Sylabus Mtech

VISVESVARAYA TECHNOLOGICAL UNIVERSITY, BELAGAVI
Scheme of Teaching and Examinations – 2020 - 21

Choice Based Credit System (CBCS) and Outcome Based Education(OBE)
Programme: M.TECH IN INDUSTRIAL ELECTRONICS (EIE)
I SEMESTER
Sl.
Course Course Code Course Title Teaching Hours /Week Examination
No
Total Marks
Assignment
SEE Marks
Duration in
Field work/
CIE Marks
Practical/
Credits
Theory
hours
Advanced Engineering
1 PCC 20ELD11 04 -- 03 40 60 100 4
Mathematics
Advanced Digital Signal
2 PCC 20ECS12 04 -- 03 40 60 100 4
Processing
3 PCC 20EVE13 Advanced EmbeddedSystem 04 -- 03 40 60 100 4
4 PCC 20ELD14 Digital Circuits and Logic Design 04 -- 03 40 60 100 4
5 PCC 20EIE15 Advanced Control System 04 -- 03 40 60 100 4
Controls and VirtualInstrumentation
6 PCC 20EIEL16 - 04 03 40 60 100 2
lab
7 PCC 20RMI17 Research Methodology and IPR 02 -- 03 40 60 100 2
TOTAL 22 04 21 280 420 700 24
Note: PCC: Professional core.
Skill Development Activities(SDA) is the responsibility of the corresponding Program (for all courses coming under BoS ECE
purview)to train the students by providing them skills through identified mentors/facilitators with the objective of enhancing
their Employment/ Self-Employment opportunities. The SDA component is a part of the CIE. It should be defined specifically
for each theory subject of 4 credits.To meet the objectives the following guidelines are framed:
The SDA include:
1. Formulating and incorporatinglab experimentsin specified subjects, at least in one subject per semester from first
to third semester. Thestudents have to conduct lab experiments (extra) as a part of CIE marks along with other
activities.
2. In courses with strong industry connect, case studies/ latest trends should be discussed as a part of subject
seminar. The student cannot assume the same cases will be part of the SEE question paper.
3. At least one industrial visit before third semester is mandatory with the relevant report.
4. Mini-project carried out in groups with relevant literature review based on latest trends in industry / research with
report in identified subject at second semester can be taken up. The publishing of a base paper based on the work
is recommended.
For Sl. No. 2 & 3 above, at least 20% of the CIE marks are to be earmarked in the concerned subject, apart from regular
assignments, quiz & seminars. For Sl. No. 1& 4, the complete CIE evaluation can be based on the practical/ lab report.In all
the Skill Development Activities, students and course instructor/sare to involve either individually or in groups to interact
together to enhance the learning and application skills of the students.
Expected outcomes
The students shall
1) Gain confidence in modelling of systems and algorithms.
2) Work on different software/s (tools) to Simulate, analyze and authenticate the output to interpret and conclude.
3) Handle advanced instruments to enhance technical talent.
4) Involve in case studies and field visits/ field work.
5) Accustom with the use of standards/codes etc., to narrow the gap between academia and industry.
All activities should enhance students’ abilities and competencies for employment and/or self-employment opportunities,
solving engineering problems, project management skills, individual and team work, life-long learning, etc.
Internship: All the students have to undergo mandatory internship of 6 weeks during the vacation of I and II
semesters and /or II and III semesters. A University examination shall be conducted during III semester and the
prescribed credit shall be counted for the same semester. Internship shall be considered as a head of passing and
shall be considered for the award of degree. Those, who do not take-up/complete the internship shall be declared as
fail in internship course and have to complete the same during the subsequent University examination after
satisfying the internship requirements.
Note: (i) Four credit courses are designed for 50 hours Teaching – Learning process.
(ii) Three credit courses are designed for 40 hours Teaching – Learning process.
II SEMESTER
Teaching Hours /Week Examination
Total Marks
SEE Marks
Duration in
Assignment/
CIE Marks
Credits
Field work/
Sl.
Theory
Practical/
hours
Course Course Code Course Title
No
Project
1 PCC 20EIE21 Process ControlInstrumentation 04 -- 03 40 60 100 4
2 PCC 20EVE22 Real Time Operating System 04 -- 03 40 60 100 4
3 PCC 20EIE23 Design of Power Converters 04 -- 03 40 60 100 4
4 PEC 20XXX24X Professional elective 1 04 -- 03 40 60 100 4
Embedded and SignalProcessing
6 PCC 20EIEL26 -- 04 03 40 60 100 2
Lab
7 PCC 20EIE27 Technical Seminar -- 02 -- 100 -- 100 2
TOTAL 20 06 20 340 360 700 24
Note: PCC: Professional core, PEC: Professional Elective.
Professional Elective 1 Professional Elective 2
Course Code Course Code under
under 20XXX24X
Course title 20XXX25X
Course title
20ECS241 Wireless Sensor Networks 20EIE251 Automotive Electronics
20EVE242 Nanoelectronics 20EIE252 Industrial Drives
20ECS243 Cryptography and Network 20ELD253 Micro Electro Mechanical Systems
Security (20EVE334)
20ELD244 Reconfigurable Computing 20EIE254 Synthesis and Optimization of Digital
Circuits
Note:
1. Technical Seminar: CIE marks shall be awarded by a committee comprising of HoD as Chairman, Guide/co-guide, if
any, and a senior faculty of the department. Participation in the seminar by all postgraduate students of the same and other
semesters of the programme shall be mandatory.
The CIE marks awarded for Technical Seminar, shall be based on the evaluation of Seminar Report, Presentation skill and
Question and Answer session in the ratio 50:25:25.
2. Internship: All the students shall have to undergo mandatory internship of 6 weeks during the vacation of I and II
semesters and /or II and III semesters. A University examination shall be conducted during III semester and the prescribed
credit shall be counted in the same semester. Internship shall be considered as a head of passing and shall be considered for
the award of degree. Those, who do not take-up/complete the internship shall be declared as fail in internship course and
have to complete the same during the subsequent University examination after satisfying the internship requirements.
III SEMESTER
Total Marks
SEE Marks
Duration in
CIE Marks
Credits
Assignment
Field work/
Sl.
Theory
Practical/
hours
No
1 PCC 20EIE31 PLCs and Industrial Automation 04 -- 03 40 60 100 4

4 PROJ 20EIE34 Project Work phase -1 -- 02 -- 100 -- 100 2
5 PROJ 20EIE35 Mini-Project -- 02 -- 100 -- 100 2
(Completed during the
intervening vacation of I
6 INT 20EIEI36 Internship and II semesters and /or
03 40 60 100 6
II and III semesters.)
TOTAL 10 04 12 360 240 600 20
Note: PCC: Professional core, PEC: Professional Elective.
Professional elective 3 Professional elective 4
Course Code Course title Course Code Course title
under 20XXX32X under 20XXX33X
20ECS321 Advances in Image Processing 20EIE331 Advanced Power Electronic
Converters and Applications
20EIE322 20ESP332 Pattern Recognition & Machine
Medical Imaging
Learning
20ELD323 Business Intelligence and its 20ECS333
Internet of Things
Applications
20ECS324 RF MEMS 20ESP334 Communication System Design using
DSP Algorithms
Note:
1. Project Work Phase-1: Students in consultation with the guide & co-guide if any, shall pursue literature survey and complete the
preliminary requirements of selected Project work. Each student shall prepare relevant introductory project phase-I report, and make a
project presentation.
CIE marks shall be awarded by a committee comprising of HoD as Chairman, Guide/co-guide if any, and a senior faculty of the
department. The CIE marks awarded for project work phase -1, shall be based on the evaluation of Project Report, Project Presentation
skill and Question and Answer session in the ratio 50:25:25.
SEE (University examination) shall be as per the University norms.
2. Mini-Project: Each student shall involve in carrying out the Mini-project work in constant consultation with internal guide, prepare the
project report as per the norms avoiding plagiarism. A mini project is an assignment that you try to complete at the end of semester to
strengthen the understanding of his/her fundamentals through effective application of theoretical concepts.
3. Internship: Those, who have not pursued /completed the internship shall be declared as fail in internship course and have to complete
the same during subsequent University examinations after satisfying the internship requirements. Internship SEE (University
examination) shall be as per the University norms.
IV SEMESTER
Total Marks
Duration in
CIE Marks
Credits
Assignment
SEE Marks
Field work/
Theory
Sl.
Viva voce
Practical/
hours
No
1 Project 20EIE41 Project work phase -2 -- 04 03 40 60 100 20

TOTAL -- 04 03 40 60 100 20
Note:
1. Project Phase-2:
CIE marks shall be awarded by a committee comprising of HoD as Chairman, Guide/co-guide, if any, and a Senior faculty of the
department. The CIE marks awarded for project work phase -2, shall be based on the evaluation of Project Report subjected to plagiarism
check, Project Presentation skill and Question and Answer session in the ratio 50:25:25.
SEE shall be at the end of IV semester. Project work evaluation and Viva-Voce examination (SEE), after satisfying the plagiarism check,
shall be as per the University norms.
VISVESVARAYA TECHNOLOGICAL UNIVERSITY
BELAGAVI
Scheme of Teaching and Examinations and Syllabus

M.Tech in Industrial Electronics (EIE)
(Effective from Academic year 2020 - 21)
M.TECH IN INDUSTRIAL ELECTRONICS (EIE)
Choice Based Credit System (CBCS) and Outcome Based Education (OBE)
(Effective from the academic year 2020-21)
SEMESTER -I
ADVANCED ENGINEERING MATHEMATICS
CourseCode 20ELD11 CIEMarks 40

Lecture Hours/Week 04 SEE Marks 60
Total Number of LectureHours 50 Exam Hours 03
Credits - 04
Module-1
Linear Algebra-I
Introduction to vector spaces and sub-spaces, definitions, illustrative example.
Linearly independent and dependent vectors- Basis-definition and problems.
Linear transformations-definitions. Matrix form of linear transformations-
Illustrative examples (Text Book1).
Module-2
Linear Algebra-II
Computation of eigen values and eigen vectors of real symmetric matrices-
Given’s method. Orthogonal vectors and orthogonal bases. Gram-Schmidt
orthogonalization process (Text Book1).
Module-3
Calculus of Variations
Concept of functional- Eulers equation. Functional dependent on first and
higher order derivatives, Functional on several dependent variables.
Isoperimetric problems-variation problems with moving boundaries.
(TextBook2).
Module-4
Probability Theory: Review of basic probability theory. Definitions of random
variables and probability distributions, probability mass and density functions,
expectation, moments, central moments, characteristic functions, probability
generating and moment generating functions-illustrations. Poisson, Gaussian
and Erlang distributions examples (Text Book 3).
2
Module-5
Engineering Applications on Random processes: Classification. Stationary,
WSS and ergodic random process. Auto-correlation function - properties,
Gaussian random process (Text Book 3).
Course outcomes:
At the end of the course the student will be able to:
1. Understand vector spaces, basis, linear transformations and the process of
obtaining matrix of linear transformations arising in magnification and
rotation of images.
2. Apply the technique of singular value decomposition for data compression,
least square approximation in solving inconsistent linear systems.
3. Utilize the concepts of functional and their variations in the applications of
communication systems, decision theory, synthesis and optimization of
digital circuits.
4. Learn the idea of random variables (discrete/continuous) and probability
distributions in analyzing the probability models arising in control systems
and system communications.
5. Analyze random process through parameter-dependent variables in various
random processes.
Question paper pattern:

The SEE question paper will be set for 100 marks and the marks scored will be
proportionately reduced to 60.
 The question paper will have ten full questions carrying equal marks.
 Each full question is for 20 marks.
 There will be two full questions (with a maximum of four sub questions)
from each module.
 Each full question will have sub question covering all the topics under a
module.
 The students will have to answer five full questions, selecting one full
question from each module.
Textbooks:
1. ‘Linear Algebra and its Applications’, David C Lay, Steven R Lay and J J
McDonald, Pearson Education Ltd., 5 th Edition, 2015
2. ‘Differential Equations and Calculus of Variations’, Elsgolts L, MIR
Publications, 3rd Edition, 1977
3. ‘Probability, Statistics and Random Process’, T Veerarajan, Tata Mc-Graw
Hill Co., 3rd Edition, 2016
3
Reference Books:
1. ‘Introduction to Linear Algebra’, Gilbert Strang, Wellesley-Cambridge
Press, 5th Edition, 2016
2. ‘Schaum’s Outlines of Theory and Problems of Matrix Operations’,
Richard Bronson, McGraw-Hill, 1988
3. ‘Probability and Random Process with application to Signal Processing’,
Scott L Miller, Donald G Childers, Elsevier Academic Press, 2 nd Edition,
2013
4
Advanced Digital Signal Processing
CourseCode 20ECS12 CIEMarks 40
Credits - 04
Module-1
Multirate Digital Signal Processing: Introduction, decimation by a factor 'D',
Interpolation by a factor 'I', sampling rate conversion by a factor 'I/D',
Implementation of sampling rate conversion, Multistage implementation of
sampling rate conversion, Applications of multirate signal processing, Digital
filter banks, two channel quadrature mirror filter banks, M-channel QMF bank
(Text 1).
Module-2
Linear prediction and Optimum Linear Filters: Random signals, Correlation
Functions and Power Spectra, Innovations Representation of a Stationary
Random Process. Forward and Backward Linear Prediction. Solution of the
Normal Equations. The Levinson-Durbin Algorithm. Properties of the Linear
Prediction-Error Filters (Text 1).
Module-3
Adaptive filters: Applications of Adaptive Filters-Adaptive Channel
Equalization, Adaptive noise cancellation, Linear Predictive coding of Speech
Signals, Adaptive direct form FIR filters-The LMS algorithm, Properties of
LMS algorithm. Adaptive direct form filters- RLS algorithm (Text 1).
Module-4
Power Spectrum Estimation: Non parametric Methods for Power Spectrum
Estimation - Bartlett Method, Welch Method, Blackman and Tukey Methods.
Parametric Methods for Power Spectrum Estimation: Relationship between
the auto correlation and the model parameters, Yule and Walker methods for
the AR Model Parameters, Burg Method for the AR Model parameters,
Unconstrained least-squares method for the AR Model parameters, Sequential
estimation methods for the AR Model parameters, ARMA Model for Power
Spectrum Estimation (Text 1).
5
Module-5
WAVELET TRANSFORMS: The Age of Wavelets, The origin of Wavelets,
Wavelets and other reality transforms, History of wavelets, Wavelets of the
future.
Continuous Wavelet and Short Time Fourier Transform: Wavelet
Transform, Mathematical preliminaries, Properties of wavelets.
Discrete Wavelet Transform: Haar scaling functions, Haar wavelet function,
Daubechies Wavelets (Chapters 1, 3 & 4 of Text 2).
Course outcomes:
1. Design adaptive filters for a given application
2. Design multirate DSP Systems
3. Implement adaptive signal processing algorithm
4. Design active networks
5. Understand advanced signal processing techniques, including multi-rate
processing and time-frequency analysis techniques

 There will be two full questions (with a maximum of four sub
questions) from each module.
 Each full question will have sub question covering all the topics under
a module.
Textbooks:
1. ‘Digital Signal Processing, Principles, Algorithms and Applications’, John
G. Proakis, Dimitris G.Manolakis, Pearson, Fourth edition, 2007
2. ‘Insight into Wavelets- from Theory to Practice’, K P Soman,
Ramachandran, Resmi, PHI, Third Edition, 2010
6
Advanced Embedded System
CourseCode 20EVE13 CIEMarks 40
Credits - 04
Module-1
Embedded System: Embedded vs General computing system, classification,
application and purpose of ES. Core of an Embedded System, Memory,
Sensors, Actuators, LED, Opto coupler, Communication Interface, Reset
circuits, RTC, WDT, Characteristics and Quality Attributes of Embedded
Systems (Text 1: Selected Topics from Ch -1, 2, 3).
Module-2
Hardware Software Co-Design, embedded firmware design approaches,
computational models, embedded firmware development languages, Integration
and testing of Embedded Hardware and firmware, Components in embedded
system development environment (IDE), Files generated during compilation,
simulators, emulators and debugging (Text 1: Selected Topics from Ch-7, 9, 12,
13).
Module-3
ARM-32 bit Microcontroller: Thumb-2 technology and applications of ARM,
Architecture of ARM Cortex M3, Various Units in the architecture, General
Purpose Registers, Special Registers, exceptions, interrupts, stack operation,
reset sequence (Text 2: Ch 1, 2, 3).
Module-4
Instruction Sets: Assembly basics, Instruction list and description, useful
instructions, Memory Systems, Memory maps, Cortex M3 implementation
overview, pipeline and bus interface (Text 2: Ch-4, 5, 6).
Module-5
Exceptions, Nested Vector interrupt controller design, Systick Timer, Cortex-
M3 Programming using assembly and C language, CMSIS (Text 2: Ch-7, 8,
10).
7
Course outcomes:
1. Understand the basic hardware components and their selection method
based on the characteristics and attributes of an embedded system.
2. Explain the hardware software co-design and firmware design approaches.
3. Understand the suitability of the instruction sets of ARM processors to
design of embedded systems.
4. Acquire the knowledge of the architectural features of ARM CORTEX M3,
a 32-bit microcontroller including memory map, interrupts and exceptions.
5. Apply the knowledge gained for Programming ARM CORTEX M3 for
different applications.

a module.
Textbooks:
1. ‘Introduction to embedded systems’, K. V. Shibu, TMH education Pvt.

Ltd., 2009
2. ‘The Definitive Guide to the ARM Cortex-M3’, Joseph Yiu, Newnes,
(Elsevier), 2ndedn, 2010.
Reference Book:
‘Embedded systems - A contemporary design tool’, James K. Peckol, John
Wiley, 2008
8
Digital Circuits and Logic Design

Credits - 04
Module-1
Threshold Logic: Introductory Concepts, Synthesis of Threshold Networks,
Capabilities, Minimization, and Transformation of Sequential Machines: The
Finite- State Model, Further Definitions, Capabilities.
Module-2
Fault Detection by Path Sensitizing, Detection of Multiple Faults, Failure-
Tolerant Design, Quadded Logic, ReliableDesign and Fault Diagnosis Hazards:
Fault Detection inCombinational Circuits.
Module-3
Fault-Location Experiments, Boolean Differences, Limitations ofFinite – State
Machines, State Equivalence and MachineMinimization, Simplification of
Incompletely SpecifiedMachines.
Module-4
Structure of Sequential Machines: Introductory Example, State Assignments
Using Partitions, The Lattice of closed Partitions,Reductions of the Output
Dependency, Input Independenceand Autonomous Clocks, Covers and
Generation of closedPartitions by state splitting, Information Flow in
SequentialMachines, decompositions, Synthesis of Multiple Machines.
Module-5
State Identifications and Fault-Detection Experiments:
HomingExperiments, Distinguishing Experiments, MachineIdentification, Fault
Detection Experiments, Design ofDiagnosable Machines, Second Algorithm for
the Design ofFault Detection Experiments, Fault-Detection.
9
Course outcomes:
1.Understand the concepts of sequential machines.
2. Design Sequential Machines/Circuits.
3. Analyze the faults in the design of circuits.
4.Apply fault detection experiments to sequential circuits.
5.Comprehend the structure of sequential machines.

a module.
Textbook:
‘Switching and Finite Automata Theory’, ZviKohavi, TMH,ISBN:
978_0_07_099387_7, 2ndEdition, 2008.
Reference Books:
1. ‘Digital Circuits and logic Design’, Charles Roth Jr., CengageLearning,
7thedition, 2014.
2. ‘Fault Tolerant and Fault Testable Hardware Design’,Parag K Lala,Prentice
Hall Inc. 1985.
3. ‘Introductory Theory of Computer’, E. V. Krishnamurthy, MacmillanPress
Ltd, 1983
4. ‘Theory of computer science – Automata,Languages and Computation’,
Mishra & Chandrasekaran, 2ndEdition, PHI, 2004.
10
Advanced Control System
CourseCode 20EIE15 CIEMarks 40
Credits - 04
Module 1
Digital Control Systems: Review of Difference equations, Z – transformsand
Inverse Z transforms, The Z- transfer function(Pulse transfer function), The Z -
Transform Analysis of Sampleddata Control Systems, The Z and S - domain
relationship, Stabilityanalysis (Jury’s Stability Test and Bilinear
Transformation)(Text 1,Text 2).
Module 2
State Models & Solution of State equations: State models for Linear
Continuous Time and Linear Discrete Time systems,Diagonalization, Solution
of State Equations (for both Continuousand Discrete Time systems), Relevant
problems(Text1).
Module 3
State Feedback Systems: Concepts of Controllability and Observability (for
both Continuous and Discrete Time systems),Pole Placement by State Feedback
(for both continuous anddiscrete Time systems), Observer System (Full order
and Reducedorder observers for both Continuous and Discrete Time
systems),Relevant problems(Text 1, Text 2).
Module 4
Regulators: Dead beat Control by State Feedback, Optimal control problems
using State Variable approach, State regulator andOutput regulator, Concepts of
Model Reference Adaptive Control(MRAC)(Text 1, Text 2).
Module 5
Nonlinear Control Systems: Behavior of Nonlinear Systems, Common
Physical Nonlinearities, Describing Function Method,Stability Analysis by
Describing Function Method, Phase PlaneMethod, Stability Analysis by Phase
Plane Method (Text 1).
11
Course Outcomes:
1. Derive the pulse transfer function for various closed loop configurationsand
understand the stability analysis of sampled data control systems.
2. Apply state space techniques to model linear continuous and discrete time
systems, convert state space (SS) representations to transfer function
(TF)representation and vice versa.
3. Apply controllability and observability tests.
4. Solve the optimal control problems using state variable approach
andknowledge of adaptive control systems.
5. Understand the types of nonlinearities, characteristics of Nonlinear systems
and the stability analysis of Nonlinear control systems.

from each module.
module.
Text Books:
1. ‘Control Systems Engineering’, IJ Nagrath& MGopal, New Age
International Publishers, Fifth edition, 2007.
2. ‘Discrete Time Control Systems’, K Ogata, 2ndedition, PHI, 2009.
Reference Books:
1. ‘Modern Control Engineering’, K Ogata, PHI, 5thEdition, 2010.
2. ‘Modern Control System Theory’, M Gopal,New Age International,
2012.
3. ‘Digital Control and State Variable methods’, M Gopal,
TataMcGrawHill, 4thedition, 2012.
4. ‘Advanced Control Theory’, A Nagoorkani, RBA publications, 2006.
12
Controls and Virtual Instrumentation lab
CourseCode 20EIEL16 CIEMarks 40
04 SEE Marks 60
Teaching Hours/Week (2 Hrs Tutorial + 2 Hrs Exam Hours 03
Practical)
Credits - 02
Sl.No Experiments
1 Use the suitable software simulation tool to develop and
implement the ladder logic for PLC
a Binary to Gray code using PLC. The logic should be solved
usingladder diagram technique.
b Bottle filling process using PLC. The logic should be solved
usingladder diagram technique.
c Elevator using PLC. The logic should be solved using ladderdiagram
technique.
d Controlling the Rotation of the motor using timer. The logicshould
be solved using ladder diagram technique.
2 Introduction of the basics of data acquisition and computer-

controlled Instrumentation using Virtual Instrumentation
(LabVIEW programs)
a Simulation of temperature indicators using LabVIEW.
b Simple calculator using LabVIEW.
c Design of a variable function generator using VI
d Creation of a CRO using VI and measurement of frequency and
amplitude
e Data acquisition using VI for temperature measurement with
thermocouple and AD590
13
3 ARM Cortex M3 Programs:
(Programming to be done using Keil uVision 4 and download the
program on to a M3 evaluation board such as NXP LPC1768 or
ATMEL ATSAM3U ).
a Write an Assembly language program to calculate the sum and
display the result for the addition of first ten numbers. SUM =
10+9+8+.........+1
b Write a Assembly language program to linkmultiple object files and
link them together.
c Write an Assembly language program to store data in RAM.
d Write a C program to Output the "Hello World" message using
UART.
e Write a C program to Design a Stopwatch using interrupts.
Course outcomes:
1.Simulate ladder logic for various applications using PLC.
2.Use LabVIEW for virtual instrumentation applications.
3.Design data acquisition experiments using LabVIEW DAQ cards.
4.Develop Assembly language programs for different applications using
ARM-Cortex M3 Kit and Keil uVision-4 tool.
5.Develop C language programs for different applications using ARM- Cortex
M3 Kit and Keiluvision-4 tool.
Conduct of Practical Examination:

1. All laboratory experiments are to be included for practical examination.
2. For examination, two questions using different tool to be set.
3. Students are allowed to pick one experiment from the lot.
4. Strictly follow the instructions as printed on the cover page of answer script
for breakup of marks.
5.Change of experiment is allowed only once and Marks allotted to the
procedure part to be made zero.
14
Research Methodology and IPR
CourseCode 20RMI17 CIEMarks 40
SEE Marks 60
Lecture Hours/Week 02
Exam Hours 03
Credits - 02
Module-1
Research Methodology: Introduction, Meaning of Research, Objectives of
Research, Motivation in Research, Types of Research, Research Approaches,
Significance of Research, Research Methods versus Methodology, Research
and Scientific Method, Importance of Knowing How Research is Done,
Research Process, Criteria of Good Research, and Problems Encountered by
Researchers in India.
Defining the Research Problem: Research Problem, Selecting the Problem,
Necessity of Defining the Problem, Technique Involved in Defining a Problem,
An Illustration.
Module-2
Reviewing the literature: Place of the literature review in research, Bringing
clarity and focus to your research problem, Improving research methodology,
Broadening knowledge base in research area, Enabling contextual findings,
How to review the literature, searching the existing literature, reviewing the
selected literature, Developing a theoretical framework, Developing a
conceptual framework, Writing about the literature reviewed.
Research Design: Meaning of Research Design, Need for Research Design,
Features of a Good Design, Important Concepts Relating to Research Design,
Different Research Designs, Basic Principles of Experimental Designs,
Important Experimental Designs.
Module-3
Design of Sampling: Introduction, Sample Design, Sampling and Non-
sampling Errors, Sample Survey versus Census Survey, Types of Sampling
Designs.
Measurement and Scaling: Qualitative and Quantitative Data, Classifications
of Measurement Scales, Goodness of Measurement Scales, Sources of Error in
Measurement Tools, Scaling, Scale Classification Bases, Scaling Technics,
Multidimensional Scaling, Deciding the Scale.
Data Collection: Experimental and Surveys, Collection of Primary Data,
Collection of Secondary Data, Selection of Appropriate Method for Data
Collection, Case Study Method.
15
Module-4
Testing of Hypotheses: Hypothesis, Basic Concepts Concerning Testing of
Hypotheses, Testing of Hypothesis, Test Statistics and Critical Region, Critical
Value and Decision Rule, Procedure for Hypothesis Testing, Hypothesis
Testing for Mean, Proportion, Variance, for Difference of Two Mean, for
Difference of Two Proportions, for Difference of Two Variances, P-Value
approach, Power of Test, Limitations of the Tests of Hypothesis.
Chi-square Test: Test of Difference of more than Two Proportions, Test of
Independence of Attributes, Test of Goodness of Fit, Cautions in Using Chi
Square Tests.
Module-5
Interpretation and Report Writing: Meaning of Interpretation, Technique of
Interpretation, Precaution in Interpretation, Significance of Report Writing,
Different Steps in Writing Report, Layout of the Research Report, Types of
Reports, Oral Presentation, Mechanics of Writing a Research Report,
Precautions for Writing Research Reports.
Intellectual Property: The Concept, Intellectual Property System in India,
Development of TRIPS Complied Regime in India, Patents Act, 1970, Trade
Mark Act, 1999,The Designs Act, 2000, The Geographical Indications of
Goods (Registration and Protection) Act1999, Copyright Act,1957,The
Protection of Plant Varieties and Farmers’ Rights Act, 2001,The Semi-
Conductor Integrated Circuits Layout Design Act, 2000, Trade Secrets, Utility
Models, IPR and Biodiversity, The Convention on Biological Diversity (CBD)
1992, Competing Rationales for Protection of IPRs, Leading International
Instruments Concerning IPR, World Intellectual Property Organisation
(WIPO),WIPO and WTO, Paris Convention for the Protection of Industrial
Property, National Treatment, Right of Priority, Common Rules, Patents,
Marks, Industrial Designs, Trade Names, Indications of Source, Unfair
Competition, Patent Cooperation Treaty (PCT), Advantages of PCT Filing,
Berne Convention for the Protection of Literary and Artistic Works, Basic
Principles, Duration of Protection, Trade Related Aspects of Intellectual
Property Rights (TRIPS) Agreement, Covered under TRIPS Agreement,
Features of the Agreement, Protection of Intellectual Property under TRIPS,
Copyright and Related Rights, Trademarks, Geographical indications, Industrial
Designs, Patents, Patentable Subject Matter, Rights Conferred, Exceptions,
Term of protection, Conditions on Patent Applicants, Process Patents, Other
Use without Authorization of the Right Holder, Layout-Designs of Integrated
Circuits, Protection of Undisclosed Information, Enforcement of Intellectual
Property Rights, UNSECO.
16
Course outcomes:
1. Discuss research methodology and the technique of defining a research
problem
2. Explain the functions of the literature review in research, carrying out
a literature search, developing theoretical and conceptual frameworks
and writing a review.
3. Explain various research designs, sampling designs, measurement and
scaling techniques and also different methods of data collections.
4. Explain several parametric tests of hypotheses, Chi-square test, art of
interpretation and writing research reports
5. Discuss various forms of the intellectual property, its relevance and
business impact in the changing global business environment and
leading International Instruments concerning IPR.

from each module.
module.
Textbooks:
1. ‘Research Methodology: Methods and Techniques’, C.R. Kothari, Gaurav

Garg, New Age International, 4th Edition, 2018
2. ‘Research Methodology a step-by-step guide for beginners. (For the topic
Reviewing the literature under module 2)’, Ranjit Kumar, SAGE
Publications, 3rd Edition, 2011
3. Study Material (For the topic Intellectual Property under module 5)
Professional Programme Intellectual Property Rights, Law and Practice,
The Institute of Company Secretaries of India, Statutory Body Under an
Act of Parliament, September 2013.
17
Reference Books:
1. ‘Research Methods: the concise knowledge base’, Trochim, Atomic Dog

Publishing, 2005
2. ‘Conducting Research Literature Reviews: From the Internet to Paper’,
Fink A, Sage Publications, 2009
18
M.TECH IN Industrial Electronics (EIE)

SEMESTER -II
Process Control Instrumentation

Credits - 04
Module-1
Automation – Need and Benefit: Instrumentation subsystems- Structure,
Signal Interface Standards, Input datareliability enhancement, Isolation and
Protection, humaninterface subsystems - Operation panel, Construction,
controlsubsystems – Structure, interfacing, automation strategies-Basic and
advanced strategies.
Module-2
Data Acquisition and Control Unit: Hardware and Software- Basic modules,
functional modules, DACU capacityexpansion, system cables, Integrated
assemblies, DACUconstruction, Data exchange on bus, Software
structure,application programming, Programmable control subsystems.
Module-3
Data Communication and Networking: Communicationnetwork, signal and
data transmission, Data communicationprotocol, Inter process communication,
cyber security, Safe andredundant network.
Module-4
Fieldbus Technology & Safety Systems: Centralized, remote- input-output,
Field bus- input-output, communication,device integration, Other networks.
Safety systems introduction,Process and Machine safety management.
19
Module-5
Management and Information Technology in Industrial Processes:
Introduction, Classification ofindustrial processes, Manufacturing and utility
processes,industrial robotics, operation technology and IT, before and
afterconvergence, ISA 95 standard, new developments.
Course outcomes:
1. Comprehend the interface between process and controlsubsystem, manual
interaction with the processes, process industrialautomation system.
2. Present the latest hardware and software modules for realizing theData
Acquisition and Control Unit.
3. Manage inter and intra systems data exchange in process
industrialautomation systems.
4. Explain the structure of field bus I/O and the management of safetyin
process plants.
5. Understand the manufacturing, utility in industrial processes andalso to
give the Integration of operational technology and
InformationTechnology to derive operational and business excellence.

a module.
Textbook:
‘Overview of Industrial Process Automation’, K L S Sharma,
2ndedition,ELSEVIER, 2016.
20
Real Time Operating System
Credits - 04
Module-1
Real-Time Systems and Resources: Brief history of Real Time Systems, A
brief history of Embedded Systems. System Resources, Resource Analysis,
Real-Time Service Utility, Scheduler concepts, Real-Time OS, State transition
diagram and tables, Thread Safe Reentrant Functions (Text 1: Selected sections
from Chap. 1, 2).
Module-2
Processing with Real Time Scheduling: Scheduler Concepts, Preemptive
Fixed Priority Scheduling Policies with timing diagrams and problems and
issues, Feasibility, Rate Monotonic least upper bound, Necessary and Sufficient
feasibility, Deadline –Monotonic Policy, Dynamic priority policies, Alternative
to RM policy (Text 1: Chap. 2,3,7).
Module-3
Memory and I/O: Worst case execution time, Intermediate I/O, Shared
Memory, ECC Memory, Flash file systems. Multi-resource Services, Blocking,
Deadlock and live lock, Critical sections to protect shared resources, Missed
deadline, QoS, Reliability and Availability, Similarities and differences,
Reliable software, Available software (Text 1: Selected topics from Chap.
4,5,6,7,11).
Module-4
Firmware Components: The 3 firmware components, RTOS system software
mechanisms, Software application components. Debugging Components,
Exceptions, assert, Checking return codes, Single-step debugging, Test access
ports, Trace Ports (Text 1: Selected topics from Chap. 8,9).
Module-5
Process and Threads: Process and thread creations, Programs related to
semaphores, message queue, shared buffer applications involving inter
task/thread communication (Text 2: Chap. 11).
21
Course outcomes:
1. Develop programs for real time services, firmware and RTOS, using the
fundamentals of Real Time Embedded System, real time service utilities,
debugging methodologies and optimization techniques.
2. Select the appropriate system resources (CPU, I/O, Memory, Cache, ECC
Memory, Microcontroller/ FPGA/ ASIC to improve the system
performance.
3. Apply priority based static and dynamic real time scheduling techniques for
the given specifications.
4. Analyze deadlock conditions, shared memory problem, critical section
problem, missed deadlines, availability, reliability and QoS.
5. Develop programs for multithreaded applications using suitable techniques
and data structure

a module.
Textbooks:
1. ‘Real-Time Embedded Systems and Components’, Sam Siewert, Cengage
Learning, India Edition, 2007.
2. ‘Embedded/Real Time Systems, Concepts, Design and Programming,
Black Book’, Dr. K.V.K.K Prasad, Dream Tech Press, New edition,
2010.
Reference Books:
1. ‘Real Time System’, James W S Liu, Pearson Education, 2008.
2. ‘Programming for Embedded Systems’, Dream Tech Software Team,
John Wiley, India Pvt. Ltd., 2008.
22
Design of Power Converters
Credits - 04
Module-1
Introduction to Control characteristics of power semiconductor devices:
SCR, BJT, MOSFET, GTO, MCT, SITH,IGBT. Comparison of controllable
switches.
AC to Controlled DC Converter: Thyristor circuits and theircontrol, Gate
Triggering, Single phase converters, Three phaseconverters(Text 1).
Module-2
DC to DC converters: Introduction, control of DC-DC converters,Buck, Boost,
Buck-Boost, Cuk converter.
Inverters: Introduction, principle of operation, single phaseinverters, three
phase inverters-120 and 180 modes of operation(Text 1).
Module-3
Switching DC power supplies: linear power supply, overview of switching
power supply, DC - DC converters with electricalisolation, flyback converter,
forward converter, push-pullconverter, Half and Full bridge converter, current
mode control,power supply protection (Text 1).
Module-4
Magnetics for switched mode converters: Power Handling capacity of a
transformer, Area product, window utilization factor.
Transformer designs – forward converter, half and Full Bridgeconverter,
Push-pull converter, Flyback converter. Design ofInductors, problems (Text 2).
Module-5
PWM controlling Techniques: single PWM, Multiple, sinusoidal,modified,
phase displacement control.
Power electronic applications: UPS, control of motor drives, criteria for
selectingdrive components, High frequency fluorescent lighting.
Industrial applications: Induction heating, Electric welding(Text 1).
23
Course outcomes:
1. Describe the various power semiconductor devices.
2. Analyze and design different power converter circuits.
3. Analyze various single phase and three phase power converter circuits
and understand their applications.
4. Develop skills to build, and troubleshoot power electronics circuits.
5. Understand the use of power converters in commercial and industrial
applications.

a module.
Textbooks:
1. ‘PowerElectronics: Converters, Applications and Design’, MNed Mohan
Tore, Undeland and William P Robbins, 3rdEdition, JohnWiley and
Sons, 2003
2. ‘Design of Magnetic Components forSwitched Mode Power
Converters’,Umanand L & SRBhat, Wiley Eastern Publication, 1992.
Reference Book:
‘Power Electronics’, M H Rashid, 3rdedition, PHI / Pearsonpublisher, 2004.
24
Professional Elective 1
Wireless Sensor Networks

Credits - 04
Module-1
Introduction: Sensor Mote Platforms, WSN Architecture and Protocol Stack
(Chap. 1Text 1).
WSN Applications: Military Applications, Environmental Applications, Health
Applications, Home Applications, Industrial Applications (Chap. 2 Text 1).
Module-2
Factors Influencing WSN Design: Hardware Constraints Fault Tolerance
Scalability Production Costs WSN Topology, Transmission Media, Power
Consumption (Chap. 3 Text 1).
Physical Layer: Physical Layer Technologies, Overview of RF Wireless
Communication, Channel Coding (Error Control Coding), Modulation,
Wireless Channel Effects, PHY Layer Standards (Chap. 4 of Text 1).
Module-3
Medium Access Control: Challenges for MAC, CSMA Mechanism,
Contention-Based Medium Access, Reservation-Based Medium Access, Hybrid
Medium Access (Chap. 5 of Text 1).
Network Layer: Challenges for Routing, Data-centric and Flat Architecture
Protocols, Hierarchical Protocols, Geographical Routing Protocols (Chap. 7 of
Text 1).
Module-4
Transport Layer: Challenges for Transport Layer, Reliable MultiSegment
Transport (RMST) Protocol, Pump Slowly, Fetch Quickly (PSFQ) Protocol,
Congestion Detection and Avoidance (CODA) Protocol, Event-to-Sink Reliable
Transport (ESRT) Protocol, GARUDA (Chap. 8 Text 1).
Application Layer: Source Coding (Data Compression), Query Processing,

Network Management (Chap. 9 Text 1).
25
Module-5
Time Synchronization: Challenges for Time Synchronization, Network Time
Protocol, Timing-Sync Protocol for Sensor Networks (TPSN), Reference-
Broadcast Synchronization (RBS), Adaptive Clock Synchronization (ACS)
(Chap. 11 of Text1).
Localization; Challenges in Localization, Ranging Techniques, Range-Based
Localization Protocols, Range-Free Localization Protocols. (Chap. 12 Text 1).
Course outcomes:
1. Acquire knowledge of characteristics of mobile/wireless communication
channels
2. Apply statistical models of multipath fading
3. Understand the multiple radio access techniques, radio standards and
communication protocols to be used for wireless sensor
4. Design wireless sensor network system for different applications under
consideration.
5. Understand the hardware details of different types of sensors and select right
type of sensor for various applications.

a module.
Textbooks:
1. ‘Wireless Sensor Networks’, Ian F. Akyildiz and Mehmet Can Vuran, John
Wiley & Sons Ltd. ISBN 978-0-470-03601-3 (H/B), 2010
2. ‘Wireless Sensor Networks:Signal Processing and Communications
Perspectives’, Ananthram Swami, et. al., John Wiley & Sons Ltd., ISBN
978-0470-03557-3, 2007
26
Nanoelectronics
Credits - 04
Module-1
Introduction: Overview of nanoscience and engineering. Development
milestones in microfabrication and electronic industry. Moores’ law and
continued miniaturization, Classification of Nanostructures, Electronic
properties of atoms and solids: Isolated atom, Bonding between atoms, Giant
molecular solids, Free electron models and energy bands, crystalline solids,
Periodicity of crystal lattices, Electronic conduction, effects of nanometer
length scale, Fabrication methods: Top down processes, Bottom up processes
methods for templating the growth of nanomaterials, ordering of nanosystems
(Text 1).
Module-2
Characterization: Classification, Microscopic techniques, Field ion
microscopy, scanning probe techniques, diffraction techniques: bulk and
surface diffraction techniques, spectroscopy techniques: photon,
radiofrequency, electron, surface analysis and dept profiling: electron, mass,
Ion beam, Reflectometry, Techniques for property measurement: mechanical,
electron, magnetic, thermal properties (Text1).
Module-3
Inorganic semiconductor nanostructures: overview of semiconductor
physics. Quantum confinement in semiconductor nanostructures: quantum
wells, quantum wires, quantum dots, super-lattices, band offsets, electronic
density of states (Text1).
Carbon Nanostructures: Carbon molecules, Carbon Clusters, Carbon
Nanotubes, application of Carbon Nanotubes (Text 2).
Module-4
Fabrication techniques: requirements of ideal semiconductor, epitaxial growth
of quantum wells, lithography and etching, cleaved-edge over growth, growth
of vicinal substrates, strain induced dots and wires, electrostatically induced
dots and wires, Quantum well width fluctuations, thermally annealed quantum
27
wells, semiconductor nanocrystals, colloidal quantum dots, self-assembly
techniques.
Physical processes: modulation doping, quantum hall effect, resonant
tunneling, charging effects, ballistic carrier transport, Inter band absorption,
intra band absorption, Light emission processes, phonon bottleneck, quantum
confined stark effect, nonlinear effects, coherence and dephasing,
characterization of semiconductor nanostructures: optical electrical and
structural (Text1).
Module-5
Methods of measuring properties: atomic, crystallography, microscopy,
spectroscopy (Text 2).
Applications: Injection lasers, quantum cascade lasers, single-photon sources,
biological tagging, optical memories, coulomb blockade devices, photonic
structures, QWIPs, NEMS, MEMS (Text1).
Course outcomes:
1. Know the principles behind Nanoscience engineering and Nanoelectronics.
2. Apply the knowledge to prepare and characterize nanomaterials.
3. Know the effect of particles size on mechanical, thermal, optical and
electrical properties of nanomaterials.
4. Design the process flow required to fabricate state of the art transistor
technology.
5. Analyze the requirements for new materials and device structure in the
future technologies.

a module.
28
Textbooks:
1. ‘Nanoscale Science and Technology’, Ed Robert Kelsall, Ian Hamley,

Mark Geoghegan, John Wiley, 2007
2. ‘Introduction to Nanotechnology’, Charles P Poole, Jr, Frank J Owens,
John Wiley, Copyright 2006, Reprint 2011.
Reference Book:
‘Hand Book of Nanoscience Engineering and Technology’, Ed William A
Goddard III, Donald W Brenner, Sergey E. Lyshevski, Gerald J Iafrate, CRC
Press, 2003
29
Cryptography and Network Security
Credits - 04
Module-1
Foundations: Terminology, Steganography, substitution ciphers and
transpositions ciphers, Simple XOR, One-Time Pads, Computer Algorithms
(Text 2: Chapter 1: Section 1.1 to 1.6).
SYMMETRIC CIPHERS: Traditional Block Cipher structure, Data
encryption standard (DES), The AES Cipher. (Text 1: Chapter 2: Section2.1,
2.2, Chapter 4).
Module-2
Introduction to modular arithmetic, Prime Numbers, Fermat’s and Euler’s
theorem, primality testing, Chinese Remainder theorem, discrete logarithm.
(Text 1: Chapter 7: Section 1, 2, 3, 4, 5).
Principles of Public-Key Cryptosystems, The RSA algorithm, Diffie - Hellman
Key Exchange, Elliptic Curve Arithmetic, Elliptic Curve Cryptography (Text 1:
Chapter 8, Chapter 9: Section 9.1, 9.3, 9.4).
Module-3
Pseudo-Random-Sequence Generators and Stream Ciphers: Linear
Congruential Generators, Linear Feedback Shift Registers, Design and analysis
of stream ciphers, Stream ciphers using LFSRs, A5, Hughes XPD/KPD,
Nanoteq, Rambutan, Additive generators, Gifford, Algorithm M, PKZIP (Text
2: Chapter 16).
Module-4
One-Way Hash Functions: Background, Snefru, N-Hash, MD4, MD5, Secure
Hash Algorithm [SHA], One way hash functions using symmetric block
algorithms, Using public key algorithms, Choosing a one-way hash functions,
Message Authentication Codes. Digital Signature Algorithm, Discrete
Logarithm Signature Scheme (Text 2: Chapter 18: Section 18.1 to 18.5, 18.7,
18.11 to 18.14 and Chapter 20: Section 20.1, 20.4).
30
Module-5
E-mail Security: Pretty Good Privacy-S/MIME (Text 1: Chapter 17: Section
17.1, 17.2).
IP Security: IP Security Overview, IP Security Policy, Encapsulation Security
Payload (ESP), Combining security Associations. (Text 1: Chapter 18: Section
18.1 to 18.4).
Web Security: Web Security Considerations, SSL (Text 1: Chapter 15: Section
15.1, 15.2).
Course outcomes:
1. Understand the basics of symmetric key and public key cryptography.
2. Use basic cryptographic algorithms to encrypt the data.
3. Generate some pseudorandom numbers required for cryptographic
applications.
4. Provide authentication and protection for encrypted data.
5. Understand the techniques and features of Email, IP and Web security.

a module.
Textbooks:
1. ‘Cryptography and Network Security Principles and Practice’, William
Stallings, Pearson Education Inc., ISBN: 978-93325-1877-3, 6th Edition,
2014
2. ‘Applied Cryptography Protocols, Algorithms, and Source code in C’,
Bruce Schneier, Wiley Publications ISBN: 9971-51348-X, 2nd Edition
Reference Books:
1. ‘Cryptography and Network Security’, Behrouz A. Forouzan, TMH, 2007
2. ‘Cryptography and Network Security’, Atul Kahate, TMH, 2003
31
Reconfigurable Computing

Credits - 04
Module -1
Introduction: History, Reconfigurable vs Processor based system, RC
Architecture.
Reconfigurable Logic Devices: Field Programmable Gate Array, Coarse
Grained Reconfigurable Arrays.
Reconfigurable Computing System: Parallel Processing on Reconfigurable
Computers, A survey of Reconfigurable Computing System (Text 1).
Module-2
Languages and Compilation: Design Cycle, Languages, HDL, High Level
Compilation, Low level Design flow, Debugging Reconfigurable Computing
Applications (Text 1).
Module -3
Implementation: Integration, FPGA Design flow, Logic Synthesis.
High Level Synthesis for Reconfigurable Devices: Modelling, Temporal
Partitioning Algorithms (Text 2).
Module-4
Partial Reconfiguration Design: Partial Reconfiguration Design, Bitstream
Manipulation with JBits, The modular Design flow, The Early Access Design
Flow, Creating Partially Reconfigurable Designs, Partial Reconfiguration using
Hansel-C Designs, Platform Design (Text 2).
Module -5
Signal Processing Applications: Reconfigurable computing for DSP, DSP
application building blocks, Examples: Beamforming, Software Radio, Image
and video processing, Local Neighbourhood functions, Convolution (Text 1).
System on a Programmable Chip: Introduction to SoPC, Adaptive
Multiprocessing on Chip(Text 2).
32
Course Outcomes:
1. Understand the fundamental principles and practices in reconfigurable
architecture.
2. Simulate and synthesize the reconfigurable computing architectures.
3. Understand the FPGA design principles, and logic synthesis
4. Integrate hardware and software technologies for reconfiguration computing
focusing on partial reconfiguration design.
5. Design digital systems for a variety of applications on signal processing and
system on chip configurations.

from each module.
module.
Text Books:
1. ‘Reconfigurable Computing:Accelerating Computation with Field-
Programmable Gate Arrays’, M. Gokhale and P. Graham, Springer,
ISBN: 978-0-387-26105-8, 2005.
2. ‘Introduction to Reconfigurable Computing: Architectures, Algorithms
and Applications’, C. Bobda, Springer, ISBN: 978-1-4020-6088-5,
2007.
Reference Books:
1. ‘Practical FPGA Programming in C’, D. Pellerin and S. Thibault,
Prentice-Hall, 2005.
2. ‘FPGA Based System Design’,W. Wolf, Prentice-Hall, 2004.
3. ‘Rapid System Prototyping with FPGAs: Accelerating the Design
Process’, R. Cofer and B. Harding, Newnes, 2005.
33
Automotive Electronics
Credits - 04
Module 1
Automotive Fundamentals, the Systems Approach to Control and
Instrumentation:Use of Electronics in the Automobile, Antilock Brake
Systems(ABS), Electronic steering control, Power steering, Tractioncontrol,
Electronically controlled suspension (Chap.1 and2 of Text).
Module 2
Automotive instrumentation Control: Operational amplifiers, Digital circuits,
Logic circuits, Microcomputer fundamentals, Microcomputer operations,
Microprocessor architecture, digital to analog converter, analog to digital
converter, Microcomputer applications in automotive systems, Instrumentation
applications of microcomputers, Microcomputer in control systems (Chap.3 and
4 of Text).
Module 3
The basics of Electronic Engine control: Integrated body: Climate controls,
Motivation for ElectronicEngine Control, Concept of An Electronic Engine
Control System,Definition of General Terms, Definition of
EnginePerformanceTerms, Electronic fuel control system, Engine control
sequence,Electronic Ignition, Sensors and Actuators, Applications ofsensors
and actuators, air flow rate sensor, Indirect measurementof mass air flow,
Engine crankshaft angular position sensor,Automotive engine control actuators,
Digital engine control,Engine speed sensor, Timing sensor for ignition and fuel
delivery,Electronic ignition control systems, Safety systems, Interiorsafety,
Lighting, Entertainment systems (Chap. 5 and 6 of Text).
Module 4
Vehicle Motion Control and Automotive diagnostics: Cruisecontrol system,
Digital cruise control, Timing light, Engineanalyzer, On-board and off-board
diagnostics, Expert systems.Stepper motor-based actuator, Cruise control
electronics,Vacuum - antilock braking system, Electronic suspension system,
34
Electronic steering control, Computer-based instrumentationsystem, Sampling
and Input\output signal conversion, Fuelquantity measurement, Coolant
temperature measurement, Oilpressure measurement, Vehicle speed
measurement, Displaydevices, Trip-Information-Computer, Occupant
protectionsystems (Chap. 8 and 10 of Text).
Module 5
Future automotive electronic systems: Alternative Fuel Engines, Collision
Wide Range Air/Fuel Sensor,Alternative Engine, Low Tire Pressure Warning
System, Collisionavoidance Radar Warning Systems, Low Tire Pressure
WarningSystem, Radio Navigation, Advance Driver information
System.Alternative-Fuel Engines, Transmission Control, CollisionAvoidance
Radar Warning System, Low Tire Pressure WarningSystem, Speech Synthesis
Multiplexing in Automobiles, ControlSignal Multiplexing, Navigation Sensors,
Radio Navigation, Signpost Navigation, Dead Reckoning Navigation Future
Technology, Voice Recognition Cell Phone Dialing Advanced Driver
informationSystem, Automatic Driving Control (Chap. 11 of Text).
Course Outcomes:
1. Implement various control requirements in the automotive system.
2. Comprehend dashboard electronics and engine system electronics.
3. Identify various physical parameters that are to be sensed and
monitored for maintaining the stability of the vehicle under
dynamicconditions.
4. Understand and implement the controls and actuator system
pertainingto the comfort and safety of commuters.
5. Design sensor network for mechanical fault diagnostics in an
automotive vehicle.

from each module.
module.
35
Text Book:
‘Understanding Automotive Electronics’, William B.
Ribbens,SAMS/Elsevier publishing, 6thEdition, 1997.
Reference Book:
‘Automotive Electrics and Automotive Electronics-Systems and
Components, Networking and Hybrid Drive’, Robert Bosch Gmbh,Springer
Verlag,5thEdition, 2007.
36
Industrial Drives

Credits - 04
Module-1
An Introduction to Electrical Drives & its Applications: Electrical Drives,
Advantages of Electrical Drives,Parts of Electrical Drives, Choice of Electrical
Drive, Status of DC and AC Drives, Fundamental Torque Equations, Speed
TorqueConventions and Multiquadrant Operation.
Applications: Rolling mill drives, cement mill drives, paper milldrives and
textile mill drives.
Module 2
Selection of Motor Power Rating: Thermal model of motor for heating and
cooling, Classes of motor duty, determination ofmotor rating.
DC Motor Drives 1: Starting braking, transient analysis, singlephase fully
controlled rectifier, control of DC separately excitedmotor, Single-phase half
controlled rectifier: control of DC separatelyexcited motor.
Module 3
DC Motor Drives 2: Three phase fully controlled rectifier: control of DC
separately excited motor, three phases half controlledrectifier: control of DC
separately excited motor, multiquadrantoperation of DC separately excited
motor fed form fully controlledrectifier. Rectifier control of DC series motor,
chopper controlledDC drives, chopper control of separately excited DC motor.
Choppercontrol of series motor.
Module 4
Induction Motor Drives: Operation with unbalanced source voltage and single
phasing,operation with unbalanced rotor impedances, analysis of
inductionmotor fed from non-sinusoidal voltage supply, starting
braking,transient analysis. Stator voltage control variable voltage
frequencycontrol from voltage sources, voltage source inverter control,
closedloop control, current source inverter control, current regulatedvoltage
source inverter control.
37
Module 5
Synchronous Motor Drives: Operation form faced frequency supply,
synchronous motor variable speed drives, and variablefrequency control of
multiple synchronous motors. Self-controlledsynchronous motor drive
employing load commutated thrusterinverter.
Course Outcomes:
1. Identify suitable power converter from the available configurations.
2. Design controllers for closed-loop operation of a separately excited DC
motor drive with symmetrical optimization technique.
3. Model existing and modified power converters under small signal and
steady state condition.
4. Develop power converters with better performance for challenging
applications.
5. Design power converters and feedback loops.

from each module.
module.
Text Book:
‘Fundamentals of Electrical Drives’, GK Dubey, 2ndEdition, 5threprint,Narosa
publishing house.
Reference Books:
1. ‘Electrical Drives’, NK De and PK Sen, PHI, 2007.
2. ‘A First Course on Electric Drives’, SK Pillai, Wiley Eastern Ltd 1990.
3.‘Power Electronics, Devices, Circuits and Industrial Applications’,VR
Moorthi, Oxford University Press, 2005.
38
Micro Electro Mechanical Systems

Credits - 04
Module 1
Overview of MEMS and Microsystems: MEMS and Microsystem, Typical
MEMS and Microsystems Products, Evolution of Microfabrication,
Microsystems and Microelectronics, Multidisciplinary Nature of Microsystems,
Miniaturization. Applications and Markets.
Module 2
Working Principles of Microsystems: Introduction, Microsensors,
Microactuation, MEMS with Microactuators, Microaccelerometers,
Microfluidics.
Engineering Science for Microsystems Design and Fabrication:

Introduction, Atomic Structure of Matters, Ions and Ionization, Molecular
Theory of Matter and Inter-molecular Forces, Doping of Semiconductors, The
Diffusion Process, Plasma Physics, Electrochemistry.
Module 3
Engineering Mechanics for Microsystems Design: Introduction, Static
Bending of Thin Plates, Mechanical Vibration, Thermomechanics, Fracture
Mechanics, Thin Film Mechanics, Overview on Finite Element Stress Analysis.
Module 4
Scaling Laws in Miniaturization:
Introduction, Scaling in Geometry, Scaling in Rigid-Body Dynamics, Scaling in
Electrostatic Forces, Scaling of Electromagnetic Forces, Scaling in Electricity,
Scaling in Fluid Mechanics, Scaling in Heat Transfer.
Module 5
Overview of Micro-manufacturing: Introduction, Bulk Micro-manufacturing,
Surface Micromachining, The LIGA Process, Summary on
Micromanufacturing.
Microsystem Design: Introduction, Design Considerations, Process Design,
Mechanical Design, Using Finite Element Method.
39
Course Outcomes:
1. Understand the technologies related to Micro Electro Mechanical Systems.
2. Relate to the scaling laws in miniaturization.
3. Analyse the MEMS devices and develop suitable mathematical models
4. Understand the various application areas for MEMS devices
5. Describe the design and fabrication processes involved with MEMS
devices.

from each module.
module.
Text Book:
‘MEMS and Micro systems: Design, Manufacture and Nanoscale
Engineering’, Tai-Ran Hsu, John Wiley & Sons, ISBN: 978-0470-08301-7,
2nd Edition, 2008
Reference Books:
1. ‘Micro and Nano Fabrication: Tools and Processes’, Hans H. Gatzen,
Volker Saile, Jurg Leuthold, Springer, 2015
2. ‘Micro Electro Mechanical Systems (MEMS)’, Dilip Kumar Bhattacharya,
Brajesh Kumar Kaushik, Cengage Learning.
40
41
Synthesis and Optimization of Digital Circuits

Credits - 04
Module 1
Introduction to Synthesis and Optimization: Design of Microelectronics
circuits, Computer aided Synthesis and Optimization.
Hardware Modeling: HDLs for Synthesis, Abstract models, Compilation and
Behavioral Optimization(Text 1: Topics from Chap. 1,3).
Module 2
Graph theory for CAD for VLSI: Graphs, Combinatorial Optimization,
Graph Optimization problems and Algorithms, Boolean Algebra and
Applications.
Architectural Synthesis and Optimization: Fundamental Architectural
Synthesis problems, Area and Performance Estimation, Strategies for
Architectural Optimization, Datapath Synthesis, Control Path Synthesis (Text1:
Topics from Chap. 2,4).
Module 3
Two level Combinational Logic Optimization: Introduction, Logic
Optimizations, Operations on Two level Logic Covers, Algorithms for Logic
Minimization, Symbolic Minimization and Encoding Problems.
Multiple Level Combinational Logic Optimization: Introduction, Models and
Transformations for Combinational Networks, The Algebraic Model, The
Boolean Model (Text1: Chap. 7, 8).
Module 4
Sequential Logic Optimization: Introduction, Sequential Logic Optimization
using State based Models, Sequential Logic Optimization using Network
Models, Implicit FSM Traversal Methods, Testability concerns for
Synchronous Circuits (Text 1: Chap. 9).
Module 5
Scheduling Algorithms: Introduction, A Model for Scheduling problems,
Scheduling with Resource Constraints, Scheduling without Resource
42
Constraints, Scheduling Algorithms for Extended Sequencing Models,
Scheduling Pipelined Circuits.
Resource Sharing and Binding: Sharing and Binding for Resource dominated
circuits, Sharing and Binding for General Circuits, Concurrent Binding and
Scheduling(Text1: Chap. 5,6).
Course Outcomes:
1.Understand the process of synthesis and optimization in a top down
approach for digital circuits models using HDLs.
2. Understand the terminologies of graph theory and its algorithms to
optimize a Boolean equation.
3. Apply different two level and multilevel optimization algorithms for
combinational circuits.
4. Apply the different sequential circuit optimization methods using state
models and network models.
5. Apply different scheduling algorithms with resource binding and without
resource binding for pipelined sequential circuits and extended sequencing
models.
.

from each module.
module.
Text Book:
‘Synthesis and Optimization of Digital Circuits’, Giovanni De Micheli, Tata
McGraw-Hill, ISBN: 9780070582781, 2003.
Reference Book:
‘Automatic Logic synthesis Techniques for Digital Systems’, Edwars M.D,
Macmillan New Electronic Series, 1992.
43
Embedded and Signal Processing Lab
CourseCode 20EIEL26 CIEMarks 40

04 SEE Marks 60
TeachingHours/Week (2 Hrs Tutorial + 2 Hrs Exam Hours 03
Practical)
Credits - 02
Laboratory Experiments:
PART-A: Following RTOS experiments to be done using Linux.
Sl.N
Experiments
o.
Develop and test programs to
1 (a) create child processand display its ID and
(b) Execute child processfunction using switch structure.
Develop and test the program for a multithreadedapplication, where
2 communication is through a bufferfor the conversion of lowercase
text to uppercase text,using semaphore concept.
Develop and test the program for a multithreadedapplication, where
3 communication is through sharedmemory for the conversion of
lowercase text touppercase text.
Develop program for inter-thread communicationusing message
4 queue. Data is to be input from thekeyboard for the chosen
application.
Create ‘n’ number of child threads.
Each threadprints the message “I’m in thread number …” and
5 sleeps for 50 ms and then quits.
The main threadwaits for complete execution of all the child
threadsand then quits. Compile and execute in Linux.
Implement the multi-thread application satisfying thefollowing:
i. Two child threads are created withnormal priority.
ii. Thread 1 receives and prints its priority and sleepsfor 50ms
and then quits.
6 iii. Thread 2 prints the priority of the thread 1 andrises its
priority to above normal and retrieves thenew priority of
thread 1, prints it and then quits.
iv. The main thread waits for the child thread tocomplete its job
and quits.
7 Implement the usage of anonymous pipe with 512bytes for data
44
sharing between parent and childprocesses using handle inheritance
mechanism.
PART-B: Digital Signal Processing using MATLAB
Sl.
Experiments
No.
Comparison of DFT and DCT (in terms of energycompactness)
Generate the sequence x[n] = n-64 for n=0,…,127.
(a) Let X[k]=DFT{x[n]}. For various values of L, set to zerothe

“high frequency coefficients” X[64-L]=….X[64]=…….=
1
X[64+L]=0. Take the inverse DFT and plot theresults.
(b) Let XDCT[k]=DCT(x[n]). For the same values of L, set tozero the
high frequency coefficients XDCT[127-L]=…..XDCT[127]. Take
the inverse DCT for each case andcompare the reconstruction
with the previous case.
Design digital FIR LPF and HPF using the followingwindows
techniques.
2
i) Hamming window function
ii) Kaiser window function
Design digital IIR Butterworth low pass and high passfilter using
bilinear transformation.
3
Compare FIR and IIR filter in terms of performance(accuracy in
meeting specifications) and computationalcomplexity.
Compute Fourier Transform & its inverse FourierTransform of an
4
image.
5 Compute FFT when N is not a power of 2.
6 Design an equiripple filter for the given specification.
Course outcomes:
1. Select a suitable task switching technique in a multithreadedapplication.
2. Implement different techniques of message passing and Intertask/thread
communication.
3. Implement different data structures such as pipes, queues, sharedmemory,
semaphores, buffers in multithreaded programming.
4. Implement DCT, DFT, FFT and IFFT for the given input data.
5. Implement the appropriate design method for FIR and IIR filters.
45
Conduct of Practical Examination:
1. All laboratory experiments are to be included for practical examination.
2. Students are allowed to pick one experiment from the lot, consisting of two
questions selected one from each part.
3. Strictly follow the instructions as printed on the cover page of answer script
for breakup of marks.
4.Change of experiment is allowed only once and Marks allotted to the
procedure part to be made zero.
46
Technical Seminar
SEE Marks -
Number of Contact Hours/Week 02
Exam Hours -
Credits - 02
Course objectives:
The objective of the seminar is to inculcate self-learning, face audience
confidently, enhance communication skill, involve in group discussion and
present and exchange ideas.
Each student, under the guidance of a Faculty, is required to

 Choose, preferably through peer reviewed journals, a recent topic of his/her
interest relevant to the Course of Specialization.
 Carryout literature survey, organize the Course topics in a systematic order.
 Prepare the report with own sentences.
 Type the matter to acquaint with the use of Micro-soft equation and drawing
tools or any such facilities.
 Present the seminar topic orally and/or through power point slides.
 Answer the queries and involve in debate/discussion.
 Submit two copies of the typed report with a list of references.
The participants shall take part in discussion to foster friendly and stimulating
environment in which the students are motivated to reach high standards and
become self-confident.
The CIE marks for the seminar shall be awarded (based on the relevance of the
topic, presentation skill, participation in the question and answer session and
quality of report) by the committee constituted for the purpose by the Head of
the Department. The committee shall consist of three faculties from the
department with the senior most acting as the Chairperson.
Marks distribution for CIE of the course 20EIE27 seminar:

Seminar Report: 50 marks
Presentation skill: 25 marks
Question and Answer:25 marks
47

SEMESTER -III
PLCs and Industrial Automation

Credits - 04
Module -1
Introduction to PLCs: Technical Definition, Advantages, Characteristic
Functions,Chronological Evolution, Types, Unitary PLC, Modular PLC,
SMEEl PLC,Medium PLC, Large PLC, Block Diagram Of PLC, Input / Output
Section, Processor Section, Power Supply, Memory, Central ProcessingUnit,
Processor Software / Executive Software, Multitasking, Languages,Ladder
Language.
Bit Logic Instructions: Introduction, Input and Output Contact Program,
Symbols, NumberingSystem of Inputs and Outputs, Program Format,
Introduction to Logic,Equivalent Ladder Diagram of - AND Gate, OR Gate,
NOT Gate, XORGate, NAND Gate, NOR Gate, Equivalent Ladder Diagram
toDemonstrate De Morgan Theorem, Ladder Design.
Module -2
PLC Timers and Counters: Timer and its Classification, Characteristics of
PLC Timer, Functions inTimer, Resetting – Retentive and Non-Retentive,
Classification of PLCTimer, On Delay, and Off Delay Timers, Timer-On
Delay, Timer OffDelay, Retentive And Non-Retentive Timers, Format of a
TimerInstruction. PLC Counter, Operation of PLC Counter,
CounterParameters, Counter Instructions. Overview, Count Up (CTU),
CountDown (CTD).
Advanced Instructions: Comparison Instructions, Addressing Data Files,
Format of LogicalAddress, Addressing Format for Micrologic System,
Different AddressingTypes. Data Movement Instructions.
Module -3
Logical Instructions: Mathematical Instructions and its Features, Special
MathematicalInstructions, Scale with Parameters or SCP Instruction. Data
48
HandlingInstructions and its Features, Program Flow Control
Instructions,Proportional Integral Derivative (PID) Instruction.
PLC I/O Modules and Power Supply: Classification of I/O, I/O System
Overview, Practical I/O System and itsmapping, Addressing Local and
Expansion I/O, Input-Output Systems,Direct I/O Parallel I/O Systems Serial I/O
Systems, Sinking andSourcing, Sourcing and Sinking in PLC Interfacing,
Discrete InputModule, Discrete DC Input Module, Discrete AC Input Module,
Rectifierwith Filter, Threshold Detection, Isolation, Logic Section,
DiscreteOutput Modules, Advantages and Disadvantages of Output
Modules,Types of Analog Input Module.
Module -4
Industrial Communication: Introduction, Evolution of Industrial Control
Process, Types ofCommunication Interface, Types of Networking Channels,
ParallelCommunication Interface. Serial Communication
Interface,communication mode, Synchronous and Asynchronous
Transmissions,Standard Interface RS 232C, RS 422, EIA 485, Comparison,
SoftwareProtocol, Industrial Network. Network Topology, Media Access
Methods.
Module -5
Industrial Networking: Open System Interconnection (OSI), Network Model,
NetworkComponents, Control Network Issues, Advantage of
StandardizedIndustrial Network, Intelligent Devices, Industrial Network Bus
Network,Device Bus Network vs. Process Bus Network, Controller Area
Network(CAN), Devicenet, Controlnet, Ethernet Protocol, AS-I
Interface,FOUNDATION FIELDBUS, Application of Profibus for Real
PLCCommunication.
Industrial Automation: Introduction, Utility of Automation, General Structure

of an AutomatedProcess, Examples of Simple Automated Systems, Selection of
PLC.
Course Outcomes:
1. Gain knowledge on Programmable Logic Controllers.
2. Understand different types of Devices to which PLC input and output
modules are connected.
3. Create ladder diagrams from process control descriptions.
4. Apply PLC timers and counters for the control of industrial processes.
5. Acquire the Knowledge of Networking in Industrial automation.
49
from each module.
module.
Text Book:
‘Programmable LogicControllers and Industrial Automation’,
Madhuchhanda Mitra and Samarjit Sengupta,Penram International
Publishing (India)Pvt. Ltd., 2007. ISBN: 81-87972-17-3.
Reference Books:
1. ‘Introduction to Programmable Logic Controllers’, Garry Dunning,
2ndEdition,Delmar Thomson Learning, 2001. ISBN: 981-240-625-5.
2. ‘Computer Control of Processes’,M. Chidambaram, CRC Press, 2002.
50
Advances in Image Processing

Credits - 03
Module-1
The image, its representations and properties: Image representations a few
concepts, Image digitization, Digital image properties, Color images.
Module-2
Image Pre-processing: Pixel brightness transformations, geometric
transformations, local pre-processing.
Module-3
Segmentation: Thresholding; Edge-based segmentation – Edge image
thresholding, Edge relaxation, Border tracing, Hough transforms; Region –
based segmentation – Region merging, Region splitting, Splitting and merging,
Watershed segmentation, Region growing post-processing.
Module-4
Shape representation and description: Region identification; Contour-based
shape representation and description – Chain codes, Simple geometric border
representation, Fourier transforms of boundaries, Boundary description using
segment sequences, B-spline representation; Region-based shape representation
and description – Simple scalar region descriptors, Moments, Convex hull.
Module-5
Mathematical Morphology: Basic morphological concepts, Four morphological
principles, Binary dilation and erosion, Skeletons and object marking,
Morphological segmentations and watersheds.
Course outcomes:
1. Understand the representation of the digital image and its properties.
2. Apply pre-processing techniques required to enhance the image for its further
analysis.
3. Use segmentation techniques to select the region of interest in the image for
analysis.
51
4. Represent the image based on its shape and edge information and also
describe the objects present in the image based on its properties and
structure.
5. Use morphological operations to simplify images, and quantify and preserve
the main shape characteristics of the objects.

from each module.
module.
Text Book:
‘Image Processing, Analysis, and Machine Vision’, Milan Sonka, Vaclav
Hlavac, Roger Boyle, Cengage Learning, ISBN: 978-81-315-1883-0, 2013
Reference Books:
1. ‘Digital Image Processing for Medical Applications’, Geoff Doughertry,
Cambridge university Press, 2010.
2. ‘Digital Image Processing’, S Jayaraman, S Esakkirajan, T Veerakumar, Tata
McGraw Hill, 2011.
52
Medical Imaging

Credits - 03
Module 1
Generation and Detection of X-Rays: X-Ray generation and X-Ray
generators, Filters, Beam Restrictors and Grids, Screens, X-RayDetectors.
X-Ray Diagnostic Methods: Conventional X-Ray Radiography,Fluoroscopy,
Angiography, Mammography, Xeroradiography, ImageSubtraction.
X-Ray Image Characteristics: Spatial Resolution, Image Noise,Image
contrast.
Biological Effects of Ionizing Radiation: Determination ofbiological effects,
Short term and Long term effects.
Module 2
X-Ray Tomography: Conventional Tomography, Computed Tomography -
Projection function, Algorithms for ImageReconstruction, CT number, Image
Artifacts.
Digital Radiography: Digital Subtraction Angiography (DSA), DualEnergy
Subtraction, K-Edge subtraction, 3-D Reconstruction.
Recent Developments: Dynamic Spatial Reconstructor (DSR),Imatron or
Fastrac Electron Beam CT.
Module 3
Generation and Detection of Ultrasound: Piezoelectric effect,Ultrasonic
Transducers, Transducer Beam Characteristics, Axial and Lateral resolution,
Focusing and Arrays.
Ultrasonic Diagnostic Methods: Pulse Echo systems - A mode, Bmode, M
mode and C mode, Transmission Methods, Dopplermethods, Duplex Imaging.
Biological Effects of Ultrasound: Acoustic phenomena at highintensity levels,
Ultrasound Bioeffects.
Module 4
Generation and Detection of Nuclear Emission: Nuclear Sources,
Radionuclide Generators, Nuclear Radiation Detectors, Collimators.
Diagnostic methods using Radiation Detector Probes: ThyroidFunction test,
Renal function test, Blood volume measurement.
53
New Radio Nuclide Imaging methods: Longitudinal SectionTomography,
SPECT and PET
Characteristics of Radionuclide Images: Spatial Resolution, Imagecontrast,
Image Noise.
Module 5
Generation and Detection of NMR signal: The NMR Coil/Probe, The
transmitter and the Receiver, Data acquisition.
Magnetic Resonance Imaging methods: Spin Echo Imaging,Gradient Echo
Imaging, Blood flow Imaging.
Characteristics of MRI images: Spatial Resolution, Image Contrast.
Imaging Safety.
Course outcomes:
1. Understand the Generation and Detection of X-Rays, the
DiagnosticMethods, Characteristics of X-ray images and Biological effects
of X-rays.
2.Analyze Computed tomography and Digital Radiography.
3. Learn the techniques of Generation and Detection of Ultrasound, Pulse Echo
Systems and Ultrasonic Diagnostic Methods.
4. Understand the principles of various radiological imaging techniques such
as SPECT and PET.
5. Understand the principles of Magnetic Resonance Imaging, the concepts of
Radionuclide Generation and Detection.

from each module.
module.
Text Book:
‘Principles of MedicalImaging’, Kirk Shung, Michael B Smith, Benjamin
M W Tsui, Academic Press, 2012.
54
Reference Books:
1. ‘Fundamentals of Medical Imaging’,Zhong Hicho and Manbir Singh,
John Wiley, 1993.
2. ‘Nuclear Medicine Introductory Text’,Peter Josefell& Edwards Sydney,
William Blackwell Scientific Publishers, London.
55
Business Intelligence and its Applications
Credits - 03
Module 1
Development Steps, BI Definitions, BI Decision Support Initiatives,
DevelopmentApproaches, Parallel Development Tracks, BI Project Team
Structure, Business Justification,Business Divers, Business Analysis Issues,
Cost – Benefit Analysis, Risk Assessment,Business Case Assessment
Activities, Roles Involved In These Activities, Risks of NotPerforming Step,
Hardware, Middleware, DBMS Platform, NonTechnical
InfrastructureEvaluation
Module 2
Managing The BI Project, Defining And Planning The BI Project, Project
PlanningActivities, Roles And Risks Involved In These Activities, General
Business Requirement,Project Specific Requirements, Interviewing Process.
Module 3
Differences in Database Design Philosophies, Logical Database Design,
Physical DatabaseDesign, Activities, Roles And Risks Involved In These
Activities, Incremental Rollout,Security Management, Database Backup And
Recovery.
Module 4
Growth Management, Application Release Concept, Post Implementation
Reviews, Release Evaluation Activities, The Information Asset and Data
Valuation, Actionable Knowledge –ROI, BI Applications, The Intelligence
Dashboard.
Module 5
Business View of Information technology Applications: Business Enterprise
excellence, Key purpose of using IT, Type of digital data, basics of enterprise
reporting, BI road ahead.
56
Course outcomes:
At the end of the course the students will be able to:
1.Evaluate the key elements of a successful business intelligence (BI) program
2. Apply a BI meta model that turns outcomes into actions
3. Extract and transform data from an operational data to a data business data
4. Evaluate business analytics and performance measurement tools
5. Demonstrate a business scenario, identify the metrics, indicators and make
recommendations to achieve the business goal.

from each module.
module.
Text Books:
1. ‘Business Intelligence Roadmap: The Complete ProjectLifecycle for
Decision Support Applications’, Larissa T Moss and ShakuAtre,
Addison Wesley Information Technology Series, 2003.
2. ‘Fundamentals of Business Analytics’, R N Prasad, SeemaAcharya,
Wiley India, 2011.
Reference Books:
1. ‘Business Intelligence: The Savvy Manager's Guide’, David Loshin,

Publisher: MorganKaufmann, ISBN 1-55860-196-4.
2. ‘Delivering Business Intelligence with Microsoft SQL Server2005’, Brian
Larson, McGraw Hill,2006.
3. ‘Foundations of SQL Server 2008’, Lynn Langit, Business Intelligence –
Apress,ISBN13: 978-14302-3324-4,2011.
57
RF MEMS

Credits - 03
Module 1
Review: Introduction to MEMS: Fabrication for MEMS transducers and
actuators, Microsensing for MEMS, Materials for MEMS.
MEMS materials and fabrication techniques: Metals, Semiconductors, Thin
films, Materials for polymer MEMS, Bulk machining for Silicon based MEMS,
Surface machining for Silicon based MEMS, Micro stereo-lithography for
polymer MEMS.
Module 2
RF MEMS Switches and micro-relays: Switch parameters, Basics of
switching, Switches for RF and Microwave applications, Actuation
mechanisms, Micro-relays and micro-actuators, Dynamic of switch operations,
MEMS switch design and design consideration, MEMS inductors and
capacitors.
Module 3
Micro machined RF filters and phase shifters: RF filters, Modelling of
mechanical filters, Micro-mechanical filters, SAW filters - Basic, Design
consideration. Bulk acoustic wave filters, Micro-machined filters for millimetre
wave frequencies. Micro-machined phase shifters, Types and limitations,
MEMS and Ferroelectric phase shifters, Applications.
Module 4
Micromachined transmission line and components: Micromachined
transmission line: Losses in transmission line, coplanar lines, Microshield and
membrane supported lines, Microshield components, Micromachined
waveguides, Directional couplers and Mixers, Resonators and Filters.
Module 5
Micromachined antennas: design, Fabrication and measurements. Integration
and packaging for RF MEMS. Roles and types of packages, Flip chip
techniques, Multichip module packaging and Wafer bonding, Reliability issues
and thermal issues.
58
Course outcomes:
1. Comprehend the need for micromachining and MEMS based systems
for RF and microwave applications
2. Describe the micromachining techniques and their use in the
fabrication of micro switches, capacitors and inductors
3. Design MEMS based microwave components aimed at reducing
insertion loss and increasing bandwidth.
4. Realize high Q micromechanical filters for frequencies up to and
beyond 10 MHz, and micromachined surface acoustic wave (SAW)
filters filling the gap up to 2 GHz.
5. Describe the packaging approaches used for these RF MEMS devices.

from each module.
module.
Text Book:
‘RF MEMS and their Applications’, Vijay K Varadan, K. J. Vinoy and K.
A. Jose, Wiley India Pvt. Ltd., ISBN - 10 : 8126529911, 2011.
Reference books:
1. ‘RF MEMS circuit design’, J De Los Santos, Artech House, 2002.
2. ‘Transaction Level Modelling with System C: TLM concepts and
applications for Embedded Systems’, Frank Ghenassia, Springer, 2005.
3. ‘Networks on chips: Technology and Tools’, Luca Beninid, Morgan
Kaufmann Publishers, 2006.
59
Professional elective 4
Advanced Power Electronic Converters and Applications

Credits - 03
Module 1
Introduction to power electronics: Introduction to PowerProcessing, Several
Applications of Power Electronics, Elementsof Power Electronics.
Principles of Steady State Converter Analysis: Inductor Volt-
SecondBalance,CapacitorChargeBalance,andtheSmall-
RippleApproximation,Boost Converter Example, Cuk ConverterExample
Estimating the Output voltage ripple and inductorcurrent ripple in converters
Containing Two-Pole Low-Pass Filter(Text 1).
Module 2
Converter Dynamics and Control: AC Equivalent Circuit Modeling, The
Basic AC Modeling Approach, State-SpaceAveraging, Circuit Averaging and
Averaged Switch Modeling, TheCanonical Circuit Model, Modeling the Pulse-
Width Modulator,Analysis of Converter Transfer Functions, Graphical
Constructionof Impedances and Transfer Functions(Text 1).
Module 3
Controller Design: Introduction, Effect of Negative Feedback onthe Network
Transfer Functions, Construction of the Important Quantities 1/(1 + T) and T/(1
+ T) and the Closed-Loop TransferFunctions, Stability, The Phase Margin Test,
The RelationshipBetween Phase Margin and Closed-Loop Damping
Factor,Transient Response vs. Damping Factor, Regulator Design,Measurement
of Loop Gains (Text 1).
Module 4
Modern Rectifiers and Power System Harmonics: Power andHarmonics in
Nonsinusoidal Systems, Pulse-Width ModulatedRectifiers.
Resonant Converters: Sinusoidal Analysis of ResonantConverters with
examples (Text 1).
60
Module 5
Power supply applications: Switching DC Power Supplies, Motor drive
applications: Introduction to Motor Drives, DC-Motor Drives,Residential and
Industrial Applications, Electric UtilityApplications (Text 2).
Course outcomes:
1. Estimate and analyze the dynamics of power electronic converters
2. Understand the sustainable energy generation technologies.
3. Perform Modelling and analysis of power electronic systems and
equipment using computational software.
4. Simulate and analyze resonant converters.
5. Apply the knowledge of mathematics to converter/machine dynamics in
Electrical engineering.

from each module.
module.
Text Books:
1. ‘Fundamentals of Power Electronics’,Erickson and Maksimovic,
2ndEdition, Kluwer Academic Publishers, 2001.
2. ‘PowerElectronics converters, Applications and Design’, MNedMohan,
Tore Undeland and WilliamPRobbins, John Wiley andSons, 3 rdEdition,
2002.
Reference Books:
1. ‘Switching Power Supply Design’, Abraham Pressman, McGraw-
HillPublishers, 1998.
2. ‘Power Electronics Handbook’, Muhammad H.
Rashid,2ndEdition,Academic Press, 2007.
61
Pattern Recognition & Machine Learning
CourseCode 20ESP332 CIEMarks 40
Credits - 03
Module 1
Introduction: Probability Theory, Model Selection, The Curse of
Dimensionality, Decision Theory, Information Theory
Distributions: Binary and Multinomial Variables, The Gaussian Distribution,
The Exponential Family, Nonparametric Methods (Ch. 1,2).
Module-2
Supervised Learning
Linear Regression Models: Linear Basis Function Models, The Bias-Variance
Decomposition, Bayesian Linear Regression, Bayesian Model Comparison
Classification & Linear Discriminant Analysis: Discriminant Functions,
Probabilistic Generative Models, Probabilistic Discriminative Mode (Ch. 3,4).
Module-3
Supervised Learning
Kernels: Dual Representations, Constructing Kernels, Radial Basis Function
Network, Gaussian Processes
Support Vector Machines: Maximum Margin Classifiers, Relevance Vector
Machines
Neural Networks: Feed-forward Network, Network Training, Error
Backpropagation (Ch. 5,6,7).
Module-4
Unsupervised Learning
Mixture Models: K-means Clustering, Mixtures of Gaussians, Maximum
likelihood, EM for Gaussian mixtures, Alternative View of EM.
Dimensionality Reduction: Principal Component Analysis, Factor/Component
Analysis, Probabilistic PCA, Kernel PCA, Nonlinear Latent Variable Models
(Ch. 9,12).
Module-5
Probabilistic Graphical Models: Bayesian Networks, Conditional
Independence, Markov Random Fields, Inference in Graphical Models, Markov
Model, Hidden Markov Models (Ch.8,13).
62
Course outcomes:
1.Identify areas where Pattern Recognition and Machine Learning can offer a
solution.
2.Describe the strength and limitations of some techniques used in
computational Machine Learning for classification, regression and density
estimation problems.
3.Describe and model data.
4.Solve problems in Regression and Classification.
5.Discuss main and modern concepts for model selection and parameter
estimation in recognition, decision making and statistical learning problems.

from each module.
module.
Text Book:
‘Pattern Recognition and Machine Learning’, Christopher Bishop, Springer,
2006.
63
Internet of Things

Credits - 03
Module-1
What is IoT ?
Genesis, Digitization, Impact, Connected Roadways, Buildings, Challenges
IoT Network Architecture and Design
Drivers behind new network Architectures, Comparing IoT Architectures,
M2M architecture, IoT world forum standard, IoT Reference Model, Simplified
IoT Architecture.
Module-2
IoT Network Architecture and Design
Core IoT Functional Stack, Layer1 (Sensors and Actuators), Layer 2
(Communications Sublayer), Access network sublayer, Gateways and backhaul
sublayer, Network transport sublayer, IoT Network management.
Layer 3 (Applications and Analytics) – Analytics vs Control, Data vs Network
Analytics, IoT Data Management and Compute Stack
Module-3
Engineering IoT Networks
Things in IoT – Sensors, Actuators, MEMS and smart objects.
Sensor networks, WSN, Communication protocols for WSN
Communications Criteria, Range, Frequency bands, power consumption,
Topology, Constrained Devices, Constrained Node Networks
IoT Access Technologies, IEEE 802.15.4
Competitive Technologies – Overview only of IEEE 802.15.4g, 4e, IEEE
1901.2a
Standard Alliances – LTE Cat 0, LTE-M, NB-IoT
Module-4
Engineering IoT Networks
IP as IoT network layer, Key Advantages, Adoption, Optimization, Constrained
Nodes, Constrained Networks, IP versions, Optimizing IP for IoT.
64
Application Protocols for IoT – Transport Layer, Application Transport layer,
Background only of SCADA, Generic web based protocols, IoT Application
Layer
Data and Analytics for IoT – Introduction, Structured and Unstructured data,
IoT Data Analytics overview and Challenges.
Module-5
IoT in Industry (Three Use cases)
IoT Strategy for Connected manufacturing, Architecture for Connected Factory
Utilities – Power utility, IT/OT divide, Grid blocks reference model, Reference
Architecture, Primary substation grid block and automation.
Smart and Connected cities –Strategy, Smart city network Architecture, Street
layer, city layer, Data center layer, services layer, Smart city security
architecture, Smart street lighting.
Course outcomes:
1. Understand the basic concepts IoT Architecture and devices employed.
2. Analyze the sensor data generated and map it to IoT protocol stack for
transport.
3. Apply communications knowledge to facilitate transport of IoT data over
various available communications media.
4. Design a use case for a typical application in real life ranging from sensing
devices to analyzing the data available on a server to perform tasks on the
device.
5. Apply knowledge of Information technology to design of IoT applications
(Operational Technology).

from each module.
module.
65
Text Book:
‘CISCO, IoT Fundamentals – Networking Technologies, Protocols, Use

Cases for IoT’, David Hanes, Gonzalo Salgueiro, Patrick Grossetete,
Robert Barton, Jerome Henry, Pearson Education, ISBN: 978-9386873743,
First edition, 2017
Reference Book:
‘Internet of Things – A Hands on Approach’, ArshdeepBahga and Vijay

Madisetti, Orient Blackswan Private Limited - New Delhi, First edition,
2015
66
Communication System Design using DSP algorithm
CourseCode 20ESP334 CIEMarks 40
Credits - 03
Module 1
Introduction to the course: Digital filters, Discrete time convolution and
frequency responses, FIR filters - Using circular buffers to implement FIR
filters in C and using DSP hardware, Interfacing C and assembly functions,
Linear assembly code and the assembly optimizer. IIR filters - realization and
implementation, FFT and power spectrum estimation: DTFT window function,
DFT and IDFT, FFT, Using FFT to implement power spectrum.
Module 2
Analog modulation scheme: Amplitude Modulation - Theory, generation and
demodulation of AM, Spectrum of AM signal, Envelope detection and square
law detection, Hilbert transform and complex envelope, DSP implementation of
amplitude modulation and demodulation.
DSBSC: Theory generation of DSBSC, Demodulation, and demodulation using
coherent detection and Costas loop. Implementation of DSBSC using DSP
hardware.
SSB: Theory, SSB modulators, Coherent demodulator, Frequency translation,
Implementation using DSP hardware.
Module 3
Frequency modulation: Theory, Single tone FM, Narrow band FM, FM
bandwidth, FM demodulation, Discrimination and PLL methods,
Implementation using DSP hardware.
Digital Modulation scheme: PRBS, and data scramblers: Generation of PRBS,
Self-synchronizing data scramblers, Implementation of PRBS and data
scramblers. RS-232C protocol and BER tester: The protocol, error rate for
binary signaling on the Gaussian noise channels, Three-bit error rate tester and
implementation.
Module 4
PAM and QAM: PAM theory, baseband pulse shaping and ISI, Implementation
of transmit filter and interpolation filter bank. Simulation and theoretical
exercises for PAM, Hardware exercises for PAM.
67
QAM fundamentals: Basic QAM transmitter, 2 constellation examples, QAM
structures using passband shaping filters, Ideal QAM demodulation, QAM
experiment. QAM receivers-Clock recovery and other frontend sub-systems.
Equalizers and carrier recovery systems.
Module 5
Experiment for QAM receiver frontend, Adaptive equalizer, Phase splitting,
Fractionally spaced equalizer. Decision directed carrier tracking, Blind
equalization, Complex cross coupled equalizer and carrier tracking experiment.
Echo cancellation for full duplex modems: Multicarrier modulation, ADSL
architecture, Components of simplified ADSL transmitter, A simplified ADSL
receiver, Implementing simple ADSL Transmitter and Receiver.
Course outcomes:
1. Realize communication systems, including algorithms that are particularly
suited to DSP implementation
2. Implement DSP algorithms on TI DSP processors
3. Implement FIR, IIR digital filtering and FFT methods
4. Implement modulators and demodulators for AM, DSBSC-AM, SSB and
FM
5. Design digital communication methods leading to the implementation of a
line communication system.

from each module.
module.
Text Book:
‘Communication System Design using DSP Algorithms with Laboratory
Experiments for the TMS320C6713 DSK’, Steven A Tretter, Springer,
2008.
68
Reference Books:
1. ‘Modern Digital Signal Processing’, Roberto Cristi, Cengage

Publishers, India, 2003.
2. ‘Digital Signal Processing: A Computer Based Approach’, S. K. Mitra,
TMH, India, 3rd edition, 2007.
3. ‘Digital Signal Processing: A Practitioner’s approach’, E.C. Ifeachor,
and B. W. Jarvis, Pearson Education, India, Second Edition, 2002,
4. ‘Digital Signal Processing’, Proakis and Manolakis, Prentice Hall, 3 rd
edition, 1996.
69
Project Work Phase – 1

SEE Marks -
Number ofcontactHours/Week 02
Exam Hours -
Credits - 02
Course objectives:
 Support independent learning.
 Guide to select and utilize adequate information from varied resources
maintaining ethics.
 Guide to organize the work in the appropriate manner and present
information (acknowledging the sources) clearly.
 Develop interactive, communication, organisation, time management,
and presentation skills.
 Impart flexibility and adaptability.
 Inspire independent and team working.
 Expand intellectual capacity, credibility, judgement, intuition.
 Adhere to punctuality, setting and meeting deadlines.
 Instil responsibilities to oneself and others.
 Train students to present the topic of project work in a seminar without
any fear, face audience confidently, enhance communication skill,
involve in group discussion to present and exchange ideas.
Project Phase-1 Students in consultation with the guide/s shall carry out
literature survey/ visit industries to finalize the topic of the Project.
Subsequently, the students shall collect the material required for the selected
project, prepare synopsis and narrate the methodology to carry out the project
work.
Seminar:Each student, under the guidance of a Faculty, is required to

 Present the seminar on the selected project orally and/or through
power point slides.
 Submit two copies of the typed report with a list of references.
70
Revised Bloom’s L3 – Applying, L4 – Analysing, L5 –
Taxonomy Level Evaluating, L6 – Creating.
Course outcomes:
1. Demonstrate a sound technical knowledge of their selected project topic.
2. Undertake problem identification, formulation and solution.
3. Design engineering solutions to complex problems utilising a systems
approach.
4. Communicate with engineers and the community at large in written an
oral forms.
5. Demonstrate the knowledge, skills and attitudes of a professional
engineer.
Continuous Internal Evaluation

CIE marks for the project report (50 marks), seminar (25 marks) and question
and answer (25 marks) shall be awarded (based on the quality of report and
presentation skill, participation in the question and answer session by the
student) by the committee constituted for the purpose by the Head of the
Department. The committee shall consist of three faculty from the department
with the senior most acting as the Chairperson.
71
MINI PROJECT
Number of contact SEE Marks -
02
Hours/Week Exam Hours/ Batch 03
Credits - 02
Course objectives:
 To support independent learning and innovative attitude.
 To guide to select and utilize adequate information from varied
resources upholding ethics.
 To guide to organize the work in the appropriate manner and present
 To develop interactive, communication, organisation, time
management, and presentation skills.
 To impart flexibility and adaptability.
 To inspire independent and team working.
 To expand intellectual capacity, credibility, judgement, intuition.
 To adhere to punctuality, setting and meeting deadlines.
 To instil responsibilities to oneself and others.
 To train students to present the topic of project work in a seminar
without any fear, face audience confidently, enhance communication
skill, involve in group discussion to present and exchange ideas.
Mini-Project: Each student of the project batch shall involve in carrying out
the project work jointly in constant consultation with internal guide, co-guide,
and external guide and prepare the project report as per the norms avoiding
plagiarism.
Course outcomes:
1. Present the mini-project and be able to defend it.
2. Make links across different areas of knowledge and to generate,
develop and evaluate ideas and information so as to apply these skills
to the project task.
3. Habituated to critical thinking and use problem solving skills.
4. Communicate effectively and to present ideas clearly and coherently in
both the written and oral forms.
5. Work in a team to achieve common goal.
6. Learn on their own, reflect on their learning and take appropriate
actions to improve it.
72
CIE procedure for Mini - Project:
The CIE marks awarded for Mini - Project, shall be based on the evaluation of
Mini - Project Report, Project Presentation skill and Question and Answer
session in the ratio 50:25:25.The marks awarded for Mini - Project report shall
be the same for all the batch mates.
73
Internship / Professional Practice
CourseCode 20EIEI36 CIEMarks 40
SEE Marks 60
Number of contact Hours/Week 02
Exam Hours 03
Credits - 06
Course objectives:
Internship/Professional practice provide students the opportunity of hands-on
experience that include personal training, time and stress management,
interactive skills, presentations, budgeting, marketing, liability and risk
management, paperwork, equipment ordering, maintenance, responding to
emergencies etc. The objectives are further,
 To put theory into practice.
 To expand thinking and broaden the knowledge and skills acquired
through course work in the field.
 To relate to, interact with, and learn from current professionals in the
field.
 To gain a greater understanding of the duties and responsibilities of a
professional.
 To understand and adhere to professional standards in the field.
 To gain insight to professional communication including meetings,
memos, reading, writing, public speaking, research, client interaction,
input of ideas, and confidentiality.
 To identify personal strengths and weaknesses.
 To develop the initiative and motivation to be a self-starter and work
independently
Internship/Professional practice: Students under the guidance of internal

guide/s and external guide shall take part in all the activities regularly to acquire
as much knowledge as possible without causing any inconvenience at the place
of internship.
Seminar: Each student, is required to

 Present the seminar on the internship orally and/or through power
point slides.
 Submit the report duly certified by the external guide.
74
Course outcomes:
 Gain practical experience within industry in which the internship is
done.
 Acquire knowledge of the industry in which the internship is done.
 Apply knowledge and skills learned to classroom work.
 Develop a greater understanding about career options while more
clearly defining personal career goals.
 Experience the activities and functions of professionals.
 Develop and refine oral and written communication skills.
 Identify areas for future knowledge and skill development.
 Expand intellectual capacity, credibility, judgment, intuition.
 Acquire the knowledge of administration, marketing, finance and
economics.
Continuous Internal Evaluation

CIE marks for the Internship/Professional practice report (20 marks), seminar
(10 marks) and question and answer session (10 marks) shall be awarded (based
on the quality of report and presentation skill, participation in the question and
answer session by the student) by the committee constituted for the purpose by
the Head of the Department. The committee shall consist of three faculty from
the department with the senior most acting as the Chairperson.
Semester End Examination

SEE marks for the Internship Report (30 Marks), Seminar (15 Marks) and
Question and Answer Session (15 marks) shall be awarded (based on the
quality of report and presentation skill, participation in the question and answer
session) by the examiners appointed by the University.
75

SEMESTER -IV
PROJECT WORK PHASE -2

SEE Marks 60
Number of contact Hours/Week 04
Exam Hours 03
Credits - 20
Course objectives:
 To support independent learning.
 To guide to select and utilize adequate information from varied
resources maintaining ethics.
 To guide to organize the work in the appropriate manner and present
 To develop interactive, communication, organisation, time
management, and presentation skills.
 To impart flexibility and adaptability.
 To inspire independent and team working.
 To expand intellectual capacity, credibility, judgement, intuition.
 To adhere to punctuality, setting and meeting deadlines.
 To instil responsibilities to oneself and others.
 To train students to present the topic of project work in a seminar
without any fear, face audience confidently, enhance communication
skill, involve in group discussion to present and exchange ideas.
Project Work Phase - II: Each student of the project batch shall involve in
carrying out the project work jointly in constant consultation with internal
guide, co-guide, and external guide and prepare the project report as per the
norms avoiding plagiarism.
Course outcomes:
 Present the project and be able to defend it.
76
 Make links across different areas of knowledge and to generate,
develop and evaluate ideas and information so as to apply these skills
to the project task.
 Habituated to critical thinking and use problem solving skills
 Communicate effectively and to present ideas clearly and coherently in
both the written and oral forms.
 Work in a team to achieve common goal.
 Learn on their own, reflect on their learning and take appropriate
actions to improve it.
Continuous Internal Evaluation:

Project Report: 20 marks. The basis for awarding the marks shall be the
involvement of the student in the project and in the preparation of project
report. To be awarded by the internal guide in consultation with external guide
if any.
Project Presentation: 10 marks.
The Project Presentation marks of the Project Work Phase -II shall be awarded
by the committee constituted for the purpose by the Head of the Department.
The committee shall consist of three faculty from the department with the
senior most acting as the Chairperson.
Question and Answer: 10 marks.
The student shall be evaluated based on the ability in the Question and Answer
session for 10 marks.
Semester End Examination

SEE marks for the project report (30 marks), seminar (15 marks) and question
and answer session (15 marks) shall be awarded (based on the quality of report
and presentation skill, participation in the question and answer session) by the
examiners appointed by the University.
77

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VISVESVARAYA TECHNOLOGICAL UNIVERSITY, BELAGAVI

Scheme of Teaching and Examinations – 2020 - 21

1 PCC 20EIE31 PLCs and Industrial Automation 04 -- 03 40 60 100 4

1 Project 20EIE41 Project work phase -2 -- 04 03 40 60 100 20

Scheme of Teaching and Examinations and Syllabus

ADVANCED ENGINEERING MATHEMATICS

CourseCode 20ELD11 CIEMarks 40

Question paper pattern:

Question paper pattern:

Question paper pattern:

1. ‘Introduction to embedded systems’, K. V. Shibu, TMH education Pvt.

CourseCode 20ELD14 CIEMarks 40

Question paper pattern:

Question paper pattern:

2 Introduction of the basics of data acquisition and computer-

Conduct of Practical Examination:

Question paper pattern:

1. ‘Research Methodology: Methods and Techniques’, C.R. Kothari, Gaurav

1. ‘Research Methods: the concise knowledge base’, Trochim, Atomic Dog

Choice Based Credit System (CBCS) and Outcome Based Education(OBE)

Process Control Instrumentation

CourseCode 20EIE21 CIEMarks 40

Question paper pattern:

Question paper pattern:

Question paper pattern:

Wireless Sensor Networks

Application Layer: Source Coding (Data Compression), Query Processing,

Question paper pattern:

Question paper pattern:

1. ‘Nanoscale Science and Technology’, Ed Robert Kelsall, Ian Hamley,

Question paper pattern:

CourseCode 20ELD244 CIEMarks 40

Question paper pattern:

Question paper pattern:

CourseCode 20EIE252 CIEMarks 40

Question paper pattern:

CourseCode 20ELD253 CIEMarks 40

Engineering Science for Microsystems Design and Fabrication:

Question paper pattern:

CourseCode 20EIE254 CIEMarks 40

Question paper pattern:

CourseCode 20EIEL26 CIEMarks 40

PART-A: Following RTOS experiments to be done using Linux.

PART-B: Digital Signal Processing using MATLAB

Generate the sequence x[n] = n-64 for n=0,…,127.

(a) Let X[k]=DFT{x[n]}. For various values of L, set to zerothe

Each student, under the guidance of a Faculty, is required to

Marks distribution for CIE of the course 20EIE27 seminar:

Choice Based Credit System (CBCS) and Outcome Based Education(OBE)

PLCs and Industrial Automation

Industrial Automation: Introduction, Utility of Automation, General Structure

Advances in Image Processing

CourseCode 20ECS321 CIEMarks 40

Question paper pattern:

CourseCode 20EIE322 CIEMarks 40

Question paper pattern:

Question paper pattern:

1. ‘Business Intelligence: The Savvy Manager's Guide’, David Loshin,

CourseCode 20ECS324 CIEMarks 40