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    SMD Desoldering

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    david reyes
    1) The author describes a no-special-tools technique for desoldering surface-mount devices (SMDs) called "flood, float, and flick" (F3). It involves heating both sides of the component simultaneously using a piece of bus wire, flooding the area with more solder, and flicking the component off once it floats up. 2) The technique was used to successfully remove and replace several small SMDs from a 23GHz circuit board without damaging the board or components. 3) SMT (surface-mount technology) is becoming more common as electronics get more complex, so hobbyists need techniques to work with these small, dense components.

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    © All Rights Reserved
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    SMD Desoldering

    Uploaded by

    david reyes
    18 views1 page
    1) The author describes a no-special-tools technique for desoldering surface-mount devices (SMDs) called "flood, float, and flick" (F3). It involves heating both sides of the component simultaneously using a piece of bus wire, flooding the area with more solder, and flicking the component off once it floats up. 2) The technique was used to successfully remove and replace several small SMDs from a 23GHz circuit board without damaging the board or components. 3) SMT (surface-mount technology) is becoming more common as electronics get more complex, so hobbyists need techniques to work with these small, dense components.

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    Electrónica

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    1) The author describes a no-special-tools technique for desoldering surface-mount devices (SMDs) called "flood, float, and flick" (F3). It involves heating both sides of the component simultaneously using a piece of bus wire, flooding the area with more solder, and flicking the component off once it floats up. 2) The technique was used to successfully remove and replace several small SMDs from a 23GHz circuit board without damaging the board or components. 3) SMT (surface-mount technology) is becoming more common as electronics get more complex, so hobbyists need techniques to work with these small, dense components.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    18 views1 page

    SMD Desoldering

    Uploaded by

    david reyes
    1) The author describes a no-special-tools technique for desoldering surface-mount devices (SMDs) called "flood, float, and flick" (F3). It involves heating both sides of the component simultaneously using a piece of bus wire, flooding the area with more solder, and flicking the component off once it floats up. 2) The technique was used to successfully remove and replace several small SMDs from a 23GHz circuit board without damaging the board or components. 3) SMT (surface-mount technology) is becoming more common as electronics get more complex, so hobbyists need techniques to work with these small, dense components.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    of 1

    A No-Special-Tools SMD

    Desoldering Technique
    You don’t need a fancy fabrication shop to get
    surface-mount devices off the board. Figure 1 — A small piece of bus wire is
    used to transfer heat to both sides of the
    component at the same time.
    Wayne Yoshida, KH6WZ

    W
    hile modifying a commercial 23 GHz action to flick the component away from its
    assembly for ham radio use on the mounting pads.
    24 GHz band, I had to remove and Next, a length of solder wicking is used
    replace several small surface-mount devices to remove excess solder from the board, as
    (SMDs). Although several techniques have shown in Figures 3 and 4. The flux can also
    been described to remove an SMD from cir- be removed with some alcohol and a little
    cuit boards, I have developed a way to remove scrubbing.
    these tiny parts without any special tools or a The removed chip resistors ended up
    need for a second soldering iron. In addition, stuck to the 20 gauge bus wire. Although
    this technique does not destroy the component a bit discolored, these little bits can also be
    or the circuit board. cleaned up with solder wick and alcohol, and
    be reused in another project. Of course, the
    Flood, Float and Flick little chip resistors are cheap enough to go Figure 2 — As the component heats and
    into the trash bin (the hazardous waste bin). solder begins to reflow, quickly add more
    I call this the flood, float and flick (F3 for solder to flood the component area. The
    short) technique: The component and board If the component were more valuable, such as component will float and you can flick the
    are heated, and as the solder begins to melt, a PIN diode or a transistor, however, it would iron tip to push the component off of its pads.
    more solder is added to the area, flooding the be worth saving.
    component area. Then, a flick of the iron tip
    moves the part so that it can be picked up with SMT is Here to Stay
    a pair of tweezers. I use a standard Weller This is another chapter in the don’t be
    WTCPT soldering iron, with an 800° screw- afraid to use surface-mount components
    driver tip for all work. story. As electronic products get more com-
    The main idea is to heat all sides of the plex and component densities increase, SMT
    component at the same time, so that the is the only way to go. Experimenters must
    device can be picked up and removed from practice using (and repairing) this construc-
    the circuit board. Since surface-mount com- tion method, and become comfortable with
    ponents are so small, it may be possible to use using these types of components.
    a large chisel-point soldering iron tip to heat By the way, the 24 GHz project I am
    both sides of the component. referring to is discussed on a Yahoo! interest
    The general concept is based on the old group site started by Frank Kelly, WB6CWN,
    trick of wrapping a piece of solid copper wire of the San Bernardino Microwave Society Figure 3 — Remove the excess solder
    around a soldering iron tip, to solder small (SBMS).1 and flux from the board with solder wick.
    components. In this technique, a small piece Additional scrubbing with a swab and
    1groups.yahoo.com/group/24GHzHam/. alcohol will remove the flux residue.
    of 20 gauge tinned bus wire is used to trans-
    fer heat to both sides of an SMD resistor, as
    shown in Figure 1. In this photo you can see ARRL Life Member and Amateur Extra class
    licensee Wayne Yoshida, KH6WZ, is employed
    that a component has already been removed,
    by M/A-COM Technology Solutions in Torrance,
    using this technique. California, and has been a ham since 1976. His
    Although I have not tried this, it should be most memorable ham radio experience was
    possible to shape the wire into a small circle, working in the press room at the NASA Johnson
    rectangle or square to remove other compo- Space Center (Mission Control, Houston)
    nents, such as SOT-223 packaged transistors during the 1983 Owen Garriott, W5LFL,
    or SMT DIP packaged devices. operation aboard STS-9/SpaceLab-1. You can
    reach Wayne at 16428 Camino Canada Ln,
    Making it Happen Huntington Beach, CA 92649 or at kh6kine@
    earthlink.net.
    Refer to Figure 2. As the leads heat and
    the solder re-flows, quickly add more sol-
    Figure 4 — The board should look like
    der to flood the area. I use Kester rosin-core this. Two 0603 size resistors have been
    solder, in a 63/37 (tin/lead) alloy. The com- removed, and the cleaned board is ready
    ponent will float, and you can use a wiping to receive two new resistors.
    August 2009 41

    YOSHIDA.indd 41 6/23/2009 12:45:07 PM

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