Data Sheet: HCPL-3120/J312 HCNW3120
Data Sheet: HCPL-3120/J312 HCNW3120
Data Sheet: HCPL-3120/J312 HCNW3120
HCNW3120
2.5 Amp Output Current IGBT Gate Drive Optocoupler
Data Sheet
Applications
• IGBT/MOSFET gate drive
• AC/Brushless DC motor drives
• Industrial inverters
• Switch mode power supplies
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this
component to prevent damage and/or degradation which may be induced by ESD.
Description applications. The high operating drive a discrete power stage
The HCPL-3120 contains a voltage range of the output stage which drives the IGBT gate. The
GaAsP LED while the provides the drive voltages HCNW3120 has the highest
HCPL-J312 and the HCNW3120 required by gate controlled insulation voltage of
contain an AlGaAs LED. The devices. The voltage and current VIORM = 1414 Vpeak in the
LED is optically coupled to an supplied by these optocouplers IEC/EN/DIN EN 60747-5-2. The
integrated circuit with a power make them ideally suited for HCPL-J312 has an insulation
output stage. These optocouplers directly driving IGBTs with voltage of VIORM = 891 Vpeak and
are ideally suited for driving ratings up to 1200 V/100 A. For the VIORM = 630 Vpeak is also
power IGBTs and MOSFETs IGBTs with higher ratings, the available with the HCPL-3120
used in motor control inverter HCPL-3120 series can be used to (Option 060).
Selection Guide
Part Number HCPL-3120 HCPL-J312 HCNW3120 HCPL-3150*
Output Peak Current ( IO) 2.5 A 2.5 A 2.5 A 0.6 A
IEC/EN/DIN EN VIORM = 630 Vpeak VIORM = 891 Vpeak VIORM = 1414 Vpeak VIORM = 630 Vpeak
60747-5-2 Approval (Option 060) (Option 060)
*The HCPL-3150 Data sheet available. Contact Avago sales representative or authorized distributor.
Ordering Information
Specify Part Number followed by Option Number (if desired)
Example:
HCPL-3120#XXXX
060 = IEC/EN/DIN EN 60747-5-2, V IORM = 630 V peak (HCPL-3120 only)
300 = Gull Wing Surface Mount Option
500 = Tape and Reel Packaging Option
XXXE = Lead Free Option
Option 500 contains 1000 units (HCPL-3120/J312), 750 units (HCNW3120) per reel.
Other options contain 50 units (HCPL-3120/J312), 42 units (HCNW312) per tube.
Option data sheets available. Contact Avago sales representative or authorized distributor.
Remarks: The notation “#” is used for existing products, while (new) products launched since 15th July
2001 and lead free option will use “-”.
2
Package Outline Drawings
HCPL-3120 Outline Drawing (Standard DIP Package)
YYWW
1 2 3 4
+ 0.076
5° TYP. 0.254 - 0.051
8 7 6 5
6.350 ± 0.25
(0.250 ± 0.010) 10.9 (0.430)
1 2 3 4
2.0 (0.080)
1.27 (0.050)
1.080 ± 0.320
(0.043 ± 0.013) 0.635 ± 0.25
(0.025 ± 0.010)
0.635 ± 0.130 12° NOM.
2.54
(0.100) (0.025 ± 0.005)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
3
Package Outline Drawings
HCPL-J312 Outline Drawing (Standard DIP Package)
YYWW
1 2 3 4
+ 0.076
5° TYP. 0.254 - 0.051
8 7 6 5
6.350 ± 0.25
(0.250 ± 0.010) 10.9 (0.430)
1 2 3 4
2.0 (0.080)
1.27 (0.050)
1.080 ± 0.320
(0.043 ± 0.013) 0.635 ± 0.25
(0.025 ± 0.010)
12° NOM.
2.54 0.635 ± 0.130
(0.100) (0.025 ± 0.005)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
4
HCNW3120 Outline Drawing (8-Pin Wide Body Package)
9.00 ± 0.15
8 7 6 5 (0.354 ± 0.006)
TYPE NUMBER
A DATE CODE
HCNWXXXX
YYWW
1 2 3 4
10.16 (0.400)
TYP.
1.55
(0.061) 7° TYP.
MAX. + 0.076
0.254 - 0.0051
+ 0.003)
(0.010 - 0.002)
5.10 MAX.
(0.201)
3.10 (0.122)
3.90 (0.154) 0.51 (0.021) MIN.
2.54 (0.100)
TYP.
1.78 ± 0.15 0.40 (0.016)
(0.070 ± 0.006) 0.56 (0.022) DIMENSIONS IN MILLIMETERS (INCHES).
11.15 ± 0.15
(0.442 ± 0.006) LAND PATTERN RECOMMENDATION
8 7 6 5
9.00 ± 0.15
(0.354 ± 0.006) 13.56
(0.534)
1 2 3 4
1.3 2.29
(0.051) (0.09)
4.00 MAX.
(0.158)
1.78 ± 0.15
(0.070 ± 0.006) 1.00 ± 0.15
0.75 ± 0.25 (0.039 ± 0.006) + 0.076
2.54 0.254 - 0.0051
(0.100) (0.030 ± 0.010)
BSC + 0.003)
(0.010 - 0.002)
DIMENSIONS IN MILLIMETERS (INCHES).
7° NOM.
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
5
Solder Reflow Temperature Profile
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC. PEAK
PEAK
TEMP.
TEMP.
245°C
240°C
PEAK
TEMP.
230°C
TEMPERATURE (°C)
200
2.5°C ± 0.5°C/SEC.
SOLDERING
30 TIME
160°C 200°C
150°C SEC.
140°C
30
3°C + 1°C/–0.5°C SEC.
100
PREHEATING TIME
150°C, 90 + 30 SEC. 50 SEC.
TIGHT
ROOM TYPICAL
TEMPERATURE LOOSE
0
0 50 100 150 200 250
TIME (SECONDS)
25
t 25 °C to PEAK
TIME
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
Tsmax = 200 °C, Tsmin = 150 °C
6
Regulatory Information
Agency/Standard HCPL-3120 HCPL-J312 HCNW3120
Underwriters Laboratory (UL) ` ` `
Recognized under UL 1577, Component Recognition Program,
Category, File E55361
Canadian Standards Association (CSA) File CA88324, ` ` `
per Component Acceptance Notice #5
IEC/EN/DIN EN 60747-5-2 ` ` `
Option 060
7
All Avago data sheets report the circuit board, minimum creep- recommended techniques such
creepage and clearance inherent age and clearance requirements as grooves and ribs which may
to the optocoupler component must be met as specified for be used on a printed circuit
itself. These dimensions are individual equipment standards. board to achieve desired creep-
needed as a starting point for For creepage, the shortest age and clearances. Creepage
the equipment designer when distance path along the surface and clearance distances will also
determining the circuit of a printed circuit board change depending on factors
insulation requirements. How- between the solder fillets of the such as pollution degree and
ever, once mounted on a printed input and output leads must be insulation level.
considered. There are
*Refer to the IEC/EN/DIN EN 60747-5-2 section (page 1-6/8) of the Isolation Control Component Designer's Catalog for a detailed description of
Method a/b partial discharge test profiles.
Note: These optocouplers are suitable for “safe electrical isolation” only within the safety limit data. Maintenance of the safety data shall be ensured
by means of protective circuits. Surface mount classification is Class A in accordance with CECC 00802.
8
Absolute Maximum Ratings
Parameter Symbol Min. Max. Units Note
Storage Temperature TS -55 125 °C
Operating Temperature TA -40 100 °C
Average Input Current IF(AVG) 25 mA 1
Peak Transient Input Current IF(TRAN) 1.0 A
(<1 µs pulse width, 300 pps)
Reverse Input Voltage HCPL-3120 VR 5 Volts
HCPL-J312 3
HCNW3120
“High” Peak Output Current IOH(PEAK) 2.5 A 2
“Low” Peak Output Current IOL(PEAK) 2.5 A 2
Supply Voltage (VCC - VEE) 0 35 Volts
Input Current (Rise/Fall Time) tr(IN) /tf(IN) 500 ns
Output Voltage VO(PEAK) 0 VCC Volts
Output Power Dissipation PO 250 mW 3
Total Power Dissipation PT 295 mW 4
Lead Solder Temperature HCPL-3120 260°C for 10 sec., 1.6 mm below seating plane
HCPL-J312
HCNW3120 260°C for 10 sec., up to seating plane
Solder Reflow Temperature Profile See Package Outline Drawings section
9
Electrical Specifications (DC)
Over recommended operating conditions (TA = -40 to 100°C, IF(ON) = 7 to 16 mA, VF(OFF) = -3.0 to 0.8 V, VCC = 15 to 30 V,
V EE = Ground) unless otherwise specified.
Parameter Symbol Device Min. Typ.* Max. Units Test Conditions Fig. Note
High Level Output I OH 0.5 1.5 A V O = (VCC - 4 V) 2, 3, 5
Current 2.0 A V O = (VCC - 15 V) 17 2
Low Level Output I OL 0.5 2.0 A V O = (VEE + 2.5 V) 5, 6, 5
Current 2.0 A V O = (VEE + 15 V) 18 2
High Level Output V OH (V CC - 4) (V CC - 3) V I O = -100 mA 1, 3, 6, 7
Voltage 19
Low Level Output V OL 0.1 0.5 V I O = 100 mA 4, 6,
Voltage 20
High Level Supply I CCH 2.5 5.0 mA Output Open, 7, 8
Current I F = 7 to 16 mA
Low Level Supply I CCL 2.5 5.0 mA Output Open,
Current V F = -3.0 to +0.8 V
Threshold Input I FLH HCPL-3120 2.3 5.0 mA I O = 0 mA, 9, 15,
Current Low to HCPL-J312 1.0 VO > 5 V 21
High HCNW3120 2.3 8.0
Threshold Input V FHL 0.8 V
Voltage High to
Low
Input Forward VF HCPL-3120 1.2 1.5 1.8 V I F = 10 mA 16
Voltage HCPL-J312 1.6 1.95
HCNW3120
Temperature ∆VF/∆TA HCPL-3120 -1.6 mV/°C I F = 10 mA
Coefficient of HCPL-J312 -1.3
Forward Voltage HCNW3120
Input Reverse BVR HCPL-3120 5 V I R = 10 µA
Breakdown HCPL-J312 3 I R = 100 µA
Voltage HCNW3120
Input Capacitance CIN HCPL-3120 60 pF f = 1 MHz,
HCPL-J312 70 VF = 0 V
HCNW3120
UVLO Threshold V UVLO+ 11.0 12.3 13.5 V V O > 5 V, 22,
I F = 10 mA 34
V UVLO– 9.5 10.7 12.0
UVLO Hysteresis UVLO HYS 1.6
*All typical values at TA = 25°C and VCC - VEE = 30 V, unless otherwise noted.
10
Switching Specifications (AC)
Over recommended operating conditions (TA = -40 to 100°C, IF(ON) = 7 to 16 mA, V F(OFF) = -3.0 to 0.8 V, VCC = 15 to 30 V,
VEE = Ground) unless otherwise specified.
Parameter Symbol Min. Typ.* Max. Units Test Conditions Fig. Note
Propagation Delay Time tPLH 0.10 0.30 0.50 µs Rg = 10 Ω, 10, 11, 16
to High Output Level Cg = 10 nF, 12, 13,
Propagation Delay Time tPHL 0.10 0.30 0.50 µs f = 10 kHz, 14, 23
to Low Output Level Duty Cycle = 50%
Pulse Width Distortion PWD 0.3 µs 17
Propagation Delay PDD -0.35 0.35 µs 35, 36 12
Difference Between Any (tPHL - t PLH)
Two Parts
Rise Time tr 0.1 µs 23
Fall Time tf 0.1 µs
UVLO Turn On Delay tUVLO ON 0.8 µs VO > 5 V, IF = 10 mA 22
UVLO Turn Off Delay tUVLO OFF 0.6 VO < 5 V, IF = 10 mA
Output High Level Common |CMH| 25 35 kV/µs TA = 25°C, 24 13, 14
Mode Transient Immunity IF = 10 to 16 mA,
VCM = 1500 V,
VCC = 30 V
Output Low Level Common |CML| 25 35 kV/µs TA = 25°C, 13, 15
Mode Transient Immunity VCM = 1500 V,
VF = 0 V, VCC = 30 V
*All typical values at T A = 25°C and VCC - VEE = 30 V, unless otherwise noted.
11
Package Characteristics
Over recommended temperature (TA = -40 to 100°C) unless otherwise specified.
Parameter Symbol Device Min. Typ. Max. Units Test Conditions Fig. Note
Input-Output Momentary VISO HCPL-3120 3750 VRMS RH < 50%, 8, 11
Withstand Voltage** HCPL-J312 3750 t = 1 min., 9, 11
HCNW3120 5000 TA = 25°C 10, 11
Resistance RI-O HCPL-3120 1012 Ω VI-O = 500 VDC 11
(Input-Output) HCPL-J312
HCNW3120 1012 1013 TA = 25°C
1011 TA = 100°C
Capacitance CI-O HCPL-3120 0.6 pF f = 1 MHz
(Input-Output) HCPL-J312 0.8
HCNW3120 0.5 0.6
LED-to-Case Thermal qLC 467 °C/W Thermocouple 28
Resistance located at center
LED-to-Detector Thermal qLD 442 °C/W underside of
Resistance package
Detector-to-Case qDC 126 °C/W
Thermal Resistance
Notes:
1. Derate linearly above 70° C free-air 7. Maximum pulse width = 1 ms, 12. The difference between tPHL and t PLH
temperature at a rate of 0.3 mA/ ° C. maximum duty cycle = 20%. between any two HCPL-3120 parts
2. Maximum pulse width = 10 µs, 8. In accordance with UL1577, each under the same test condition.
maximum duty cycle = 0.2%. This optocoupler is proof tested by 13. Pins 1 and 4 need to be connected to
value is intended to allow for applying an insulation test voltage LED common.
component tolerances for designs ≥4500 Vrms for 1 second (leakage 14. Common mode transient immunity
with IO peak minimum = 2.0 A. See detection current limit, II-O ≤ 5 µA). in the high state is the maximum
Applications section for additional 9. In accordance with UL1577, each tolerable dVCM /dt of the common
details on limiting IOH peak. optocoupler is proof tested by mode pulse, VCM, to assure that the
3. Derate linearly above 70° C free-air applying an insulation test voltage output will remain in the high state
temperature at a rate of 4.8 mW/ ° C. ≥4500 Vrms for 1 second (leakage (i.e., VO > 15.0 V).
4. Derate linearly above 70° C free-air detection current limit, II-O ≤ 5 µA). 15. Common mode transient immunity
temperature at a rate of 5.4 mW/ ° C. 10. In accordance with UL1577, each in a low state is the maximum
The maximum LED junction tem- optocoupler is proof tested by tolerable dVCM/dt of the common
perature should not exceed 125° C. applying an insulation test voltage mode pulse, VCM, to assure that the
5. Maximum pulse width = 50 µs, ≥6000 Vrms for 1 second (leakage output will remain in a low state (i.e.,
maximum duty cycle = 0.5%. detection current limit, II-O ≤ 5 µA). VO < 1.0 V).
6. In this test VOH is measured with a dc 11. Device considered a two-terminal 16. This load condition approximates
load current. When driving device: pins 1, 2, 3, and 4 shorted the gate load of a 1200 V/75A IGBT.
capacitive loads VOH will approach together and pins 5, 6, 7, and 8 17. Pulse Width Distortion (PWD) is
VCC as IOH approaches zero amps. shorted together. defined as |tPHL-tPLH| for any given
device.
12
(VOH – VCC ) – OUTPUT HIGH VOLTAGE DROP – V
(VOH – VCC ) – HIGH OUTPUT VOLTAGE DROP – V
0 2.0 -1
IF = 7 to 16 mA IF = 7 to 16 mA
1.6 -3
-2
1.4 -4
-3 IF = 7 to 16 mA
1.2 -5 VCC = 15 to 30 V
VEE = 0 V
-4 1.0 -6
-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 0 0.5 1.0 1.5 2.0 2.5
TA – TEMPERATURE – °C TA – TEMPERATURE – °C IOH – OUTPUT HIGH CURRENT – A
Figure 1. VOH vs. temperature. Figure 2. IOH vs. temperature. Figure 3. VOH vs. I OH.
0.25 4 4
VF(OFF) = -3.0 to 0.8 V
VOL – OUTPUT LOW VOLTAGE – V
1 1
0.05 100 °C
25 °C
-40 °C
0 0 0
-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 0 0.5 1.0 1.5 2.0 2.5
TA – TEMPERATURE – °C TA – TEMPERATURE – °C IOL – OUTPUT LOW CURRENT – A
Figure 4. VOL vs. temperature. Figure 5. I OL vs. temperature. Figure 6. VOL vs. I OL.
3.5 3.5
ICCH ICCH
ICC – SUPPLY CURRENT – mA
ICCL ICCL
3.0 3.0
2.5 2.5
13
IFLH – LOW TO HIGH CURRENT THRESHOLD – mA
3 3 3
2 2 2
1 1 1
0 0 0
-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100
TA – TEMPERATURE – °C TA – TEMPERATURE – °C TA – TEMPERATURE – °C
Tp – PROPAGATION DELAY – ns
Tp – PROPAGATION DELAY – ns
TA = 25 °C Rg = 10 Ω, Cg = 10 nF VCC = 30 V, VEE = 0 V
TPHL
Rg = 10 Ω TA = 25 °C Rg = 10 Ω, Cg = 10 nF
400 Cg = 10 nF 400 DUTY CYCLE = 50% 400 DUTY CYCLE = 50%
DUTY CYCLE = 50% f = 10 kHz f = 10 kHz
f = 10 kHz
Figure 10. Propagation delay vs. VCC. Figure 11. Propagation delay vs. IF. Figure 12. Propagation delay vs. temperature.
500 500
VCC = 30 V, VEE = 0 V VCC = 30 V, VEE = 0 V
Tp – PROPAGATION DELAY – ns
Tp – PROPAGATION DELAY – ns
TA = 25 °C TA = 25 °C
IF = 10 mA IF = 10 mA
400 Cg = 10 nF 400 Rg = 10 Ω
DUTY CYCLE = 50% DUTY CYCLE = 50%
f = 10 kHz f = 10 kHz
300 300
200 200
TPLH TPLH
TPHL TPHL
100 100
0 10 20 30 40 50 0 20 40 60 80 100
Rg – SERIES LOAD RESISTANCE – Ω Cg – LOAD CAPACITANCE – nF
Figure 13. Propagation delay vs. Rg. Figure 14. Propagation delay vs. Cg.
14
HCPL-3120 / HCNW3120 HCPL-J312
30 35
30
VO – OUTPUT VOLTAGE – V
VO – OUTPUT VOLTAGE – V
25
25
20
20
15
15
10
10
5
5
0 0
0 1 2 3 4 5 0 1 2 3 4 5
IF – FORWARD LED CURRENT – mA
IF – FORWARD LED CURRENT – mA
HCPL-3120 HCPL-J312/HCNW3120
1000 1000
TA = 25°C
TA = 25°C
IF – FORWARD CURRENT – mA
IF – FORWARD CURRENT – mA
100 100
IF IF
10 + 10 +
VF VF
– –
1.0 1.0
0.1 0.1
0.01 0.01
0.001 0.001
1.10 1.20 1.30 1.40 1.50 1.60 1.2 1.3 1.4 1.5 1.6 1.7
VF – FORWARD VOLTAGE – VOLTS VF – FORWARD VOLTAGE – VOLTS
1 8
0.1 µF
+ 4V
2 7 –
IF = 7 to + VCC = 15
16 mA – to 30 V
3 6
IOH
4 5
15
1 8 1 8
0.1 µF 0.1 µF
IOL
VOH
2 7 2 7
+ VCC = 15
– to 30 V IF = 7 to + VCC = 15
16 mA – to 30 V
3 6 2.5 V + 3 6
–
100 mA
4 5 4 5
Figure 18. IOL Test circuit. Figure 19. VOH Test circuit.
1 8 1 8
0.1 µF 0.1 µF
100 mA
2 7 2 7
+ VCC = 15 IF + VCC = 15
– to 30 V VO > 5 V – to 30 V
3 6 3 6
VOL
4 5 4 5
Figure 20. VOL Test circuit. Figure 21. IFLH Test circuit.
1 8
0.1 µF
2 7
IF = 10 mA + VCC
VO > 5 V –
3 6
4 5
16
1 8
0.1 µF IF
IF = 7 to 16 mA VCC = 15
+ to 30 V
2 7 –
500 Ω tr tf
+ VO
10 KHz – 90%
50% DUTY 3 6 10 Ω
CYCLE 50%
10 nF VOUT 10%
4 5
tPLH tPHL
VCM
δV VCM
1 8 =
IF δt ∆t
A 0.1 µF
0V
2 7
B
+ + ∆t
5V VO –
–
VCC = 30 V
3 6 VOH
VO
SWITCH AT A: IF = 10 mA
4 5
VO VOL
SWITCH AT B: IF = 0 mA
+
–
VCM = 1500 V
17
Applications Information IGBT gate is shorted to the or emitter traces close to the
Eliminating Negative IGBT Gate emitter by Rg + 1 Ω. Minimizing HCPL-3120 input as this can
Drive (Discussion applies to HCPL- Rg and the lead inductance from result in unwanted coupling of
3120, HCPL-J312, and HCNW3120) the HCPL-3120 to the IGBT gate transient signals into the HCPL-
To keep the IGBT firmly off, the and emitter (possibly by 3120 and degrade performance.
HCPL-3120 has a very low mounting the HCPL-3120 on a (If the IGBT drain must be
maximum VOL specification of small PC board directly above routed near the HCPL-3120
0.5 V. The HCPL-3120 realizes the IGBT) can eliminate the need input, then the LED should be
this very low VOL by using a for negative IGBT gate drive in reverse-biased when in the off
DMOS transistor with 1 Ω many applications as shown in state, to prevent the transient
(typical) on resistance in its pull Figure 25. Care should be taken signals coupled from the IGBT
down circuit. When the HCPL- with such a PC board design to drain from turning on the
3120 is in the low state, the avoid routing the IGBT collector HCPL-3120.)
+5 V HCPL-3120
1 8
VCC = 18 V + HVDC
270 Ω 0.1 µF +
–
2 7
Rg
CONTROL Q1 3-PHASE
INPUT 3 6 AC
74XXX
OPEN 4 5
COLLECTOR
Q2 - HVDC
18
Selecting the Gate Resistor (Rg) to (V CC – VEE - VOL) The VOL value of 2 V in the pre-
Rg ≥ ————————————
Minimize IGBT Switching Losses. I OLPEAK vious equation is a conservative
(Discussion applies to HCPL-3120, value of VOL at the peak current
(V CC – VEE - 2 V)
HCPL-J312 and HCNW3120) = ———————————— of 2.5A (see Figure 6). At lower
I OLPEAK Rg values the voltage supplied
Step 1: Calculate Rg Minimum
from the IOL Peak Specifica- (15 V + 5 V - 2 V) by the HCPL-3120 is not an ideal
= ————————————
tion. The IGBT and Rg in Figure 2.5 A voltage step. This results in
26 can be analyzed as a simple lower peak currents (more
= 7.2 Ω ` 8 Ω
RC circuit with a voltage margin) than predicted by this
supplied by the HCPL-3120. analysis. When negative gate
drive is not used VEE in the
previous equation is equal to
zero volts.
+5 V HCPL-3120
1 8
VCC = 15 V + HVDC
270 Ω 0.1 µF +
–
2 7
Rg
CONTROL Q1 3-PHASE
3 6 AC
INPUT VEE = -5 V
+
–
74XXX
OPEN 4 5
COLLECTOR
Q2 - HVDC
Figure 26. HCPL-3120 typical application circuit with negative IGBT gate drive.
19
Step 2: Check the HCPL-3120 Power The value of 4.25 mA for I CC in
Dissipation and Increase Rg if the previous equation was
Necessary. The HCPL-3120 total obtained by derating the ICC max
power dissipation (PT) is equal to the of 5 mA (which occurs at -40°C)
sum of the emitter power (PE) and to ICC max at 85C (see Figure 7).
the output power (PO):
P T = PE + PO Since P O for this case is greater
P E = IF @VF @Duty Cycle than P O(MAX), Rg must be
P O = P O(BIAS) + PO (SWITCHING) increased to reduce the
= ICC@ (VCC - VEE) HCPL-3120 power dissipation.
+ ESW(RG, QG) @f
PO(SWITCHING MAX)
For the circuit in Figure 26 with IF = PO(MAX) - PO(BIAS)
(worst case) = 16 mA, Rg = 8 Ω, Max = 178 mW - 85 mW
Duty Cycle = 80%, Qg = 500 nC, = 93 mW
f = 20 kHz and TA max = 85C: PO(SWITCHINGMAX)
ESW(MAX) = ———————————
f
P E = 16 mA @1.8 V @ 0.8 = 23 mW
93 mW
= —————— = 4.65 µW
P O = 4.25 mA @20 V 20 kHz
+ 5.2 µ J@20 kHz
= 85 mW + 104 mW For Qg = 500 nC, from Figure 27, a
= 189 mW value of ESW = 4.65 µW gives a
> 178 mW (PO(MAX) @ 85C Rg = 10.3 Ω.
= 250 mW-15C*4.8 mW/C)
14
Qg = 100 nC
12 Qg = 500 nC
Qg = 1000 nC
10
VCC = 19 V
8 VEE = -9 V
0
0 10 20 30 40 50
Rg – GATE RESISTANCE – Ω
20
Thermal Model (Discussion applies small traces (no ground plane), a Inserting the values for qLC and
to HCPL-3120, HCPL-J312 and single HCPL-3120 soldered into qDC shown in Figure 28 gives:
HCNW3120) the center of the board and still
The steady state thermal model air. The absolute maximum power TJE = PE @(256°C/W + qCA)
for the HCPL-3120 is shown in dissipation derating specifications + PD@(57°C/W + qCA) + TA
Figure 28. The thermal assume a qCAvalue of 83°C/W. TJD = PE @(57°C/W + qCA)
resistance values given in this + PD@(111°C/W + qCA ) + TA
model can be used to calculate From the thermal mode in Figure
the temperatures at each node 28 the LED and detector IC For example, given PE = 45 mW,
for a given operating condition. junction temperatures can be P O = 250 mW, TA = 70°C and
As shown by the model, all heat expressed as: qCA = 83°C/W:
generated flows through qCA
TJE = PE @ (qLC||(qLD + qDC) + qCA) TJE = PE@339°C/W + PD@140° C/W + TA
which raises the case
temperature TC accordingly. The qLC * qDC = 45 mW@339° C/W + 250 mW
+ PD @(——————————— + qCA) + TA @140° C/W + 70° C = 120° C
value of qCA depends on the qLC + qDC + qLD
conditions of the board design
and is, therefore, determined by qLC @ qDC TJD = PE@140°C/W + PD@ 194°C/W + TA
TJD = PE (—————————— +q ) = 45 mW @140°C/W + 250 mW
the designer. The value of qLC + qDC + qLD CA
qCA = 83°C/W was obtained from @194° C/W + 70° C = 125° C
+ PD@(qDC||(qLD + qLC) + qCA) + TA
thermal measurements using a
2.5 x 2.5 inch PC board, with TJE and TJD should be limited to
125° C based on the board layout
and part placement (qCA) specific
to the application.
21
LED Drive Circuit Considerations for IC with an optically transparent main design objective of a high
Ultra High CMR Performance. Faraday shield, which diverts CMR LED drive circuit becomes
(Discussion applies to HCPL-3120, the capacitively coupled current keeping the LED in the proper
HCPL-J312, and HCNW3120) away from the sensitive IC state (on or off) during common
Without a detector shield, the circuitry. However, this shield mode transients. For example,
dominant cause of optocoupler does not eliminate the capacitive the recommended application
CMR failure is capacitive coupling between the LED and circuit (Figure 25), can achieve
coupling from the input side of optocoupler pins 5-8 as shown 25 kV/µs CMR while minimizing
the optocoupler, through the in Figure 30. This capacitive component complexity.
package, to the detector IC as coupling causes perturbations in
shown in Figure 29. The the LED current during common Techniques to keep the LED in
HCPL-3120 improves CMR mode transients and becomes the proper state are discussed in
perform-ance by using a detector the major source of CMR failures the next two sections.
for a shielded optocoupler. The
1 8 1 CLEDO1 8
CLEDP CLEDP
2 7 2 7
CLEDO2
3 6 3 6
CLEDN CLEDN
4 5 4 5
SHIELD
Figure 29. Optocoupler input to output capacitance model Figure 30. Optocoupler input to output capacitance model
for unshielded optocouplers. for shielded optocouplers.
22
CMR with the LED On (CMRH). CMR with the LED Off (CMR L). The open collector drive circuit,
A high CMR LED drive circuit A high CMR LED drive circuit shown in Figure 32, cannot keep
must keep the LED on during must keep the LED off the LED off during a +dVcm/dt
common mode transients. This is (VF ≤ VF(OFF)) during common transient, since all the current
achieved by overdriving the LED mode transients. For example, flowing through CLEDN must be
current beyond the input during a -dV cm/dt transient in supplied by the LED, and it is
threshold so that it is not pulled Figure 31, the current flowing not recommended for applica-
below the threshold during a through CLEDP also flows tions requiring ultra high CMRL
transient. A minimum LED cur- through the R SAT and VSAT of performance. Figure 33 is an
rent of 10 mA provides adequate the logic gate. As long as the low alternative drive circuit which,
margin over the maximum I FLH state voltage developed across like the recommended applica-
of 5 mA to achieve 25 kV/µs the logic gate is less than tion circuit (Figure 25), does
CMR. VF(OFF), the LED will remain off achieve ultra high CMR
and no common mode failure performance by shunting the
will occur. LED in the off state.
+5 V 1 8
0.1
CLEDP µF +
– VCC = 18 V
+ 2 7
1 8
ILEDP
VSAT +5 V
–
CLEDP
3 6 ••• 2 7
CLEDN
Rg
4 5 •••
SHIELD 3 6
Q1 CLEDN
ILEDN
* THE ARROWS INDICATE THE DIRECTION 4 5
OF CURRENT FLOW DURING –dVCM/dt. SHIELD
+ –
VCM
Figure 31. Equivalent circuit for figure 25 during common Figure 32. Not recommended open collector
mode transient. drive circuit.
1 8
+5 V
CLEDP
2 7
3 6
CLEDN
4 5
SHIELD
23
Under Voltage Lockout Feature. IGBT gate voltage) to drop below When the HCPL-3120 output is
(Discussion applies to HCPL-3120, a level necessary to keep the in the low state and the supply
HCPL-J312, and HCNW3120) IGBT in a low resistance state. voltage rises above the HCPL-
The HCPL-3120 contains an When the HCPL-3120 output is 3120 VUVLO+ threshold
under voltage lockout (UVLO) in the high state and the supply (11.0 < VUVLO+ < 13.5) the
feature that is designed to voltage drops below the optocoupler output will go into
protect the IGBT under fault HCPL-3120 VUVLO– threshold the high state (assumes LED is
conditions which cause the (9.5 < VUVLO– < 12.0) the opto- “ON”) with a typical delay, UVLO
HCPL-3120 supply voltage coupler output will go into the Turn On Delay of 0.8 µs.
(equivalent to the fully-charged low state with a typical delay,
UVLO Turn Off Delay, of 0.6 µs.
14
12
VO – OUTPUT VOLTAGE – V
(12.3, 10.8)
10
(10.7, 9.2)
8
2
(10.7, 0.1) (12.3, 0.1)
0
0 5 10 15 20
(VCC - VEE ) – SUPPLY VOLTAGE – V
24
IPM Dead Time and Propagation designs. Dead time is the time
Delay Specifications. (Discussion period during which both the
applies to HCPL-3120, HCPL-J312, high and low side power
and HCNW3120) transistors (Q1 and Q2 in Figure
The HCPL-3120 includes a 25) are off. Any overlap in Q1
Propagation Delay Difference and Q2 conduction will result in
(PDD) specification intended to large currents flowing through
help designers minimize “dead the power devices between the
time” in their power inverter high and low voltage motor rails.
ILED1
ILED1
VOUT1
VOUT1 Q1 ON
Q1 ON
Q1 OFF
Q1 OFF
Q2 ON
Q2 ON
VOUT2 Q2 OFF
Q2 OFF
VOUT2
ILED2
ILED2
tPHL MAX tPHL MIN
tPHL MAX
tPLH MIN
tPLH
PDD* MAX = (tPHL- tPLH)MAX = tPHL MAX - tPLH MIN MIN
tPLH MAX
*PDD = PROPAGATION DELAY DIFFERENCE
NOTE: FOR PDD CALCULATIONS THE PROPAGATION DELAYS (tPHL-tPLH) MAX
ARE TAKEN AT THE SAME TEMPERATURE AND TEST CONDITIONS.
PDD* MAX
300 400
300
200
200
100
100
0 0
0 25 50 75 100 125 150 175 200 0 25 50 75 100 125 150 175
TS – CASE TEMPERATURE – °C TS – CASE TEMPERATURE – °C
Figure 37. Thermal derating curve, dependence of safety limiting value with case temperature
per IEC/EN/DIN EN 60747-5-2.
25
To minimize dead time in a Delaying the LED signal by the Note that the propagation delays
given design, the turn on of maximum propagation delay used to calculate PDD and dead
LED2 should be delayed difference ensures that the time are taken at equal tempera-
(relative to the turn off of LED1) minimum dead time is zero, but tures and test conditions since
so that under worst-case con- it does not tell a designer what the optocouplers under
ditions, transistor Q1 has just the maximum dead time will be. consideration are typically
turned off when transistor Q2 The maximum dead time is mounted in close proximity to
turns on, as shown in Figure 35. equivalent to the difference each other and are switching
The amount of delay necessary between the maximum and identical IGBTs.
to achieve this conditions is minimum propagation delay
equal to the maximum value of difference specifications as
the propagation delay difference shown in Figure 36. The
specification, PDDMAX, which is maximum dead time for the
specified to be 350 ns over the HCPL-3120 is 700 ns
operating temperature range of (= 350 ns - (-350 ns)) over an
-40°C to 100°C. operating temperature range of -
40°C to 100°C.
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Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved. Obsoletes 5989-2941EN
AV01-0622EN October 31, 2006