Application Note AN 2006-05

V2.1, February 2013

EconoDUAL™3
Mounting instructions / Application note

IFAG IPC MP
N 2010-03
Application Note AN 2006-05
2009
V2.1, February 2013

Edition 2013-02-01
Published by
Infineon Technologies AG
59568 Warstein, Germany
© Infineon Technologies AG 2010.
All Rights Reserved.

Attention please!
THE INFORMATION GIVEN IN THIS APPLICATION NOTE IS GIVEN AS A HINT FOR THE
IMPLEMENTATION OF THE INFINEON TECHNOLOGIES COMPONENT ONLY AND SHALL NOT BE
REGARDED AS ANY DESCRIPTION OR WARRANTY OF A CERTAIN FUNCTIONALITY, CONDITION OR
QUALITY OF THE INFINEON TECHNOLOGIES COMPONENT. THE RECIPIENT OF THIS APPLICATION
NOTE MUST VERIFY ANY FUNCTION DESCRIBED HEREIN IN THE REAL APPLICATION. INFINEON
TECHNOLOGIES HEREBY DISCLAIMS ANY AND ALL WARRANTIES AND LIABILITIES OF ANY KIND
(INCLUDING WITHOUT LIMITATION WARRANTIES OF NON-INFRINGEMENT OF INTELLECTUAL
PROPERTY RIGHTS OF ANY THIRD PARTY) WITH RESPECT TO ANY AND ALL INFORMATION GIVEN
IN THIS APPLICATION NOTE.

Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office (www.infineon.com).

Warnings
Due to technical requirements components may contain dangerous substances. For information on the types
in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components
may only be used in life-support devices or systems with the express written approval of Infineon
Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-
support device or system, or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body, or to support and/or maintain and
sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other
persons may be endangered.

AN 2006-05
Revision History: 2011-01-31 V2.0
Actual Version: 2013-02-01 V2.1
Major changes since last revision: Additional chapter 9.Climatic conditions; chapter 2.2.4 typ. press-in force
110N/ pin.

Author: Martin Knecht (IFAG IMM INP MP)

We Listen to Your Comments

Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will
help us to continuously improve the quality of this document. Please send your proposal (including a
reference to this document) to: [[email protected]]

-2-
N 2010-03
Application Note AN 2006-05
2009
V2.1, February 2013

Table of Contents
1 General information ...................................................................................................................... 4
1.1 General application information ...................................................................................................... 4
1.2 Handling of electrostatic sensitive components .............................................................................. 4
2 Assembling instruction for PCB’s on modules ......................................................................... 5
2.1 Assembling instruction for PCB’s on solderable modules .............................................................. 5
2.1.1 Additional fixing of the printed circuit board .................................................................................... 5
2.2 Assembling instruction for PCB’s on Press-FIT modules ............................................................... 7
2.2.1 Requirements for the Press-FIT printed circuit board’s ....................................................... 7
2.2.2 The press-in process ........................................................................................................... 9
2.2.3 Press-in tool ....................................................................................................................... 10
2.2.4 Press-in forces ................................................................................................................... 11
2.2.5 Additional fixing of the printed circuit board ....................................................................... 11
3 Requirements towards the heat sink for module assembly ................................................... 11
4 Application of the thermal interface material ........................................................................... 12
4.1 Application of thermal conductive paste by screen printing .......................................................... 12
4.2 Alternative: Applying TCP by roller or spatula .............................................................................. 13
5 Mounting the module to the heat sink ...................................................................................... 14
5.1 Screws to mount the module to the heat sink ............................................................................... 14
5.2 Mounting the module to the heat sink ........................................................................................... 14
6 Connecting the busbars to the power terminals ..................................................................... 16
6.1 Connecting the power terminals with ideal strain relief................................................................. 17
7 Mechanical loads (vibration and shock) ................................................................................... 18
8 Storage and transportation of IGBT modules .......................................................................... 18
9 Climatic conditions during active, current carrying operation of EconoDUAL™ 3
modules ....................................................................................................................................... 18

-3-
N 2010-03
Application Note AN 2006-05
2009
V2.1, February 2013

1 General information
1.1 General application information
Compliance with the requirements for Infineon IGBT modules is assured by appropriate reliability tests
and by 100% final tests that are performed during production.
Maximum values in the product data sheets and application notes of IGBT modules are definite limits
that may never be exceeded, even not for a short period of time, as this could end in the destruction of
the components.
This application note cannot cover all different applications and application conditions. Therefore
application notes can not replace a detailed technical evaluation and examination by the user.
Therefore, the application notes will under no circumstances become part of any supplier agreed
warranty, unless the supply agreement determines otherwise in writing.

1.2 Handling of electrostatic sensitive components

IGBT modules are electrostatic sensitive components. Electrostatic discharge (ESD) may pre-damage
these modules or even destroy them.
In order to prevent destruction or pre-damage of the components by electrostatic discharge, the
components are delivered according to the approved ESD regulations, in appropriate ESD protected
packaging.
The removal of the ESD protection and the handling of the unprotected modules require the
installation of ESD conform workplaces. Further information is available e.g. from the ESD security
guidelines IEC 61340-5-1 and ANSI/ESD S2020.

Figure1: Electrostatic discharge symbol

-4-
N 2010-03
Application Note AN 2006-05
2009
V2.1, February 2013

2 Assembling instruction for PCB’s on modules

2.1 Assembling instruction for PCB’s on solderable modules
2.1.1 Additional fixing of the printed circuit board

By using an external driver board, the gate-collector connection should be realized as short as
possible to prevent magnetic coupling and to minimize the gate circuit inductivity.
After the solder process, it is recommended to mechanically relieve the contact areas between module
and printed circuit board. Relieve of the contact areas is achieved by mounting the PCB onto the
module using the four PCB mounting stand-offs (see figure 2) using self-tapping screws or similar
fastening methods.

For the development process both evaluation driver boards as well as evaluation module adapter
boards (module adapter to hold gate resistors and clamping diodes) are available on request. Further
information regarding EconoDUAL™ evaluation drivers is contained in the application note AN2006-04
Evaluation Driver Board for EconoDUAL™ IGBT modules.

Besides screwing the PCB to the mounting domes by hand, an electronically controlled or at least
slowly turning electric screw driver (U  300U/min) is a preferred tool for this process.
Due to a lack of accuracy we do not recommend the use of pneumatic screw drivers.

Figure2: PCB mounting stand-offs at EconoDUAL™3 module (marked red)

The effective length of the screw thread entering the PCB mounting stand-offs should be of a
minimum length of lmin  4mm and a maximum length of lmax  10mm, taking into account the specific
PCB thickness and the weight of the mounted PCB.

-5-
N 2010-03
Application Note AN 2006-05
2009
V2.1, February 2013

screw

A. Correctly assembled B. Incorrectly positioned screw

PCB screw
PCB

Modul
Modul

Figure3: A. Correctly assembled screw in the PCB mounting stand-off

B. Incorrectly positioned screw in the PCB mounting stand-off
The upper 1.5mm of the mounting stand-offs serve as guidance only and can’t take any force. The
thread in the plastic will form itself when the screw is driven in. The recommended self-tapping screw
is for example:
- EJOT PT WN 1451 K25x10 A2K : Mmax = 0.45Nm  10%

To avoid damage or splitting of the mounting stand-off, straight insertion of the screws into the stand-
offs has to be achieved during assembly (figure 3).

The recommended screw and torque is based on laboratory tests. Depending on the screws used and
tools it may be necessary to adjust the assembly process accordingly.

After mounting the PCB the solder process (manual soldering, selective soldering or wave soldering)
may begin. When adhering to this sequence of assembly, the mechanical strain to the solder points
can be minimised.

If the modules, before they enter the soldering process, are pre-heated with the aid of heat plates
below the base plate or by circulating air, this process must be adjusted such that a pre-heat
temperature of T≤150°C for t≤30min is not exceeded.

During the entire soldering process care needs to be taken that neither too high a soldering
temperature nor too long a process time at the auxiliary pins overheats the plastic case and thus
deforms it.

According to IEC 68 section 2, a maximum solder temperature of T=260°C for a maximum process
time of tmax≤10s has to be observed during the solder process.
Further information regarding solder processes is detailed in the application note AN2005-06
“Soldering Econo und Easy modules”.

-6-
N 2010-03
Application Note AN 2006-05
2009
V2.1, February 2013

2.2 Assembling instruction for PCB’s on Press-FIT modules

2.2.1 Requirements for the Press-FIT printed circuit board’s
The PressFIT technology used in the EconoDUAL™3 modules has been inspected and qualified by
Infineon Technologies AG for standard FR4 printed circuit boards with „chemical tin“ surface
(according to the IEC 60352-5 + IEC60747-15 standards). If other technologies are used for the
production of printed circuit boards, they have to be tested, inspected and qualified separately.
Requirements for the printed circuit board (PCB) material are:
Double-sided PCB according to IEC 60249-2-4 or IEC 6249-2-5.
Multilayer PCB according to IEC 60249-2-11 or IEC 60249-2-12.
In order to ensure a good contact between PCB hole and PressFIT pin, the specification of the hole
given in table 1 has to be followed.
If the specification of the PCB holes included only the final hole dimension (i.e. the metallized hole),
different drill sizes and metalization thicknesses could be used depending on the PCB manufacturer
and his production capability. This could result in varying results and so compromise the quality of the
electrical contact. For this reason it is recommended to follow the complete guidelines provided in
table 1.
A further recommendation is to drill the holes in the PCB with a drill of 1.15mm in diameter, and not to
mill it. Experience has shown that with milling the final hole diameter is typically between 1.12mm and
1.15mm due to the runout tolerances of the spindles used and due to shrinkage of the FR4 material.

Min. Typ. Max.

Drill hole diameter 1.12 1.15
Copper thickness in hole >25m <50m
Metallization in hole <15m
Final hole diameter 0.94mm 1.09mm
Copper thickness of 35m 70m - 105m 400m
conductors
Metallization of PCB Tin (chemical)
Metallization of pin Tin (galvanic)
Table 1: Requirements for the printed circuit board

With a copper thickness of 25m to 50m in the hole and a tin layer of about 1m for chemically
applied tin, a final hole diameter is obtained as a test dimension. Due to the thinner tin layer thickness
compared to e.g. HAL printed circuit boards, the diameter is always higher than the value of 1mm that
is given in the according standard (IEC 60352-5). The final hole diameter, considering the drilled hole
diameter, copper thickness and tin thickness is typically between 1.02mm and 1.09mm.

-7-
N 2010-03
Application Note AN 2006-05
2009
V2.1, February 2013

Drill hole

1,15 -0,03 mm

-0,03
1,15 mm
Copper in drill hole
Annular ring min. 0,2 mm

min. 25µm Cu ; max. 50µm Cu

Final hole diameter

max. 15µm tin

chemical tin typ 1µm
min. 0.94 mm
max.1.09 mm min. 0.94mm ; max 1.09mm

Figure 4 Structure of the printed circuit board

The PressFIT technology is qualified for FR4 printed circuit board material.
After a reflow soldering process is carried out on a printed circuit board, the module can still be
pressed into the board. The contact and retention forces of the PressFIT pins are not lessened.
As with Easy and Econo PressFIT modules, a distance of 5mm from the middle of each pin to other
components on the PCB has to be observed. The same dimensions have to be considered in case of
Press-tools developed by the user when positioning components on the PCB.
A PressFIT module can be replaced up to two times. This means that a printed circuit board can be
used up to three times in total. Correct handling of the components is essential in this case.
A module that has been pressed in and then pressed out again can no longer be pressed in. Instead,
the module can be attached in a new PCB by soldering. The plastic deformation of the PressFIT pin
does not allow further press-fitting.

-8-
N 2010-03
Application Note AN 2006-05
2009
V2.1, February 2013

2.2.2 The press-in process

The PressFIT module is inserted into a printed circuit board by press-in. The press-fitting can be
performed either using a simple toggle lever press or a machine. A press-in tool that records the
necessary force and the distance moved is recommended as this will assure constant quality. Doing
so, a consistent quality is assured. The press-fitting speed should be between 25mm/min and
50mm/min according to IEC 60352-5.

Please note that during the press-in process the placement area of the printed circuit board and the
pressing area of the pressure plate have to be parallel towards each other. The pressure plate should
be mechanically fixed in position. The module should be pressed into the printed circuit board by a
uniform movement.

The module pins should penetrate the printed circuit board during press-in until the bearing areas of
the module housing are touched by the PCB.

To limit the force at the end the press-in process, springs could be implemented at the upper part of
the press-in tool. The spring-biased force of the tool can be adjusted to the amount of pins and the
according necessary press-in force. The springs may be not necessary in certain cases, especially if
the press-in force is controlled and limited.

The following illustrations show the press-in process of an EconoDUAL™ 3 as it is implemented in the
Infineon Technologies AG lab.

Step 1: Step 2: Step 3:

The press is aligned to ensure The PCB and the module are The PressFIT pins of the module
that both parts of the tool are placed in the tool. The positioning are pressed into the PCB by
directly above each other. is supported by the tool guides. moving the upper tool part
downwards.

Figure 5 Example of the press-in process for an EconoDUAL™3 module.

-9-
N 2010-03
Application Note AN 2006-05
2009
V2.1, February 2013

2.2.3 Press-in tool

Infineon has developed an example press-in tool for the EconoDUAL™3. Figure 6 shows the press-in
tool. Drawings of the tool can be requested through the normal Infineon channels. The suitability for
the specific assembly process and application has to be tested and qualified by the user.

When adjusting the tool for a specific PCB or developing a tool, the positioning of PCB components
close to the load bearing areas of the tool has to be taken into account in order to prevent damaging of
these components during the press-in process.

Figure 6: Example of a press-in tool for EconoDUAL™3.

- 10 -
N 2010-03
Application Note AN 2006-05
2009
V2.1, February 2013

2.2.4 Press-in forces

To press a module into a printed circuit board, a force of approximately 110N has to be applied for
each pin of the module. The press-in forces depend on the PCB hole diameters. As the
EconoDUAL™3 feature 7 PressFIT pins; the typical necessary press-in force is approximately 0.8kN.
If the holes in the PCB are at the lower limit of the tolerance and/ or several modules will be pressed in
parallel, the press-in force can be much higher. It is the responsibility of the customer that surface
mounted devices on the PCB will not be damaged.

Min. Typ. Max.

Drill hole diameter 1.15mm
Press-in speed 25mm/min
Copper thickness in hole 25m 50m
Typical Press-in force per pin 110N
Table 2: Typical press-in forces

2.2.5 Additional fixing of the printed circuit board

After the press-in process, it is recommended to mechanically relieve the contact areas between
module and printed circuit board (like mentioned in 2.1.1).

3 Requirements towards the heat sink for

module assembly
The power loss generated in the module has to be dissipated via a heat sink in order not to exceed the
maximum permissible temperature specified in the data sheets during switching (T vjop). Detailed
information can be found in Application Note 2008-01 „Definition and use of junction temperature
values“.
The condition of the heatsink surface in the module mounting area is of great importance, as the
interface between heatsink and and module has a large influence on efficient towards the heat transfer
from the module to the ambient.
The contact surfaces, the base plate of the module and the surface of the heatsink have to be free of
degradation and contamination and should be cleaned with a fresh, lint free cloth.
The contact surface between module baseplate and heatsink should not exceed the following values:
- Surface flatness  30m
- Surface roughness Rz  10m
The heat sink has to be of sufficient stiffness for the assembly and the subsequent shipping in order
not to exert additional strain or pulling forces to the base plate of the module. The heatsink has to be
handled twist-free during the entire assembly process, particularly when the PCB is linked with the
heatsink.

- 11 -
N 2010-03
Application Note AN 2006-05
2009
V2.1, February 2013

4 Application of the thermal interface material

Due to the individual surface shapes of the module base plates and the heat sinks, there are inherent
air gaps in-between both mating surfaces. To dissipate the losses in the module and to achieve an
efficient heat flow from the chip into the heat sink, these gaps or cavities must be filled by a thermal
interface material (TIM). An optimum layer thickness displaces all air, but also does not prevent the
metal-to-metal contact between the baseplate and the heat sink surface where it occurs.
When using a thermal conductive paste (TCP), a homogenous application has to be ensured.
A TIM should be selected that shows permanent elastic features in order to ensure a constant good
heat transfer resistance. The TIM should be applied in a way that no screw holes are contaminated so
that screw torques’s are not compromised.

4.1 Application of thermal conductive paste by screen printing

It’s everything but easy to apply thermal conductive paste manually with a constant thickness in the
m-range. Homogenity and reproducability of the resulting thermal layer are always questionable.
Therefore it is recommended to apply the thermal conductive paste by screen printing (see figure 7).
Besides applying the TCP homogeneously and reproducably, this method offers the possibility to
adjust the distribution of the paste to the individual module.
Proposals for module specific drawings of such screen printing stencils can be requested using the
normal Infineon channels. The suitability of the stencil in combination with the specific TCP and the
assembly process and application has to be tested and qualified by the user.

A. Screen printing equipment B. Applying the TCP

TCP stencile

Module base plate

Figure 7: A. Example of screen printing equipment to apply TCP

B. Applying the TCP by using a stencil

- 12 -
N 2010-03
Application Note AN 2006-05
2009
V2.1, February 2013

A typical distribution of thermal conductive paste on the base plate of an EconoPACK™ 4 applied by
screen printing is shown in figure 8.

Figure 8 Base plate of an EconoDUAL™3 after applying TCP by screen printing

Further information of the use of stencils to apply thermal conductive paste by screen printing can be
found in the application note AN2006-02 „Application of screen print templates to paste thermal
grease within Infineon modules “.

4.2 Alternative: Applying TCP by roller or spatula

If the application of thermal conductive paste can’t be done by the recommended screen printing
process, the paste could be applied using a roller or spatula alternatively. The layer thickness of the
applied grease should be typically between 50µm and 100µm.
As a guideline for the required the amount of thermal conductive paste depending on the thickness d
the following volumes can be given:
d = 50µm  VTCP  0,4cm
3

d = 100µm  VTCP  0,8cm .

3

These volumes can be either measured with the aid of a syringe or applied from a tube.
Common rollers or fine toothed spatulas can be used to apply the thermal conductive paste.
Unfortunately, the homogeneity and reproducibility of the resulting layer thickness is always
questionable. For qualification and verification of the assembly process and during training phases,
the thickness of the paste can be controlled by the aid of a wet film comb.

- 13 -
N 2010-03
Application Note AN 2006-05
2009
V2.1, February 2013

5 Mounting the module to the heat sink

5.1 Screws to mount the module to the heat sink
To mount the modules the following is recommended: DIN M5 bolts which comply at least with class
6.8, e.g. according to DIN912 (ISO4762), ISO 7380, DIN6912, DIN7984 in combination with a suitable
washer and spring washer, e.g. according to DIN433 or DIN125 or comparable combined screws.
The clearance and creepage distances that are specified in the EconoDUAL™3 data sheets are the
shortest clearance and creepage distances at the unassembled and unconnected module.
When selecting suitable M5 screws, washers and spring washers to mount the module, it is
recommended to consider the resulting clearance and creepage distances between the power
terminals and the nearest screw head or washer during the development phase and according to the
valid standards.

5.2 Mounting the module to the heat sink

Mounting of the module has to be carried out within the permissible module tolerances. Further
information and module drawings are given in the relevant data sheets.
The clamping force of the module, resulting from the assembly process to the heatsink, depends on
the applied torque and the condition of the heat sink. The following torque values specified in the data
sheet result from steel screws in aluminium heat sinks with a dry M5 thread and their typical friction
factors of µG=0,2…µG=0,25 (µG=friction coefficient thread in heat sink):

Mmin=3Nm to Mmax=6Nm.

The module fastening screws have to be tightened uniformly in the recommended sequences with the
specified torque.
Other material combinations of screws and/or heatsink material may require an adjustment of the
mechanical parameters.

To ensure a good thermal contact to the heatsink, the following procedure is recommended when
tightening the four M5 fastening screws:

1. Place the module with the applied thermal compound onto the heat sink and fix with the screws
2. Fix the screws with 0.5Nm (hand tight, crosswise) in the following sequence (see figure 9)
Screw number: 1 – 2 – 3 – 4
3. Tighten the screws with 3Nm – 6Nm in the same sequence (crosswise)
Screw number: 1 – 2 – 3 – 4

Depending on the viscosity of the used thermal compound, an intermediate step 2a may be required,
especially for pastes with high viscosity. This additional step will give the thermal compound the
chance to distribute during the assembly process and to adapt to the module base plates and heat
sink’s shape. After a certain time, depending on the used thermal compound, step 3 has to be carried
out.
2.a. Tighten the screws with approximately 2Nm in the same sequence (crosswise)
Screw number: 1 – 2 – 3 – 4

- 14 -
N 2010-03
Application Note AN 2006-05
2009
V2.1, February 2013

1 3

4 2

Figure 9 Tightening sequence to mount the module to the heat sink

When using thermal compound, it may be necessary (depending on the type of paste) to check the
tightening torques of the fastening screws for the correct value after a heat-up test. When using
thermal foils instead of TCP, it is definitely recommended to perform this additional check. The
application notes and the given torques are valid only when using thermal conductive paste.
Therefore, own tests and measurements with the envisaged heat conductive foils are absolutely
necessary!
When selecting the thermal interface material between module and heat sink, the thermal contact and
the long-term stability should be considered and discussed with the manufacturer of the thermal
interface material.

- 15 -
N 2010-03
Application Note AN 2006-05
2009
V2.1, February 2013

6 Connecting the busbars to the power terminals

Connecting the module has to be carried out within the permissible module tolerances given in the
individual datasheets.
The DC power side should be connected to a laminated bus bar in order to keep the switching
overvoltages as low as possible by minimising the stray inductance. Adherence to the maximum
permissible voltage at the power terminals and at the IGBT chip has to be assured according to the
relevant data sheet (see RBSOA).
For the connection of the power terminals DIN M6 screws are required which comply at least with
class 6.8, in combination with a suitable washer and spring washer or complete combination screws.
These should be tightened with the recommended torque of
Mmin=3Nm to Mmax=6Nm.
When selecting the screw length, the layer thickness of the connected parts has to be substracted
from the total length of the screws. The effective length of engagement into the module thread may not
exceed the maximum specified depth of 10mm.
The connected parts have to be mounted to the power terminals in a way that the specified forces
(see figure 10) are not exceeded during assembly or later in operation.

Figure 10: Maximum permissible pull and push forces at the power terminals of the
EconoDUAL™3 only during the screw-in operation.

- 16 -
N 2010-03
Application Note AN 2006-05
2009
V2.1, February 2013

6.1 Connecting the power terminals with ideal strain relief

To connect the power terminals with the best possible strain relief, an assembly according to the
concept drawings in figures 11 or 12 is recommended.
Taking into account all tolerances, the mounting block should be approximately 0.5mm lower than the
height of the power terminals in order to ideally give a pre-tension to the power terminals and
especially to avoid a damaging permanent force in Fz+ direction (see figure 10).

F fixing block

x X- 0,5mm

height A
fan heat sink

Figure 11 Concept drawing 1 of EconoDUAL™3 assembly with ideal strain relief

copper
module

copper

0026 plastic fixing

blockk

screw

heat sink cable lug

cable fixing block screw

heat sink

Figure 12 Concept drawing 2 of EconoDUAL™3 assembly with ideal strain relief

- 17 -
N 2010-03
Application Note AN 2006-05
2009
V2.1, February 2013

7 Mechanical loads (vibration and shock)

The EconoDUAL™3 modules exhibit a rugged construction, developed with a clear focus to offer the
best mechanical robustness in the application.
However, the maximum permissible values given in this application note for pull and push forces at the
power terminals in chapter 6 as well as the press-in forces at the auxiliary terminals given in chapter
2.2.4 are values for a one-time mechanical load during the mounting process.
The impacts of continuous mechanical loads on the module, especially generated by vibration or
shock, strongly depend on the mechanical set-up of the inverter and the load profile in the application
and can’t be specified in general.
The ability of the modules for the operation under such specific mechanial loads has to be tested and
qualified by the user in his mechanical set-up and using the specific mechanical load profile.

8 Storage and transportation of IGBT modules

During transport and storage of the modules extreme forces by shock or vibration have to be avoided
as well as extreme environmental influences.
Storing the modules at the limits of the specified temperature in the data sheet is possible, however,
not recommended.
The recommended storage conditions according to TR14 should be assured fort he recommended
storage time of maximum 2 years.
If stored according to the recommended conditions, pre-drying of the module prior to the assembly
process like recommended for moulded discrete components (e.g. microcontrollers, TO-cases etc.) is
not required for EconoDUAL™3 modules.

9 Climatic conditions during active, current

carrying operation of EconoDUAL™ 3 modules
EconoDUAL™ 3 modules are not hermetically sealed. The housings and the molding compound, used
for the electrical isolation within the housing, are permeable for humidity and gases in both directions.
Therefore humidity differences will be equalized in both directions.
Corrosive gases must be avoided during operation and storage of the devices.
The climatic conditions for Infineon EconoDUAL™ 3 modules in active, current carrying operation are
specified as per EN60721-3-3 class 3K3 for fixed installations.
The operation of the modules in humid atmosphere caused by condensation and/or the operation in
climatic conditions beyond class 3K3 of EN60721-3-3 must be avoided and additional
countermeasures need to be taken in such cases.

- 18 -