Wl18Xxmod Wilink™ 8 Single-Band Combo Module - Wi-Fi, Bluetooth, and Bluetooth Low Energy (Le)
Wl18Xxmod Wilink™ 8 Single-Band Combo Module - Wi-Fi, Bluetooth, and Bluetooth Low Energy (Le)
Wl18Xxmod Wilink™ 8 Single-Band Combo Module - Wi-Fi, Bluetooth, and Bluetooth Low Energy (Le)
1.1
1
Features
• General • Bluetooth® and Bluetooth low energy
– Integrates RF, Power Amplifiers (PAs), Clock, (WL183xMOD Only)
RF Switches, Filters, Passives, and Power – Bluetooth 4.2 Secure Connection Compliant and
Management CSA2 Support (Declaration ID: D032799)
– Quick Hardware Design With TI Module – Host Controller Interface (HCI) Transport for
Collateral and Reference Designs Bluetooth Over UART
– Operating Temperature: –20°C to +70°C – Dedicated Audio Processor Support of SBC
– Small Form Factor: 13.3 × 13.4 × 2 mm Encoding + A2DP
– 100-Pin MOC Package – Dual-Mode Bluetooth and Bluetooth Low Energy
– FCC, IC, ETSI/CE, and TELEC Certified With – TI's Bluetooth- and Bluetooth Low Energy-
PCB, Dipole, Chip, and PIFA Antennas Certified Stack
• Wi-Fi® • Key Benefits
– WLAN Baseband Processor and RF Transceiver – Reduces Design Overhead
Support of IEEE Std 802.11b, 802.11g, and – Differentiated Use Cases by Configuring
802.11n WiLink™ 8 Simultaneously in Two Roles (STA
– 20- and 40-MHz SISO and 20-MHz 2 × 2 MIMO and AP) to Connect Directly With Other Wi-Fi
at 2.4 GHz for High Throughput: 80 Mbps Devices on Different RF Channel (Wi-Fi
(TCP), 100 Mbps (UDP) Networks)
– 2.4-GHz MRC Support for Extended Range – Best-in-Class Wi-Fi With High-Performance
– Fully Calibrated: Production Calibration Not Audio and Video Streaming Reference
Required Applications With Up to 1.4× the Range Versus
One Antenna
– 4-Bit SDIO Host Interface Support
– Different Provisioning Methods for In-Home
– Wi-Fi Direct Concurrent Operation
Devices Connectivity to Wi-Fi in One Step
(Multichannel, Multirole)
– Lowest Wi-Fi Power Consumption in Connected
Idle (< 800 µA)
– Configurable Wake on WLAN Filters to Only
Wake Up the System
– Wi-Fi-Bluetooth Single Antenna Coexistence
1.2 Applications
• Internet of Things (IoT) • Industrial and Home Automation
• Multimedia • Smart Gateway and Metering
• Home Electronics • Video Conferencing
• Home Appliances and White Goods • Video Camera and Security
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD
SWRS152M – JULY 2013 – REVISED OCTOBER 2017 www.ti.com
1.3 Description
The certified WiLink™ 8 module from TI offers high throughput and extended range along with Wi-Fi® and
Bluetooth® coexistence (WL1835MOD only) in a power-optimized design. The WL18x5MOD device is a
2.4-GHz module, two antenna solution. The device is FCC, IC, ETSI/CE, and TELEC certified for AP and
client. TI offers drivers for high-level operating systems such as Linux®and Android™. Additional drivers,
such as WinCE and RTOS, which includes QNX, Nucleus, ThreadX, and FreeRTOS, are supported
through third parties.
RF_ANT2
ZigBee
COEX
Interface BG1
BT_UART F
WRF2
MAC/PHY
WLAN_SDIO BG2
RF_ANT1
BT_EN
WRF1 2.4-GHz
WLAN_EN SPDT
BT F
MAC/PHY
26M XTAL
VIO
VBAT PM
Table of Contents
1 Device Overview ......................................... 1 Characteristics....................................... 16
1.1 Features .............................................. 1 5.16 Bluetooth low energy Performance: Modulation
1.2 Applications ........................................... 1 Characteristics....................................... 16
1.3 Description ............................................ 2 5.17 Bluetooth BR and EDR Dynamic Currents.......... 16
1.4 Functional Block Diagram ............................ 2 5.18 Bluetooth low energy Currents ...................... 17
2 Revision History ......................................... 3 5.19 Timing and Switching Characteristics ............... 17
3 Device Comparison ..................................... 4 6 Detailed Description ................................... 25
3.1 Related Products ..................................... 4 6.1 WLAN Features ..................................... 26
4 Terminal Configuration and Functions .............. 5 6.2 Bluetooth Features .................................. 26
4.1 Pin Attributes ......................................... 6 6.3 Bluetooth low energy Features ..................... 27
5 Specifications ............................................ 9 6.4 Device Certification .................................. 27
5.1 Absolute Maximum Ratings .......................... 9 6.5 Module Markings .................................... 29
5.2 ESD Ratings .......................................... 9 6.6 Test Grades ......................................... 29
5.3 Recommended Operating Conditions ................ 9 6.7 End Product Labeling ............................... 30
5.4 External Digital Slow Clock Requirements .......... 10 6.8 Manual Information to the End User ................ 30
5.5 Thermal Resistance Characteristics for MOC 100- 7 Applications, Implementation, and Layout........ 31
Pin Package ......................................... 10 7.1 Application Information .............................. 31
5.6 WLAN Performance: 2.4-GHz Receiver 8 Device and Documentation Support ............... 38
Characteristics....................................... 11 8.1 Device Support ...................................... 38
5.7 WLAN Performance: 2.4-GHz Transmitter Power .. 12 8.2 Related Links ........................................ 41
5.8 WLAN Performance: Currents ...................... 13 8.3 Community Resources .............................. 41
5.9 Bluetooth Performance: BR, EDR Receiver
8.4 Trademarks.......................................... 41
Characteristics—In-Band Signals ................... 13
8.5 Electrostatic Discharge Caution ..................... 41
5.10 Bluetooth Performance: Transmitter, BR ........... 14
8.6 Glossary ............................................. 41
5.11 Bluetooth Performance: Transmitter, EDR .......... 14
9 Mechanical, Packaging, and Orderable
5.12 Bluetooth Performance: Modulation, BR ............ 15
Information .............................................. 42
5.13 Bluetooth Performance: Modulation, EDR .......... 15
9.1 TI Module Mechanical Outline ...................... 42
5.14 Bluetooth low energy Performance: Receiver
9.2 Tape and Reel Information .......................... 43
Characteristics – In-Band Signals................... 15
5.15 Bluetooth low energy Performance: Transmitter 9.3 Packaging Information .............................. 45
2 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
3 Device Comparison
The TI WiLink 8 module offers four footprint-compatible 2.4-GHz variants providing stand-alone Wi-Fi and
Bluetooth combo connectivity. Table 3-1 compares the features of the module variants.
PIN 42 - WL_UART_DBG
PIN 43 - BT_UART_DBG
PIN 40 - WLAN_EN
PIN 36 - EXT_32K
PIN 47 - VBAT_IN
PIN 46 - VBAT_IN
PIN 41 - BT_EN
PIN 34 - GND
PIN 33 - GND
PIN 44 - GND
PIN 45 - GND
PIN 48 - GND
PIN 35 - GND
PIN 37 - GND
PIN 39 - GND
PIN 38 - VIO PIN 49 - GND
PIN 17 - GND
Pin 2 Indicator
PIN 6 - WL_SDIO_CMD
PIN 8 - WL_SDIO_CLK
PIN 11 - WL_SDIO_D1
PIN 13 - WL_SDIO_D3
PIN 10 - WL_SDIO_D0
PIN 12 - WL_SDIO_D2
PIN 14 - WLAN_IRQ
PIN 2 - GPIO11
PIN 16 - GND
PIN 15 - GND
PIN 5 - GPIO12
PIN 4 - GPIO10
PIN 9 - GND
PIN 3 - GPIO9
PIN 7 - GND
PIN 1 - GND
5 Specifications
All specifications are measured at the module pins using the TI WL1835MODCOM8 evaluation board. All
measurements are performed with VBAT = 3.7 V, VIO = 1.8 V, 25°C for typical values with matched RF
antennas, unless otherwise indicated.
NOTE
For level-shifting I/Os with the TI WL18x5MOD, see the Level Shifting WL18xx I/Os
Application Report.
(1) 4.8 V is applicable only for 2.33 years (30% of the time). Otherwise, maximum VBAT must not exceed 4.3 V.
(2) Applies to all digital lines except PCM and slow clock lines
Copyright © 2013–2017, Texas Instruments Incorporated Specifications 9
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(1) All RF and performance numbers are aligned to the module pin.
(2) Sensitivity degradation up to –3 dB may occur due to fast clock harmonics with dirty TX on.
Copyright © 2013–2017, Texas Instruments Incorporated Specifications 13
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5.14 Bluetooth low energy Performance: Receiver Characteristics – In-Band Signals (1)
over operating free-air temperature range (unless otherwise noted)
PARAMETER CONDITION (2) MIN TYP MAX UNIT
Bluetooth low energy operation frequency 2402 2480 MHz
range
Bluetooth low energy channel spacing 2 MHz
Bluetooth low energy input impedance 50 Ω
(3)
Bluetooth low energy sensitivity –92.2
dBm
Dirty TX on
Bluetooth low energy maximum usable input –5 dBm
power
Bluetooth low energy intermodulation Level of interferers. –36 –30
dBm
characteristics For n = 3, 4, 5
(1) All RF and performance numbers are aligned to the module pin.
(2) BER of 0.1% corresponds to PER of 30.8% for a minimum of 1500 transmitted packets, according to the Bluetooth low energy test
specification.
(3) Sensitivity degradation of up to –3 dB can occur due to fast clock harmonics.
Copyright © 2013–2017, Texas Instruments Incorporated Specifications 15
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VBAT
VBAT_IN_MAIN_DC2DC
VBAT
VBAT_IN_PA_DC2DC VBAT
MAIN_DC2DC_OUT SW SW PA_DC2DC_OUT
PA
LDO_IN_DIG FB Main DC2DC
DC2DC FB FB_IN_PA_DC2DC
2.2 – 2.7 V
1.8 V
DIG_DC2DC_OUT SW
To perform the correct power-up sequence, assert (high) WL_EN. The internal DC-DCs, LDOs, and clock
start to ramp and stabilize. Stable slow clock, VIO, and VBAT are prerequisites to the assertion of one of the
enable signals.
To perform the correct shut-down sequence, deassert (low) WL_EN while all the supplies to the device
(VBAT, VIO, and slow clock) are still stable and available. The supplies to the chip (VBAT and VIO) can be
deasserted only after both enable signals are deasserted (low).
Figure 5-2 shows the general power scheme for the module, including the power-down sequence.
VBAT
VIO
5 5
EXT_32K
>10 µs 2 >10 µs 4
3
WLEN > 60 µs
EXT_32K
input
WL_EN
input
4.5 ms delay
Main 1V8 DC2DC
DIG DC2DC
SRAM LDO
Top RESETZ
TCXO_CLK_REQ
output
VBAT / VIO
input
SLOWCLK
input
WL_EN
input
TCXO_CLK_REQ
output
TXCO_LDO
output
TCXO
input
SDIO_CLK
input
Indicates completion of firmware download
and internal initialization NLCP: trigger at rising edge
WLAN_IRQ
output
NLCP
Wake-up time
Initialization time
tISU tIH
VDD
VIH VIH
Data Input Not Valid Valid Not Valid
VIL VIL
VSS
tODLY(max)
VDD tODLY(min)
VOH VOH
Data Output Not Valid Valid Not Valid
VOL VOL
VSS
tISU tIH
VDD
VIH VIH
Data Input Not Valid Valid Not Valid
VIL VIL
VSS
VSS
tTLH
VOH VOH
Data Output Not Valid Valid Not Valid
VOL VOL
VSS
5.19.7 HCI UART Shared-Transport Layers for All Functional Blocks (Except WLAN)
The device includes a UART module dedicated to the Bluetooth shared-transport, host controller interface
(HCI) transport layer. The HCI transports commands, events, and ACL between the Bluetooth device and
its host using HCI data packets ack as a shared transport for all functional blocks except WLAN. Table 5-3
lists the transport mechanism for WLAN and bluetooth audio.
_
The HCI UART supports most baud rates (including all PC rates) for all fast-clock frequencies up to a
maximum of 4 Mbps. After power up, the baud rate is set for 115.2 Kbps, regardless of the fast-clock
frequency. The baud rate can then be changed using a VS command. The device responds with a
Command Complete Event (still at 115.2 Kbps), after which the baud rate change occurs.
HCI hardware includes the following features:
• Receiver detection of break, idle, framing, FIFO overflow, and parity error conditions
• Receiver-transmitter underflow detection
• CTS, RTS hardware flow control
• 4 wire (H4)
Table 5-4 lists the UART default settings.
_ _
tb
STR-Start-bit; D0..Dn - Data bits (LSB first); PAR - Parity bit (if used); STP - Stop-bit
Figure 5-11. UART Data Frame
tis tih
top
6 Detailed Description
The WiLink 8 module is a self-contained connectivity solution based on WiLink 8 connectivity. As the
eighth-generation connectivity combo chip from TI, the WiLink 8 module is based on proven technology.
Figure 6-1 shows a high-level view of the WL1835MOD variant.
32 kHz VBAT
XTAL
Antenna 1
Wi-Fi and Bluetooth
VIO
32 kHz
Antenna 2
Bluetooth WPA Supplicant WL1835MOD Wi-Fi
Stack and Profiles and Wi-Fi Driver Enable (Optional)
Wi-Fi
SDIO
UART Driver SDIO Driver Bluetooth
UART
Table 6-1, Table 6-2, and Table 6-3 list performance parameters along with shutdown and sleep currents.
• The maximum VBAT value is based on peak calibration consumption with a 30% margin.
CAUTION
FCC RF Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an
uncontrolled environment. End users must follow the specific operating
instructions for satisfying RF exposure limits. This transmitter must not be
colocated or operating with any other antenna or transmitter.
CAUTION
IC RF Radiation Exposure Statement:
To comply with IC RF exposure requirements, this device and its antenna must
not be colocated or operating in conjunction with any other antenna or
transmitter.
Pour se conformer aux exigences de conformité RF canadienne l'exposition,
cet appareil et son antenne ne doivent pas étre co-localisés ou fonctionnant en
conjonction avec une autre antenne or transmitter.
6.4.3 ETSI/CE
The WL18MODGB modules conform to the EU Radio Equipment Directive. For further detains, see the full
text of the EU Declaration of Conformity for the WL18MODGBWL18MODGB (test grade 01),
WL18MODGB (test grade 05), WL18MODGB (test grade 31), and WL18MODGI (test grade 35) devices.
CE CE compliance mark
NOTE
Information in the following Applications section is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes. Customers should validate and test
their design implementation to confirm system functionality.
ANT1- WL_2.4_IO2/BT
48
47
46
45
44
43
42
41
40
39
38
37
35
34
33
36
BT_UART_DBG
WL_UART_DBG
VIO
GND
GND
GND
GND
GND
GND
GND
GND
BT_EN_SOC
WLAN_EN_SOC
EXT_32K
VBAT
VBAT
ANT1
C13 ANT016008LCD2442MA1
C5 8pF ANT-N3-1.6X0.8MM-A
10pF 0402
49 32 0402 A
GND RF_ANT1 FEED
BT_HCI_RTS_1V8 50 31 2.4G 5G
BT_HCI_RTS GND
B1
B2
C7 L1
BT_HCI_CTS_1V8 51 30 NU_10pF 1.1nH
BT_HCI_CTS GND 0402 0402 C9 C10
BT_HCI_TX_1V8 52 29 2.2pF NU_0.3pF
BT_HCI_TX GND 2 0402 0402
BT_HCI_RX_1V8 53 28 1
BT_HCI_RX GND 3 J5
54 27 WL_RS232_TX_1V8 TP3 U.FL-R-SMT(10)
GND GPIO_1
Connect to Host HCI Interface. U.FL The value of antenna matching components
55 26 WL_RS232_RX_1V8 TP4
GND GPIO_2 is for WL1835MODCOM8B
For Debug only
BT_AUD_IN 56 25 TP5
BT_AUD_IN U1 GPIO_4
For Debug only
BT_AUD_OUT 57 24
BT_AUD_OUT WL1835MODGB GND
BT_AUD_FSYNC 58 23
BT_AUD_FSYNC E-13.4X13.3-N100_0.75-TOP GND
59 22 TP6
GND RESERVED2
BT_AUD_CLK 60
BT_AUD_CLK RESERVED1
21 TP7 ANT2- WL_2.4_IO1
61 20 ANT2
GND GND C6 ANT016008LCD2442MA1
Connect to Host BT PCM Bus. TP8 62 19 10pF C14 ANT-N3-1.6X0.8MM-B
RESERVED3 GND 0402 4pF
63 18 0402 A
GND RF_ANT2 FEED
64 17 2.4G 5G
GND GND
B1
B2
C8 L2
NU_10pF 1.5nH
G19 G1 0402 0402 C11 C12
G20 GND GND G2 1.2pF NU
G21 GND GND G3 2 0402 0402
G22 GND GND G4 1
G23 GND GND G5 3 J6
G24 GND GND G6 U.FL-R-SMT(10)
G25 GND GND G7
GND GND
U.FL The value of antenna matching components
G26 G8
G27 GND GND G9 is for WL1835MODCOM8B
G28 GND GND G10
GND GND For Debug only
G29 G11
G30 GND GND G12
G31 GND GND G13
G32 GND GND G14
GND GND
WL_SDIO_CMD
WL_SDIO_CLK
G33 G15
WL_SDIO_D0
WL_SDIO_D1
WL_SDIO_D2
WL_SDIO_D3
GPIO12
GPIO11
GPIO9
GND GND
GND
GND
GND
GND
GND
1
10
12
13
14
15
16
11
VIO_IN
For Debug only
R20
NU
RES1005
TP10TP11TP12TP13
WL_IRQ_1V8
WL_SDIO_D3_1V8
WL_SDIO_D2_1V8
WL_SDIO_D1_1V8
WL_SDIO_D0_1V8
WL_SDIO_CLK_1V8
WL_SDIO_CMD_1V8
NOTE
For reuse of the regulatory certification, a trace of 1-dB attenuation is required on the final
application board.
76.00mm
Figure 7-2. Location of Antenna and RF Trace Routing on the WL1835MODCOM8B Board
Layer 1
Layer 2 (Solid GND)
Module
COM8 Board
Figure 7-5 shows via array patterns, which are applied wherever possible to connect all of the layers to
the TI module central or main ground pads.
D3
D2
T3
D1
T1 T2
Time
(SeC)
Table 7-3 lists the temperature values for the profile shown in Figure 7-6.
NOTE
TI does not recommend the use of conformal coating or similar material on the WiLink 8
module. This coating can lead to localized stress on the WCSP solder connections inside the
module and impact the device reliability. Care should be taken during module assembly
process to the final PCB to avoid the presence of foreign material inside the module.
Bluetooth Service Pack for WL18xx (WL18XX-BT-SP) The Bluetooth Service Pack is composed of the
following four files: BTS file (TIInit_11.8.32.bts), ILI file (TIInit_11.8.32.ili), XML
(TIInit_11.8.32.xml), Release Notes Document, and License Agreement Note.
TI Bluetooth Linux Add-On for AM335x EVM, AM437x EVM and BeagleBone with WL18xx and
CC256x (TI-BT-STACK-LINUX-ADDON) The Bluetooth Linux Add-On package contains
the install package, pre-compiled object, and source of the TI Bluetooth Stack and Platform
Manager to easily upgrade the default LINUX EZSDK Binary on a AM437x EVM, AM335x
EVM, or BeagleBone. The software is built with Linaro GCC 4.7 and can be added to Linux
SDKs that use a similar toolchain on other platforms. The Bluetooth stack is fully qualified
(QDID 69886 and QDID 69887), provides simple command line sample applications to
speed development, and has MFI capability on request.
WiLink Wireless Tools for WL18XX Modules (WILINK-BT_WIFI-WIRELESS_TOOLS) The WiLink
Wireless Tools package includes the following applications: WLAN Real-Time Tuning Tool
(RTTT), Bluetooth Logger, WLAN gLogger, Link Quality Monitor (LQM), HCITester Tool
(BTSout, BTSTransform, and ScriptPad). The applications provide all of the capabilities
required to debug and monitor WiLink WLAN/Bluetooth/Bluetooth low energy firmware with a
host, perform RF validation tests, run pretest for regulatory certification testing, and debug
hardware and software platform integration issues.
Development Tools
WiLink 8 Proprietary Wi-Fi Driver – QNX, WinCE, Nucleus RTOS Baseline (WILINK8-WIFI-WAPI-
MCP8, WILINK8-WIFI-MCP8, WILINK8-WIFI-SIGMA-MCP8) The MCP package contains
the install package, precompiled object, and source of the proprietary Wi-Fi driver - QNX,
Nucleus, WinCE as well as ThreadX, FreeRTOS, µC, MQX ,RTX and uITRON RTOS
baseline image to easily integrate the TI WiLink Wi-Fi drivers. The integration is supported
through third party vendors. The WAPI package provides the WPA Supplicant patch to
support WAPI security protocol. The Sigma package provides the required APIs for WL8
code to support automated Sigma certification testing.
Package Designator
WL18XY Family MOC = LGA Package
X = 0/3
0 = WLAN only
3 = Bluetooth, WLAN Model
GB = 2.4 GHz Wi-Fi
Y = 1/5/7 GI = 5 GHz Wi-Fi
1 = 2.4 GHz SISO
5 = 2.4 GHz MIMO Module
7 = 2.4 GHz MIMO + 5 GHz MOD = module
8.4 Trademarks
WiLink, Sitara, E2E are trademarks of Texas Instruments.
ARM is a registered trademark of ARM Physical IP, Inc.
Airplay is a registered trademark of Apple Inc.
Bluetooth is a registered trademark of Bluetooth SIG.
Android is a trademark of Google, Inc.
IEEE Std 802.11 is a trademark of IEEE.
Linux is a registered trademark of Linus Torvalds.
Wi-Fi is a registered trademark of Wi-Fi Alliance.
ZigBee is a registered trademark of ZigBee Alliance.
All other trademarks are the property of their respective owners.
8.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
W T W
e4 e5 e2
e3 d2
d1 e1
L L
e6
Pin 2 Indicator
a3
c2 c3
b1 4 3 2 1
b2 a1 c1
b3 a2
Bottom View Side View Top View
Table 9-1 lists the dimensions for the mechanical outline of the device.
NOTE
The TI module weighs 0.684 g typical.
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E
Do
F
Pin 1
W
T P
C0.5
5.00°
Ko
Ao = Bo
330.00±2.0 2.20±0.7
100.00±1.5
W1
W2
Copyright © 2013–2017, Texas Instruments Incorporated Mechanical, Packaging, and Orderable Information 43
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360 45
572
370
NOTE
The size of the shipping box may vary depending on the number of reel boxes packed.
616
362
354 250
1,243
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Copyright © 2013–2017, Texas Instruments Incorporated Mechanical, Packaging, and Orderable Information 45
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Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD
WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD
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46 Mechanical, Packaging, and Orderable Information Copyright © 2013–2017, Texas Instruments Incorporated
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PACKAGE OUTLINE
MOC0100A QFM - 2.0 mm max height
QUAD FLAT MODULE
13.4 A
B 13.2
PIN 1
INDEX AREA 13.5
13.3
C
2 MAX
0.08 C
2X 11.95
2X 9.8
7.7
TYP
17 56X
33
0.7
G6 G36
60X 0.8
0.7
2X 12.05
G1
60X 0.45
0.35
G7 G19 G31
0.1 C A B
1 0.05 C
64 49
PIN 2 0.8
ID 4X 0.7 SYMM
1.05 (1.4) TYP
36X 0.95 4221006/B 10/2016
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pads must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
MOC0100A QFM - 2.0 mm max height
QUAD FLAT MODULE
2X (11.95)
64
1 49
2X
(12.05)
SYMM
56X (0.7)
(1.05) TYP
(1.4) TYP
60X (0.75)
60X (0.4)
G6 G12 G18 G24 G30 G36
(1.05) TYP (1.4) TYP
17 33
4X (0.75)
36X (1) SYMM
0.05 MIN
ALL AROUND
SOLDER MASK
SOLDER MASK DETAILS OPENING
SOLDER MASK
DEFINED
METAL UNDER
SOLDER MASK
(R0.05) TYP
4221006/B 10/2016
NOTES: (continued)
4. This package is designed to be soldered to thermal pads on the board. For more information, see Texas Instruments
literature number SLUA271 (www.ti.com/lit/slua271) .
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
6. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, it is recommended
that vias under paste be filled, plugged or tented.
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EXAMPLE STENCIL DESIGN
MOC0100A QFM - 2.0 mm max height
QUAD FLAT MODULE
2X (11.95)
64
1 49
60X (0.75)
2X
(12.05)
SYMM
56X (0.7)
(1.05) TYP
(1.4) TYP
SEE DETAIL B
17 33
SYMM
SEE DETAIL A
4221006/B 10/2016
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations..
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