eBOOK For Thermal Analysis Using Hyperworks

EBOOK
Learn Thermal Analysis with Altair

OptiStructTM
© Altair Engineering, Inc. All Rights Reserved. / altair.com / Nasdaq: ALTR / Contact Us
eBook / Learn Thermal Analysis with Altair OptiStructTM
CONTENTS
1. About This Book .................................................................................................................... 3
2. Acknowledgement ................................................................................................................. 4
3. Disclaimer .............................................................................................................................. 5
4. Introduction To Heat Transfer .............................................................................................. 6
5. Thermal Materials Used In Optistruct ................................................................................ 11
6. Thermal Loads And Boundary Conditions........................................................................ 16
6.1. Volumetric Heat Generation ................................................................................................................. 17
6.2. Heat Flux ................................................................................................................................................ 19
6.3. Imposed Temperature ........................................................................................................................... 21
6.4. Free Convection .................................................................................................................................... 22
6.5. Time-Dependent Thermal Loading (Transient Analysis) .................................................................. 26
6.5.1. Load History Card Tloadi................................................................................................................. 26
6.5.2. Initial Conditions .............................................................................................................................. 27
7. Thermal Results .................................................................................................................. 29

8. Steady State Heat Transfer Analysis ................................................................................. 32
8.1. Linear Steady State Heat Transfer Analysis ....................................................................................... 32
8.1.1. Tutorial: Linear Steady State Heat Transfer Analysis ..................................................................... 33
8.2. Coupled Thermal Structural Analysis ................................................................................................. 41
8.2.1. Tutorial: Coupled Linear Heat Transfer/Structure Analysis............................................................. 42
8.3. Nonlinear Steady State Heat Transfer Analysis ................................................................................. 49
8.3.1. Tutorial: Nonlinear Steady State Heat Transfer Analysis................................................................ 50
9. Transient Heat Transfer Analysis ...................................................................................... 57

9.1. Linear Transient Heat Transfer Analysis ............................................................................................ 57
9.1.1. Tutorial: Linear Transient Heat Transfer Analysis ........................................................................... 59
9.2. One Step Transient Thermal Stress Analysis .................................................................................... 65
9.2.1. Tutorial: One-Step Transient Thermal Stress Analysis ................................................................... 67
9.3. Nonlinear Transient Heat Transfer Analysis ...................................................................................... 75
10. Contact-Based Thermal Analysis ...................................................................................... 76

10.1. Iterative Solver................................................................................................................................... 77
10.2. Thermal Contact Properties ............................................................................................................. 77
© Altair Engineering, Inc. All Rights Reserved. / altair.com / Nasdaq: ALTR / Contact Us 1
10.3. Thermal Contact Without Static Analysis ....................................................................................... 81
10.4. Contact-Based Thermal-Structural Analysis Setup....................................................................... 81
10.5. Tutorial: Setting Up Thermal Contacts For The Bolted Pipe Flange Model ................................ 82
11. Additional Industry Examples ............................................................................................ 91

11.1. Heat Sink: Steady State Thermal Analysis ..................................................................................... 91
11.2. Engine Block: Heat Transfer Analysis ............................................................................................ 92
11.3. Brake Disc: Coupled Linear Heat Transfer And Structural Analysis ........................................... 94
11.4. Extended Surface Fin: Linear Transient Heat Transfer Analysis ................................................. 96
11.5. Aluminium Bar: Nonlinear One-Step Transient Thermal Analysis .............................................. 98
11.6. Exhaust Manifold: One Step Thermal Transient Stress Analysis .............................................. 100
11.7. Manifold: Nonlinear Transient Heat Transfer ............................................................................... 101
11.8. Piston Ring: Heat Transfer Analysis With Gap Elements ........................................................... 103
12. Appendix ............................................................................................................................ 105

12.1. Card Images Summary Table ......................................................................................................... 105
12.2. Thermal Expansion Coefficient Support For Rigid Elements..................................................... 107
12.3. Tools Menu To Set Up Convection Load And Heat Transfer Analysis ...................................... 108
12.4. Clearance Based Conductance Table For Heat Subcases ......................................................... 108
12.5. Thermal Stress Steady State Analysis .......................................................................................... 109
12.6. Debugging For Heat Transfer Analysis......................................................................................... 110
12.7. Optistruct Online Tutorials List ..................................................................................................... 110
1. About This Book
This study guide aims to provide a fundamental to advanced approach into the exciting and challenging world of Structural
Analysis. The focus will be on aspects of Thermal Analysis. As with our other eBooks we have deliberately kept the theoretical
aspects as short as possible.
The Finite Element Program used in this book is Altair OptiStruct. OptiStruct® is an industry proven, modern structural analysis
solver for linear and nonlinear structural problems under static, dynamic, and thermal loads. OptiStruct is used by thousands of
companies worldwide to analyze and optimize structures and mechanical systems for strength, durability, noise and vibrations,
heat transfer, as well as impact. In this eBook, we will describe in some detail, how to perform a thermal analysis including:
• Linear steady state thermal analysis
• Nonlinear steady state thermal analysis
• Sequentially coupled thermal-structural analysis
• Linear transient thermal analysis
• Nonlinear transient thermal analysis
• One step transient thermal stress analysis
• Contact-based thermal analysis
Please note that a commercially released software is a living “thing” and so at every release (major or point release) new method,
new functions are added along with improvement to existing methods. This document is written using OptiStruct 2017.2.3. Any
feedback helping to improve the quality of this book would be very much appreciated.
Thank you very much.
Dr. Matthias Goelke
On behalf of the Altair University Team
2. Acknowledgement
A very special Thank You goes to all the many colleagues who contributed in different ways:
• Gabriel Stankiewicz for creating and testing various chapters contained in this eBook. Rahul Rajan for adding industry
examples, appendix and organizing eBook chapters.
• Rahul Ponginan and Premanand Suryavanshi for reviewing the book. For sure, your feedback and suggestions had a
significant impact on the “shape” and content of this book.
• Junji Saiki, Xueyong Qu and Ujwal Patnaik from HyperWorks Core Development.
• Aditya Jayanthi for using his brake example.
• Mike Heskitt, Sean Putman & Dev Anand for all the support.
• The entire OptiStruct Documentation team for putting together 1000’s of pages of documentation and recently released
OptiStruct verification and example section.
• Lastly, the OptiStruct Development team deserves huge credit for their passion & dedication! It is so exciting to see how
OptiStruct has evolved throughout the last couple of years.
Thank you very much.
Your Altair University Team
3. Disclaimer
Every effort has been made to keep the book free from technical as well as other mistakes. However, publishers and authors will
not be responsible for loss, damage in any form and consequences arising directly or indirectly from the use of this book.
© 2021 Altair Engineering, Inc. All rights reserved. No part of this publication may be reproduced, transmitted, transcribed, or
translated to another language without the written permission of Altair Engineering, Inc. To obtain this permission, write to the
attention Altair Engineering legal department at: 1820 E. Big Beaver, Troy, Michigan, USA, or call +1-248-614-2400.
4. Introduction to Heat Transfer
From a physical point of view, what is Heat Transfer?
Heat transfer is the exchange of thermal energy between physical systems, depending on the temperature and pressure, by
dissipating heat. The fundamental modes of heat transfer are conduction or diffusion, convection and radiation.
Heat transfer always occurs from a region of high temperature to another region of lower temperature. Heat transfer changes the
internal energy of both systems involved according to the First Law of Thermodynamics. The Second Law of Thermodynamics
defines the concept of thermodynamic entropy, by measurable heat transfer.
Thermal equilibrium is reached when all involved bodies and the surroundings reach the same temperature. Thermal expansion
is the tendency of matter to change in volume in response to a change in temperature.
The first law of thermodynamics is a version of the law of conservation of energy, adapted for thermodynamic systems. The
law of conservation of energy states that the total energy of an isolated system is constant; energy can be transformed from one
form to another but cannot be created or destroyed.
The second law of thermodynamics states that every natural thermodynamic process proceeds in the sense in which the sum
of the entropies of all bodies taking part in the process is increased. In the limiting case, for reversible processes this sum
remains unchanged.
Thermal analysis is a branch of materials science where the properties of materials are studied as they change with
temperature.
Modes of Heat Transfer
Conduction Convection Radiation
Natural Forced
Steady Unsteady Specular Diffuse
Convection Convection
State State
Conduction Conduction
Practical applications: Engine, Radiator, Exhaust System, Heat exchangers, Power plants, Satellite design etc.
According to the types of FEA Methods, Thermal Analysis may be divided into two categories:
1. Steady State Thermal Analysis
2. Transient Thermal Analysis
There are many heat transfer solutions supported in OptiStruct

• Linear steady state thermal analysis
• Nonlinear steady state thermal analysis
• Sequentially coupled thermal-structural analysis
• Linear transient thermal analysis
• Nonlinear transient thermal analysis
• One step transient thermal Stress analysis
• Contact-based thermal analysis
Steady
State
Transient
Conduction
Conduction is the transfer of heat between substances that are in direct contact with each other. The better the conductor, the
more rapidly heat will be transferred. Metal is a good conductor of heat. Conduction occurs when a substance is heated, particles
will gain more energy, and vibrate more. These molecules then bump into nearby particles and transfer some of their energy to
them. This then continues, and energy is hence passed from the hot end down to the colder end of the substance.
Key facts about conduction:
• Conduction takes place in solids due to lattice vibration, in liquids and gases due to molecular collision.
• Particles do not change their position in structure.
• Heat is transferred due to direct molecular collisions (a physical contact).
• Particles with higher speeds collide with low-speed particles, transferring some part of the energy to them.
Fourier’s law governs conduction heat transfer. Fourier proved by experiments, that heat transfer rate is proportional to area and
temperature difference and inversely proportional to thickness.
Q = -kA*[DT/DX]
Where
Q = Heat transfer rate (W)
A = Area (m2)
DT = Temperature differential (°C/K/°R)
DX = thickness (m)
k = Thermal conductivity (W/mK)
The bracketed term is called temperature gradient, it’s been assigned with negative sign since the temperature gradient vector is in
opposite direction of heat flow as shown below.
Convection
Thermal energy is transferred from hot places to cold places by convection. Convection occurs when warmer areas of a liquid or
gas rise to cooler areas in the liquid or gas. Cooler liquid or gas then takes the place of the warmer areas which have risen
higher. This results in a continuous circulation pattern. Water boiling in a pan is a good example of these convection currents.
Another good example of convection is in the atmosphere. The earth's surface is warmed by the sun, the warm air rises, and cool
air moves in.
Key facts about convection:
• Opposed to conduction, convection is a movement of particles with high thermal energy.
• Convection takes place in fluids, as it allows particles displacement.
• Usually, convection occurs in the vertical direction, towards higher altitudes. This is because warmer areas of a fluid
increase their volume (more space to vibrate) and therefore are lighter, causing colder areas to fall below and push them
upwards.
• Convection can be either natural or forced (enforced by e.g. by a rotating fan)
Basic governing equation is Newton’s Law of Cooling:

𝑄𝑄 = ℎ𝐴𝐴(𝑇𝑇𝑠𝑠 − 𝑇𝑇𝑓𝑓 )
Where
Q – Heat transfer rate (W)
h – Heat transfer coefficient (convection coefficient) (W/m2K)
A – Surface area (m2)
Ts – Surface temperature (°C,K)
Tf – Fluid temperature (°C,K)
Examples of convection:
• The hottest air is exactly above the bonfire
• Water evaporates in the vertical direction when boiling
• Air flow in intake system of the engine (forced convection)
Radiation
Radiation is a method of heat transfer that does not rely upon any contact between the heat source and the heated object as is
the case with conduction and convection. Heat can be transmitted through empty space by thermal radiation often called infrared
radiation. This is a type of electromagnetic radiation. No mass is exchanged, and no medium is required in the process of
radiation. Examples of radiation is the heat from the sun, or heat released from the filament of a light bulb.
Key facts about radiation:
• Radiation is a phenomenon of electromagnetic waves emission
• The frequency of emitted waves is proportional to emissive body temperature
• Radiation occurs through vacuum or transparent medium.
• Emitted electromagnetic waves are a direct result of particle vibrations
• All objects with temperature above 0 K radiate
Stefan-Boltzmann law is used for calculating radiation emitted by an object to its temperature.
𝐸𝐸 = 𝜎𝜎𝜎𝜎𝜎𝜎(𝑇𝑇1 − 𝑇𝑇2 )4
Where
E = total amount of radiation emitted by an object per square meter (W/m²)
σ = Stefan-Boltzmann constant = 5.67 * 10e-8 (W/(m²K4))
ε = Emissivity of the body
T1 & T2 are the temperatures of the objects in K
5. Thermal Materials used in OptiStruct
Material for thermal analysis is defined through MAT4 or MAT5 card image, which can be extended with MATT4 or MATT5 entries.
When to use which material model?
MAT4 Thermally isotropic material or isotropy can be assumed.
MAT4+MATT4 Additionally: conductivity scalar is temperature-dependent
MAT5 Thermally anisotropic material & conductivity matrix entries are known.
MAT5+MATT5 Additionally: conductivity matrix is temperature-dependent.
MAT1+MAT4/5 Thermal-Structural coupled analysis. MAT4/5 here is an extension to MAT1 card.
The MAT4 card defines constant thermal material properties for isotropic materials
(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)
MAT4 MID K CP RHO H HGEN
Where:
Material identification number. Can be shared with structural material

MID
properties (MAT1, MAT2, MAT8, MAT9, and MGASK)
K Thermal conductivity
CP Heat capacity per unit mass (specific heat)
RHO Density
H Free convection heat transfer coefficient
Heat generation capability used with QVOL entries. HGEN is the scale factor
and QVOL is the power generated per unit volume, Pin = volume
HGEN
* HGEN * QVOL
• K (Thermal conductivity)
Thermal conductivity is a material constant defining the ability to transfer heat by conduction. SI units are (W/mK) or (J/m*s*K). This
means that when the conductivity is equal to 1, it transfers 1J of thermal energy in 1 second through the distance of 1m, if the
temperature difference between its ends is 1 K.
• CP (Specific heat capacity)
In shortest words, this is the ability to heat the material. It tells us the amount of heat that is needed to raise the temperature of 1 kg
of this material by 1 K. SI units (J/kgK)
• RHO (density of the material)
Must be defined when specific heat capacity is defined, as it refers to mass of the component.
• H (Heat Transfer Coefficient or Free Convection Coefficient)
This material constant is used to describe ability of the material (fluid) to transfer heat by means of convection. SI units are (W/m²K)
or (J/sm²K), which tell us what amount of heat flux (W/m²) is transferred when temperature difference is 1 K. Or alternatively: how
much energy (J) is transferred through 1 m² of area in 1 second, when the temperature difference between both sides of the area is
1 K.
The MAT5 card defines constant thermal material properties for anisotropic materials
(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)
MAT5 MID KXX KXY KXZ KYY KYZ KZZ CP
RHO HGEN
Where,
Material identification number. Can be shared with structural material properties

MID
(MAT1, MAT2, MAT8, MAT9, and MGASK)
Kij Thermal conductivity matrix values
CP Heat capacity per unit mass (specific heat)
RHO Density
Heat generation capability used with QVOL entries. HGEN is the scale factor and
HGEN
QVOL is the power generated per unit volume, Pin = volume * HGEN * QVOL
The thermal conductivity matrix has the following form:
Heat capacity (CP) is defined per unit mass. It is multiplied by density (RHO) to calculate heat capacity matrix in transient heat
transfer analysis. If RHO is not defined on MAT5, then positive density from a structural material entry with matching MID is used.
If MAT5 does not have a corresponding matching structural material, then the default value of 1.0 is used.
The MATT4 card defines temperature-dependent material properties for the corresponding MAT4 bulk data entry fields via
TABLEMi entries
(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)
MATT4 MID T(K)
Where:
Material identification number. Can be shared with structural material properties

MID
(MAT1, MAT2, MAT8, MAT9, and MGASK)
T(K) Temperature-dependent thermal conductivity TABLEMi ID number
Tip: Constant thermal conductivity defined in MAT4 is multiplied by this tabular function to generate temperature dependent
thermal conductivity. If T(K) field is blank or zero, the constant thermal conductivity defined in MAT4 is used.
The MATHE card defines material properties for nonlinear hyper elastic materials
(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)
MATHE MID Model NU RHO TEXP TREF
C10 C01 D1 TAB1 TAB2 TAB4 TABD
C20 C11 C02 D2 NA ND
C30 C21 C12 C03 D3
C40 C31 C22 C13 C04 D4
C50 C41 C32 C23 C14 C05 D5
NOTE: One can also use nonlinear hyper elastic materials such as MATHE card, which provides the option to define linear
thermal expansion coefficient, to carry out Thermal Analysis. MATHE card information covered in detail in OptiStruct Nonlinear
Analysis FEA guide.
MAT1+MAT4 extension or MAT1+MAT5 extension
Material for thermal-structural coupled analysis is defined through structural material entry MAT1, with all the structural
parameters and additional extension for
MAT4 checked, which contains the same parameters as MAT4 card described above. RHO parameter is repeated and needs to be
defined in both entries, since the one from MAT1 is used for structural part of the analysis and the one in MAT4 extension is used
for thermal part of the analysis.
A – thermal expansion coefficient (see chapter: Coupled Thermal-Structural Analysis)

TREF – reference temperature for density (thermal expansion causes density change)
6. Thermal Loads and Boundary Conditions
Generally, we can divide the loading possibilities in OptiStruct into four groups, basing on the physical phenomenon:
• Volumetric Heat Generation (Loading)
• Heat Flux (Loading)
• Imposed temperature (BC or Loading - SPC or SPCD)
• Free Convection (defined as Group)
To better understand the meaning of each loading/boundary condition to the simulation, a following table is made to show its
similarity to structural analysis.
LOADINGS
Mechanical Thermal Comments
Defines heat generation of elements per unit of volume.

Volumetric This can be used to model heat generation by Joule effect for
Inertial loads [GRAV] heating example.
[QVOL] Unit’s example: W/m3 or W/mm3 (depending on unit used for
distance)
A thermal loading applied to a 2D area, the external face of a 3D

part, or the edge of a 2D part. Unlike in mechanical analysis, Flux
Thermal flux
Pressure [PLOAD] is not directly applied to structural elements, but on dedicated
[QBDY1]
entities, the thermal interface elements (CHBDYE) Unit’s example:
W/m² or W/mm² (depending on unit used for distance)
We use SPC(D) to set displacement boundary conditions on nodes

Imposed
in a mechanical analysis (dof =1 to 6), the same principle is used to
Imposed displacements temperature
set temperature boundary conditions on nodes (dof = 0).
[SPC / SPCD] [SPC /
MPC also works in thermal analysis with dof = 0.
SPCD]
Unit’s example: K or °C
Both Contact and Convection are set up as a Group and they

describe relationship between adjacent media, they are not
referred in subcase entry. Since contact is a structural interface
between contact surface and set of nodes, convection is a thermal
interface between thermal elements and a single GRID or
Convection SPOINT, on which an SPC is applied to model the external
Contact [CONTACT]
[CONV] solid/fluid temperature away from the structure.
Different convection rules can be used to determine the resulting
loading. Thermal flux is not directly set by the user but depends on
convection rules, part temperature and fluid temperature.
Unit’s example: W/m² or W/mm² (depending on unit used for
distance)
6.1. Volumetric Heat Generation
Volumetric Heat Generation is a thermal loading, which is used to define 3D elements as heat sources, to simulate physical
phenomena of electrical/chemical/nuclear energy conversion to thermal energy. In such a case, user needs to specify the
Volumetric Heat Generation Rate, through QVOL entry. The unit for this parameter is (W/mm³). Then, if a certain volume is
assigned with QVOL, it will generate a rate of heat flow (thermal power) (W) calculated by a following formula:
∆𝑄𝑄
= 𝑉𝑉 ∗ 𝑄𝑄𝑄𝑄𝑄𝑄𝑄𝑄 ∗ 𝐻𝐻𝐺𝐺𝐸𝐸𝐸𝐸
∆𝑡𝑡
Where:
ΔQ/Δt – rate of heat flow (thermal power) (W)
V – volume (mm³)
QVOL – Volumetric Heat Generation Rate (W/mm³)

HGEN – scale factor for volumetric heat generation defined in material entry MAT4/MAT5.
Or it can be expressed with the amount of thermal energy Q (J) that will be produced in a certain amount of time t (s):
𝑄𝑄 = 𝑉𝑉 ∗ 𝑄𝑄𝑄𝑄𝑄𝑄𝑄𝑄 ∗ 𝐻𝐻𝐻𝐻𝐻𝐻𝐻𝐻 ∗ 𝑡𝑡
Examples of phenomena, where heat generation occurs:
• Exothermic chemical reactions
• Electrical energy conversion into thermal energy
• Nuclear reactions
Generally, an energy conversion into thermal energy is considered as volumetric heat generation.
Volumetric Heat Generation Rate Setup
Since, this is a thermal load, it will be referenced in a thermal subcase entry as LOAD. Therefore, user needs to follow these steps
to set up Volumetric Heat Generation Rate:
1. Create Load Collector with no card image (make sure it is a current collector, otherwise, right click on it -> Make Current)
2. Go to analysis panel -> flux
3. In flux panel, generate volumetric flux loading on 2D/3D elements, with loading type QVOL
• QVOL is directly applied on structural elements
• Tip: Heat generation is scaled by the HGEN parameter in MAT4/5
• The value unit should be {power_unit}/{distance_unit}3. For example, (W/m3).
• Flux will be illustrated as arrows in the graphics area
6.2. Heat Flux
Heat Flux is also a thermal loading, which defines amount of thermal power (rate of heat flow) that goes through a unit area. This is
defined as power divided by area, for example W/m² in SI units. In HyperMesh, Heat Flux can be applied to:
• Any surface of a solid component
• Surface of shell component
• Edge of shell component (then the surface letting the flux in is A = edge length * shell thickness)
• End of 1D element (inlet surface is a cross section of the element)
• Along the 1D component
The equation showing the relationship between heat flux and rate of heat flow (thermal power) is shown below:
∆𝑄𝑄
= 𝜙𝜙𝑞𝑞 ∗ 𝐴𝐴
∆𝑡𝑡
Where:
ΔQ/Δt – rate of heat flow (thermal power) (W)

A – surface area (m²)
Φq – heat flux (W/m²)
The equation can also be expressed as amount of thermal energy going through a unit area in a unit time:
𝑄𝑄 = 𝜙𝜙𝑞𝑞 ∗ 𝐴𝐴 ∗ 𝑡𝑡
Additionally, heat flux is expressed by means of conduction and convection equations, which were mentioned before. Just the left
side of the equation, which contains rate of heat flow, needs to be divided by flux area. We can then obtain the following formulae:
𝜙𝜙𝑞𝑞 = −𝑘𝑘∇𝑇𝑇
Where:
𝛻𝛻𝛻𝛻 – temperature gradient (for 1 dimensional case: DT/DX)

k – thermal conductivity (W/mK)
Negative sign in the equation means that heat goes (heat flux) in the negative direction of the temperature gradient (from hot to
cold). For convection, the equation is as follows:
𝜙𝜙𝑞𝑞 = ℎ(𝑇𝑇𝑠𝑠 − 𝑇𝑇𝑓𝑓 )
Where:
h – heat transfer coefficient (convection coefficient, (W/m²*K))

Tf – Fluid temperature (°C,K)
Examples of phenomena, where heat flux is observed:
• Heat flux through window, due to temperature difference in the inside and outside of the building
• Heat flux through spoon from hot soup to hand
Generally, any kind of material with conductivity property, that is in contact with environments of different temperature at the same
time.
Define Heat Flux in Hyper Mesh

1. To create CHBDYE thermal interface elements:
a. Create a new group of card image CONDUCTION
b. Add to this group the elements or elements faces that define the interface used to apply the thermal loading.
This action will create new elements: the CHBDYE elements, displayed as hollow rectangular or triangular shapes.
Notes about creating CHBDYE elements:
c. CHBDYE elements are specific to thermal analysis
d. They are used to apply flux and/or convection in thermal analysis
e. They are not used for mechanical analysis
f. CHBDYE element configuration in HyperMesh is slave3 or slave4
g. Due to their “non-physical” nature, they are not held in components but in groups and can be selected using the
“by group” selection
2. To create a heat flux on CHBDYE thermal interface elements:
a. Create a load collector with no card image
b. Create flux loading on CHBDYE thermal elements with loading type QBDY1
When creating heat flux loading:
• In order to select CHBDYE thermal elements, use the by group selection option
• The value unit should be {power_unit}/{distance_unit} ². For example, W/m².
• Flux will be shown as arrows in the graphics area
6.3. Imposed Temperature
By imposed temperature it is understood, that certain chosen grid points (GRID) will be forced to have a predefined value of
temperature throughout the analysis. This is basically a thermal Boundary Condition, like in structural analysis we define fixed
DOFs, here we can treat imposed temperature as fixing just another “DOF”.
• Temperature Constraints need to be applied to grid points of conduction elements or ambient points (for convection, see:
Free Convection) (GRID or SPOINT)
• Imposed Temperature can be created as SPC or SPC1 and referred as SPC entry in thermal subcase definition or as
SPCD and referred as LOAD entry in thermal subcase definition.
When to use SPC and when SPCD?
SPC Imposed temperatures for steady-state analysis.
Imposed temperatures for transient analysis (can be used for steady-state, however it is then referred as LOAD
SPCD
subcase entry.
Imposed Temperature Setup

1. Create a Load Collector with no card image
2. Go to analysis panel -> constraints.
3. Select nodes, which need to be assigned with fixed temperature (usually option by face is used to select whole faces)
4. Leave all DOFs unchecked.
5. Select load types as SPC, SPC1 or SPCD.
NOTE: If Heat Flux or Volumetric Heat Generation Rate is specified, it is more convenient to create SPC or SPC1 type fixed
temperatures and refer them in SPC subcase entry. Of course, one collector can handle both SPCD and Heat Flux for example,
in that case only LOAD entry in thermal subcase definition will be referred.
6. Click create/edit to enter the card edit panel. Set fixed temperature value in D entry.
6.4. Free Convection
In free convection, fluid motion is not generated by any external source, like pump, fan, etc. but only by density differences in the
fluid due to temperature gradients.
In HyperWorks, free convection allows thermal energy transfers between a surface and an ambient environment (SPC/SPCD) through
heat transfer coefficient (H) and a surface element (CHBDYE).
A setup of convection in HyperMesh is a bit different than the previously described loadings. Convection is understood here as
thermal interface. The best analogy to structural analysis seems to be contact interface – both convection and contact are:
• Not referred in subcase entry
• Set up through interfaces panel, defined as Group in browser
• Describing behaviour on the boundary of two media (solid surface and ambient environment in convection) or two bodies
(physical interaction between two solid bodies)
• Defined as interaction between a surface and a set of nodes (contact) or one node (convection)
• A kind of boundary condition.
To remind you of a physical relation describing convection, the equation of heat flux is once more presented:
𝜙𝜙𝑞𝑞 = ℎ(𝑇𝑇𝑠𝑠 − 𝑇𝑇𝑓𝑓 )
Where:
𝜙𝜙𝑞𝑞 – heat flux (W/m²)

h – heat transfer coefficient (convection coefficient, (W/m²*K))
Tf – Fluid (ambient) temperature (°C,K)
Free Convection Setup

1. Create convection interface (PCONV)
Go to analysis panel -> interfaces. Type in the name and set type = as CONVECTION. Click create/edit to enter the
card edit panel.
OR:
Right click in model browser -> Create -> Group. Type in the name and set Card Image to CONVECTION.
2. Edit convection properties (PCONV)

(In card edit panel or Entity Editor) Choose the material of the convection surface under MID entry. If H is not specified in
MAT4 entry, choose FTYPE = 3 and type in H1 ([power unit]/ [area unit*temperature unit], example: W/m²*K) value of
convection coefficient between solid surface and ambient environment.
3. Create CHBDYE elements for convection surface definition.
If still in interfaces panel:
Switch to add panel, which is available on the left side. Make sure you are editing your newly created convection
interface (click on name and choose it). Choose slave as face. Define the convection surface in the same manner as
faces for contact: choose elements that will be included in the face and select three nodes within one element on the
chosen face. Click add. CHBDYE elements will be created and added to the convection interface.
OR:
Define face through Entity Editor. Click on 0 Elements in the Slave Entity IDs option, and define the face in the same
manner as described above. HINT: There is an additional option to directly click on face and choose it: add shell/solid
faces -> faces -> click directly on the chosen face, add and return.
4. Create ambient temperature.
Create a node somewhere in space (Geom panel: nodes -> type in the coordinates -> create). Add imposed
temperature boundary condition to that node (unchecked DOFs, temperature added through D entry in card edit panel).
5. Assign ambient temperature node to convection surface (CONV).
Go to card edit panel. Choose config = as slave3 (for tria CHBDYE elements) or slave4 (for quad CHBDYE
elements). type = will be CHBDYE3 or CHBDYE4 respectively. Now select which thermal elements need to be in relation
with ambient temperature: Select elems with by group advanced option. Choose proper convection interface. Click edit.
Now you will see the CONV card additionally, which is responsible for matching PCONV convection property ID with ambient
temperature node ID. Select TA1 entry for ambient temperature node – either click in the graphic window on ambient
temperature node or type in its ID. In PCONID entry, the ID of referred PCONV property should already be there.
The setup is done. Below, a relationship between each card image is shown to help you better understand the convection
interface setup.
NOTE: The CONVECTION card image that is created through either interfaces panel or as Group in model browser, is in fact
PCONV card image entry. CONV card image is just defining an assignment of ambient temperature node (TA) to PCONV
property.
6.5. Time-dependent Thermal Loading (transient analysis)
6.5.1. Load history card TLOADi
In Transient Thermal Analysis, user has the possibility to define time-dependent thermal loads. Generally, the structure of time-
dependent loads setup is analogous to Structural Transient Analysis:
Time dependent thermal loading and boundary conditions:
• Time dependent heat flux (QBDY1)
• Time dependent heat generation (QVOL)
• Time dependent temperature boundary conditions (SPCD)
• Time dependent ambient temperatures for convection (SPCD)
Key notes on time-dependent load TLOADi:
1. Entries used to define loading values: SPCD, QVOL, QBDY1 should now be set up with either unit values, so that tabular
data will consist of real values in time or can be set up with real value along with a tabular data containing appropriate
scaling factors.
2. Tabular data containing time dependent loading values (or scaling factors) is defined within TABLED load collector.
When SPCD, QVOL, QBDY1 entries contain unit values (= 1), then Y-column in TABLED should contain real thermal
loading values in proper unit system. X-column is, of course, for time points.
3. TLOAD1/2 is used to associate TABLED data to proper thermal load values: SPCD, QVOL, QBDY1. TID entry should
refer to TABLED ID. EXCITEID entry should refer to SPCD, QVOL or QBDY1 ID. Additionally, DELAY can be defined for
time delay.
𝐟𝐟(𝐭𝐭) = 𝐀𝐀 ∗ 𝐅𝐅(𝐭𝐭) + 𝛕𝛕
• f(t) is the time-dependent dynamic load or enforced motion
• A is the amplitude of the dynamic excitation in transient response analysis and is referenced by the EXCITEID field.
• F(t) is a user-defined function that defines the time-variant nature or loading scale factors for f(t). It is specified by
referencing a predefined TABLEDi entry in the TID field.
4. When there is only one TLOADi present in the model setup, it can be directly referred by the DLOAD subcase entry in
Heat Transfer (Transient) load step. In case of multiple TLOADi definitions, user needs to create another load collector
with card image DLOAD, in which all TLOADi IDs must be referred with proper scaling factors and global scale factor.
The DLOAD load collector is then referred in DLOAD subcase entry in load step definition
The TLOAD1 card defines a time-dependent dynamic load or enforced motion:
(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)
TLOAD1 SID EXCITEID DELAY TYPE TID
Where:
SID Set identification number.
Identification number of the DAREA, SPCD, FORCEx, MOMENTx, PLOADx,

EXCITEID RFORCE, QVOL, QBDY1, ACCEL, ACCEL1, ACCEL2, or GRAV entry set
that defines {A}
DELAY Defines time delay t
TYPE Defines the type of the dynamic excitation.
TID TABLEDi entry identification number that gives F(t)
6.5.2. Initial Conditions
When we are looking for a transient behaviour of a model, initial conditions play crucial role in how the following transient response
will look like. In the case of thermal analysis, this is an initial temperature. We can set up initial temperature in two ways:
• Using a load collector with card image TEMPD, where T1 must be filled with initial temperature value.
• Creating a load collector with no card image and adding here a temperature load (analysis panel -> temperatures -> load
types = TEMP). With this option you can apply initial temperature to certain grid points (faces, edges, whole components
etc…).
The difference between these two options is that TEMPD only allows setup of a “general” initial temperature, whereas TEMP load
can be assigned to “any” entity.
In the end, user should refer the load collector containing initial temperature to IC subcase entry.
7. Thermal Results
By default, only Grid Temperatures are exported to .h3d file for results view. Therefore, usually it is recommended to request for
additional results through GLOBAL OUTPUT REQUEST control card. Mostly two types of results are requested:
• THERMAL – These requests for Grid Temperatures, they are always exported to h3d file by default (set the FORMAT (1)
to H3D and OPTION (1) to ALL/YES. In this card, threshold temperature output can also be defined: RTHRESH, which
provides a threshold for the temperature output.
• FLUX – Additionally temperature gradients and thermal conductivity heat fluxes can be requested. Set the FORMAT (1) to
H3D and OPTION (1) to ALL/YES.
• SPCFORCE Output for Heat Transfer - when SPCF/SPCFORCE is requested for steady state heat transfer subcase,
the power at SPC grids will be calculated. SPC power is a measure of energy flowing in and out of the structure.
Feature supported version: OptiStruct 2017.0 or above
RESULTS
Mechanical Thermal Comments
In both case, those are the first results to be calculated,

and those values will be used to calculate all other
results.
- In mechanical analysis: stress, strain, energy is
Displacement Temperature calculated based on nodal displacements.
- In thermal analysis: gradients, fluxes, thermal
energies are calculated based on nodal temperatures.
This is a nodal scalar result. Unit’s
example: K or °C
This is used to obtain temperature variation in space

along the different Axis (X, Y, and Z).
Temperature
Strain
Gradient This is an elemental vector result.
Unit’s example: K/m or K/mm (depending on unit used
for distance)
Defines the thermal power passing through a unitary

section perpendicular to a particular direction (X, Y, Z)
Stress Fluxes This is an elemental vector result.
Unit’s example: W/m² or W/mm² (depending on unit used
for distance)
This result is not a library-based result, but is calculated

by OptiStruct to represent some kind of energy absorbed
by the part during the thermal transfer (however, the unit
is not consistent with an energy).
Thermal
Compliance This response is mainly used for optimization, where
Compliance
optimizing thermal compliance improves the part
conductivity.
This is a global scalar result.
Units example : W.K
Again, to better understand the relevance of each result type, their analogue in structural analysis is presented:
8. Steady State Heat Transfer Analysis

For a steady-state heat transfer analysis, the temperature distribution and heat flow within the model are independent of time. No
transient effect is considered.
Linear steady state heat transfer

• Material properties such as conductivity and convection coefficient are independent of temperature (MAT4/MAT5)
• ANALYSIS=HEAT
Nonlinear steady state heat transfer

• Temperature dependent material properties defined in MATT4
• ANALYSIS=NLHEAT
Industry examples of application:
• Heat Sink – description and model download in chapter 9.1 – Linear Steady-State Heat Transfer analysis
• Engine Block – description and model download in chapter 9.2 – Linear Steady-State Heat Transfer analysis
8.1. Linear Steady State Heat Transfer Analysis
In linear steady state analysis, material properties such as conductivity and convection coefficient are linear. Temperature and
fluxes at the final thermal equilibrium state are of interest. The basic finite element equation is:
([𝑲𝑲𝒄𝒄] + [𝑯𝑯]){𝑻𝑻} = {𝑷𝑷𝑩𝑩} + {𝑷𝑷𝑯𝑯} + {𝑷𝑷𝑸𝑸}
Where:
[Kc] – conductivity matrix
[H] – boundary convection matrix due to free convection,
{T} – unknown nodal temperature,
{PB} is power due to heat flux at boundary specified by QBDY1 card

{PH} is boundary convection vector due to convection specified by CONV card {PQ} is power vector due to internal heat
generation specified by QVOL card.
The matrix on the left-hand side of equation (1) is singular unless temperature boundary conditions are specified. Once the
unknown temperatures at the nodal points of the elements are calculated, temperature gradient can be calculated according to
element shape functions. Element fluxes can be calculated by using:
{𝑸𝑸𝑭𝑭𝑭𝑭𝑭𝑭𝑭𝑭} = [𝑲𝑲𝒄𝒄]{𝛁𝛁𝛁𝛁}
{𝛁𝛁𝛁𝛁} – temperature gradient vector based on temperature vector {𝑻𝑻}
{𝑸𝑸𝑭𝑭𝑭𝑭𝑭𝑭𝑭𝑭} – heat flux vector
Linear Steady-State analysis is set up through Heat Transfer (Steady State) analysis type in loadstep definition. Following entries
are defined in this loadstep:
• SPC – load collector containing Imposed Temperature of type SPC or SPC1
• LOAD – load collector containing Volumetric Heat Generation Rate (QVOL), Heat Flux (QBDY1) and Imposed
Temperature as SPCD type.
Convection does not need to be referred in subcase entry.
8.1.1. Tutorial: Linear Steady State Heat Transfer Analysis
This tutorial demonstrates how to import an existing FE model, apply boundary conditions, and perform a Linear Steady State
Heat Transfer Analysis on a thin square plate. Post-processing of analysis is done using HyperView to view Grid Temperature
and element fluxes.
The unit system maintained in the model is N m kg
Open the plates.hm file (Download required model file from the folder)
Step 1: Create the Material

The imported model has four component collectors with no materials. A material collector needs to be created and assigned to
the shell component collectors.
1. In the Model Browser, right-click and select Create > Material from the context menu.
A default material displays in the Entity Editor.
2. For Name, enter Mat.
3. Set the Card Image set to MAT4
4. Enter the material values next to the corresponding fields.
a. K = 52.0 W/m°C.
b. H = 750.0 W/m2 °CA
A new material, Mat, has been created. The material uses OptiStruct linear isotropic thermal material model, MAT4.
Step 2: Create the Property

1. In the Model Browser, right-click and select Create > Property from the context menu.
A default property displays in the Entity Editor.
2. For Name, enter PSHELL.
3. For Card Image select PSHELL, as the component is made of shell elements
4. For thickness enter value of T = 0.1
5. Also select the material as Mat.
Step 3: Assign the Material and Property

Assign the material and property to plate component. This can be done by a right click on the component and select Assign. From
the pop-up menu select the PSHELL property.
Step 4: Applying Thermal Loads and Boundary Conditions

In this exercise the thermal boundary conditions are applied on one edge of the plate and saved in a load collector SPC_TEMP. A
predefined node 101 specifies the ambient temperature. A predefined node set node_temp contains the nodes on one edge of
the plate.
Creating Temperature on one edge of the plate
From version 2017 on we can directly apply temperature with SPC load type using temperature panel
1. Create a load collector named SPC_TEMP
2. From the Analysis page, click temperature.
3. Go to the create subpanel.
4. Make sure the current selection field is set to nodes and load collector to SPC_TEMP.
5. Click nodes >> by path.
6. Select the first and last node as indicated:
7. Set value to 100.
8. Set load types to SPC.
9. Click create.
This applies the temperature 100 on one edge of plate.
Creating Ambient Temperature

1. Make sure SPC_TEMP is the current load collector.
2. From the Analysis page, select the Temperatures panel.
4. Click nodes >> by id.
5. Input the ID of the predefined node 101.
6. Node 101 should be highlighted.
7. Set load types to SPC.
8. Set value as 1e-4
9. Click create.
This applies the temperature 1e-4 on one edge of plate.
Creating CHBDYE Surface Elements

Surface elements are to be created to simulate the heat exchange between the plate and the surrounding air.
1. Go to Analysis panel > Interfaces.
2. For Name, enter convection.
3. For Type, select CONVECTION from the drop-down menu.
4. Click Color and select a color from the palette.
5. Click create/edit
6. Click MID to activate it.
7. For Material, click MID > Mat.
8. Switch to the add panel now
9. For Slave Entity IDs, select elements as shown below
10. Click add.
This adds the CHBDYE surface elements to the solid elements on the outer surface following the same side convention, as
shown in the following figure.
Defining Convection Boundary Condition to Surface Elements
1. Click the Card Edit icon .
2. Select elems.
3. Click elems >> by group.
4. Check the box in front of CONVECTION and click select.
5. Click config= and select slave4.
6. Click type= and select CHBDYE4.
7. Click edit and go to the CHBDYE Card Image panel.
8. Check the box in front of CONV.
9. Click TA1 and input the ambient node ID 101, as shown below.
10. Click return two times to go back to the Analysis page.
Step 5: Creating Heat Transfer Load Step

An OptiStruct steady state heat convection loadstep is created, which references the thermal boundary conditions in the load
collector spc_temp. The gradient, flux, and temperature output for the heat transfer analysis is also requested in the Loadsteps
panel.
1. In the Model Browser, right-click and select Create > Load Step.
2. A default loadstep displays in the Entity Editor.
3. For Name, enter heat_transfer.
4. Click on the Analysis type field and select Heat transfer (steady state) from the drop-down menu.
5. For SPC, click Unspecified > Loadcol.
6. In the Select Loadcol dialog, select SPC_TEMP and click OK.
7. Check the box next to Output.
8. Activate the options of FLUX and THERMAL on the sub-list.
9. Activate the FORMAT fields for both outputs and select H3D format.
10. Activate the OPTION fields for both outputs and select ALL.
The FORMAT and OUTPUT fields for THERMAL output may open up a new window.
Click on the first field in the window to select the corresponding values.
FLUX and THERMAL output can also be requested in the Control cards panel on the Analysis page.
Step 6: Run the analysis
Step 7: Review the results in HyperView
8.2. Coupled Thermal Structural Analysis
While pure thermal analysis provides us with information about temperature and heat flux distribution, in most cases it is also
crucial to check whether thermal loading will not lead to structural failure of the component. This is mostly about one significant
material property, which is the thermal expansion coefficient. It can even be said to be a “linking” parameter between thermal
and structural aspects of a component or assembly.
Industry example of application:

• Brake disc – Description and model download in chapter 9.3 – Coupled Thermal-Structural Analysis.
A linear (1D) thermal expansion provides the following equation:
∆𝐿𝐿
= 𝛼𝛼𝐿𝐿 ∗ ∆𝑇𝑇
𝐿𝐿
Where:
αL – linear thermal expansion coefficient (1/K)

L – initial length (m)
ΔL – change in length due to expansion (m)
ΔT – change in temperature along this length
While strains induce stresses, or stresses induce strains (it in fact happens simultaneously), temperature induces a so-called
expansion of the component, which can be understood as a strain without any stresses (change of initial unstressed shape due to
greater particle vibrations).
What is then the influence of temperature on the strength of the part?
The answer lays in temperature gradients. Imagine that one component has different temperatures across its length, then each
fragment of this part needs to expand proportionally to its temperature, which means adjacent fragments need to expand to
different extents to meet its unstrained state. This brings conflict between adjacent fragments, since they are bounded by crystal
structure and must come to compromise regarding expansion, which in fact induce strains and stresses. Huge temperature
gradients induce proportionally huge stresses, which may be a crucial loading condition for a component’s strength.
Coupled thermal structural analysis is done in the following fashion. Heat transfer analysis is performed first to determine the
temperature field of the structure. The temperature field is used as part of the loading for structural analysis. A single finite
element mesh is usually used for both thermal and structural analysis. The finite element governing equation for static structural
analysis is:
[𝑲𝑲]{𝑫𝑫} = {𝒇𝒇} + {𝒇𝒇𝑻𝑻}

Where:
[K] is the global stiffness matrix
{D} is the unknown displacement vector
{fT} is temperature loading
{f} is structural loading such as forces, pressures, etc.
The setup for such analysis involves creation of two load steps, linear steady-state thermal and linear static structural. Which
means loading & BCs for both subcases are created simultaneously, sorted into appropriate load collectors and referred in their
subcases (thermal SPC and loading load collectors are referred by thermal subcase and structural SPC and loading load
collectors are referred by linear static subcase).
The only difference is that structural (linear static) subcase needs reference to thermal subcase by checking TEMP_LOAD
subcase option and referring SUBCASEID in the field TEMP.
Remember: Material setup for a coupled thermal-structural analysis is set via MAT1 card image with MAT4 extension checked and
filled with thermal properties! For more information, please refer to Thermal Materials chapter.
8.2.1. Tutorial: Coupled Linear Heat Transfer/Structure Analysis
A coupled heat transfer/structure analysis on a steel pipe is performed in this tutorial. As shown in the figure below, the pipe is
fixed on the ground at one end and the heat flux is applied on the other end. A linear steady state heat conduction solution is
defined first. Then it is referred by a structure solution by TEMP to perform the coupled thermal/structural analysis. The problem is
defined in HyperMesh and solved with OptiStruct implicit solver. The heat transfer and structure results are post processed in
HyperView.
Open the pipe.fem file (Download required model file from the folder)

1. In the Model Browser, right-click and select Create > Material.
A default MAT1 material displays in the Entity Editor.
2. For Name, enter steel.
3. Click the box next to MAT4.
4. The MAT4 card image appears below MAT1 in the material information area. The MAT1 card defines the isotropic
structural material. MAT4 card is for the constant thermal material. MAT4 uses the same material ID as MAT1.
5. Enter the following values for the material, steel, in the Entity Editor.
Step 2: Create the Property

1. In the Model Browser, right-click and select Create > Property.
A default PSHELL property displays in the Entity Editor.
2. For Name, enter solid.
3. For Material, click Unspecified > Material.
4. In the Select Material dialog, select steel and click OK.
5. For Card Image, select PSOLID from the drop-down menu and click Yes to confirm.
The property of the solid steel pipe has been created as 3D PSOLID. Material information is linked to this property.
Once the material and property are defined, they need to be linked to the structure.
1. In the Model Browser, click on the pipe component.
The component template displays in the Entity Editor.
2. For Property, click Unspecified > Property.
3. In the Select Property dialog, select solid and click OK.

A structural constraint spc_struct is applied on the RBE2 element to fix the pipe on the ground. Two empty load collectors,
spc_heat and heat_flux have been precreated. In this section, the thermal boundary conditions and heat flux are applied on the
model and saved in spc_heat and heat_flux, respectively
Creating Thermal Constraints

1. Click the Set Current Load Collector panel located at the right corner of the footer bar, as shown below.
A list of load collectors appears.
2. Select spc_heat as the current load collector.
3. From the Analysis page, click constraints.
5. Click the entity selection switch and select nodes from the pop-up menu.
6. Click nodes >> by sets.
7. Select the predefined entity set heat and click select.
8. The selected nodes on the fixed end should be highlighted.
9. Uncheck the boxes in front of dof1, dof2, dof3, dof4, dof5, and dof6 and enter 0.0 in the entry fields.
10. Click load types = and select SPC from the pop-up list.
11. Click create/edit, make sure D = 0.0. Click return
12. This applies these thermal constraints to the selected nodal set.
13. Click return to go to the Analysis page.
Creating CHBDYE Surface Elements

The heat flux will be applied on the surface of the free end of the pipe. Therefore, the surface elements CHBDYE for defining heat
transfer boundaries must be created first.
1. Click BCs > Create > Interfaces.
2. For Name, enter heat_surf.
3. For Type, select CONDUCTION from the drop-down menu.
4. Select an appropriate color from the palette.
5. For Slave Entity IDs, click Elements.
6. The Slave Entity IDs panel is now displayed below the Graphics browser.
7. The upper option should be set to “add solid faces”.
8. Click the switch button for elems and select faces from the pop-up list.
9. Click the highlighted solid elems and select by sets from the pop-up selection menu.
10. Select element set solid elems and click select.
11. Click nodes in the face nodes field.
12. Select four nodes on one face of a solid element where the heat flux is applied
13. Click add.
14. This adds the CHBDYE surface elements on all the solid elements following the same side convention,
15. Click return to return to the Entity Editor.
16. Click Close.
Creating Heat Flux on Surface Elements

In this step, the uniform heat flux into CHBDYE elements is defined with QBDY1 entries.
1. Set your current load collector to heat_flux.
2. From the Analysis page, click flux to enter the Flux panel.
4. Click elems >> by group.
5. Select heat_surf and click select.
6. The surface elements are highlighted.
7. Click load types= and select QBDY1.
8. In the value= field, enter 1.0.
9. Click create.
10. The uniform heat flux in the surface elements is defined.
11. Click return to go back to Analysis page.
Step 5: Creating Load Step and Output request

Creating Heat Transfer loadstep and request outputs
1. 1. In the Model Browser, right-click and select Create > Load Step.
2. A default load step displays in the Entity Editor.
3. For Name, enter heat_transfer.
4. Verify that the Analysis type is set to Heat Transfer (Steady State), define subcase definition as per below screenshot
and click on create.
5. Enter the control cards panel on the Analysis page. Navigate to the second page and enter the
GLOBAL_OUTPUT_REQUEST.
6. Activate the check box for THERMAL, setting FORMAT (1) to H3D and OPTION (1) to ALL.
7. Activate the check box for FLUX, setting FORMAT (1) to H3D and OPTION (1) to ALL.
8. Exit the control cards panel.
Create a new loadcase for Thermal Structural Coupling and Request Outputs
1. Right-click in the Model Browser and select Create > Load step.
2. Set the Analysis type to Linear Static and set the other values as shown:
3. Enter the control cards panel on the Analysis page. Navigate to the second page and enter the
GLOBAL_OUTPUT_REQUEST.
4. Activate the check box for DISPLACEMENT, setting FORMAT (1) to H3D and OPTION (1) to ALL.
5. Activate the check box for STRESS, setting FORMAT (1) to H3D and OPTION (1) to ALL.
6. Exit the control cards panel.
8.3. Nonlinear Steady State Heat Transfer Analysis
This type of analysis is used when the material nonlinearity is present, that means temperature dependent conductivity or
thermal loading and BCs vary with time. As mentioned previously, temperature dependent conductivity is defined in MATT4/5
(extension to MAT4/5 material card). Tabular data is entered in TABLEMi load collector. Equation of motion is in this case modified
as follows:
([𝑲𝑲𝒄𝒄 (𝑻𝑻)] + [𝑯𝑯]){𝑻𝑻} = {𝑷𝑷𝑩𝑩 } + {𝑷𝑷𝑯𝑯 } + {𝑷𝑷𝑸𝑸 }
Where:
[Kc(T)] – temperature dependent conductivity matrix
[H] – boundary convection matrix due to free convection
{T} – unknown nodal temperature
{PB} is power due to heat flux at boundary specified by QBDY1 card
{PH} is boundary convection vector due to convection specified by CONV card
{PQ} is power vector due to internal heat generation specified by QVOL card.
The following steps are a guide to setup a Nonlinear Steady-State Heat Transfer Analysis.
7. Use the solution sequence identifier (ANALYSIS) in the Subcase Information
8. Entry section to select the nonlinear steady-state heat transfer analysis using: ANALYSIS=NLHEAT.
9. The likely initial temperature distribution can be defined using the TEMPERATURE Subcase Information Entry
(type=INITIAL). A good initial temperature estimate improves the convergence of the solver.
10. The MATT4 Bulk Data Entry can be used to define temperature dependent thermal material properties.
11. To indicate that a nonlinear solution is required for any subcase, a NLPARM Subcase Information Entry is required.
This subcase entry points to a NLPARM Bulk Data Entry that specifies convergence tolerances and other nonlinear
parameters.
12. Loads and boundary conditions are defined in the Bulk Data Entry section of the input deck. These should be
referenced in the Subcase Information Entry section using SPC and LOAD entries in a subcase. Each Subcase defines
a load vector.
8.3.1. Tutorial: Nonlinear Steady State Heat Transfer Analysis
Consider a beam in the figure below, which is built from three different materials. The first segment is 100 mm in length and it is
made from steel (K = 60.5 W/m.°C). The second one is made from copper (K = 401 W/m.°C) and it is 250 mm in length. The last
segment is made from aluminium and it is 50 mm in length. Aluminium conductivity is nonlinear as presented in the following
table:
Bar cross section is constant, with an area equal to 625 mm². On the steel side (left free end), temperature is constant, and it is
equal to 200 °C, while on the other side, on the aluminium free end, a convection condition is introduced, with convection
coefficient equals to 100 W/m². The room temperature is assumed to be 20 °C. The external faces are thermal isolated so that
conduction occurs only in the longitudinal direction.
Open NLHEAT_Model.hm file (Download required model file from the folder)

Create Material Nonlinear Properties Table
1. Right click on the model browser to create a new Load Collector.
2. Enter Aluminium as a name and TABLEM1 as a Card Image.
3. Enter the value 3 on TABLEM1_NUM field.
4. Click on Data x, y to enter the material data as the picture below.
5. Click Close.
Create Material card for Steel, Copper and Aluminium

1. Right click on the model browser to create a new Material.
2. Enter Steel as a name and MAT4 as a Card Image.
3. Click on [K] and insert 60.5 on this field.
4. This field is the thermal conductivity [W/m.°C] of the material.
5. Repeat the steps 1 to 3 with the name Copper and use [K] as 401.
6. Repeat the steps 1 to 3 with the name Aluminium and use [K] as 1.
7. Only for Aluminium, click on [H] and enter 100 as a value.
8. This field is the convection heat transfer coefficient [W/m²°C] of the material.
9. Check the check box to active the MATT4 field.
10. Under the T(K) select the Load Collector Aluminium to indicate the nonlinear thermal conductivity properties of the
material.
11. Click OK
Step 2: Creating the Properties

1. Right click on the model browser to create a new Property.
2. Enter Steel as a name and PSOLID as a Card Image.
3. Repeat steps 1 and 2 for the property Copper and Aluminium.
Step 3: Assign the material and property

1. Left click on the Steel Component.
2. Under Property enter the Steel Property created on the Step 2.
3. Under Material enter the Steel Material created on the Step 1.
4. Repeat the steps 1 to 3 for the component Copper and Aluminium.

Room Temperature Constraints
2. Name it as SPC_HEAT and leave Card Image as None.
3. Make sure the load collector SPC_HEAT is the current one.
4. From the Analysis page, click on the constraints panel.
5. Deselect all DOFs and click on the free node (id = 2917).
6. Select SPC as the load type.
7. Click Create and Return.
8. Click on (Card Edit), change to loads option and configuration const.
9. Select the Constraint created on the step 1-4.
10. Click edit.
11. Active D and enter 20 as room temperature constraint.
12. Click Return twice.
Steel Side Temperature Constraints

1. From Analysis page, click on the constraints panel.
Make sure the load collector SPC_HEAT is the current one.
2. Deselect all DOFs and select all the nodes on the free side (left free end) of the steel component.
3. Select SPC as the load type.
4. Click Create and Return.
5. Click on (Card Edit), change to loads option and configuration const.
6. Select all the Constraints created on this step.
7. Click edit.
8. Active D and enter 200 as the steel side constraint temperature.
9. Click on Return twice.
Create Convection Condition

1. From Analysis page, click on the interfaces panel.
2. Enter Convec on the name field and select type CONVECTION.
3. Click on create/edit.
4. Click on MID to select Aluminium as the material properties.
5. Click return.
6. On the add page select face option for the slave surface.
7. To select the free Aluminium face, select all the elements on the component Aluminium.
8. On the face nodes, select all the nodes on the Aluminium free end side.
9. Click on add and return.
Define the Convection Boundary Condition to Surface Elements

1. Click on (Card Edit) button.
2. Change to element entry.
3. Click elems and select by group.
4. Check the check box button near the CONVEC group and click select.
5. Select Config = Slave 4 and Type = CHBDYE4.
6. Click on edit.
7. Check the check box button CONV under the Card Image Panel.
8. Select TA1 to select the room temperature constraint node (id = 2917) as show below.
Create Nonlinear Parameter Load Collector

2. Enter NLPARM as a name and Card Image NLPARM.
3. Let all the parameters as the default values.
Step 5: Creating Loadsteps and Output request

1. From the Analysis page, click on the Loadsteps panel.
2. Give the name NLHEAT for this analysis.
3. Enter Type as NLHEAT.
4. Check the SPC check box button and enter the Load Collector SPC_HEAT.
5. Check the NLPARM check box button and enter the Load Collector NLPARM.
6. Click Create.
Output Request
1. From the Analysis page, click on the control card panel.
2. Select GLOBAL_OUTPUT_REQUEST.
3. Check FLUX and THERMAL check boxes button to request these outputs in H3d format.
Step 6: Run the analysis.
9. Transient Heat Transfer Analysis

For a Transient heat transfer analysis, the temperature distribution and heat flow within the model are dependent on time.
Transient heat transfer analysis can further be categorized in to two types named below:
Linear Transient Heat Transfer Analysis
Nonlinear Transient Heat Transfer Analysis

• Extended Surface fin – description and model download link in chapter 9.4 – Linear Transient Heat Transfer Analysis
• Manifold – description and model download link in chapter 9.7 – Nonlinear Transient Heat Transfer Analysis
9.1. Linear Transient Heat Transfer Analysis
As in a steady-state thermal analysis we are looking for thermal equilibrium of a system, that may be reached after a certain
amount of time and the output is a time-independent state of a system, in transient thermal analysis we are investigating the
response of a system to thermal loading within a specified period of time after this thermal loading started acting on the system.
This is a dynamic analysis which may be loaded by time-dependent or -independent thermal loads. The equilibrium equation looks
as follows:
[𝑪𝑪]{𝑻𝑻̇} + ([𝑲𝑲𝒄𝒄 ] + [𝑯𝑯]){𝑻𝑻} = {𝑷𝑷𝑩𝑩 } + {𝑷𝑷𝑯𝑯 } + {𝑷𝑷𝑸𝑸 }
Where:
[C] is the heat capacity matrix which is defined in MAT4/MAT5

[Kc] is the conductivity matrix
[H] is the boundary convection matrix due to free convection
{𝑻𝑻̇}is the temperature derivative with respect to time. Term [C]{ 𝑻𝑻̇} captures the transient nature of the analysis
{T} is the unknown nodal temperature
{Px} are the thermal loading vectors
Please note that since this is a linear type of analysis, constant thermal conductivity is used. The difference between steady-state
analysis and transient analysis is the presence of [C]{𝑇𝑇´} part in the equation, which indicates the transient nature of the analysis.
Steady-State Vs Transient
Steady-State Transient
Calculates the effects of steady thermal loads on a Calculates thermal quantities such as temperature that
system vary over a period of time
Input would be thermal loads that do not vary over a Typically use temperatures from transient thermal
period of time analysis as input to structural analysis
Applications include nozzles, pressure vessels, engine

Typically performed before doing a transient analysis
block
It is supported in OptiStruct It is supported in OptiStruct
Transient analysis setup

Linear Transient Thermal Analysis is set up using analysis type Heat Transfer (Transient) in the load step definition. The
parameters that need to be defined are very similar to ones for structural transient analysis, except the loading and boundary
conditions are not of structural kind, but thermal. Following parameters need to be defined:
• Time stepping (TSTEP)
Since time plays a role in the transient type of analysis, user must specify the time stepping for increments and therefore overall
time of simulation. This is done by creating a load collector:
1. Create a load collector with card image TSTEP
2. Define TSTEP_NUM =, the number of lines in the TSTEP table.
3. Set N and DT, where DT is a time step size (in an appropriate time unit) and N is a number of time steps with size DT.
4. NOTE: As you can see, if you need to define different time step sizes, you must enter an appropriate number of lines,
so that each line will contain different DT values.
5. NOTE: You can also specify the skip factor NO, to define which time steps should be used in output file for results. It
can be achieved via card edit panel (right click onto load collector in model browser -> card edit). This might help
decreasing the computing time.
6. Refer the TSTEP load collector in TSTEP subcase entry in Heat Transfer (Transient) load step.
• Initial Conditions (IC)
Please take a look at chapter: 4.5 Time-dependent thermal loading.
• Loading (DLOAD)
As mentioned in previous chapters, DLOAD subcase entry is used to refer to TLOAD or DLOAD load collector.
• Boundary Conditions (SPC or MPC)
Reference to thermal boundary conditions load collector.
9.1.1. Tutorial: Linear Transient Heat Transfer Analysis
This is the NAFEMS test problem T3 for transient heat transfer analysis. OptiStruct examines the material temperature at point C,
0.08m from point A and the total simulation time is 40 seconds.
Quad4 elements are used to build the model with 10 elements. At time t=0, all temperature = zero and at time t>0, at one end
temperature is zero and at the other end temperature is 100 sin(ϖt/40) °C. There is no heat flux perpendicular to the length of the
beam. Model: Beam linear transient.hm (Download required model file from the folder)
Material properties
Conductivity = 35 W/m°C
Specific Heat = 440.5 J/kg °C
Density = 7200 kg/m3

1. In the Model Browser, right-click and select Create > Material from the context menu. A default material displays in the
Entity Editor.
2. For Name, enter Mat.
3. Set the Card Image set to MAT4
4. Enter the material values next to the corresponding fields.
K = 35.0 W/m°C
Rho = 7200 Kg/m3
Cp = 440.5 J/Kg °C
A new material, Mat, has been created. The material uses OptiStruct linear isotropic thermal material model, MAT4.
Step 2: Creating the Properties

1. In the Model Browser, right-click and select Create > Property from the context menu.
2. A default property displays in the Entity Editor.
3. For Name, enter PSHELL.
4. For Card Image select PSHELL, as the component is made of shell elements
5. For thickness enter value of T = 0.01
6. Also select the material as Mat.

Assign the material and property to T3_Quad4_Fine component. This can be done by a right click on the component and select
Assign. From the pop-up menu select the PSHELL property.
Step 4: Applying Transient Thermal Boundary Conditions

Creating Transient Heat Transfer Analysis Time Steps
A transient analysis captures the behaviour of the system over a specific period of time. Therefore, a time period of interest for
your system is defined. A time period of 40 seconds is defined with results output every 0.4 seconds. A load collector is created
for this purpose and the TSTEP entry is referenced, as shown below.
1. In the Model Browser, right-click and select Create > Load Collector.
2. For Name, enter Time Steps.
3. For Card Image, select TSTEP.
4. For TSTEP_NUM, enter a value of 1.
5. Click and enter the number of time steps (N) = 100 and set each time increment (DT) to 0.4.
This encompasses a total time period of 40 seconds in which to capture the behaviour of the system. 6. Click Close.
Creating Transient Heat Transfer Analysis Initial Conditions

Since the temperature profile of the system varies over time, the initial grid point temperature profile must be set to specify the
starting point for the analysis. You assume that the temperature of the entire system is equal to .0001°C, at T=0 seconds, the
TEMPD bulk data entry sets the initial temperatures
2. For Name, enter Initial Conditions.
3. For Card Image, select TEMPD.
4. For T1, enter a value of 0.0001
Creating a Time-variant Temperature

1. Create load collector named SPCD, and for Card Image, select None.
2. The newly created SPCD load collector is the current load collector (look at the right bottom corner of the screen to
verify that SPCD is displayed).
3. If the SPCD load collector is not specified, right-click SPCD in the Model Browser and click Make Current.
4. Next, create the amplitude (constant part) of the time variant temperature using an SPCD data entry. Click BCs >
Create > Constraints.
5. The temperature is set by using the SPCD data entry to control an existing node outside the actual structure. In the
Constraints panel, click nodes > by id, enter 3,2 in the id= field and press Enter.
6. The ambient node is highlighted in the Entity Editor above the structure.
7. Enter 10.0 in the size= field and uncheck the boxes beside all the degrees of freedom (dof1 through dof6) and enter 0.0
in all the fields next to the dof#.
8. For load types =, select SPCD.
9. Creating an SPCD entry to control the temperature.
10. Click create/edit and enter 1.0 in the D field on the SPCD data entry.
11. This creates an SPCD referencing the ambient node specifying a temperature of 1°C.
12. Click return twice to go back to the Analysis page.
The time variable nature of the temperature can be captured using a TABLED1 entry also referenced by the TLOAD1
data.
1. Create a new load collector named TABLED and set the Card Image as TABLED1.
2. For TABLED1_NUM, enter 6 and press Enter.
3. In the table, enter data as per below screenshot.
4. Click Close.
A time variable ambient temperature can be created by referencing an SPCD entry via a TLOAD1 data entry.
2. For Name, enter TLOAD.
3. For Card Image, select TLOAD1.
4. For EXCITEID, select the SPCD load collector from the menu.
5. For TYPE, select DISP, then click TID and select the Tabled load collector menu.
6. Create a new load collector named SPC TEMP and for Card Image, select None.
Create temperature with load type set as SPC on node id 2,3 and define value as 0.0
(BCs > Create > Temperature)
Step 5: Creating a Transient Heat Transfer Load Step

An OptiStruct transient heat transfer loadstep is created which references the time steps in the load collector Time Steps, the
initial conditions in the load collector Initial Conditions, DLOAD in the TLOAD, and the SPC boundary condition in the load
collector SPC TEMP.
Output Request
1. From the Analysis page, click on the control card panel.
2. Select GLOBAL_OUTPUT_REQUEST.
3. Check FLUX and THERMAL check boxes button to request these outputs in H3d format.
9.2. One Step Transient Thermal Stress Analysis
Like in steady-state coupled thermal-structural analysis, we can “merge” a transient thermal analysis with a static subcase.
However, in this case it is called a “One-Step” analysis, which is because transient analysis generates a temperature field for each
time step, which in fact makes it possible to apply temperature field at each time step to the static subcase – as a result solution is
presented as a simultaneous interaction between thermal and structural states. But since the structural load step is not transient,
i.e., it can be either linear static or nonlinear static, OptiStruct splits the static subcase into a number of small static subcases equal
to the number of time steps, during which temperature field was calculated. However, from a solver’s point of view, the transient
thermal analysis is done first and the entire temperature field history is applied to static subcase.
One step transient thermal stress analysis can be performed with:

• Linear static subcases
• Nonlinear static subcases

• Exhaust Manifold – description and model download link in chapter 9.6 – Linear One-Step Transient Thermal Stress
Analysis
• Aluminum Bar – description and model download link in chapter 9.5 – Nonlinear One-Step Transient Thermal Stress
Analysis
A setup for OSTTS analysis is analogous to the sequentially coupled thermal analysis with one addition: while referring the thermal
subcase in structural subcase entry
under TEMP_LOAD, user needs to additionally check HTIME keyword, to select time steps from the transient thermal analysis.
OSTTS may take long computing time and generate large result files. It is recommended to use skip factor in TSTEP to write
temperature result at a limited number of time steps, especially for nonlinear OSTTS.
EXAMPLE:
Problem description:
• Time dependent flux input QBDY1 referred by TLOAD1; imposed temperatures; IC=0
• Stress analysis boundary conditions: fixed at both ends
• TEMP (LOAD/BOTH, HTIME=ALL)
Temperature history and peak stress history from OSTTS are shown in the image. The peak temperature is 43.27 degrees Celsius
at 145 seconds, while the stress peak is 42.35 Mpa at 165 seconds. Note that the peak stress is not required to occur at the same
time as the peak temperature or at the initial or final time step. This illustrates that OSTTS is useful in capturing the stress peak
over the duration of the transient analysis.
9.2.1. Tutorial: One-Step Transient Thermal Stress Analysis
This exercise covers step by step process of One-Step Transient Thermal Stress (OSTTS) Analysis. Heating of Pipe from free
convection of variable ambient temperature at external surface (373K*scale factor). Fixed boundary condition on both ends.
Model: Pipe linear one step transient.hm (Download required model file from the folder)
Step 2: Create the Properties

1. Right click on the model browser to create a new Property.
2. Enter psolids as a name and PSOLID as a Card Image.
Step 3: Assign the material and property to component

Once the material and property are defined, they need to be linked to the structure.
1. In the Model Browser, click on the pipe component.
The component template displays in the Entity Editor.
2. For Property, click Unspecified > Property.
3. In the Select Property dialog, select psolids and click OK.
Step 4: Applying Transient Thermal Boundary Conditions

1. Create a new load collector named TABLED1 and set the Card Image as TABLED1.
2. For TABLED1_NUM, enter 4 and press Enter.
3. In the table, enter data as per below screenshot.
4. Click Close.
Creating Transient Heat Transfer Analysis Initial Conditions

6. For Name, enter Initial Conditions.
7. For Card Image, select TEMPD.
8. For T1, enter a value of 373.0
Creating Transient Heat Transfer Analysis Time Steps

2. For Name, enter Time Steps.
3. For Card Image, select TSTEP.
4. For TSTEP_NUM, enter a value of 1.
5. Click and enter the number of time steps (N) = 100 and set each time increment (DT) to 1
This encompasses a total time period of 100 seconds in which to capture the behaviour of the system.
6. Click Close.
Creating a Time-variant Temperature

1. Create load collector named SPCD, and for Card Image, select None.
2. Next, create the amplitude (constant part) of the time variant temperature using an SPCD data entry. Click BCs > Create
> Constraints.
3. The temperature is set by using the SPCD data entry to control an existing node outside the actual structure. In the
Constraints panel, click nodes > by id, enter 18472 in the id= field and press Enter.
4. The ambient node is highlighted in the Entity Editor above the structure.
5. Enter 10.0 in the size= field and uncheck the boxes beside all the degrees of freedom (dof1 through dof6) and enter 0.0
in all the fields next to the dof#.
6. For load types =, select SPCD.
7. Creating an SPCD entry to control the temperature.
8. Click create/edit and enter 373 in the D field on the SPCD data entry.
9. This creates an SPCD referencing the ambient node specifying a temperature of 373K.
A time variable temperature can be created by referencing an SPCD entry via a TLOAD1 data entry.
2. For Name, enter TLOAD.
3. For Card Image, select TLOAD1.
4. For EXCITEID, select the SPCD load collector from the menu.
5. For TYPE, select DISP, then click TID and select the TABLED1 load collector menu.
6. Create a new load collector named SPC TEMP and for Card Image, select None.
Create temperature load load type set as SPC on node id 18472 and define value as 0.0 (BCs > Create > Temperature)
Create a free convection interface

1. Go to BCs > Create > Interfaces
2. Create a Conv interface with card image CONVECTION and reference to Mat material:
3. Choose Slave elements by clicking on “0 Elements”. A panel for element selection will pop up. Use option “Add solid
faces” to select the external surface of the pipe. Click “Add”
4. Click “close”.
5. Now we need to edit Card image of the newly created CHBDYE4 elements. Click “Card Edit” button . Switch the
selector to “elems” and select “by group” > Conv. This will select all thermal interface elements. For “config=” choose
slave4 and for “type =” select CHBDYE4. Click “Edit”
6. Check option next to CONV on the bottom and edit TA1 field to choose a node id 18472.
7. Click return two times.
Create constraints for structural case

8. Create a new load collector named SPC Struct and for Card Image, select None.
9. Make sure that the newly created load collector SPC Struct is current and click BCs > Create > Constraints and click
nodes in the Constraints panel.
10. Select corner nodes of the tube end
11. Enter 5.0 in the size= field and check the boxes beside all the degrees of freedom (dof1 through dof6) and enter 0.0 in
all the fields next to the dof#.
12. For load types =, select SPC.
Step 5: Creating Load Step and Output request
Creating Heat Transfer loadstep and request outputs

1. In the Model Browser, right-click and select Create > Load Step.
A default load step displays in the Entity Editor.
2. For Name, enter heat.
3. Verify that the Analysis type is set to HEAT transfer (transient), define subcase definition as per below screenshot and
subcase options set for output as Thermal/Flux> Option set to All> FORMAT set to H3d and click on create.
Create a new loadcase for One step transient thermal analysis and request outputs
1. Right-click in the Model Browser and select Create > Load step.
2. Set the Analysis type to Linear Static and subcase option as shown below:
Output of displacement and stress for Structure subcase generated default.
9.3. Nonlinear Transient Heat Transfer Analysis
Calculate the temperature distribution in a system with respect to time.
The applied thermal loads can either be time-dependent or time-invariant; transient thermal analysis is used to capture the
thermal behaviour of a system over a specific period of time.
The basic finite element equation for transient heat transfer analysis is given by:
C˙T+F(K)+[H]T=PCT˙+F(K)+[H]T=P
C is the heat capacity matrix,
F(K) is the internal power, due to temperature-dependent conductivity(K),
H is the boundary convection matrix, due to free convection,
T˙ is the derivative of the nodal temperature matrix with respect to time,
T is the unknown nodal temperature matrix, and
P is the thermal loading vector.
When the conductivity matrix becomes temperature dependent, then it is nonlinear transient heat transfer analysis
10. Contact-Based Thermal Analysis
In OptiStruct, structural models involving contact are solved by using Small Displacement Nonlinear Analysis.
The analysis involves finding the contact status, such as contact clearance and pressure. Contact clearance spans the distance
between the master and slave, while contact pressure is developed between two surfaces in contact.
Contact-Based Thermal Analysis may be required when heat transfer occurs on the boundary of two solid parts. In reality, thermal
behaviour in the area of contact is not that straight forward, therefore OptiStruct allows quite a comprehensive setup of contact
thermal properties.
The traditional thermal structural analysis is one-way coupling, in the sense that thermal analysis influences structural analysis by
providing temperature, but structural problem does not affect the thermal problem.
Figure 1
When contact problems are involved, thermal structural analysis becomes fully coupled since contact status changes thermal
conductance.
Figure 2
In Figure 1, you can see that a change in contact status does not affect the thermal problem. This may lead to inaccurate
solutions if thermal conductance depends on the contact status. In Figure 2, the contact clearance and/or pressure changes
during the course of the quasi-static nonlinear analysis, the corresponding change in the thermal conductance will affect the
solution of the thermal problem.
Contact-Based Thermal-Structural Analysis is mostly about contact-dependent conductance, which can change due to:
• Contact status change
• Contact pressure change
• Contact clearance change
This property of a contact interface is described in detail in this chapter.
10.1. Iterative Solver
Since the analysis is fully coupled, it needs constant exchange of information between thermal and structural subcases. Therefore,
OptiStruct needs to iterate the process of sequentially performed thermal and structural subcases until a certain level of
convergence is achieved, i.e., thermal results of a certain iteration will not be too much different than the ones from thermal
analysis from previous iteration, before contact status update. i.e., provided the contact status update is little enough.
The solver’s procedure is presented below:
Thermal analysis is performed first using initial contact status. Nonlinear structural analysis is employed to find contact status.
Thermal conductance at the contact interface is calculated based on contact clearance or pressure or based on user-defined
values. Coupling is essential because the contact status is used to determine thermal conductance. Temperature results from
thermal analysis are used as convergence criteria.
10.2. Thermal Contact Properties
In OptiStruct, structural models involving contact are solved by using Small Displacement Nonlinear Analysis. The analysis involves
finding the contact status, such as contact clearance and pressure. Contact clearance spans the distance between the master and
slave, while contact pressure is developed between two surfaces in contact.
Thermal (Area-Based) Conductivity for contacts is defined in the following ways:
• For thermal contact problems with CGAP/CGAPG, PGAPHT is required. The PGAPHT entry should have the same PID
as PGAP. For problems with CONTACT and PCONT, the PCONTHT entry should be used and it requires the same PID
as PCONT.
• For contacts without PCONT property, i.e., contacts of type SLIDE, STICK, FREEZE the thermal conductivity is
automatically evaluated based on contacting elements thermal conductivity, that means 100% conductivity is available
when contact status is closed and 0% conductivity when the contact status is open. This will mean that FREEZE contact
provides constantly full conductivity and therefore iterative procedure will converge immediately.
• When PCONT property is used, activation of PCONTHT field must be done:
KC_opts checked sets it to AUTO mode. This option will behave exactly the same as described in the previous point. Also,
without KC_opts checked, a real value for conductivity can be specified for closed status (KCHTC). KOHTC (conductivity for
open contact) is set by default to 10e-14 KCHTC.
Also, user can specify tabular data for both pressure- and clearance-dependent thermal conductivity. They will be referred in TPID
and TCID entries in PCONTHT (see above).
Theoretically, while higher conductance values enforce a perfect conductor, excessively high values may cause poor conditioning
of the conductivity matrix. If such effects are observed, it may be beneficial to reduce the value of conductance, or use
conductance-based contact clearance and pressure.
NOTE ABOUT THE UNITS:

The units are not the same as for thermal conductivity in material properties! They are actually the same as for Heat Transfer
Coefficient (H) - exemplary units: W/m²K, generally: rate of heat transfer per unit area per unit degree of temperature)
Pressure based thermal conductance

When parts are in contact, heat transfer efficiency can be influenced by the contact pressure.
The pressure-based conductance values can be specified one the TABLED# entries. The typical conductivity values vary as
follows:
Clearance based thermal conductance

When parts in contact are separating from each other, transfer efficiency is directly related to the separation distance
• The clearance-based conductance per unit contact area can be specified through the TABLEDi entries (which should start
from zero clearance). Conductance is linearly interpolated within the range on the TABLEDi entry. It is extrapolated to zero
outside the range (TCID in PCONTHT).
• KCHTC=AUTO determines the value of KCHTC for each contact element using the contact HTC values of surrounding
elements.
Clearance and pressure based thermal conductance

Both clearance- and pressure-dependent thermal conductances can be set and referred in TCID and TPID entries.
Typical thermal conductance values increase as the clearance between the master and slave decreases. In the case of contact
pressure, the thermal conductance increases with a corresponding increase in pressure.
Thermal Bulk Data Cards: PCONTHT Parameters

The PCONTHT card defines heat conductance per unit area (also called heat transfer coefficient) for CONTACT elements
(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)
PCONTHT PID KCHTC KOHTC TPID TCID
Where:
Property identification number. Must match with a PID of a PCONT

PID
bulk data entry.
KCHTC Contact Heat Transfer Coefficient (HTC) for the closed contact.
KOHTC Contact Heat Transfer Coefficient (HTC) for the open contact.
Identification number of a TABLEDi entry which specifies Contact HTC

TPID
based on contact pressure
Identification number of a TABLEDi entry which specifies Contact HTC

TCID
based on contact clearance
Tip: PCONTHT is not supported for surface-to-surface contact (DISCRET=S2S on
CONTACT/TIE)
Tip: For CONTACT interfaces without PCONT, PCONTHT is not required. Thermal Contact HTC values based on
KCHTC=AUTO will be utilized in such cases.
Thermal Bulk Data Cards: PGAPHT Parameters

The PGAPHT card defines heat transfer conduction properties for CGAP or CGAPG elements for heat transfer analysis by linking
to the existing PGAP card for those elements.
(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)
PGAPHT PID KAHT KBHT TCID
Where:
PID Property identification number of an existing PGAP bulk data entry.
KAHT Thermal conductance of the gap when closed
KBHT Thermal conductance of the gap when open
Identification number of a TABLEDi entry which specifies the gap

TCID
conductance based upon gap clearance
10.3. Thermal Contact without Static Analysis
Pure heat transfer analysis with thermal contact is solved based on initial contact status. Contact clearance and area are
calculated based on geometry.
KAHT, KBHT and TCID on PGAPHT Bulk Data Entry and KCHTC, KOHTC and TCID on PCONTHT Bulk Data Entry can be
used. Contact pressure is not available without static analysis. Therefore, TPID cannot be used in such a scenario.
10.4. Contact-Based Thermal-Structural Analysis Setup
Like in Coupled Thermal-Structural Analysis a reference to thermal subcase in structural subcase is done, in contact-based thermal
analysis a thermal subcase must also have a reference to a structural subcase:
• STATSUB(STRUCT) is used in thermal subcase entry to refer to structural subcase
• TEMP_LOAD subcase option is used in structural subcase to refer to thermal subcase
10.5. Tutorial: Setting up Thermal Contacts for the Bolted Pipe Flange Model
This tutorial introduces the user to using HyperMesh Desktop to set up a fully-coupled thermomechanical analysis on a pipe
support loaded by a pair of pipes. The model is a mixture of solid elements and 1-dimensional supports with a small number of
SPCs already defined. The pipes will be modelled as Polyamide and the pipe support will be set up as nylon. Contact will be the
primary mode of thermal transfer.
(Download required model file from the folder)
Step 1: Open the model ThermoMechanical_Coupling.hm in HyperMesh Desktop
Step 2: Create a new TABLEM1 load collector to hold the thermal/modulus curve
Step 3: Create the materials for each of the components
NOTE: MATT1 extension has been used here to define temperature-dependent stiffness for Nylon material, note that MATT1
entry is analogic to the MATT4 extension in MAT4 card image.
Step 4: Create PSOLID properties for the pipe support and the pipes
Step 5: Assign the PSOLID properties to their respective components
Step 6: Create a PBUSH property, setup stiffness values as below and assign it to Extremities_Block component:
Step 7: Create contact surfaces for the pipe support and the tube exteriors in the vicinity of the pipe support
Tip: Remember that the contact surfaces must point toward each other for the contact to be set up correctly.
Step 8: Create two new TABLED1 load collectors to support the contact definition for clearance and pressure-based analysis
Step 9: Create a new contact property which details the parameters for fully coupled heat transfer contact
Step 10: Create a new contact using the contact surfaces for pipes and support and the contact property
Step 11: Create a new load collector named SPC_Thermal
Step 12: Create a new SPC on a free node at {-20,0,200} for cold convection and set the SPC to 5 degrees
Step 13: Create a new SPC on a free node at {20,0,200} for hot convection and set the SPC to 75 degrees
Step 14: Create a new set of CHBDYE convection elements the interior surface of the Tube_Cold component and edit the
elements in the group to reference the cold convection node (card edit the elems of config= slave4 and type= CHBDYE4, you can
select them using “by group” selection, add the ambient node in TA1 field).
Step 15: Create a new set of CHBDYE convection elements the interior surface of the Tube_Hot component and edit the
elements in the group to reference the hot convection node (card edit the elems of config= slave4 and type= CHBDYE4, you can
select them using “by group” selection, add the ambient node in TA1 field)
Step 16: Create a nonlinear parameter load collector to drive the structural nonlinear simulation
Step 17: Create the load steps for thermal analysis with mechanical input, mechanical analysis with thermal loading, and thermal
only analysis
Tip: For Thermal analysis with mechanical STATSUB, enable all FLUX and THERMAL outputs. Also, since the thermal analysis
above references the mechanical analysis load step and vice versa, both subcases have to be created before the mechanical
subcase is linked to the thermal load case.
Step 18: Run the simulation in OptiStruct
Step 19: Post-process the von Mises stress, Temperature, and Displacement results from the Mechanical analysis results in
HyperView
11. Additional Industry Examples

These examples were developed in order to gain confidence by working on real life examples. Of course, loads and boundary
conditions chosen in these examples are based on the assumption that one could get more accurate results while considering
actual material property and boundary conditions. We try to cover most commonly used applications in these examples. This
model can also be used for further design optimization.
11.1. Heat Sink: Steady State Thermal Analysis

Heat sink with fins is commonly used in engineering applications to dissipate heat. The 3D geometry of an aluminium heat sink
designed for cooling. The cross-sectional view of a furnace constructed from two materials.
Model Description: The inner part is made of copper and the outer heat sink wall is made of aluminium. The outer heat sink wall
comes into contact with the ambient air and heat convection takes place. (Download required file from the folder)
The Finite element model consists of three different materials.
Results:
Grid Temperature/Element Temperature & SPCF Power/Element Flux contour
11.2. Engine Block: Heat Transfer Analysis
The temperature distribution in an engine block is an important factor when designing a four-cylinder engine. The heat flux
generated during ignition is 4 W/mm2 but the temperature inside the engine bay is 250°C.
The analysis of the engine block is focused on the differences between the temperature gradient when the engine is working
uncooled and when the engine is liquid cooled at 225°C.The material used to manufacture the engine block is steel and has a
thermal conductivity value of 0.037 W/ mm°C.
Engine Block with Cooling Load (Download required file from the folder)
Engine Block with without Cooling Load
Results
Grid Temperature and Element Temperature contour
11.3. Brake Disc: Coupled Linear Heat Transfer and Structural Analysis
Objective: To study the coupled thermal and structural linear analysis of a brake disc.
Model information: The braking surface dissipate heat at a constant flux. The performance requirement is that temperature on
the braking surfaces should not be more than 600°C.The model is symmetric in the azimuthal direction. The brake disc is
mounted to the hub in the axial directions.
(Download required file from the folder) The solid element properties are:
Brake Disc: First order Solid elements
The material properties for the manifold are:
Youngs Modulus: 115000 MPa
Thermal Conductivity: 0.071 W/mm*K,
Poisson Ratio: 0.26
Thermal expansion coefficient: 9e-006
Free convection heat transfer coefficient:0.0005
Results
NOTE: HyperView Symmetry option have been used to plot symmetric results
Grid Temperature and Flux output
Displacement and Stress contours
11.4. Extended Surface Fin: Linear Transient Heat Transfer Analysis
This example presents a linear transient heat transfer analysis on a steel extended-surface heat transfer fin attached to the outer
surface of a system generating heat flux (Example: IC engine). The extended-surface heat transfer fin analysed in this example is
one of many from an array of such fins connected to the system. The fins draw heat away from the outer surface of the system
and dissipate it to the surrounding air. The process of heat transfer out of the fin depends upon the flow of air around the fin (Free
or forced convection). In the current tutorial, the focus is on transient heat transfer through heat flux loading and free convection
dissipation.
An extended surface heat transfer fin made of steel. To meet certain structural design requirements, the fin is bent at 90° at
approximately a quarter of its length.
The extended surface heat transfer fin is meshed with CHEXA elements in HyperMesh and a transient heat transfer analysis is
performed in HyperMesh using the Altair OptiStruct solver. A typical heat flux load of 100 KW/m2 is applied to the face connected
to the outer surface of the system. An ambient temperature of 25°C is assumed and all material properties are assumed to
remain constant with temperature and time. Free (Natural) convection is assumed over the entire surface of the material, wherein
heat transfer between the surface of the fin and the surrounding air occurs due to a complex mechanism of density differences as
a result of temperature gradients. (Download required file from the folder)
Results
Grid Temperature and Flux output at 500 seconds
Grid Temperature at 500 seconds with free convection and without free convection
11.5. Aluminium Bar: Nonlinear One-Step Transient Thermal Analysis
This example introduces the user to use HyperMesh Desktop to set up one-step transient thermal analysis. The aim of this
example is to determine the residual plastic strain in an aluminium bar submitted to volume heating for 6sec. Plastic strains are
calculated 4 seconds after the end of volume heating.
The solid element properties are:

Aluminium Bar: First order Hex elements
The material properties for the aluminium Bar are:
Youngs Modulus: 70000 MPa
Density: 2.4e-009 tonnes/mm3
Poisson Ratio: 0.3
Thermal expansion coefficient: 1e-005
Thermal Conductivity: 0.2
Heat Capacity per unit mass: 921 / Heat generation: 0.01
(Download required file from the folder)
Nonlinear material parameter of MATS1 card

Type: Plastic
Work hardening slope:30000, Yield function criterion:1
Hardening Rule:1, Initial Yield Poin:200
Results
Element Flux and Grid Temperature output at 3 seconds
Element stress and Plastic strain contour
11.6. Exhaust Manifold: One Step Thermal Transient Stress Analysis
Model Description: An engine exhaust manifold with conjugate heat transfer and structural deformation, constructed of gray cast
iron, initially at 300 K. The manifold outer surface has a convective heat transfer coefficient of h = 6 W/m2 K at 300 K. The four
inlets to the manifold are held at 500 K with air as the fluid at 5 m/s. Temperature history is available after linear transient heat
transfer analysis. In order to apply temperatures at multiple time steps to a structural analysis, one step transient thermal stress
analysis should be used. It provides displacement and stress history for the duration of transient heat transfer. In order to perform
one step transient thermal stress analysis, you can define a linear transient heat transfer subcase and a static subcase.
TEMPERATURE case control cards with HTIME keyword can be used in static subcase to choose selected or all-time steps to
perform stress analysis.
Tip: One step transient thermal stress analysis is to perform static analysis at all output time steps of transient heat transfer
analysis. Transient heat transfer analysis outputs temperature results for every time step by default. This can result in a long
simulation time and create large result files. It is recommended to use the skip factor on TSTEP card to write temperature results
for a limited number of time steps, with which one step transient thermal stress analysis can still capture the stress history without
added computational cost. When one step transient thermal stress analysis is a nonlinear static subcase, the number of time
steps should be further limited. DLOAD is not supported.
(Download required file from the folder)
Results
Grid Temperature Contour
Element Stress and Plastic Strain Contour
11.7. Manifold: Nonlinear Transient Heat Transfer
Nonlinear transient heat transfer analysis of a manifold is done using OptiStruct. The thermal conductivity of the material is a
function of temperature.
Model Description
Consists of a manifold, on which the inlet is maintained at 355°C and the outlet at 122°C. The inside of the manifold is maintained
at a temperature of 816°C. Temperature dependent material properties are defined using TABLEM1. Convective heat transfer
occurs through the inside surface of the manifold. Here you run a nonlinear heat transfer analysis
(Download required file from the folder

The solid element properties of the Manifold: First order Solid elements
The material properties for the manifold are:
• Thermal Conductivity: 0.045 W/mm*K

• Poisson Ratio: 0.3
• Density: 7.9 x 10-9 ton/mm3
Results
Variation of Element flux & Grid Temperature at Time 0.05 Seconds
Variation of Element flux & Grid Temperature at Time 1 Seconds
11.8. Piston Ring: Heat Transfer Analysis with GAP Elements
Piston rings fit on the outer surface of a piston in an engine. They support heat transfer from the piston to the cylinder wall. This
tutorial demonstrates running a heat transfer analysis on a set of piston rings. The inner ring takes the heat flux (10.0W/m2) from
the piston. The outer surface of the ring that contacts the cylinder wall has zero-degree temperatures. FREEZE gap elements are
used to model the contact between the two rings. Thermal conduction property PGAPHT is defined for gap elements to simulate
the heat transfer between the rings. The thermal boundary condition, heat flux loading, and a linear steady state heat conduction
subcase have already been defined in the model. You will focus on how to define PGAPHT for gap elements in this exercise.
Note that without PGAPHT, the heat cannot be transferred through the gap elements. In this case, the outer ring remains zero
degree and the inner ring takes all heat, as shown in the temperature results. Run the completed model and compare the results
with PGAPHT to the results below. (Download required file from the folder)
12. Appendix
This section discusses typical and frequently asked questions regarding OptiStruct thermal analysis.
12.1. Card Images Summary Table
Short summary of used card images
Entity group Card image Description Application Notes
Conductivity, specific heat,

Materials with
density, free convection
Constant isotropic temperature-independent
MAT4 transfer coefficient and heat
thermal material card. and isotropic thermal
generation scaling factor (for
properties.
QVOL)
Extension to MAT4
Materials with
card: temperature- Tabular values act as
temperature-dependent
MATT4 dependent conductivity multipliers for conductivity
and isotropic thermal
via TABLEMi or value given in MAT4 entry.
properties.
TABLEG entry.
Materials
Materials with
Conductivity, specific heat,
Constant anisotropic temperature-independent
MAT5 density and heat generation
thermal material card. thermal properties and
scaling factor (for QVOL).
anisotropic conductivity.
Extension to MAT5
Materials with
card: temperature- Tabular values act as
temperature-dependent
MATT5 dependent conductivity multipliers for conductivity
and isotropic
via TABLEMi or values given in MAT5 entry.
conductivity.
TABLEG entry.
This is not a specifically

General hyperelastic
thermal material model,
Nonlinear hyperelastic materials, where thermal
MATHE however a coefficient of
material card. effects need to be
thermal expansion can be
considered.
defined.
Recommended for both

Can be either 0.0 or non-zero
Enforced displacement zero and non-zero enforced
SPC value. Referred in SPC entry
(temperature) condition. temperatures. In steady-
of subcase card.
BCs state analyses.
Generally not frequently Must be a 0.0 value. If paired

Enforced displacement
SPC1 used card image for with SPCD entry, other value
(temperature).
enforced temperatures. might be used.
Can be used for transient

Enforced displacement The collector containing SPCD
analyses as EXCITEID for
SPCD (or temperature) is referred in LOAD entry of
time-dependent TLOADi
condition. subcase card.
card.
Referred by TEMPERATURE
or TEMPERATURE(BOTH)
Applicable when a certain subcase entry for steady-state
Initial temperature for
set of grid points needs to analysis and by IC for transient
TEMP certain grid points (or
be assigned with initial analysis. Defined through
sets).
temperature. "temperatures" panel. Load
collector does not have card
image.
Initial Condition Applicable when varying Specified as a combination of

Defines temperature
temperature across reference plane temperature
TEMPP1 field for shell
element thicknesses plays and linear thermal gradient
elements
crucial role. through thickness.
Affects all grid points, except

those defined by TEMP card.
Reffered by subcases in the
Initial temperature for Applicable when a general
same manner as
TEMPD all grid points (ambient initial temperature needs to
TEMP.Defined as a load
temperature). be defined.
collector card image. Then a
global parameter T1 needs to
be set.
Defined through "flux" panel.

Defines a rate of Power input per unit volme (i.e.
Used when a volumetric
volumetric heat W/mm^3). The total body
QVOL heat source is present like
addition in a conduction power generated: P = volume *
i.e. chemical reactions.
element. HGEN * QVOL, where HGEN
is MAT4/5 scaling factor.
Loads
Defines a uniform heat Used when a thermal flux Defined through "flux" panel.
QBDY1 flux through a model surface Q0 parameter: power input per
for CHBDYE elements. needs to be included. unit surface (i.e. W/mm^2)
Can be applied to QVOL,

Used for transient QBDY1 or SPCD thermal
TLOAD1/2 Time-dependent load. analyses, to specify a load loading, which are referenced
history. as EXCITEID parameter of
TLOADi.
Thermal energy transfer

Free convection between "SPC/SPCD"
parameters. "Group" Must be defined whenever temperature BCs and surface
PCONV
with card image free convection is needed. elements "CHBDYE"
CONVECTION. depending on "H" heat transfer
Interactions coefficient defined in MAT4.
Card activated in card edit of

slave3/4 - type CHBDYE 3/4
Defines a free Must be defined whenever
CONV elements. PCONID must refer
convection interaction. free convection is needed.
PCONV card. TA1 refer the
SPC/SPCD BCs.
An actual element is slave3/4

and CHBDYE3/4 is a type of
A special kind of Thermal flux (QBDY1) or
CHBDYE3 slave element. They are
Interaction element that is non- free convection (CONV)
(slave3) & created when a face for flux or
elements structural and is used surfaces can only be
CHBDYE4 free convection is chosen.
to define thermal defined using CHBDYE
(slave4) CHBDYE3 stays for tria and
interactions. elements.
CHBDYE4 for quad face
elements.
12.2. Thermal Expansion Coefficient Support for Rigid Elements
Thermal expansion is the tendency of matter to change in shape, area and volume in response to change in temperature. The
degree of expansion divided by the change in temperature is called the material ‘s coefficient of thermal expansion.
How to setup in OptiStruct?

Supported by ‘ALPHA’ field on RBE2, RBE3, RROD, RBAR
• Thermal load is requested by the TEMPERATURE(INITIAL) and TEMPERATURE(LOAD) subcase information entries.
• The temperature of the element is taken to be the average of the temperatures at all the nodes of the element.
12.3. Tools Menu to set up Convection Load and Heat Transfer Analysis
Thermal boundary condition SPC with D value is now available in Temperature panel; with this, you can map ambient
temperature on structure from external file through linear interpolation option in the Temperature panel.
Feature supported version: OptiStruct Interface 2017.1 or above
12.4. Clearance Based Conductance Table for HEAT Subcases
Thermal contact analysis can be performed without performing static analysis.
TCID field can be input for only Heat Transfer subcases.
KCHTC (closed contact), KOHTC (open contact) are conductance per unit area – W/(M2*K), Contact Heat Transfer Coefficients.
TPID specifies conductance per unit area vs. pressure table – W/(M2*K) TCID specifies conductance per unit area vs.
clearance table – W/(M2*K)
TPID overrides KCHTC for coupled thermal contact analysis.
TCID overrides KOHTC.
TCID overrides KCHTC for closed contact if TPID is not present.
Feature supported version: OptiStruct 14.0.210 or above.
PCONTHT
(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)
PCONTHT PID KCHTC KOHTC TPID TCID
Example:
• Two blocks connected by contact
• Heat transfer analysis and no static analysis
• SPC on the left
• Volumetric heat generation (QVOL) on right
• PCONTHT with TCID defined
(Download required file from the folder) tcid_contact_qvol.fem
12.5. Thermal Stress Steady State Analysis
Not only forces or moments, but also temperature changes cause bodies to expand or contract. The total strain of a body is the
sum of mechanical strain and heat strain:
ε=𝜀𝜀_𝜎𝜎+𝜀𝜀_𝑇𝑇= 𝜎𝜎/𝐸𝐸+𝛼𝛼_𝑇𝑇 Δ𝑇𝑇
with thermal expansion coefficient 𝛼𝛼_𝑇𝑇 and temperature change Δ𝑇𝑇
If a body cannot expand unrestricted, there are constraints which lead to (thermal) stress:
𝜎𝜎=𝐸𝐸 (𝜀𝜀−𝛼𝛼_𝑇𝑇 Δ𝑇𝑇)
The thermal expansion coefficient A and a reference temperature TREF for thermal loading can be defined on the material cards,
e.g. MAT1:
12.6. Debugging for Heat Transfer Analysis
• Shell elements are considered to be membranes in Heat Transfer Analysis. Composite properties are homogenized (1
degree of freedom per grid). The temperature distribution through the thickness of shell elements is not calculated. Only
nodal temperature is determined.
• Non-zero SPC will be considered as zero SPC for transient thermal analysis, except when non-zero SPC are used to
specify ambient points for convection. When an ambient point is controlled by TLOAD1/TLOAD2 via SPCD, the
corresponding SPC should be zero. Temperature dependent conductivity only works with NLHEAT
• The units are not the same as for thermal conductivity in material properties! They are actually the same as for Heat
Transfer Coefficient (H) - exemplary units: W/m²K, generally: rate of heat transfer per unit area per unit degree of
temperature.
• TABLEM1 in MATT4 defines multipliers, not actual conductivity
12.7. OptiStruct Online Tutorials List
• OS-T: 1080 Coupled Linear Heat Transfer/Structure Analysis
• OS-T: 1085 Linear Steady-state Heat Convection Analysis
• OS-T: 1090 Linear Transient Heat Transfer Analysis of an Extended Surface Heat Transfer Fin
• OS-T: 1100 Thermal Stress Analysis of a Printed Circuit Board with Anisotropic Material Properties
• OS-T: 1385 Heat Transfer Analysis on Piston Rings with GAP Elements

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Learn Thermal Analysis with Altair

6.2. Heat Flux ................................................................................................................................................ 19

6.3. Imposed Temperature ........................................................................................................................... 21

6.4. Free Convection .................................................................................................................................... 22

6.5. Time-Dependent Thermal Loading (Transient Analysis) .................................................................. 26

6.5.1. Load History Card Tloadi................................................................................................................. 26

6.5.2. Initial Conditions .............................................................................................................................. 27

7. Thermal Results .................................................................................................................. 29

8.1.1. Tutorial: Linear Steady State Heat Transfer Analysis ..................................................................... 33

8.2. Coupled Thermal Structural Analysis ................................................................................................. 41

8.2.1. Tutorial: Coupled Linear Heat Transfer/Structure Analysis............................................................. 42

8.3. Nonlinear Steady State Heat Transfer Analysis ................................................................................. 49

8.3.1. Tutorial: Nonlinear Steady State Heat Transfer Analysis................................................................ 50

9. Transient Heat Transfer Analysis ...................................................................................... 57

9.1.1. Tutorial: Linear Transient Heat Transfer Analysis ........................................................................... 59

9.2. One Step Transient Thermal Stress Analysis .................................................................................... 65

9.2.1. Tutorial: One-Step Transient Thermal Stress Analysis ................................................................... 67

9.3. Nonlinear Transient Heat Transfer Analysis ...................................................................................... 75

10. Contact-Based Thermal Analysis ...................................................................................... 76

10.2. Thermal Contact Properties ............................................................................................................. 77

10.3. Thermal Contact Without Static Analysis ....................................................................................... 81

10.4. Contact-Based Thermal-Structural Analysis Setup....................................................................... 81

11. Additional Industry Examples ............................................................................................ 91

11.2. Engine Block: Heat Transfer Analysis ............................................................................................ 92

11.5. Aluminium Bar: Nonlinear One-Step Transient Thermal Analysis .............................................. 98

11.7. Manifold: Nonlinear Transient Heat Transfer ............................................................................... 101

12. Appendix ............................................................................................................................ 105

12.2. Thermal Expansion Coefficient Support For Rigid Elements..................................................... 107

12.5. Thermal Stress Steady State Analysis .......................................................................................... 109

12.6. Debugging For Heat Transfer Analysis......................................................................................... 110

12.7. Optistruct Online Tutorials List ..................................................................................................... 110

1. About This Book

• Linear steady state thermal analysis

• Nonlinear steady state thermal analysis

• Sequentially coupled thermal-structural analysis

• Linear transient thermal analysis

• Nonlinear transient thermal analysis

• One step transient thermal stress analysis

• Contact-based thermal analysis

Thank you very much.

Dr. Matthias Goelke

On behalf of the Altair University Team

examples, appendix and organizing eBook chapters.

significant impact on the “shape” and content of this book.

• Aditya Jayanthi for using his brake example.

OptiStruct verification and example section.

OptiStruct has evolved throughout the last couple of years.

Thank you very much.

Your Altair University Team

4. Introduction to Heat Transfer

From a physical point of view, what is Heat Transfer?

Modes of Heat Transfer

Conduction Convection Radiation

2. Transient Thermal Analysis

There are many heat transfer solutions supported in OptiStruct

• Nonlinear steady state thermal analysis

• Sequentially coupled thermal-structural analysis

• Linear transient thermal analysis