Glenn Okamoto ASIC Engr Resume SJ
Glenn Okamoto ASIC Engr Resume SJ
Glenn Okamoto ASIC Engr Resume SJ
SKILLS:
WORK EXPERIENCE:
19 November 2018 – 30 April 2020 Hcl Asic Engineer at customer worksite, Intel, 75
reed rd, Hudson, MA 19227
16 May – 21 August 2016 independent ASIC Engineer contractor, worked from Santa
Clara, CA, client=Synaptics
1 February-18 March 2016 independent ASIC Engineer contractor, worked from Santa
Clara, CA, client=ST Microelectronics
22 December 2015-12 April 2016 independent ASIC Engineer contractor, worked from
Santa Clara, CA, client=Esencia Tech
• Synopsys Tetramax/DFTMAX scan test pattern generation for 2
post-tapeout chips (passed zero delay sim, passed min/max SDF delay sim, passed
on tester)
• Synopsys Verilog Cycle Simulation (VCS) (passed zero delay sim,
passed min/max SDF delay sim)
25 April 2011-15 June 2012 Kelly ASIC Engineer contractor at customer worksite, Santa
Clara, CA
26 June 2006-25 June 2007 Volt ASIC Engineer contractor at customer worksite, Fort
Collins, CO
• Proved rtl=gate level functional logic using Synopsys Formality
• Encrypted QPI, FBD, PCIE serdes component design for use in
customer chips.
• Worked with transistor-level circuit design and simulation
• Fort Collins, CO dc and ac test vector generation ATPG using
Synopsys Tetramax and Mentor Graphics Fastscan, dc and ac jtag and functional
loopback test vector generation, reported and fixed problems in gate-level netlist
that I received, test vector simulation using Cadence NC verilog and Synopsys
vcs, ran Spyglass, worked on 90nm chip with 12 GHz Quick Path
Interface/Common System Interface (CSI) for serdes i/o, pcie2 serdes i/o, fully
buffered dimm (fbd) serdes i/o
6-17 February 2006 Oxford ASIC Engineer contractor at customer worksite, Newport
Beach, CA
• Scan insertion, ATPG, and ram bist ram wrapper generation and
ram bist insertion fixes using Mentor Graphics DFTAdvisor and MBISTArchitect,
reported and fixed problems in gate-level netlist that I received, JTAG and ram
BIST simulation using Modelsim
EDUCATION:
• 1993-1994 Master of Science (MS) Computer Engineering,
GPA=3.7, Syracuse, NY (to include transistor-level digital circuit design, A in C+
+ class (Object Oriented Analysis))
• 1989-1995 Master of Science Electrical Engineering (MSEE),
GPA=3.4, NC A&T State University, Greensboro, NC (to include transistor-level
digital circuit design, simulation with spice, use of AutoCAD and OrCAD for
electronics drawings)
• 1980-1984 Bachelor of Science (BS) dual concentration Electrical
Engineering + Chemistry, GPA=3.4, US Military Academy, West Point, NY
DESIGNS:
• digital mass production test interface (Small electronics company)
• pci interface fifo (IBM)
• on-chip-memory & processor bus interface (IBM)
• clocks to include PLLs (IBM, Kawasaki LSI, Small electronics
company)
• encryption/decryption (school)
REFERENCES: