CuClad Laminates Data Sheet
CuClad Laminates Data Sheet
CuClad Laminates Data Sheet
Data Sheet
CuClad 217 (Er=2.17, 2.20) uses a low fiberglass/PTFE ratio to provide the lowest dielectric constant and dissipation
factor available in fiberglass reinforced PTFE based laminates. Together, these properties offer faster signal propagation
and higher signal/noise ratios.
CuClad 233 (Er=2.33) uses a medium fiberglass/PTFE ratio to balance lower dielectric constant and improved dissipation
factor without sacrificing mechanical properties.
CuClad 250 (Er=2.40–2.60) uses a higher fiberglass/PTFE ratio to provide mechanical properties approaching those of
conventional substrates. Better dimensional stability and lower thermal expansion in all directions are other
significant benefits. For critical performance applications, CuClad products may be specified with an “LX” testing
grade; this designates that each sheet will be tested individually, and a test report will be issued with the order. “LX”
designated products are higher priced, as a portion of each sheet is utilized in destructive testing.
Results listed above are typical properties; they are not to be used as specification limits. The above information creates no ex- pressed or
implied warranties. The properties of Rogers laminates may vary depending on the design and application.
Typical Properties: CuClad
Property Test Method Condition CuClad 217 CuClad 233 Cuclad 250
Dielectric Constant @10 GHz IPC TM-650 2.5.5.5 C23/50 2.17, 2.20 2.33 2.40 to 2.55
Dielectric Constant @1MHz IPC TM-650 2.5.5.3 C23/50 2.17, 2.20 2.33 2.40 to 2.60
Dissipation Factor @10 GHz IPC TM-650 2.5.5.5 C23/50 0.0009 0.0013 0.0017
Thermal Coefficient of Er IPC TM-650 2.5.5.5 -10°C to +140°C -160 -161 -153
(ppm/°C) Adapted
Peel Strength (lbs.per inch) IPC TM-650 2.4.8 After Thermal Stress 14 14 14
Volume Resistivity (MΩ-cm) IPC TM-650 2.5.17.1 C96/35/90 2.3 x 10 8 8.0 x 10 8 8.0 x 10 9
Surface Resistivity (MΩ) IPC TM-650 2.5.17.1 C96/35/90 3.4 x 10 6 2.4 x 10 6 1.5 x 10 8
Arc Resistance (seconds) ASTM D-495 D48/50 >180 >180 >180
Tensile Modulus (kpsi) ASTM D-638 A, 23°C 275, 219 510, 414 725, 572
Tensile Strength (kpsi) ASTM D-882 A, 23°C 8.8, 6.6 10.3, 9.8 26.0, 20.5
Specific Gravity (g/cm3) ASTM D-792 Method A A, 23°C 2.23 2.26 2.31
Water Absorption (%) MIL-S-13949H 3.7.7 E1/105 + D24/23 0.02 0.02 0.03
IPC TM-650 2.6.2.2
Flammability UL 94 Vertical Burn C48/23/50, E24/125 Meets requirements Meets requirements Meets requirements
IPC TM-650 2.3.10 of UL94-V0 of UL94-V0 of UL94-V0
Material Availability:
CuClad laminates are supplied with 1/2, 1, or 2 ounce electrodeposited copper on both s ides. Other copper weights and
rolled copper foil are available. CuClad is available bonded to a heavy metal ground plane. Aluminum, brass, or copper
plates also provide an integral heat sink and mechanical support to the substrate. When ordering CuClad products
please specify dielectric constant, thickness, cladding, panel size and any other special considerations. Available
master sheet sizes include 36" x 36" in a crossplied configuration and 36" x 48" in a parallel plied configuration.
Results listed above are typical properties; they are not to be used as specification limits. The above information creates no ex-
pressed or implied warranties. The properties of Rogers laminates may vary depending on the design and application.
CuClad 217
Figure 1
Frequency (GHz)
Figure 2
Frequency (GHz)
Results listed above are typical properties; they are not to be used as specification limits. The above information creates no ex-
pressed or implied warranties. The properties of Rogers laminates may vary depending on the design and application.
CuClad 250
Figure 3
Figure 4
Frequency (GHz)
The information in this data sheet is intended to assist you in designing with Rogers’ circuit materials. It is not intended to and does not create
any warranties express or implied, including any warranty of merchantability or fitness for a particular purpose or that the results shown on this
data sheet will be achieved by a user for a particular purpose. The user should determine the suitability of Rogers’ circuit materials for each
application.
These commodities, technology and software are exported from the United States in accordance with the Export Administration regulations.
Diversion contrary to U.S. law prohibited.
The Rogers’ logo, Helping power, protect, connect our world, and CuClad are trademarks of Rogers Corporation or one of its subsidiaries.
©2022 Rogers Corporation. All rights reserved. PUB 92-204 Revised 1576 072822
Results listed above are typical properties; they are not to be used as specification limits. The above information creates no ex-
pressed or implied warranties. The properties of laminates may vary depending on the design and application.