TLE6225GP
TLE6225GP
Block Diagram
1 4
4
Output Control OUT4
Buffer
GND
1)
RI=internal resistance of the load dump test pulse generator LD200
2)
VLoadDump is setup without DUT connected to the generator per ISO 7637-1 and DIN 40 839.
V2.1 Page 3 26.Aug. 2002
Data Sheet TLE 6225 G
Electrical Characteristics
Parameter and Conditions Symbol Values Unit
VS = 4.5 to 32 V ; Tj = - 40 °C to + 150 °C min typ max
(unless otherwise specified)
1. Power Supply
Supply Voltage VS 4.5 32 V
Supply Current (ENA = H, Outputs ON) IS(ON) 1 2 mA
Supply Current in Standby Mode (ENA = L) IS(stby) 10 µA
2. Power Outputs
ON Resistance VS ≥ 6 V; ID = 300 mA TJ = 25°C RDS(ON) 1.7 2 Ω
TJ = 150°C 3 3.6
Output Clamping Voltage Output OFF VDS(AZ) 45 50 60 V
Current Limit ID(lim) 500 750 1000 mA
Output Leakage Current VENA = L ID(lkg) 5 µA
Turn-On Time ID = 200 mA, resistive load tON 5 10 µs
Turn-Off Time ID = 200 mA, resistive load tOFF 5 10 µs
Functional Description
The TLE 6225 G is a quad channel low-side switch with four power DMOS stages. The power
transistors are protected against short to VBB, overload, overtemperature and against over-
voltage by zenerclamp.
The diagnostic logic recognises a fault condition which is indicated by a fault flag.
Circuit Description
Output Stage Control
Each output is independently controlled by an input pin and a common enable line, which en-
ables/disables all four outputs. The parallel inputs are high or low active depending on the
PRG pin. If the parallel input pins are not connected (independent of high or low activity) it is
guaranteed that the outputs 1 to 4 are switched OFF. ENA - and PRG - pin itself are internally
pulled down when they are not connected.
ENA - Enable pin. ENA = High: Active mode. Channels are enabled
ENA = Low (GND): Sleep mode. Channels are switched off. Less than
1 µA current consumption.
PRG - Program pin. PRG = High: Parallel inputs Channel 1 to 4 are high active
PRG = Low (GND): Parallel inputs Channel 1 to 4 are low active.
Power Transistors
Each of the four output stages has its own zenerclamp. This causes a voltage limitation at the
power transistors when inductive loads are switched off. The outputs are provided with a cur-
rent limitation set to a minimum of 500 mA.
Each output is protected by embedded protection functions3). In the event of an overload or
short to supply, the current is internally limited. If this operation leads to an overtemperature
condition, a second protection level (about 170 °C) will turn the effected output into a PWM-
mode (selective thermal shutdown with restart) to prevent critical chip temperatures. The tem-
perature hysteresis is typically 10K.
Diagnostic
The FAULT pin is an open drain output. The logic status depends on the programming pin
PRG.
3)
The integrated protection functions prevent an IC destruction under fault conditions and may not be used in normal operation or perma-
nently
V2.1 Page 5 26.Aug. 2002
Data Sheet TLE 6225 G
Diagnostic Table
X = not relevant
Fault Distinction
Open load/short to ground is recognised in OFF-state. Overtemperature as a result of an
overload or short to battery can only arise in ON-state. If there is only one fault at a time, it is
possible to distinguish which channel is affected with which fault.
Drain-Source on-resistance
RDS(ON) = f (Tj) ; Vs = 5V
3
RDS(ON) [Ohm]
2,5
1,5
1
-50 -25 0 25 50 75 100 125 150 175
Tj[°C]
54
53
VDS (AZ) [V]
52
51
50
49
48
-50 -25 0 25 50 75 100 125 150 175
Tj[°C]
Timing Diagrams
Power Outputs
VIN
tON tOFF
VDS
80%
20%
t
Application Circuit
+5V VBB
VS
VCC PRG
TLE
6225 G
Py.1 ENA
GND
0.35 x 45˚
2.65 max
2.45 -0.2
7.6 -0.21)
0.2 -0.1
+0.09
x
8˚ ma
0 .2 3
1.27 0.4 +0.8
2)
0.35 +0.15 0.1 10.3 ±0.3
0.2 24x
20 11
1 12.8 1) 10
-0.2 GPS05094
Index Marking
1) Does not include plastic or metal protrusions of 0.15 max per side
2) Does not include dambar protrusion of 0.05 max per side
Published by
Infineon Technologies AG,
Bereichs Kommunikation
St.-Martin-Strasse 76,
D-81541 München
© Infineon Technologies AG 1999
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits,
descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Tech-
nologies Office in Germany or our Infineon Technologies Representatives worldwide (see address list).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in question
please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of
Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support
device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are in-
tended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it
is reasonable to assume that the health of the user or other persons may be endangered.
www.datasheetcatalog.com