HW6 Solution
HW6 Solution
HW6 Solution
∘
T ∞=25 C
¿ 25+273=298 K
T s , 1=40 ∘ C
¿ 40+273=313 K
L=0.35 m
T s ,2=100∘ C
¿ 100+273=373 K
¿
kA ΔT
Qcond =
L
Qconv =h A( Δ T )
T s ,1 +T s , 2
T mean =
2
313 K +373 K
T mean =
2
T mean =343 K
(600−400) K (400−343)K
=
W W
( 48.8−58.7) (58.7−K )
m⋅K m⋅K
W
K =61.5215
m⋅ K
Qcond =Qconv
ΔT
=h A (Δ T )
L
kA
373 K−313 K
=h × A(313 K −298 K )
0.35 m
61.521× A
W
h=703.10285 2
m .K
dT T s ,1 −T s ,2
=
dx L
313 K−373 K
¿
0.35 m
dT k
=−171.4285
dx m
Qcond =Qconv
−K f A ( dTdx ) =h A (T −T )
x=0
s,1 ∞
( dTdx ) = −hK (T −T )
x=0 f
s,1 ∞
T (K )
K f × 10−3 ( mK
W
)
305 620
310 628
( 310−305)K (306−305) K
=
W
(328−620)×10
−3
m.K
( K f −620 ×10−3 ) mW. K
W
K f =621.6 ×10−3
m⋅ K
Putting value of K from equation (3) and h from equation (1) into equation (2) we get:
W
−703.10285
( )
dT
dx x=0
=
621.6 × 10
m2 ⋅ K
−3 W
(313−298)K
m⋅K
( )
dT
dx x=0
=−16966.7676
K
m
¿
T s 2=100 ° C
Steel Wall
T s 1=40° C
Newton’s convection law
q 1=h1 (T s−T ∞ )
10000
h1 = =100
400−300
Now since:
R e 1=R e2
L1 L2
V1× =V 2 ×
ν ν
Also since Prandtl number depends on medium which is air in both cases, hence:
Pr ¿ Pr 2
1
N u1=N u2
h1 L 1 h2 L 2
=
k1 k2
W
h2 =20 2
m
Given Data:
l=4 mm=0.004 m
L=120 mm=0.12 m
m
v =10
s
T ∞=25 C
q=30 mW =0.003 W
N u x =0.04 ⋅ R e 0.85
x ⋅ Pr
1/ 3
W−3
k=26.3 ⋅10
mK
2
−6 m
ν=15.89 ⋅10
s
Pr =0.707
Nusselt number is given by:
hx ⋅ L
N u x=
k
v⋅L
R ex=
ν
And
0.85 1/ 3
N u x =0.04 ⋅ R e x ⋅ Pr
Hence:
( ) ( )
0.85
k v⋅L 1/ 3 26.3 ⋅10−3 10 ⋅0.12 0.85
1/ 3
h x ¿ 0.04 ⋅ ⋅ ⋅ Pr =0.04 ⋅ ⋅ ⋅ 0.707
L ν 0.12 15.89 ⋅ 10−6
¿ ¿
q q 0.003
T s ¿ T ∞+ =T ∞ + =25+
hx ⋅ A h x ⋅l
2
109.4 ⋅ 0.004
2
¿ ¿
Question 6.32
Consider the electronic elements that are cooled by forced convection in Problem 6.31. The cooling
system is designed and tested at sea level (p ≈ 1 atm), but the circuit board is sold to a customer in
Mexico City, with an elevation of 2250 m and atmospheric pressure of 76.5 kPa.
(a) Estimate the surface temperature of the chip located 120 mm from the leading edge of the
board when the board is operated in Mexico City. The dependence of various thermophysical
properties on pressure is noted in Problem 6.19.
(b) It is desirable for the chip operating temperature to be independent of the location of the
customer. What air velocity is required for operation in Mexico City if the chip temperature is to
be the same as at sea level?
Given Data:
l=4 mm=0.004 m
L=120 mm=0.12 m
m
v =10
s
T ∞=25 C
q=30 mW =0.003 W
0.85 1/ 3
N u x =0.04 ⋅ R e x ⋅ Pr
(a)
From Properties of Air table A-4 corresponding to T =300 K and P=1 atm we can find:
W −3
k=26.3 ⋅10
mK
2
−6 m
ν=15.89 ⋅10
s
Pr =0.707
2
−6 100 −6 m
ν Mex =15.89 ⋅ 10 ⋅ =21⋅ 10
76.5 s
v⋅L
R e x= If we put Nusselt and Raynold number expressions to given correlation above, we can
ν
calculate convection heat transfer in the Mexico City:
( ) ( )
0.85 −3 0.85
k v⋅ L 1/ 3 26.3 ⋅ 10 10⋅ 0.12 1/ 3
h x =0.04 ⋅ ⋅ ⋅ Pr =0.04 ⋅ ⋅ ⋅ 0.707
L ν Mex 0.12 21⋅10
−6
W
¿ 86.3 2
Km
q q 0.003
T s ¿ T ∞+ =T ∞ + =25+
hx ⋅ A h x ⋅l 2
86.3⋅0.004 2
¿ ¿
(b)
( ) ( )
0.85 −3 0.85
k v⋅L 26.3 ⋅10 10 ⋅0.12
h x ¿ 0.04 ⋅ ⋅ ⋅ Pr 1/ 3=0.04 ⋅ ⋅ ⋅ 0.7071/ 3
L ν 0.12 15.89 ⋅ 10
−6
¿ ¿
( )
1 /0.85
ν hx ⋅ L
v ¿ Mex ⋅ ⋅ Pr −1/ 3
L 0.04 ⋅ k
m
¿ ¿ 13.2
s