Schematic Diagram NP Q70

4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
Table of Contents
D Page. 1 COVER D
Page. 2 OPERATION BLOCK DIAGRAM
Page. 3 POWER DIAGRAM
Page. 4 POWER SEQUENCE DIAGRAM
Page. 5 POWER RAIL
Page. 6 CLOCK DISTRIBUTION
TORINO 2 Page. 7 BOARD INFORMATION
g
Page. 8 CLOCK GENERATOR (CK-505)
PCB Thinckness:1mm Page. 9~10 MEROM
Page. 11 THERMAL MONITOR
n
Page. 12~16 CRESTLINE (965GM)
l
CPU :INTEL MEROM Page. 17 DDR2 SODIMM (TOP)
u
Page. 18 DDR2 SODIMM (BOTTOM)
a
Chip Set :INTEL 965GM & ICH8-M Page. 19 DDR2 TERMINATION
s i
C Page. 20~23 DISCRETE GFX (NB8M-SE & GDDR3) C
Page. 24~27 ICH8-M
t
Remarks :w/o INTEL AMT Page. 28 LCD(LVDS) CONN.
2 SODIMMs Page. 29 CRT CONN.
m n
Page. 30 HDD & ODD CONNECTOR
Page. 31 MICOM
a e
Page. 32 LAN CONTROLLER (10/100M)
Model Name : TORINO 2 Page. 33 ROBSON
Page. 34 USB PORT, MDC CONN. & BLUETOOTH
S fid
PBA Name : MAIN Page. 35 MINI CARD SOCKET (WLAN/HSDPA/WIBRO)
Page. 36 CARDBUS CONTROLLER(1) & 4IN1
PCB Code : BA41-00727A / 728A Page. 37 CARDBUS CONTROLLER(2) & 1394(4P)
Page. 38 PCMCIA SOCKET
Dev. Step : MP
n
Page. 39 AUDIO CODEC
B Page. 40 AUDIO AMP B
Revision : 1.1 Page. 41 AUDIO JACK
o
Page. 42 CHARGER
T.R. Date : 2007.04.10 Page. 43 P3.3V_AUX & P5V_AUX
C
Page. 44 DDR2 POWER
Page. 45 CPU VRM POWER
Page. 46 P1.25V & P1.05V POWER
Page. 47 GFX CORE & P1.5V POWER
DRAW CHECK APPROVAL Page. 48 SWITCHED POWER
Page. 49 POWER S/W, DMB, DEBUG & KEYBOARD CONN.
Page. 50 LEDS & TOUCHPAD
Page. 51 MOUNT HOLE
- - - Page. 52 TEST POINTS
Page. 53 REVISION HISTORY
A A
DRAW DATE TITLE
CHECK
ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
ELECTRONICS
GUO LEI MP COVER
APPROVAL REV PART NO.
CONTENTS
KEVIN LEE 1.1 BA41-00727/8A
MODULE CODE LAST EDIT
March 28, 2007 3:33:29 PM PAGE 1 OF 54

4 3 2 1
COM-22C-015(1996.6.5) REV. 3 D:/users/mentor/Torino2/MP/T2_MP1.1_0410
4 3 2 1
SAMSUNG PROPRIETARY
OPERATION BLOCK DIAGRAM
mPGA479M Socket-M FAN CONTROL
D
THERMAL D
CLOCK
GENERATOR CPU CPU2_THERMDA/DC
MONITOR Page 11
MEROM-4M MAX6695
CK-505 Page 11
Page 9,10
Page 8
TFT_LCD
12.1" WIDE 800MHz FSB (CeleronM:667MHz) SODIMM0 (TOP)
1280 X 800 MAX 2 GB
1299 uFCBGA Type
g
CHANNEL A Page 17
Page 28 LVDS GMCH 667/533 MHz
VGA
n
CRT 965GM/PM
Page 29 Discrete Gfx. CHANNEL B
l
nVidia G3-64 Family CRESTLINE SODIMM1 (BOTTOM)
667/533 MHz
u
GDDR3 128MB 64bit
MAX 2 GB
K4J52324QC-BC14 NB8M-SE Page 12~16
PCI-E X16
a
Page 27 Page 18
s i
C C
DMI X4 C-Link0
t
LOM
MDC
RJ11
10/100M
PCI-E
676 FCBGA Type AZALIA Module
RJ45
Marvell PCI-E Lane2

LAN Transformer
m n
Page 34
88E8039 Page 35
Page 32,33 ICH
EXTERNAL MIC
PCI
JACK
e
3722-001822 3301-001629
ICH8 - M AUDIO CODEC HEADPHONE
1394 IEEE1394
4pin 82801 HBM IDE
CardBus ALC262
S fid
Page 38 Page 38 MS / SD / MMC / xD Controller SATA Page 40 Internal MIC
RICOH R5C847
USB2.0 Page 23~26
MultiMedia Crad PCMCIA
Audio AMP
SPEAKER
L
6in1 B’d Page 37,38
LPC SPI D-Class
Page 37
RTC MAX9715
n
2P
Batt.
R
Page 41
Page 18
B SPI EEPROM B
Intel ROBSON
o
PCMCIA
PCI-E Lane4 AT25080
Page 33
Page 39 Page 24
PCI-E Lane1 Page 30 Page 30
C
USB PORT 3 KBC On TOP B’D
H8S - 2110B HDD ODD MASTER
Power S/W Sub-B’D
Page 31 with MIO, LID S/W
PCI-E Lane3
GOLAN / Kerdon HSDPA
802.11abg/abgn /Wibro USB PORT 5 2.5inch
Page 36 Page 36 USB PORT 6 SATA only
Space bar
KEYBOARD
A A
DMB Module BLUETOOTH CAMERA PS/2 SYNAPTICS
PORT 7 TOUCHPAD DRAW DATE TITLE
PORT 0 PORT 1 PORT 2 PORT 4 ZHOU JUN 4/10/2007

TORINO 2 SAMSUNG
CHECK DEV. STEP
USB (Right) USB (Back) GUO LEI MP MAIN
ELECTRONICS
Page 35 Page 35 Page 48 Page 35 APPROVAL REV

BLOCK DIAGRAM
PART NO.

March 28, 2007 3:33:29 PM PAGE 2 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
EXCEPT AS AUTHORIZED BY SAMSUNG. POWER DIAGRAM
D D
ALWAYS ON KBC3_SUSPWR KBC3_PWRON KBC3_VRON P3.3V Clock Gen.
P3.3V_AUX
P3.3V_AUX LOM
3.3V Core
LDO 3.3V CTRL_18
0.8V CPU IO FET
1.8V
CTRL12_25
FET
2.5V
P5.0V_AUX P5.0V CPU_CORE
DDR2 Power VRM ICH8-M USB CPU
ICH8-M CRT Touchpad P1.05V Vcc_CORE
MICOM FAN VCCP P5.0V HDD / ODD

PCMCIA HDD P1.5V VCCA 5V
AC Adapter P3.3V 3.3V
19V
VDC P3.3V_AUX P3.3V P1.05V Crestline GM/PM
g
1.05V MCHCore P3.3V_AUX SPI
Battery DC ICH8M 965GM Thermal Sensor P1.25V 1.05V FSB, PEG 3.3V VCC
11.1V MDC ICH8-M R5C843 1.05V DDRHSIO, DDRDLL
MINICARD CK505 BlueTooth P1.5V 1.05V ME
LOM MICOM LEDs P3.3V_AUX
n
0.7V~1.25V Vgfx Thermal Sensor
SODIMM LCD P1.8V_AUX 1.25V DPLL, DMI 3.3V VCC
HDD MINICARD 1.25V MLINK, HPLL
P12.0V_ALW SPI
l
1.5V VCCDTV/CRT
SWITCHED POWER 1.8V DDRIO P5.0V FAN

P3.3V
u
1.8V LVDSIO 5V VCC
P2.5V 3.3V TV/CRT IO, PXPBG
a
G7xM
P3.3V P3.3V LCD
P5.0V_ALW
s
DDR2
i
3.3V VDD
C MAX1999 P1.8V_AUX 3.3V SPD VDC 12V Inverter VDC
C
P1.5V 1.8V VDDQ
P0.9V
t
MEROM 0.9V Vref, Vtt
965GM P5.0V CRT

ICH8-M 5V VCC
P3.3V_MICOM GFX_CORE Discrete GFX
m
MICOM 1.0V~1.1V VDD Core
n
P1.8V_AUX P0.9V P1.2V 1.2V PEX Core, IO, PLL P3.3V_MICOM MICOM
SODIMM (DDR II) DDR II-Termination 1.2V FBA PLL 3.3V VCC
RTC Battery 965GM P2.5V 1.2V Core Clock PLL Digital P5.0V 5V VccB
3V 2.5V Core Clock PLL Analog
a
P1.8V
e
ICH8-M 2.5V VID PLL
P1.8V 1.8V FBVDDQ P3.3V_AUX MDC
NB8M-SE P3.3V 1.8V LVDSIO 3.3V VCC
GDDR3 3.3V VDD3_3
3.3V DAC VDD P5.0V AUDIO
S fid
3.3V MIO VDDQ 5V AVDD
P3.3V 3.3V DVDD
P1.25V
965GM P1.8V GDDR3
ICH8-M 1.8V VDDQ P3.3V Bluetooth
0.9V VREF 3.3V VCC
P1.2V
NB8M-SE
P5.0V USB (2 Ports)
PRTC
n
RTC 5V VCC
VccRTC
ICH8-M Base
P1.05V
B MEROM P3.3V LAN P5.0V DMB B
965GM VccLAN3_3 5V
1.05V AUX LDO LAN100_SLP
o
ICH8-M VccLAN1_05 P3.3V 3.3V
VccGLAN3_3
VccGLAN1_5 P3.3V
GFX_CORE P1.5V MINI CARD
NB8M-SE CL P1.5V 3.3V
VccCL3_3 1.5V
C
1.05V EP LDO P3.3V_AUX
VccCL1_05 3.3V AUX
VccCL1_5 1.5V EP LDO INTVRMEN
CPU_CORE
MEROM P5.0V_AUX Resume P3.3V CARDBUS
V5REF_Sus 3.3V
P3.3V_AUX VccSus3_3 1.8V (Internal VR)
1.05V Sus LDO
VccSus1_05
VccSus1_5 1.5V Sus LDO P3.3V
P3.3V
S5 / S4 S3 S0 P5.0V Core
DIAMOND
VDD P3.3V_AUX
LEDS
3.3V SCL, NUM, CAP
V5REF P1.5V AVDD 3.3V WLAN
P1.05V Vcc3_3 P3.3V_MICOM 3.3V POWERON
Vcc1_05 3.3V ACIN
P1.25V Vcc1_5 P3.3V NAND FLASH
VccDMI 1.8V VCC
Rail
State +V*Always +V*AUX +V SUSPWR PWRON VRON
Full On ON ON ON H H H
A S3 ON ON OFF H L L
A
S4 ON OFF OFF H L L DRAW DATE TITLE
S5 ON OFF OFF L L L CHECK

ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
ELECTRONICS
GUO LEI MP MAIN
POWER DIAGRAM
March 28, 2007 3:33:29 PM PAGE 3 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
POWER SEQUENCE Rev. 0.1
D D
3) P12V_ALWS
2) VDC ALWAYS 3) P5V_ALWS PRTC
POWER 3) MICOM_P3V
7) P3.3V_AUX INTVRMEN
7) P1.05V_AUX
g
PRTC
4) KBC3_RST*
RST Circuit RES# 7) P5V_AUX 7) P1.5V_AUX EN
5) KBC3_CHKPWRSW* 7) P1.5V_CL
POWER S/W LAN100_SLP
n
ONTOP B’D
* KBC3_LANRST# assert 100ms after LAN Power stable 7) P1.05V_CL 1-1) PRTC_BAT
6) KBC3_SUSPWRON EN
RTC
7) P1.05V_LAN
1-2) CHP3_RTCRST*
l
RTCRST# Battery
8) SUSPWRGD 9) KBC3_RSMRST*
u
10ms Delay
RSMRST#
10-1) CHP3_SLPS4*/S5* SLP_M#
18) CLK3_PWRGD* CLOCK 19) Clock Running
a
11) KBC3_PWRON SLP_S3#
CK_PWRGD
10-2) CHP3_SLPS3* SLP_S4# CK505
s i
C S4_STATE# C
13) VCCP_PWRGD 99ms Delay 17) VRM3_CPU_PWRGD SLP_S5#
VRMPWRGD 21) CPU1_PWRGDCPU
t
CPUPWRGD
20) KBC3_PWRGD PWROK PWRGOOD
CLPWROK CL_RST#
20) KBC3_PWRGDMCH SUS_STAT# PLTRST# 16) VCC_CORE CPU
PCIRST# RESET#
m
15) KBC3_VRON ICH8-M
7) P3.3V_AUX
MICOM
a e n 22) PLT3_RST*
23) CPU1_CPURST*
S fid
P5V_AUX & P3V_AUX
7) P5V_AUX
MAX 1999 CPURST#
PWROK
CLPWROK
7) P1.8V_AUX 22) CL3_RST*
DDR2 POWER
IMVP6 16) VCC_CORE CL_RST#
SC486 12) P0.9V SC452 RSTIN#
GMCH
n
12) P1.25V
P1.25V / P1.05V
B B
ISL6227 12) P1.05V
o
Discrete
GFX.
GFX_CORE 12) GFX_CORE
SC470
P1.5V
SC486
Switched
Power
Switched
12) P1.5V
12) P5V
12) P3.3V
12) P2.5V
14) P1.8V
C
14) P1.2V
A Power A
DRAW DATE TITLE
CHECK
ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
ELECTRONICS
GUO LEI MP MAIN
POWER SEQUENCE
March 28, 2007 3:33:29 PM PAGE 4 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
Timing Diagram, no ME Rev. 0.2 Phil 2006-9-21
S5 S5 S3 S3 S0 S0 S0 S3 S3 S4 / S5 G3
D VDC VDC D
Px.xV_ALW Px.xV_ALW
P3.3V_MICOM P3.3V_MICOM
ADT3_SEL ADT3_SEL
>= 20ms
KBC3_RST* KBC3_RST*
>= 16ms, ICH internal debounce
KBC3_CHKPWRSW# KBC3_CHKPWRSW#
KBC3_SUSPWRON KBC3_SUSPWRON
g
Px.xV_AUX Px.xV_AUX
SUSPWRGD SUSPWRGD
KBC3_LANLOWPWR# KBC3_LANLOWPWR#
n
Due to Pull-up to P3.3V_AUX
>= 5ms
KBC3_RSMRST* KBC3_RSMRST*
l
Due to enabled wake event, such as PWRBTN# 1 ~ 2 RTCCLK
CHP3_SLPS5* CHP3_SLPS5*
u
1 ~ 2 RTCCLK, Refer to D31:F0:A4h bits 5:3 1 ~ 2 RTCCLK
CHP3_SLPS4* CHP3_SLPS4*
a
Raise at the same time as SLPS4#
CHP3_S4STATE* CHP3_S4STATE*
s i
1 ~ 2 RTCCLK 1 ~ 2 RTCCLK
C CHP3_SLPS3* CHP3_SLPS3* C
Raise at the same time as SLPS3#
t
CHP3_SLPM* CHP3_SLPM*
KBC3_PWRON KBC3_PWRON
m
P5.0V / P3.3V / P1.5V P5.0V / P3.3V / P1.5V
n
P1.25V / P2.5V P1.25V / P2.5V
P0.9V P0.9V
a e
P1.05V P1.05V
VCCP_PWRGD VCCP_PWRGD
S fid
P1.8V / P1.2V P1.8V / P1.2V
KBC3_VRON KBC3_VRON
VCC_CORE >= 0
VCC_CORE
VRM3_CPU_PWRGD VRM3_CPU_PWRGD
0 ~ 100ns
CLK3_PWRGD >= 3ms

CLK3_PWRGD
n
KBC3_PWRGD KBC3_PWRGD
>= 99ms
B KBC3_PWRGDMCH KBC3_PWRGDMCH B
o
CPU1_CPUPWRGD CPU1_CPUPWRGD
>= 0s
CL3_RST0* CL3_RST0*
CHP3_SUSSTAT* CHP3_SUSSTAT*
C
PLT3_RST* PLT3_RST*
PCI3_RST* >= 1ms

PCI3_RST*
CPU1_CPURST* CPU1_CPURST*
>= 1ms <= 100us
SPI Signals soft strap read BIOS Boot SPI Signals

CL0 (MCH-ICH) MCH soft straps Prepare for ME off CL0 (MCH-ICH)
DMI CPU_RST_DONE/ACK BIOS Boot SMM SLP_EN Write Sx Entry Req Sx Entry Ack L2 / L3 DMI
BSEL[2:0] Valid Toggling (Valid) BSEL[2:0]

0 ~ 100ns after VRM3_PWRGD Low
CHP3_CPUSTP* CHP3_CPUSTP*
2 ~ 10 RTCCLK
CHP3_PCISTP* CHP3_PCISTP*
0 ~ 1ms
CLK0_HOST_CPU Toggling (Valid) CLK0_HOST_CPU

A CLK0_HOST_GMCH Toggling (Valid) CLK0_HOST_GMCH
A
DRAW DATE TITLE
CHECK
ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
ELECTRONICS
GUO LEI MP MAIN
TIMING DIAGRAM
March 28, 2007 3:33:29 PM PAGE 5 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
EXCEPT AS AUTHORIZED BY SAMSUNG. CLOCK DISTRIBUTION Rev. 0.1
BSEL(2:0)
D 200 MHz CLK0_HOST_CPU/CPU# D
MEROM CPU BSEL
CLK3_PWRGD
CK505
FSB
CLK0_HOST_GMCH/GMCH#
667/533 MHz
CPU_STP# Main PLL 200 MHz HPLL 333/266 MHz CLK1_MCLK0/0#
SSC
MPLL
GMCH3_CLKREQ#
965GM / PM ON B’D MEM
g
333/266 MHz CLK1_MCLK1/1#
100 MHz CLK1_MCH3GPLL/3GPLL#
3GPLL Crestline
333/266 MHz CLK1_MCLK2/2#
n
48/96MHz
96 MHz CLK1_DREFCLK/CLK#
DPLLA
GMCH
SODIMM #0
l
NO SSC 333/266 MHz CLK1_MCLK3/3#
100 MHz CLK1_DREFSSC/SSC#
u
DPLLB
a
CLK1_27M
CLK1_27M_SS
s i
C C
100 MHz CLK1_PCIEGFX/GFX# PCIE Ext. GFX.
t
X16 PEG X4 DMI MDC3_BCLK
100 MHz CLK1_PCIEICH/ICH# MDC
PCIEPLL
m n
GMCH3_CLKREQ#
AUD3_BCLK HD 24 MHz
100MHz 100 MHz CLK1_MCH3GPLL/3GPLL# HD Audio
/33MHz SATAPLL
a e
SEL_LCDCLK#
SSC CLK3_USB48 SPI3_CLK
PCI_STP# 48 MHz
USBPLL 17.86 / 31.25 MHz SPI
ICH8-M
S fid
14.318 MHz CLK3_ICH14
33 MHz CLK3_PCLKICH RTC Clock

32.768 KHz
OSC
32.768 KHz
2801-003856
n
MINIPCIE3_CLKREQ1 / 2#
B
100 MHz CLK1_MINIPCIE1 / 1# MINI CARD (WLAN) B
ITP_EN
Co
100 MHz
100 MHz
100 MHz
CLK1_MINIPCIE2 / 2#
LAN3_CLKREQ#
CLK1_PCIELOM/PCIELOM#
CLK1_PEXNAND/FEXNAND#
MINI CARD (HSDPA) OPTION
LAN PHY
ROBSON
25 MHz
2801-003892
OPTION
33 MHz CLK3_PCLKMICOM
MICOM 10 MHz
14 MHz
A OSC
1394 Clock A
33 MHz CLK3_PCLKCB
CARDBUS 24.576 MHz
DRAW DATE TITLE
14.318 MHz 2801-003898 ZHOU JUN 4/10/2007
SAMSUNG
TORINO 2
2801-003730 CHECK DEV. STEP
33 MHz CLK3_DBGLPC ELECTRONICS
GUO LEI MP MAIN
DEBUG PORT APPROVAL REV
CLOCK DISTRIBUTION
PART NO.

March 28, 2007 3:33:29 PM PAGE 6 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
BOARD INFORMATION
D SCHEMATIC ANNOTATIONS AND BOARD INFORMATION D
PCI Devices Crystal / Oscillator

Devices IDSEL# REQ/GNT# Interrupts TYPE FREQUENCY DEVICE USAGE
Cardbus AD25 0 E,F,G Crystal 32.768KHz ICH8-M Real Time Clock
Crystal 10MHz MICOM H8S/2110BV
Crystal 14.318MHz CLOCK-Generator CK-505
Crystal 24.576MHz Cardbus Controller 1394
g
Crystal 25MHz LAN LAN
Voltage Rails
n
VDC Primary DC system power supply (7 to 21V)
CPU_CORE Core voltage for Processor (1.308~1.068V)
CPU Core Voltage Table
l
P1.05V Processor System Bus(PSB) Termination (1.05V) IMVP-6
GMCH & ICH8 Core Voltage
u
GFX_CORE Core voltage for NB8M-SE (1.0 ~ 1.1V)
P1.8V_AUX 1.8V power rail for DDR2 (off in S4-S5)
a
P0.9V 0.9V switched power rail (off in S3-S5) Active/Deeper Sleep Deeper Sleep/Extended Deeper Sleep
P1.8V 1.8V power rail for GDDR3 (off in S3-S5) Active Mode
Dual Mode Region
s i
C P1.2V 1.2V switched power rail (off in S3-S5) Dual Mode Region C
P1.5V 1.5V switched power rail (off in S3-S5)
t
P2.5V 2.5V switched power rail (off in S3-S5) VID(6:0) Voltage VID(6:0) Voltage VID(6:0) Voltage
P3.3V 3.3V switched power rail (off in S3-S5) 0 0 0 0 0 0 0 1.5000 V 0 1 0 1 0 0 0 1.0000 V 1 0 1 0 0 0 1 0.4875 V
P5.0V 5.0V switched power rail (off in S3-S5) 0 0 0 0 0 0 1 1.4875 V 0 1 0 1 0 0 1 0.9875 V 1 0 1 0 0 1 0 0.4750 V
P3.3V_AUX 3.3V power rail (off in S4-S5) 0 0 0 0 0 1 0 1.4750 V 0 1 0 1 0 1 0 0.9750 V 1 0 1 0 0 1 1 0.4625 V
m n
P5V_AUX 5.0V power rail (off in S4-S5) 0 0 0 0 0 1 1 1.4625 V 0 1 0 1 0 1 1 0.9625 V 1 0 1 0 1 0 0 0.4500 V
0 0 0 0 1 0 0 1.4500 V 0 1 0 1 1 0 0 0.9500 V 1 0 1 0 1 0 1 0.4375 V
PRTC_BAT 3.0V power rail (ALWAYS ON) 0 0 0 0 1 0 1 1.4375 V 0 1 0 1 1 0 1 0.9375 V 1 0 1 0 1 1 0 0.4250 V
P3.3V_MICOM 3.3V always on power rail for MICOM 0 0 0 0 1 1 0 1.4250 V 0 1 0 1 1 1 0 0.9250 V 1 0 1 0 1 1 1 0.4125 V
a
P5.0V_ALW 5V power rail (Always On) 0 0 1
e
0 0 0 1 1 1 1.4125 V 1 0 1 1 1 1 0.9125 V 0 1 1 0 0 0 0.4000 V
P12.0V_ALW 12V power rail (Always On) 0 0 0 1 0 0 0 1.4000 V 0 1 1 0 0 0 0 0.9000 V 1 0 1 1 0 0 1 0.3875 V
0 0 0 1 0 0 1 1.3875 V 0 1 1 0 0 0 1 0.8875 V 1 0 1 1 0 1 0 0.3750 V
0 0 0 1 0 1 0 1.3750 V 0 1 1 0 0 1 0 0.8750 V 1 0 1 1 0 1 1 0.3625 V
0 0 0 1 0 1 1 1.3625 V 0 1 1 0 0 1 1 0.8625 V 1 0 1 1 1 0 0 0.3500 V
S fid
0 0 0 1 1 0 0 1.3500 V 0 1 1 0 1 0 0 0.8500 V 1 0 1 1 1 0 1 0.3375 V
0 0 0 1 1 0 1 1.3375 V 0 1 1 0 1 0 1 0.8375 V 1 0 1 1 1 1 0 0.3250 V
0 0 0 1 1 1 0 1.3250 V 0 1 1 0 1 1 0 0.8250 V 1 0 1 1 1 1 1 0.3125 V
I2C / SMB Address 0
0
0
0
0
1
1
0
1
0
1
0
1
0
1.3125 V
1.3000 V
0
0
1
1
1
1
0
1
1
0
1
0
1
0
0.8125 V
0.8000 V
1
1
1
1
0
0
0
0
0
0
0
0
0
1
0.3000 V
0.2875 V
Devices Address Hex Bus 0 0 1 0 0 0 1 1.2875 V 0 1 1 1 0 0 1 0.7875 V 1 1 0 0 0 1 0 0.2750 V
0 0 1 0 0 1 0 1.2750 V 0 1 1 1 0 1 0 0.7750 V 1 1 0 0 0 1 1 0.2625 V
ICH8 Master - SMBUS Master 0 0 1 0 0 1 1 1.2625 V 0 1 1 1 0 1 1 0.7625 V 1 1 0 0 1 0 0 0.2500 V
0 0 1 0 1 0 0 1.2500 V 0 1 1 1 1 0 0 0.7500 V 1 1 0 0 1 0 1 0.2375 V
SODIMM0 1010 000X A0h - 0 0 1 0 1 0 1 1.2375 V 0 1 1 1 1 0 1 0.7375 V 1 1 0 0 1 1 0 0.2250 V
n
SODIMM1 1010 010X A4h - 0 0 1 0 1 1 0 1.2250 V 0 1 1 1 1 1 0 0.7250 V 1 1 0 0 1 1 1 0.2125 V
CK-505 (Clock Generator) 1101 001x D2h Clock, Unused Clock Output Disable 0 0 1 0 1 1 1 1.2125 V 0 1 1 1 1 1 1 0.7125 V 1 1 0 1 0 0 0
1 0.2000 V
0 0 1 1 0 0 0 1.2000 V 1 0 0 0 0 0 0 0.7000 V 1 1 0 1 0 0 1 0.1875 V
B MICOM Master - SMBUS Master
0 1 1 0 1 0
B
0 1 0 0 1 1.1875 V 0 0 0 0 1 0.6875 V 1 1 0 1 0 0.1750 V
BATTERY 0001 011X 16h - 0 1 1 0 1 0
o
0 1 0 1 0 1.1750 V 0 0 0 1 0 0.6750 V 1 1 0 1 1 0.1625 V
EMC2102(Thermal Sensor) 0111 101X 7Ah Thermal Sensor 0 0 1 1 0 1 1 1.1625 V 1 0 0 0 0 1 1 0.6625 V 1 1 0 1 1 0 0 0.1500 V
0 0 1 1 1 0 0 1.1500 V 1 0 0 0 1 0 0 0.6500 V 1 1 0 1 1 0 1 0.1375 V
0 0 1 1 1 0 1 1.1375 V 1 0 0 0 1 0 1 0.6375 V 1 1 0 1 1 1 0 0.1250 V
0 0 1 1 1 1 0 1.1250 V 1 0 0 0 1 1 0 0.6250 V 1 1 0 1 1 1 1 0.1125 V
0 0 1 1 1 1 1 1.1125 V 1 0 0 0 1 1 1 0.6125 V 1 1 1 0 0 0 0 0.1000 V
C
0 1 0 0 0 0 0 1.1000 V 1 0 0 1 0 0 0 0.6000 V 1 1 1 0 0 0 1 0.0875 V
USB PORT Assign 0 1 0 0 0 0 1 1.0875 V 1 0 0 1 0 0 1 0.5875 V 1 1 1 0 0 1 0 0.0750 V
0 1 0 0 0 1 0 1.0750 V 1 0 0 1 0 1 0 0.5750 V 1 1 1 0 0 1 1 0.0625 V
PORT NUMBER ASSIGNED TO 0 1 0 0 0 1 1 1.0625 V 1 0 0 1 0 1 1 0.5625 V 1 1 1 0 1 0 0 0.0500 V
0 1 0 0 1 0 0 1.0500 V 1 0 0 1 1 0 0 0.5500 V 1 1 1 0 1 0 1 0.0375 V
0 SYSTEM PORT A 0 1 0 0 1 0 1 1.0375 V 1 0 0 1 1 0 1 0.5375 V 1 1 1 0 1 1 0 0.0250 V
1 SYSTEM PORT B 0 1 0 0 1 1 0 1.0250 V 1 0 0 1 1 1 0 0.5250 V 1 1 1 0 1 1 1 0.0125 V
2 DMB CARD 0 1 0 0 1 1 1 1.0125 V 1 0 0 1 1 1 1 0.5125 V 1 1 1 1 0 0
1 0 0.0000 V
3 MINIPCI-E 1 1
0 1 0 0 0 0 0.5000 V 1 1 1 1 0 0 1 0.0000 V
4 BLUETOOTH 1 1 1 1 0 1 0 0.0000 V
5 WIBRO SIM CARD Deeper Slp 1 1 1 1 0 1 1 0.0000 V
6 HSDPA Active 1 1 1 1 1 0 0 0.0000 V
7 CAMERA DPRSLPVR 0 DPRSLPVR 1 1 1 1 1 1 0 1 0.0000 V
DPRSTP* 0 1 1 1 1 1 1 0 0.0000 V
DPRSTP* 1 1 1 1 1 1 1 1 0.0000 V
PSI2* 0 or 1 PSI2* 0 or 1
*"1111111" : 0V power good asserted.
System Power States

A CHP3_SLPS1* S1, Powered-On-Suspend(POS) : In this state, all clocks(except the 32.768KHz clock) are stopped. A
The system context is maintained in system DRAM. Power is maintained to PCI, the CPU, memory controller, memory, and all other criticial subsystems.
Note that this state does not preclude power being removed from non-essential devices, such as disk drives. During this state, CPU can be selected DRAW DATE TITLE
for either Deep Sleep or Deeper Sleep.
In Deeper Sleep, CPU voltage reduced in this state to reduce the leakage power.
ZHOU JUN 4/10/2007
TORINO 2 SAMSUNG
CHP3_SLPS3* S3, Suspend-To-RAM(STR) : The system context is maintained in system DRAM, but power is shut off to non-critical circuits. CHECK DEV. STEP
Memory is retained, and refreshes continue. All clocks stop except RTC clock. ELECTRONICS
GUO LEI MP MAIN
CHP3_SLP4S* S4, Suspend-To-Disk(STD) : The Context of the system is maintained on the disk. All power is then shut off to the system except for the logic required to resume. APPROVAL REV PART NO.
Externally appears same as S5, but may have different wake events. BOARD INFORMATION
CHP3_SLPS5* S5, Soft Off(SOFF) : System context is not maintained. All power is shut off except for the logic required to restart. A full boot is required when waking.
March 28, 2007 3:33:29 PM PAGE 7 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
D D
P3.3V
TP15281
MMZ1608S121AT
C744 C774 C772 C743 C742 C768 C766 C769 C773 B524
C771 C767 10000nF
C770 10000nF U20
100nF 100nF 100nF 10nF 10nF 100nF 100nF 100nF 100nF 10000nF
6.3V 6.3V SLG8SP513 6.3V
1%
10K 1%
19 4
VDD_IO VDD_REF
33 16
VDD_SRC_IO1 VDD_48
10K
43 9
g
VDD_SRC_IO2 VDD_PCI
52 23
VDD_SRC_IO3 VDD_PLL3
56
VDD_CPU_IO
27 46
NO_STUFF
EXT_GFX VDD_PLL3_IO VDD_SRC
62
R918
R195
VDD_CPU
n
37-B2 R189 33 5% 55
CLK3_FM48 25-A2 R188 33 5%
NC
61 10-D4
CLK3_USB48 TP15280 17 CPU0 CLK0_HOST_CPU
R190 2.2K 5% 60 10-D4
CPU1_BSEL0 USB_FS_A CPU0# CLK0_HOST_CPU#
l
10-C4 13-A3 64
CPU1_BSEL1 TP15279 5 FSB_TESTMODE
CPU1_BSEL2
10-C4 13-A3 R199 10K 1%
REF_FS_C_TEST_SEL CPU1_MCH
58 12-B2
CLK0_HOST_GMCH
u
10-C4 13-A3 R200 33 5% 57 12-B2
CLK3_ICH14 25-A2 44
CPU1_MCH# CLK0_HOST_GMCH#
CHP3_CPUSTP# CPUSTOP#
a
25-D2 45 40 R214 0 5%
CHP3_PCISTP# 25-D2
PCISTOP# SRC11_CLKREQH#
39 R213 0 5% 35-C2
CLK1_MINIPCIE2
TP15278 63 SRC11#_CLKREQG# CLK1_MINIPCIE2#
R201
s
100
i
35-C2
C CLK3_PWRGD 25-B2
CLKPWRGD_PWRDN#
41 C
TP15277 14 SRC10 CLK1_PCIEICH
CLK3_PCLKICH R192 33 5%
PCIF_5_ITP_EN SRC10#
42 25-C1
CLK1_PCIEICH#
t
25-C3 25-C1
R194 33 5% TP15282 13 37 R210 0
CLK3_PCLKMICOM PCI_4_SEL_LCDCLK# SRC9 CLK1_PEXNAND
31-B4 38 R211 0 33-B4
R196 33 5% TP15275 12 SRC9# 33-B4
CLK1_PEXNAND#
CLK3_PCLKCB PCI_3
m
36-A4 54
n
R197 33 5% TP15276 11 SRC8_ITP
53 32-D4
CLK1_PCIELOM
CLK3_DBGLPC 49-B4
PCI_2 SRC8#_ITP# 32-D4
CLK1_PCIELOM#
13-B4 TP15272 10 51 TP16368 R569 0 NO_STUFF 32-C4
GMCH3_CLKREQ# PCI_1_CLKREQ_B# SRC7_CLKREQF#
50 35-C4
LAN3_CLKREQ#
a
SRC7#_CLKREQE# MINIPCIE3_CLKREQ1#
e
25-B2 8
CHP3_SATACLKREQ# PCI_0_CLKREQ_A#
48
7
SRC6
47 35-C4
CLK1_MINIPCIE1
CLK3_SMBCLK 8-A2 17-C4
17-B4 18-C4
18-B4 6
SCL SRC6# 35-C4
CLK1_MINIPCIE1#
CLK3_SMBDATA SDA
34
S fid
TP15268 3 SRC4
35 13-C1
CLK1_MCH3GPLL
TP15269 2 XTAL_IN SRC4# 13-C1
CLK1_MCH3GPLL#
XTAL_OUT
31
SRC3_CLKREQC#
18 32
VSS_48 SRC3#_CLKREQD#
Y500 59
VSS_CPU
22 28
14.31818MHz VSS_IO SRC2 CLK1_SATA
15 29 24-B4
VSS_PCI SRC2# CLK1_SATA#
10K 1%
10K 1%
10K 1%
1 2 26 24-B4
SEL_LCDCLK# Pin20 Pin21 Pin24 Pin25 1
VSS_PLL3
24 INT_GFX R208 0
VSS_REF LCDCLK_27M CLK1_DREFSSCLK
n
0 DOT96 DOT96# LCDCLK LCDCLK# 30 25 R209 0 13-C1
2801-004518
36
VSS_SRC1 LCDCLK#_27M_SS 13-C1
CLK1_DREFSSCLK#
1 SRC0 SRC0# 27MHz 27MHz_SS VSS_SRC2
49
VSS_SRC3 SRC0_DOT96
20 R751 301 1%
CLK3_27M
B INT_GFX SRC0#_DOT96#
21 EXT_GFX R752 301 1% 20-B1
CLK3_27M_SS 3.3V to 1.2V Translation for G72M B
C273 C274 20-B1
NO_STUFF
R917
R191
R193
o
0.033nF 0.033nF INT_GFX R206 0
1205-003156 R207 0 13-C1
CLK1_DREFCLK
CLK1_DREFCLK#
SMBUS Address "D2h" EXT_GFX R750 0
13-C1
CLK1_PCIEGFX
R749 0 20-A4
CLK1_PCIEGFX#
20-A4
C
P1.05V
PCI2 is multiple used as TME on IDTCV179 R89 0
Place 14.318MHz within IDTCV179 P/N: 1205-003159 R88 1K
500mils of Clock chip R21 0
R93 1K
P3.3V P3.3V EXT_GFX
R711 CLK REQ Mapping Device

FSA FSB FSC 10K
HOST CLK TP1065
R754 R753 A# SRC_2 SATA
CPU BSEL0 BSEL1 BSEL2 10K 10K
RHU002N06 G 1 B# SRC_4 GMCH
0 0 0 266 MHz Q506
0 0 1 333 MHz D S E# SRC_6 MiniCard(WLAN)
SMB3_CLK CLK3_SMBCLK
25-D2 27-C3 35-C1 35-C3 3 2 18-C4 17-C4 8-C4
0 1 0 200 MHz G 1 F# SRC_8 GbE LAN (100M: N/A)
A 0 1 1 400 MHz S A
25-D2 27-C3 35-C1 35-C3 D
1 0 0 133 MHz SMB3_DATA 3 2 18-B4 17-B4 8-B4
CLK3_SMBDATA
1 0 1 100 MHz RHU002N06
DRAW DATE TITLE
1 1 0 166 MHz Q507 C932

0.33nF
C933
0.33nF CHECK
ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
1 1 1 RSVD GUO LEI MP MAIN
ELECTRONICS
KEVIN LEE 1.1 CLOCK GENERATOR BA41-00727/8A

March 28, 2007 3:33:29 PM PAGE 8 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
D D
CPU SOCKET : MEROM
g
P1.05V
CPU500-2
n
CPU500-1 R37
56 MEROM-SOCKET
MEROM-SOCKET 2/4
CPU1_D#(15:0) CPU1_D#(47:32)
l
1/4 12-D4 0 E22 Y22 32 12-D4
CPU1_A#(16:3) 12-D1 3 J4 H1 12-C2 1 F24
D0* D32*
AB24 33
A3* ADS* CPU1_ADS# D1* D33*
u
4 L5 E2 2 E26 V24 34
5 L4
A4* BNR*
G5 12-C2
CPU1_BNR# 3 G22
D2* D34*
V26 35
A5* BPRI* CPU1_BPRI# D3* D35*
a
6 K5 4 F23 V23 36
A6* D4* D36*
7 M3 F1 5 G25 T22 37
0
A7* BR0* CPU1_BREQ# D5* D37*

ADDR GROUP
s
8 N2 6 E25 U25 38
i
12-C2
C 9 J1
A8*
H5 12-B2 7 E23
D6* D38*
U23 39 C
A9* DEFER* CPU1_DEFER# D7* D39*
DATA GRP 0
DATA GRP 2
10 N3 F21 8 K24 Y25 40
A10* DRDY* CPU1_DRDY# D8* D40*
t
11 P5 E1 12-B2 9 G24 W22 41
12 P2
A11* DBSY* 12-B2
CPU1_DBSY# 10 J24
D9* D41*
Y23 42
A12* TP15292 D10* D42*
CONTROL
13 L2 D20 11 J23 W24 43

A13* IERR* D11* D43*
14 P4 B3 24-C2 12 H22 W25 44
A14* INIT* CPU1_INIT# D12* D44*
m
15 P1 13 F26 AA23 45
n
A15* D13* D45*
16 R1 H4 14 K22 AA24 46
M1
A16* LOCK* 12-B2
CPU1_LOCK# 15 H23
D14* D46*
AB25 47
CPU1_ADSTB0# 12-C2
ADSTB0*
C1 12-B2 J26
D15* D47*
Y26 12-B2
RESET*
F3 12-A2
12-B4
CPU1_CPURST# CPU1_DSTBN0# 12-B2 H26
DSTBN0* DSTBN2*
AA26 12-B2
CPU1_DSTBN2#
a
RS0* CPU1_RS0# CPU1_DSTBP0# DSTBP0* DSTBP2* CPU1_DSTBP2#
e
F4 12-A2 12-B2 H25 U22 12-B2
CPU1_A#(35:17) 12-D1 17 Y2
RS1*
G3 12-A2
CPU1_RS1# CPU1_DBI0# DINV0* DINV2* CPU1_DBI2#
18 U5
A17* RS2*
G2 12-B2
CPU1_RS2# CPU1_D#(31:16) 12-D4 16 N22 AE24 48 12-D4
CPU1_D#(63:48)
19 R3
A18* TRDY* CPU1_TRDY# 17 K25
D16* D48*
AD24 49
A19* D17* D49*
20 W6 G6 18 P26 AA21 50
S fid
21 U4
A20* HIT*
E4 12-B2
CPU1_HIT# 19 R23
D18* D50*
AB22 51
22 Y5
A21* HITM* 12-B2
CPU1_HITM# 20 L23
D19* D51*
AB21 52
A22* D20* D52*
23 U1 A6 24-C2 21 M24 AC26 53
24 R4
A23* A20M*
A5 CPU1_A20M# 22 L22
D21* D53*
AD20 54
1
ADDR GROUP
25 T5
A24* FERR*
C4 24-C2
CPU1_FERR# 23 M23
D22* D54*
AE22 55
A25* IGNNE* CPU1_IGNNE# D23* D55*
DATA GRP 1
DATA GRP 3
26 T3 24 P25 AF23 56
A26* D24* D56*
ICH
27 W2 D5 24-C2 25 P23 AC25 57

28 W5
A27* STPCLK*
C6 24-C2
CPU1_STPCLK# 26 P22
D25* D57*
AE21 58
29 Y4
A28* LINT0
B4 24-C2
CPU1_INTR 27 T24
D26* D58*
AD21 59
A29* LINT1 CPU1_NMI D27* D59*
n
30 U2 A3 28 R24 AC22 60
31 V4
A30* SMI* 24-C2
CPU1_SMI# 29 L25
D28* D60*
AD23 61
32 W3
A31*
K3 0 12-A2
CPU1_REQ#(4:0) 30 T25
D29* D61*
AF22 62
A32* REQ0* D30* D62*
B 33 AA4
A33* REQ1*
H2 1 31 N25
D31* D63*
AC23 63 B
34 AB2 K2 2 12-B2 L26 AE25 12-B2
A34* REQ2* CPU1_DSTBN1# DSTBN1* DSTBN3* CPU1_DSTBN3#
o
35 AA3 J3 3 12-B2 M26 AF24 12-B2
V1
A35* REQ3*
L1 4 CPU1_DSTBP1# 12-B2 N24
DSTBP1* DSTBP3*
AC20 12-B2
CPU1_DSTBP3#
CPU1_ADSTB1# 12-C2
ADSTB1* REQ4* CPU1_DBI1# DINV1* DINV3* CPU1_DBI3#
C
A A
DRAW DATE TITLE
CHECK
ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
ELECTRONICS
GUO LEI MP MAIN
KEVIN LEE 1.1 MEROM(1) BA41-00727/8A

March 28, 2007 3:33:29 PM PAGE 9 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
CPU SOCKET : MEROM
D D
CPU500-3 CPU_CORE CPU_CORE
M22
M25
N23
N26
R22
K23
K26
P21
P24
L21
L24
M2
M5
N1
N4
R2
P1.5V
K4
P3
P6
L3
L6
MEROM-SOCKET
VSS_121
VSS_122
VSS_123
VSS_124
VSS_125
VSS_126
VSS_127
VSS_128
VSS_129
VSS_130
VSS_131
VSS_132
VSS_133
VSS_134
VSS_135
VSS_136
VSS_137
VSS_138
VSS_139
VSS_140
VSS_141
A22 B26
H CLK
CLK0_HOST_CPU 8-C1 A21
BCLK0 VCCA_1
C26
CLK0_HOST_CPU# 8-C1
BCLK1 VCCA_2 C4 C5
D7 K6 10nF 10000nF A11 K1
CPU1_SLP# 12-B4 B5
SLP* VCCP_1
J6
25V 6.3V A14
VSS_1 VSS_120
J5
CPU1_DPSLP# 24-C2 E5
DPSLP* VCCP_2
M6 A16
VSS_2 VSS_119
J25
CPU1_DPRSTP# 13-B1 24-C2 D24
DPRSTP* VCCP_3
N6 Placed as close as possible to A19
VSS_3 VSS_118
J22
CPU1_DPWR# 12-B2 D6
DPWR* VCCP_4
T6 each of the four VCCA pins. A2
VSS_4
A10 AE9
VSS_117
J2
g
CPU1_PWRGDCPU 24-C2 AE6
PWRGOOD VCCP_5
R6 A23
VSS_5
A12
VCC_1 VCC_51
AF10
VSS_116
H6
CPU1_PSI# 45-B4
PSI* VCCP_6
K21 A25
VSS_6
A13
VCC_2 VCC_52
AF12
VSS_115
H3
CPU1_VID(6:0) 45-B4 6 AE2
VCCP_7
J21 P1.05V A4
VSS_7
A15
VCC_3 VCC_53
AF14
VSS_114
H24
VID_6 VCCP_8 VSS_8 VCC_4 VCC_54 VSS_113
5 AF3 M21 A8 A17 AF15 H21
P1.05V VID_5 VCCP_9 VSS_9 VCC_5 VCC_55 VSS_112
n
4 AE3 N21 AA11 A18 AF17 G4
3 AF4 T21 EC5 AA14 A20 AF18 G26
2 AE5 R21 330uF AA16 A7 AF20 G23
l
R36 1 AF5 V21 2.5V AA19 A9 AF9 G1
IF PROCHOT* USED, 56ohm -> 68ohm
56 0 AD6
VID_1 VCCP_13
W21 AL AA2
VSS_13
AA10
VCC_9 CPU500-4 VCC_59
B10
VSS_108
F8
3/4
u
1% V6 AA22 AA12 B12 F5
TP16322 D21
VCCP_15
G21 AA25
VSS_15
AA13
VCC_11 MEROM-SOCKET VCC_61
B14
VSS_106
F25
THERMAL
CPU1_PROCHOT# PROCHOT* VCCP_16 VSS_16 VCC_12 VCC_62 VSS_105
a
A24 AA5 AA15 B15 F22
CPU2_THERMDA 11-C2 B25
THRMDA
AC1 AA8
VSS_17
AA17
VCC_13 VCC_63
B17
VSS_104
F2
CPU2_THERMDC THRMDC PREQ* VSS_18 VCC_14
4/4 VCC_64 VSS_103
P1.05V
s
C7 AC2 AB1 AA18 B18 F19
i
11-C2
C CPU1_THRMTRIP# 11-B3 13-B1 24-C2
THERMTRIP* PRDY*
AC4 AB11
VSS_19
AA20
VCC_15 VCC_65
B20
VSS_102
F16 C
BPM3* VSS_20 VCC_16 VCC_66 VSS_101
XDP/ITP SIGNALS
C21 AD1 AB13 AA7 B7 F13
CPU1_BSEL2 BSEL2 BPM2* VSS_21 VCC_17 VCC_67 VSS_100
t
8-C4 13-A3 B23 AD3 P1.05V AB16 AA9 B9 F11
R148 CPU1_BSEL1 BSEL1 BPM1* VSS_22 VCC_18 VCC_68 VSS_99
1K 8-C4 13-A3 B22 AD4 AB19 AB10 C10 E8
1%
CPU1_BSEL0 8-C4 13-A3
BSEL0 BPM0*
AB26
VSS_23
AB12
VCC_19 VCC_69
C12
VSS_98
E6
TP15067 TP15068 VSS_24 VCC_20 VCC_70 VSS_97
AD26
GTLREF TCK
AC5 R151 27.4 1% AB4
VSS_25
AB14
VCC_21 VCC_71
C13
VSS_96
E3
m
AA6 R134 150 1% AB8 AB15 C15 E24
n
TDI VSS_26 VCC_22 VCC_72 VSS_95
R147 R136 54.9 1%TP15063 Y1 AB3 AC11 AB17 C17 E21
COMP3 TDO VSS_27 VCC_23 VCC_73 VSS_94
2K R137 27.4 1%TP15064
AA1 AB5 R135 40.2 5% AC14 AB18 C18 E19
COMP2 TMS VSS_28 VCC_24 VCC_74 VSS_93
1% R132 54.9 1%TP15065
U26 AB6 R133 475 1% AC16 AB20 C9 E16
COMP1 TRST* VSS_29 VCC_25 VCC_75 VSS_92
R131 27.4 1%TP15066
R26 TP15072 R38
C20 0 AC19 AB7 D10 E14
a
COMP0 DBR* ITP3_SYSRST# VSS_30 VCC_26 VCC_76 VSS_91
e
25-D2 AC21 AB9 D12 E11
VSS_31 VCC_27 VCC_77 VSS_90
AF7 D2 AC24 AC10 D14 D8
CPU1_VCCSENSE 10-A3 45-B4 AE7
VCCSENSE RSVD_1
F6 AC3
VSS_32
AC12
VCC_28 VCC_78
D15
VSS_89
D4
CPU1_VSSSENSE 10-A3 45-B4
VSSSENSE RSVD_2
D3 AC6
VSS_33
AC13
VCC_29 VCC_79
D17
VSS_88
D26
NO_STUFF
RSVD_3 VSS_34 VCC_30 VCC_80 VSS_87
D22 AC8 AC15 D18 D23
S fid
TP15073 RSVD_4 VSS_35 VCC_31 VCC_81 VSS_86
COMP0,2(COMP1,3) should be R7 1K C23 M4 AD11 AC17 D9 D19
RSVD
TP15062 TEST1 RSVD_5 VSS_36 VCC_32 VCC_82 VSS_85

connected with Zo=27.4ohm(55ohm) R8 1K D25
TEST2 RSVD_6
N5 AD13
VSS_37
AC18
VCC_33 VCC_83
E10
VSS_84
D16
1% C24 T2 AD16 AC7 E12 D13
trace shorter than 1/2" to their AF26
TEST3 RSVD_7
V3 AD19
VSS_38
AC9
VCC_34 VCC_84
E13
VSS_83
D11
respective Banias socket pins. TEST4 RSVD_8 VSS_39 VCC_35 VCC_85 VSS_82
AF1 B2 AD2 AD10 E15 D1
TEST5 RSVD_9 VSS_40 VCC_36 VCC_86 VSS_81
A26 C3 AD22 AD12 E17 C8
TEST6 RSVD_10 VSS_41 VCC_37 VCC_87 VSS_80
AB23 AD14 E18 C5
GTLREF : Keep the Voltage divider within 0.5" AD25
VSS_43
AD15
VCC_39 VCC_89
E20
VSS_78
C25
of the First GTLREF0 with Z0= 55 ohm trace AD5 AD17 E7 C22
n
AD8 AD18 E9 C2
Minimize coupling of any switching signals to this net AE1
VSS_45
AD7
VCC_41 VCC_91
F10
VSS_76
C19
AE11 AD9 F12 C16
B AE14
VSS_48
AE10
VCC_44 VCC_94
F14
VSS_73
C14 B
AE16 AE12 F15 C11
o
AE19 AE13 F17 B8
AE23 AE15 F18 B6
CPU_CORE CPU VRM side : 330uF X 6ea VSS_51 VCC_47 VCC_97 VSS_70
AE26 AE17 F20 B24
AE4 AE18 F7 B21
AE8 AE20 F9 B19
AF11 B16
C
C112 C113 C102 C100 C101 C182 C183 C110 C107 C104 AF13
VSS_55 VSS_66
B13
10000nF 10000nF 10000nF 10000nF 10000nF 10000nF 10000nF 10000nF 10000nF 10000nF VSS_56 VSS_65
AF16 B11
6.3V 6.3V 6.3V 6.3V 6.3V 6.3V 6.3V 6.3V 6.3V 6.3V VSS_57 VSS_64
AF19 AF8
VSS_58 VSS_63
AF2 AF6
VSS_59 VSS_62
AF21 AF25
VSS_163
VSS_162
VSS_161
VSS_160
VSS_159
VSS_158
VSS_157
VSS_156
VSS_155
VSS_154
VSS_153
VSS_152
VSS_151
VSS_150
VSS_149
VSS_148
VSS_147
VSS_146
VSS_145
VSS_144
VSS_143
VSS_142
CPU_CORE VSS_60 VSS_61
20mils R149 100 1%

45-B4 10-C4
CPU1_VCCSENSE
C106 C105 C103 C180 C181 C111 C176 C179
Y6
Y3
Y24
Y21
W4
W26
W23
W1
V5
V25
V22
V2
U6
U3
U24
U21
T4
T26
T23
T1
R5
R25
10000nF 10000nF 10000nF 10000nF 10000nF 10000nF 10000nF 10000nF
6.3V 6.3V 6.3V 6.3V 6.3V 6.3V 6.3V 6.3V
R150 100 1%
45-B4 10-C4
CPU1_VSSSENSE
P1.05V
A A
C109 C108 C114 C99 C178 C177
100nF 100nF 100nF 100nF 100nF 100nF DRAW DATE TITLE
CHECK
ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
ELECTRONICS
GUO LEI MP MAIN
CHECK BULK CAP USING
IF IT DOUBLED KEVIN LEE 1.1 MEROM(2) BA41-00727/8A
March 28, 2007 3:33:29 PM PAGE 10 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
D D
Thermal Monitor
P3.3V_AUX
P5.0V P3.3V_AUX
g
R778 R777 R783 R779
C816 C804 10K 10K 10K 10K
10000nF C817 10000nF C805
6.3V
100nF 6.3V
100nF
U507
EMC2102
n
1 22
24
VDD_3V SMDATA
23 31-C2
31-B2
KBC3_THERM_SMDATA
VDD_5V_1 SMCLK KBC3_THERM_SMCLK
l
27
VDD_5V_2
19 25-C2
ALERT# TP15146R781 THERM_ALERT#
u
14 12 0
KBC3_PWRGD 25-B2 31-C4 36-A4 TP16317 16 POWER_OK SYS_SHDN# 43-B1
THERM_STP#
RESET#
a
R780 0 2 10-C4
TP16318 10 DN1
3 CPU2_THERMDC
FAN_MODE DP1 C806 0.47nF
s
25
i
10-C4
C FAN5_VDD 11-B2 26
FAN_1
4 CPU2_THERMDA C
FAN_2 DN2 GFX3_THERMDN
FAN3_FDBACK# 28
TACH DP2
5 C807 20-A1
t
11-B2 0.47nF EXT_GFX
13 6 TP16369 20-A1
GFX3_THERMDP
CPU3_THRMTRIP# 11-B3
THERMTRIP# DN3
7
TP16319 9 DP3 2
P3.3V_AUX SHDN_SEL
m
11 17 MMBT3904
n
TRIP_SET CLK_SEL
18 TP16316
2.2nF C808 1
CLK_IN Q505
8 3
NC_1 TP15152
R782 15 20
NC_2 GND
21 29
a
100K NC_3 THRM_PAD
e
1%
TRIP_SET TP15150
1209-001718 Place nearby Memory
3.3 * R2 / (R1 + R2) = (T - 75) / 21
So: T = 100’C R773 SMBUS Address "7A"
S fid
56.2K
1%
n
B P1.05V P3.3V
FAN Control B
P3.3V
o
R785 R784
2K 10K R228
1% 10K
J4
TP16370 Line Width = 20 mil HDR-3P-SMD
C
1 FAN5_VDD 1
11-C3
2
CPU1_THRMTRIP# CPU3_THRMTRIP# FAN3_FDBACK# 4
3
10-C4 13-B1 24-C2 2 3 11-C3 11-C3
MNT1
5
MMBT3904 MNT2
Q508
3711-005853
A A
DRAW DATE TITLE
CHECK
ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
ELECTRONICS
GUO LEI MP MAIN
KEVIN LEE 1.1 THERMAL MONITOR BA41-00727/8A

March 28, 2007 3:33:29 PM PAGE 11 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
EXCEPT AS AUTHORIZED BY SAMSUNG. P1.05V
U13
U12
U11
T13
T11
T10
U9
U8
U7
U5
U3
U2
U1
R3
R2
R1
T9
T7
T6
T5
T3
T2
D 9-C4
CPU1_A#(35:3) D
CPU1_D#(63:0)
VTT_1
VTT_2
VTT_3
VTT_4
VTT_5
VTT_6
VTT_7
VTT_8
VTT_9
VTT_10
VTT_11
VTT_12
VTT_13
VTT_14
VTT_15
VTT_16
VTT_17
VTT_18
VTT_19
VTT_20
VTT_21
VTT_22
9-C1 9-C2 J13 3
0 E2 HA*_3 B11 4
HD*_0 HA*_4
1 G2 HD*_1 HA*_5 C11 5
2 G7 M11 6
HD*_2 HA*_6
3 M6 HD*_3 HA*_7 C15 7
4 H7 F16 8
5 H3 HD*_4 VTT HA*_8 L13 9
HD*_5 HA*_9
6 G4 G17 10
7 F3 HD*_6 HA*_10 C14 11
HD*_7 HA*_11
8 N8 HD*_8 HA*_12 K16 12
9 H2 B13 13
HD*_9 HA*_13
10 M10 HD*_10 HA*_14 L16 14
11 N12 J17 15
g
12 N9 HD*_11 HA*_15 B14 16
U504-1
Host Address Bus

HD*_12 HA*_16
13 H5 HD*_13 HA*_17 K19 17
14 P13 P15 18
HD*_14 HA*_18
15 K9 HD*_15 LE88CLGM HA*_19 R17 19
n
16 M2 B16 20
17 W10 HD*_16 HA*_20 H20 21
18 Y8
HD*_17
HD*_18 1 OF 5 HA*_21
HA*_22
L19 22
l
19 V4 D17 23
HD*_19 HA*_23
20 M3 HD*_20 HA*_24 M17 24
u
21 J1 N16 25
HD*_21 HA*_25
22 N5 HD*_22 HA*_26 J19 26
a
23 N3 B18 27
P1.05V 24 W6 HD*_23 HA*_27 E19 28
HD*_24 HA*_28
W9 B17
s
25 29
i
C 26 N2 HD*_25 HA*_29 B15 30 C
Host Data Bus

HD*_26 HA*_30
R35 27 Y7 HD*_27 HA*_31 E17 31
t
221 28 Y9 C18 32
1% HD*_28 HA*_32
29 P4 HD*_29 HA*_33 A19 33
TP16371 30 W3 B19 34
12-A4
GMCH1_HSWING 31 N1 HD*_30 HA*_34 N19 35
HD*_31 HA*_35
m
R34 C98 32 AD12
n
HD*_32
100 100nF 33 AE3 G12
1% 34 AD9
HD*_33 H_ADS*
H17 9-C3
CPU1_ADS#
nearby Pin C2 HD*_34 H_ADSTB*_0 CPU1_ADSTB0#
35 AC9 G20 9-C4
36 AC7 HD*_35 H_ADSTB*_1 C8 9-B4
CPU1_ADSTB1#
a
HD*_36 H_BNR* CPU1_BNR#
e
37 AC14 E8 9-C3
38 AD11 HD*_37 H_BPRI* F12 9-C3
CPU1_BPRI#
39 AC11
HD*_38 H_BREQ* 9-C3
CPU1_BREQ#
HD*_39
40 AB2
HD*_40
41 AD7 D6
S fid
42 AB1
HD*_41 H_DEFER*
C10 9-C3
CPU1_DEFER#
43 Y3 HD*_42 H_DBSY* H8 9-C3
CPU1_DBSY#
P1.05V 44 AC6
HD*_43 H_DPWR*
K7 10-D4
CPU1_DPWR#
45 AE2 HD*_44 H_DRDY* 9-C3
CPU1_DRDY#
HD*_45
46 AC5 E4
HD*_46 H_HIT* CPU1_HIT#
R529 47 AG3 C6 9-B3
1K 48 AJ9
HD*_47 H_HITM*
G10 9-B3
CPU1_HITM#
1% 49 AH8
HD*_48 H_LOCK*
B7 9-C3
CPU1_LOCK#
TP16372 50 AJ14 HD*_49 H_TRDY* 9-C3
CPU1_TRDY#
GMCH1_HVREF HD*_50
n
12-A4 51 AE9 AM5
R528 C531 52 AE11 HD*_51 HPLL_CLK AM7 8-C1
CLK0_HOST_GMCH
HD*_52 HPLL_CLK* CLK0_HOST_GMCH#
2K 100nF 53 AH12 HD*_53
8-C1
B 1% 54 AJ5 K5 B
nearby Pin A9, B9 HD*_54 H_DINV*_0 CPU1_DBI0#
55 AH5 L2 9-C2
HD*_55 H_DINV*_1 CPU1_DBI1#
o
56 AJ6 AD13 9-B2
57 AE7 HD*_56 H_DINV*_2 AE13 9-C1
CPU1_DBI2#
58 AJ7
HD*_57 H_DINV*_3 9-B1
CPU1_DBI3#
HD*_58
59 AJ2 M7
60 AE5
HD*_59 H_DSTBN*_0
K3 9-C2
CPU1_DSTBN0#
61 AJ3
HD*_60 H_DSTBN*_1
AD2 9-B2
CPU1_DSTBN1#
C
62 AH2 HD*_61 H_DSTBN*_2 AH11 9-C1
CPU1_DSTBN2#
P1.05V 63 AH13
HD*_62 H_DSTBN*_3 9-B1
CPU1_DSTBN3#
HD*_63 L7
B6
H_DSTBP*0
K2 9-C2
CPU1_DSTBP0#
CPU1_CPURST# 9-C3 E5
H_CPURST* H_DSTBP*1
AC2 9-B2
CPU1_DSTBP1#
CPU1_SLP# 10-D4
H_CPUSLP* H_DSTBP*2
AJ10 9-C1
CPU1_DSTBP2#
54.9 1% TP15296
H_DSTBP*3 CPU1_DSTBP3#
R587 W1 9-B1
R588 54.9 1% TP15297 W2 H_SCOMP M14 0 9-B3
CPU1_REQ#(4:0)
H_SCOMP* H_REQ*_0
E13 1
B3 H_REQ*_1 A11 2
GMCH1_HSWING 24.9 1% TP15298
H_SWING H_REQ*_2
12-C4 R530 C2 H_RCOMP H_REQ*_3 H13 3
B12 4
A9 VCC Core VTT LF H_REQ*_4
GMCH1_HVREF 12-B4 B9
H_DVREF
E12
H_AVREF H_RS*_0 CPU1_RS0#
VTTLF_1
VTTLF_2
VTTLF_3
D7 9-C3
VCC_10
VCC_11
VCC_12
VCC_13
H_RS*_1 CPU1_RS1#
VCC_1
VCC_2
VCC_3
VCC_4
VCC_5
VCC_6
VCC_7
VCC_8
VCC_9
D8 9-C3
H_RS*_2 9-C3
CPU1_RS2#
AT35
AT34
AH28
AC32
AC31
AK32
AJ31
AJ28
AH32
AH31
AH29
AF32
R30
A7
F2
AH1
A P1.05V A
DRAW DATE TITLE
270uF
EC8 16V 470nF C28

ZHOU JUN 4/10/2007
TORINO 2 SAMSUNG
C579 C29 TP15295 CHECK DEV. STEP
330uF C97 16V 470nF C581 ELECTRONICS
220nF 4700nF 2200nF
TP15294
16V 470nF C175
GUO LEI MP MAIN
2.5V
AL 16V 10V TP15293 APPROVAL REV PART NO.
KEVIN LEE 1.1 965GM(1) BA41-00727/8A

Place on the edge Place in cavity
March 28, 2007 3:33:29 PM PAGE 12 OF 54

4 3 2 1
A
B
C
D
GMCH3_ICHSYNC#
GMCH3_CLKREQ#
SDVO_CTRL_DATA
LCD1_ACLK
LCD1_ACLK#
LCD1_ADATA2
LCD1_ADATA1
LCD1_ADATA0
LCD1_ADATA2#
LCD1_ADATA1#
LCD1_ADATA0#
LCD3_BKLTEN
LCD3_BKLTCTRL
LCD3_VDDEN
LCD3_EDID_DATA
LCD3_EDID_CLK
VGA3_RED
VGA3_GREEN
VGA3_BLUE
VGA3_VSYNC
VGA3_HSYNC
VGA3_DDCDATA
VGA3_DDCCLK
COM-22C-015(1996.6.5) REV. 3
P3.3V
8-C4
25-B2
16-B1
28-B4
29-B4
29-B4
29-A2
29-A4
28-C4
28-C4
28-C4
28-C4
28-C4
28-C4
28-C4
28-C4
28-C2
28-D2
28-C4
28-C4
INT_GFX
R198
R94
R100
R96
R92
4
4
R105
29-C4R107
29-C4R108
29-C4R104
0 [email protected].
475
20K
SAMSUNG PROPRIETARY
1.3K 1%
150 1%
150 1%
150 1%
10K 1%
2.4K 1%
TP15307
TP15306
TP16218
TP16219
Int. Gfx. Core Voltage

TP15305
R32
A37
G40
1% G39
K36
H35
N40
N41
L43
TP15308 L41
E42
D44
A45
A47
E44
B45
B47
G44
C45
D46
F48
E50
G50
F49
E51
G51
H39
J40
K40
E40
E39
D35
C37
L27
J27
F27
K27
G27
E27
P33
M35
C32
E29
F29
J29
K29
G32
H32
E33
F33
G35
K33
P1.05V
TEST_2
TEST_1
TVB_RTN
TVA_RTN
TVC_RTN
TVB_DAC
TVA_DAC
TVC_DAC
CRT_RED
LVDS_IBG
CLK_REQ*
CRT_RED*
L_VDD_EN
CRT_BLUE
R129
R144
R130
R145
R113
LVDS_VBG
ICH_SYNC*
INT_GFX
L_BKLT_EN
CRT_BLUE*
LVDSB_CLK
LVDSA_CLK
L_DDC_CLK
EXT_GFX
CRT_VSYNC
CRT_HSYNC
LVDSB_CLK*
LVDSA_CLK*
CRT_GREEN
L_CTRL_CLK
LVDS_VREFL
L_DDC_DATA
LVDS_VREFH
CRT_GREEN*
L_BKLT_CTRL
L_CTRL_DATA
GFX1_RXN(15:0)
GFX1_RXP(15:0)
CRT_DDC_CLK
CRT_TVO_IREF
TV_DCONSEL_1
TV_DCONSEL_0
CRT_DDC_DATA
LVDSB_DATAP_2
LVDSB_DATAP_1
LVDSB_DATAP_0
LVDSA_DATAP_2
LVDSA_DATAP_1
LVDSA_DATAP_0
LVDSB_DATAN_2
LVDSB_DATAN_1
LVDSB_DATAN_0
LVDSA_DATAN_2
LVDSA_DATAN_1
LVDSA_DATAN_0
SDVO_CTRL_CLK
0
0
0
0
0
SDVO_CTRL_DATA
MISC LVDS TV VGA
20-B4
20-C4
J51 0
PEG_RXN_0
TP16377
L51 1
PEG_RXN_1
PEG_RXN_2 N47 2
A35 T45 3
RSVD_1 PEG_RXN_3
B37 RSVD_2 PEG_RXN_4 T50 4
B36 U40 5
B34 RSVD_3 PEG_RXN_5 Y44
RSVD_4 PEG_RXN_6 6
C34 Y40 7
BF23 RSVD_5 Y17 R20 PEG_RXN_7 AB51
RSVD_6 VCC_AXG_NCTF_25 VCC_AXG_1 PEG_RXN_8 8
BG23 RSVD_7 Y19 VCC_AXG_NCTF_26 VCC_AXG_2 T14 PEG_RXN_9 W49 9
BJ29 Y20 W13 AD44 10
RSVD_8 VCC_AXG_NCTF_27 VCC_AXG_3 PEG_RXN_10
BJ20 RSVD_9 Y21 VCC_AXG_NCTF_28 VCC_AXG_4 W14 PEG_RXN_11 AD40 11
BK22 Y23 Y12 AG46 12
BC23 RSVD_10 Y24 VCC_AXG_NCTF_29 VCC_AXG_5 AA20 PEG_RXN_12 AH49
RSVD_11 VCC_AXG_NCTF_30 VCC_AXG_6 PEG_RXN_13 13
BD24 Y26 AA23 AG45 14
C
BE24 Y28 AA26 AG41 15
3
3

BH39 RSVD_14 Y29 VCC_AXG_NCTF_33 VCC_AXG_9 AA28
BF19 AA16 AB21
BH20 RSVD_20 AA17 VCC_AXG_NCTF_34 VCC_AXG_10 AB24 J50
RSVD_21 VCC_AXG_NCTF_35 VCC_AXG_11 PEG_RXP_0 0
BK18 AB16 AB29 L50 1
RSVD_22 VCC_AXG_NCTF_36 VCC_AXG_12 PEG_RXP_1
MCH3_CFG(9)
MCH3_CFG(5)
CPU1_BSEL2
CPU1_BSEL1
CPU1_BSEL0
19-C4 17-D4
19-B4 18-D4
BJ18 AB19 AC20 M47 2
AW20 RSVD_24 AC16 VCC_AXG_NCTF_38 VCC_AXG_14 AC21 PEG_RXP_3 U44 3
BK20 AC17 AC23 T49 4
P36
a AC19 AC24 T41 5
o
8-C4
8-C4
8-C4
P37 AD15 AC26 W45
16-B1
16-B1
RSVD_27 VCC_AXG_NCTF_41 VCC_AXG_17 PEG_RXP_6 6
RVSD
R35 AD16 AC28 W41 7
N35 AD17 AC29 AB50 8
10-C4
10-C4
10-C4
GFX VCC
J12 AF16 AD20 Y48 9

H10 RSVD_31 AF19 VCC_AXG_NCTF_45 VCC_AXG_21 AD23 PEG_RXP_10 AC45 10
AR12 AH15 AD24 AC41 11
MEM1_AMA(14)
MEM1_BMA(14)
AR13 RSVD_33 AH16 VCC_AXG_NCTF_47 VCC_AXG_23 AD28 PEG_RXP_12 AH47 12
AM12 AH17 AF21 AG49 13
AN13 RSVD_34 AH19 VCC_AXG_NCTF_48 VCC_AXG_24 AF26 PEG_RXP_13 AH45
AR37
AM36
n RSVD_35
RSVD_36
RSVD_37
AJ16
AJ17
VCC_AXG_NCTF_49
VCC_AXG_NCTF_50
VCC_AXG_NCTF_51
VCC_AXG_25
VCC_AXG_26
VCC_AXG_27
AA31
AH20
PEG_RXP_14
PEG_RXP_15
AG42
14
15
PCIE GFX
AL36 AJ19 AH21

m
RSVD_38 VCC_AXG_NCTF_52 VCC_AXG_28
R32
R33
R31
AM37 AK16 AH23 N45 C572 100nF
RSVD_39 VCC_AXG_NCTF_53 VCC_AXG_29 PEG_TXN_0 0
C48 RSVD_40 AK19 VCC_AXG_NCTF_54 VCC_AXG_30 AH24 PEG_TXN_1 U39 C570 100nF
D47 AL16 AH26 U47 C571 100nF 1
B44 RSVD_41 AL17 VCC_AXG_NCTF_55 VCC_AXG_31 AD31 PEG_TXN_2 N51 2
RSVD_42 VCC_AXG_NCTF_56 VCC_AXG_32 PEG_TXN_3
C567 100nF
3
1K
1K
1K
C44 RSVD_43 AL19 VCC_AXG_NCTF_57 VCC_AXG_33 AJ20 PEG_TXN_4 R50 C574 100nF
D20 AL20 AN14 T42 C564 100nF 4
2 OF 5
RSVD_44 VCC_AXG_NCTF_58 VCC_AXG_34 PEG_TXN_5

U504-2
B51 AL21 Y43 C573 100nF 5

RSVD_45 VCC_AXG_NCTF_59 PEG_TXN_6 6
AL23 T17 W46 C610 100nF
s GFX VCC NCTF
AM15 VCC_AXG_NCTF_60 VCC_AXG_NCTF_1 T18 PEG_TXN_7 W38 7

VCC_AXG_NCTF_61 VCC_AXG_NCTF_2 PEG_TXN_8
C618 100nF
1%
1%
1%
P27 AM16 T19 AD39 C612 100nF 8
LE88CLGM
N27 CFG_0 AM19 VCC_AXG_NCTF_62 VCC_AXG_NCTF_3 T21 PEG_TXN_9 AC46 9

CFG_1 VCC_AXG_NCTF_63 VCC_AXG_NCTF_4 PEG_TXN_10
C623 100nF
10
TP16378
N24 CFG_2 AM20 VCC_AXG_NCTF_64 VCC_AXG_NCTF_5 T22 PEG_TXN_11 AC49 C615 100nF
11
TP16379
C21 AM21 T23 AC42 C622 100nF
CFG_3 VCC_AXG_NCTF_65 VCC_AXG_NCTF_6 PEG_TXN_12 12
TP16373
C23 AM23 T25 AH39 C608 100nF
S fid
CFG_4 VCC_AXG_NCTF_66 VCC_AXG_NCTF_7 PEG_TXN_13 13
F23 AP15 U15 AE49 C616 100nF
N23 CFG_5 AP16 VCC_AXG_NCTF_67 VCC_AXG_NCTF_8 U16 PEG_TXN_14 AH44 14
CFG_6 VCC_AXG_NCTF_68 VCC_AXG_NCTF_9 PEG_TXN_15
C609 100nF
u
G23 AP17 U17 15

J20 CFG_7 AP19 VCC_AXG_NCTF_69 VCC_AXG_NCTF_10 U19
CFG_8 VCC_AXG_NCTF_70 VCC_AXG_NCTF_11
C20 CFG_9 AP20 VCC_AXG_NCTF_71 VCC_AXG_NCTF_12 U20 PEG_TXP_0 M45 C576 100nF
R24 AP21 U21 T38 C566 100nF 0
2
2
CFG_10 VCC_AXG_NCTF_72 VCC_AXG_NCTF_13 PEG_TXP_1

L23 AP23 U23 T46 C575 100nF 1
CFG

J23 AP24 U26 N50 C565 100nF 2
e

GFX VCC NCTF
E23 AR20 V16 R51 C578 100nF 3

E20 CFG_14 AR21 VCC_AXG_NCTF_76 VCC_AXG_NCTF_17 V17 PEG_TXP_5 U43 C569 100nF 4
K23 AR23 V19 W42 C577 100nF 5
n

M20 CFG_16 AR24 VCC_AXG_NCTF_78 VCC_AXG_NCTF_19 V20 PEG_TXP_7 Y47 C568 100nF 6
M24 AR26 V21 Y39
DRAW
C617 100nF 7
CHECK
18 L32 CFG_17 V26 VCC_AXG_NCTF_79 VCC_AXG_NCTF_20 V23 PEG_TXP_8 AC38

APPROVAL
C613 100nF 8
19 N33 V28 V24 AD47 C620 100nF 9
MODULE CODE
20 L35 CFG_19 V29 VCC_AXG_NCTF_81 VCC_AXG_NCTF_22 Y15 PEG_TXP_10 AC50
C614 100nF 10
n
Y31 VCC_AXG_NCTF_83 VCC_AXG_NCTF_24 Y16 PEG_TXP_12 AD43 C621 100nF 11

AG39 C611 100nF 12
PEG_TXP_13
PEG_TXP_14 AE50 C619 100nF 13
g
AH43 C641 100nF 14

PEG_TXP_15 15
t
KEVIN LEE
GUO LEI
ZHOU JUN
NC PM ME CLK DMI PCIE GFX

16-B1
16-C1 16-B1
EXT_GFX
REV
DATE
LAST EDIT
DEV. STEP
20-D4
20-C4
1.1
MP
4/10/2007
a
TITLE
NC_16
NC_15
NC_14
NC_13
NC_12
NC_11
NC_10
NC_9
NC_8
NC_7
NC_6
NC_5
NC_4
NC_3
NC_2
NC_1
DPRSLPVR
THERMTRIP*
RSTIN*
PWROK
PM_EXT_TS*_1
PM_EXT_TS*_0
PM_DPRSTP*
PM_BM_BUSY*
CL_VREF
CL_RST*
CL_PWROK
CL_DATA
CL_CLK
PEG_CLK*
PEG_CLK
DPLL_REF_SSCLK*
DPLL_REF_SSCLK
DPLL_REF_CLK*
DPLL_REF_CLK
DMI_TXP_3
DMI_TXP_2
DMI_TXP_1
DMI_TXP_0
DMI_TXN_3
DMI_TXN_2
DMI_TXN_1
DMI_TXN_0
DMI_RXP_3
DMI_RXP_2
DMI_RXP_1
DMI_RXP_0
DMI_RXN_3
DMI_RXN_2
DMI_RXN_1
DMI_RXN_0
GFX_VR_EN
GFX_VID_3
GFX_VID_2
GFX_VID_1
GFX_VID_0
PEG_COMPO
PEG_COMPI
MCH3_CFG(16)
MCH3_CFG(20:18)
A5
E1
J36
L36
L39
BJ1
A49
A50
B50
BL2
BL3
K45
K44
B42
E36
B39
A39
E35
C51
N20
H47
H48
C42
C38
N43
BK2
BK1
G36
G41
M43
l
BJ51
AJ42
AJ47
AJ41
AJ46
AJ39
AJ38
BL49
BL50
AT43
BK50
BK51
AV20
AK50
AN49
AN45
AN41
AN46
AN42
AN47
AM50
AM49
AM43
AM39
AM44
AM40
AM47
AW49
GFX1_TXP(15:0)
GFX1_TXN(15:0)
R98
R99
1%
100
MAIN
965GM(2)
TORINO 2
24-C2
31-B4
MCH1_CLVREF
R143
1
1
10K 1%
10K 1%
P1.05V
TP15303
March 28, 2007 3:33:29 PM

1%
24.9
R91
13-B1
45-C4 25-C2
11-B3 10-C4
25-C3 25-A3
31-C2
17-C2
18-C2
24-C2 10-D4
25-D2
13-B1
25-C1
31-C2
25-C1
25-C1
8-B1
8-B1
8-B1
8-B1
8-B1
8-B1
25-D1
25-D1
25-D1
25-D1
25-D1
25-D1
25-D1
25-D1
25-C1
25-D1
25-D1
25-D1
25-C1
25-D1
25-D1
25-D1
P3.3V
PAGE
PART NO.
13
P1.25V
TP15300
1K
1%
1%
392
CL3_CLK
R604
R603
CL3_RST#
CL3_DATA
DMI1_TXP3
DMI1_TXP2
DMI1_TXP1
DMI1_TXP0
PLT3_RST#
DMI1_TXN3
DMI1_TXN2
DMI1_TXN1
DMI1_TXN0
DMI1_RXP3
DMI1_RXP2
DMI1_RXP1
DMI1_RXP0
DMI1_RXN3
DMI1_RXN2
DMI1_RXN1
DMI1_RXN0
OF
MCH1_CLVREF
CLK1_DREFCLK
CPU1_DPRSTP#
0.350V
CLK1_DREFCLK#
CLK1_MCH3GPLL
GMCH3_EXTTS1#
GMCH3_EXTTS0#
CHP3_DPRSLPVR
CPU1_THRMTRIP#
GMCH3_BMBUSY#
CLK1_MCH3GPLL#
CLK1_DREFSSCLK
10V
KBC3_PWRGDMCH
KBC3_PWRGDMCH
CLK1_DREFSSCLK#
SAMSUNG
C642
100nF
P3.3V
54
BA41-00727/8A
ELECTRONICS
A
B
C
D
D:/users/mentor/Torino2/MP/T2_MP1.1_0410
4 3 2 1
SAMSUNG PROPRIETARY
MEM1_ADQ(63:0) 17-D2
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
AW44
AW47
AW43
AW40
AW36
AW41
AW11
BG47
BG50
BG42
BG40
BG10
AR43
AR41
AR45
BH49
BH45
AR40
AU15
BD10
AN10
AN11
BA45
AY46
BB45
BB47
BE45
BE44
BE40
AY41
AV38
AV13
AV11
BA13
BA11
BE10
AT42
BF48
BF44
BF40
AT39
AT38
AT13
AT11
BJ45
AW9
AM8
AM9
BD8
BD7
AR5
AR8
AR9
AN3
AN9
AY9
BB9
BB5
AY7
AY6
BB7
AT5
AT7
AT9
D D
SA_DQ_0
SA_DQ_1
SA_DQ_2
SA_DQ_3
SA_DQ_4
SA_DQ_5
SA_DQ_6
SA_DQ_7
SA_DQ_8
SA_DQ_9
SA_DQ_10
SA_DQ_11
SA_DQ_12
SA_DQ_13
SA_DQ_14
SA_DQ_15
SA_DQ_16
SA_DQ_17
SA_DQ_18
SA_DQ_19
SA_DQ_20
SA_DQ_21
SA_DQ_22
SA_DQ_23
SA_DQ_24
SA_DQ_25
SA_DQ_26
SA_DQ_27
SA_DQ_28
SA_DQ_29
SA_DQ_30
SA_DQ_31
SA_DQ_32
SA_DQ_33
SA_DQ_34
SA_DQ_35
SA_DQ_36
SA_DQ_37
SA_DQ_38
SA_DQ_39
SA_DQ_40
SA_DQ_41
SA_DQ_42
SA_DQ_43
SA_DQ_44
SA_DQ_45
SA_DQ_46
SA_DQ_47
SA_DQ_48
SA_DQ_49
SA_DQ_50
SA_DQ_51
SA_DQ_52
SA_DQ_53
SA_DQ_54
SA_DQ_55
SA_DQ_56
SA_DQ_57
SA_DQ_58
SA_DQ_59
SA_DQ_60
SA_DQ_61
SA_DQ_62
SA_DQ_63
BB19 AR49
MEM1_ABS0 17-C4 19-C2 BK19
SA_BS_0 SM_VREF_0
AW4
MEM1_ABS1 17-C4 19-C2 BF29
SA_BS_1 SM_VREF_1 44-B4 18-C2 17-C2
MEM1_VREF
MEM1_ABS2 17-C4 19-C2
SA_BS_2
AW30
MEM1_ADM(7:0) 17-B4 0 AT45
SM_CK*0
BA23 17-C4
CLK1_MCLK0#
1 BD44 SA_DM_0 SM_CK*1 AW25 17-C4
CLK1_MCLK1#
2 BD42
SA_DM_1 SM_CK*3
AW23 18-C4
CLK1_MCLK2#
DDR MUX
SA_DM_2 SYSTEM MEMORY A SM_CK*4 CLK1_MCLK3#
3 AW38 18-C4
SA_DM_3
4 AW13 AV29
5 BG8
SA_DM_4 SM_CK0
BB23 17-C4
CLK1_MCLK0
6 AY5
SA_DM_5 SM_CK1
BA25 17-C4
CLK1_MCLK1
7 AN6
SA_DM_6 SM_CK3
AV23 18-C4
CLK1_MCLK2
g
SA_DM_7 SM_CK4 18-C4
CLK1_MCLK3
MEM1_ADQS#(7:0) 17-B4 0 AT47 BE29
1 BD47
SA_DQS*_0 SM_CKE0
AY32 19-C2 17-C4
MEM1_CKE0
2 BC41
SA_DQS*_1 SM_CKE1
BD39 19-C2 17-C4
MEM1_CKE1
SA_DQS*_2 SM_CKE3 MEM1_CKE2
n
3 BA37 BG37 19-C2 18-C4
4 BA16 SA_DQS*_3 SM_CKE4 19-C2 18-C4
MEM1_CKE3
SA_DQS*_4
5 BH7 AY17
SA_DQS*_5 SB_BS_0 MEM1_BBS0
l
6 BC1 BG18 19-C2 18-C4
7 AP2
SA_DQS*_6 SB_BS_1
BG36 19-C2 18-C4
MEM1_BBS1
SA_DQS*_7 SB_BS_2 MEM1_BBS2
u
MEM1_ADQS(7:0) 17-B4 0 AT46 SA_DQS_0
U504-3 SB_DM_0 AR50 0
19-C2 18-C4
18-B4
MEM1_BDM(7:0)
a
1 BE48 BD49 1
SA_DQS_1 SB_DM_1
LE88CLGM
SYSTEM MEMORY A
2 BB43 BK45 2
SA_DQS_2 SB_DM_2
BC37 BL39
s
3 3
i
C 4 BB16 SA_DQS_3 SB_DM_3 BH12 4 C
SA_DQS_4 SB_DM_4
5 BH6 SA_DQS_5 3 OF 5 SB_DM_5 BJ7 5
t
6 BB2 BF3 6
SA_DQS_6 SB_DM_6
7 AP3 SA_DQS_7 SB_DM_7 AW2 7
MEM1_AMA(13:0) 17-D4 19-C4 0 BJ19 AU50 0 18-B4
MEM1_BDQS#(7:0)
SA_MA_0 SB_DQS*_0
m
1 BD20 BC50 1
n
2 BK27 SA_MA_1 SB_DQS*_1 BL45 2
SA_MA_2 SB_DQS*_2
3 BH28 SA_MA_3 SB_DQS*_3 BK38 3
4 BL24 BK12 4
5 BK28 SA_MA_4 SB_DQS*_4 BK7 5
SYSTEM MEMORY B
SA_MA_5 SB_DQS*_5
e
6 BJ27 BF2 6
7 BJ25 SA_MA_6 SB_DQS*_6 AV3 7
SA_MA_7 SB_DQS*_7
8 BL28
9 BA28
SA_MA_8
AT50 0 18-B4
MEM1_BDQS(7:0)
SA_MA_9 SB_DQS_0
10 BC19 BD50 1
S fid
SA_MA_10 SB_DQS_1
11 BE28 BK46 2
12 BG30 SA_MA_11 SB_DQS_2 BK39 3
SA_MA_12 SB_DQS_3
13 BJ16 BJ12 4
SA_MA_13 SB_DQS_4 BL7 5
SB_DQS_5
BL17 BE2 6
MEM1_ACAS# 17-C4 19-C2 BE18
SA_CAS* SB_DQS_6
AV2 7
MEM1_ARAS# 17-C4 19-C2 BA19
SA_RAS* SB_DQS_7
MEM1_AWE# 17-C4 19-C2 AY20
SA_WE*
BC18 0 19-B4 18-D4
MEM1_BMA(13:0)
SA_RCVEN* SB_MA_0 BG28 1
SB_MA_1
n
BG20 BG25 2
MEM1_CS0# 17-C4 19-D2 BK16 SM_CS*_0 SB_MA_2 AW17 3
MEM1_CS1# 17-C4 19-D2 BG16
SM_CS*_1 SB_MA_3
BF25 4
MEM1_CS2# SM_CS*_2 SB_MA_4
B MEM1_CS3#
18-C4 19-C2 BE13
SM_CS*_3 SB_MA_5
BE25 5 B
18-C4 19-C2 BA29 6
SB_MA_6
o
DDR MUX
BH18 BC28 7
MEM1_ODT0 17-B4 19-C2 BJ15 SM_ODT_0 SB_MA_7 AY28 8
MEM1_ODT1 17-B4 19-C2 BJ14
SM_ODT_1 SB_MA_8
BD37 9
MEM1_ODT2 18-B4 19-C2 BE16
SM_ODT_2 SB_MA_9
BG17 10
P1.8V_AUX MEM1_ODT3 18-B4 19-C2
SM_ODT_3 SB_MA_10
BE37 11
TP15302BL15 SB_MA_11
1% 22.6 R630 BA39 12
C
TP15301BK14 SM_RCOMP SYSTEM MEMORY B SB_MA_12
Route as short as possible 1% 22.6 R631 20ohm SM_RCOMP* SB_MA_13
BG13 13
BK31 BE17
SB_DQ_10
SB_DQ_11
SB_DQ_12
SB_DQ_13
SB_DQ_14
SB_DQ_15
SB_DQ_16
SB_DQ_17
SB_DQ_18
SB_DQ_19
SB_DQ_20
SB_DQ_21
SB_DQ_22
SB_DQ_23
SB_DQ_24
SB_DQ_25
SB_DQ_26
SB_DQ_27
SB_DQ_28
SB_DQ_29
SB_DQ_30
SB_DQ_31
SB_DQ_32
SB_DQ_33
SB_DQ_34
SB_DQ_35
SB_DQ_36
SB_DQ_37
SB_DQ_38
SB_DQ_39
SB_DQ_40
SB_DQ_41
SB_DQ_42
SB_DQ_43
SB_DQ_44
SB_DQ_45
SB_DQ_46
SB_DQ_47
SB_DQ_48
SB_DQ_49
SB_DQ_50
SB_DQ_51
SB_DQ_52
SB_DQ_53
SB_DQ_54
SB_DQ_55
SB_DQ_56
SB_DQ_57
SB_DQ_58
SB_DQ_59
SB_DQ_60
SB_DQ_61
SB_DQ_62
SB_DQ_63
SM_RCOMP_VOH SB_CAS* MEM1_BCAS#
SB_DQ_0
SB_DQ_1
SB_DQ_2
SB_DQ_3
SB_DQ_4
SB_DQ_5
SB_DQ_6
SB_DQ_7
SB_DQ_8
SB_DQ_9
P1.8V_AUX BL31 AV16 19-C2 18-C4

SM_RCOMP_VOL SB_RAS*
BC17 19-C2 18-C4
MEM1_BRAS#
SB_WE*
AY18 19-C2 18-C4
MEM1_BWE#
SB_RCVEN*
R152
1K
AP49
AR51
AW50
AW51
AN51
AN50
AV50
AV49
BA50
BB50
BA49
BE50
BA51
AY49
BF50
BF49
BJ50
BJ44
BJ43
BL43
BK47
BK49
BK43
BK42
BJ41
BL41
BJ37
BJ36
BK41
BJ40
BL35
BK37
BK13
BE11
BK11
BC11
BC13
BE12
BC12
BG12
BJ10
BL9
BK5
BL5
BK9
BK10
BJ8
BJ6
BF4
BH5
BG1
BC2
BK3
BE4
BD3
BJ2
BA3
BB3
AR1
AT3
AY2
AY3
AU2
AT2
1%
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
R154
0
1
2
3
4
5
6
7
8
9
3.01K MEM1_BDQ(63:0)
1% 18-D3
Dual Channel Ch. A (So-DIMM A) Ch. B (So-DIMM B)

R153 C227 C226
1K 10nF C228 10nF C229 SM_CK(2:0) SA_CK(2:0) N/A
1% 2200nF 2200nF SM_CK(2:0)* SA_CK(2:0)* N/A
16V 16V
A SM_CK(5:3) N/A SB_CK(2:0) A
SM_CK(5:3)* N/A SB_CK(2:0)*
SM_CS(1:0)* SA_CS(1:0)* N/A DRAW DATE TITLE
SM_CKE(1:0) SA_CKE(1:0) N/A ZHOU JUN 4/10/2007

TORINO 2 SAMSUNG
SM_ODT(1:0) SA_ODT(1:0) N/A CHECK DEV. STEP
ELECTRONICS
SM_CS(3:2)* N/A SB_CS(3:2)* GUO LEI MP MAIN
SM_SKE(3:2) N/A SB_CKE(3:2) APPROVAL REV PART NO.
KEVIN LEE 1.1 965GM(3) BA41-00727/8A

SM_ODT(3:2) N/A SB_ODT(3:2)
March 28, 2007 3:33:29 PM PAGE 14 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
SAMSUNG ELECTRONICS CO’S PROPERTY. P1.05V
EC4 C173 C625 C96 C174 C30
330uF 10000nF 10000nF
C580 220nF 220nF 220nF
P1.05V 2.5V 1000nF
P1.05V P3.3V P1.05V_PEG AL 6.3V 6.3V 16V 16V 16V
Check Load Transient

D D
B19
AM35
AR36
AR35
AH37
AH36
AH35
AH33
AD36
AD35
AD33
AC36
AC35
AC33
91nH, 20mOhm ESR
AP36
AP35
AK37
AK36
AK35
AK33
AB37
AB36
AB33
AA36
AA35
AA33
AF36
AF33
AL35
AL33
AJ36
AJ35
AJ33
U36
U35
U33
U32
U31
U29
Y37
Y36
Y35
Y33
Y32
V37
V36
V33
V32
T35
T34
T30
EXCML16A270u
P1.25V TP15314 P1.05V
VCC_NCTF_1
VCC_NCTF_2
VCC_NCTF_3
VCC_NCTF_4
VCC_NCTF_5
VCC_NCTF_6
VCC_NCTF_7
VCC_NCTF_8
VCC_NCTF_9
VCC_NCTF_10
VCC_NCTF_11
VCC_NCTF_12
VCC_NCTF_13
VCC_NCTF_14
VCC_NCTF_15
VCC_NCTF_16
VCC_NCTF_17
VCC_NCTF_18
VCC_NCTF_19
VCC_NCTF_20
VCC_NCTF_21
VCC_NCTF_22
VCC_NCTF_23
VCC_NCTF_24
VCC_NCTF_25
VCC_NCTF_26
VCC_NCTF_27
VCC_NCTF_28
VCC_NCTF_29
VCC_NCTF_30
VCC_NCTF_31
VCC_NCTF_32
VCC_NCTF_33
VCC_NCTF_34
VCC_NCTF_35
VCC_NCTF_36
VCC_NCTF_37
VCC_NCTF_38
VCC_NCTF_39
VCC_NCTF_40
VCC_NCTF_41
VCC_NCTF_42
VCC_NCTF_43
VCC_NCTF_44
VCC_NCTF_45
VCC_NCTF_46
VCC_NCTF_47
VCC_NCTF_48
VCC_NCTF_49
VCC_NCTF_50
B18 EC503 C674 C673
BLM18PG181SN1 330uF 10000nF 10000nF C89 AD51 VCC_PEG_1
2.5V
6.3V 6.3V
100nF V49
VCC_PEG_2 VCC_AXM_NCTF_1
AL24
AL V50 AL26
VCC_PEG_3 VCC_AXM_NCTF_2
R602 W50 AL28
W51 VCC_PEG_4 VCC_AXM_NCTF_3 AL29
1 VCC_PEG_5 VCC_AXM_NCTF_4
AL31
PEG
TP16385 TP16386 VCC_AXM_NCTF_5
U51 AL32
VCCA_PEG_PLL VCC_AXM_NCTF_6
VCC NCTF AM26
C672 VCC_AXM_NCTF_7
VCC AXM NCTF

C639 C640 K50 AM28
g
10000nF VCCA_PEG_BG VCC_AXM_NCTF_8
6.3V
100nF 100nF VCC_AXM_NCTF_9
AM29
P1.8V_AUX U48 AM31
VCCD_PEG_PLL VCC_AXM_NCTF_10
AM32
VCC_AXM_NCTF_11
INT_GFX R90 0 J41 VCCD_LVDS_1 VCC_AXM_NCTF_12 AM33
n
L500 H42 AP29
VCCD_LVDS_2 VCC_AXM_NCTF_13
LVDS
EXT_GFX AP31
1uH VCC_AXM_NCTF_14
TP16388 A41 AP32
VCCA_LVDS VCC_AXM_NCTF_15
l
C525 AP33
VCC_AXM_NCTF_16
330uF C526 C527 C90 C91 R95 R527 A43 VCC_TX_LVDS VCC_AXM_NCTF_17 AR31
U504-4
u
2.5V 10nF 10nF 100nF 10nF 0 0 VCC_AXM_NCTF_18
AR32
AL J32 AR33
VCC_SYNC VCC_AXM_NCTF_19
a
[email protected]. [email protected]. TP16390 A33
LE88CLGM
CRT
VCCA_CRT_DAC_1
B33 AJ23
s i
C P3.3V VCCA_CRT_DAC_2 VCC_AXM_1 C
INT_GFX
4 OF 5 VCC_AXM_2
AJ26
VCC AXM
R103 0 A30 VCCA_DAC_BG VCC_AXM_3 AK23
t
B514 AK24
EXT_GFX VCC_AXM_4
BLM18PG181SN1 C25 VCCA_TVA_DAC_1 VCC_AXM_5 AK29
B25 AT31
VCCA_TVA_DAC_2 VCC_AXM_6 AT33 P1.25V
C528 C26 C25 VCC_AXM_7
m
C92 R101 R27 C27
n
VCCA_TVB_DAC_1
TV
10000nF 100nF 22nF 100nF 0 0 B27 AW18
6.3V 25V VCCA_TVB_DAC_2 VCCA_SM_1
VCCA_SM_2 AV19
B28 AU19 EC16
A28 VCCA_TVC_DAC_1 VCCA_SM_3 AU18 C214 C671 C212 C670
150uF
a
VCCA_TVC_DAC_2 VCCA_SM_4 22000nF 22000nF 1000nF 4700nF
e
P1.25V [email protected].
A SM
INT_GFX AU17 6.3V
TP16391 B49 VCCA_SM_5 OXI
6.3V 6.3V 6.3V 10V
B518 MMZ1608S121AT
VCCA_DPLLA VCCA_SM_6
AT22
B11 MMZ1608S121AT TP16392 AT21
VCCA_SM_7
B520 MMZ1608S121AT H49
VCCA_DPLLB VCCA_SM_8
AT19
B519 MMZ1608S121AT AT18
S fid
VCCA_SM_9
PLL
TP16393 AL2 AT17

2.5V AL
2.5V AL
VCCA_HPLL VCCA_SM_10
22000nF 6.3V
A SM CK A SM NCTF
TP16394 AM2 AR17
R146 VCCA_MPLL VCCA_SM_NCTF_1 AR16
100nF
100nF
1 R87 R526 VCCA_SM_NCTF_2

100nF
100nF
100nF
100nF
330uF
330uF
0 0 AN2 P1.25V
VCCD_HPLL
C221 AJ50 VCC_DMI VCCA_SM_CK_1 BC29
22000nF BB29
EXT_GFX
DMI
6.3V VCCA_SM_CK_2 C669 C213 C211

EC2
C88
EC501
C524
C643
C644
C220
C626
C624
AH50 C27
VCC_RXR_DMI_1
AU28 TP16399
1000nF 1000nF 22000nF
n
AH51
VCC_RXR_DMI_2 VCC_AXD_1
100nF 6.3V 6.3V 6.3V
P1.05V AU24
VCC_AXD_2
C40 AT30
VCC AXD
VCC_HV_1 VCC_AXD_3
B B40 AT29 B
HV
VCC_HV_2 VCC_AXD_4 AT25

VCC_AXD_5
o
P1.05V_PEG TP16395 M32 VCC SM VCC SM CK VCC SM LF AT23 B20
VCCD_CRT VCC_AXD_6
TV/CRT
L29
VCCD_TVDAC
BLM18PG181SN1
VCC_SM_CK_1
VCC_SM_CK_2
VCC_SM_CK_3
VCC_SM_CK_4
Shared Filtering with VCC_PEG AR29
VCC_SM_LF_1
VCC_SM_LF_2
VCC_SM_LF_3
VCC_SM_LF_4
VCC_SM_LF_5
VCC_SM_LF_6
VCC_SM_LF_7
VCC_AXD_NCTF_1
N28
VCC_SM_10
VCC_SM_11
VCC_SM_12
VCC_SM_13
VCC_SM_14
VCC_SM_15
VCC_SM_16
VCC_SM_17
VCC_SM_18
VCC_SM_19
VCC_SM_20
VCC_SM_21
VCC_SM_22
VCC_SM_23
VCC_SM_24
VCC_SM_25
VCC_SM_26
VCC_SM_27
VCC_SM_28
VCC_SM_29
VCC_SM_30
VCC_SM_31
VCC_SM_32
VCC_SM_33
VCC_SM_34
VCC_SM_35
VCC_SM_36
P1.05V P3.3V VCCD_QDAC C172 C215
VCC_SM_1
VCC_SM_2
VCC_SM_3
VCC_SM_4
VCC_SM_5
VCC_SM_6
VCC_SM_7
VCC_SM_8
VCC_SM_9
B23
VCC AXF
VCC_AXF_1
B21
1000nF 22000nF
C
TP15315 10 VCC_AXF_2 6.3V 6.3V
1 3 R23 VCC_AXF_3
A21
D4 C24
MMBD301 100nF
AU30
AU32
AU33
AU35
AV33
AW33
AW35
AY35
BA32
BA33
BA35
BB33
BC32
BC33
BC35
BD32
BD35
BE32
BE33
BE35
BF33
BF34
BG32
BG33
BG35
BH32
BH34
BH35
BJ32
BJ33
BJ34
BK32
BK33
BK34
BK35
BL33
BK24
BK23
BJ24
BJ23
AW45
BC39
BE39
BD17
BD4
AW8
AT6
INT_GFX C530 C529
P1.5V 1000nF 10000nF
C208
C210
C209
C216
C219
C217
C218
6.3V 6.3V
R110 0
BLM18PG181SN1 TP15313
B12
P1.8V_AUX L501
6.3V 10000nF
6.3V 10000nF
16V 470nF
16V 220nF
16V 220nF
16V 100nF
16V 100nF
C93 C94 C95 R109 R106 1uH
100nF 100nF 100nF TP16396
0 0
EC504 C676 C716
330uF 22000nF C677 C680 C678 C679
[email protected]. 22000nF 100nF R629 22000nF
2.5V 1 10000nF 100nF
EXT_GFX AL 6.3V 6.3V
6.3V 6.3V
A A
DRAW DATE TITLE
CHECK
ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
ELECTRONICS
GUO LEI MP MAIN
KEVIN LEE 1.1 965GM(4) BA41-00727/8A

March 28, 2007 3:33:29 PM PAGE 15 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
AW12
AW16
AW24
AW29
AW32
AM41
AM45
D D
AN38
AN39
AN43
AR11
AR39
AR44
AR47
AU23
AU29
AU36
AU49
AU51
AP48
AP50
AV25
AV39
AV48
AY10
AY24
AY37
AY42
AY43
AY45
AY47
AY50
AT10
AT14
AT27
AT41
AT49
AW1
AW5
AW7
AM4
AN1
AN5
AN7
AR2
AR7
AU1
AU3
AP4
B10
VSS_71
VSS_72
VSS_73
VSS_74
VSS_75
VSS_76
VSS_77
VSS_78
VSS_79
VSS_80
VSS_81
VSS_82
VSS_83
VSS_84
VSS_85
VSS_86
VSS_87
VSS_88
VSS_89
VSS_90
VSS_91
VSS_92
VSS_93
VSS_94
VSS_95
VSS_96
VSS_97
VSS_98
VSS_99
VSS_100
VSS_101
VSS_102
VSS_103
VSS_104
VSS_105
VSS_106
VSS_107
VSS_108
VSS_109
VSS_110
VSS_111
VSS_112
VSS_113
VSS_114
VSS_115
VSS_116
VSS_117
VSS_118
VSS_119
VSS_120
A13 VSS_1 VSS_121 B20
A15 B24
VSS_2 VSS_122
A17 VSS_3 VSS_123 B29
A24 B30
AA21 VSS_4 VSS_124 B35
VSS_5 VSS_125
AA24 VSS B38
VSS_7 VSS_127
AB20 B5
VSS_9 VSS_129
AB23 VSS_10 C36 VSS_211 VSS_262 L24 VSS_130 B8
AB26 C7 L28 BA1 ** Note
g
AB28 VSS_11 D13 VSS_212 VSS_263 L3 VSS_131 BA17
AB31
VSS_12
D24
VSS_213 VSS_264
L33
VSS_132
BA18
Current Setting (def. : default Option)
VSS_13 VSS_214 VSS_265 VSS_133 Low High
AB32
VSS_14
D3
VSS_215 VSS_266
L49
VSS_134
BA2 CFG#
AC10 D32 M28 BA24
VSS_15 VSS_216 VSS_267 VSS_135 CFG(5) DMIx2 DMIx4 (def.)
n
AC13 D39 M42 BB12
AC3 VSS_16 D45 VSS_217 VSS_268 M46 VSS_136 BB25 CFG(9) PEG Reversal Normal
AC39
VSS_17
D49
VSS_218 VSS_269
M49
VSS_137
BB40
CFG(16) Dynamic ODT Dynamic ODT
VSS_18 VSS_219 VSS_270 VSS_138
l
AC43 E10 M5 BB44 Disabled Enabled (def.)
VSS_19 VSS_220 VSS_271 VSS_139 CFG(18) VCC 1.05V (def.) VCC 1.5V
AC47 E16 M50 BB49
VSS_20 VSS_221 U504-5 VSS_272 VSS_140
u
AD1
VSS_21
E24
VSS_222 VSS_273
M9
VSS_141
BB8 CFG(19) DMI Lane Normal DMI Lane Reversal
AD21 E28 N11 BC16
VSS_22 VSS_223 LE88CLGM VSS_274 VSS_142 CFG(20) SDVO or PCIE X1 SDVO and PCIE X1
a
AD26 E32 N14 BC24
AD29 VSS_23 E47 VSS_224 VSS_275 N17 VSS_143 BC25 Only(def.) Simultaneously
AD3
VSS_24
F19
VSS_225
5 OF 5 VSS_276
N29
VSS_144
BC36 SDVO_CTRL_DATA No SDVO Device SDVO Device Present
s i
C AD32 VSS_25 F36 VSS_226 VSS_277 N32 VSS_145 BC40 Present (def.) C
AD41 VSS_27 F4 VSS_228 VSS_279 N36 VSS_147 BC51
t
AD45 F40 N39 BD13
AD49 VSS_29 F50 VSS_230 VSS_281 N44 VSS_149 BD2
AD5 G1 N49 BD28
AD50 VSS_30 G13 VSS_231 VSS_282 N7 VSS_150 BD45
m
AD8 G16 P19 BD48
n
AE10 VSS_32 G19 VSS_233 VSS_284 P2 VSS_152 BD5
AE14 VSS_34 G24 VSS_235 VSS_286 P23 VSS_154 BE1
AE6 G28 P29 BE19
VSS
VSS
VSS
AF20 VSS_35 G29 VSS_236 VSS_287 P3 VSS_155 BE23
VSS
a
e
AF23 G33 P50 BE30 P3.3V
AF24 VSS_37 G42 VSS_238 VSS_289 R49 VSS_157 BE42
AF28 VSS_39 G45 VSS_240 VSS_291 T39 VSS_159 BE51 MCH3_CFG(18) TP16220
AF29 G48 T43 BE8 13-A2
AF31 G8 T47 BF12 R102 1K
S fid
VSS_41 VSS_242 VSS_293 VSS_161 MCH3_CFG(19) NO_STUFF
AG2 H24 U41 BF16 13-A2
AG38 VSS_42 H28 VSS_243 VSS_294 U45 VSS_162 BF36
VSS_43 VSS_244 VSS_295 VSS_163 MCH3_CFG(20) TP16221
AG43 H4 U50 BG19 13-A2
AG47 VSS_44 H45 VSS_245 VSS_296 V2 VSS_164 BG2
VSS_45 VSS_246 VSS_297 VSS_165 SDVO_CTRL_DATA TP16222
AG50 VSS_46 H50 VSS_247 VSS_298 V3 VSS_166 BG24 13-B4
AH3 J11 W11 BG29
VSS_47 VSS_248 VSS_299 VSS_167 MCH3_CFG(5) TP16223
AH40 VSS_48 J16 VSS_249 VSS_300 W39 VSS_168 BG39 13-A3
AH41 J2 W43 BG48 TP16401
R111 2K 1%
VSS_49 VSS_250 VSS_301 VSS_169 MCH3_CFG(9) TP16402 NO_STUFF
AH7
VSS_50
J24
VSS_251 VSS_302
W47
VSS_170
BG5 MCH3_CFG(16)
13-A3 R112 2K 1%
NO_STUFF
n
AH9 J28 W5 BG51 13-A2
AJ11 VSS_51 J33 VSS_252 VSS_303 W7 VSS_171 BH17
VSS_52 VSS_253 VSS_304 VSS_172 ** Note
AJ13 VSS_53 J35 VSS_254 VSS_305 Y11 VSS_173 BH30
B AJ21
VSS_54
J39
VSS_255 VSS_306
Y13
VSS_174
BH44 CFG(17:3) Internal Pull-up B
AJ24 K12 Y2 BH46
VSS_55 VSS_256 VSS_307 VSS_175 CFG(20:18) Internal Pull-down
o
AJ29 K47 Y41 BH8
AJ32 VSS_56 K8 VSS_257 VSS_308 Y45 VSS_176 BJ11
AJ43 VSS_58 L1 VSS_259 VSS_310 Y49 VSS_178 BJ13
AJ45 L17 Y5 BJ38
AJ49 VSS_60 L20 VSS_261 VSS_312 Y50 VSS_180 BJ4
AK20 BJ42
C
AK21 VSS_61 VSS_181 BJ46
VSS_62 VSS_182
AK26 BK15
AK28 VSS_63 VSS SCB VSS NCTF VSS VSS_183 BK17
VSS_64 VSS_184
AK31 VSS_65 VSS_185 BK25
VSSA_PEG_BG
VSSA_DAC_BG
AK51 BK29
VSS_NCTF_10
VSS_NCTF_11
VSS_NCTF_12
VSS_NCTF_13
VSS_NCTF_14
VSS_NCTF_15
VSS_NCTF_16
VSS_NCTF_17
VSS_NCTF_18
VSS_NCTF_19
VSS_NCTF_20
VSS_NCTF_21
VSS_66 VSS_186
VSS_NCTF_1
VSS_NCTF_2
VSS_NCTF_3
VSS_NCTF_4
VSS_NCTF_5
VSS_NCTF_6
VSS_NCTF_7
VSS_NCTF_8
VSS_NCTF_9
AL1 BK36
VSSA_LVDS
VSS_SCB_1
VSS_SCB_2
VSS_SCB_3
VSS_SCB_4
VSS_SCB_5
VSS_SCB_6
VSS_67 VSS_187
AM11 BK40
VSS_68 VSS_188
VSS_191
VSS_192
VSS_193
VSS_194
VSS_195
VSS_196
VSS_197
VSS_198
VSS_199
VSS_200
VSS_201
VSS_202
VSS_203
VSS_204
VSS_205
VSS_206
VSS_207
VSS_208
VSS_209
VSS_210
AM13 BK44
VSS_69 VSS_189
AM3 BK6
VSS_70 VSS_190
K49
B41
B32
A3
B2
A51
BL1
BL51
C1
AA19
AB17
AB35
AD19
AD37
AF17
AF35
AK17
AM17
AM24
AP26
AP28
AR15
AR19
AR28
T27
T37
U24
U28
V31
V35
BK8
BL11
BL13
BL19
BL22
BL37
BL47
C12
C16
C19
C28
C29
C33
T33
T31
T29
R28
C50
C46
C41
A A
DRAW DATE TITLE
CHECK
ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
ELECTRONICS
GUO LEI MP MAIN
KEVIN LEE 1.1 965GM(5) BA41-00727/8A

March 28, 2007 3:33:29 PM PAGE 16 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
SODIMM0 (TOP)
D DDR1-1 D
DDR2-SODIMM-200P-STD
MEM1_AMA(14:0) 13-A3 14-C4 19-C4 1/2 14-D4
MEM1_ADQ(63:0)
0 102 5 0
A0 DQ0
1 101 7 1
A1 DQ1
2 100 17 2
A2 DQ2
3 99 19 3
A3 DQ3
4 98 4 4
A4 DQ4
5 97 6 5
A5 DQ5
6 94 14 6
A6 DQ6
7 92
A7 DQ7
16 7 DDR1-2
8 93 23 8 P1.8V_AUX
9 91
A8 DQ8
25 9
DDR2-SODIMM-200P-STD
g
10 105
A9
A10_AP
DQ9
DQ10
35 10 2/2
11 90 37 11 112 18
A11 DQ11 VDD1 VSS16
12 89 20 12 111 24
A12 DQ12 VDD2 VSS17
13 116 22 13 117 41
A13 DQ13 VDD3 VSS18
n
14 86 36 14 96 53
A14 DQ14 VDD4 VSS19
84 38 15 95 42
A15 DQ15 VDD5 VSS20
85 43 16 118 54
MEM1_ABS2 A16_BA2 DQ16 VDD6 VSS21
l
14-D4 19-C2 45 17 81 59
DQ17 P3.3V VDD7 VSS22
107 55 18 82 65
MEM1_ABS0 BA0 DQ18 VDD8 VSS23
u
14-D4 19-C2 106 57 19 87 60
MEM1_ABS1 14-D4 19-C2
BA1 DQ19
44 20 103
VDD9 VSS24
66
DQ20 VDD10 VSS25
a
110 46 21 88 127
MEM1_CS0# 14-B4 19-D2 115
S0* DQ21
56 22 C810 C809 104
VDD11 VSS26
139
MEM1_CS1# S1* DQ22 VDD12 VSS27
100nF
s
58 23 2200nF 128
i
14-B4 19-D2
C 30
DQ23
61 24 199
VSS28
145 C
CLK1_MCLK0 14-D1 32
CK0 DQ24
63 25
VDDSPD VSS29
165
CLK1_MCLK0# CK0* DQ25 VSS30
t
14-D1 164 73 26 83 171
CLK1_MCLK1 14-D1 166
CK1 DQ26
75 27 120
NC1 VSS31
172
CLK1_MCLK1# 14-D1 79
CK1* DQ27
62 28 50
NC2 VSS32
177
MEM1_CKE0 14-C1 19-C2 80
CKE0 DQ28
64 29 GMCH3_EXTTS0# 13-B1 69
NC3 VSS33
187
MEM1_CKE1 CKE1 DQ29 NC4 VSS34
m
14-C1 19-C2 74 30 163 178
n
DQ30 NCTEST VSS35
113 76 31 190
MEM1_ACAS# 14-B4 19-C2 108
CAS* DQ31
123 32 1
VSS36
9
MEM1_ARAS# 14-B4 19-C2 109
RAS* DQ32
125 33
MEM1_VREF 14-D1 18-C2 44-B4
VREF VSS37
21
MEM1_AWE# 14-B4 19-C2
WE* DQ33
135 34 C799 C798 201
VSS38
33
a
TP16403 DQ34 GND0 VSS39
e
R772 10K 198
SA0 DQ35
137 35 2200nF 100nF 202
GND1 VSS40
155
R771 10K TP16404 200 124 36 34
SA1 DQ36 VSS41
197 126 37 47 132
CLK3_SMBCLK 8-A2 8-C4 18-C4 195
SCL DQ37
134 38 133
VSS1 VSS42
144
CLK3_SMBDATA 8-A2 8-B4 18-B4
SDA DQ38
136 39 183
VSS2 VSS43
156
S fid
DQ39 VSS3 VSS44
114 141 40 77 168
MEM1_ODT0 14-B4 19-C2 119
ODT0 DQ40
143 41 12
VSS4 VSS45
2
MEM1_ODT1 14-B4 19-C2
ODT1 DQ41
151 42 48
VSS5 VSS46
3
MEM1_ADM(7:0) 14-D4 0 10
DQ42
153 43 184
VSS6 VSS47
15
DM0 DQ43 VSS7 VSS48
1 26 140 44 78 27
DM1 DQ44 VSS8 VSS49
2 52 142 45 71 39
DM2 DQ45 VSS9 VSS50
3 67 152 46 72 149
DM3 DQ46 VSS10 VSS51
4 130 154 47 121 161
5 147 157 48 122 28
n
6 170 159 49 196 40
7 185 173 50 193 138
175 51 8 150
MEM1_ADQS(7:0) DQ51 VSS15 VSS56
B 14-C4 0 13
DQS0 DQ52
158 52
VSS57
162 B
1 31 160 53
DQS1 DQ53
o
2 51 174 54
DQS2 DQ54
3 70 176 55 3709-001325
DQS3 DQ55
4 131 179 56
DQS4 DQ56
5 148 181 57
DQS5 DQ57
6 169 189 58
DQS6 DQ58 P1.8V_AUX
7 188 191 59
C
DQS7 DQ59
180 60
MEM1_ADQS#(7:0) 14-C4 0 11
DQ60
182 61
DQS*0 DQ61
1 29 192 62
DQS*1 DQ62
2 49
DQS*2 DQ63
194 63 C800 C803 C780 C786 C784 C801 C802 C776
3 68
DQS*3
2200nF 2200nF 2200nF 2200nF 100nF 100nF 100nF 100nF
4 129
DQS*4
5 146
DQS*5
6 167
DQS*6
7 186
DQS*7
3709-001325
Height: 4mm
SMBUS ADDR.: "A0h"
A A
DRAW DATE TITLE
CHECK
ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
ELECTRONICS
GUO LEI MP MAIN
KEVIN LEE 1.1 DDR2 SODIMM (TOP) BA41-00727/8A

March 28, 2007 3:33:29 PM PAGE 17 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
SODIMM1 (BOTTOM)
D DDR500-1 DDR500-2 D
P1.8V_AUX
DDR2-SODIMM-200P-STD DDR2-SODIMM-200P-STD
MEM1_BMA(14:0) 13-A3 14-B1 19-B4 1/2 14-A1
MEM1_BDQ(63:0) 2/2
0 102 5 0 112 18
A0 DQ0 VDD1 VSS16
1 101 7 1 111 24
A1 DQ1 VDD2 VSS17
2 100 17 2 117 41
A2 DQ2 P3.3V VDD3 VSS18
3 99 19 3 96 53
A3 DQ3 VDD4 VSS19
4 98 4 4 95 42
A4 DQ4 VDD5 VSS20
5 97 6 5 118 54
A5 DQ5 VDD6 VSS21
6 94 14 6 81 59
A6 DQ6 C719 VDD7 VSS22
7 92
A7 DQ7
16 7 C718 2200nF
82
VDD8 VSS23
65
8 93
A8 DQ8
23 8 100nF 16V
87
VDD9 VSS24
60
9 91 25 9 103 66
g
A9 DQ9 VDD10 VSS25
10 105 35 10 88 127
A10_AP DQ10 VDD11 VSS26
11 90 37 11 104 139
A11 DQ11 VDD12 VSS27
12 89 20 12 128
A12 DQ12 VSS28
13 116 22 13 199 145
A13 DQ13 VDDSPD VSS29
n
14 86 36 14 165
A14 DQ14 VSS30
84 38 15 83 171
A15 DQ15 NC1 VSS31
14-C1 19-C2 85 43 16 120 172
MEM1_BBS2 A16_BA2 DQ16 NC2 VSS32
l
45 17 50 177
14-C1 19-C2 107
DQ17
55 18
GMCH3_EXTTS1# 13-B1 69
NC3 VSS33
187
MEM1_BBS0 BA0 DQ18 NC4 VSS34
u
14-C1 19-C2 106 57 19 163 178
MEM1_BBS1 BA1 DQ19
44 20
NCTEST VSS35
190
DQ20 VSS36
a
110 46 21 1 9
MEM1_CS2# 14-B4 19-C2 115
S0* DQ21
56 22 MEM1_VREF 14-D1 17-C2 44-B4
VREF VSS37
21
MEM1_CS3# S1* DQ22 C715 VSS38
C668
s
58 23 201 33
i
14-B4 19-C2
C 30
DQ23
61 24 100nF 2200nF
202
GND0 VSS39
155 C
CLK1_MCLK2 14-D1 32
CK0 DQ24
63 25
16V GND1 VSS40
34
CLK1_MCLK2# CK0* DQ25 VSS41
t
14-D1 164 73 26 47 132
CLK1_MCLK3 14-C1 166
CK1 DQ26
75 27 133
VSS1 VSS42
144
CLK1_MCLK3# 14-D1 79
CK1* DQ27
62 28 183
VSS2 VSS43
156
MEM1_CKE2 14-C1 19-C2 80
CKE0 DQ28
64 29 77
VSS3 VSS44
168
MEM1_CKE3 CKE1 DQ29 VSS4 VSS45
m
14-C1 19-C2 74 30 12 2
n
DQ30 VSS5 VSS46
14-B1 19-C2 113 76 31 48 3
P3.3V MEM1_BCAS# 14-B1 19-C2 108
CAS* DQ31
123 32 184
VSS6 VSS47
15
MEM1_BRAS# 14-B1 19-C2 109
RAS* DQ32
125 33 78
VSS7 VSS48
27
MEM1_BWE# WE* DQ33
135 34 71
VSS8 VSS49
39
a
DQ34 VSS9 VSS50
e
R203 10K TP1161 198
SA0 DQ35
137 35 72
VSS10 VSS51
149
R204 10K TP1162 200
SA1 DQ36
124 36 121
VSS11 VSS52
161
197 126 37 122 28
CLK3_SMBCLK 8-A2 8-C4
8-B4 17-C4
17-B4 195
SCL DQ37
134 38 196
VSS12 VSS53
40
CLK3_SMBDATA SDA DQ38
136 39 193
VSS13 VSS54
138
S fid
DQ39 VSS14 VSS55
14-B4 19-C2 114 141 40 8 150
MEM1_ODT2 14-B4 19-C2 119
ODT0 DQ40
143 41
VSS15 VSS56
162
MEM1_ODT3 ODT1 DQ41
151 42
VSS57
MEM1_BDM(7:0) 14-C1 0 10
DQ42
153 43
DM0 DQ43
1 26 140 44 3709-001375
DM1 DQ44
2 52 142 45
DM2 DQ45
3 67 152 46
DM3 DQ46
4 130 154 47
DM4 DQ47
5 147 157 48
DM5 DQ48
n
6 170 159 49
DM6 DQ49
7 185 173 50
MEM1_BDQS(7:0) 14-C1
DM7 DQ50
175 51
DQ51
B 0 13
DQS0 DQ52
158 52 B
1 31 160 53
DQS1 DQ53
o
2 51 174 54
DQS2 DQ54
3 70 176 55
DQS3 DQ55 P1.8V_AUX
4 131 179 56
DQS4 DQ56
5 148 181 57
DQS5 DQ57
6 169 189 58
DQS6 DQ58
7 188 191 59
C
MEM1_BDQS#(7:0) 14-C1
DQS7 DQ59
180 60
DQ60
0 11
DQS*0 DQ61
182 61 C675 C747 C746 C749 C717 C748 C745 C246
1 29
DQS*1 DQ62
192 62 2200nF 2200nF 2200nF 2200nF 100nF 100nF 100nF 100nF
2 49 194 63
DQS*2 DQ63
3 68
DQS*3
4 129
DQS*4
5 146
DQS*5 NO_STUFF
6 167
DQS*6
7 186
DQS*7 EMI500 EMI501 EMI503
3709-001375 EMI EMI EMI
SMBUS ADDR "A4h" CONTACT-PLATE-EMI CONTACT-PLATE-EMI CONTACT-PLATE-EMI
A A
DRAW DATE TITLE
CHECK
ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
ELECTRONICS
GUO LEI MP MAIN
KEVIN LEE 1.1 DDR2 SODIMM (BOTTOM) BA41-00727/8A

March 28, 2007 3:33:29 PM PAGE 18 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
D D
P0.9V
RA508-1 1 2 56
MEM1_CS0#
MEM1_CS1#
14-B4 17-C4 RA515-2 3 4 56
14-B4 17-C4 RA11-1 1 2 56
g
MEM1_CS2# 14-B4 18-C4 RA6-1 1 2 56
P0.9V MEM1_CS3# 14-B4 18-C4
MEM1_AMA(14:0) 13-A3 14-C4 17-D4 RA510-1 1 2 56
MEM1_CKE0
0 RA507-1 1 2 56
MEM1_CKE1
14-C1 17-C4 R755 56
n
1 RA513-2 3 4 56 14-C1 17-C4 RA1-1 1 2 56
2 RA506-2 3 4 56 MEM1_CKE2 14-C1 18-C4 R202 56
MEM1_CKE3
3 R769 56 14-C1 18-C4
l
RA509-2 3 4 56
MEM1_ODT0
4 RA506-1 1 2 56
MEM1_ODT1
14-B4 17-B4 R770 56
u
5 RA512-1 1 2 56 14-B4 17-B4 RA12-2 3 4 56
MEM1_ODT2
6 RA505-2 3 4 56
MEM1_ODT3
14-B4 18-B4 RA6-2 3 4 56
a
7 RA504-2 3 4 56 14-B4 18-B4
RA514-1 1 2 56
MEM1_ABS0
RA512-2 RA507-2
s
8 56 56
i
3 4 14-D4 17-C4 3 4
C 9 RA511-2 3 4 56 MEM1_ABS1 14-D4 17-C4 RA510-2 3 4 56 C
MEM1_ABS2
10 RA513-1 1 2 56 14-D4 17-C4
t
11 RA505-1 1 2 56 RA515-1 1 2 56
MEM1_ACAS#
MEM1_ARAS#
14-B4 17-C4 RA508-2 3 4 56
12 RA511-1 1 2 56 14-B4 17-C4 RA514-2 3 4 56
13 RA509-1 1 2 56 MEM1_AWE# 14-B4 17-C4
m
14 RA504-1 1 2 56 R169 56
n
MEM1_BBS0 14-C1 18-C4 RA10-1 1 2 56
MEM1_BBS1
MEM1_BBS2
14-C1 18-C4 RA1-2 3 4 56
14-C1 18-C4
RA5-2 3 4 56
a
MEM1_BCAS#
e
14-B1 18-C4 RA11-2 3 4 56
MEM1_BRAS# 14-B1 18-C4 RA5-1 1 2 56
MEM1_BWE# 14-B1 18-C4
MEM1_BMA(14:0) 13-A3 14-B1 18-D4
0
1
2
3
S fid
RA10-2
RA4-2
RA9-1
RA4-1
3
3
1
1
4
4
2
2
56
56
56
56
P0.9V
n
4 RA9-2 3 4 56 P0.9V
5 RA3-2 3 4 56
B 6 RA8-1 1 2 56 B
7 RA8-2 3 4 56
o
8 RA3-1 1 2 56 C279 C252 C248 C249 C278 C251 C277 C245 C247 C276 C275 C250
9 RA2-2 3 4 56
10 R170 56 100nF 100nF 100nF 100nF 100nF 100nF 100nF 100nF 100nF 100nF 100nF 100nF
11 RA7-1 1 2 56
C
12 RA2-1 1 2 56
13 RA12-1 1 2 56
14 RA7-2 3 4 56 C775 C788 C790 C777 C789 C781 C785 C787 C779 C782 C783 C778
100nF 100nF 100nF 100nF 100nF 100nF 100nF 100nF 100nF 100nF 100nF 100nF
Place one cap close to every 2 pull-up resistors terminated to P0.9V
A A
DRAW DATE TITLE
CHECK
ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
ELECTRONICS
GUO LEI MP MAIN
KEVIN LEE 1.1 DDR2 TERMINATION BA41-00727/8A

March 28, 2007 3:33:29 PM PAGE 19 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL P3.3V
PROPRIETARY INFORMATION THAT IS 28-C4
SAMSUNG ELECTRONICS CO’S PROPERTY. 28-C4
GFX3_EDID_DATA
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS TP16321 GFX3_EDID_CLK
GFX3_MEMVID TP16209 R123
EXCEPT AS AUTHORIZED BY SAMSUNG. 10K Disable I2CB by BIOS
GFX3_VID0 47-C4 TP16208 1%
TP16332
TP16333
TP16334
TP16335
TP16337
GFX3_BKLTEN 28-C2 TP16207 29-A2
GFX3_DDCDATA
GFX3_VDDEN 28-D2 TP16206 TP16205 29-A4
GFX3_DDCCLK
GFX3_BKLTCTRL 28-B4
GFX3_THERM#
TP16164
TP16165 TP16163
TP16162 R903 0 NB8M: I2CS_SDA
G72M: GND
D D
AD27
AD26
AD25
AE27
AE26
NO_STUFF
C10
C12
C13
D10
D11
A10
B10
B12
A12
A13
B13
B15
A15
B16
E12
E10
F10
F11
F12
D9
D2
D3
D1
D8
A9
E9
F3
F9
GFX1_TXP(15:0)
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
GPIO8
GPIO9
GPIO10
GPIO11
GPIO12
GPIO13
GPIO14
ROM_SCLK
ROM_SI
ROM_SO
ROMCS#
JTAG_TCK
JTAG_TDI
JTAG_TDO
JTAG_TMS
JTAG_TRST#
I2CC_SDA
I2CC_SCL
I2CB_SDA
I2CB_SCL
I2CA_SDA
I2CA_SCL
I2CS_SDA
I2CS_SCL
NC
13-D1 0 AF1 T4
1 AG3
PEX_RX0 IFPA_TXC
U4 28-B4
GFX1_ACLK
2 AF4
PEX_RX1 IFPA_TXC#
N4 28-B4
GFX1_ACLK#
3 AG6
PEX_RX2 IFPA_TXD0
N5 28-C4
GFX1_ADATA0
4 AF7 PEX_RX3 IFPA_TXD0# R5 28-C4
GFX1_ADATA0#
5 AG9
PEX_RX4 IFPA_TXD1
R4 28-C4
GFX1_ADATA1
6 AF10 PEX_RX5 IFPA_TXD1# T5 28-C4
GFX1_ADATA1#
7 AG12
PEX_RX6 GPIO I2C IFPA_TXD2
T6 28-B4
GFX1_ADATA2
8 AG15
PEX_RX7 IFPA_TXD2#
R6 28-B4
GFX1_ADATA2#
PEX_RX8 IFPA_TXD3
9 AF16 PEX_RX9 IFPA_TXD3# P6
10 AG18
g
PEX_RX10
11 AF19
PEX_RX11
U6 R81 1K NO_STUFF
12 AG21 LVDS IFPAB_RSET
N6 C69 10nF 16V NO_STUFF
PEX_RX12 IFPAB_VPROBE
13 AF22
PEX_RX13
14 AG24 PEX_RX14 IFPB_TXC W5
n
15 AG26 W6
GFX1_TXN(15:0) AG2 PEX_RX15 IFPB_TXC# W3
13-D1 0
1 AG4
PEX_RX0# U503-1 IFPB_TXD4
W2
PEX_RX1# IFPB_TXD4#
l
2 AF5 NB8M-SE AA2
PEX_RX2# IFPB_TXD5
3 AG7 PEX_RX3# IFPB_TXD5# AA3
u
4 AF8
PEX_RX4# (23X23) IFPB_TXD6
AB1
5 AG10 AA1
PEX_RX5# 1/4 IFPB_TXD6#
a
6 AF11 AB3
7 AG13 PEX_RX6# IFPB_TXD7 AB2
PEX_RX7# IFPB_TXD7#
AG16
s
8
i
C 9 AF17 PEX_RX8# V1 C
PEX_RX9# IFPC_TXC
10 AG19 PEX_RX10# IFPC_TXC# W1
t
11 AF20 T1
PEX_RX11# IFPC_TXD0
12 AG22 PEX_RX12# IFPC_TXD0# R1
13 AF23 T3
14 AG25 PEX_RX13# IFPC_TXD1 T2
PEX_RX14# TMDS IFPC_TXD1#
m
15 AF27 V2
n
PEX_RX15# IFPC_TXD2 V3
GFX1_RXP(15:0) IFPC_TXD2#
13-D4 0 C82 100nF AD5 PEX_TX0
NO_STUFF
1 C86 100nF AE6
PEX_TX1 IFPCD_RSET
J3 R73 1K
2 C80 100nF AD7 PCI EXPRESS M5
a
PEX_TX2 IFPCD_VPROBE
e
3 C85 100nF AE9
PEX_TX3
4 C79 100nF AD10 TP16169
AE1
PEX_TX4 DACA_RED TP16170 GFX3_RED
5 C167 100nF AE12 PEX_TX5 DACA_GREEN AD1 29-C4
GFX3_GREEN
6 C156 100nF AD13 TP16171
AD2 29-C4
PEX_TX6 DACA_BLUE GFX3_BLUE
7 C170 100nF AC15 29-C4
S fid
PEX_TX7 TP16172
8 C161 100nF AE15 DAC1 AD4
9 C169 100nF AC18 PEX_TX8 DACA_HSYNC TP16173
AC4 29-B4
GFX3_HSYNC
PEX_TX9 DACA_VSYNC GFX3_VSYNC
10 C159 100nF AE18
PEX_TX10
29-B4
11 C168 100nF AC21 TP16204
AD3
PEX_TX11 DACA_RSET
12 C162 100nF AE21 PEX_TX12
13 C166 100nF AD22
PEX_TX13 DACB_RED
F4 R18 R86 R84 R85
14 C204 100nF AF25 PEX_TX14 DACB_GREEN E4 124 150 150 150
15 C206 100nF AE24 D5 1% 1% 1% 1%
GFX1_RXN(15:0) 13-D4 0 C81 100nF AD6 PEX_TX15 DACB_BLUE
PEX_TX0#
n
1 C84 100nF AE7 E6
2 C77 100nF AC7 PEX_TX1# DAC2 DACB_HSYNC F5
PEX_TX2# DACB_VSYNC
3 C83 100nF AE10 PEX_TX3#
B 4 C78 100nF AC10
PEX_TX4# DACB_CSYNC
F7 B
5 C87 100nF AE13
PEX_TX5#
o
6 C163 100nF AC13
PEX_TX6# DACB_RSET
D6 R51 124 1% NO_STUFF
7 C171 100nF AD15
PEX_TX7#
8 C160 100nF AE16 B1 TP16200
PEX_TX8# XTALIN CLK3_27M
9 C164 100nF AD18
PEX_TX9# CLK XTALOUT
C2 R748 150 1% NO_STUFF 8-B1
10 C158 100nF AE19 PEX_TX10# R58 10K 1% STUFF it if G72M used
11 C165 100nF AD21 C3TP16198 R57 10K 1%
C
PEX_TX11# XTALOUTBUFF C1TP16197
12 C157 100nF AE22
PEX_TX12# XTALSSIN CLK3_27M_SS
13 C205 100nF AD23
PEX_TX13#
R747 150 1% 8-B1
14 C203 100nF AE25
PEX_TX14# SPDIF
D12
15 C207 100nF AD24 PEX_TX15#
NO_STUFF
A6
MIOBCAL_PD_VDDQ
P3.3V BUFRST#
AF13
MIOBCAL_PU_GND
PEX_TSTCLK_OUT
AF14 C9TP16174
PEX_TSTCLK_OUT# THERMDN GFX3_THERMDN
MIOB_CLKOUT#
AE3 THERM B9 TP16175
MIOB_CLKOUT
11-C2
CLK1_PCIEGFX PEX_REFCLK THERMDP GFX3_THERMDP
MIOA_HSYNC
MIOB_HSYNC
MIOB_VSYNC
8-B1 AE4 11-C2
MIOB_CLKIN
MIOB_VREF
CLK1_PCIEGFX# PEX_REFCLK#
MIOB_CTL3
8-B1 C7
I2CH_SCL
MIOB_DE
MIOAD10
MIOBD10
MIOBD11
R49 10K 1%TP16195A7

MIOAD0
MIOAD1
MIOAD2
MIOAD3
MIOAD4
MIOAD5
MIOAD6
MIOAD7
MIOAD8
MIOAD9
MIOBD0
MIOBD1
MIOBD2
MIOBD3
MIOBD4
MIOBD5
MIOBD6
MIOBD7
MIOBD8
MIOBD9
NO_STUFF SWAPRDY
R53 10K 1% D7 B7 TP16203
AC6 TESTMODE I2CH_SDA
PLT3_RSTF# 25-A2 30-D2 33-B4 35-C1 35-C3 49-B4
PEX_RST#
A2
B3
A3
D4
A4
B4
B6
P4
C6
G5
V4
G2
G3
J2
J1
K4
K1
M2
M1
N1
N2
N3
R3
C4
J4
F1
G4
G1
F2
K3
K2
R2
M3
J5
TP16405
EXT_GFX
All Instances on this Page shoule be NO_STUFF @ Int. Gfx.
R565
TP16176
TP16177
TP16323
TP16324
TP16325
TP16326
TP16178
TP16181
TP16329
TP16187
A A
DRAW DATE TITLE
GFX3_MIOAD(0,1,6,8,9)
0 1 6 8 9 ZHOU JUN 4/10/2007
TORINO 2 SAMSUNG
1% 10K
21-C2
CHECK DEV. STEP
0 1 3 4 5 8 9 11 ELECTRONICS
GFX3_MIOBD(0,1,3,4,5,8,9,11) 21-C2
GUO LEI MP MAIN
GFX3_MIOBHSYNC 21-C2 KEVIN LEE 1.1 GFX (1) BA41-00727/8A
Add TP on MIOA[0:10], MIOB[0:11], JTAG for debug purpose MODULE CODE LAST EDIT
March 28, 2007 3:33:29 PM PAGE 20 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
P1.8V
D D
R121
200
1%
Nearby GFX
TP16355
0.7 * VDDQ
R122 C131
475 100nF
1%
A16 A26 0 22-C3 22-C1

GDDR1_DQ(63:0)
FB_VREF FBAD0
FBAD1 C24 1
L24 B24 2
g
GDDR1_CLK0 22-C4 K23 FBA_CLK0 FBAD2 A24 3
GDDR1_CLK0#
GDDR1_CLK1
22-C4 M22
FBA_CLK0#
FBA_CLK1
FBAD3
FBAD4 C22 4 P3.3V STRAPS
22-C2 N22 A25 5
GDDR1_CLK1# 22-C2
FBA_CLK1# FBAD5
B25 6
GDDR1_MAA(11:0) FBAD6 GFX3_MIOAD(0,1,6,8,9) NO_STUFF SUB_VENDOR MIOAD[1]
n
22-A2 22-D2 22-D4 0 K26 D23 7 20-A3
FBA_CMD19 FBAD7
1 B27 G22 8 1 R52 2K 1% 0 No Video BIOS ROM
2 F27
FBA_CMD25 FBAD8
J23 9
GFX3_MIOBD(0,1,3,4,5,8,9,11) 20-A3 1 Video BIOS ROM is present (DEF.) (For merged BIOS)
FBA_CMD22 FBAD9
l
3 G26 E24 10 NO_STUFF 8 R67 10K 1%
4 G27
FBA_CMD24 FBAD10
F23 11
RAM_CFG[2:0] MIOBD[8, 1, 0]
FBA_CMD0 FBAD11
u
5 F26
FBA_CMD2 FBAD12
J24 12 R74 10K 1% 000 8M x 32 DDR, Monolithic, 2.5V I/O
6 K24 FBA_CMD21 FBAD13 F24 13 001 8M x 32 DDR, Monolithic, 1.8V I/O
a
7 M25
FBA_CMD16 FBAD14
G23 14 1 R64 10K 1% 010 8M x 32 DDR, 1.8V I/O Analog DLL (SEC K4D55323QF-GC)
8 K27 H24 15 011 16M x 32 DDR, 1.8V I/O, Hynix Stacked Die (2 x 8M x32)
FBA_CMD23 FBAD15
K25 D16 R59
s
9 16 10K 1% 100 4M x 32 DDR, 1.8V I/O
i
NO_STUFF
C 10 D26 FBA_CMD20 FBAD16 E16 17 101 Reserved C
FBA_CMD17 FBAD17
11 C25 FBA_CMD9 FBAD18 D17 18 0 R562 10K 1% 110 4M x 32 DDR, 2.5V I/O
t
M27 F18 19 111 Reserved
FBA_CMD14 FBAD19
N24 FBA_CMD26 FBAD20 E19 20 NO_STUFF R561 10K 1%
U503-2 FBAD21
E18 21
RAM_CFG[3] MIOBD[9]
M23
FBA_CMD27 FBAD22
D20 22 NO_STUFF 9 R563 10K 1%
NB8M-SE
m
M24 D19 23 0 Full Width
n
FBA_CMD28 FBAD23 A18 24 R564 10K 1% 1 Half Width
GDDR1_MAB(5:2) 22-A2 22-D2 2 G25 (23X23) FBAD24
B18 25
FBA_CMD4 FBAD25 CRYSTAL[1:0] MIOBD[6, 2]
3 J27
FBA_CMD6 2/4 FBAD26
A19 26
4 J25 B19 27 00 13.5MHz
a
FBA_CMD5 FBAD27
e
5 J26 D18 28 01 14.318MHz
FBA_CMD13 FBAD28 C19 29 10 27.0MHz (DEF.)
GDDR1_BA(2:0) 22-C2 22-C4 0 G24
FBAD29
C16 30 11 Reserved
FBA_CMD12 FBAD30
1 F25 C18 31
2 M26
FBA_CMD3 FBAD31
N26 32
TVMODE[1:0] MIOAD[10, 7]
S fid
FBA_CMD7 FBAD32
N25 33 000 SECAM
C27 FBAD33 R25 34 001 NTSC (DEF.)
GDDR1_CS# 22-C2 22-C4 N27
FBA_CMD8 FBAD34
R26 35 010 PAL
GDDR1_WE# 22-C2 22-C4 D25 FBA_CMD11 FBAD35 R27 36 011 VGA
GDDR1_RAS# FBA_CMD1 FBAD36
GDDR1_CAS#
22-C2 22-C4 D24 FBA_CMD10 FBAD37 T25 37 11 R77 2K 1%
PCI_DEVID[3:0] MIOBD[11, 3, 5, 4]
22-C2 22-C4
FBAD38
T27 38 NO_STUFF 3 R63 2K 1%
GDDR1_CKE D27 FBA_CMD18 FBAD39 T26 39 NO_STUFF 5 R68 2K 1% G72M 0x01D8 NB8M-SE 0x0428
22-C2 22-C4 C26 AB23 40 NO_STUFF 4 R66 2K 1% G72MV 0x01D7 NB8M-GS 0x0427
GDDR1_RESET 22-C2 22-C4
FBA_CMD15 FBAD40 Y24 41 G73M 0x0398
GDDR1_DM(7:0) FBAD41
n
22-B2 22-B4 0 D21 AB24 42
1 F22 FBADQM0 FBAD42 AB22 43 R911 2K 1% 3GIO_PADCFG[2:0] MIOBHSYNC, MIOAD[9, 8, 6]
2 F20
FBADQM1 FBAD43
AC24 44
GFX3_MIOBHSYNC 20-A3 0000 Desktop (DEF.)
R599 R600 FBADQM2 FBAD44 1000 Mobile
B 10K 10K 3 A21
FBADQM3 FBAD45
AC22 45 NO_STUFF 9 R62 2K 1% X001 Mobile1 (G72M) B
1% 1% 4 V27
FBADQM4 FBAD46
AA23 46 NO_STUFF 8 R56 2K 1% X010 Mobile2 G7x or NV42
o
5 W22
FBADQM5 FBAD47
AA22 47 NO_STUFF 6 R54 2K 1% X011 Mobile3
6 V22 T24 48
FBADQM6 FBAD48 PEX_PLL_EN_TERM MIOAD[0]
7 V24 FBADQM7 FBAD49 T23 49 NO_STUFF 0 R50 2K 1%
R24 50 0 Enabled (DEF.)
GDDR1_RDQS(7:0) 22-C2 22-C4 0 A22
FBAD50
R23 51 1 Disabled
FBADQS_RN0 FBAD51
1 E22 R22 52
C
2 F21 FBADQS_RN1 FBAD52 T22 53
FBADQS_RN2 FBAD53
3 B21 N23 54
4 V26 FBADQS_RN3 FBAD54 P24 55
FBADQS_RN4 FBAD55
5 W23 FBADQS_RN5 FBAD56 AA24 56
6 V23 AA27 57
FBADQS_RN6 FBAD57
7 W27 FBADQS_RN7 FBAD58 AA26 58
AB25 59
GDDR1_WDQS(7:0) 22-B2 22-B4 0 B22 FBAD59 AB26 60
FBADQS_WP0 FBAD60
1 D22 AB27 61
2 E21 FBADQS_WP1 FBAD61 AA25 62
FBADQS_WP2 FBAD62 EXT_GFX
3 C21 W25 63 FBA_PLLAVDD B13 P1.2V All Instances on this Page shoule be NO_STUFF @ Int. Gfx.
FBADQS_WP3 FBAD63
4 V25 MMZ1608S121AT
5 W24 FBADQS_WP4 D13 TP16190
FBADQS_WP5 FB_PLLAVDD
6 U24
7 W26 FBADQS_WP6 P1.8V C132 C130
FBADQS_WP7 4700nF
FBCAL_PD_VDDQ D15 TP16191R125 45.3 1% 100nF 10V
TP16189 K22 E13 TP16192R124 24.9 1%
FBA_DEBUG FBCAL_PU_GND
C15 FB_PLLGND FBCAL_TERM_GND H22 TP16193R128 40.2 1%
A FBCAL_PU_GND pull down resistor A

NB8M: 24.9 ohm (2007-007302)
G72M: 33 ohm (2007-001292) DRAW DATE TITLE
CHECK
ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
ELECTRONICS
GUO LEI MP MAIN
KEVIN LEE 1.1 GFX (2) BA41-00727/8A

March 28, 2007 3:33:29 PM PAGE 21 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
P1.8V
C196 100nF TP16409

B16 MMZ1608S121AT C198 100nF TP16408
B17 MMZ1608S121AT
D D
M12
M12
A11
V11
K12
A12
A11
V11
K12
A12
F12
F12
M1
M1
C1
C4
C9
C1
C4
C9
A2
V2
K1
A1
A2
V2
K1
A1
F1
F1
VDD_1
VDD_2
VDD_3
VDD_4
VDD_5
VDD_6
VDD_7
VDD_8
VDDA_1
VDDA_2
VDDQ_1
VDDQ_2
VDDQ_3
VDDQ_4
VDDQ_5
VDD_1
VDD_2
VDD_3
VDD_4
VDD_5
VDD_6
VDD_7
VDD_8
VDDA_1
VDDA_2
VDDQ_1
VDDQ_2
VDDQ_3
VDDQ_4
VDDQ_5
GDDR1_MAA(1:0) 21-C4 22-D2 0 K4 C12
GDDR1_MAA(1:0) 21-C4 22-D4 0 K4 C12
A0 VDDQ_6 A0 VDDQ_6
1 H2 E1 1 H2 E1
GDDR1_MAA(5:2) 21-C4 22-A2 2 K3
A1 VDDQ_7
E4
GDDR1_MAB(5:2) 21-C4 22-A2 2 K3
A1 VDDQ_7
E4
3 M4 A2 VDDQ_8 E9 3 M4 A2 VDDQ_8 E9
A3 VDDQ_9 A3 VDDQ_9
4 K9 E12 4 K9 E12
5 H11 A4 VDDQ_10 J4 5 H11 A4 VDDQ_10 J4
GDDR1_MAA(11:6) 21-C4 22-D2 6 K10
A5 VDDQ_11
J9
GDDR1_MAA(11:6) 21-C4 22-D4 6 K10
A5 VDDQ_11
J9
A6 VDDQ_12 A6 VDDQ_12
7 L9 N1 7 L9 N1
A7 VDDQ_13 A7 VDDQ_13
8 K11 A8_AP VDDQ_14 N4 8 K11 A8_AP VDDQ_14 N4
9 M9 N9 9 M9 N9
g
10 K2 A9 VDDQ_15 N12 10 K2 A9 VDDQ_15 N12
R141 A10 VDDQ_16 R168 A10 VDDQ_16
480ohm for G73 240 11 L4 A11 VDDQ_17 R1 240 11 L4 A11 VDDQ_17 R1
R4 R4
VDDQ_18 VDDQ_18
VDDQ_19 R9 VDDQ_19 R9
n
J11 R12 J11 R12
GDDR1_CLK0 21-C4 J10 CK VDDQ_20 V1 GDDR1_CLK1 21-C4 J10 CK VDDQ_20 V1
GDDR1_CLK0# 21-C4
CK* VDDQ_21
V12
GDDR1_CLK1# 21-C4
CK* VDDQ_21
V12
VDDQ_22 VDDQ_22
l
H4 B2 20 21-D3
GDDR1_DQ(31:0) H4 B2 48 21-D3
GDDR1_DQ(63:32)
GDDR1_CKE CKE DQ0 GDDR1_CKE CKE DQ0
u
21-B4 22-C2 B3 23 21-B4 22-C4 B3 49
GDDR1_BA(2:0) DQ1 GDDR1_BA(2:0) DQ1
Data Group 2
Data Group 6
21-C4 22-C2 0 G4 BA0 U8 DQ2 C2 21 21-C4 22-C4 0 G4 BA0 U12 DQ2 C2 50
a
1 G9 C3 22 1 G9 C3 53
2 H10 BA1
BA2
K4J52324QC-BC14 DQ3
DQ4
E2 18 2 H10 BA1
BA2
K4J52324QC-BC14 DQ3
DQ4
E2 51
F3 16 F3 55
s i
C V4 DQ5 F2 19 V4 DQ5 F2 52 C
SEN DQ6 SEN DQ6
V9 G3 17 V9 G3 54
GDDR1_RESET RESET DQ7 GDDR1_RESET RESET DQ7
t
21-B4 22-C2 B11 11 21-B4 22-C4 B11 46
DQ8 DQ8
F9 B10 8 F9 B10 41
GDDR1_CS# CS* DQ9 GDDR1_CS# CS* DQ9
Data Group 1
Data Group 5
21-B4 22-C2 H3 C11 13 21-B4 22-C4 H3 C11 40
GDDR1_RAS# 21-B4 22-C2 F4 RAS* DQ10 C10 10 GDDR1_RAS# 21-B4 22-C4 F4 RAS* DQ10 C10 47
GDDR1_CAS# CAS* DQ11 GDDR1_CAS# CAS* DQ11
m
21-B4 22-C2 H9 E11 14 21-B4 22-C4 H9 E11 42
n
GDDR1_WE# 21-B4 22-C2
WE* DQ12 F10 15 GDDR1_WE# 21-B4 22-C4
WE* DQ12 F10 45
DQ13 DQ13
21-B4 F11 9 21-B4 F11 44
GDDR1_RDQS(3:0) 2 D3
DQ14
G10 12
GDDR1_RDQS(7:4) 6 D3
DQ14
G10 43
1 D10 RDQS_0 DQ15 M11 7 5 D10 RDQS_0 DQ15 M11 63
a
RDQS_1 DQ16 RDQS_1 DQ16
e
0 P10 L10 4 7 P10 L10 57
Data Group 0
Data Group 7
3 P3 N11 2 4 P3 N11 56
DQ19 M10 3 DQ19 M10 58
21-B4 R11 1 21-B4 R11 62
GDDR1_WDQS(3:0) 2 D2
DQ20
R10 6
GDDR1_WDQS(7:4) 6 D2
DQ20
R10 61
S fid
WDQS_0 DQ21 WDQS_0 DQ21
1 D11 T11 0 5 D11 T11 60
0 P11 WDQS_1 DQ22 T10 5 7 P11 WDQS_1 DQ22 T10 59
WDQS_2 DQ23 WDQS_2 DQ23
3 P2 M2 29 4 P2 M2 37
WDQS_3 DQ24 L3 27 WDQS_3 DQ24 L3 39
DQ25 DQ25
Data Group 3
Data Group 4
21-B4 N2 31 21-B4 N2 34
GDDR1_DM(3:0) 2 E3
DQ26
M3 26
GDDR1_DM(7:4) 6 E3
DQ26
M3 38
DM0 DQ27 DM0 DQ27
1 E10 DM1 DQ28 R2 25 5 E10 DM1 DQ28 R2 35
0 N10 R3 24 7 N10 R3 33
3 N3 DM2 DQ29 T2 28 4 N3 DM2 DQ29 T2 36
DM3 DQ30 DM3 DQ30
n
T3 30 T3 32
DQ31 DQ31
H1 B1 H1 B1
FBA1_VREF VREF_1 VSSQ_1 FBA1_VREF VREF_1 VSSQ_1
B 22-A4 22-B2 H12
VREF_2 VSSQ_2
B4 22-A4 22-B4 H12
VREF_2 VSSQ_2
B4 B
B9 B9
VSSQ_3 VSSQ_3
o
B12 B12
VSSQ_4 D1 VSSQ_4 D1
VSSQ_5 VSSQ_5
A9 MF VSSQ_6 D4 A9 MF VSSQ_6 D4
R120 240TP16406A4 D9 R142 240TP16407 A4 D9
ZQ VSSQ_7 ZQ VSSQ_7
VSSQ_8 D12 VSSQ_8 D12
G2 G2
C
J2 VSSQ_9 G11 J2 VSSQ_9 G11
RFU1 VSSQ_10 RFU1 VSSQ_10
J3 L2 J3 L2
RFU2 VSSQ_11 L11 RFU2 VSSQ_11 L11
VSSQ_12 VSSQ_12
VSSQ_15
VSSQ_16
VSSQ_17
VSSQ_18
VSSQ_19
VSSQ_20
VSSQ_15
VSSQ_16
VSSQ_17
VSSQ_18
VSSQ_19
VSSQ_20
P1 P1
VSSA_1
VSSA_2
VSSA_1
VSSA_2
VSSQ_13 VSSQ_13
VSS_1
VSS_2
VSS_3
VSS_4
VSS_5
VSS_6
VSS_7
VSS_8
VSS_1
VSS_2
VSS_3
VSS_4
VSS_5
VSS_6
VSS_7
VSS_8
P4 P4
VSSQ_14 VSSQ_14
A3
A10
G1
G12
L1
L12
V3
V10
J1
J12
P9
P12
T1
T4
T9
T12
A3
A10
G1
G12
L1
L12
V3
V10
J1
J12
P9
P12
T1
T4
T9
T12
P1.8V
On Die Termination
On : 0.7 * VDDQ
R601 Off : 0.5 * VDDQ EXT_GFX
2K All Instances on this Page should be NO_STUFF @ Int. Gfx.
1%
TP16194 P1.8V
A 0.7*VDDQ 22-B4 22-B2
FBA1_VREF A
R628
4.7K C667 DRAW DATE TITLE
100nF C199
2200nF
C197
2200nF
C606
100nF
C638
100nF
C607
100nF
C712
100nF
C714
10nF
C713
10nF CHECK
ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
ELECTRONICS
GUO LEI MP MAIN

March 28, 2007 3:33:29 PM PAGE 22 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
D D
P3.3V B5 P3.3V
BLM18PG181SN1
C61 C66 C59 C62 C67

C76 C74 C22 1000nF C60 C64 10nF 10nF 10nF 4.7nF
4700nF 4.7nF
C23 10nF 6.3V
100nF 100nF 16V 16V 16V 25V
0.47nF
10V 25V 16V
W10
W11
W12
F13
F14
J12
J13
J15
J16
W9
GFX_CORE
R65 C65 TP16410 AE2
U503-4
VDD_LP_1
VDD_LP_2
VDD_LP_3
VDD_LP_4
VDD33_1
VDD33_2
VDD33_3
VDD33_4
VDD33_5
VDD33_6
J9
g
10K
1%
10nF
16V
TP16411 AB4 DACA_VDD
DACA_VREF
VDD_1
VDD_2
J10
C140 C139 C224
NB8M-SE
J11
F8
VDD_3
L12
10000nF 10000nF 10000nF (23X23)
P1.8V DACB_VDD VDD_4 6.3V 6.3V 6.3V
E7 DACB_VREF VDD_5 L13 B2 GND_1 GND_48 P19
n
L15 B5 P23
F17 VDD_6 L16 B8 GND_2 GND_49 P26
F19
FBVDDQ_1 VDD_7
M9
C148 C149 C225 B11
GND_3 GND_50
R12
C138 C195 C193 FBVDDQ_2 VDD_8 4700nF 4700nF 4700nF GND_4 GND_51
l
J19 M11 B14 R13
4700nF 4700nF 10000nF FBVDDQ_3 VDD_9 10V 10V 10V GND_5 GND_52
10V 10V 6.3V J22 FBVDDQ_4 VDD_10 M12 B17 GND_6 GND_53 R14
u
L22 M13 B20 R15
FBVDDQ_5 VDD_11 GND_7 GND_54
M19 FBVDDQ_6 VDD_12 M14 B23 GND_8 GND_55 R16
a
P22
FBVDDQ_7 VDD_13
M15 C145 C192 C144 C141 B26
GND_9 GND_56
U2
C143 C135 C637 T19
FBVDDQ_8 VDD_14
M16 100nF 100nF 100nF 100nF E2
GND_10 GND_57
U5
100nF 100nF 100nF U22 M17 E5 U11
s i
C Y22 FBVDDQ_9 VDD_15 N11 E8 GND_11 GND_58 U14 C
FBVDDQ_10 VDD_16 GND_12 GND_59
N17 E11 U17
VDD_17 C147 C146 C191 C142 C150 GND_13 GND_60
t
E15 R9 E14 U23
C137 C128 C666 C136 F15
FBVTT_1 VDD_18
R11
10nF 10nF 10nF 4.7nF 4.7nF
E17
GND_14 GND_61
U26
10nF 10nF 4.7nF 4.7nF FBVTT_2 VDD_19 16V 16V 16V 25V 25V GND_15 GND_62
16V 16V 25V 25V EXT_GFX
F16
FBVTT_3 VDD_20
R17 E20
GND_16 4/4 GND_63
V9
J17 T9 E23 V19
FBVTT_4 U503-3 VDD_21 GND_17 GND_64
m
B512 J18 T11 E26 W14
n
P1.8V P1.8V L19 FBVTT_5 VDD_22 T12 H2 GND_18 GND_65 Y2
MMZ1608S121AT G72M: 2.5V FBVTT_6 VDD_23 GND_19 GND_66
NB8M: 1.8V N19 FBVTT_7 NB8M-SE VDD_24 T13 H6 GND_20 GND_67 Y5
R19 T14 H23 Y23
B511 NO_STUFF U19 FBVTT_8 (23X23) VDD_25 T15 H26 GND_21 GND_68 Y26
a
B8 FBVTT_9 VDD_26 GND_22 GND_69
3/4
e
P2.5V MMZ1608S121AT W19 T16 J14 AC2
MMZ1608S121AT FBVTT_10 VDD_27 GND_23 GND_70
T17 K9 AC5
TP16414 W4 VDD_28 GND_24 GND_71
IFPA_IOVDD VDD_29 U12 K19 GND_25 GND_72 AC8
U13 L2 AC14
C20 C559 TP16415 VDD_30 GND_26 GND_73
C560 V5 U15 L5 AC23
S fid
4700nF 1000nF IFPAB_PLLVDD VDD_31 GND_27 GND_74
0.47nF U16 L11 AC26
10V 6.3V C520 C521 C561 R82 10K 1% Y4 VDD_32 W13 G72M: NV_PLLAVDD L14 GND_28 GND_75 AD8
4700nF 1000nF
0.47nF
IFPB_IOVDD VDD_33
W15
NB8M: VDD L17
GND_29 GND_76
AD9
10V 6.3V VDD_34 P1.2V GND_30 GND_77
R70 10K 1% L4
IFPC_IOVDD VDD_35
W16 B9 L23
GND_31 GND_78
AD11
MMZ1608S121AT L26 GND_32 GND_79 AD12
R72 10K 1% M4
IFPCD_PLLVDD VDD_36
N9 N12
GND_33 GND_80
AD14
N13 AD16
P1.2V W17 D14
C71 C73 C68 NO_STUFF N14
GND_34 GND_81
AD17
W18 PEX_IOVDD_1 H_PLLVDD 22nF 22nF 4700nF
N15 GND_35 GND_82 AD19
PEX_IOVDD_2 25V 25V 10V GND_36 GND_83
n
AB10 AA4 N16 AD20
AB11 PEX_IOVDD_3 PEX_IOVDDQ_1 AB5 P2 GND_37 GND_84 AF2
PEX_IOVDD_4 PEX_IOVDDQ_2 GND_38 GND_85
AB14 AB6 P5 AF3
C51 C153 C49 C151 C48 PEX_IOVDD_5 PEX_IOVDDQ_3 GND_39 GND_86
B 10000nF 4700nF 22nF 22nF 22nF
AB15
PEX_IOVDD_6 PEX_IOVDDQ_4
AB7 P9
GND_40 GND_87
AF6 B
AB20 AB8 P11 AF9
6.3V 10V 25V 25V 25V PEX_IOVDD_7 PEX_IOVDDQ_5 GND_41 GND_88
o
AB21 AB9 B14 P1.2V P12 AF12
PEX_IOVDD_8 PEX_IOVDDQ_6 AB12 P13 GND_42 GND_89 AF15
PEX_IOVDDQ_7 MMZ1608S121AT GND_43 GND_90
Y6 PEX_PLLAVDD PEX_IOVDDQ_8 AB13 P14 GND_44 GND_91 AF18
AA5 AB16 P15 AF21
PEX_PLLDVDD PEX_IOVDDQ_9 C129 GND_45 GND_92
PEX_IOVDDQ_10 AB17 C133 4700nF P16 GND_46 GND_93 AF24
P1.2V TP16421 H4 AB18 100nF P17 AF26
B10
C
PLLVDD PEX_IOVDDQ_11 AB19
10V GND_47 GND_94
MMZ1608S121AT PEX_IOVDDQ_12
U9 AC9
DACA_IDUMP PEX_IOVDDQ_13
L9 AC11 NB8M: H_PLLVDD
MIOB_VDDQ_1
MIOB_VDDQ_2
MIOB_VDDQ_3
C21 C75 C72 DACB_IDUMP PEX_IOVDDQ_14

MIOA_VDDQ0
MIOA_VDDQ1
MIOA_VDDQ2
4700nF 1000nF C70 10nF PEX_IOVDDQ_15 AC12 G72M: NC

10V 6.3V
100nF 16V
V6
IFPAB_PLLGND PEX_IOVDDQ_16
AC16
M6 AC17 P1.2V
IFPCD_PLLGND PEX_IOVDDQ_17
H5 AC19
AA6 PLLGND PEX_IOVDDQ_18 AC20
NO_STUFF PEX_PLLGND PEX_IOVDDQ_19
P2.5V G72M: 2.5V C152 C522 C562 C563 C155 C154
B517 10000nF 4700nF 22nF 22nF 22nF 10nF
F6
G6
J6
K5
K6
L6
MMZ1608S121AT NB8M: 1.2V 6.3V 10V 25V 25V 25V 16V

P3.3V
P1.2V C514 C516

B516 4700nF
C515 4.7nF
MMZ1608S121AT 100nF EXT_GFX
10V 25V C63
4700nF C134 All instances on this page should be NO_STUFF @ Int. Gfx.
0.47nF
EXT_GFX
10V
A A
DRAW DATE TITLE
CHECK
ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
ELECTRONICS
GUO LEI MP MAIN

March 28, 2007 3:33:29 PM PAGE 23 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
PRTC_BAT
D D
R656 R644 R654

U17-1
TP15160 332K 332K 1M NH82801HEM
1% 1%
1/5 49-A4 31-B4
LPC3_LAD(0:3)
R615 TP15161
10M AG25 E5 0
RTCX1 FWH0_LAD0
AF24 F5 1
0.032768MHz RTCX2 FWH1_LAD1
G8 2
FWH2_LAD2
1 4 AF23 F6 3
CHP3_RTCRST# RTCRST* FWH3_LAD3
RTC
LPC
24-A3
C663 2 3 C664 TP15158AD22 C4
0.01nF 0.01nF TP15159 AF25
INTRUDER* FWH4_LFRAME* 49-B4 31-B4
LPC3_LFRAME#
Y2 INTVRMEN
G9
g
2801-003856 TP16343 LDRQ0* TP15038
AD21 E6
LAN100_SLP LDRQ1*_GPIO23 TP15039
B24 AF13 31-B2 27-B3 P1.05V
GLAN_CLK A20GATE
AG26 9-B3
KBC3_A20G
A20M* CPU1_A20M#
n
D22
LAN_RSTSYNC
AF26 R652
C21
DPRSTP*
AE26 13-B1 10-D4
CPU1_DPRSTP# 56.2
LAN_RXD0 DPSLP* CPU1_DPSLP#
l
B21 10-D4 1%
LAN_RXD1
LAN / GLAN
C22 AD24
LAN_RXD2 FERR* CPU1_FERR#
u
9-B3
D21 AG29 10-C4
LAN_TXD0 CPUPWRGD_GPIO49 CPU1_PWRGDCPU
a
E20
LAN_TXD1
C20 AF27 9-B3
LAN_TXD2 IGNNE* CPU1_IGNNE#
s i
CPU
C AH21 AE24 9-C3 C
GLAN_DOCK*_GPIO13 INIT*
AC20 9-B3
CPU1_INIT#
INTR CPU1_INTR
t
P1.5V_PCIE TP16344
D25 AH14 31-C2 27-B3
GLAN_COMPI RCIN* KBC3_CPURST# P1.05V
R726 24.9 1% C25
GLAN_COMPO
34-D3 R621 33 5% AD23 9-B3
CHP3_AZ_MDC_BCLK 39-C4 R622 33 5% TP15157
AJ16
NMI
AG28 9-B3
CPU1_NMI
CHP3_AZ_AUD_BCLK TP15156 HDA_BIT_CLK SMI* CPU1_SMI#
m
39-C4 R623 33 5% AJ15 R647
n
CHP3_AZ_AUD_SYNC 34-D4 R624 33 5%
HDA_SYNC
AA24 9-B3 56.2
CHP3_AZ_MDC_SYNC TP15155 STPCLK* CPU1_STPCLK# 1%
CHP3_AZ_AUD_RST#
39-C4 41-C1 R671 33 5% AE14
HDA_RST*
34-D4 R670 33 5% AE27TP15163 R648 22.6 1% 24ohm
CHP3_AZ_MDC_RST# AJ17
THRMTRIP* 13-B1 11-B3 10-C4
CPU1_THRMTRIP#
a
CHP3_AZ_AUD_SDI0 HDA_SDIN0
e
39-C4 AH17 AA23
IHDA
CHP3_AZ_MDC_SDI1 HDA_SDIN1 TP8 TP15015
34-D4 AH15
AD13
HDA_SDIN2
V1 0 30-C2 30-C1
IDE_D(15:0)
HDA_SDIN3 DD0
34-D4 R676 33 5% U2 1
CHP3_AZ_MDC_SDO TP15154 DD1
39-C4 R678 33 5% AE13 V3 2
S fid
CHP3_AZ_AUD_SDO HDA_SDOUT DD2
T1 3
DD3
AE10 V4 4
HDA_DOCK_EN*_GPIO33 DD4
AG14 T5 5
HDA_DOCK_RST*_GPIO34 DD5
AB2 6
TP15044 DD6
30-B4 AF10 T6 7
CHP3_SATALED# SATALED* DD7
T3 8
30-C4 AF6
DD8
R2 9
*Layout Note
SATA1_RXN0 SATA0RXN DD9
AF5 T4 10 27.4ohm resistor needs
SATA1_RXP0 30-C4 C710 4.7nF 25V AH5
SATA0RXP DD10
V6 11 to placed within 2" of ICH7-M
SATA1_TXN0 SATA0TXN DD11
n
30-C4 C708 4.7nF 25V AH6 V5 12 56.2ohm must be placed
SATA1_TXP0 30-C4
SATA0TXP DD12
U1 13
DD13 to placed within 2" of 27.4ohm w/o stub
AG3 V2 14
SATA1RXN DD14
B AG4 U6 15 B
IDE
SATA1RXP DD15
AJ4
SATA1TXN
o
AJ3 AA4
SATA
SATA1TXP DA0
AA1 30-C2
IDE_A0
AF2
DA1
AB3 30-C2
IDE_A1
AF1
SATA2RXN DA2 30-C1
IDE_A2
SATA2RXP
AE4 Y6
AE3
SATA2TXN DCS1*
Y5 30-C2
IDE_CS1#
C
SATA2TXP DCS3* 30-C1
IDE_CS3#
AB7 W4
CLK1_SATA# 8-B1 AC6
SATA_CLKN DIOR*
W3 30-C1
IDE_IOR#
CLK1_SATA 8-B1
SATA_CLKP DIOW*
Y2 30-C2
IDE_IOW#
TP15164 AG1
DDACK*
Y3 30-C1
30-B1
IDE_DACK#
AG2
SATARBIAS* IDEIRQ
Y1 30-C2
CHP3_IDEIRQ
SATARBIAS IORDY
W5 30-C1
IDE_IORDY
DDREQ IDE_DREQ
R686
24.9
1%
P3.3V_MICOM PRTC_BAT
1
D506
3
BAT54C
R800
2
A 20K A
1%
3711-000541
TP16117 1K TP15165
CHP3_RTCRST#
2 R790 24-D3 DRAW DATE TITLE
1
1%
C832
C829 R799
1M
CMOS ZHOU JUN 4/10/2007
TORINO 2 SAMSUNG
1000nF CHECK DEV. STEP
HDR-2P-SMD 1000nF
6.3V NO_STUFF RESET GUO LEI MP MAIN
ELECTRONICS
J504
PLACE TO BOTTOM APPROVAL REV PART NO.
ARROUND MEMORY DOOR KEVIN LEE 1.1 ICH8M(1) BA41-00727/8A

March 28, 2007 3:33:29 PM PAGE 24 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
PROPRIETARY INFORMATION THAT IS AC caps : PCIE need to be within 250mils of the driver
SAMSUNG ELECTRONICS CO’S PROPERTY. Resistor for Test : Place Stuffing Option to minimize stubs
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS U17-3
EXCEPT AS AUTHORIZED BY SAMSUNG. NH82801HEM
3/5
U17-2 AJ26 V27
SMB3_CLK SMBCLK DMI0RXN DMI1_RXN0
NH82801HEM R739 1K 8-A3 27-C3 35-C1 35-C3 AD19 V26 13-C1
SMB3_DATA SMBDATA DMI0RXP DMI1_RXP0
SMB
27-D3 27-C3
8-A3 35-C4 35-C1 35-C3 AG21 U29 13-C1
PCI3_AD(31:0) 36-B4 36-C4 2/5 CL3_WLANRST# AC17
LINKALERT* DMI0TXN
U28 13-C1
DMI1_TXN0
D 0 D20 A4 CHP3_SMLINK0 27-D3 AE19
SMLINK0 DMI0TXP DMI1_TXP0 D
1 E19
AD0
PCI
REQ0*
D7 36-B4 27-B3
PCI3_REQ0# CHP3_SMLINK1 27-D3
SMLINK1
Y27
2 D19
AD1 GNT0*
E18 36-B4
PCI3_GNT0# P3.3V_AUX TP15334 AF17 DMI1RXN
Y26 13-C1
DMI1_RXN1
AD2 REQ1*_GPIO50 TP16228 RI* DMI1RXP DMI1_RXP1
3 A20
AD3 GNT1*_GPIO51
C18
GNT1* Should not be pulled low R666 10K
DMI1TXN
W29 13-C1
DMI1_TXN1
4 D17 B19 31-B2 F4 W28 13-C1
AD4 REQ2*_GPIO52 CHP3_SUSSTAT# 10KTP15335AD15
SUS_STAT*_LPCPD* DMI1TXP DMI1_TXP1
5 A21 F18 R668
Direct Media Interface

AD5 GNT2*_GPIO53 SYS_RESET*
6 A19 A11 AB26
7 C19
AD6 REQ3*_GPIO54 TP16227
C10 ITP3_SYSRST# 10-C2 R672 0 TP15336AG12
DMI2RXN
AB25 13-C1
DMI1_RXN2
8 A18
AD7 GNT3*_GPIO55 GMCH3_BMBUSY# 13-B1
BMBUSY*_GPIO0 DMI2RXP
AA29 13-C1
DMI1_RXP2
9 B16
AD8
C17 27-D3 AG22
DMI2TXN
AA28 13-C1
DMI1_TXN2
10 A12
AD9 C_BE0*
E15 36-B4
PCI3_CBE0# SMB3_ALERT# SMBALERT*_GPIO11 DMI2TXP DMI1_TXP2
AD10 C_BE1* PCI3_CBE1#
GPIO
11 E16 F16 36-B4 AE20 AD27
SYS
12 A14
AD11 C_BE2*
E17 36-B4
PCI3_CBE2# CHP3_PCISTP# 8-C4 AG18
STP_PCI*_GPIO15 DMI3RXN
AD26 13-C1
DMI1_RXN3
13 G16
AD12 C_BE3* 36-B4
PCI3_CBE3# CHP3_CPUSTP# 8-C4
STP_CPU*_GPIO25 DMI3RXP
AC29 13-C1
DMI1_RXP3
g
14 A15
AD13
C8 AH11
DMI3TXN
AC28 13-C1
DMI1_TXN3
15 B6
AD14 IRDY*
D9 36-A4 27-C3
PCI3_IRDY# PCI3_CLKRUN# 27-C3 31-B2 36-A4
CLKRUN*_GPIO32 DMI3TXP DMI1_TXP3
16 C11
AD15 PAR
G6 36-B4
PCI3_PAR AE17 T26
17 A9
AD16 PCIRST*
D16 36-A4
PCI3_RST# PEX3_WAKE# 27-C3 32-D4 35-C2 35-C4 AF12
WAKE* DMI_CLKN
T25 8-C1
CLK1_PCIEICH#
AD17 DEVSEL* PCI3_DEVSEL# CHP3_SERIRQ 0TP15337
SERIRQ DMI_CLKP CLK1_PCIEICH
n
18 D11 A7 36-A4 27-C3 11-C2 31-B4
27-B3 36-C3 R675 AC13 8-C1
19 B12
AD18 PERR*
B7 36-A4 27-C3
PCI3_PERR# THERM_ALERT# THRM*
Y23 TP16119 P1.5V_PCIE
AD19 PLOCK* PCI3_PLOCK# 0TP15338
DMI_ZCOMP
20 C12 F10 27-C3 R619 AJ20 Y24 R705 24.9
AD20 SERR* PCI3_SERR# VRM3_CPU_PWRGD VRMPWRGD DMI_IRCOMP
l
21 D10 C16 36-A4 27-C3 31-C2 45-B4 1%
22 C7
AD21 STOP*
C9 36-A4 27-C3
PCI3_STOP# TP16160
AJ22 F23
AD22 TRDY* PCI3_TRDY# TP7 CL_CLK0 CL3_CLK
u
23 F13 A17 36-A4 27-B3 AE18 13-B1
24 E11
AD23 FRAME* 36-B4 27-C3
PCI3_FRAME# 31-C2 AG23
CL_CLK1 35-C4
CL3_WLANCLK
AD24 CHP3_SLPS3# TP16266 SLP_S3*
a
25 E13 AG24 CHP3_SLPS4# AF21 F22
26 E12
AD25 PLTRST*
B10 31-B4 25-A3 13-B1
PLT3_RST# 31-B2 AD18
SLP_S4* CL_DATA0
AF19 13-B1
CL3_DATA
AD26 PCICLK CLK3_PCLKICH CHP3_SLPS5# SLP_S5* CL_DATA1 CL3_WLANDATA
s
27 D8 G7
i
36-A4
Controller Link
8-C4 35-C4
C 28 A6
AD27 PME* CHP3_PME# AH27 D24 C
29 E8
AD28 CHP3_S4STATE# 31-B2
S4_STATE*_GPIO26 CL_VREF0
AH23 25-A4
CL_VREF0_ICH
AD29 CL_VREF1 CL_VREF1_ICH
t
30 D6 TP16267
AJ25 25-A4
AD30 CHP3_SLPM# SLP_M*
31 A3 AJ23
AD31
0 TP15340
CL_RST* CL3_RST#
13-B1 45-C4 R625 AJ14 13-B1
27-B3 F9 F8 36-B3 27-B3
CHP3_DPRSLPVR DPRSLPVR_GPIO16
AJ27 P3.3V_AUX
Power MGT
PCI3_INTA# PIRQA* PIRQE*_GPIO2 PCI3_INTE# P3.3V_AUX TP15325 MEN_LED_GPIO24
AJ24 TP16264 R616
m
27-B3 B5 Interrupt I/F G11 36-B3 27-B3 AE21 10K
n
PCI3_INTB# 27-B3 C5
PIRQB* PIRQF*_GPIO3
F12 36-B3 27-B3
PCI3_INTF# R660 10K
BATLOW* ME_ES_ALERT_GPIO10
AF22TP16263 R661 10K
PCI3_INTC# 27-B3 A10
PIRQC* PIRQG*_GPIO4
B3 27-B3
PCI3_INTG# 31-C2 C2
ES_ME_ALERT_GPIO14
AG19TP16225 R901 100K
PCI3_INTD# PIRQD* PIRQH*_GPIO5 PCI3_INTH# KBC3_PWRBTN# PWRBTN* WOL_EN_EPIO08
P27 F27 R659 0 AH20 G3
a
PEX1_RXN1_MIN PERN0 PERN4 LAN_RST* USBP0N USB3_P0-
e
35-C4 P26 PCI - Express F26 G2 34-C2
PEX1_RXP1_MIN 35-C4 100nF C724 N29 PERP0 PERP4
E29 R646 100 1%
AG27
USBP0P
H5 34-C2
USB3_P0+
PEX1_TXN1_MIN PETN0 PETN4 KBC3_RSMRST# RSMRST* USBP1N USB3_P1-
PEX1_TXP1_MIN
35-C4 100nF C725 N28 PETP0 PETP4
E28 31-C2 R645 100K
USBP1P
H4 34-B2
USB3_P1+
E1 H2 34-B2
M27 D27
CLK3_PWRGD 8-C4
CK_PWRGD USBP2N
H1 49-C4
USB3_P2-
S fid
PEX1_LAN_RXDN PERN1 PERN5_GLAN_RXN TP1075 E3 USBP2P USB3_P2+
32-C4 M26 D26 R745 0 J3 49-C4
PEX1_LAN_RXDP 32-D4 100nF C727 L29 PERP1 PERP5_GLAN_RXP
C29 R655
0
CLPWROK USBP3N
J2 35-C3
USB3_P3-
PEX1_LAN_TXDN PETN1 PETN5_GLAN_TXN KBC3_PWRGD USBP3P USB3_P3+
32-C4 100nF C728 L28 C28 11-C3 31-C4 36-A4 R65310K AE23 K5 35-C3
PEX1_LAN_TXDP 32-C4
PETP1 PETP5_GLAN_TXP PWROK USBP4N
K4 34-B4
USB3_P4-
TP15339 USBP4P USB3_P4+
K27 31-C4 AJ8 K2 34-B4
PEX1_RXN3_MIN 35-C2
PERN2 KBC3_EXTSMI# TP15053 AJ9 TACH1_GPIO1 USBP5N
K1 35-C2
USB3_P5-
PEX1_RXP3_MIN K26 PERP2 CHP3_CRISIS# TACH2_GPIO6 USBP5P USB3_P5+
PEX1_TXN3_MIN
35-C2 100nF C757 J29 PETN2 KBC3_RUNSCI#
31-C4
27-C4 AH9
TACH3_GPIO7 USBP6N
L3 35-C2
USB3_P6-
35-C2 100nF C758 J28 C23 TP16365 31-B2 AE16 L2 35-C1
PEX1_TXP3_MIN PETP2 SPI_CLK
B23 TP16366 KBC3_WAKESCI# AC19
GPIO8 USBP6P
M5 35-C1
USB3_P6+
SPI_CS0* TP16161 GPIO12 USBP7N USB3_P7-
n
H27 E22 SPI3_CS1# AG8 M4 28-A4
PEX1_RXN4_NAND PERN3 SPI_CS1* CHP3_DMBON TACH0_GPIO17 USBP7P USB3_P7+
SPI
USB
33-B4 H26 AH12 M2 28-A4
PEX1_RXP4_NAND 33-B4C755
PERP3 CHP3_HSDPAOFF# GPIO18 USBP8N
100nFG29 F21 SPI3_MISO AE11 M1
GPIO
B PEX1_TXN4_NAND Should not be pulled high TP16224 AG10
PETN3 SPI_MISO TP16367 GPIO20 USBP8P
PEX1_TXP4_NAND
33-B4C756 100nFG28 PETP3 SPI_MOSI
D23
SCLOCK_GPIO22 USBP9N
N3 B
AH25 N2
ROBSON CHP3_LANSEL QRT_STATE0_GPIO27 USBP9P
o
27-C4 AD16
P3.3V CHP3_GFXSEL 27-B4 AG13
QRT_STATE1_GPIO28
F2 TP15341 R746 22.6 1%
CHP3_SATACLKREQ# 8-C4 AF9
SATACLKREQ*_GPIO35 USBRBIAS*
F3
P3.3V SLOAD_GPIO38 USBRBIAS
SPI3_CS0# R722 22 AJ11
CHP3_ROBSONSEL SDATAOUT0_GPIO39
AJ19 TP16120
SPI3_CLK R725 100
CHP3_1394_ROMW#
27-B4 AD10
SDATAOUT1_GPIO48 OC0*
SPI3_MOSI R724 47 36-C2 R674 10K AG16
C
OC1*_GPIO40
AD9 AG15
U19 CHP3_SPKR 27-D4 40-A4
SPKR OC2*_GPIO41
AE15
R720 R721 OC3*_GPIO42
MISC
10K 10K MX25L8005M2C-15G 13-B4 AJ13 AF15
TP15324 5 2 TP15330 R723 22 TP15329 GMCH3_ICHSYNC# MCH_SYNC* OC4*_GPIO43
AG17
1% 1% TP16226 D Q TP16159 OC5*_GPIO29
6 Input, internally ANDed with the PWROK input AJ21 AD12
TP15328 C TP3 OC6*_GPIO30 P3.3V_AUX
1 AJ18
TP15332 S* OC7*_GPIO31
7 AG9 AD14
TP15331 HOLD* ICH7 BOOT BIOS SELECT CLK3_ICH14 CLK14 OC8*
Clocks
3 8-C4 G5 AH18 R620 1K
8
W*
4
CLK3_USB48 8-C4
CLK48 OC9*
VCC VSS SPI PCI LPC TP16158 D3 AJ12 TP1071
SUSCLK SATA0GP_GPIO21
C754 C931 AJ10 TP1072
GPIO
SATA
1107-001646 GNT0* 0 1 1 SATA1GP_GPIO19
100nF 0.033nF AF11 TP1073
SATA2GP_GPIO36
SPI_CS1* 1 0 1 SATA3GP_GPIO37
AG11 TP1074
P3.3V_AUX
Default : LPC Boot
P3.3V P3.3V_AUX NO_STUFF
(0 : Pull Down / 1 : Default)
U16
5 7SZ08
R766 R618 13-B1 25-C3 31-B4 1 +
PLT3_RST# 4 49-B4 35-C3 35-C1 33-B4 30-D2 20-A4
A 3.24K 3.24K PLT3_RSTF# A
1% 1% 2
-
CL_VREF0_ICH 0.405V 3 R183
25-C1 NO_STUFF 100K USB CONFIG. DRAW DATE TITLE
CL_VREF1_ICH 25-C1
C795 R763 C705 R617
1% USB 0 : RIGHT PORT
USB 1 : BACK PORT
ZHOU JUN 4/10/2007
TORINO 2 SAMSUNG
USB 2 : DMB CARD CHECK DEV. STEP
100nF 453 100nF 453 USB 3 : MINICARD (WLAN) ELECTRONICS
1% 1% USB 4 : BLUETOOTH
GUO LEI MP MAIN
USB 5 : WiBro SIM CARD APPROVAL REV PART NO.
R182 0
USB 6 : WiBro / HSDPA
KEVIN LEE 1.1 ICH8M(2) BA41-00727/8A
USB 7 : Camera
March 28, 2007 3:33:29 PM PAGE 25 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
M24
G24
H24
N23
H23
K24
V23
F24
T23
L24
L23
J24
J23
VCC1_5_B_13
VCC1_5_B_12
VCC1_5_B_11
VCC1_5_B_10
VCC1_5_B_9
VCC1_5_B_8
VCC1_5_B_7
VCC1_5_B_6
VCC1_5_B_5
VCC1_5_B_4
VCC1_5_B_3
VCC1_5_B_2
VCC1_5_B_1
N24 L11
VCC1_5_B_14 VCC1_05_1 P1.05V
P24 M11
VCC1_5_B_15 VCC1_05_2
R24 P11
VCC1_5_B_16 VCC1_05_3
T24 T11
P1.5V_PCIE VCC1_5_B_17 VCC1_05_4
U24 U11
P1.5V VCC1_5_B_18 VCC1_05_5
V24 V11
D B25 E25
VCC1_5_B_19 VCC1_05_6
A13 C735 C734 D
VCC1_5_B_20 VCC1_05_7
BLM18PG181SN1 F25
VCC1_5_B_21 VCC1_05_8
B13 100nF 100nF
TP16422 K25 G14
VCC1_5_B_22 VCC1_05_9
L25 C13
VCC1_5_B_23 VCC1_05_10
EC20 M25 C14
C732 C731 VCC1_5_B_24 VCC1_05_11
330uF 22000nF 22000nF C730 N25
VCC1_5_B_25 VCC1_05_12
D14
2.5V 2200nF P25 E14
VCC1_5_B_26 VCC1_05_13
CORE
AL 6.3V 6.3V R25 F14
VCC1_5_B_27 VCC1_05_14
U25 L12
VCC1_5_B_28 VCC1_05_15
VCCA3GP
V25 L14
VCC1_5_B_29 VCC1_05_16
W25 L16
VCC1_5_B_30 VCC1_05_17
Y25 L17
VCC1_5_B_31 VCC1_05_18
AA25 L18
P5.0V_AUX P3.3V_AUX P5.0V P3.3V VCC1_5_B_32 VCC1_05_19
E26 M18
g
VCC1_5_B_33 VCC1_05_20
R26 P18
VCC1_5_B_34 VCC1_05_21
AA26 T18
1 1 VCC1_5_B_35 VCC1_05_22
R742 R767 E27 U18
D15 D18 VCC1_5_B_36 VCC1_05_23
10 MMBD301 100 MMBD301 R27 V12
VCC1_5_B_37 VCC1_05_24
n
3 1% 3 T27 V14
TP15343 VCC1_5_B_38 VCC1_05_25
AA27 V16
TP15344 VCC1_5_B_39 VCC1_05_26
AB27 V17
VCC1_5_B_40 VCC1_05_27
l
D28 V18 P1.25V L11 P1.5V
VCC1_5_B_41 VCC1_05_28
C764 C797 T28
VCC1_5_B_42 1uH
TP15342 TP15345 1
u
100nF 100nF AB28
VCC1_5_B_43 VCCDMIPLL
R29 R704
D29
VCC1_5_B_44 C263
U17-4
a
T29 AE28 C726
PRTC_BAT AB29
VCC1_5_B_45 VCC_DMI_1
AE29 C702 10nF
10000nF
VCC1_5_B_46 VCC_DMI_2 22000nF 6.3V
s i
C AD25 NH82801HEM AC23 6.3V
C
VCCRTC V_CPU_IO_1 P1.05V
AC24
V_CPU_IO_2
t
C703 C704 A16
100nF 100nF T7
V5REF_1 4/5 AF29
V5REF_2 VCC3_3_1
P1.5V G4 AD2 C733 C736 C289
L10 V5REF_SUS VCC3_3_2 4700nF
m
4.7uH 100nF 100nF
n
TP16423 10V
VCCP CORE
AJ6 AC8
VCCSATAPLL VCC3_3_3
AF8
C237 C711 AE7
VCC3_3_4
AD8
10000nF 1000nF VCC1_5_A_1 VCC3_3_5
AF7 AE8
a
6.3V 6.3V VCC1_5_A_2 VCC3_3_6
e ARX
AG7
VCC1_5_A_3
AH7 AA3
VCC1_5_A_4 VCC3_3_7
AJ7 U7
VCC1_5_A_5 VCC3_3_8
V7
VCC3_3_9
AC1 W1
IDE
S fid
VCC1_5_A_6 VCC3_3_10
AC2 W6
VCC1_5_A_7 VCC3_3_11 P3.3V
ATX
AC3 W7
VCC1_5_A_8 VCC3_3_12
AC4 Y7
VCC1_5_A_9 VCC3_3_13
AC5
VCC1_5_A_10
A8
VCC3_3_14
AC10
VCC1_5_A_11 VCC3_3_15
B15 C762 C761 C759 C763
P1.5V P1.5V AC9 B18 100nF 100nF 100nF 100nF
VCC1_5_A_12 VCC3_3_16
B4
VCC3_3_17
AA5 B9
VCC1_5_A_13 VCC3_3_18
n
AA6 C15 Distribute in PCI section
PCI
VCC1_5_A_14 VCC3_3_19
D13
VCC3_3_20
C765 C236 C280 G12
VCC1_5_A_15 VCC3_3_21
D5
B 100nF 1000nF 1000nF G17
VCC1_5_A_16 VCC3_3_22
E10 B
H7 E7
VCC1_5_A_17 VCC3_3_23
o
F11 P3.3V_AUX P3.3V
VCC3_3_24
AC7
VCC1_5_A_18
AD7 AC12
VCC1_5_A_19 VCCHDA
P1.5V D1 AD11
VCCUSBPLL VCCSUSHDA
C
F1 J6 TP16153
VCC1_5_A_20 VCCSUS1_05_1
USB CORE
L6 AF20 TP16151 C707 C706

VCC1_5_A_21 VCCSUS1_05_2
C709 L7
VCC1_5_A_22
100nF 100nF
100nF M6 AC16 TP16154
P3.3V VCC1_5_A_23 VCCSUS1_5_1
M7
VCC1_5_A_24 TP16155
J7
VCCSUS1_5_2
W23
VCC1_5_A_25
C3
TP16156 F17 VCCSUS3_3_1
C760 VCCLAN1_5_1
100nF TP16157 G18 AC18
VCCLAN1_5_2 VCCSUS3_3_2
AC21
VCCPSUS
VCCSUS3_3_3
F19 AC22
P1.5V VCCLAN3_3_1 VCCSUS3_3_4 P3.3V_AUX
G20 AG20
VCCLAN3_3_2 VCCSUS3_3_5
AH28
VCCSUS3_3_6
A24
VCCGLANPLL VCCPUSB TP474
G22
VCCCL1_05_1 C267
GLAN POWER
C796 A26 P3.3V C737 C738

VCCGLAN1_5_1 TP16152 4700nF
100nF A27 A22 100nF 100nF
VCCSUS3_3_19
VCCSUS3_3_18
VCCSUS3_3_17
VCCSUS3_3_16
VCCSUS3_3_15
VCCSUS3_3_14
VCCSUS3_3_13
VCCSUS3_3_12
VCCSUS3_3_11
VCCSUS3_3_10
VCCGLAN1_5_2 VCCCL1_5_1 6.3V

VCCSUS3_3_9
VCCSUS3_3_8
VCCSUS3_3_7
P1.5V_PCIE B26
VCCGLAN1_5_3
B27 F20
A B28
VCCGLAN1_5_4 VCCCL3_3_1
G21 A
VCCGLAN1_5_5 VCCCL3_3_2
C729 B25
VCCGLAN3_3
DRAW DATE TITLE
100nF ZHOU JUN 4/10/2007

TORINO 2 SAMSUNG
R6
R5
R3
R1
P7
P6
P5
P4
P3
P2
P1
N7
C1
CHECK DEV. STEP

ELECTRONICS
GUO LEI MP MAIN

March 28, 2007 3:33:29 PM PAGE 26 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
M12
M13
M14
M15
M16
M17
M23
M28
M29
N11
N12
N13
N14
N15
N16
N17
N18
L13
L15
L26
L27
M3
N1
K7
L1
L4
L5
VSS_99
VSS_100
VSS_101
VSS_102
VSS_103
VSS_104
VSS_105
VSS_106
VSS_107
VSS_108
VSS_109
VSS_110
VSS_111
VSS_112
VSS_113
VSS_114
VSS_115
VSS_116
VSS_117
VSS_118
VSS_119
VSS_120
VSS_121
VSS_122
VSS_123
VSS_124
VSS_125
A23 N26
D A5
VSS_1 VSS_126
N27 D
VSS_2 VSS_127
AA2 N4
VSS_3 VSS_128
AA7 N5
P3.3V P3.3V_AUX VSS_4 VSS_129
A25 N6
VSS_5 VSS_130
AB1 P12
VSS_6 VSS_131
AB24 P13
VSS_7 VSS_132
NO_STUFF AC11 P14
VSS_8 VSS_133
AC14 P15
VSS_9 VSS_134
R682 1K 1% R664 10K 25-D2 AC25 P16
40-A4 25-B2
CHP3_SPKR R663 10K 25-D2
CHP3_SMLINK0 AC26
VSS_10 VSS_135
P17
CHP3_SMLINK1 AC27
VSS_11 VSS_136
P23
VSS_12 VSS_137
R657 10K 35-C4 25-D2 AD17 P28
CHP3_SPKR Stuff: No Reboot CL3_WLANRST# VSS_13 VSS_138
R658 10K 25-D2
SMB3_ALERT# AD20
VSS_14 VSS_139
P29
AD28 R11
g
VSS_15 VSS_140
AD29 R12
P3.3V VSS_16 VSS_141
R662 2.2K
SMB3_DATA
AD3
VSS_17 VSS_142
R13
R649 2.2K 35-C3 35-C1 25-D2 8-A3 AD4 R14
35-C3 35-C1 25-D2 8-A3
SMB3_CLK AD6
VSS_18 VSS_143
R15
VSS_19 VSS_144
n
R683 AE1 R16
P3.3V_AUX VSS_20 VSS_145
10K AE12 R17
VSS_21 VSS_146
1% AE2 R18
VSS_22 VSS_147
l
AE22 R28
VSS_23 VSS_148
CHP3_CRISIS# R665 1K 1%
PEX3_WAKE#
AD1
VSS_24 VSS_149
R4
u
25-B2 35-C4 35-C2 32-D4 25-C2 AE25 T12
VSS_25 VSS_150
AE5 T13
VSS_26 VSS_151
U17-5
a
R627 Wake on PCI-E, OD, Pull-up to ALWAYS power AE6
VSS_27 VSS_152
T14
10K AE9 T15
VSS_28 VSS_153
s
1% AF14 T16
i
C NO_STUFF AF16
VSS_29 NH82801HEM VSS_154
T17 C
P3.3V VSS_30 VSS_155
AF18 T2
VSS_31 VSS_156
t
AF3 U12
VSS_32 VSS_157
AF4
VSS_33 5/5 VSS_158
U13
AG5 U14
VSS_34 VSS_159
R680 10K 36-A4 31-B2 25-C2 AG6 U15
PCI3_CLKRUN# VSS_35 VSS_160
m
AH10 U16
n
VSS_36 VSS_161
R768 10K 36-A4 25-C3 AH13 U17
P3.3V PCI3_PERR# VSS_37 VSS_162
R738 10K 25-C3
PCI3_PLOCK# AH16
VSS_38 VSS_163
U23
R728 10K 36-A4 25-C3 AH19 U26
R727 10K 36-B4 25-C3
PCI3_DEVSEL# AH2
VSS_39 VSS_164
U27
a
PCI3_FRAME# VSS_40 VSS_165
e
R650 10K R729 10K 36-A4 25-C3 AF28 U3
88E8039 100M 25-B2
CHP3_LANSEL R733 10K 36-A4 25-C3
PCI3_STOP# AH22
VSS_41 VSS_166
U5
PCI3_SERR# VSS_42 VSS_167
88E8055 GbE R651 10K NO_STUFF R735 10K 36-A4 25-C3
PCI3_IRDY#
AH24
VSS_43 VSS_168
V13
R736 10K 36-A4 25-C3 AH26 V15
PCI3_TRDY# VSS_44 VSS_169
INT_GFX R669 10K AH3 V28
S fid
25-B2
CHP3_GFXSEL AH4
VSS_45 VSS_170
V29
VSS_46 VSS_171
EXT_GFX R667 10K R734 10K 25-C4 AH8 W2
PCI3_INTA# VSS_47 VSS_172
R740 10K 25-C4 AJ5 W26
R681 10K R743 10K 25-C4
PCI3_INTB# B11
VSS_48 VSS_173
W27
ROBSON CHP3_ROBSONSEL PCI3_INTC# VSS_49 VSS_174
25-B2 R732 10K 25-C4
PCI3_INTD# B14
VSS_50 VSS_175
Y28
NO_ROBSON R626 10K B17
VSS_51 VSS_176
Y29
B2 Y4
VSS_52 VSS_177
R737 10K 36-B3 25-C3 B20 AB4
R731 10K 36-B3 25-C3
PCI3_INTE# B22
VSS_53 VSS_178
AB23
PCI3_INTF# VSS_54 VSS_179
n
R730 10K 36-B3 25-C3 B8 AB5
R741 10K 25-C3
PCI3_INTG# C24
VSS_55 VSS_180
AB6
PCI3_INTH# C26
VSS_56 VSS_181
AD5
VSS_57 VSS_182
B C27
VSS_58 VSS_183
U4 B
R744 10K 36-B4 25-D3 C6 W24
PCI3_REQ0# VSS_59 VSS_184
o
D12
VSS_60
D15 A1
VSS_61 VSS__NCTF1
R679 10K 36-C3 31-B4 25-C2
CHP3_SERIRQ D18
VSS_62 VSS__NCTF2
A2
D2 A28
VSS_63 VSS__NCTF3
D4 A29
VSS_64 VSS__NCTF4
R673 10K 31-C2 24-C2 E21 AH1
C
R677 10K 31-B2 24-C2
KBC3_CPURST# E24
VSS_65 VSS__NCTF5
AH29
KBC3_A20G E4
VSS_66 VSS__NCTF6
AJ1
VSS_67 VSS__NCTF7
E9 AJ2
VSS_68 VSS__NCTF8
F15 AJ28
VSS_69 VSS__NCTF9
E23 AJ29
VSS_70 VSS__NCTF10
F28 B1
VSS_71 VSS__NCTF11
VSS_72
VSS_73
VSS_74
VSS_75
VSS_76
VSS_77
VSS_78
VSS_79
VSS_80
VSS_81
VSS_82
VSS_83
VSS_84
VSS_85
VSS_86
VSS_87
VSS_88
VSS_89
VSS_90
VSS_91
VSS_92
VSS_93
VSS_94
VSS_95
VSS_96
VSS_97
VSS_98
B29
VSS__NCTF12
F29
F7
G1
E2
G10
G13
G19
G23
G25
G26
G27
H25
H28
H29
H3
H6
J1
J25
J26
J27
J4
J5
K23
K28
K29
K3
K6
A A
DRAW DATE TITLE
CHECK
ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
ELECTRONICS
GUO LEI MP MAIN

March 28, 2007 3:33:29 PM PAGE 27 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
SI2315BDS-T1
P3.3V_AUX P3.3V Q9 LCD_VDD3V
3
2
D D
D
S
R579
1
G
200K
C600
WXGA LCD CONNECTOR TP1080 R577 68K TP319
100nF
3
R55 0 1 10K Q10 C601
INT_GFX LCD3_VDDEN 13-C4 KSR1102 100nF
10K
P3.3V P3.3V LCD_VDD3V
GFX3_VDDEN 2
20-D3
NO_STUFF
g
R547 R548 C547 C597 C598 LCD1
4.7K 4.7K 100nF 100nF 100nF SOCK-30P-1R-SMD
1
2 Signlas : #40AWG
n
Ext_GFX GFX3_EDID_CLK 20-D2 EDID 3 LCD Vdd : #36AWG
GFX3_EDID_DATA 4
20-D2
5
Inverter Vdd : #36AWG
l
R61 0 GND : #36AWG
LCD3_EDID_CLK 6
LCD3_EDID_DATA
13-C4 R60 0
7
u
13-C4 R69 0
LCD1_ADATA0# 8
LCD1_ADATA0
13-C4 R71 0
9
a
13-B4
10
R75 0
LCD1_ADATA1# 11 P3.3V
R78
s
0
i
13-C4
C Int_GFX LCD1_ADATA1 12 C
13-B4
13
LCD1_ADATA2# R83 0
14
t
13-C4 R80 0
LCD1_ADATA2 13-B4
15
16 TP17366 U1
R79 0 R907 47K
LCD1_ACLK# 13-B4 R76 0
17 KBC5_BKLTON R908 0 1
5 ELM7S08WS
LCD1_ACLK 18 NO_STUFF KBC3_BKLTON +
TP16362 4 TP15354
m
13-B4 31-C2 R48 0 R513 1K 1%
n
CLOSE to GFX 19 EXT_GFX GFX3_BKLTEN 20-D3 R97 0 2 28-B4
LCD3_BKLTON
INT_GFX 20 INT_GFX LCD3_BKLTEN -
13-C4
GFX1_ADATA0# 20-D1
21 3
GFX1_ADATA0 22 R514 R515
20-D1
a
23 100K 100K
TP15353
e
1% 1%
GFX1_ADATA1# 20-D1
24
31
GFX1_ADATA1 C545 C544 25 MNT1
Ext_GFX 20-D1
0.006nF 0.006nF 26 MNT2
32
33
GFX1_ADATA2# 20-D1
50V 50V 27 MNT3
34
S fid
GFX1_ADATA2 20-D1 NO_STUFF
28 MNT4
35
29 MNT5
36
GFX1_ACLK# 20-D1
30 MNT6
GFX1_ACLK 20-D1
DECOUPLING CAP FOR EMI 3710-002130
EXT_GFX
B2 VDC_INV
MMZ1608S121AT
n
GFX3_BKLTCTRL 20-D3
LCD3_BKLTCTRL
B LCD3_BKLTON
13-C4 Q1 B
28-C1 B7 VDC SI2307BDS-T1-E3 VDC_INV
o
MMZ1608S121AT
3
2
INT_GFX
D
S
NO_STUFF
C41 C42 C3
1
R504
G
100nF 100nF 100nF
KBC3_BKLTON R904 0
25V 25V 300K 25V
31-C2 1%
C
KBC3_BKLTON is a PWM Brightness Control by MICOM
TP15355 C7
For i965GM PWM Control Bug R505 10K TP1077 100nF
25V
P3.3V R506
100K
Camera
TP1078
P5.0V Q2
B539 B540 Camera1 2N7002 D 3
For Camera ACM2012-900-2P-T BLM18PG181SN1 HDR-4P-SMD
2 3 R516 4.7K TP15056 G
1
1 S 2
USB3_P7- 25-B1
2
USB3_P7+ 25-B1
3
4
1 4 C937 5
MNT1
100nF 6
MNT2
3711-005854
A A
DRAW DATE TITLE
CHECK
ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
ELECTRONICS
GUO LEI MP MAIN
KEVIN LEE 1.1 LVDS BA41-00727/8A

March 28, 2007 3:33:29 PM PAGE 28 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
D D
CRT CONNECTOR VCC_CRT
B515
MMZ1608S121AT
CRT500
g
DSUB-15-3R-F
R28 0 TP16214 CRT3_RED L4 33nH TP1083 1
INT_GFX VGA3_RED 13-C4 R26 0 6
EXT_GFX GFX3_RED 20-C1 11
TP16215 CRT3_GREEN L3 33nH TP1084
n
R29 0 2
INT_GFX VGA3_GREEN 13-D4 R25 0 7
EXT_GFX GFX3_GREEN 20-C1 12
l
R30 0 TP16216 CRT3_BLUE L5 33nH TP1085 3
INT_GFX VGA3_BLUE
150 1%
150 1%
150 1%
13-D4 R24 0 8
0.0033nF
0.0033nF
0.0033nF
0.0033nF
0.0033nF
0.0033nF
EXT_GFX GFX3_BLUE
PGB1010603NR
20-B1 13
1
4
TP1086
a
9
14
s
5 16
2
C C
NO_STUFF
NO_STUFF
C31
C33
C32
C35
C36
C34
10 17
R39
R41
R40
D1
D5
D6
15
t
C534
100nF 3701-001326
m n
VGA5_DDCDATA 29-A1
VGA5_DDCCLK 29-A3
VCC_CRT
INT_GFX
EXT_GFX
INT_GFX
EXT_GFX
VGA3_HSYNC
GFX3_HSYNC
VGA3_VSYNC
GFX3_VSYNC
13-D4
20-B1
13-D4
20-B1
R510
R509
R6
R5
a
S fid
33
22.6
33
22.6e TP1087
1%
TP1088
1%
2
C533
OE*
1
+
-
5
3
4
U501
SN74AHCT1G125DCKR
2
OE*
1
+
-
5
3
4
U502
TP16424
TP16425
SN74AHCT1G125DCKR
R537
R536
39.2 1%
39.2 1%
0.33nF
0.33nF
0.1nF
0.1nF
100nF
n
C535
C536
C537
C538
B B
INT_GFX
P3.3V
R531
2.2K
P3.3V
1 G
Q503
BSS138
D Co VCC_CRT
TP16426
R535
2.2K
3
D502
MMBD4148
C532
100nF
1
P5.0V
INT_GFX
P3.3V
R533
2.2K
P3.3V
1 G
Q504
BSS138
D
VCC_CRT
R534
2.2K
S
S
VGA3_DDCCLK 13-D4 29-C4
VGA5_DDCCLK VGA3_DDCDATA 13-D4 29-C4
VGA5_DDCDATA
2 3 2 3
R566 0 R532 0
GFX3_DDCCLK 20-D2
GFX3_DDCDATA 20-D2
EXT_GFX EXT_GFX
A A
DRAW DATE TITLE
CHECK
ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
ELECTRONICS
GUO LEI MP MAIN
KEVIN LEE 1.1 CRT BA41-00727/8A

March 28, 2007 3:33:29 PM PAGE 29 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
Main to ODD
D Main to HDD D
P5.0V
P5.0V P5.0V
C844 TP1090
C840 10000nF C839 C842
100nF 100nF 100nF ODD500
6.3V
PLT3_RSTF# R47 33 1%
20-A4 25-A2 33-B4 35-C1 35-C3 49-B4
g
1 2 24-C2
IDE_D(8:15)
IDE_D(0:7) 24-C2
3 4
8
5 6
7 9
P3.3V 7 8
6 10
P3.3V 9 10
n
5 11
4
11 12 12
13 14
3 13
C838 HDD500 15 16
l
4700nF
C841 C843 R685 2
17 18
14
100nF 100nF CONN-20P-FPC 1 15
10V 4.7K 19 20
u
0
1 21 22 24-A2
IDE_DREQ
2 23 24 IDE_IOR#
a
24-B2
3 IDE_IOW# 24-B2
25 26 24-B2
4 IDE_IORDY 27 28 IDE_DACK#
s i
24-B2
C 5 IDE_IRQ 30-B2
29 30 C
6 IDE_A1 24-B2
31 32 PDIAG* 24-B2
7 IDE_A0 33 34 IDE_A2
t
24-B2 24-B2
8 IDE_CS1# 24-B2
35 36 IDE_CS3#
9 DASP* 37 38
10 39 40
11 41 42
m n
12 C200 C201 C202 43 44
13 10000nF TP16244 45 46
SATA1_RXN0
24-B4 C870 4.7nF 25V
14 6.3V
100nF 100nF
47 48
24-B4 C869 4.7nF 25V
SATA1_RXP0 15 49 50
51
a
16 MNT1
e
52
SATA1_TXN0 24-B4
17 MNT2
SATA1_TXP0 24-B4
18
19
20 3710-002314
21
S fid
MNT1
22 SOCKET-50P-2R
MNT2
CSEL(Pin47)
3708-002036 1.Open-Master
2.GND-Slave
Height 7.4mm
P3.3V
B
R875
10K
1%
R847
10K
1%
o n5
+
U516
7SZ08
4
P5.0V
R687
10K D13
MMBD301
P3.3V
R684
10K
B
C
2 50-C3
HDD3_LED# 3 1
CHP3_SATALED# 24-B4
- IDE_IRQ 30-C2 24-B2
CHP3_IDEIRQ
D 3 3
Q518
R873 10K G RHU002N06
NAND3_DISKBUSY 33-B4 1
S
2
NO_STUFF
A A
DRAW DATE TITLE
CHECK
ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
ELECTRONICS
GUO LEI MP MAIN
KEVIN LEE 1.1 IDE BA41-00727/8A

March 28, 2007 3:33:29 PM PAGE 30 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
P3.3V_MICOM
D D
C720 C722 C721

100nF 100nF 100nF R717 R716 R719
P5.0V 10K 10K 10K
1% 1% 1%
TP15107 TP16072
TP15106
10K 49-C1 31-B2

KBC3_CHKPWRSW#
10K
10K
10K
10K
10K
31-B1
KBC3_RST#
100
36
37
59
7
1
6
5
4
9
8
NMI
RES*
g
RESO*
VCC_1
VCC_2
VCC_3
MD0
MD1
VCCB
VCL
STBY*
TP17350
R714
R715
R694
R695
R693
R692 48 49
KBC5_BKLTON 47
PA0 P40
50 25-C2
KBC3_RSMRST#
TP15111 31
PA1 P41
51 44-C2 43-B2
KBC3_SUSPWRON
TP15112 PA2 P42 KBC3_THERM_SMDATA
n
30 52 11-C2
TP15113 21
PA3 P43
53 49-C1
KBC3_BLCKPWRSW#
TP15114 20
PA4 P44
54 25-C2
KBC3_PWRBTN#
PA5 P45 KBC3_VRON
l
11 55 28-C2
45-C4
KBC5_TCLK 50-C2 10
PA6 P46
56
KBC3_BKLTON P3.3V_MICOM
KBC5_TDATA PA7 P47 KBC3_CPURST#
u
50-C2 R718 4.7K 27-B3 24-C2
25-B2 91 14
KBC3_EXTSMI# PB0 P50 KBC3_LED_ACIN#
a
25-B2 90 13 50-B3
KBC3_RUNSCI# 50-D4 81
PB1 P51
12 KBC3_LED_CHARGE#
KBC3_SCLED# PB2 P52 KBC3_SMCLK# P3.3V_MICOM
s
80
i
50-D4 42-A2
C KBC3_NUMLED# 50-D4 69
PB3
26 45-B4 25-C2 C
KBC3_CAPSLED# 50-A3 68
PB4 P60
27 TP14991 49-C1
VRM3_CPU_PWRGD
KBC3_LED_POWER# PB5 P61 LID3_SWITCH#
t
58 28 R165
KBC3_PWRGD 11-C3 25-B2 36-A4 57
PB6 U15 P62
29 43-B2
SUSPWRGD
KBC3_PWRON PB7 P63 VCCP_PWRGD 200K
43-A4
49-B2 46-B1 46-B4 47-B2 47-D4 48-B4 48-C4 32 48-C2 47-D4 42-A2
46-A1 45-C4 1%
KBC5_KSI(0:7) 0 79 H8S-2110B P64
33 KBC3_CHGEN R691 47 42-B1
P10 P65 BAT3_TEMPA
m
1 78 34 25-C2
n
2 77
P11 0903-001439 P66
35 CHP3_SLPS3# C696
3 76
P12 P67 13-B1
49-B2
KBC3_PWRGDMCH 100nF
4 75
P13
38 8
KBC5_KSO(8:15)
P14 P70
5 74 39 9
MICOM RESET
a
P15 P71
e
6 73 40 10
49-B2 7 72
P16 50 26 P72
41 11
KBC5_KSO(0:7) P17 51 25 P73
42 12 P3.3V_MICOM
P74
0 67 43 13
P20 P75 P3.3V_MICOM
1 66 44 14
S fid
P21 P76
2 65
P22 P77
45 15 R713 10K
3 64
P23
4 63 93
5 62
P24 P80
94 25-B2
KBC3_WAKESCI#
P25 P81 KBC3_A20G R181
6 61 95 27-B3 24-C2 30.1K
7 60
P26 P82
96 36-A4 27-C3 25-C2
PCI3_CLKRUN# 1%
P27 P83
97 TP15109 35-C3 35-C1 34-A4
R701 31-D2
LPC3_LAD(0:3) 75 1 TXD P84 KBC3_RFOFF# 100K KBC3_RST#
24-D2 49-A4 0 82 76 100 98 TP15110 R702
1 83
P30 RXD P85 99 40-C4
KBC3_SPKMUTE 100K D 4
P31 P86 KBC3_THERM_SMCLK 1% Q23-1
n
2 84 11-C2
P32 TP15108 SM6K2
3 85 25 49-C1 G
P33 P90 MIO3_BUTTON#
LPC3_LFRAME# 86
P34 P91
24 R700 1K
KBC3_LANRST# 2 C262
B 24-D2 49-B4 87 23 R696 1K 32-D4 D 1 S B
PLT3_RST# P35 P92 ADT3_SEL 3 1000nF
8-C4 25-A3
13-B1 25-C3 88 22 42-A4 Q23-2
CLK3_PCLKMICOM P36 P93 KBC3_CHKPWRSW# 16V
o
89 19 49-C1 31-D2
25-D2 TP15105 G SM6K2
CHP3_SERIRQ 25-C2 27-B3 36-C3
P37 P94
18 CHP3_SUSSTAT#
P95 CHP3_SLPS5# 5
2
VSS_1
VSS_2
VSS_3
VSS_4
VSS_5
17 25-C2 S
6
3
XTAL P96
16
CHP3_S4STATE# C723
EXTAL P97 42-A2
KBC3_SMDATA# 1000nF
10MHz TP1091 6.3V
C
TP1092
15
46
70
71
92
R699 4.7K
1
R698 10K P3.3V_MICOM

C753 C752 R697 10K VDC P3.3V_MICOM
0.02nF Y3 0.02nF
2801-004200
R642 R703
430K 100K
D 4
1% 1% Q25-1
TP16147 G SM6K2
2
D 1 S
3
C662 Q25-2
100nF TP16148 G SM6K2
5
R643 S
6
150K
1%
A A
DRAW DATE TITLE
CHECK
ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
ELECTRONICS
GUO LEI MP MAIN
KEVIN LEE 1.1 MICOM BA41-00727/8A

March 28, 2007 3:33:29 PM PAGE 31 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
P3.3V_AUX
D D
3722-002390
P1.8V_P2.5V_LAN MNT4
16
MNT3
15
P3.3V_AUX MNT2
14
U5 13
MNT1
88E8039 NO_STUFF
YELLOW-
31-B2 5 30 LAN3_MDI3P 12
KBC3_LANRST# 6
PERST# NC_5
31 LAN3_MDI3N 11
YELLOW+
PEX3_WAKE# 25-C2 27-C3 35-C2 35-C4 55
WAKE# NC_6
26 LAN3_MDI2P 10
GREEN-
CLK1_PCIELOM 8-C1 56
REFCLKP NC_7
27 LAN3_MDI2N LT500 9
GREEN+
CLK1_PCIELOM# REFCLKN NC_8 H0022 TERM4
PEX1_LAN_RXDP
8-C1
25-B4 C588 100nF 49
PCIE_TXP RXP
20 LAN3_MDI1P 8
TERM3
25-B4 C589 100nF 50 21 LAN3_MDI1N 1 16 RJ45_TD1P 7
g
PEX1_LAN_RXDN 54
PCIE_TXN RXN
17 LAN3_MDI0P 3
RD+ RX+
14 6
RD-
PEX1_LAN_TXDP 25-B4 53
PCIE_RXP TXP
18 LAN3_MDI0N 2
RDCT RXCT
15 RJ45_TD1N 5
TERM2
PEX1_LAN_TXDN PCIE_RXN TXN RD- RX- TERM1
25-B4 R570 4.7K 4
RD+
1%
1%
1%
1%
1%
1%
1%
1%
42 7 10 RJ45_TD0P 3
LAN3_CLKREQ# PU_VDDO_TTL_1 TD+ TX+ TD-
n
8-C1 R571 4.7K 43 6 11 2
49.9
49.9
49.9
49.9
49.9
49.9
49.9
49.9
PU_VDDO_TTL_2 TDCT TXCT TD+
8 9 RJ45_TD0N 1
TD- TX-
Left NC @ 88E8055 37 59 JACK-LAN-8P-LED
NC_1 LED_ACTI# LAN3_ACTLED#
l
35 60 32-B2 LAN500
34
NC_2 LED_SPEED#
62 32-B2
LAN3_LINK10_100#
NC_3 NC_9 LAN3_LINK1000#
u
36 63 32-B2
R545
R546
R543
R544
R541
R542
R538
R539
NC_4 LED_LINK#
a
38 3 32-A4
LAN3_VPDCLK 32-A1 41
VPD_CLK CTRL12
4 32-A3
CTRL_12
LAN3_VPDDATA VPD_DATA CTRL25 CTRL18_25 TP16345
TP16346
TP16347
TP16348
s i
32-A1
C C
1%
1%
1%
1%
45
P3.3V_AUX P3.3V_AUX VDDO_TTL_1 TP16262
40 9
VDDO_TTL_2 SWITCH_VAUX
t
1 11 TP16256
75
75
75
75
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
VDDO_TTL_3 SWITCH_VCC
61
VDDO_TTL_4 P3.3V_AUX P3.3V
8
VDDO_TTL_5 TP16257R573
m
12 0
R3
R4
R2
R1
n
VAUX_AVLBL
C543
C542
C541
C540
C506
C507
C508
C505
C594 C595 C584 C593 48
VDD_1
100nF 100nF 100nF 100nF 44 47 TP16258R114 0 TP16349
VDD_2 VMAIN_AVLBL
39 R574 4.7K
P1.2V_LAN 33
VDD_3
10 TP16259 C6
a
VDD_4 LOM_DISABLE# KBC3_LANLOWPWR# 1nF
e
13 NO_STUFF
VDD_5 TP16350 3KV
7 15
VDD_6 XTALI
2
C115 VDD_7 TP16351 Y1
10000nF
C583 C592 C591 C582 C585 58
VDD_8 XTALO
14
100nF 100nF 100nF 100nF 100nF 25MHz
S fid
6.3V
32
AVDDL_1 TP15359
28 1 2 R500 221 1%
22
AVDDL_2
46
LAN3_ACTLED# 32-C3
AVDDL_3 TESTMODE 2801-004517
P1.8V_P2.5V_LAN 19 29 TP16254 C596 C599 R512 221 1% TP15358
AVDDL_4 TSTPT TP16260 LAN3_LINK10_100#
57
AVDDL_5 HSDDACP
24 0.018nF 0.018nF
LAN3_LINK1000#
32-C3 R511 221 1%
52 25 TP16255 32-C3
AVDDL_6 HSDACN TP16261 NO_STUFF
C37 51
AVDDL_7 RSET
16 R572 2K 1%
10000nF
C587 C590 C631 C633
100nF 100nF 100nF 100nF 23
6.3V AVDD 88E8039: 2Kohm
n
65
64
THERMAL 88E8055: 4.99Kohm
VDD25
B B
1205-003090 P3.3V_AUX
o
Pin Compatible with 88E8055
4.7K
4.7K
C
P3.3V_AUX P1.2V_LAN P3.3V_AUX P1.8V_P2.5V_LAN 88E8039: 2.5V
B15 B6 88E8055: 1.8V
U4
4
4
BLM18PG181SN1 BLM18PG181SN1
TP16353 TP16354
R567
R568
AT24C08AN-10SU-2.7
8 1
3
2
VCC A0
7 2
C186 C184 C185 C38 C40 C39 WP A1
1
1
R591 C634 C632 R540 C539 C586 32-C4 6 3
100nF 4700nF Q12 10000nF 4700nF
100nF 4700nF
100nF Q7 10000nF 4700nF
100nF LAN3_VPDCLK 5
SCL A2
4
4.7K 10V 6.3V 10V 4.7K 10V 6.3V 10V LAN3_VPDDATA SDA GND
BCP69-16 BCP69-16 32-C4
CTRL_12 32-C3
CTRL18_25 32-C3
A A
DRAW DATE TITLE
CHECK
ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
ELECTRONICS
GUO LEI MP MAIN
KEVIN LEE 1.1 LOM BA41-00727/8A

March 28, 2007 3:33:29 PM PAGE 32 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
P3.3V
D D
C630 C629 C690
1000nF 100nF 100nF
6.3V 10V 10V
U10
Robson 12
K9K1G08U0M-YCB0
7
37
VCC1 R_B1*
6 33-B4 33-B1
NAND3_RB
VCC2 R_B2*
NAND3_IO(7:0)
9 29 RA501-1 1 8 33 0 33-C2
NAND3_CE0# 33-B2 33-B4 10
CE1* IO_0
30 RA501-2 2 7 33 1
NAND3_CE1# CE2* IO_1
NAND3_RE0#
33-B2 33-B4 8
RE* IO_2
31 RA501-3 3 6 33 2
P1.5V B523 33-B2 33-B4 16 32 RA501-4 4 5 33 3
NAND3_CLE CLE IO_3
CIM10J750NC NAND3_ALE
33-B2 33-B4 17
ALE IO_4
41 RA500-1 1 8 33 4
TP16431 33-B2 33-B4 18 42 RA500-2 2 7 33 5
g
P3.3V NAND3_WE0# 33-B2 33-C4 19
WE* IO_5
43 RA500-3 3 6 33 6
C701 C656 NAND3_WP# WP* IO_6
1000nF 100nF C654 B23 33-B2 33-B4
IO_7
44 RA500-4 4 5 33 7
10nF CIM10J750NC 1
6.3V 10V TP16430 NC1
2 35
NC2 NC17
n
B522 3 39
C698 C700 C699 C697 Internal 1.2V VRM 4
NC3 NC18
40
CIM10J750NC 1000nF 100nF 100nFTP16435 NC4 NC19
TP16432 10nF 5 45
6.3V 10V 10V NC5 NC20
l
11 46
C658 C657 C655 C693 C692 C694 NC6 NC21
1000nF 1000nF 100nF C659 C695 100nF 100nF 1000nF
14
NC7 NC22
47
u
10nF 10nF 15 48
6.3V 6.3V 10V 10V 10V 6.3V NC8 NC23
23 20
NC9 DNU1
a
24 21
NC10 DNU2
25 22
P1.5V NC11 DNU3
s
27
i
C U11 NC12 C
P3.3V DIAMOND 28 38
NC13 PRE_VSS
18 3 26
AVDD VDD1 NC14
t
24 8 33 13
27
AVDDT VDD2
13
C650 C651 34
NC15 VSS1
36
C649 C652 C648 AVDDL VDD3 100nF 1000nF NC16 VSS2
1000nF 100nF 100nF
C653 VDD4
41
10V 6.3V
10nF 2 POWER 45
6.3V 10V 10V VDDO1 VDD5 1107-001350
m
15 47
n
VDDO2 VDD6
38
VDDO3
52 46
VDDO4 VDDR1
61 48
VDDO5 VDDR2
a
TP16238 54 NAND3_IO(15:0)
e
R606 33 57 0 33-D1 33-B1
NAND3_WE0# 33-B2 33-C2 TP16230 55 NF_WE0* NF_IO_0
59 1
NF_WE1* NF_IO_1 P3.3V
62 2
TP16239 39 NF_IO_2
R612 33
NAND
64 3
NAND3_RE0# 33-B2 33-D2 TP16231 40 NF_RE0* NF_IO_3
66 4 P3.3V
S fid
NF_RE1* Interface NF_IO_4
68 5
R610 33 TP16240 42 NF_IO_5
4 6 C750 C751 C691
NAND3_CE0# 33-B2 33-D2R609 33 TP16241 43 NF_CE0* NF_IO_6
6 7
1000nF 100nF 100nF
NAND3_CE1# TP16233 49 NF_CE1* NF_IO_7 6.3V 10V 10V R613
33-B2 33-D2 58 8 U14 1K
TP16234 50 NF_CE2* NF_IO_8
60 9 K9K1G08U0M-YCB0
NF_CE3* NF_IO_9
63 10 12 7
TP16242 51 NF_IO_10 VCC1 R_B1* NAND3_RB
NAND3_CLE R608 33
NF_CLE NF_IO_11
65 11 37
VCC2 R_B2*
6 33-D1 33-B4
33-B2 33-D2R607 33 TP16243 53 67 12
NAND3_ALE 33-B2 33-D2 56
NF_ALE NF_IO_12
1 13 9 29 RA503-1 1 8 33 8 33-C2
NAND3_IO(15:8)
NAND3_WP# NF_WP* NF_IO_13 NAND3_CE0# CE1* IO_0
n
33-B2 33-C2 37 5 14 33-B4 33-D2 10 30 RA503-2 2 7 33 9
NAND3_RB 33-B1 33-D1 33
NF_RB NF_IO_14
7 15 NAND3_CE1# 33-B4 33-D2 8
CE2* IO_1
31 RA503-3 3 6 33 10
NAND3_DISKBUSY DISK_BUSY NF_IO_15 NAND3_RE0# RE* IO_2
30-B4
NAND3_CLE
33-B4 33-D2 16
CLE IO_3
32 RA503-4 4 5 33 11
B C661 100nF 10V 23 19 TP16433 33-B4 33-D2 17 41 RA502-1 1 8 33 12 B
PEX1_RXP4_NAND 25-B4 C660 100nF 10V 22
TXP ISET NAND3_ALE 33-B4 33-D2 18
ALE IO_4
42 RA502-2 2 7 33 13
PEX1_RXN4_NAND TXN NAND3_WE0# WE* IO_5
o
25-B4 44 TP16434 33-C2 33-C4 19 43 RA502-3 3 6 33 14
26
DIS_REG12 NAND3_WP# 33-B4 33-C2
WP* IO_6
44 RA502-4 4 5 33 15
PEX1_TXP4_NAND RXP PCI Express IO_7
25-B4 25 Interface 9 R611 R166 R605 1
P3.3V PEX1_TXN4_NAND 25-B4
RXN TRST
10 2
NC1
35
TMS 1K 6.04K 10K NC2 NC17
36 11 1% 3 39
PLT3_RSTF# 20-A4 25-A2R614
30-D2 10K 35-C3
35-C1 TP16237 35
49-B4
PERST* TDO
12 4
NC3 NC18
40
C
CLKREQ* TDI NC4 NC19
14 5 45
TCK NC5 NC20
30 31 NO_STUFF 11 46
CLK1_PEXNAND 8-C1 29
CLK_P NORMAL_0
32 14
NC6 NC21
47
CLK1_PEXNAND# 8-C1
CLK_N NORMAL_1
28
STUFF: 2K Virtual Page 15
NC7 NC22
48
TP16236 16 Clock TP NO_STUFF: 4K Virtual Page NC8 NC23
21 23 20
TP16232 17 XTAL1 HSDACP NC9 DNU1
20 24 21
XTAL2 HSDACN NC10 DNU2
34 25 22
EXT_TRIG NC11 DNU3
69 27
GND_PAD NC12
28 38
NC13 PRE_VSS
26
0904-002228 NC14
33 13
NC15 VSS1
34 36
NC16 VSS2
1107-001350
ROBSON
A All istances on this page should be NO_STUFF if ROBSON is N/A A
DRAW DATE TITLE
CHECK
ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
ELECTRONICS
GUO LEI MP MAIN
KEVIN LEE 1.1 ROBSON BA41-00727/8A

March 28, 2007 3:33:29 PM PAGE 33 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
MDC connector USB Port

D D
P3.3V_AUX
J502
P5.0V
24-B4
1 2 PIN2 Tied to P3.3V_AUX, 060812 U505
CHP3_AZ_MDC_SDO 3 4
TPS2062
5 6
C646 100nF 2
CHP3_AZ_MDC_SYNC 33 TP15371
7 8 IN TP1098
24-C4 R229 7
CHP3_AZ_MDC_SDI1 24-C4
9 10 24-C4 8
OUT1
CHP3_AZ_MDC_RST# 24-C4 13
11 12 CHP3_AZ_MDC_BCLK 5
OC1*
6
MNT1 C300 OC2* OUT2 EC502
14
MNT2
C301 10000nF
3
EN1*
C628 C627 C647 100uF
15
MNT3 100nF 6.3V
4
EN2* GND
1 0.033nF 100nF 100nF 6.3V
16 AL
g
M501 M500 MNT4
17
MNT5
HEAD HEAD 18
MNT6
DIA DIA
LENGTH LENGTH 3710-002133
ACM2012-900-2P-T
B521
Left Side
n
3722-002002
SOCK-12P-2R-SMD NO_STUFF 2 3
MNT4
l
8
MNT3
7
MNT2
u
1 4 6
MNT1
5
4
a
R589 0
USB3_P0- 25-C1 R590 0
3
MDC500 USB3_P0+ 2
s i
B503 25-C1
C 3711-004318
CIC21J601NE JACK-MODEM-2P 1 C
TP15369 TP15367 1
2 RING JACK-USB-4P
t
TP15370 TP15368 2
1 TIP USB501
1
HDR-2P-SMD CIC21J601NE 3 PGB1010603NR PGB1010603NR
B502 C2 C1 4
MNT1 D504 D503
J2 1nF 1nF MNT2
2
n
3KV 3KV
3722-002246
Lib Comp Reversed
a e
P5.0V
U500
TPS2062
S fid
C513 100nF 2
IN TP1160
7
OUT1
BLUETOOTH 8
5
3
OC1*
OC2* OUT2
EN1*
6
C501 C500 C502
EC500
100uF
4
EN2* GND
1 0.033nF 100nF 100nF 6.3V
Bluetooth 2.0 Standard AL
n
P3.3V ACM2012-900-2P-T Back Side
B1 3722-002002
NO_STUFF
B 2 3 B
BLT1
MNT4
o
HDR-8P-1R 8
MNT3
7
1 3.3V 1 4 6
MNT2
25-B1
2 GND 5
MNT1
USB3_P4+ 3 USB+ 4
USB3_P4-
25-B1
4 USB- USB3_P1- R502 0
3
35-C4 R870 0 25-C1 R501 0
C
COEX2 35-C4 R871 0
5 CH_CLK / BLT_PRI USB3_P1+ 25-C1
2
COEX1 6 CH_DATA 1
NO_STUFF
7 LINK_IND
8 MODULE_DETECT JACK-USB-4P
9 USB500
MNT1
1
C349 C348 10
MNT2
100nF 100nF PGB1010603NR PGB1010603NR
D501 D500
3711-005947
2
Lib Comp Reversed
WIRELESS LAN LED

P3.3V
ON OFF ON OFF
U511
5 TS7S14F
2 + 4
A KBC3_RFOFF# 31-B2 35-C1 35-C3 - 50-B3 35-C3
WLON_LED# A
3
DRAW DATE TITLE
CHECK
ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
ELECTRONICS
GUO LEI MP MAIN
KEVIN LEE 1.1 USB,MDC & BLUETOOTH BA41-00727/8A

March 28, 2007 3:33:29 PM PAGE 34 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
D
Mini PCI-E Card (WLAN) Mini PCI-E Card (HSDPA) D
P1.5V P3.3V_AUX P3.3V
P3.3V P1.5V P3.3V_AUX
NO_STUFF
P3.3V
C315
R845 C834 C833 R921 R922 10000nF
C828 C316
10K R826 100nF 100nF 0 0 100nF 100nF
C850 P3.3V 6.3V
1% C827 100nF 10K
100nF 1%
USB Port 5 For WiBro SIM CARD
J506 J7
g
EDGE-MINIPCI-E-52P EDGE-MINIPCI-E-52P
R84632-D4
25-C2 27-C3 0
35-C2 TP151241 2 R23732-D4
25-C2 27-C3 0
35-C4 1 2
PEX3_WAKE# WAKE* P3.3V_1 PEX3_WAKE# WAKE* P3.3V_1
34-B4 3 4 25-B1 R808 0 3 4
COEX1 RSVD_1 GND_1 C825 USB3_P5- RSVD_1 GND_1
COEX2 5
RSVD_2 P1.5V_1
6
10000nF C826 C875 USB3_P5+ R809 0 5
RSVD_2 P1.5V_1
6
n
34-B4
8-C1 7 8 100nF 100nF 25-B1 7 8
MINIPCIE3_CLKREQ1# 9
CLKREQ* SIM_VCC_C1
10
6.3V MINIPCIE3_CLKREQ2# 9
CLKREQ* SIM_VCC_C1
10 35-B2
SIM3_VCC
GND_2 SIM_DATAIO_C7 NO_STUFF GND_2 SIM_DATAIO_C7 SIM3_DATA
11 12 11 12 35-B2
CLK1_MINIPCIE1# REFCLK- SIM_CLK_C3 CLK1_MINIPCIE2# REFCLK- SIM_CLK_C3 SIM3_CLK
l
8-C1 13 14 8-C1 13 14 35-B2
CLK1_MINIPCIE1 8-C1 15
REFCLK+ SIM_RESET_C2
16
CLK1_MINIPCIE2 8-C1 15
REFCLK+ SIM_RESET_C2
16 35-B2
SIM3_RST
GND_3 SIM_VPP_C6 GND_3 SIM_VPP_C6 SIM3_VPP
u
35-B2
17 18 35-B2 17 18 NO_STUFF
SIM_RSVD_C8 GND_4 SIM3_C8 SIM_RSVD_C8 GND_4
a
19 20 19 20 R801 0
21
SIM_RSVD_C4 W_DISABLE*
22 35-C1 34-A4 31-B2
KBC3_RFOFF# SIM3_C4 35-B2 21
SIM_RSVD_C4 W_DISABLE*
22 35-C3 34-A4 31-B2
CHP3_HSDPAOFF#
GND_5 PERST* PLT3_RSTF# GND_5 PERST* PLT3_RSTF#
s
23 24 23 24
i
25-C4 49-B4 35-C1 33-B4 30-D2 25-A2 20-A4 25-B4 49-B4 35-C3 33-B4 30-D2 25-A2 20-A4
C PEX1_RXN1_MIN 25-C4 25
PERN0 P3.3V_AUX
26 PEX1_RXN3_MIN 25-B4 25
PERN0 P3.3V_AUX
26 C
PEX1_RXP1_MIN 27
PERP0 GND_6
28 NO_STUFF
PEX1_RXP3_MIN 27
PERP0 GND_6
28 NO_STUFF
GND_7 P1.5V_2 GND_7 P1.5V_2
t
29 30 R817 0 29 30 R802 0
GND_8 SMB_CLK TP15050 SMB3_CLK GND_8 SMB_CLK SMB3_CLK
PEX1_TXN1_MIN 31
PETN0 SMB_DATA
32
TP15051 R818
35-C1 27-C30 25-D2 8-A3
SMB3_DATA PEX1_TXN3_MIN 31
PETN0 SMB_DATA
32 R803
35-C3 27-C3 0
25-D2 8-A3
SMB3_DATA
25-C4 33 34 35-C1 27-C3 25-D2 8-A3 25-B4 33 34 35-C3 27-C3 25-D2 8-A3
PEX1_TXP1_MIN 25-C4 35
PETP0 GND_9
36 PEX1_TXP3_MIN 25-B4 35
PETP0 GND_9
36
GND_10 USB_D- USB3_P3- P3.3V TP17365 GND_10 USB_D- USB3_P6-
m
37 38 25-B1 37 38 25-B1
n
39
RSVD_11 USB_D+
40 25-B1
USB3_P3+ TP17364 39
RSVD_11 USB_D+
40 25-B1
USB3_P6+
RSVD_12 GND_11 NO_STUFF RSVD_12 GND_11
41
RSVD_13 LED_WWAN*
42 R805 0 41
RSVD_13 LED_WWAN*
42
TP16130
43 44 R816 0 43 44
R798 0 45
RSVD_14 LED_WLAN*
46 50-B3 34-A3
WLON_LED# 45
RSVD_14 LED_WLAN*
46
TP16132
a
CL3_WLANCLK RSVD_15 LED_WPAN* RSVD_15 LED_WPAN* TP16131
e
25-C1 R797 0 47 48 47 48
CL3_WLANDATA 25-C1 R796 0 49
RSVD_16 P1.5V_3
50 49
RSVD_16 P1.5V_3
50
CL3_WLANRST# 25-D2 27-D3 51
RSVD_17 GND_12
52 51
RSVD_17 GND_12
52
RSVD_18 P3.3V_2 RSVD_18 P3.3V_2
NO_STUFF 53 R804 53
S fid
MNT1 MNT1
54 0 54
MNT2 MNT2
3709-001401 Height : 4mm 3709-001401
PCI Express Mini Card ElectroMechanical Spec. 1.0
SIM Card FFC CONN
n
J503
B CONN-12P-FPC B
Mini PCI Express Card
1 SIM3_C8
o
35-C2
30.00 mm J505 2
MINIPCI-52P-LATCH 3 35-C1
SIM3_DATA PEM
4
1
2
MNT1 5 SIM3_VPP
50.95 mm
48.05 mm
35-C1
Top 3
MNT2 6 35-C2
SIM3_C4
C
MNT3 7 M2 M1
4
5
MNT4 8 35-C1
SIM3_CLK HEAD HEAD
Pin 1 MNT5 9 DIA DIA
10 35-C1
SIM3_RST LENGTH LENGTH
3719-001350 Height : 4mm 11
Odd Pins : Top side 12 SIM3_VCC
35-C1 BA61-01090A BA61-01090A
Even Pins : Bottom Side
3708-002190
A A
DRAW DATE TITLE
CHECK
ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
ELECTRONICS
GUO LEI MP MAIN
KEVIN LEE 1.1 MINI CARD BA41-00727/8A

March 28, 2007 3:33:29 PM PAGE 35 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY P5.0V
THIS DOCUMENT CONTAINS CONFIDENTIAL TP15002
PROPRIETARY INFORMATION THAT IS TP15003
SAMSUNG ELECTRONICS CO’S PROPERTY. TP15004 U508 CB_MD_VCC
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS TP15005 FST3125 C821
EXCEPT AS AUTHORIZED BY SAMSUNG. 2 14 100nF
CB3_MD_DATA3 36-D1 37-B2 5
1A VCC
CB3_MD_DATA2 36-D1 37-B2 9
2A J507
CB3_MD_DATA1 3A R793
36-C1 37-B2 12 3 R813 49.9 1% C836 200K C837 R007-530-L5
P3.3V P3.3V CB3_MD_DATA0_MS_SDIO 4A 1B CB3_SD_DATA3
36-C1 37-B2 6 R812 49.9 1% 36-D1 2200nF 1% 10nF 41
2B CB3_SD_DATA2 XD_VCC
1
OE1* 3B
8 R810 49.9 1% 36-C1
CB3_SD_DATA1
15
SD_VCC
4 11 R811 49.9 1% 36-C1 9
D 10
OE2* 4B 36-C1
CB3_SD_DATA0_MS_SDIO MS_VCC D
C292 CB3_SD_CD_XD_CD# OE3*
C295 C814 C813 C291 C290 36-C1 37-B2 13 7 29
100nF 10nF 10nF
10000nF 10nF 10nF
OE4* GND TP14998 CB3_MD_XD_ALE 37-C2 28
XD_ALE
6.3V TP14999 CB3_MD_XD_CLE 37-B2 40
XD_CLE
TP15000 CB3_MD_DATA7_XD 37-B2 39
XD_D7
TP15001 CB3_MD_DATA6_XD 37-B2 38
XD_D6
CB3_MD_DATA5_XD 37-B2 37
XD_D5
CB3_MD_DATA4_XD 37-B2
XD_D4
Internal 1.8V VRM 36

TP1101 CB3_MD_DATA3 XD_D3
U25-1 CB3_SD_DATA3
36-D3 37-B2
TP15374
12
SD_DAT3
36-D2 R792 49.9 1% 7
C815 C294 C293 R5C843 P3.3V MS_DATA3
1000nF 100nF 10nF 1/2 CB3_MD_DATA2

35
XD_D2
W3 F5 36-D3 37-B2 11
g
R11
VCC_PCI3V_0 VCC_3V_0
G5 CB3_SD_DATA2 36-D2 R787 49.9 TP15372
1% 5
SD_DAT2
VCC_PCI3V_1 VCC_3V_1 C296 MS_DATA2
R12
VCC_PCI3V_2 VCC_3V_2
J19 C297 C308 10000nF
K19 10nF 100nF 34
R6
VCC_3V_3 P3.3V 6.3V CB3_MD_DATA1 36-D3 37-B2 20
XD_D1
VCC_RIN_0 CB3_SD_DATA1 TP15375 SD_DAT1
n
R786 E13
VCC_RIN_1
36-D2 R788 49.9 1% 3
MS_DATA1
100K L1 A4
VCC_ROUT_0 VCC_MD3V
E14 R223 33
VCC_ROUT_1 CB3_MD_DATA0_MS_SDIO XD_D0
l
10K 36-D3 37-B2 19
TP15373 CB3_SD_DATA0_MS_SDIO TP15376 SD_DAT0
R7
REGEN*
1% 36-D2 R789 49.9 1% 4
MS_DATA0
TP1104
u
F2
HWSPND*
26
PCI3_AD(31:0) TP16268 XD_RE
a
25-D4 36-B4 31 M2 F1 16
AD_31 SPKROUT CB3_SPKR SD_CLK
30 M1 8
AD_30 P3.3V P3.3V CB3_MD_CLK MS_SCLK
s
29 N5 30
i
37-B2
C AD_29 R222 XD_WE C
28 N4 100K U506 13
AD_28 SD_CMD
27 N2 G1 R220 S524A40X20-RC70 2
AD_27 UDIO_5 CB3_MS_BS_SD_CMD MS_BS
t
26 N1 R218 R219 20K 8 1 37-B2 31
25 P5
AD_26
H5 1%
VCC A0
2
CB3_MD_XD_WP# 37-B2 25
XD_WP
AD_25 UDIO_4 10K 10K A1 XD_R_B
24 P4 1% 1% 7 3 43
23 R4
AD_24
H4 TP15040 6
WC A2 CB3_SD_WP_XD_R_B# 37-B2 27
SD_WP_SW
AD_23 UDIO_3 SCL XD_CE
m
22 R2 TP15041 5 4 37-B2 6
n
21 R1
AD_22
H2
SDA GND CB3_MS_INS_XD_CD# 23
MS_INS
AD_21 UDIO_2 TP14997 XD_CD
20 T2 21
19 T1
AD_20
H1
CB3_SD_CD_XD_CD# 36-D3 37-B2 24
SD_CD_SW
18 U2
AD_19 UDIO_1 25-B2
CHP3_1394_ROMW# 3 32
XD_GND_1
a
AD_18 XD_GND_2
e
17 U1 J4 1 2 14
16 V1
AD_17 UDIO_0_SRIRQ* 31-B4 27-B3 25-C2
CHP3_SERIRQ CB_MD_VCC 17
SD_GND_1
AD_16 SD_GND_2
15 T7 D507 22
AD_15 SD_CD_COM
14 V7 BAT54C 1
AD_14 MS_GND_1
13 W7 J2 27-B3 25-C3 10
S fid
12 R8
AD_13 INTA*
K4 27-B3 25-C3
PCI3_INTE# R791 44
MS_GND_2
11 T8
AD_12 INTB*
K2 PCI3_INTF# 680K SD_WP_COM
10 V8
AD_11 INTC* 27-B3 25-C3
PCI3_INTG# 18
9 W8
AD_10 CB3_MD_XD_CE# 37-B2 42
NC1
AD_9 NC2
8 R9 INTA*(J2): PC Card I/F 45
AD_8 MNT1
7 V9 L2 46
AD_7 NC_0 INTB*(K4): 1394 OHCI MNT2
6 W9
AD_6
5 T11 INTC*(K2): SD/MS/xD
AD_5 3709-001413
4 V11
AD_4
n
3 W11
AD_3
2 T12
1 V12
AD_2
AD_1
Reverse type
B 0 W12
AD_0 B
o
V6
PCI3_PAR 25-C3
PAR
J1
GND_0 P3.3V P5.0V
25-D3 P2 J5 U509
PCI3_CBE3# 25-D3 W2
C_BE_3* GND_1
K5 R5534V-E2-FB
PCI3_CBE2# 25-D3 W6
C_BE_2* GND_2
E9 10
PCI3_CBE1# 25-D3 T9
C_BE_1* GND_3
R10 11
VCC3IN_1
9
C
PCI3_CBE0# C_BE_0* GND_4
T10
VCC3IN_2 AVPP_OUT CB_MD_VCC CB_VPPA CB_VCCA
TP1102 P1 GND_5
R215 100 V10 6
PCI3_AD(25) 25-D4 36-C4
IDSEL GND_6
W10 15
VCC5IN_1
7
25-D3 27-B3 M4
GND_7
L15
C819 C830 VCC5IN_2 AVCC_OUT1
8
PCI3_REQ0# M5
REQ* GND_8
M19
1000nF 1000nF
5
AVCC_OUT2
PCI3_GNT0# 25-D3
25-C3 27-C3 V3
GNT* GND_9 6.3V 6.3V TST
PCI3_FRAME# 25-C3 27-C3 V4
FRAME*
A9 4 12
PCI3_IRDY# 25-C3 27-B3 W4
IRDY* AGND_0
B9 3
AEN0 BVPP_OUT
PCI3_TRDY# 25-C3 27-C3 T5
TRDY* AGND_1
D9 1
AEN1
PCI3_DEVSEL# 25-C3 27-C3 V5
DEVSEL* AGND_2
D14 CB3_MD_VCCEN 37-B2 2
AVCC5_EN
13
PCI3_STOP# 25-C3 27-C3 W5
STOP* AGND_3
A15
AVCC3_EN BVCC_OUT1
14
PCI3_PERR# PERR* AGND_4 BVCC_OUT2
25-C3 27-C3 T6 B15 17 C831 C820 C835 R806
PCI3_SERR# SERR* AGND_5 CB3_VPPEN0 37-A4 18
BEN0
100nF 100nF 100nF
CB3_VPPEN1 BEN1 200K
TP1105 G2 F4 37-A4 20 16 1%
KBC3_PWRGD 11-C3 25-B2 31-C4 R221 0 L4
GBRST* TEST CB3_VCC5EN# 37-B4 19
BVCC5_EN GND
PCI3_RST# 25-C3 K1
PCIRST* CB3_VCC3EN# 37-A4
BVCC3_EN
NO_STUFF
CLK3_PCLKCB 8-C4
PCICLK
PCI3_CLKRUN#
25-C2 27-C3 31-B2 R217 0 L5
CLKRUN*
1205-002806
25-C3 G4
CHP3_PME# R224 0
RI_OUT*_PME* P3.3V
A TP1103 A
NO_STUFF TP1107
R807 100K
PCI3_CLKRUN* NEEDS GROUND-SHIELD 1% DRAW DATE TITLE
R216
10K
CHECK
ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
NO_STUFF
VPPEN0 xD Function GUO LEI MP MAIN
ELECTRONICS
Pull-Down Disable APPROVAL REV PART NO.
CARDBUS(1)
Pull-Up Enable KEVIN LEE 1.1 BA41-00727/8A
March 28, 2007 3:33:29 PM PAGE 36 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
D U25-2 D
P3.3V
38-D2 R5C843 Place these components
CB3_CAD(31:0) 2/2 close to R5C843
31 B19 E10 TP16102
CAD_31_CDATA_10 AVCC_PHY_0
30 C18 E11
CAD_30_CDATA_9 AVCC_PHY_1 C314 B29
29 D19
CAD_29_CDATA_1 AVCC_PHY_2
A17 C304 C313 C312 C311 C310 10000nF
28 D18 B17 1nF 1nF 10nF 100nF 100nF MMZ1608S121AT
CAD_28_CDATA_8 AVCC_PHY_3 6.3V
27 E19
CAD_27_CDATA_0
26 E16
CAD_26_CADR_0 NO_STUFF
25 F18 D11
CAD_25_CADR_1 CPS
24 F15
CAD_24_CADR_2
R844 0
23 G18 A14TP15179 C305 10nF 25V R843 0
CAD_23_CADR_3 FIL0
22 G15 B14TP15180 R235 10K 1%
g
CAD_22_CADR_4 REXT TP15181 C302
21 H18
CAD_21_CADR_5 VREF
D13 10nF 25V
20 H15 SRIDB-5050-900
CAD_20_CADR_6
19 J18
CAD_19_CADR_25 B528-1 J508
18 J16 D12
CAD_18_CADR_7 TPBIAS_0
IEEE1394-4P
n
17 J15
7
CAD_17_CADR_24
16 P16 A13 1
CAD_16_CADR_17 TPBN_0 TB-
15 P19 B13 2
CAD_15_IOWR*_USBD- TPBP_0 TB+
l
14 R19 3
CAD_14_CADR_9 TA-
13 P18 A12 4
8
CAD_13_IORD*_USBD+ TPAN_0 TA+
u
12 R18 B12
CAD_12_CADR_11 TPAP_0 MNT1
11 T19
5
CAD_11_OE* MNT2
a
10 T18 D10
CAD_10_CE_2* TPBIAS_1 R231 R233 R232 R230
9 U19
CAD_9_CADR_10 56 56 56 56
s
8 U18 A11 3722-001732
i
C 7 W17
CAD_8_CDATA_15 TPBN_1
B11 1% 1% 1% 1% C
6
CAD_7_CDATA_7 TPBP_1
6 V17
CAD_6_CDATA_13 B528-2
t
5 W16 A10
CAD_5_CDATA_6 TPAN_1 Y501 C303 C307 R234 C306 SRIDB-5050-900
4 V16
CAD_4_CDATA_12 TPAP_1
B10 1394 Clock 10nF 330nF 5.11K 270pF
3 W15 1 2 Place this choke coil
CAD_3_CDATA_5 25V 16V 1%
2 V15 close to 1394 Connector
CAD_2_CDATA_11
A16TP15176
C823 C822
m
1 T15 24.576MHz
n
CAD_1_CDATA_4 XI 0.01nF 0.01nF
0 R14 2801-004609
CAD_0_CDATA_3 0.5pF 0.5pF
B16TP15177
XO Place these components
38-B3 F16 R842 0
CB3_CCBE3# 38-B3 K18
CC_BE_3*_REG*
E12 Place the xtal close to R5C843 R841 0
a
CB3_CCBE2# CC_BE_2*_CADR_12 NC_8 close to R5C843
e
38-C3 P15
CB3_CCBE1# 38-C3 V19
CC_BE_1*_CADR_8 NO_STUFF
CB3_CCBE0# CC_BE_0*_CE_1*
E8
38-C3 N15
MDIO_19
D8 36-D1
CB3_MD_XD_ALE
CB3_CPAR F19
CPAR_CADR13 MDIO_18
B8 36-D1
CB3_MD_XD_CLE
S fid
CB3_CAUDIO 38-B3 T14
CAUDIO_BVD_2 MDIO_17
A8 36-D1
CB3_MD_DATA7_XD
CB3_CCD1# 38-D3 D15
CCD_1*_CD_1*_CCD_1* MDIO_16
E7 36-D1
CB3_MD_DATA6_XD
CB3_CCD2# 38-C3
38-A3 L18
CCD_2*_CD_2*_CCD_2* MDIO_15
D7 36-D1
CB3_MD_DATA5_XD
CB3_CDEVSEL# 38-B3 K16
CDEVSEL*_CADR_21 MDIO_14
B7 36-D1
CB3_MD_DATA4_XD
CB3_CFRAME# 38-C3 M15
CFRAME*_CADR_23 MDIO_13_MSCDAT_3_SDCDAT_3
A7 36-D3 36-D1
CB3_MD_DATA3
CB3_CGNT# M18
CGNT*_WE* MDIO_12_MSCDAT_2_SDCDAT_2
E6 36-D3 36-D1
CB3_MD_DATA2
CB3_CINT# 38-B3
38-C3 K15
CINT*_RDY_IREQ* MDIO_11_MSCDAT_1_SDCDAT_1
D6 36-D3 36-C1
CB3_MD_DATA1
CB3_CIRDY# CIRDY*_CADR_15 MDIO_10_MSCDAT_0_SDCDAT_0 CB3_MD_DATA0_MS_SDIO
38-C3 N18 B6 R227 33 1% 36-D3 36-C1
CB3_CPERR# G19
CPERR*_CADR_14 MDIO_9_MSCCLK_SDCCLK
A6 R226 49.9 1% 36-C1
CB3_MD_CLK
CB3_CREQ# CREQ*_INPACK* MDIO_8_MSBS_SDCCMD CB3_MS_BS_SD_CMD
n
38-B3 G16 D5 36-C1
CB3_CSERR# 38-C3
38-B3 M16
CSERR*_WAIT* MDIO_7_MSEXTCK_SDEXTCK
B5 TP14992 8-C4
CLK3_FM48
CB3_CSTOP# E18
CSTOP*_CADR_20 MDIO_6_MSLED*_SDLED*
A5 TP14993
CB3_CSTSCHG CSTSCHG_BVD_1 MDIO_5_SDPWR_1 CB3_MD_XD_WP#
B CB3_CTRDY#
38-B3 L16
CTRDY*_CADR_22_CPUSB* MDIO_4_MSPWR_SDPWR_0
B4 36-C1
CB3_MD_VCCEN B
38-C3 R16 B3 36-A2
CB3_CVS1 CVS_1_VS_1*_CVS_1 MDIO_3_SDWP* CB3_SD_WP_XD_R_B#
o
38-B3 H16 A3 36-C1
CB3_CVS2 CVS_2_VS_2*_CVS_2 MDIO_2
A2 36-B1
CB3_MD_XD_CE#
TP15178 MDIO_1_MSCD* CB3_MS_INS_XD_CD#
CB3_CCLK
38-C3 R236 49.9 L19
A_CCLK_CADR_16 MDIO_0_SDCD*
B1 36-C1
CB3_SD_CD_XD_CD#
38-B3 1% A18 36-D3 36-C1
CB3_CCLKRUN# 38-B3 H19
A_CCLKRUN*_WP_IOIS16*
CB3_CRST# A_CRST*_RESET
C1
C
NC_1
38-C3 N19 D1 R225
CB3_A19 CADR_19 NC_2
38-C3 N16 E1 0 C298
CB3_A18 38-C3 W18
CADR_18 NC_3
C2 0.033nF
CB3_D14 38-B3 C19
CDATA_14 NC_4
D2
CB3_D2 CDATA_2_PERST* NC_5
E2 NO_STUFF NO_STUFF
NC_6
36-A2 R13 E4
CB3_VCC5EN# 36-A2 T13
VCC5EN* NC_7
CB3_VCC3EN# 36-A2 V13
VCC3EN*
CB3_VPPEN0 VPPEN_0
36-A2 W13 **Note
CB3_VPPEN1 V14
VPPEN_1
USBDP CB3_MD_CLK NEEDS SHIELD WITH GROUND AND
W14
USBDM
C309 22.6 OHM NEEDS AS CLOSE AS POSSIBLE TO R5C843
10nF
CB3_CLK NEEDS SHIELD WITH GROUND AND

A 49.9 OHM NEEDS AS CLOSE AS POSSIBLE TO R5C843 A
DRAW DATE TITLE
CHECK
ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
ELECTRONICS
GUO LEI MP MAIN
KEVIN LEE 1.1 CARDBUS(2) BA41-00727/8A

March 28, 2007 3:33:29 PM PAGE 37 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
D D
C818
J5 270pF
PCMCIA-68P-A
1
GND1
35 37-D4
CB3_CAD(31:0)
GND2
2 0
CAD0
36
CCD1*
3 37-B4
CB3_CCD1# 1
CAD1
37 2
CAD2
4 3
CAD3
38 4
CAD4
5 5
g
CAD5
39 6
CAD6
6 7
CAD7
40
RSRVD1
7 37-B4
CB3_D14
CCBE0* CB3_CCBE0#
n
41 37-C4 8
CAD8
8 9
CAD9
42 10
CAD10
l
9 11
CAD11
43
CVS1 CB3_CVS1
u
10 37-B4 12
CAD12
44 13
CAD13
a
11 14
CAD14
45 15
CAD15
s
12
i
C CCBE1*
46 37-C4
CB3_CCBE1# 16 C
CAD16
13
CPAR CB3_CPAR
t
47 37-B4
RSRVD2
14 37-B4
CB3_A18 PCMCIA FRAME
CPERR*
48 37-B4
CB3_CPERR#
CBLOCK*
15 CB3_A19 J6
CGNT* CB3_CGNT# PCMCIA-68P-MNT
m
49 37-B4
n
CSTOP*
16 37-B4
CB3_CSTOP# 71
CINT*
50 37-B4
CB3_CINT# CB_VCCA MNT1
72
CDEVSEL*
17
CB3_CDEVSEL# MNT2
73
VCC1 MNT3
51 74
a
VCC2 MNT4
e
18 CB_VPPA
VPP1
52
VPP2 3709-001425
19
CCLK
53 37-B4
CB3_CCLK
CTRDY*
20 37-B4
CB3_CTRDY#
S fid
CIRDY*
54 37-B4
CB3_CIRDY#
CFRAME*
21 37-C4
CB3_CFRAME#
CCBE2*
55
CB3_CCBE2# 17
CAD17
22 18
CAD18
56 19
CAD19
23 20
CAD20
57
CVS2
24 37-B4
CB3_CVS2 21
CAD21
58
CRST* CB3_CRST#
n
25 37-B4 22
CAD22
59 37-B4
CSERR*
26
CB3_CSERR# 23
CAD23
B CREQ*
60
CB3_CREQ# B
27 37-B4 24
CAD24
o
61
CCBE3*
28 37-C4
CB3_CCBE3# 25
CAD25
62
CAUDIO
29 37-B4
CB3_CAUDIO 26
CAD26
63
CSTSCHG
30 37-B4
CB3_CSTSCHG
27
C
CAD27
64 28
CAD28
31 29
CAD29
65 30
CAD30
32
RSRVD3
66 37-B4
CB3_D2 31
CAD31
33
CCLKRUN*
67 37-B4
CB3_CCLKRUN#
CCD2*
34 37-B4
CB3_CCD2#
GND3
GND4
68 C854
270pF
3711-004646
A A
DRAW DATE TITLE
CHECK
ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
ELECTRONICS
GUO LEI MP MAIN
KEVIN LEE 1.1 CARDBUS (3) BA41-00727/8A

March 28, 2007 3:33:29 PM PAGE 38 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
P3.3V AUDIO CODEC

D C337 C320 C336 D
10000nF
100nF 100nF U515
6.3V ALC262-GR ALL 1608 SIZE
1 36
DVDD_CORE0 LINE_OUT_R_D AUD5_LINE_OUT_R
9 35 40-C4 C868 10nF
DVDD_CORE1 LINE_OUT_L_D AUD5_LINE_OUT_L
40-C4 R240 0
41 EC23 150uF 6.3V OXI R835 56 5% 41-D1
43
HP_OUT_R_A
39 EC22 150uF 6.3V OXI R834 56 5% 41-D1
HP_OUT_R C862 10nF
AUD3_GPIO0 GPIO0 HP_OUT_L_A HP_OUT_L
40-D4 44 NO_STUFF R828 0
AUD3_GPIO1 41-C1 2
GPIO1
22 TP15204 C892 1000nF 6.3V 41-C3
GPIO2 MIC1_R_B
21 TP15205 C893
MIC1
3
GPIO3 MIC1_L_B
1000nF 6.3V 41-C3
MIC2 C910 10nF
R247 0
MIC2_R_F
17 C894 1000nF 6.3V
AUD5_INTMIC
24-B4 5 16 C895 1000nF 41-B1
g
CHP3_AZ_AUD_SDO 24-C4 6
SDATA_OUT MIC2_L_F 6.3V
CHP3_AZ_AUD_BCLK BCLK
CHP3_AZ_AUD_SDI0
24-C4 R248 33 8
SDATA_IN LINE1_R_C
24
24-C4 10 23 R242 R243 R833 R832 G_AUD
CHP3_AZ_AUD_SYNC 24-C4 41-C1 11
SYNC LINE1_L_C
CHP3_AZ_AUD_RST# RESET* 2K 2K 20K 20K
TP16449 12
n
C864 1000nF 6.3V 29 1% 1% 1% 1% C879 10nF
AUD3_PCBEEP 40-A3
BEEP LINE1_VREFO
R885 0
NO_STUFF
15
LINE2_R_E
l
C665 18 14 C905 10nF
Nearby ICH8 CD_L LINE2_L_E
0.022nF 19
CD_GND G_AUD NO_STUFF R886 0
u
NO_STUFF 20 31
CD_R LINE2_VREFO
a
B527 37
MONO_OUT
BLM18PG181SN1 47
TP16450 48 SPDIF_EAPD
s
45
i
39-A2 G_AUD
C AUD5_SPDIF_OUT SPDIFO NC0
46 C
NC1
33
DCVOL
t
30
MIC2_VREFO 41-B3
AUD5_MIC_VREF
40 32 TP15206 AUD5_MIC_VREF_R
JDREF MIC1_VREFO_R
28 TP16245 AUD5_MIC_VREF_L
MIC1_VREFO_L
m n
39-B4 13 27
JCK_SENS_A 34
SENSE_A VREF
SENSE_B C333
AVSS1
26 C891 10000nF
42 100nF
a
AVSS2 6.3V
SPDIF DETECT
e
4 25
NO_STUFF DVSS_CORE0 AVDD1
R867 R836 7 38
DVSS_CORE1 AVDD2 VDD_AUD
20K 20K
MONO_MIC 1% 1% G_AUD
S fid
P5.0V_AUD 39-B3
JCK_SENS_HP
C867 C890
G_AUD G_AUD 1205-002853 G_AUD 100nF 100nF R889 D 3
10K
1% Q522
TP16452 G RHU002N06
MMBT3904
Q521 1
G_AUD S
3 2
n
39-A2 41-D1 R888 47KTP16451
1
JCK_SENS
B 39-C4 R890 39.2K 1% A(HP) 39-B1 B
JCK_SENS_A JCK_SENS_HP DEFAULTL: HIGH 2
R245 20K 1% B(MIC) 41-C3
JACK INSERT : LOW
JCK_SENS_MIC
o
R244 10K 1% C(LINE-IN)
R246 5.11K D(LINE-OUT)
1% G_AUD G_AUD
NO_STUFF
SPDIF BUFFER
C
G_AUD nearby AUDIO Jack
P5.0V
C346 100nF
NC7SZ125P5X
U28
P5.0V_AUD AVDD VDD_AUD4.75V 2 +

5
4
AUD5_SPDIF_OUT 39-C4 OE*
-
41-D1
AUD5_SPDIF
3
U27 1 R868
1M
1 5 1%
IN OUT
2 39-B2 41-D1
GND
4 TP15207
C334 JCK_SENS
C330 C331 3
EN BYPASS
C335 10000NF
1000nF 100nF 100nF 10V
C332
MIC5252-4.75BM5 1000nF
A A
DRAW DATE TITLE
G_AUD G_AUD G_AUD G_AUD

CHECK
ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
ELECTRONICS
GUO LEI MP MAIN
KEVIN LEE 1.1 AUDIO CODEC BA41-00727/8A

March 28, 2007 3:33:29 PM PAGE 39 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
D
AUDIO AMP D
VDD_AMP VDD_AMP
Pull-up: 9dB Gain
Pull-down: 10.5dB Gain TP16356 CIS10J270NC
NO_STUFF C858 C857 B525 C887 C860

AUD3_GPIO0 39-D4
10000NF 100nF 100nF 10000NF
10V 25V 25V 10V
R837 R864
U514
g
10K 1M
1% 1% MAX9715ETE+T
G_AUD 14 4 G_AUD
VDD PVDD1
9
TP15130 15 PVDD2
AUD5_LINE_OUT_R C866 100nF R827 1K 1%
INR
n
39-D2 25V 3 30mils
C889 100nF R866 1K 1% TP15129 16 OUTL-
2 30mils 40-B3
AUD5_SPK_L-
AUD5_LINE_OUT_L 39-D2 25V
INL OUTL+
10 30mils 40-B3
AUD5_SPK_L+
OUTR- AUD5_SPK_R-
l
11 30mils 40-B3
TP15131 6
OUTR+ 40-B3
AUD5_SPK_R+
TP16129 GAIN
u
8 17
TP15134 13 SHDN# GND2 These Patterns must be 30mils
BIAS
a
5 1
3 NC PGND1
D 7 12
GND1 PGND2
50V
50V
Q516
10V
1000nF 25V
s i
C G RHU002N06 C
KBC3_SPKMUTE
0.047nF
0.047nF
31-B2 1201-002486
1
330nF
t
S 2
R865 G_AUD
0
C886
C885
C863
C888
G_AUD
a m
G_AUD
e n NO_STUFF
G_AUD
NO_STUFF
GPRS
J1
HDR-4P-SMD
TP16357
INTERNAL STEREO SPEAKERS
S fid P12.0V_ALW P5.0V_AUX P5.0V_AUD P5.0V
n
B505 BLM18PG181SN1
1 TP16358 B507 BLM18PG181SN1 40-C2
AUD5_SPK_R-
2 TP16359 AUD5_SPK_R+ R825 NO_STUFF
B504 BLM18PG181SN1 40-C2 100K Q514
3 TP16360 AUD5_SPK_L- FDC653N
B 4
B506 BLM18PG181SN1 40-C2
AUD5_SPK_L+
R238 0 B
MNT1
5 40-C2 1
D1 S
4 R239 0
o
6 2
MNT2 D2 VDD_AMP
5
D3
6 3
D4 G
3711-005854 B526
C510 C511 C512 C509 CIS10J270NC
1nF 1nF 1nF 1nF TP16361
C
D 3
Q513 C861
C859 10000nF
G RHU002N06 10nF
PWRON# 48-C4
6.3V
1
S
2
VDD_AUD
R829 G_AUD
PC BEEP 20K
1%
39-C4
AUD3_PCBEEP
D 3
Q515
R830 1K G RHU002N06
CHP3_SPKR 25-B2 27-D4
C865
1 R831 4.7nF
A S
2 1K 25V A
DRAW DATE TITLE
CHECK
ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
G_AUD ELECTRONICS
GUO LEI MP MAIN
KEVIN LEE 1.1 AUDIO AMPLIFIER BA41-00727/8A

March 28, 2007 3:33:29 PM PAGE 40 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
P5.0V
P3.3V
C856 100nF
D JACK-PHONE-9P-LED R887 D
HEADPHONE+SPDIF
J509 10K
1% BLM18PG181SN1
VIN 6 B530
VCC 7 39-A1
AUD5_SPDIF
BLM18PG181SN1
GND 8
1
RCH 3 B529
LCH 2 39-D2
HP_OUT_R
B531 HP_OUT_L
GROUND 4 39-D2
SENSE 5
9 39-B2 39-A2
JCK_SENS
MNT1
10
MNT2 3 2 U512
3722-002548 C882 C883 C880 C884 Q517 1TP16091R821 TP16461 7SZ08 5
C881 C907 1K 1
g
1000nF 0.1nF 0.1nF 0.1nF + AUD3_GPIO1
100nF 1nF MMBT3904 TP16462
4 39-D4
Default 4-5-1 Open 25V 50V 50V 50V DTA114YUA
3 Q511 1 2 TP16455 R823 0 39-C4 24-C4
Stereo 4-5-1 Short 2 TP16092R822 - CHP3_AZ_AUD_RST#
Q512 1 1K 3
S/PDIF 4-5 Short MMBT3904 3
R824 R838
n
2 1M 1M
u l
G_AUD Connect to G_AUD
Connect to
Mount-hole Mount-hole
s i a
C C
t
JACK-PHONE-6P
J510 VDD_AUD
m n
5 39-B3
JCK_SENS_MIC C902 10nF
4
TP15140 BLM18PG181SN1
MIC JACK
R 3 B533 39-D2
a
TP15138 MIC1 Right Channel C853
e
6
10000nF
C852
L 2 TP15139 39-D2 100nF
B534 MIC2 Left Channel 6.3V
1 G_MIC
C909 C908 BLM18PG181SN1
0.1nF 0.1nF
C896
R863 1nF 10nF C906
S fid
3722-002545 50V 50V
0 0 R862
NO_STUFF
G_MIC G_AUD G_MIC
G_AUD
Connect to
Mount-hole
3.3K
o n Internal MIC
NO_STUFF
R884
TP16458
NO_STUFF
R882 0
VDD_AUD
B
C
39-C2
AUD5_MIC_VREF
U513-1
LMV358M
2 8
B532 - V
BLM18PG181SN1 1
2 TP16453 TP16460 3 OUT AUD5_INTMIC
1
C904 1000nF 6.3V
+ G 39-D2
4
HDR-2P-SMD
J8 VDD_AUD VDD_AUD
C903 R883 R859
0.1nF 2K 47K G_MIC
U513-2 1%
50V TP16454 R819 4.7K
R860 LMV358M
6 8
20K -
1% V
7 TP16457 C851 2.2nF
TP16456 OUT R820
5 G 1K
+
4 1%
C878 TP16459
1000nF R861
6.3V 20K C855
1%
1000nF
A G_MIC 6.3V A
DRAW DATE TITLE
G_MIC G_MIC G_MIC

CHECK
ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
ELECTRONICS
GUO LEI MP MAIN
KEVIN LEE 1.1 AUDIO JACK BA41-00727/8A

March 28, 2007 3:33:29 PM PAGE 41 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
CHARGER & POWER MANAGEMENT
D3
B340A
2 1
J500 VDC_ADPT PWR_DC VDC BATT_DC
JACK-DC-POWER-3P 3Arms @ 250KHz
D B501 Q524 Q525 3.5Arms @ 400KHz Q6 D
2
EXCML16A270u AP4435GM AP4435GM R22 AP4435GM
3 TP15074 TP17367
1 8 8 1 1 8
4 S1 D1 D1 S1 S1 D1
2 7 7 2 2 7
MNT1 R909 C936 3
S2 D2
6 6
D2 S2
3 0.01 3
S2 D2
6
MNT2 100K 1000nF S3 D3 D3 S3 1% TP1117 S3 D3
25V 4 5 5 4 4 5
1% G D4 D4 G G D4
3722-002191 B500 C504 C503 TP17368 C58 C57
100nF 10nF R503 100nF
EXCML16A270u 25V 470K 10000nF 50V
R910 1%
25V
100K
1%
TP1123
g
1
MMBD301
D7 3
Q5
FDS8958A Reverse Type
n
0505-001699 B3
HU-1M2012-121JT
TP16113
D4
5 6
TP1109
l
TP1116 J501
S2 3
L2 B4
D3
BATT-CONN-5P-REV
TP1113 10uH TP1110 R17 TP1111 HU-1M2012-121JT
TP16114
G2
4
CHG_REF TP1118 5
[2600mA_CELL] IHLP2525CZ-01
0.015 TP1119 4
D2
8
100nF 25V
3
ICHG=2.933A FOR 2P3S 1% TP1120
S1 1
D1 7
2
10000nF
10000nF
VCHG=12.94V (4.32V*3) C558 C557
s i
C 10nF 10nF
1 C
G1
2
ICP=3.17A (60.29W) (4.2235V) TP1115
3711-006058
t
fs = 400KHz R16 R11 R20 R19
B513
HU-1M2012-121JT
PreCHG = 0.3A < 3.1V/cell C54 G_CHG G_CHG
C19
C17
C18
39.2K 30K 1M 1M
1% 1% 1000nF 1% 1% NO_STUFF FOR DMB Test
50V LDO_P5.4V
m n
BAT3_VOLTA
(2.112V) TP1124 (2.66V) R525 C523
C53
100
100
100
100K 10nF
C56 U2 100nF 1% 50V
a
1000nF MAX1909ETI+T 50V
e
FOR 3CELL BATTERY TEST R12 R46 C55
R902 R13 50V
51.1K 26 25 33 1000nF
R520
R523
R524
30K 30K CSSP CSSN
LDO_P5.4V 1% 1% 1% 1% 25V
27 22 TP1114
TP16364 PDS DHIV
NO_STUFF 24
S fid
SRC G_CHG
R899 1 28 B510 MMZ1608Y601B
DCIN PDL
2 C52 31-C2
BAT3_TEMPA
10K LDO TP1121
D 3 G_CHG G_CHG 11 21 TP1126 1000nF
Q523 TP14989 VCTL DLOV B509 MMZ1608Y601B
10 23 25V TP1122
TP16363 G RHU002N06 7
ICTL DHI
20 42-A1
BAT3_SMDATA#
MODE DLO
1 3 19
ACIN PGND BATT_DC B508 MMZ1608Y601B
R900 S
2 18 TP1112
6
CSIP
17 42-A1
BAT3_SMCLK#
10K ACOK CSIN
5 16
50V
50V
50V
CHG_REF PKPRES* BATT
n
8
IINP CHG_REF (4.2235V)
0.1nF
0.1nF
0.1nF
9 15
TP1129 G_CHG CLS GND
13 4
G_CHG G_CHG TP1131 CCV REF
B R15 12
TP1132 14 CCI B
232K 29
CCS THERM
o
VDC_ADPT
C517
C518
C519
1% C16
SHORT500
1000nF
6.3V
INSTPAR
TP1128 R10
R560 10K
430K (1.658V) 1%
1%
C
TP1127 TP1130 C15 C13
(4.91V) 10nF 10nF LDO_P5.4V
25V 25V P3.3V_MICOM
R559 R14 C14
LDO_P5.4V 150K 150K 100nF
1% 1% 25V
G_CHG
DA204K-T147
DA204K-T147
2 2
R518
20K
G_CHG G_CHG G_CHG G_CHG G_CHG
R517
1% 10K 3 3
D9
G_CHG
D8
1%
ADT3_SEL 31-B2
1 D 1 1
(ACTIVE HIGH) Q501-2
SM6K2 G
TP1133
R519
30K 5
S 4 D R521 100 1%
6 KBC3_SMCLK# BAT3_SMCLK#
Q501-1 31-C2 R522 100 1% 42-B1
SM6K2 TP1108 KBC3_SMDATA# BAT3_SMDATA#
G R508 10K 31-C2
KBC3_CHGEN
31-B2 42-B1
2 5%
A G_CHG 3 S R507 A
470K
1%
DRAW DATE TITLE
CHECK
ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
G_CHG G_CHG G_CHG ELECTRONICS
GUO LEI MP MAIN
KEVIN LEE 1.1 VDC & CHARGER BA41-00727/8A

March 28, 2007 3:33:29 PM PAGE 42 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
P5V_AUX & P3.3V_AUX
VDC
D D
P5.0V_ALW
R241
5.1
5%
P3.3V_AUX VDC P5.0V_ALW
3216
R881
C911 C912 C913 C914 1%
g
49.9 TP15191
100nF 100nF 100nF 100nF
C343 C344
10000nF 100nF C325 C328 C327
25V 25V C345 C877 10000nF 100nF 10000nF
C900 C899 C876 4700nF 100nF 25V 25V
25V
n
1000nF 100nF 1000nF
6.3V 25V
6.3V 6.3V
Decoupling Caps for EMI, 2006/11/23 10V
l
P3.3V
BAT54A TP15195
u
D509 3
2 1
a
C915 C916 C917 C918 C919 R858
100nF 100nF 100nF 100nF 100nF 10K
Vton = GND U26
s
1%
i
C MAX8734AEEI+T C
5V / 3.3V : 400KHz / 500KHz C901
5 18 100nF
ILIM3 ILIM3 LDO5
t
1743-B2 20 R879 15 1% 10V
TP16121 C342 11
VCC V+ TP15192 TP15193
14 TP15196
100nF ILIM5
TP15189 TP15190 28
43-B2
ILIM5 BST5 TP15197
16
P3.3V P3.3V_AUX 8 D1 BST3 DH5 P5.0V_AUX (5.5A)
10V R857 15 1% 26
DH3 LX5
15
TP15198 D1 8
m
(4.5A) Q31 L14 27 19 L15
n
G1TP15186 LX3 DL5
FDS6680A 3.3uH 5 13 21 3.3uH
6 1
TON OUT5 G1 5
24 9
DL3 FB5 TP15194
D1 D2 D3 D4
S1 S2 S3
7 22 6 1 6
1 2 3
5 6 7 8
IHLP2525CZ-01 TP15188 OUT3 SHDN* IHLP2525CZ-01

EC25 NO_STUFF 7 4 7
a
FB3 ON5
e
330uF C341 R895 Q39 2
PGOOD ON3
3
C283 100nF G2 TP15187 R891 0 12 23
4
6.3V 200K SI4816DY Q40 R897 EC24

G
AL SKIP* GND G2
4700nF 10V 1% 4 10
PRO* REF
8 R892 SI4816DY 300K 330uF C329
6.3V 18 mohm 3 2 25 1 4 6.3V 100nF
LDO3 NC 0
2 3 AL 10V
SHORT3
S fid
18 mohm
R898 INSTPAR
300K R896
G_P3.3V P3.3V_MICOM 200K
1%
G_P3.3V NO_STUFF
G_P3.3V
C326 C324 G_P3.3V
VDC 4700nF 1000nF
P3.3V_MICOM 6.3V 25V
n
P3.3V_AUX
Q519
B G_P3.3V 3 D BSS84 B
R212 R854 TP15199 Q520
30.1K 100K RHU002N06
o
P12.0V_ALW TP15202 TP15203
3
1% 1%
2
G
3 TP15185
S
SUSPWRGD R855 R849 1
NO_STUFF TP15183 1 Q28 31-C2 R878 4.7K
1
S
G
150K 100K 2
MMBT3904 1% 1%
BZX84C12L
2 TP15184
3
C
C281
Z1
1nF
C282 R757 R851
1
50V 10000nF 100K TP15200 0

25V 1% ILIM3 KBC3_SUSPWRON THERM_STP#
43-C2 44-C2 31-C2 11-C2
TP15201 R848
R756 ILIM5
470K 43-C2 0
D 1
Q29-2
TP15182 G SM6K2 C811
VDC Decoupling Caps for EMI, 2006/11/23 R856 R850 R852 R853
5 1nF 200K 150K 300K 300K
50V
S
6 1% 1% 1% 1%
D 4
Q29-1
G SM6K2
KBC3_PWRON 31-C4 46-B1 46-B4
C924 C925 C926 C927 C928 C929 C930
247-B2 47-D4 48-B4 48-C4
100nF 100nF 100nF 100nF 100nF 100nF 100nF
S
3 25V 25V 25V 25V 25V 25V 25V
G_P3.3V G_P3.3V
A A
DRAW DATE TITLE
CHECK
ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
ELECTRONICS
GUO LEI MP MAIN
KEVIN LEE 1.1 P5V_AUX & P3.3V_LAN(AUX) BA41-00727/8A

March 28, 2007 3:33:29 PM PAGE 43 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
D D
DDR2 POWER
P1.8V_AUX VDC P5.0V_AUX P5.0V
n g l
P5.0V_AUX
C242 C243
TP16115
C241
B24
EXCML16A270u
VDC
2
R710 D14 4.7nF 100nF 10000nF
C740 R708 R709 R167 R184 U18 470K MBR0540 25V 25V
u
25V
1
1nF 20K 12.1 715K 10
1% 1% 1% 1608
SC486IMLTRT
50V
a
11 7
VTTEN PGD
3 R707 1K 1% 43-B2 31-C2
VDDQS KBC3_SUSPWRON
C739
s
2 1 2.2nF
i
50V
C 6
TON EN_PSV C
FB
8
REF
t
9 24 R688 0 G_DDR C239 100nF P1.8V_AUX (7A)
COMP BST D1 8
10 25V L12
VTTS
5 2.2uH
VCCA G1
4 23 5
VSSA DH
m
R706 21 R690 10K 1% R689 1K 1% 1 6
IHLP-2525CZ-01
n
C266 C238 C264 15
ILIM
22 7
100K 1000nF 1nF VTT_1 LX
1% 1000nF G_DDR 14
6.3V
50V VTT_2 C244 EC17 EC18
Q27 100nF 330uF 330uF
P1.8V_AUX 13 19 G2
SI4816DY 2.5V 2.5V
a
VTTIN_1 DL 10V
e
12 20 4 AL AL
VTTIN_2 VDDP P5.0V_AUX 2 3 NO_STUFF
G_DDR G_DDR G_DDR G_DDR 17 18
C270 16
PGND_2 PGND_1
25
1000nF PGND_3 THERM
S fid
25V C240
1000nF
25V
n
P0.9V P1.8V_AUX
B B
o
R186 12.1 1% C269 1nF 50V R187 0 5%
MEM1_VREF 14-D1 17-C2 18-C2
R185
10
C920 C921 C922 C923
5% 100nF 100nF 100nF 100nF
C268 C271 C272 SHORT502 INSTPAR
C
1nF 10000nF 10000nF
50V
C265 4V 4V
1000nF
6.3V
G_DDR
Decoupling Caps for EMI, 2006/11/23
G_DDR G_DDR
A A
DRAW DATE TITLE
CHECK
ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
ELECTRONICS
GUO LEI MP MAIN
KEVIN LEE 1.1 DDR2 POWER BA41-00727/8A

March 28, 2007 3:33:29 PM PAGE 44 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
EXCEPT AS AUTHORIZED BY SAMSUNG. CPU VRM [SEMTECH] VDC
B21
EXCML16A270u
TP16109 TP16110
P5.0V EC15 B22

D D11
C223
15uF EXCML16A270u
D
10000nF
BAT54A 25V
25V
AL
3
2 1
C231
1000nF
TP15230 6.3V
P3.3V
VDC 5 6 7 8 5 6 7 8
R157 C232
D1 D2 D3 D4 D1 D2 D3 D4
3.3 1000nF
25V
R158 Q19 Q18 CPU_CORE

TP15229
TP15227 TG1 HAT2198R G HAT2198R
g
2K G
1% C233
100nF 4 4 L9
25V
S1 S2 S3 S1 S2 S3 0.5uH
TP15226 DRN1 1 2 3 1 2 3
C234 5 6 7 8 5 6 7 8
IHLP5050CE-03 R164
n
1nF D1 D2 D3 D4 D1 D2 D3 D4
R919 EC10 EC19
TP15222 TP15225
50V 0.001
R178 0 4.7 330uF 330uF C222
KBC3_VRON 1W 1%
100nF
2
31-C2 Q22 Q21 2V 2V
D12
l
TP15228 BG1 AL AL
R160 G HAT2195R G HAT2195R B340A
R180 100K 1% 4 4
1
100
u
NO_STUFF 1% R159 S1 S2 S3 S1 S2 S3 C938
TP15224 7.5K 1% TP15231 C260 10nF 50V 1 2 3 1 2 3 1nF
TP15232
a
R179 0
VCCP_PWRGD 31-C2 46-A1 47-D4R161
48-C2 475 1% TP15223
CHP3_DPRSLPVR C235 P5.0V
SHORT2
s
INSTPAR
i
13-B1 25-C2
C 0.1nF C
50V TP15233
45
44
41
39
38
35
34
40
37
36
43
42
t
G_CPU
R173 R174
22.6 22.6
G_CPU TP15234
PGND
DPRSTP*
VPN1
VIN1
BST1
TG1
DRN1
BG1
V5_1
EN
NC
ISH
1% 1% R162 4.99K 1%
TP17363 1 33 TP15237
TP15208 R640 150K 1% TP15239 2 CLKIN* CS1+ TP15218
m
R641 30.1K 1% 32 R163 4.99K 1%
n
VREF CS1-
C689 0.1nF 3
HYS CS2-
31
4 30 R177 4.99K 1%
100K 1%
50V
R637 43.2K TP15241 R638 0 TP15242
TP15240R636 5
CLSET CS2+
29 TP15238
50V
VID6 ERROUT
10nF 50V
1% 5% TP15243 6 U13 28 R176 4.99K 1%
50V
a
50V
20K 1% VID5 VCCA
2K 1%
0.1nF
TP15244
e
6.3V
7 SC452IMLTRT 27
R639
100nF 25V
VID4 AGND
0.1nF
TP15245 TP15236
0.047nF
C686 0.1nF 8 26 Note : differential pairs
R635 1.5K
VID3 DAC
1000nF
TP15246 TP15235 TP15216
1%
50V
C687 1nF 9
VID2 SS
25
50V
TP15247 10 24
470pF
50V
PWRGD
VID1 DRP+
47nF
TP15248 11
C258
C257
R175
C256 1nF
23
25V
NO_STUFF
C685
DRN2
S fid
VPN2
VID0 DRP-
BST2
VDC
V5_2
VIN2
BG2
PSI*
TG2
FB+
C255
C645
G_CPU CPU1_VID(6) FB-
10-C4 B27
C254
C688
CPU1_VID(5)
50V
C684
10-C4
NO_STUFF
EXCML16A270u
1%
CPU1_VID(4)
R634 2K
TP16111 TP16112
12
13
14
15
16
17
18
19
20
21
22
10-C4
CPU1_VID(3) 10-C4
CPU1_VID(2) 10-C4 TP15212
CPU1_VID(1) C299 EC21 B28
10-C4 G_CPU G_CPU
CPU1_VID(0) 10000nF 15uF EXCML16A270u
10-C4 25V
25V AL
VRM3_CPU_PWRGD
n
25-C2 31-C2
CPU1_PSI# TP15249 R156
10-C4 R172 10 7.5K 1%
CPU1_VCCSENSE 10-A3 10-C4 TP15210 TP15220
C253
B 0.047nF B
50V
o
R171 10 TP15209
CPU1_VSSSENSE 5 6 7 8 5 6 7 8
10-A3 10-C4 D1 D2 D3 D4 D1 D2 D3 D4
R633 Q37 Q38 R205

TP15214 TG2
100 G HAT2198R G HAT2198R 0.001
1% 4 4 L13
C
TP15211 1W
P3.3V S1 S2 S3 S1 S2 S3
0.5uH 1%
TP15213 DRN2 1 2 3 1 2 3
C683 5 6 7 8 5 6 7 8 IHLP5050CE-03
1nF D1 D2 D3 D4 D1 D2 D3 D4
R920 EC14 EC9
50V
4.7 C261 330uF 330uF
2
R632 Q36 Q35 100nF 2V 2V
TP15215 BG2 D19 AL AL
2K G HAT2195R G HAT2195R B340A
1% 4 4
1
R155 C681
3.3 1000nF
S1 S2 S3 S1 S2 S3 C939
25V C682 1 2 3 1 2 3 1nF
TP15219 1nF
50V
VDC P5.0V NO_STUFF
2
D505
BAT54A
3
C230
C259
1
100nF 1000nF
A 25V 6.3V A
DRAW DATE TITLE
CHECK
ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
ELECTRONICS
GUO LEI MP MAIN
KEVIN LEE 1.1 CPU VRM BA41-00727/8A

March 28, 2007 3:33:29 PM PAGE 45 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
D D
P1.25V & P1.05V
P5.0V_AUX VDC
g
R43
10
n
C8 C47
VDC 100nF
100nF
25V
l
25V
P5.0V_AUX VDC
u a
3
C45 C44 C46 TP16274 1 2 TP16275 R9
10000nF 10000nF 100nF 0 C11 C10 C12
s i
C 25V 25V 25V
CMPSH-3A 10000nF 10000nF 100nF C
3216 25V 25V 25V
C552 C551 D2 TP16284 3216
R553
t
100nF 10nF
3.3 U3 R555 C553 C9
ISL6227CAZ-T 3.3 100nF
TP16287 12 4700nF
14 TP16288
TP16273 G_P1.05V SOFT1 VIN
m
6.3V
6
n
BOOT1
28
VCC
TP16271 5 5 6 7 8
UGATE1
P1.25V (5.5A) TP16270 4 17 TP16280 C554 4.7nF 25V G_P1.05V D1 D2 D3 D4
PHASE1 SOFT2
L1 8 D1 Q3 23 TP16276
a
BOOT2
1.5K 1%TP16285 7
e
4.7uH SI4816DY R552 Q4 P1.05V (5A)
ISEN1
5 G1 24 TP16278 G_P1.05V G FDS6680A
TP16272 2 UGATE2
IHLP-2525CZ-01 6 1 25 TP16277 4 L6
LGATE1 PHASE2
7 3 22 TP16282 R45 1.5K 1% S1 S2 S3
2.2uH
C548 PGND1 ISEN2 1 2 3
R42
S fid
4.7nF
EC3 20K 27 TP16279 5 6 7 8 IHLP-2525CZ-01
C43 1% 25V G2 10
LGATE2
26 D1 D2 D3 D4 C556
4700nF 330uF TP16269 VSEN1 PGND2 R556
2.5V C549 4 C550 9
VOUT1
10nF 5.11K
25V
6.3V AL 1nF 3 2 1nF 8 19 Q8 1% EC1
EN1 VSEN2 TP16281
(15mohm) R549 VOUT2
20 G FDS6680A 330uF C50
51.1K NO_STUFF 15 4 2.5V 100nF
1% TP16286 11 PG1 AL
21 S1 S2 S3
R554
OCSET1 EN2 (15mohm)
1 2 3 30.1K
G_P1.05V 1 16 C555 1%
R550 GND PG2_REF
n
1K R551 1nF
1% 100K 13 18 TP16283
DDR OCSET2
1%
B R558 B
G_P1.05V
R44 100K
o
G_P1.05V 1% G_P1.05V
10
48-C4 48-B4 47-D4 47-B2 46-B4 43-A4 31-C4

KBC3_PWRON
P3.3V
G_P1.05V G_P1.05V G_P1.05V
C R557
1.5K
1%
SHORT501
KBC3_PWRON 31-C4 43-A4 46-B1 47-B2 47-D4 48-B4 48-C4

INSTPAR
48-C2 47-D4 45-C4 31-C2

VCCP_PWRGD
G_P1.05V
A A
DRAW DATE TITLE
CHECK
ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
ELECTRONICS
GUO LEI MP MAIN
KEVIN LEE 1.1 P1.25V & P1.05V BA41-00727/8A

March 28, 2007 3:33:29 PM PAGE 46 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
VDC
Graphic Core Power EXT_GFX
D C122 EC6 EC7 D

VDC GFX_CORE P5.0V P5.0V 100nF
10000nF 10000nF
25V
2
U6
3
BAT54A 5 6 7 8
D1 D2 D3 D4
R583 R117
R585 0
1
VCCP_PWRGD 750K 10 U7 C123
31-C2 45-C4 46-A1 48-C2 1% 5% QF2
SC470ITSTRT R581 100nF GFX_CORE (AVE MAX : 14A)
3.3 25V
G HAT2198R
R584 150K 1% 1 14 4 L8
KBC3_PWRON 31-C4 43-A4 46-B1 46-B4 47-B2 48-B4 48-C4 2
EN_PSV BST
13
TON DH
S1 S2 S3 0.82uH
3 12 1 2 3
g
VOUT LX
C604 4
VCCA ILIM
11 R582 10K 1% 5 6 7 8 IHLP2525-CZ-0.82uH
10nF 5 10 D1 D2 D3 D4
25V C125 FB VDDP
C603 1000nF
6
PGD DL
9
NO_STUFF 1nF 6.3V 7
VSSA PGND
8 QF1 EC13 EC12
50V
n
C124 G HAT2195R 330uF 330uF C190
1000nF 4 2V 2V 100nF
G_EGFX 6.3V S1 S2 S3 AL AL 10V
l
1 2 3
C605 R118
0.047nF 30.1K SHORT1
u
1% INSTPAR
50V
EXT_GFX G72MV is only support 1.0V Core power
s i a
C P5.0V R586 R119 C
100K 30.1K
1% 1% G_EGFX
t
GFX3_VID0
R594
0 1.15V D 4
100K
1 1.0V 1% Q14-1
SM6K2
m
R593 1K 1% G
n
2
D 1 S
C635 3
Q14-2
SM6K2 22nF
R595 10K
a
G
GFX3_VID0 25V
e
20-D3 1% 5
R596 S 6
10K
1%
S fid
G_EGFX G_EGFX
G_EGFX G_EGFX
P1.5V
B
10K C116 R115

P1.5V
R578
VDC P5.0V_AUX
R116
o
R576
n U9
P5.0V_AUX
R138
475K
1%
1
3
D10
BAT54
C120
100nF
25V
VDC
TP16308
C121
10000nF
25V
B
C
0.01nF 30.1K 12.1 715K 12.1 SC486IMLTRT
1% 1% 1% 1% 1%
1608
R575 0.5pF $V
TP17360 11 7
VTTEN PGD
3 R580
48-C4 48-B4 10K
47-D4 1%
46-B4 46-B1 43-A4 31-C4
VDDQS KBC3_PWRON
2
TON EN_PSV
1 C602 100nF 10V
6
$V FB
8
REF P1.5V
9
COMP BST
24 C188 100nF
10 25V D1 8
R139 VTTS L7
12.1 5 4.7uH
VCCA G1
1% 4 23 5
$V VSSA DH
R592 C118 C119 ILIM
21 R140 7.5K 1% 1 6
IHLP-2525CZ-01
301K 1000nF 1nF
C117 15
VTT_1 LX
22 7
C187 1% 6.3V
50V
1000nF 14
VTT_2 EC11
1000nF Q13 330uF
13 19 G2
VTTIN_1 DL SI4816DY 2.5V
12 20 4 AL
VTTIN_2 VDDP P5.0V_AUX 2 3
17 18
PGND_2 PGND_1
NO_STUFF 16 25
PGND_3 THERM
A C189 A
1000nF
25V
DRAW DATE TITLE
CHECK
ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
ELECTRONICS
GUO LEI MP MAIN
KEVIN LEE 1.1 GFX_CORE & P1.5V BA41-00727/8A

March 28, 2007 3:33:29 PM PAGE 47 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
D Switched Power On (P5V) Switched Power On (P1.8V) D
P5.0V_AUX P5.0V P12.0V_ALW P1.8V_AUX P1.8V

Q33
AP4435GM
1 8 Q20
S1 D1 FDS6680A
2 7
S2 D2
D1 D2 D3 D4
S1 S2 S3
C286 3 6
5 6 7 8
1 2 3
R760 S3 D3 C287
10K 10nF 4 5 C794
G D4 4700nF C194
1%
6.3V 100nF R597 R598 4700nF
4
10V
G
TP16123 470K 470K 6.3V
R776 0 R759 10KTP15251
PWRON# 40-B2 1% PWRON12# TP15250
D 3 D 1 C636
10nF
Q32
n
10KTP15252 TP16320 25V
R761 G RHU002N06 G
KBC3_PWRON 31-C4 43-A4 46-B1 46-B4 47-B2 1% 48-B4
47-D4 Q16-2
1 5
l
4
6 SM6K2
S D S
2
C793
u
100nF G
10V
VCCP_PWRGD 31-C2 45-C4 46-A1 47-D4 Q16-1
2
3 SM6K2
a
S
NO_STUFF
s i
C C
m n t
P3.3V_AUX
Switched Power On (P2.5V)
a
S fid
NO_STUFF
e
It’s ony used for G72M
P2.5V
( MAX : 0.5A)
Switched Power On (P1.2V)
P1.25V
EXT_GFX
P1.2V
n
C284 C791 R893 0
B 4700nF 100nF
R894 0 B
6.3V 10V C792 C285 C127
o
100nF 10000nF 4700nF
10V
4V 6.3V
U24 R774
MIC5219B 150K
1 5 1%
C
TP15256 IN OUT
R758 0 3
KBC3_PWRON 31-C4 43-A4 46-B1 46-B4 47-B2 47-D4 48-C4 2
EN
4 TP15253
GND ADJ
C812 R775
100nF 150K
10V
1%
A A
DRAW DATE TITLE
CHECK
ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
ELECTRONICS
GUO LEI MP MAIN
KEVIN LEE 1.1 SWITCHED POWER BA41-00727/8A

March 28, 2007 3:33:29 PM PAGE 48 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
D D
OPTION: DMB INTERFACE

NO_STUFF
P5.0V P5.0V P3.3V
Power Switch Connector
R913
100K
P3.3V P3.3V_MICOM D16 P3.3V_MICOM
DA204K-T147
Q528 2 1
g
RHU002N06 D 3 3
NO_STUFF R764 R762 R765
2 2 47K 100K 47K
R912 10K G 1 S 1 S J3
CHP3_DMBON G G HDR-6P-1R-SMD
1 R914 R915 TP16463 TP1069 2 3
n
R916 S
2 Q526 0 Q527 0 1 B535 KBC3_CHKPWRSW#
1M SI2315BDS-T1 D 3 SI2315BDS-T1 D 3 S D 31-D2 31-B2
2 TP16464 C288
3 B536 100nF RHU002N06
l
G
4 25V 1 Q34
DMB1 TP16465
B537 31-C2
5 TP16466 KBC3_BLCKPWRSW#
u
1 11 6 B538
USB3_P2+ 2 12
CIC21J601NE
a
25-B1 31-B2
USB3_P2- 25-B1
3 13 3711-004779 MIO3_BUTTON#
4 14 B30
s i
C TP15048 5 15 HU-1M2012-121JT C
Module internal reset logic 6 16 TP15008
7 17 LID3_SWITCH#
t
P3.3V_MICOM 31-C2
TP15049 8 18
9 19 C339 C338 3
10 20 100nF 100nF 2 1
C340 10V 10V
m
3711-004203
n
100nF DA204K-T147
10V D17
SOCKET-20P-2R-SMD
NO_STUFF
a e
3711-004203 : 3.5mm
3711-004204 : 4.0mm (NEON)
S fid KEYBOARD
n
3708-001321
KBC5_KSI(0:7)
B 31-C4 7
24 B
6
23
o
5
4
22
P5.0V P3.3V 3
21
2
20
DEBUG500 1
19
18
HDR-10P-SMD 0
C
KBC5_KSO(0:15) 31-C2 31-C4 15
17
1 14
16
2 13
15
PLT3_RSTF# 20-A4 25-A2 30-D2 33-B4 35-C1 35-C3
3 12
14
CLK3_DBGLPC 8-C4
4 11
13
LPC3_LFRAME# 24-D2 31-B4 3
5 10
12
6 11
2 9
1
7 8
10
8 9
0 7
9 6
8
10
11 MNT1 FOR DEBUG 5
7
LPC3_LAD(0:3) 24-D2 31-B4 12 4
6
MNT2 3
5
2
4
3711-002050 1
3
0
2
1
CONN-24P-FPC
KBD1
A A
DRAW DATE TITLE
CHECK
ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
ELECTRONICS
GUO LEI MP MAIN
KEVIN LEE 1.1 DMB & KBD & DEBUG & POWER S/W BA41-00727/8A
March 28, 2007 3:33:29 PM PAGE 49 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
TOUCH PAD
U21
5 7SZ08
1 +
D KBC3_NUMLED# 31-C4 4 D
2 50-C3
NUMLED#
-
3 P5.0V P5.0V_TP
B26
U23
5 CIC21J601NE
1 7SZ08
KBC3_CAPSLED# +
31-C4 4
CAPSLED#
2
-
50-C3 C741
100nF
TP_FFC PAD
3
U22
5 7SZ08 TP16126
1 +
KBC3_SCLED# 31-C4 4
12
2 50-C3
SCLED# 11
g
- KBC5_TDATA 31-C4
10
3 9
KBC5_TCLK 31-C4
8
7
6
n
5
TP_SWL# 50-C1
4
3
l
2
LEDS TP_SWR# 1
u
50-C2
TPAD1
a
CONN-12P-FPC
P3.3V
Green(Yellow) 1608size 3708-002190
s i
C R872 75 TP15094 LED1 1 2 SML-310MT C
0601-001334 50-D3
NUMLED#
Green(Yellow) 1608size
t
R874 75 TP15095 LED2 1 2 SML-310MT
0601-001334 50-D3
CAPSLED# P5.0V_TP P5.0V_TP
Green(Yellow) 1608size TP_SWITCH
75 TP15096 LED3 2 SML-310MT
m
R876 1
n
0601-001334 50-D3
SCLED#
Green(Yellow) 1608size
R877 75 TP15092 LED4 1 2 SML-310MT
3
HDD3_LED# R869 D508 R258 D20
0601-001334 30-B3
a
10K 10K
MMBD4148 MMBD4148
1
P3.3V
Blue 1608size TP16124 TP16125
150TP15097 LED5 2 LTST-C193TBKT-AC
TP_SWR# TP_SWL#
R880 1 50-C2 50-C2
0601-002037 35-C3 34-A3
WLON_LED# 1 3 1 3
S fid
WIRELESS SW2 SW1
2 4 SW-TACT-4P 2 4 SW-TACT-4P
Height : 5mm Height : 5mm
P3.3V_MICOM 3404-001311 3404-001311
C897 C347
10nF 10nF
R840 150TP15098
NO_STUFF
16V NO_STUFF
16V
2 S 1 TP15093 R794 10K
G 1% 31-C2
KBC3_LED_CHARGE#
BSS84
SML-020MLT-T86
n
Q509
LED6
Amber 3 D
TP15100
O
B 3 4
3.0*2.5 TP15101
B
G
o
1 2 Green
0601-001130 3 D
Q510
P3.3V_MICOM BSS84 G
TP15102 R795 10K
S 1% 31-C2
KBC3_LED_ACIN#
2 1
R839 150TP15099
LED7
LTST-C193TBKT-AC
1 TP15103R814
0601-002037
Blue 1608size
150TP15104
R815
1M
C849
C
P3.3V_AUX
4
5
3
+
-
2
U510
7SZ14
31-C4
KBC3_LED_POWER#
2200nF
A A
DRAW DATE TITLE
CHECK
ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
ELECTRONICS
GUO LEI MP MAIN
KEVIN LEE 1.1 TOUCH PAD & LEDs BA41-00727/8A

March 28, 2007 3:33:29 PM PAGE 50 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
D DMB-NUT D
EMI2 EMI1 MT524 MT526 MT528
M3 M5 M4 RMNT-2.5-5.0-1P RMNT-2.5-5.0-1P RMNT-2.5-5.0-1P
HEAD HEAD HEAD EMI EMI
DIA DIA DIA CONTACT-PLATE-EMI CONTACT-PLATE-EMI
LENGTH LENGTH LENGTH
BA81-02753A BA81-02753A BA81-02753A
added 10-20
g
NUT for RHE, Locate on TOP of PCB EMI504
EMI
M502 M503 M504 CONTACT-PLATE-EMI
TOP SODIMM Clip (06-11-1)
HEAD HEAD HEAD MT532 MT533 MT534 MT531
n
DIA DIA DIA RMNT-35-60-1P RMNT-35-60-1P RMNT-35-60-1P RMNT-35-60-1P
LENGTH LENGTH LENGTH
l
BA61-01090A BA61-01090A BA61-01090A
MT536
RMNT-40-60-1P
MT537
RMNT-40-60-1P
MT523
RMNT-25-50-1P
s u t i a
EMI3
EMI
CONTACT-PLATE-EMI
EMI4
EMI
CONTACT-PLATE-EMI
C
m
Place on top, Height 4.1mm For DMB (07-1-18)
n
added 12-28, CPU & GMCH MNT
MT15
RMNT-2.5-7.0-1P
MT16
RMNT-2.5-7.0-1P
MT18
RMNT-2.5-7.0-1P
MT19
a
S fid
RMNT-2.5-7.0-1P
e MT538
RMNT-2.5-7.0-1P
n
For EMI, 2006-11-1
B 1 ~ 499 SIDE B
o
TP407 TP409 TP410 TP411 TP412 TP460
PCB REVISION CONTROL ( ICT )
C321
C317 C323 C319 C318 C322 NO CONNECTION DATE(YY/MM/DD) REVISION STEP
C
0.1nF
0.01nF 470pF 270pF 0.047nF 0.0033nF
0.5pF
1 N.C.
REV1
1 2 1-2
TP408
3 2-3
2 3
4 3-1
5 1-2-3
500 ~ SIDE
6 N.C.
TP413 TP415 TP416 TP417 TP418 TP461 TP462 TP16088 TP16089 TP16090 7 1-2
8 2-3
C845 9 3-1
0.01nF C846 C848 C847 C873 C872 C871 C824 C898 C874
0.027nF 0.047nF 0.02nF 0.033nF 0.0033nF 0.1nF 470pF 270pF 0.33nF
0.5pF 10 1-2-3
A TP414 A
DRAW DATE TITLE
CHECK
ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
ELECTRONICS
GUO LEI MP MAIN
KEVIN LEE 1.1 MOUNT HOLE BA41-00727/8A

March 28, 2007 3:33:29 PM PAGE 51 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
D TP17080 ADT3_SEL TP17032 CB3_MD_DATA4_XD TP16776 CTRL18_25 TP16485 KBC5_KSO(11) TP17143 PCI3_AD(24) TP17229 G_MIC TP17377 GROUND D
TP17081 AUD3_GPIO0 TP17033 CB3_MD_DATA5_XD TP16777 CTRL_12 TP16486 KBC5_KSO(12) TP17144 PCI3_AD(25) TP17231 G_P1.05V TP17378 GROUND
TP17082 AUD3_GPIO1 TP17034 CB3_MD_DATA6_XD TP16599 GMCH3_BMBUSY# TP16487 KBC5_KSO(13) TP17145 PCI3_AD(26) TP17233 G_P3.3V TP17379 GROUND
TP17083 AUD3_PCBEEP TP17035 CB3_MD_DATA7_XD TP16536 GMCH3_EXTTS0# TP16488 KBC5_KSO(14) TP17146 PCI3_AD(27) TP17235 LCD_VDD3V TP17380 GROUND
TP17084 AUD5_INTMIC TP17036 CB3_MD_VCCEN TP16537 GMCH3_EXTTS1# TP16489 KBC5_KSO(15) TP17147 PCI3_AD(28) TP17236 LDO_P5.4V
TP17085 AUD5_LINE_OUT_L TP17037 CB3_MD_XD_ALE TP16538 GMCH3_ICHSYNC# TP16490 KBC5_KSO(2) TP17148 PCI3_AD(29) TP17237 P1.05V
TP17086 AUD5_LINE_OUT_R TP17038 CB3_MD_XD_CE# TP16539 HDD3_LED# TP16491 KBC5_KSO(3) TP17149 PCI3_AD(3) TP17238 P1.05V
TP17087 AUD5_MIC_VREF TP17039 CB3_MD_XD_CLE TP16540 HP_OUT_L TP16492 KBC5_KSO(4) TP17150 PCI3_AD(30) TP17239 P1.05V
TP17088 AUD5_SPDIF TP17040 CB3_MD_XD_WP# TP16541 HP_OUT_R TP16493 KBC5_KSO(5) TP17151 PCI3_AD(31) TP17240 P1.05V
TP17089 AUD5_SPDIF_OUT TP17041 CB3_MS_BS_SD_CMD TP16542 IDE_A0 TP16494 KBC5_KSO(6) TP17152 PCI3_AD(4) TP17241 P1.25V
TP17090 AUD5_SPK_L+ TP17042 CB3_MS_INS_XD_CD# TP16543 IDE_A1 TP16495 KBC5_KSO(7) TP17153 PCI3_AD(5) TP17242 P1.25V
TP17091 AUD5_SPK_L- TP17043 CB3_SD_CD_XD_CD# TP16544 IDE_A2 TP16496 KBC5_KSO(8) TP17154 PCI3_AD(6) TP17243 P1.25V
TP17092 AUD5_SPK_R+ TP17044 CB3_SD_DATA0_MS_SDIO TP16545 IDE_CS1# TP16497 KBC5_KSO(9) TP17155 PCI3_AD(7) TP17244 P1.25V
TP17093 AUD5_SPK_R- TP17045 CB3_SD_DATA1 TP16546 IDE_CS3# TP17353 KBC5_TCLK TP17156 PCI3_AD(8) TP17245 P1.2V
g
TP17094 BAT3_SMCLK# TP17046 CB3_SD_DATA2 TP16547 IDE_D(0) TP17356 KBC5_TDATA TP17157 PCI3_AD(9) TP17246 P1.2V
TP17047 CB3_SD_DATA3 TP16548 IDE_D(1) TP16498 LAN3_ACTLED# TP17158 PCI3_CBE0# TP17247 P1.2V
TP17096 BAT3_TEMPA TP16984 CB3_SD_WP_XD_R_B# TP16549 IDE_D(10) TP16499 LAN3_CLKREQ# TP17159 PCI3_CBE1# TP17248 P1.2V
TP17097 BAT3_VOLTA TP16985 CB3_VCC3EN# TP16550 IDE_D(11) TP16500 LAN3_LINK1000# TP17160 PCI3_CBE2# TP17249 P1.2V_LAN
TP17098 CAPSLED# TP16986 CB3_VCC5EN# TP16551 IDE_D(12) TP16501 LAN3_LINK10_100# TP17161 PCI3_CBE3# TP17250 P1.2V_LAN
n
TP17099 CB3_A18 TP16987 CB3_VPPEN0 TP16552 IDE_D(13) TP17112 LAN3_VPDCLK TP17162 PCI3_CLKRUN# TP17251 P1.2V_LAN
TP17100 CB3_A19 TP16988 CB3_VPPEN1 TP16553 IDE_D(14) TP17113 LAN3_VPDDATA TP17163 PCI3_DEVSEL# TP17252 P1.2V_LAN
TP17101 CB3_CAD(0) TP16989 CHP3_1394_ROMW# TP16554 IDE_D(15) TP17114 LCD3_BKLTCTRL TP17164 PCI3_FRAME# TP17253 P1.5V
l
TP17102 CB3_CAD(1) TP16990 CHP3_AZ_AUD_BCLK TP16555 IDE_D(2) TP17165 PCI3_GNT0# TP17254 P1.5V
TP17103 CB3_CAD(10) TP16991 CHP3_AZ_AUD_RST# TP16556 IDE_D(3) TP17116 LCD3_BKLTON TP17166 PCI3_INTA# TP17255 P1.5V
u
TP17104 CB3_CAD(11) TP16992 CHP3_AZ_AUD_SDI0 TP16557 IDE_D(4) TP17167 PCI3_INTB# TP17256 P1.5V
TP17105 CB3_CAD(12) TP16993 CHP3_AZ_AUD_SDO TP16558 IDE_D(5) TP17118 LCD3_EDID_DATA TP17168 PCI3_INTC# TP17257 P1.8V
a
TP17106 CB3_CAD(13) TP16994 CHP3_AZ_AUD_SYNC TP16559 IDE_D(6) TP17169 PCI3_INTD# TP17258 P1.8V
TP17107 CB3_CAD(14) TP16995 CHP3_AZ_MDC_BCLK TP16560 IDE_D(7) TP17120 LPC3_LAD(0) TP17170 PCI3_INTE# TP17259 P1.8V
s i
C TP17108 CB3_CAD(15) TP16996 CHP3_AZ_MDC_RST# TP16561 IDE_D(8) TP17121 LPC3_LAD(1) TP17171 PCI3_INTF# TP17260 P1.8V C
TP17109 CB3_CAD(16) TP16997 CHP3_AZ_MDC_SDI1 TP16562 IDE_D(9) TP17122 LPC3_LAD(2) TP17172 PCI3_INTG# TP17261 P1.8V_AUX
TP17110 CB3_CAD(17) TP16998 CHP3_AZ_MDC_SDO TP16563 IDE_DACK# TP17123 LPC3_LAD(3) TP17173 PCI3_INTH# TP17262 P1.8V_AUX
t
TP17111 CB3_CAD(18) TP16999 CHP3_AZ_MDC_SYNC TP16564 IDE_DREQ TP17124 LPC3_LFRAME# TP17174 PCI3_IRDY# TP17263 P1.8V_AUX
TP17048 CB3_CAD(19) TP17000 CHP3_CPUSTP# TP16565 IDE_IOR# TP17125 MEM1_VREF TP17175 PCI3_PAR TP17264 P1.8V_AUX
TP17049 CB3_CAD(2) TP17001 CHP3_DPRSLPVR TP16566 IDE_IORDY TP17126 MIC1 TP17176 PCI3_PERR# TP17265 P1.8V_P2.5V_LAN
TP17050 CB3_CAD(20) TP17002 CHP3_GFXSEL TP16567 IDE_IOW# TP17127 MIC2 TP17177 PCI3_PLOCK# TP17266 P1.8V_P2.5V_LAN
m n
TP17051 CB3_CAD(21) TP17003 CHP3_IDEIRQ TP16504 IDE_IRQ TP17128 MINIPCIE3_CLKREQ1# TP17178 PCI3_REQ0# TP17267 P1.8V_P2.5V_LAN
TP17052 CB3_CAD(22) TP17004 CHP3_LANSEL TP16505 ILIM3 TP17357 MIO3_BUTTON# TP17179 PCI3_RST# TP17268 P1.8V_P2.5V_LAN
TP17053 CB3_CAD(23) TP17005 CHP3_PCISTP# TP16506 ILIM5 TP17311 NAND3_ALE TP17180 PCI3_SERR# TP17269 P12.0V_ALW
TP17054 CB3_CAD(24) TP17006 CHP3_PME# TP16507 JCK_SENS TP17312 NAND3_CE0# TP17181 PCI3_STOP# TP17270 P12.0V_ALW
a
TP17055 CB3_CAD(25) TP17007 CHP3_ROBSONSEL TP16508 JCK_SENS_HP TP17313 NAND3_CE1# TP17182 PCI3_TRDY# TP17271 P12.0V_ALW
e
TP17056 CB3_CAD(26) TP17008 CHP3_RTCRST# TP16509 JCK_SENS_MIC TP17314 NAND3_CLE TP17340 PEX3_WAKE# TP17272 P12.0V_ALW
TP17057 CB3_CAD(27) TP17009 CHP3_S4STATE# TP16510 KBC3_A20G TP17315 NAND3_DISKBUSY TP17341 PLT3_RST# TP17273 P2.5V
TP17058 CB3_CAD(28) TP17010 CHP3_SATACLKREQ# TP16511 KBC3_BKLTON TP17316 NAND3_IO(0) TP17342 PLT3_RSTF# TP17274 P2.5V
TP17059 CB3_CAD(29) TP17011 CHP3_SERIRQ TP16512 KBC3_BLCKPWRSW# TP17317 NAND3_IO(1) TP17343 PWRON# TP17275 P2.5V
S fid
TP17060 CB3_CAD(3) TP17012 CHP3_SLPS3# TP16513 KBC3_CAPSLED# TP17318 NAND3_IO(10) TP17344 SCLED# TP17276 P2.5V
TP17061 CB3_CAD(30) TP17013 CHP3_SLPS5# TP16514 KBC3_CHGEN TP17319 NAND3_IO(11) TP17345 SMB3_ALERT# TP17354 P3.3V
TP17062 CB3_CAD(31) TP17014 CHP3_SMLINK0 TP16515 KBC3_CHKPWRSW# TP17320 NAND3_IO(12) TP17346 SMB3_CLK TP17358 P3.3V
TP17063 CB3_CAD(4) TP17015 CHP3_SMLINK1 TP16516 KBC3_CPURST# TP17321 NAND3_IO(13) TP17347 SMB3_DATA TP17359 P3.3V
TP17064 CB3_CAD(5) TP16952 CHP3_SPKR TP16517 KBC3_EXTSMI# TP17322 NAND3_IO(14) TP17348 THERM_ALERT# TP17355 P3.3V
TP17065 CB3_CAD(6) TP16953 CHP3_SUSSTAT# TP16518 KBC3_LANRST# TP17323 NAND3_IO(15) TP17349 THERM_STP# TP17277 P3.3V_AUX
TP17066 CB3_CAD(7) TP16954 CL3_CLK TP16519 KBC3_LED_ACIN# TP17324 NAND3_IO(2) TP17183 VCCP_PWRGD TP17278 P3.3V_AUX
TP17067 CB3_CAD(8) TP16955 CL3_DATA TP16520 KBC3_LED_CHARGE# TP17325 NAND3_IO(3) TP17184 VGA3_BLUE TP17279 P3.3V_AUX
TP17068 CB3_CAD(9) TP16956 CL3_RST# TP16521 KBC3_LED_POWER# TP17326 NAND3_IO(4) TP17185 VGA3_DDCCLK TP17280 P3.3V_AUX
TP17069 CB3_CAUDIO TP16957 CL3_WLANCLK TP16522 KBC3_NUMLED# TP17327 NAND3_IO(5) TP17186 VGA3_DDCDATA TP17281 P3.3V_MICOM
n
TP17070 CB3_CCBE0# TP16958 CL3_WLANDATA TP16523 KBC3_PWRBTN# TP17328 NAND3_IO(6) TP17187 VGA3_GREEN TP17282 P3.3V_MICOM
TP17071 CB3_CCBE1# TP16959 CL3_WLANRST# TP16524 KBC3_PWRGD TP17329 NAND3_IO(7) TP17188 VGA3_HSYNC TP17283 P3.3V_MICOM
TP17072 CB3_CCBE2# TP16928 CLK3_DBGLPC TP16525 KBC3_PWRGDMCH TP17330 NAND3_IO(8) TP17189 VGA3_RED TP17284 P3.3V_MICOM
B TP17073 CB3_CCBE3# TP16929 CLK3_FM48 TP16526 KBC3_PWRON TP17331 NAND3_IO(9) TP17190 VGA3_VSYNC TP17285 P5.0V B
TP17074 CB3_CCD1# TP16930 CLK3_ICH14 TP16527 KBC3_RSMRST# TP17332 NAND3_RB TP17191 VGA5_DDCCLK TP17286 P5.0V
o
TP17075 CB3_CCD2# TP16931 CLK3_PCLKCB TP16528 KBC3_RST# TP17333 NAND3_RE0# TP17192 VGA5_DDCDATA TP17287 P5.0V
TP17076 CB3_CCLK TP16932 CLK3_PCLKICH TP16529 KBC3_RUNSCI# TP17334 NAND3_WE0# TP17193 VRM3_CPU_PWRGD TP17288 P5.0V
TP17077 CB3_CCLKRUN# TP16933 CLK3_PCLKMICOM TP16530 KBC3_SCLED# TP17335 NAND3_WP# TP17194 WLON_LED# TP17289 P5.0V_ALW
TP17078 CB3_CDEVSEL# TP16934 CLK3_PWRGD TP16531 KBC3_SMCLK# TP17336 NUMLED# TP17195 CB_MD_VCC TP17290 P5.0V_ALW
TP17079 CB3_CFRAME# TP16935 CLK3_SMBCLK TP16532 KBC3_SMDATA# TP17337 PCI3_AD(0) TP17199 CB_VCCA TP17291 P5.0V_AUD
C
TP17016 CB3_CGNT# TP16936 CLK3_SMBDATA TP16533 KBC3_SUSPWRON TP17338 PCI3_AD(1) TP17203 CB_VPPA TP17292 P5.0V_AUX
TP17017 CB3_CINT# TP16937 CLK3_USB48 TP16534 KBC3_THERM_SMCLK TP17339 PCI3_AD(10) TP17207 CHG_REF TP17293 P5.0V_AUX
TP17018 CB3_CIRDY# TP16938 CL_VREF0_ICH TP16535 KBC3_THERM_SMDATA TP17129 PCI3_AD(11) TP17211 CPU_CORE TP17294 P5.0V_AUX
TP17019 CB3_CPAR TP16939 CL_VREF1_ICH TP16472 KBC3_VRON TP17130 PCI3_AD(12) TP17212 CPU_CORE TP17295 P5.0V_AUX
TP17020 CB3_CPERR# TP16940 COEX1 TP16473 KBC3_WAKESCI# TP17131 PCI3_AD(13) TP17213 CPU_CORE TP17296 PRTC_BAT
TP17021 CB3_CREQ# TP16941 COEX2 TP16474 KBC5_KSI(0) TP17132 PCI3_AD(14) TP17214 CPU_CORE TP17300 PWR_DC
TP17022 CB3_CRST# TP16918 CPU1_BSEL0 TP16475 KBC5_KSI(1) TP17133 PCI3_AD(15) TP17215 GFX_CORE TP17301 PWR_DC
TP17023 CB3_CSERR# TP16919 CPU1_BSEL1 TP16476 KBC5_KSI(2) TP17134 PCI3_AD(16) TP17216 GFX_CORE TP17302 PWR_DC
TP17024 CB3_CSTOP# TP16856 CPU1_BSEL2 TP16477 KBC5_KSI(3) TP17135 PCI3_AD(17) TP17217 GFX_CORE TP17303 PWR_DC
TP17025 CB3_CSTSCHG TP16768 CPU1_STPCLK# TP16478 KBC5_KSI(4) TP17136 PCI3_AD(18) TP17218 GFX_CORE TP17304 VDC_INV
TP17026 CB3_CTRDY# TP16769 CPU1_THRMTRIP# TP16479 KBC5_KSI(5) TP17137 PCI3_AD(19) TP17219 G_AUD TP17305 VDC_INV
TP17027 CB3_CVS1 TP16771 CPU1_VCCSENSE TP16480 KBC5_KSI(6) TP17138 PCI3_AD(2) TP17220 G_AUD TP17306 VDC_INV
TP17028 CB3_CVS2 TP16772 CPU1_VSSSENSE TP16481 KBC5_KSI(7) TP17139 PCI3_AD(20) TP17221 G_CHG TP17307 VDC_INV
TP17029 CB3_D14 TP16773 CPU2_THERMDA TP16482 KBC5_KSO(0) TP17140 PCI3_AD(21) TP17223 G_CPU TP17308 VDD_AMP
TP17030 CB3_D2 TP16774 CPU2_THERMDC TP16483 KBC5_KSO(1) TP17141 PCI3_AD(22) TP17225 G_DDR TP17309 VDD_AUD
TP17031 CB3_MD_CLK TP16775 CPU3_THRMTRIP# TP16484 KBC5_KSO(10) TP17142 PCI3_AD(23) TP17227 G_EGFX TP17376 GROUND
A A
DRAW DATE TITLE
CHECK
ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
ELECTRONICS
GUO LEI MP MAIN
KEVIN LEE 1.1 TEST POINT BA41-00727/8A

March 28, 2007 3:33:29 PM PAGE 52 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
D D
TORINO2 ON TOP BOARD T2_SUB

BEIJING ON TOP BOARD BJ_SUB
POWER S/W POWER S/W

SW3 SW5
SKQGAB SKQGAB
P3.3V_SUB_T2 TP16467 1 3 P3.3V_SUB_BJ TP17381 1 3
g
2 4 2 4
n
J512 MIO S/W J513 MIO S/W
HDR-6P-1R-SMD HDR-6P-1R-SMD
l
1 SW4 1 SW6
TP17382
2 SKQGAB 2 SKQGAB
TP16468 TP17383
u
1 3 1 3
3 $V
TP17352 3
4 4
a
2 4 2 4
5 $V,$P
TP17351 5 TP17384
6 6
s i
C C
3711-004779 3711-004779
t
POWER LED POWER LED
P3.3V_SUB_T2 P3.3V_SUB_BJ
m n
U518 U520
5 7SZ08 5 7SZ08
1 1
a
+ +
4 TP16469R906 150TP16470 1 4 TP17385R924 150TP17386 1
e
2 2
2 2
- -
3 LED8 3 LED9
LTST-C193TBKT-AC LTST-C193TBKT-AC
P3.3V_SUB_T2
LID S/W
S fid
P3.3V_SUB_T2 P3.3V_SUB_BJ
LID S/W
P3.3V_SUB_BJ
MT539
RMNT-2.0-1P
TP16471
R905
C935
100nF
16V
2
U517
20K A3212ELH/HED55XXU12
OUTPUT
SUPPLY
GND
1
o n C934
100nF
16V
MT541
RMNT-2.0-1P
MT540
RMNT-2.0-1P
TP17387
R923
C941
100nF
16V
2
U519
20K A3212ELH/HED55XXU12
SUPPLY
OUTPUT
GND
1
3
C940
100nF
16V
B
C Drill size: 2.2mm
PAD size: TOP 6.0mm

Bottom 5.0mm
A A
DRAW DATE TITLE
CHECK
ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
ELECTRONICS
GUO LEI MP MAIN
KEVIN LEE 1.1 ON TOP BOARD BA41-00727/8A

March 28, 2007 3:33:29 PM PAGE 53 OF 54

4 3 2 1
4 3 2 1
SAMSUNG PROPRIETARY
REVISION HISTORY
D D
REVISION DATE NO.# CONTENTS
n g l
C
s u t i a
C
a m e n
S fid
B
o n B
NOTES
Note1.
Note2.
Schematic Revision: MP 1 . 0 . 0
Development Stage
PCB Version
Schematic Version
PCB SEC Code

Vendor: SGCE
Vendor: TPT
P/N: BA41-??????
P/N: BA41-??????
C
A A
DRAW DATE TITLE
CHECK
ZHOU JUN
DEV. STEP
4/10/2007
TORINO 2 SAMSUNG
ELECTRONICS
GUO LEI MP MAIN
KEVIN LEE 1.1 REVISION HISTORY BA41-00727/8A

March 28, 2007 3:33:29 PM PAGE 54 OF 54

4 3 2 1

Schematic Diagram NP Q70

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4 3 2 1

Page. 24~27 ICH8-M

March 28, 2007 3:33:29 PM PAGE 1 OF 54

Marvell PCI-E Lane2

PCI-E Lane1 Page 30 Page 30

PORT 7 TOUCHPAD DRAW DATE TITLE

PORT 0 PORT 1 PORT 2 PORT 4 ZHOU JUN 4/10/2007

Page 35 Page 35 Page 48 Page 35 APPROVAL REV

KEVIN LEE 1.1 BA41-00727/8A

March 28, 2007 3:33:29 PM PAGE 2 OF 54

MICOM FAN VCCP P5.0V HDD / ODD

SWITCHED POWER 1.8V DDRIO P5.0V FAN

965GM P5.0V CRT

GDDR3 3.3V VDD3_3

3.3V DAC VDD P5.0V AUDIO

S4 ON OFF OFF H L L DRAW DATE TITLE

S5 ON OFF OFF L L L CHECK

March 28, 2007 3:33:29 PM PAGE 3 OF 54

SC486 12) P0.9V SC452 RSTIN#

March 28, 2007 3:33:29 PM PAGE 4 OF 54

CLK3_PWRGD >= 3ms

PCI3_RST* >= 1ms

SPI Signals soft strap read BIOS Boot SPI Signals

BSEL[2:0] Valid Toggling (Valid) BSEL[2:0]

CLK0_HOST_CPU Toggling (Valid) CLK0_HOST_CPU

March 28, 2007 3:33:29 PM PAGE 5 OF 54

33 MHz CLK3_PCLKICH RTC Clock

KEVIN LEE 1.1 BA41-00727/8A

March 28, 2007 3:33:29 PM PAGE 6 OF 54

D SCHEMATIC ANNOTATIONS AND BOARD INFORMATION D

PCI Devices Crystal / Oscillator

System Power States

March 28, 2007 3:33:29 PM PAGE 7 OF 54

R711 CLK REQ Mapping Device

1 1 0 166 MHz Q507 C932

KEVIN LEE 1.1 CLOCK GENERATOR BA41-00727/8A

March 28, 2007 3:33:29 PM PAGE 8 OF 54

CPU SOCKET : MEROM

A7* BR0* CPU1_BREQ# D5* D37*

13 L2 D20 11 J23 W24 43

27 W2 D5 24-C2 25 P23 AC25 57

KEVIN LEE 1.1 MEROM(1) BA41-00727/8A

March 28, 2007 3:33:29 PM PAGE 9 OF 54

CPU500-3 CPU_CORE CPU_CORE

TP15062 TEST1 RSVD_5 VSS_36 VCC_32 VCC_82 VSS_85

20mils R149 100 1%

March 28, 2007 3:33:29 PM PAGE 10 OF 54

KEVIN LEE 1.1 THERMAL MONITOR BA41-00727/8A

March 28, 2007 3:33:29 PM PAGE 11 OF 54

Host Address Bus

Host Data Bus

EC8 16V 470nF C28

KEVIN LEE 1.1 965GM(1) BA41-00727/8A

March 28, 2007 3:33:29 PM PAGE 12 OF 54

EXCEPT AS AUTHORIZED BY SAMSUNG.

Int. Gfx. Core Voltage

RSVD_13 VCC_AXG_NCTF_32 VCC_AXG_8 PEG_RXN_15

J12 AF16 AD20 Y48 9

AL36 AJ19 AH21