Stp7Nc80Z - Stp7Nc80Zfp STB7NC80Z - STB7NC80Z-1
Stp7Nc80Z - Stp7Nc80Zfp STB7NC80Z - STB7NC80Z-1
com
STP7NC80Z - STP7NC80ZFP
STB7NC80Z - STB7NC80Z-1
N-CHANNEL 800V - 1.3Ω - 6.5A TO-220/FP/D2PAK/I2PAK
Zener-Protected PowerMESH™III MOSFET
I2PAK
(Tabless TO-220)
DESCRIPTION
The third generation of MESH OVERLAY™ Power
MOSFETs for very high voltage exhibits unsur-
passed on-resistance per unit area while integrating INTERNAL SCHEMATIC DIAGRAM
back-to-back Zener diodes between gate and
source. Such arrangement gives extra ESD capabil-
ity with higher ruggedness performance as request-
ed by a large variety of single-switch applications.
APPLICATIONS
■ SINGLE-ENDED SMPS IN MONITORS,
COMPUTER AND INDUSTRIAL APPLICATION
■ WELDING EQUIPMENT
ORDERING INFORMATION
SALES TYPE MARKING PACKAGE PACKAGING
STP7NC80Z P7NC80Z TO-220 TUBE
STP7NC80ZFP P7NC80ZFP TO-220FP TUBE
THERMAL DATA
TO-220 / D2PAK /
TO-220FP
I2PAK
Rthj-case Thermal Resistance Junction-case Max 0.93 3.13 °C/W
Rthj-amb Thermal Resistance Junction-ambient Max 30 °C/W
Tl Maximum Lead Temperature For Soldering Purpose 300 °C
AVALANCHE CHARACTERISTICS
Symbol Parameter Max Value Unit
IAR Avalanche Current, Repetitive or Not-Repetitive 6.5 A
(pulse width limited by Tj max)
EAS Single Pulse Avalanche Energy 290 mJ
(starting Tj = 25 °C, ID = IAR, VDD = 50 V)
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STP7NC80Z - STP7NC80ZFP - STB7NC80Z - STB7NC80Z-1
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
gfs (1) Forward Transconductance VDS > ID(on) x RDS(on)max, 6 S
ID = 3.3 A
Ciss Input Capacitance VDS = 25V, f = 1 MHz, VGS = 0 2350 pF
Coss Output Capacitance 164 pF
Crss Reverse Transfer 17 pF
Capacitance
SWITCHING ON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
td(on) Turn-on Delay Time VDD = 400 V, ID = 3 A 33 ns
tr Rise Time RG = 4.7Ω VGS = 10 V 12 ns
( see test circuit, Figure 3)
Qg Total Gate Charge VDD = 640 V, ID = 6 A, 43 58 nC
Qgs Gate-Source Charge VGS = 10V 12 nC
Qgd Gate-Drain Charge 15 nC
SWITCHING OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
tr(Voff) Off-voltage Rise Time VDD = 640 V, ID =6 A, 13 ns
tf Fall Time RG = 4.7Ω, VGS = 10V 13 ns
tc Cross-over Time (see test circuit, Figure 5) 20 ns
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STP7NC80Z - STP7NC80ZFP - STB7NC80Z - STB7NC80Z-1
Fig. 1: Unclamped Inductive Load Test Circuit Fig. 2: Unclamped Inductive Waveform
Fig. 3: Switching Times Test Circuit For Fig. 4: Gate Charge test Circuit
Resistive Load
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STP7NC80Z - STP7NC80ZFP - STB7NC80Z - STB7NC80Z-1
mm inch
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 4.40 4.60 0.173 0.181
C 1.23 1.32 0.048 0.051
D 2.40 2.72 0.094 0.107
D1 1.27 0.050
E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034
F1 1.14 1.70 0.044 0.067
F2 1.14 1.70 0.044 0.067
G 4.95 5.15 0.194 0.203
G1 2.4 2.7 0.094 0.106
H2 10.0 10.40 0.393 0.409
L2 16.4 0.645
L4 13.0 14.0 0.511 0.551
L5 2.65 2.95 0.104 0.116
L6 15.25 15.75 0.600 0.620
L7 6.2 6.6 0.244 0.260
L9 3.5 3.93 0.137 0.154
DIA. 3.75 3.85 0.147 0.151
E
A
D
C
D1
L2
F1
G1
H2
G
Dia.
F
F2
L5
L9
L7
L6 L4
P011C
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STP7NC80Z - STP7NC80ZFP - STB7NC80Z - STB7NC80Z-1
mm. inch
DIM.
MIN. TYP MAX. MIN. TYP. MAX.
A 4.4 4.6 0.173 0.181
B 2.5 2.7 0.098 0.106
D 2.5 2.75 0.098 0.108
E 0.45 0.7 0.017 0.027
F 0.75 1 0.030 0.039
F1 1.15 1.5 0.045 0.067
F2 1.15 1.5 0.045 0.067
G 4.95 5.2 0.195 0.204
G1 2.4 2.7 0.094 0.106
H 10 10.4 0.393 0.409
L2 16 0.630
L3 28.6 30.6 1.126 1.204
L4 9.8 10.6 .0385 0.417
L5 2.9 3.6 0.114 0.141
L6 15.9 16.4 0.626 0.645
L7 9 9.3 0.354 0.366
Ø 3 3.2 0.118 0.126
E
A
D
B
L3
L6
L7
F1
¯
F
G1
G
H
F2
1 2 3
L5
L2 L4
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STP7NC80Z - STP7NC80ZFP - STB7NC80Z - STB7NC80Z-1
mm inch
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A1
C2
B2
B
e
E
L1
L2 D L
P011P5/E
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STP7NC80Z - STP7NC80ZFP - STB7NC80Z - STB7NC80Z-1
mm. inch
DIM.
MIN. TYP MAX. MIN. TYP. MAX.
D1 8 0.315
E 10 10.4 0.393
E1 8.5 0.334
R 0.4 0.015
V2 0º 4º
3
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STP7NC80Z - STP7NC80ZFP - STB7NC80Z - STB7NC80Z-1
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from
its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information
previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or
systems without express written approval of STMicroelectronics.
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