: Example 2: Example 3:


- Bipolar - Unipolar - Bipolar
- Big offset - Inverted (neg. gain)

Figure 4 Examples of Operation

Data Sheet 11 Rev 1.0, 2008-12


TLE4998C

Maximum Ratings

3 Maximum Ratings

Table 3 Absolute Maximum Ratings


Parameter Symbol Limit Values Unit Notes
min. max.
Storage temperature TST - 40 150 °C
1)
Junction temperature TJ - 40 170 °C
Voltage on VDD pin with VDD -18 18 V 2)

respect to ground
Supply current IDDov - 15 mA
@ overvoltage VDD max.
Reverse supply current IDDrev -1 0 mA
@ VDD min.
Voltage on output pin with VOUT -13) 184) V
respect to ground
Magnetic field BMAX - unlimited T
ESD protection VESD - 4.0 kV According HBM
JESD22-A114-B 5)
1)
For limited time of 96 h. Depends on customer temperature lifetime cycles. Please ask for support by Infineon
2)
Higher voltage stress than absolute maximum rating, e.g. 150% in latch-up tests is not applicable. In such
cases, Rseries ≥100 Ω for current limitation is required
3)
IDD can exceed 10 mA when the voltage on OUT is pulled below -1 V (-5 V at room temperature)
4)
VDD = 5 V, open drain permanent low, for max. 10 minutes
5)
100 pF and 1.5 kΩ

Note: Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in
the operational sections of this specification is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.

Data Sheet 12 Rev 1.0, 2008-12


TLE4998C

Operating Range

4 Operating Range
The following operating conditions must not be exceeded in order to ensure correct
operation of the TLE4998C. All parameters specified in the following sections refer to
these operating conditions, unless otherwise indicated.

Table 4 Operating Range


Parameter Symbol Limit Values Unit Notes
min. max.
Supply voltage VDD 4.5 5.5 V
1) 2)
4.1 16 V Extended range
Output pull-up voltage3) Vpull-up - 18 V
Load resistance3) RL 1 - kΩ
Output current3) IOUT 0 5 mA
Load capacitance3) CL 1 8 nF
Junction temperature TJ - 40 125 °C For 5000 h
1504) For 1000 h not additive

1)
For reduced output accuracy
2)
For supply voltages > 12 V, a series resistance Rseries ≥ 100 Ω is recommended
3)
Required output protocol characteristics depend on these parameters, RL must be according to max. output
current
4)
For reduced magnetic accuracy; extended limits are taken for characteristics
Note: Keeping signal levels within the limits specified in this table ensures operation
without overload conditions.

Data Sheet 13 Rev 1.0, 2008-12


TLE4998C

Electrical, Thermal, and Magnetic Parameters

5 Electrical, Thermal, and Magnetic Parameters


Table 5 Electrical Characteristics
Parameter Symbol Limit Values Unit Notes
min. typ. max.
SPC transmission time tSPC - - 1 ms Unit time 3µs1)
Supply current IDD 3 6 8 mA
Output current @ OUT IOUTsh - 95 - mA VOUT = 5 V, max. 10
shorted to supply lines minutes
Thermal resistance RthJA - 219 - K/W Junction to air
TLE4998C3 RthJC - 47 - K/W Junction to case
Thermal resistance RthJA - 240 - K/W Junction to air
TLE4998C4 RthJC - 41 - K/W Junction to case
Power-on time2) tPon - 0.7 2 ms ≤ ± 5% target out value
15 20 ≤ ± 1% target out value
Power-on reset level VDDpon - 3.6 4 V
3)
Output impedance ZOUT 20 40 70 kΩ
Output fall time tfall 2 - 4 µs VOUT 4.5 V to 0.5 V 4)
Output rise time trise - 20 - µs VOUT 0.5 V to 4.5 V
4)5)

Output low saturation VOUTsat - 0.3 0.6 V IOUTsink = 5 mA


voltage 0.2 0.4 IOUTsink = 2.2 mA
Output noise (rms) OUTnoise - 1 2.5 LSB12 6)

1)
Transmission time depends on the data values being sent and on int. RC oscillator frequ. variation of +/- 20%.
2)
Response time to set up output data at power on when a constant field is applied. The first value given has a
± 5% error, the second value has a ± 1% error. Measured with 640-Hz low-pass filter
3)
VDD = 5V, VOUT=2.6V, open drain high state
4)
For VDD = 5 V, RL = 2.2 kΩ, CL = 4.7 nF, at room temperature, not considering condensator tolerance or
influence of external circuitry

Data Sheet 14 Rev 1.0, 2008-12


TLE4998C

Electrical, Thermal, and Magnetic Parameters


5)
Depends on external RL and CL
*)
VOUT t HIGH

tlow
VDD
90% VDD

10% VDD *)
VOUTsat RL to VDD assumed

t
tfall trise

6)
Range 100 mT, Gain 2.23, internal LP filter 244 Hz, B = 0 mT, T = 25 °C

Data Sheet 15 Rev 1.0, 2008-12


TLE4998C

Electrical, Thermal, and Magnetic Parameters


Calculation of the Junction Temperature
The internal power dissipation PTOT of the sensor increases the chip junction
temperature above the ambient temperature.
The power multiplied by the total thermal resistance RthJA (Junction to Ambient) added
to TA leads to the final junction temperature. RthJA is the sum of the addition of the two
components, Junction to Case and Case to Ambient.

RthJA = RthJC + RthCA


TJ = TA + ∆T
∆T = RthJA x PTOT = RthJA x ( VDD x IDD + VOUT x IOUT ) IDD , IOUT > 0, if direction is into IC

Example (assuming no load on Vout and TLE4998C4 type):


– VDD = 5 V
– IDD = 8 mA
– ∆T = 240 [K/W] x (5 [V] x 0.008 [A] + 0 [VA] ) = 9.6 K

For moulded sensors, the calculation with RthJC is more adequate.

Magnetic Parameters

Table 6 Magnetic Characteristics


Parameter Symbol Limit Values Unit Notes
min. typ. max.
Sensitivity S1) ± 8.2 - ± 245 LSB12/ Programmable2)
mT
3)
Temperature TC -150 0 150 ppm/
coefficient of sensitivity °C See Figure 5
Magnetic field range MFR ± 50 ± 1004) ± 200 mT Programmable 5)
Integral nonlinearity INL - 0.1 - 0.1 %MFR 6)8)

Magnetic offset BOS - 400 0 400 µT 7)8)

Magnetic offset drift ∆BOS -5 - 5 µT / °C Error band8)


Magnetic hysteresis BHYS 0 - 10 µT 9)

1) Defined as ∆OUT / ∆B
2) Programmable in steps of 0.024%
3) For any 1st and 2nd order polynomial, coefficient within definition in Chapter 8.

Data Sheet 16 Rev 1.0, 2008-12


TLE4998C

Electrical, Thermal, and Magnetic Parameters


4)
This range is also used for temperature and offset pre-calibration of the IC
5)
Depending on offset and gain settings, the output may already be saturated at lower fields
6)
Gain setup is 1.0
7)
In operating temperature range and over lifetime
8)
Measured at ± 100 mT range
9)
Measured in 100 mT range, Gain = 1, room temperature

∆S ~
S(T)/S0-1 max. pos.
TC-error
TCmax = ∆S/∆T

∆S0
0
Tmin Tmax
T0 Tj

max. neg.
TC-error
TCmin = ∆S/∆T

Figure 5 Drift of Temperature Coefficient

Data Sheet 17 Rev 1.0, 2008-12


TLE4998C

Signal Processing

6 Signal Processing
The signal flow diagram in Figure 6 shows the signal path and data-processing
algorithm.

Range LP Gain
Limiter
(Clamp)
Hall A Protocol
Sensor D X + Generation
out
X

Temperature Offset
Sensor TC 2

X
X
Stored in
A 1 EEPROM
D + +
Memory
X
-T0 TC 1

Temperature
Compensation

Figure 6 Signal Processing Flow

Magnetic Field Path


• The analog output signal of the chopped Hall-effect cell is converted to a digital signal
in the continuous-time A/D converter. The range of the chopped A/D converter can be
set in several steps either by EEPROM settings or dynamically by the master in the
dynamic range mode (see Table 7). This gives a suitable level for the A/D converter
• After the A/D conversion, a digital low-pass filter reduces the bandwidth (Table 11)
• A multiplier amplifies the value depending on the gain (see Table 9) and temperature
compensation settings
• The offset value is added (see Table 10)
• A limiter reduces the resulting signal to 16 bits (see Chapter 13) and feeds the
Protocol Generation stage

Temperature Compensation
(Details are listed in Chapter 8)
• The output signal of the temperature cell is also A/D converted

Data Sheet 18 Rev 1.0, 2008-12


TLE4998C

Signal Processing
• The temperature is normalized by subtraction of the reference temperature T0 value
(zero point of the quadratic function)
• The linear path is multiplied with the TC1 value
• In the quadratic path, the temperature difference to T0 is squared and multiplied with
the TC2 value
• Both path outputs are added together and multiplied with the Gain value from the
EEPROM

6.1 Magnetic Field Ranges


The working range of the magnetic field defines the input range of the A/D converter. It
is always symmetrical around the zero field point. Any two points in the magnetic field
range can be selected to be the end points of the output value. The output value is
represented within the range between the two points.
In the case of fields higher than the range values, the output signal may be distorted. In
case of synchronous mode and ID selection mode the range must be set accordingly
(R=0/1/3) before the calibration of offset and gain.
Table 7 Range Setting
Range Range in mT1) Parameter R
Low ± 50 3
Mid ± 100 12)
High ± 200 0
1)
Ranges do not have a guaranteed absolute accuracy. The temperature pre-calibration is performed in the mid
range (100 mT)
2)
Setting R = 2 is not used, internally changed to R = 1

Table 8 Range
Parameter Symbol Limit Values Unit Notes
min. max.
Register size R 2 bit

Data Sheet 19 Rev 1.0, 2008-12


TLE4998C

Signal Processing
6.2 Gain Setting
The overall sensitivity is defined by the range and the gain setting. The output of the ADC
is multiplied with the Gain value.
Table 9 Gain
Parameter Symbol Limit Values Unit Notes
min. max.
Register size G 15 bit Unsigned integer value
1)2)
Gain range Gain - 4.0 3.9998 -
Gain quantization steps ∆Gain 244.14 ppm Corresponds to 1/4096
1) For Gain values between - 0.5 and + 0.5, the numerical accuracy decreases
To obtain a flatter output curve, it is advisable to select a higher range setting
2) A gain value of +1.0 corresponds to typical 32 LSB12/mT sensitivity (100 mT range, not guaranteed). It is
crucial to do a final calibration of each IC within the application using the Gain/OUTOS value

The Gain value can be calculated by


:

( G – 16384 )
Gain = ------------------------------
4096

6.3 Offset Setting


The offset value corresponds to an output value with zero field at the sensor.
Table 10 Offset
Parameter Symbol Limit Values Unit Notes
min. max.
Register size OS 15 bit Unsigned integer value
Offset range OUTOS -16384 16383 LSB12 1)

Offset quantization ∆OUTOS 1 LSB12


steps
1)
Infineon pre-calibrates the samples at zero field to 50% output value (100 mT range), but does not guarantee
the value. Therefore it is crucial to do a final calibration of each IC within the application

The offset value can be calculated by:

OUT OS = OS – 16384

Data Sheet 20 Rev 1.0, 2008-12


TLE4998C

Signal Processing
6.4 DSP Input Low-Pass Filter
A digital low-pass filter is placed between the Hall A/D converter and the DSP, and can
be used to reduce the noise level. The low-pass filter has a constant DC amplification of
0 dB (Gain of 1), which means that its setting has no influence on the internal Hall ADC
value.
The bandwidth can be set to any of 8 values.
Table 11 Low Pass Filter Setting
Note: Parameter LP Cutoff frequency in Hz (-3dB point)1)
0 80
1 240
2 440
3 640
4 860
5 1100
6 1390
7 off
1) As this is a digital filter running with an RC-based oscillator, the cutoff frequency may vary within ±20%

Table 12 Low-Pass Filter


Parameter Symbol Limit Values Unit Notes
min. max.
Register size LP 3 bit
Corner frequency ∆f - 20 + 20 %
variation

Note: In range 7 (filter off), the output noise increases.

Data Sheet 21 Rev 1.0, 2008-12


TLE4998C

Signal Processing
Figure 7 shows the filter characteristics as a magnitude plot (the highest setting is
marked). The “off” position would be a flat 0 dB line. The update rate after the low-pass
filter is 16 kHz.

-1

-2
Magnitude (dB)

-3

-4

-5

-6
2 3
101 10 10
Frequency (Hz)
Figure 7 DSP Input Filter (Magnitude Plot)

Data Sheet 22 Rev 1.0, 2008-12


TLE4998C

Signal Processing
6.5 Clamping
The clamping function is useful for separating the output range into an operating range
and error ranges. If the magnetic field is exceeding the selected measurement range, the
output value OUT is limited to the clamping values.

Table 13 Clamping
Parameter Symbol Limit Values Unit Notes
min. max.
Register size CL,CH 2x6 bit (0...63)
Clamping value low OUTCL 0 65535 LSB16 1)

1) 2)
Clamping value high OUTCH 0 65535 LSB16
Clamping quantization ∆OUTCx 1024 LSB16 3)

steps
1) For CL = 0 and CH = 63 the clamping function is disabled
2) OUTCL < OUTCH mandatory
3)
Quantization starts for CL at 0 LSB16 and for CH at 65535 LSB16

The clamping values are calculated by:

Clamping value low (deactivated if CL=0):

OUT CL = CL ⋅ 64 ⋅ 16

Clamping value high (deactivated if CH=63):

OUT CH = ( CH + 1 ) ⋅ 64 ⋅ 16 – 1

Data Sheet 23 Rev 1.0, 2008-12


TLE4998C

Signal Processing
Figure 8 shows an example in which the magnetic field range between Bmin and Bmax
is mapped to output values between 10240 LSB16 and 55295 LSB16.

OUT (LSB16)
65535
Error range
55295 OUTCH

Operating range

10240 OUTCL
Error range
0
Bmin Bmax
B (mT)

Figure 8 Clamping Example


Note: The clamping high value must be above the low value. If OUTCL is set to a higher
value than OUTCH, the OUTCH value is dominating. This would lead to a constant
output value independent of the magnetic field strength.

Data Sheet 24 Rev 1.0, 2008-12


TLE4998C

Error Detection

7 Error Detection
Different error cases can be detected by the On-Board Diagnostics (OBD) and reported
to the microcontroller in the status nibble (see Chapter 13).

7.1 Voltages Outside the Operating Range


The output signals an error condition if VDD crosses the overvoltage threshold level.
Table 14 Overvoltage
Parameter Symbol Limit Values Unit Notes
min. typ. max.
1)
Overvoltage threshold VDDov 16.65 17.5 18.35 V
1) Overvoltage bit activated in status nibble, output stays in “off” state (high ohmic)

7.2 EEPROM Error Correction


The parity method is able to correct a single bit in the EEPROM line. One other single bit
error in another EEPROM line can also be detected, but not corrected. In an
uncorrectable EEPROM failure, the open drain stage is disabled and kept in the off state
permanently (high ohmic/sensor defect).

Data Sheet 25 Rev 1.0, 2008-12


TLE4998C

Temperature Compensation

8 Temperature Compensation
The magnetic field strength of a magnet depends on the temperature. This material
constant is specific for the different magnet types. Therefore, the TLE4998C offers a
second-order temperature compensation polynomial, by which the Hall signal output is
multiplied in the DSP. There are three parameters for the compensation:
• Reference temperature T0
• A linear part (1st order) TC1
• A quadratic part (2nd order) TC2

The following formula describes the sensitivity dependent on the temperature in relation
to the sensitivity at the reference temperature T0:
2
S TC ( T ) = 1 + TC 1 × ( T – T 0 ) + TC 2 × ( T – T0 )
For more information, please refer to the signal processing flow in Figure 6.
The full temperature compensation of the complete system is done in two steps:
1. Pre-calibration in the Infineon final test
The parameters TC1, TC2, T0 are set to maximally flat temperature characteristics
with respect to the Hall probe and internal analog processing parts.
2. Overall system calibration
The typical coefficients TC1, TC2, T0 of the magnetic circuitry are programmed. This
can be done deterministically, as the algorithm of the DSP is fully reproducible. The
final setting of the TC1, TC2, T0 values depend on the pre-calibrated values.
Table 15 Temperature Compensation
Parameter Symbol Limit Values Unit Notes
min. max.
Register size TC1 TL - 9 bit Unsigned integer values
1st order coefficient TC1 TC1 -1000 2500 ppm/ °C 1)

Quantization steps of TC1 qTC1 15.26 ppm/ °C


Register size TC2 TQ - 8 bit Unsigned integer values
2nd order coefficient TC2 TC2 -4 4 ppm/ °C² 2)

Quantization steps of TC2 qTC2 0.119 ppm/ °C²


Reference temp. T0 - 48 64 °C
3)
Quantization steps of T0 qT0 1 °C
1) Full adjustable range: -2441 to +5355 ppm/°C, can be only used after confirmation by Infineon
2) Full adjustable range: -15 to +15 ppm/°C², can be only used after confirmation by Infineon
3)
Handled by algorithm only (see Application Note)

Data Sheet 26 Rev 1.0, 2008-12


TLE4998C

Temperature Compensation
8.1 Parameter Calculation
The parameters TC1 and TC2 may be calculated by:

TL – 160
TC 1 = ---------------------- × 1000000
65536
TQ – 128
TC 2 = ----------------------- × 1000000
8388608
Now the digital output for a given field BIN at a specific temperature can be calculated by:

 B IN 
- × S TC × S TCHall × S 0 × 4096 + OUT OS
OUT = 2 ⋅  ------------
 B FSR 

BFSR is the full-range magnetic field. It is dependent on the range setting (e.g 100 mT).
S0 is the nominal sensitivity of the Hall probe times the Gain factor set in the EEPROM.
STC is the temperature-dependent sensitivity factor calculated by the DSP.
STCHall is the temperature behavior of the Hall probe.
The pre-calibration at Infineon is performed such that the following condition is met:

S TC ( T J – T 0 ) × S TCHall ( T J ) ≈ 1

Within the application, an additional factor BIN(T) / BIN(T0) is given due to the magnetic
system. STC then needs to be modified to STCnew so that the following condition is
satisfied:

B IN ( T )
-------------------- × S TCnew ( T ) × S TCHall ( T ) ≈ S TC ( T ) × S TCHall ( T ) ≈ 1
B IN ( T 0 )

Therefore, the new sensitivity parameters STCnew can be calculated from the pre-
calibrated setup STC using the relationship:

B IN ( T )
-------------------- × S TCnew ( T ) ≈ S TC ( T )
B IN ( T 0 )

Data Sheet 27 Rev 1.0, 2008-12


TLE4998C

Calibration

9 Calibration
For the calibration of the sensor, a special hardware interface to a PC is required. All
calibration and setting bits can be temporarily written into a Random Access Memory
(RAM). This allows the EEPROM to remain untouched during the entire calibration
process, since the number of the EEPROM programming cycles is limited. Therefore,
this temporary setup (using the RAM only) does not stress the EEPROM.
The digital signal processing is completely deterministic. This allows a two-point
calibration to be performed in one step without iterations. After measuring the Hall output
signal for the two end points, the signal processing parameters Gain and Offset can be
calculated.

Table 16 Calibration Characteristics


Parameter Symbol Limit Values Unit Notes
min. max.
Ambient temperature at TCAL 10 30 °C
calibration
2 point Calibration ∆OUTCAL1 -8 8 LSB12 Position 1
accuracy1) ∆OUTCAL2 -8 8 LSB12 Position 2
1)
Corresponds to ± 0.2% accuracy in each position

Data Sheet 28 Rev 1.0, 2008-12


TLE4998C

Calibration
9.1 Calibration Data Memory
When the MEMLOCK bits are programmed (two redundant bits), the memory content is
frozen and may no longer be changed. Furthermore, the programming interface is locked
out and the chip remains in application mode only, preventing accidental programming
due to environmental influences.

Column Parity Bits

User-Calibration Bits
Row Parity Bits

Pre-Calibration Bits

Figure 9 EEPROM Map


A matrix parity architecture allows automatic correction of any single-bit error. Each row
is protected by a row parity bit. The sum of bits set (including this bit) must be an odd
number (ODD PARITY). Each column is additionally protected by a column parity bit.
Each bit in the even positions (0, 2, etc.) of all lines must sum up to an even number
(EVEN PARITY), and each bit in the odd positions (1, 3, etc.) must have an odd sum
(ODD PARITY). The parity column must have an even sum (EVEN PARITY).
This system of different parity calculations also protects against many block errors (such
as erasing a full line or even the whole EEPROM).
When modifying the application bits (such as Gain, Offset, TC, etc.), the parity bits must
be updated. As for the column bits, the pre-calibration area must be read out and
considered for correct parity generation as well.
Note: A specific programming algorithm must be followed to ensure data retention.
A detailed separate programming specification is available on request.

Data Sheet 29 Rev 1.0, 2008-12


TLE4998C

Calibration

Table 17 Programming Characteristics


Parameter Symbol Limit Values Unit Notes
min. max.
Number of EEPROM NPRG - 10 Cycles1) Programming allowed
programming cycles only at start of lifetime
Ambient temperature at TPRG 10 30 °C
programming
Programming time tPRG 100 - ms For complete memory 2)
Calibration memory - 150 Bit All active EEPROM bits
Error Correction - 26 Bit All parity EEPROM bits
1) 1 cycle is the simultaneous change of ≥ 1 bit
2) Depending on clock frequency at VDD, write pulse 10 ms ±1%, erase pulse 80 ms ±1%

9.2 Programming Interface


The VDD pin and the OUT pin are used as a two-wire interface to transmit the EEPROM
data to and from the sensor.
This allows:
• Communication with high data reliability
• The bus-type connection of several sensors and separate programming via the OUT
pin

9.3 Data Transfer Protocol


The data transfer protocol is described in a separate document (User Programming
Description), available on request.

9.4 Programming of Sensors with Common Supply Lines


In many automotive applications, two sensors are used to measure the same parameter.
This redundancy makes it possible to continue operation in an emergency mode. If both
sensors use the same power supply lines, they can be programmed together in parallel.

Data Sheet 30 Rev 1.0, 2008-12


TLE4998C

Application Circuit

10 Application Circuit
Figure 10 shows the connection of multiple sensors to a microcontroller.

Sensor ECU
Module Voltage Supply Voltage Supply Module
Sensor µC

VDD µC
V dd
V DD
OUT1 2k2
TLE 50
out
47nF 4998 CCin1
GND
1 nF
4.7nF GND
VGND

CCin2
2k2
V DD
OUT2
TLE out 50
47nF 4998
GND
optional 1 nF
4.7nF

Figure 10 Application Circuit


Note: For calibration and programming, the interface has to be connected directly to the
OUT pin.
The application circuit shown should be regarded as an example only. It will need to be
adapted to meet the requirements of other specific applications. Further information is
given in Chapter 13.

Data Sheet 31 Rev 1.0, 2008-12


TLE4998C

PG-SSO-3-10 Package Outlines

11 PG-SSO-3-10 Package Outlines


45˚

4.06 ±0.05 2 A
0.1 MAX.

B
1.5 1.5 ±0.05
4.05 ±0.05
(0.25)
1)
1 ±0.2

0.5 ±0.1 0.82 ±0.05


3x
0.42 ±0.05 0.36 ±0.05
0.5 B

1 2 3
2 x 1.27 = 2.54

12.7 ±1
2 C
(Useable
Length)
(10)

19 ±0.5

1-1
33 MAX.
+0.75

6 ±0.5
9 -0.50

C
18 ±0.5

A Adhesive
Tape
Tape

6.35 ±0.4 4 ±0.3 0.25 -0.15


12.7 ±0.3 0.39 ±0.1
Total tolerance at 19 pitches ±1

1) No solder function area


Molded body dimensions do not unclude plastic or metal protrusion of 0.15 max per side
P-PG-SSO-3-10-PO V02

Figure 11 PG-SSO-3-10 (Plastic Green Single Small Outline Package)

Data Sheet 32 Rev 1.0, 2008-12


TLE4998C

PG-SSO-4-1 Package Outlines

12 PG-SSO-4-1 Package Outlines


5.34 ±0.05
0.2
5.16 ±0.08
2 A
1 x 45˚ ±1˚ 1-0.1
0.1 MAX.

3.38 ±0.06
3.71±0.08
1.9 MAX. 0.25 ±0.05


(0.25)

1 MAX.1)
0.2 +0.1

4x 0.6 MAX.
0.4 ±0.05
0.5

1 2 3 4
1.27
3 x 1.27 = 3.81

12.7 ±1
(Useable Length)
(14.8)

23.8 ±0.5
38 MAX.

1-1
6 ±0.5
9 +0.75
-0.5

18 ±0.5

A Adhesive
Tape

Tape
6.35 ±0.4 4 ±0.3 0.25 -0.15
12.7 ±0.3 0.39 ±0.1
Total tolerance at 10 pitches ±1

1) No solder function area GPO05357

Figure 12 PG-SSO-4-1 (Plastic Green Single Small Outline Package)

Data Sheet 33 Rev 1.0, 2008-12


TLE4998C

SPC Output Definition

13 SPC Output Definition


The sensor supports a SPC (Short PWM Code) protocol, which enhances the
standardized SENT protocol (Single Edge Nibble Transmission) defined by SAE J2716.
SPC enables the use of enhanced protocol functionality due to the ability to select
between “synchronous”, “range selection” and “ID selection” protocol mode. The
following tables give an overview of relevant registers to chose the appropriate SPC
mode.

Table 18 SPC Mode Registers


Parameter Symbol Limit Values Unit Notes
min. max.
Protocol register P 2 bit
1)
ID register ID 2 bit
1)
The ID register is only actively used in ID selection mode.

Table 19 SPC Mode Selection


Mode Parameter PMSB Parameter PLSB Explanation
Synchronous 0 No effect Section 13.4
Dynamic range selection 1 0 Section 13.5
ID selection 1 1 Section 13.6

13.1 Basic SPC Protocol Definition


As in SENT, the time between two consecutive falling edges defines the value of a four
bit nibble, thus representing numbers between 0 and 15. The transmission time therefore
depends on the transmitted data values. The single edge is defined by a 3 unit time (UT)
low pulse on the output, followed by the high time defined in the protocol (nominal values,
may vary by tolerance of internal RC oscillator, not including analog delay of the open
drain output and influence by external circuitry, unit time programming see
Section 13.2). All values are multiples of a unit time frame concept. A transfer consists
of the following parts, depicted in Figure 13:
• A trigger pulse by the master, which initiates the data transmission
• A synchronization period of 56 UT (in parallel, a new sample is calculated)
• A status nibble of 12-27 UT
• Between 3 and 6 data nibbles of 12-27 UT each (number is programmable, see
Table 21), representing the Hall value and temperature information
• A CRC nibble of 12-27 UT
• An end pulse to terminate the SPC transmission.

Data Sheet 34 Rev 1.0, 2008-12


TLE4998C

SPC Output Definition

Master Sync Status Data Data Data


Line idle Trigger frame Nibble Nibble 1 Nibble 2 Nibble 3
Pulse
OUT

Data Data Data Data CRC Available for


End Pulse
Nibble 3 Nibble 4* Nibble 5* Nibble 6* Nibble next sample

* Data Nibbles 4 to 6 are optional (programmable )

Figure 13 SPC Frame


The CRC checksum includes the status nibble and the data nibbles and can be used to
check the validity of the decoded data. The sensor is available for the next sample 90µs
after the falling edge of the end pulse. The sampling time (when values are taken for
temperature compensation) is always defined as the beginning of the synchronization
period. During this period, the resulting data is always calculated from scratch.
The number of transmitted SPC nibbles is programmable to customize the amount of
information sent by the sensor. The frame contains a 16bit Hall value and an 8bit
temperature value in the full configuration.

Table 20 Frame Register


Parameter Symbol Limit Values Unit Notes
min. max.
Frame register F 2 bit

Table 21 Frame Selection


Frame Type Parameter F Data Nibbles
16bit Hall, 8bit temperature 0 6 nibbles
16bit Hall 1 4 nibbles
12bit Hall, 8bit temperature 2 5 nibbles
12bit Hall 3 3 nibbles

The temperature is coded as an 8bit value. The value is transferred in unsigned integer
format and corresponds to the range between -55°C and +200°C, so a transferred value

Data Sheet 35 Rev 1.0, 2008-12


TLE4998C

SPC Output Definition


of 55 corresponds to 0°C. Table 22 shows the mapping between junction temperature
and the transmitted value in the SPC frame.

Table 22 Mapping of Temperature Value


Junction Temperature Typ. Decimal Value from Sensor Note
- 55°C 0 Theoretical lower limit1)
0°C 55
25°C 80
200°C 255 Theoretical upper limit1)
1) Theoretical range of temperature values, not operating temperature range

The status nibble allows to check internal states and conditions of the sensor.
• Depending on the selected SPC mode, the first two bits of the status nibble contain
either the selected magnetic range or the ID of the sensor and allow therefore an easy
interpretation of the received data.
• The third bit is set to “1” for the first transmission after the sensor returns from an
overvoltage operation with disabled open drain stage to regular operation (see
Chapter 7.1).
• The fourth bit is switched to “1” for the first data package transferred after a reset. This
allows the detection of low-voltage situations or EMC problems of the sensor.

13.2 Unit Time Setup


The basic SPC protocol unit time granularity is defined as 3 µs. Every timing is a multiple
of this basic time unit. To achieve more flexibility, trimming of the unit time can be used
to:
• Allow a calibration trim within a timing error of less than 20% clock error (as given in
SAE standard)
• Allow a modification of the unit time for small speed adjustments
This enables a setup of different unit times, even if the internal RC oscillator varies by
±20%. Of course, timing values that are too low could clash with timing requirements of

Data Sheet 36 Rev 1.0, 2008-12


TLE4998C

SPC Output Definition


the application and should therefore be avoided, but in principle it is possible to adjust
the timer unit for a more precise protocol timing.

Table 23 Predivider Setting

Parameter Symbol Limit Values Unit Notes


min. max.
Register size Prediv 4 bit Predivider1)
Unit time tUNIT 2.0 3.88 µs ClkUNIT=8MHz2)
1)
Prediv default is decimal = 8 for 3 µs nominal SPC unit time
2)
RC oscillator frequency variation +/- 20%

The nominal unit time is calculated by:

tUNIT = (Prediv + 16) / ClkUNIT

Clk UNIT = 8MHz ± 20%

13.3 Master Pulse Requirements


An SPC transmission is initiated by a Master pulse on the OUT pin. To detect a low level
on the OUT pin, the voltage must be below a threshold Vthf. The sensor detects that the
OUT line has been released as soon as Vthr is crossed. Figure 14 shows the timing
definitions for the master pulse. The master low time tmlow as well as the total trigger time
tmtr are individual for the different SPC modes and are given in the subsequent sections.
It is recommended to chose the typical master low time exactly between the minimum
and the maximum possible time: tmlow,typ = (tmlow,min + tmlow,max) / 2. Although the
allowed timing windows are larger for longer low times, the master should use a quarz
clock source to provide a high timing accuracy (approx. 1%). For improved robustness,
the master pulse can be adopted by the master once the effective unit time is known
through the sensor’s synchronisation period length. If the master low time exceeds the
maximum low time, the sensor does not respond and is available for a next triggering

Data Sheet 37 Rev 1.0, 2008-12


TLE4998C

SPC Output Definition


30µs after the master pulse crosses Vthr. tmd,tot is the delay between internal triggering
of the falling edge in the sensor and the triggering of the ECU.

Table 24 Master Pulse Parameters

Parameter Symbol Limit Values Unit Notes


min. typ. max.
Falling edge threshold Vthf 1.1 1.3 1.7 V
Rising edge threshold Vthr 1.25 1.43 1.8 V
Total trigger time tmtr 10.8 13 16.3 UT Synchronous mode 1)2)
46.6 56 70 UT Dyn. range mode 1)2)
75 90 113 UT ID selection mode 1)2)
3)
Master delay time tmd,tot 3.7 5.8 7.9 µs
1)
UT = Programmed nominal SPC unit time
2)
Trigger time in the sensor is fixed to the number of unit times specified in the “typ.” column, but the effective
trigger time varies due to the sensor’s clock variation
3)
For VDD = 5 V, RL = 2.2 kΩ, CL = 4.7 nF, ECU trigger level Vth,ECU = 2V

tmtr

OUT
Vthr,max ECU trigger
Vthf,max
Vthr,min level
Vthf,min

tmd,tot
tmlow,min

t mlow,max

Figure 14 SPC Master Pulse Timing

Data Sheet 38 Rev 1.0, 2008-12


TLE4998C

SPC Output Definition


13.4 Synchronous Transmission
In the “synchronous” mode, the sensor (slave) starts to transfer a complete data frame
only after a low pulse is forced by the master on the OUT pin. This means that the data
line is bidirectional - an open drain output of the microcontroller (master) sends the
trigger pulse. The sensor then initiates a sync pulse and starts to calculate the new
output data value. After the synchronization period, the data follows in form of a standard
SENT frame, starting with the status, data and CRC nibbles. At the end, an end pulse
allows the CRC nibble decoding and indicates that the data line is idle again. The timing
diagram in Figure 13 visualizes a synchronous transmission.

Table 25 Master Pulse Timing Requirements for Synchronous Mode

Parameter Symbol Limit Values Unit1) Notes


min. typ. max.
Master low time tmlow 1.5 2.75 4 UT
1) UT = Programmed nominal SPC unit time

Sensor CPU
VDD

OUT Capcom-Unit
Outpin (OD)
GND

Figure 15 Bidirectional Communication in Synchronous Mode

13.5 Synchronous Transmission Including Range Selection


The low time duration of the master can be used to select the magnetic range of the
sensor in SPC dynamic range selection mode.

Table 26 Master Pulse Timing Requirements for Dynamic Range Mode

Parameter Symbol Limit Values Unit1) Notes


min. typ. max.
Master low time tmlow 1.5 3.25 5 UT Range = 200mT (R=0)
9 12 15 UT Range = 100mT (R=1)
24 31.5 39 UT Range = 50mT (R=3)
1) UT = Programmed nominal SPC unit time

Data Sheet 39 Rev 1.0, 2008-12


TLE4998C

SPC Output Definition


The range information in the status bit can be used to determine whether the range has
been properly identified. Changing the range takes some time due to the settling time of
internal circuitry. The first sample after a range switch therefore still displays a value
sampled with the old range setting, and the second transmission after changing the
range displays the new range with reduced accuracy.

13.6 Synchronous Mode with ID Selection


This functionality is similar to the previous mode, but instead of switching the range of
one sensor, one of up to four sensors are selectable on a bus (bus mode, 1 master with
up to 4 slaves). This allows parallel connection of up to 4 sensors using only three lines
(VDD, GND, OUT), as illustrated in Figure 16.

Sensor 1 CPU

VDD

OUT Capcom-Unit
Outpin (OD)
GND

Sensor 2
VDD

OUT

GND

Figure 16 Bidirectional Communication with ID Selection


In this mode, the sensor starts to transfer complete packages only after receiving a
master low pulse with an ID that is equivalent to the programmed value in its ID register.
The mapping between master low time and ID is given in Table 27. A proper addressing
requires the different sensors on a same bus to be programmed with the same nominal

Data Sheet 40 Rev 1.0, 2008-12


TLE4998C

SPC Output Definition


SPC unit time. Alternatively, the sensors can be trimmed using the predivider settings to
further reduce their relative unit time difference for more robustness.

Table 27 Master Pulse Timing Requirements for ID Selection Mode

Parameter Symbol Limit Values Unit1) Notes


min. typ. max.
Master low time tmlow 9 10.5 12 UT ID = 0
19 21 23 UT ID = 1
35.5 38 40.5 UT ID = 2
61.5 64.5 67.5 UT ID = 3
1) UT = Programmed nominal SPC unit time

Data Sheet 41 Rev 1.0, 2008-12


TLE4998C

SPC Output Definition


Table 28 Content of a SPC Data Frame (5-8 Nibbles)

omitted if F[0] = 1*
omitted if F[1] = 1*

TRIGGER SYNC STATUS H1 H2 H3 H4 T1 T2 CRC

bits description description


state state status information

10 RR/ID startup condition in RR / of ID CRC calculation


for all nibbles
01 RR/ID overvoltage in RR / of ID
00 RR/ID normal state in RR / of ID seed value: 0101

polynomial: X4+X3 +X2+1


bits description
11 +/- 50mT or ID #3
10 +/- 100mT or ID #2
01 +/- 100mT or ID #1
00 +/- 200mT or ID #0

bits description1 description 2 bits description

H1 H2 H3 H4
decimal: OUT12 decimal: OUT16 T1 T2
decimal: TEMP8
( = H1* 256+H2*16 +H3 ) ( = OUT12*16+H4 ) ( = T1*16 + T2 )

1111 1111 1111 1111 4095 (FSR) 65535 (FSR) 1111 1111 200 °C
1111 1111 1111 1110 4095 65534 1111 1110 199 °C
1111 1111 1111 : 4095 : 1111 : :
1111 1111 1111 0000 4095 65520 1111 0000 185 °C
1111 1111 1110 1111 4094 65519 1110 1111 184 °C
1111 1111 1110 1110 4094 65518 : : :
1111 1111 1110 : 4094 : 0101 0000 25 °C
1111 1111 1110 0000 4094 65504 0100 1111 24 °C
1111 1111 1101 1111 4093 65503 : : :
: : : : : : 0011 0111 0°C
0000 0000 0010 0000 2 32 0011 0110 -1°C
0000 0000 0001 1111 1 31 : : :
0000 0000 0001 : 1 : 0000 0001 -54 °C
0000 0000 0001 0000 1 16 0000 0000 -55 °C
0000 0000 0000 1111 0 15
0000 0000 0000 1110 0 14
0000 0000 0000 : 0 : Abbreviations:
TRIGGER – trigger nibble
0000 0000 0000 0001 0 1
SYNC – synchronization nibble
0000 0000 0000 0000 0 0 STATUS – status nibble
CRC – cyclic redundancy code nibble
FSR – full scale range
H1..4 – hall value
T1..2 – temperature value
OUT12 – 12 bit output value
OUT16 – 16 bit output value
* The number of nibbles is programmed TEMP8 – 8 bit temperature value
in the frame register F

Data Sheet 42 Rev 1.0, 2008-12


TLE4998C

SPC Output Definition


13.7 Checksum Nibble Details
The Checksum nibble is a 4-bit CRC of the data nibbles including the status nibble. The
CRC is calculated using a polynomial x4 +x3 + x2 + 1 with a seed value of 0101.
In the TLE4998C it is implemented as a series of XOR and shift operations as shown in
the following flowchart:

CRC calculation
Pre-initialization : Nibble
next Nibble
GENERATOR = 1101 VALUE

xor
SEED = 0101 , use this
constant as old CRC
value at first call SEED

<<1

VALUE
VALUExor
xorSEED
SEED
0
4x
xor only if MSB = 1

GENPOLY

Figure 17 CRC Calculation


A microcontroller implementation may use an XOR command plus a small 4-bit lookup
table to calculate the CRC for each nibble.

// Fast way for any µC with low memory and compute capabilities
char Data[8] = {…}; // contains the input data (status nibble , 6 data nibble , CRC)
// required variables and LUT
char CheckSum, i;
char CrcLookup[16] = {0, 13, 7, 10, 14, 3, 9, 4, 1, 12, 6, 11, 15, 2, 8, 5};
CheckSum= 5; // initialize checksum with seed "0101"
for (i=0; i<7; i++) {
CheckSum = CheckSum ^ Data[i];
CheckSum = CrcLookup[CheckSum];
}
; // finally check if Data [7] is equal to CheckSum

Figure 18 Example Code for CRC Generation

Data Sheet 43 Rev 1.0, 2008-12


w w w . i n f i n e o n . c o m

Published by Infineon Technologies AG

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