Solder Paste Specification: No-Clean Xjs-638
Solder Paste Specification: No-Clean Xjs-638
Solder Paste Specification: No-Clean Xjs-638
SPECIFICATION
NO-CLEAN XJS-638
DESCRIPTION
XJS-638 series is a middle activated rosin no-clear solder paste. Special designed for LED production process. XJS-
638 Series is different than most other types of no-clear solder paste with great selection of process parameters, so
it can adapt in different environment, different equipment and different application process。XJS-638 It can ensure
excellent continuity printing, anti collapse ability, surface insulation resistance. low residue after welding can ensure
the ICT test. XJS-638 With excellent anti-interference ability, in the continuous printing can still ensure 12 hours of
solder paste has good adhesion conditions.
FEATURES
Lead solder paste 12 hours continuous printing capability
6 hours collapse schedule No need for gas protection
Viscosity constant 16miI(0.3mm)Simple distance printing
PHYSICAL PROPERTIES
Suitable for 89%,-325+500Alloy powder solder paste
Brook fieId:700-1400kcPs @ 5 RPM(Brook fieId Viscmter at 25℃)
MaIcom:1700-2300 Poise @ 10 RPM(MaIcom Viscometer at 25℃)
Solder ball test Qualified Test standard J-STD-005,IPC-TM-650,Method 2.4.43
Wet ability test Qualified Test standard J-STD-005,IPC-TM-650,Method 2.4.45
RELIABILTY PROPERTIES
The Copper mirror test Qualified(low) Test standard J-STD-004,IPC-TM-650,Method 2. 3. 32.
Copper surface corrosion test Qualified(low) Test standard J-STD-004,IPC-TM-650,Method 2. 6. 15
Halogen content test
Silver chromate test Qualified Test standard J-STD-004,IPC-TM-650,Method 2. 3. 33
Fluorine point test Qualified Test standard J-STD-004,IPC-TM-650, Method 2. 3. 35. 1
Surface insulation resistance Qualified Test standard J-STD-004,IPC-TM-650,Method 2. 6. 3. 3
IPC TM-650
0Hour >1×10012hm 96Hour >1×10011hm
REFLOW DATA
Test Report
Model:XJS-638
Flux type:ROMO
Test item According to the rules IPC-TM-650 Test method Testing requirement Test results
Metal content 3.4 2.2.20 89.5-90.5% 89.7%
BrookfieId 700-1400kcps 700-1100
viscosity 3.5
MaIcom 150-250kcps 170-230
3.6 No bridging qualified
Solder Balls 3.7 2.4.43 No big ball qualified
Expansion ratio 4.7.7.2.2 92%
The mirror test 3.2.4.1 2.3.32 <50%Pierce through qualified
Halogen test 3.2.4.2
Silver chromate
3.2.4.2.1 2.3.33 No color change qualified
test
Fluorine point test 3.2.4.2.2 2.3.35.1 No color change qualified
Copper surface Slight corrosion can be
3.2.4.4 2.6.15 qualified
corrosion accepted
8 12
Surface insulation 3.2.4.4 0 Hour >1.00×10 1.09×10
2.6.3.3 8 11
resistance 3.2.4.5 96 Hours >1.00×10 1.38×10
Solder powder can’t be flow, in the form of powder residue on the pad
Possible causes Solution
Improved heating equipment and adjust reflow soldering
a) The heating temperature is not appropriate
temperature curve
Be care of the cold storage the solder and remove the
b) solder paste is Deterioration
surface which is dried of the solder paste
c) Preheat excessive, too long or too high temperature Improved preheating condition
b) In the strength of solder paste flux floating component Use the solder paste with less flux
c) The thickness solder paste is not enough after printing Increase printing thickness
d) Heating speed is too fast and uneven. Adjust reflow soldering temperature curve
e) Welding pad design is not reasonable Strictly according to the specification of the pad design
Solder Ball
Possible causes Solution
a) Heating speed is too fast Adjust reflow soldering temperature curve
b) The moisture absorption of solder paste Reduce environmental humidity
c) The solder paste is oxidized Use new solder paste, shorten the warm-up time
d) PCB Pad contamination For PCB or increase the activity of solder paste
Incomplete Weld
Possible causes Solution
a) Welding pad or components welding property is bad Use good quality PCB and components
Reduce paste viscosity, check the speed and pressure of
b) Printing parameter is not correct
scraper
c) Reflow oven temperature or temperature rising speed is
Adjust the temperature curve of reflow oven
not correct
d) Heating speed is too fast Adjust the temperature curve of reflow oven
Collapse
Possible causes Solution
a) Solder paste viscosity low and welding property is bad Choose more suitable solder paste