Electrical and Electronic
Electrical and Electronic
Electrical and Electronic
®
Electrical and Electronic Electrical and Electronic ®
www.epotec.info
www.adityabirlachemicals.com
Bangkok Office
888/160-161, 16th Floor, Mahatun Plaza Building,
Ploenchit Road, Bangkok 10330, Thailand.
Tel. (66 2) 253 5031-3
Fax. (66 2) 253 5030
Email. [email protected]
Rayong Plant
Map Tha Phut Industrial Estate, No. 2, I-5 Road,
A. Muang, Rayong 21150, Thailand.
Tel. (66 38) 685 233-4
Fax. (66 38) 683 982
The Company endeavors to ensure all information is correct at the time of printing.
Information in this document ‘Epotec® Epoxy Systems - Electrical and Electronic’ is subject
to change without notice.
02-0410
Transcending the conventional barriers of business
to send out a message that “We Care”
A US $29.2 billion corporation, the Aditya Birla Among the world’s top 15 BPO companies and
Group is in the League of Fortune 500. It is among India’s top 4.
anchored by an extraordinary force of 130,000 Among the best energy efficient fertilizer plants.
employees, belonging to 30 different nationalities.
In India, the Group has been adjudged “The Best In India
Employer in India and among the top 20 in Asia” by A premier branded garments player.
the Hewitt-Economic Times and Wall Street Journal
The 2nd largest player in viscose filament yarn.
Study 2007. Over 60 per cent of its revenues flow
The 2nd largest in the Chlor-alkali sector.
from its overseas operations.
Among the top 5 mobile telephony companies.
The Group operates in 25 countries - India, UK, A leading player in Life Insurance and Asset
Germany, Hungary, Brazil, Italy, France, Management.
Luxembourg, Switzerland, Australia, USA, Canada, Among the top 3 super-market chains in the Retail
Egypt, China, Thailand, Laos, Indonesia, business.
Philippines, Dubai, Singapore, Myanmar,
Bangladesh, Vietnam, Malaysia and Korea.
Beyond Business
A Global Perspective The Aditya Birla Group is working in 3,700 villages,
reaching out to 7 million people annually through
A metals powerhouse, among the world’s most
the Aditya Birla Centre for Community Initiatives and
cost-efficient aluminium and copper producers.
Rural Development, spearheaded by Mrs.
Hindalco-Novelis is the largest aluminium rolling
Rajashree Birla. The Group’s functions span 42
company. It is one of the 3 biggest producers of
schools and 18 hospitals, furthering its focus on
primary aluminium in Asia, with the largest single
health care, education, sustainable livelihood,
location copper smelter.
infrastructure and social causes.
No. 1 in viscose staple fibre.
The 4th largest producer of insulators. For more information visit www.adityabirla.com
The 4th largest producer of carbon black.
The 11th largest cement producer globally, the 7th
largest in Asia and the 2nd largest in India.
Thai Epoxy and Allied Products Company Limited The Company offers a wide range of epoxies and
(Thai Epoxy), has recently been transformed to the modifiers that vary in chemical structure, molecular
Epoxy Division of Aditya Birla Chemicals (Thailand) weight, viscosity and functionality. All products are
Limited. It is part of the Aditya Birla Group of marketed under the trade name of Epotec®,
Companies. Being the pioneer manufacturer of including liquid, solid, solutions, blends and other
epoxy resins in the ASEAN region, the Company multifunctional epoxy resins. Epoxy Resin, a
constitutes its success on its Specialized Epoxy performance polymer, is a versatile resin which
Systems and its complete in-house Research and finds application in adhesives, civil engineering,
Application Development Center. Sustainability has composites, casting and encapsulation of electrical
also been achieved through its group-wide unique components, and coatings including protective,
World Class Manufacturing (WCM) strategy for marine, floor, powder, can and coil.
enterprise excellence.
The Company stretches its business arms in all six
Located within the prestigious Map Tha Phut continents of the globe.
Industrial Estate at Rayong Province in Thailand, the
Company started commercial production in 1992
with technology from Tohto Kasei Company Limited,
Japan’s largest producer of epoxy resins. The
Company is currently accredited and certified with
ISO 9001:2000 and ISO 14001 in recognition of its
quality and environment management systems.
008 008
4 Epotec® Epoxy Systems | Electrical and Electronic Epotec® Epoxy Systems | Electrical and Electronic
5
Castings
In this technique, a mold is prepared to give the proper dimensions to the finished part. The molds are designed
to provide minimum internal stresses as the resin shrinks during curing. The resin, curing agent and fillers are
mixed and poured slowly into the mold, preferably in a vacuum to avoid air entrapment. The entire assembly is
then cured either at room temperature, by its own exothermic heat or in an oven. The part is then released from
the mold. Castings technique is divided into the following subcategories:
Vacuum Casting
In this process, epoxy compound, including resin,
7 curing agent and filler, are poured under gravity into
steel molds under vacuum. Partially cured
4 5 6
® components are demolded and post curing is
performed in oven.
3 3 3
7 1 Autoclave
2 Static Mixer / Buffer Tank
2
3 Dosing Pump
4 Resin Tank
Processes & Applications
5 Flexibilizer / Accelerator Tank
1
Epotec® Epoxy Systems are best known for casting Encapsulation 8 6 Curing Agent Tank
into molds, cavities, cores and patterns. They are Encapsulation is a method of providing a protective 7 Vacuum Plant
also extensively used for encapsulation coating on the inside of coils, closed-packed 8 Control Panel
(encapsulation and embedment are frequently used electronic assemblies and wire bundles. For
inter-changeably), impregnation and protection of saturation of components it is essential to select
electrical and electronic assemblies and Epotec® Resins of high flow and high wetting
components. Usually low-pressure-reacted resins properties. The components finally are surrounded Automation Pressure Gelation (APG) or Liquid
are utilized and curing is performed at room by a thin film of resin. Components encapsulated in Injection Molding (LIM)
temperature to elevated temperature, up to 200°C. this manner maintain high electrical insulation, In this process, the liquid epoxy compound,
Room temperature curing Epotec® Systems are excellent environmental protection against heat, premixed with fillers and additives, is directly
preferred for low voltage, small components, while moisture and chemicals, and also protect 6 pumped into a split mold which is v-mounted on a
heat-cured Epotec® Systems offer extremely high microelectronic assemblies with their fine inter- clamping machine. Only gelling step is allowed in
physical, thermal and chemical resistance. As such, connection. 4 5 the mold and final curing of component is
heat-cured Epotec® Systems are used for medium 6 performed in separate oven. This method allows to
and high voltage applications. Impregnation compensate for chemical shrinkage and is used
Encapsulation is more of a coating process which extensively for mass production of insulating
There are few common process techniques for use allows minimum penetration of resin into compact components for electrical industries.
3 3
of Epotec® Epoxy Resins in electrical and electronic assemblies, whereas impregnation is a process
components. specifically designed to ensure that the liquid resin 1 APG Clamping Unit
has completely entered into interstices of assembly 2 Static Mixer
2 2
Pottings prior to curing. Some transformer and electronic
3 Dosing Unit
Potting is a variation of casting in which the equipment manufacture requires both encapsulation
7 1 1 4 Resin Mixing Tank
prefabricated mold, a thin shell of metal or plastic, and impregnation.
5 Curing Agent Mixing Tank
becomes an integral part of the finished product.
6 Vacuum Plant
The resin is fluid enough to flow around the
components being embedded and fills all voids, 7 Control Panel
including the container. Potting is used frequently to
reduce weight, avoid breakdown and prevent failure
NOTE: The above diagrams only demonstrate a simple representation
due to moisture and vibration in components. of the associated processes. This is only for a purpose of reference,
and may not be accurate in terms of details and scaling.
6 Epotec® Epoxy Systems | Electrical and Electronic Epotec® Epoxy Systems | Electrical and Electronic
7
Castings
In this technique, a mold is prepared to give the proper dimensions to the finished part. The molds are designed
to provide minimum internal stresses as the resin shrinks during curing. The resin, curing agent and fillers are
mixed and poured slowly into the mold, preferably in a vacuum to avoid air entrapment. The entire assembly is
then cured either at room temperature, by its own exothermic heat or in an oven. The part is then released from
the mold. Castings technique is divided into the following subcategories:
Vacuum Casting
In this process, epoxy compound, including resin,
7 curing agent and filler, are poured under gravity into
steel molds under vacuum. Partially cured
4 5 6
® components are demolded and post curing is
performed in oven.
3 3 3
7 1 Autoclave
2 Static Mixer / Buffer Tank
2
3 Dosing Pump
4 Resin Tank
Processes & Applications
5 Flexibilizer / Accelerator Tank
1
Epotec® Epoxy Systems are best known for casting Encapsulation 8 6 Curing Agent Tank
into molds, cavities, cores and patterns. They are Encapsulation is a method of providing a protective 7 Vacuum Plant
also extensively used for encapsulation coating on the inside of coils, closed-packed 8 Control Panel
(encapsulation and embedment are frequently used electronic assemblies and wire bundles. For
inter-changeably), impregnation and protection of saturation of components it is essential to select
electrical and electronic assemblies and Epotec® Resins of high flow and high wetting
components. Usually low-pressure-reacted resins properties. The components finally are surrounded Automation Pressure Gelation (APG) or Liquid
are utilized and curing is performed at room by a thin film of resin. Components encapsulated in Injection Molding (LIM)
temperature to elevated temperature, up to 200°C. this manner maintain high electrical insulation, In this process, the liquid epoxy compound,
Room temperature curing Epotec® Systems are excellent environmental protection against heat, premixed with fillers and additives, is directly
preferred for low voltage, small components, while moisture and chemicals, and also protect 6 pumped into a split mold which is v-mounted on a
heat-cured Epotec® Systems offer extremely high microelectronic assemblies with their fine inter- clamping machine. Only gelling step is allowed in
physical, thermal and chemical resistance. As such, connection. 4 5 the mold and final curing of component is
heat-cured Epotec® Systems are used for medium 6 performed in separate oven. This method allows to
and high voltage applications. Impregnation compensate for chemical shrinkage and is used
Encapsulation is more of a coating process which extensively for mass production of insulating
There are few common process techniques for use allows minimum penetration of resin into compact components for electrical industries.
3 3
of Epotec® Epoxy Resins in electrical and electronic assemblies, whereas impregnation is a process
components. specifically designed to ensure that the liquid resin 1 APG Clamping Unit
has completely entered into interstices of assembly 2 Static Mixer
2 2
Pottings prior to curing. Some transformer and electronic
3 Dosing Unit
Potting is a variation of casting in which the equipment manufacture requires both encapsulation
7 1 1 4 Resin Mixing Tank
prefabricated mold, a thin shell of metal or plastic, and impregnation.
5 Curing Agent Mixing Tank
becomes an integral part of the finished product.
6 Vacuum Plant
The resin is fluid enough to flow around the
components being embedded and fills all voids, 7 Control Panel
including the container. Potting is used frequently to
reduce weight, avoid breakdown and prevent failure
NOTE: The above diagrams only demonstrate a simple representation
due to moisture and vibration in components. of the associated processes. This is only for a purpose of reference,
and may not be accurate in terms of details and scaling.
6 Epotec® Epoxy Systems | Electrical and Electronic Epotec® Epoxy Systems | Electrical and Electronic
7
®
Typical Properties of Epotec® Epoxy Systems for Electrical and Electronic Applications
Resin 100 pbw1 YDC 6001 YDC 6002 YDC 6004 YDC 6015 YDC 6003 YDC 6003 YDC 6030 YDC 6006 YDH 184 YDH 184 YDH 184M1 YDC 6020i YDC 6029 YDC 6018
Curing Agent pbw1 TH 7656 / 30 TH 7656 / 30 TH 7657 / 100 TH 7652 P1 / 80 TH 7658 / 80 TH 7662 / 80 TH 7670 / 82 TH 7269 / 9 - 10 TH 7351 / 90 TH 7356 / 90 TH 7356P / 80 TH 7652i / 32 TH 7668 / 30 TH 8251 / 18
Accelerator pbw1 - - TA 7852 / 1 - - - TA 7854 / 0.5 - 2 - TA 7851 / 0.5 - 3 TA 7851 / 0.5 - 2 - TA 7851 / 1.5 - -
Flexibilizer pbw1 - - TP 01 / 10 TP 01 / 0 - 8 - - - - - - - - - -
Filler (silica flour 300 mesh) pbw1 200 200 400 320 - 350 270 270 270 150 300 270 270 Prefilled Prefilled Prefilled
Filler loading (pbw1 filler) % 61 61 65 65 60 60 60 58 61 61 61 - - -
Curing condition Hot Cure Hot Cure Hot Cure Hot Cure Hot Cure Hot Cure Hot Cure Ambient Cure Hot Cure Hot Cure Hot Cure Hot Cure Hot Cure Ambient Cure
Processing technique CVC CVC CVC CVC, PG, APG CVC, PG, APG CVC, PG, APG CVC, APG CVC CVC, PG, APG CVC, PG, APG CVC, PG, APG CVC CVC CVC
Processing temperature ˚C 120 - 140 120 - 140 Ambient - 80 Ambient - 80 Ambient - 80 Ambient - 80 60 - 80 Ambient 40 - 80 40 - 80 40 - 80 60 - 80 60 - 80 RT
Initial viscosity of mix mPa s/˚C 1,900 / 120 4,000 / 120 1,500 / 80 10,000 / 60 40,000 / 40 70,000 / 40 1,700 / 60 8,500 / 25 1,000 / 80 100 / 80 6,400 / 25 700 - 900 / 25 2,500 - 3,500 / 25 -
500 / 140 2,500 / 140 - 1,500 / 80 1,000 / 80 1,500 / 80 - - - - 3,000 / 40 - - -
- - - - - - - - - - 700 / 60 - - -
- - - - - - - - - - - - - -
Pot life of mix (< 5kg) h/˚C 6 / 120 1 / 120 14 / 40 24 - 48 / 25 15 / 40 15 / 40 24 - 48 / 25 0.5 / 25 1 / 80 4 / 60 4 / 60 24 - 36 / 25 24 - 36 / 25 0.5 / 25
- 0.5 / 140 1.5 / 80 - 2 / 80 2 / 80 - (100g mix) - 1 / 80 1 / 80 - - -
Gel time min/˚C 780 / 110 160 / 120 100 / 80 20 / 120 285 / 80 270 / 80 80 - 90 / 120 - 4 / 140 4 / 140 11 / 120 40 / 80 115 - 150 / 80 -
330 / 130 60 / 140 35 / 100 - 14 / 120 15 / 120 25 - 30 / 140 - 3 / 150 3 / 150 5 / 140 4 / 120 30 - 40 / 100 -
150 / 150 - 15 / 120 - 8 / 140 8 / 140 - - 2 / 160 2 / 160 - - - -
Minimum cure time h/˚C 16 / 140 14 / 140 3 / 120 10 / 140 6 / 80 + 10 / 130 6 / 80 + 10 / 130 6 / 80 + 10 / 130 6 / 80 6 / 80 + 10 / 140 6 / 80 + 10 / 140 6 / 80 + 10 / 140 4 / 80 + 2 / 130 4 / 80 + 2 / 130 24 / RT
8 Epotec® Epoxy Systems | Electrical and Electronic Epotec® Epoxy Systems | Electrical and Electronic
10
Important Considerations for Epotec® Resins
The epoxy casting resins, generally, are liquids at processing temperature when combined with the curing
agents. The mixture is cured at room or elevated temperature to the thermoset state. There are a number of
common considerations involved in achieving good, solid, crack-free, bubble-free castings. These include:
Exotherm
Exotherm is the increase in temperature of this service because of relatively poor thermal
compound above the cure temperature due to stability. To obtain satisfactory thermal shock
energies released as the epoxy group reacts. For resistance for severe thermal cycling, sophistication
fast resins it is quite possible for the center of a in the formulation is required. Initial stresses caused
casting to generate bubbling due to vapor pressure, by shrinkage and cure temperature should be
and which lead to char and explodes in extreme minimized. Reversible stresses caused by the
conditions. expansion characteristics of the compound should
be reduced to the level of practical.
Reactivity
Reactivity of epoxy resins while curing ideally obeys Thermal Stability
Arrhenius’ law which in effect states “For every 10°C Thermal stability indicates the ability of the resin to
rise in temperature, the reaction rate doubles”. serve at elevated temperature and maintain
Hence, if a compound will gel in 30 minutes at room minimum specified properties. With elevated
temperature of 25°C then if warmed to 35°C, it will temperature aging there is generally a progressive
gel in approximately 15 minutes; at 45°C, in 7½ loss of strength and an overall reduction in
minutes. Thus when heat is used as a means of properties. Often there is progressive embrittlement
achieving low viscosity, reactivity becomes an because of loss of volatile fragments and increased
opposing factor. cross-linking. As temperature is further increased
surface charing will occur, followed by cracking and
Shrinkage decomposition.
Shrinkage is the reduction in volume or in linear
dimensions observed during cure. Shrinkage Vapor Pressure
induces stresses which can damage pressure The temperature at which the vapor pressure
sensitive inserts or which can lead to crack under equals the surrounding or atmospheric pressure,
thermal cycling. the boundary between the gas and liquid
disappears and the substance boils. If epoxy
Thermal Expansion compound becomes too hot, this may lead to
Thermal expansion characteristics are the function generation of gas bubbles trapped in the cured
of epoxy resin, curing agent, modifiers, and fillers structure.
present in formulation. In general, the more highly
flexibilized the compound, the higher the expansion Viscosity
rate; the more highly filled the lower the expansion The viscosity of resin controls the quantity of filler
rate. Ideally the expansion rate of the resin should and determines the viscosity of formulated
be matched to those of the inserts present or should compound. In order to assist removal of air bubbles
provide an intermediate value in the case of different from compound and to obtain a desired, void-free
expansion rate of the inserts. structure, it is often desirable to have low viscosity
at processing temperature.
Thermal Shock
Thermal shock is a severe problem with rigid epoxy
resin system. The problem is magnified when higher
temperature operation is required, in so far as many
flexible systems are inherently unsuited for
Dissipation Factor
The ratio of the power loss in a
dielectric material to the total power
transmitted through the dielectric.
Disclaimer
This brochure is designed to provide you with information to the Epotec® range of Products referred to, and should be read in
conjunction with the latest Technical Data Sheets (TDS) and Material Safety Data Sheets (MSDS), and may not be construed
as legally binding. Nothing contained herein constitutes an offer for the sale of any product. The Company makes no
warranties, either expressed or implied, with respect to its product or the results of its use, or with respect to any information
provided by the Company.
Because of changes in conditions and circumstances the Company reserves the right, subject to all applicable laws, at any
time, at its discretion, and without notice, to discontinue or change the specifications and the prices of their products, and to
either permanently or temporarily withdraw any such products from the market without incurring any liability to any prospective
purchaser or purchaser. It is the sole responsibility of the user to test our products for suitability in the intended use. Always
consult an authorized Epotec® representative for the latest information with respect to specifications, prices, and availability.
®
Electrical and Electronic Electrical and Electronic ®
www.epotec.info
www.adityabirlachemicals.com
Bangkok Office
888/160-161, 16th Floor, Mahatun Plaza Building,
Ploenchit Road, Bangkok 10330, Thailand.
Tel. (66 2) 253 5031-3
Fax. (66 2) 253 5030
Email. [email protected]
Rayong Plant
Map Tha Phut Industrial Estate, No. 2, I-5 Road,
A. Muang, Rayong 21150, Thailand.
Tel. (66 38) 685 233-4
Fax. (66 38) 683 982
The Company endeavors to ensure all information is correct at the time of printing.
Information in this document ‘Epotec® Epoxy Systems - Electrical and Electronic’ is subject
to change without notice.
02-0410