Stm32h563 MCU DataSheet
Stm32h563 MCU DataSheet
Stm32h563 MCU DataSheet
Features
Includes ST state-of-the-art patented technology
UFBGA169 (7 x 7 mm)
ART Accelerator UFBGA 176+25 (10 x 10 mm)
• 8-Kbyte instruction cache allowing WLCSP80 (3.50 X 3.27 mm)
0-wait-state execution from flash and external
memories
Clock management
• 4-Kbyte data cache for external memories
• Internal oscillators: 64 MHz HSI, 48 MHz
Benchmarks HSI48, 4 MHz CSI, 32 kHz LSI
• 1.5 DMIPS/MHz (Drystone 2.1) External oscillators: 4-50 MHz HSE, 32.768 kHz
LSE
• 1023 CoreMark® (4.092 CoreMark®/MHz)
Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3 Functional overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.1 Arm Cortex-M33 core with TrustZone and FPU . . . . . . . . . . . . . . . . . . . . 19
3.2 ART Accelerator (ICACHE and DCACHE) . . . . . . . . . . . . . . . . . . . . . . . . 19
3.2.1 Instruction cache (ICACHE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.2.2 Data cache (DCACHE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.3 Memory protection unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.4 Embedded flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.4.1 FLASH security and protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.4.2 FLASH privilege protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.5 Embedded SRAMs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.5.1 SRAMs TrustZone security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.5.2 SRAMs privilege protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.6 Security overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.7 Boot modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.7.1 STM32H562/H563boot modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.8 Global TrustZone controller (GTZC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.9 TrustZone security architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.9.1 TrustZone peripheral classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.9.2 Default TrustZone security state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.10 Power supply management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.10.1 Power supply schemes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
3.10.2 Power supply supervisor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
3.10.3 Reset mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
3.10.4 VBAT operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
3.10.5 PWR TrustZone security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
3.11 Peripheral interconnect matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
3.12 Reset and clock controller (RCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
3.12.1 RCC TrustZone security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
3.13 Clock recovery system (CRS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
List of tables
List of figures
1 Introduction
This document provides the ordering information and mechanical device characteristics of
the STM32H562xx and STM32H563xx microcontrollers.
For information on the device errata with respect to the datasheet and reference manual,
refer to the STM32H562xx and STM32H563xx errata sheet.
a. Arm is a registered trademark of Arm Limited (or its subsidiaries) in the US and/or elsewhere.
2 Description
order to preserve the RTC functionality and to backup 32x 32-bit registers and
4-Kbyte SRAM.
The devices offer eight packages from 64-pin to 176-pin.
All packages are available with two options LDO or SMPS supply for the VCORE (except for
LQFP64 and VFQFPN68 packages which are not available in SMPS and WLCSP80 which
is not available in LDO).
STM32H562RI/G
STM32H563AI/G
STM32H562AI/G
STM32H563VI/G
STM32H562VI/G
STM32H563ZI/G
STM32H562ZI/G
STM32H563II/G
STM32H562II/G
STM32H563MI
Peripherals
STM32H563RI/G
STM32H562RI/G
STM32H563AI/G
STM32H562AI/G
STM32H563VI/G
STM32H562VI/G
STM32H563ZI/G
STM32H562ZI/G
STM32H563II/G
STM32H562II/G
STM32H563MI
Peripherals
STM32H563RI/G
STM32H562RI/G
STM32H563AI/G
STM32H562AI/G
STM32H563VI/G
STM32H562VI/G
STM32H563ZI/G
STM32H562ZI/G
STM32H563II/G
STM32H562II/G
STM32H563MI
Peripherals
12-bit ADC 2
Number of
ADC channels 16/ 16/ 20/ 20/ 20/ 20/ 20/ 20/
16/NA NA / 16
(legacy/SMP 14 NA 18 NA 20 NA 20 NA
S)
12-bit DAC
1
controller
DAC Number of
12-bit Dto-A 2
converters
Internal voltage reference
No YES
buffer
Maximum CPU frequency 250 MHz
Operating voltage 1.71 to 3.6 V
Ambient operating temperature: – 40 to 85 °C / – 40 to 125 °C
Operating temperature
Junction temperature: – 40 to 130 °C
LQFP64 LQFP176
Package WLCSP80 LQFP100 LQFP144 UFBGA169
VFQFPN68 UFBGA176
1. 8-bit to interface LCD controller.
2. For the LQFP100 package, only FMC Bank1 is available. Bank1 can only support a multiplexed NOR/PSRAM memory
using the NE1 chip select.
3. Shares the same IOs than I2C4.
4. DCMI and PSSI cannot be used at the same time as they share the same circuitry.
5. Active tampers in output sharing mode (one output shared by all inputs).
6. 49 for LQFP64.
7. 136 for LQFP176.
8. 5 for VFQFPN68.
(8 Kbytes)
TRACECLK, SDRAM, SRAM, PSRAM, NOR Flash, FRAM, NAND Flash
ICACHE
NRAS, NCAS, as AF
TRACED[3:0] Arm Cortex-M33
250 MHz IO[7:0], CLK, NCLK,
C-BUS OCTOSPI1 memory interface NCS. DQS as AF
TrustZone FPU
S-BUS
(4 Kbytes)
DCACHE
AHB bus-matrix
Flash memory RNG
(up to 2 Mbytes)
HASH
D[7:0], D[3:1]dir
FIFO
CMD, CMDdir,CK, CKin SDMMC1 SRAM1 (256 Kbytes)
@VDDA
D0dir, D2dir DAC1_OUT1
SRAM2 (64 Kbytes)
FIFO
ITF DAC1
SDMMC2
SRAM3 (320 Kbytes) DAC1_OUT2
FIFO
MAC ETHERNET
DCMI/PSSI D[15:0], CK, CMD as AF
GPDMA1
@VDD
VDD Power management
@VDD
GPDMA2
Voltage regulator LDO or VDD = 1.71 to 3.6 V
HSI48 SMPS 3.3 to 1.2 V VSS
HS64 @VDD
Reset Supply supervision
CSI BOR
@VBAT Int
VDDIO, VDDUSB, VDDA,
LSI PVD, PVM VSSA, VDD, VSS, NRST
PA[15:0] GPIO port A BKPSRAM
(4 Kbytes) @VDD
PB[15:0] GPIO port B PLL 1, 2, 3
AHB1 250 MHz
FCLK
HCLKx
PCLKx
PH[15:0] GPIO port H TIM2 32b 4 channels, ETR as AF
SPI4
NSS as AF
FDCAN2 TX, RX as AF
TIM6 16b
MOSI, MISO, SCK, SPI6
NSS as AF CC1, DBCC1, CC2,
PHY
DP USB FS
DM AHB/APB3 TIM14 16b 1 channel, ETR as AF
Temperature
AHB3 250 MHz
SBS
3 Functional overview
The Options bytes are available to set the flash memory protection mechanisms:
• Different product states for protecting memory content from debug access
• Write protection (WRP) to protect areas against erasing and programming. Two areas
per bank can be selected with 8-Kbyte granularity.
• Sector group write-protection (WRPSG), protecting up to 32 groups of 4 sectors
(32 Kbytes) per bank
• Two secure-only areas (one per user flash memory bank). When enabled, this area is
accessible only if the STM32 device operates in Secure-access mode
• One HDP per area bank providing temporal isolation for startup code
The whole non-volatile memory embeds the error correction code (ECC) feature supporting:
• Single-error detection and correction
• Double-error detection
• ECC fail address report
Note: The ECC is supported by SRAM2, SRAM3, and BKPSRAM when enabled with the
SRAM2_ECC, SRAM3_ECC, and BKPRAM_ECC user option bits.
Embedded bootloader
The embedded bootloader is located in the system memory, programmed by ST during
production. It is used to reprogram the flash memory by using USART, I2C, I3C, SPI,
FDCAN, or USB_FS in device mode through the DFU (device firmware upgrade).
Refer to the application note STM32 microcontroller system memory boot mode (AN2606).
The below table provides the detail of the boot mode when the TrustZone is enabled
(TZEN=0xB4), for the STM32H562/H563 devices.
When TrustZone is enabled (TZEN=0xB4), the boot space must be in secure area. The
SECBOOTADD0[24:0] option bytes are used to select the boot secure memory address. A
unique boot entry option can be selected by setting the SECBOOT_LOCK option bit.
Both regulators can provide four different voltages (voltage scaling) and can operate in Stop
modes.
VDDA domain
A/D converters
VDDA
D/A converters
VSSA
Voltage reference buffer
VDDUSB
USB transceiver
VSS
VDDIO2 domain
VDDIO2 VDDIO2
I/O ring
VSS
VDD domain
VDDIO1 I/O ring
Reset block
Temperature sensor
3 x PLL VCORE domain
Internal RC oscillators
Core
VSS Standby circuitry
(Wakeup logic, IWDG) SRAM1
VDD SRAM2
Voltage regulator SRAM3
VCORE
2x VCAP Digital
VLXSMPS peripherals
SMPS regulator
VDDSMPS
VSSSMPS
Flash memory
Low-voltage detector
Backup domain
LSE crystal 32kHz oscillator
VBAT Backup registers
RCC_BDCR register
RTC
TAMP
BKPSRAM
MSv64010V2
VDDUSB
USB transceiver
VSS
VDDIO2 domain
VDDIO2 VDDIO2
I/O ring
VSS
VDD domain
VDDIO1 I/O ring
VCORE domain
Reset block
Temperature sensor Core
3 x PLL
VSS Internal RC oscillators SRAM1
SRAM2
Standby circuitry SRAM3
VDD (Wakeup logic, IWDG)
VCORE
VCAP Digital
peripherals
LDO regulator
Flash memory
Low-voltage detector
Backup domain
LSE crystal 32kHz oscillator
VBAT Backup registers
RCC_BDCR register
RTC
TAMP
BKPSRAM
MSv64011V1
During power-up and power-down phases, the following power sequence requirements
must be respected:
• When VDD is below 1 V, other power supplies (VDDA, VDDIO2, VDDUSB) must remain
below VDD + 300 mV.
• When VDD is above 1 V, all power supplies are independent.
• During the power-down phase, VDD can temporarily become lower than other supplies
only if the energy provided to the MCU remains below 1 mJ. This allows external
decoupling capacitors to be discharged with different time constants during the power-
down transient phase.
3.6
VDDX(1)
VDD
VBOR0
0.3
Invalid supply area VDDX < VDD + 300 mV VDDX independent from VDD
MSv47490V1
1. VDDX refers to any power supply among VDDA, VDDUSB, and VDDIO2.
Low-power modes
By default, the microcontroller is in Run mode after a system or a power reset. It is up to the
user to select one of the low-power modes described below:
• Sleep mode
In Sleep mode, only the CPU is stopped. All peripherals continue to operate and can
wake up the CPU when an interrupt/event occurs.
• Stop modes
Stop mode achieves the lowest power consumption while retaining the content of
SRAM and registers. All clocks in the VCORE domain are stopped, the PLL, the CSI,
the HSI, the HSI48 and the HSE crystal oscillators are disabled. The LSE or LSI is still
running.
The RTC can remain active (Stop mode with RTC, Stop mode without RTC).
The system clock when exiting from Stop mode can be either HSI up to 64 MHz or CSI
(4 MHz), depending on software configuration.
• Standby mode
The Standby mode is used to achieve the lowest power consumption with BOR. The
PLL, the HSI, the CSI, the HSI48 and the HSE crystal oscillators are also switched off.
The RTC can remain active (Standby mode with RTC, Standby mode without RTC).
The BOR always remains active in Standby mode.
The I/Os state during Standby mode can be retained.
After entering Standby mode, SRAMs and register contents are lost except for registers
and backup SRAM in the Backup domain and Standby circuitry.
The device exits Standby mode when an external reset (NRST pin), an IWDG reset,
WKUP pin event (configurable rising or falling edge), an RTC event occurs (alarm,
periodic wakeup, timestamp), or a tamper detection. The tamper detection can be
raised either due to external pins or due to an internal failure detection.
The system clock after wakeup is HSI at 32 MHz.
– System PLL that can be fed by HSE, HSI or CSI, with a maximum frequency at
250 MHz.
• RC48 with clock recovery system (HSI48): internal 48 MHz clock source (HSI48),
can be used to drive the USB.
• UCPD kernel clock, derived from HSI clock. The HSI RC oscillator must be enabled
prior to the UCPD kernel clock use.
• Auxiliary clock source: two ultra-low-power clock sources that can be used to drive
the real-time clock:
– 32.768 kHz low-speed external crystal (LSE), supporting four drive capability
modes. The LSE can also be configured in bypass mode for an external clock.
– 32 kHz low-speed internal RC (LSI), also used to drive the independent watchdog.
• Peripheral clock sources: several peripherals have their own independent clock
whatever the system clock. Three PLLs, each having three independent outputs
allowing the highest flexibility, can generate independent clocks for the ADC, USB,
SDMMC, RNG, FDCAN1, OCTOSPI and the two SAIs.
• Startup clock: after reset, the microcontroller restarts by default with an internal
32 MHz clock (HSIdiv 2). The prescaler ratio and clock source can be changed by the
application program as soon as the code execution starts.
• Clock security system (CSS): this feature can be enabled by software. If a HSE clock
failure occurs, the master clock automatically switches to HSI and a software interrupt
is generated if enabled. LSE failure can also be detected and generates an interrupt.
• Clock-out capability:
– MCO (microcontroller clock output): it outputs one of the internal clocks for
external use by the application.
– LSCO (low-speed clock output): it outputs LSI or LSE in all low-power modes
(except VBAT).
Several prescalers allow AHB and APB frequencies configuration. The maximum frequency
of the AHB and the APB clock domains is 250 MHz.
automatic trimming is based on the external synchronization signal, that is either derived
from USB SOF signalization, from LSE oscillator, from an external signal on CRS_SYNC pin
or generated by user software. For faster lock-in during startup, automatic trimming and
manual trimming action can be combined.
The OCTOSPI supports the following protocols with associated frame formats:
• the standard frame format with the command, address, alternate byte, dummy cycles
and data phase
• the HyperBus™ frame format
The OCTOSPI offers the following features:
• Three functional modes: Indirect, Status-polling, and Memory-mapped
• Read and write support in Memory-mapped mode
• Supports for single, dual, quad and octal communication
• Dual-quad mode, where eight bits can be sent/received simultaneously by accessing
two quad memories in parallel.
• SDR (single-data rate) and DTR (double-transfer rate) support
• Data strobe support
• Fully programmable opcode
• Fully programmable frame format
• HyperBus support
• Integrated FIFO for reception and transmission
• 8-, 16-, and 32-bit data accesses allowed
• DMA channel for Indirect mode operations
• Interrupt generation on FIFO threshold, timeout, operation complete, and access error
Resolution 12 bit
5 Msps
Maximum sampling speed
(12-bit resolution)
Dual mode operation X
Hardware offset calibration X
Hardware linearity calibration -
Single-end input X
Differential input X
Injected channel conversion X
Oversampling up to x256
Data register 16 bits
Data register FIFO depth 3 stages
DMA support X
Parallel data output to ADF -
Offset compensation X
Gain compensation -
Number of analog watchdog 3
Option register - X
When selected, these inputs can either enable the transmitter to indicate when the data is
valid, or allow the receiver to indicate when it is ready to sample the data, or both.
• Corresponding 32-bit words of the digest from consecutive message blocks are added
to each other to form the digest of the whole message
– Automatic 32-bit words swapping to comply with the internal little-endian
representation of the input bit string
– Word swapping supported: bits, bytes, half-words and 32-bit words
• Automatic padding to complete the input bit string to fit digest minimum block size of
512 bits (16 × 32 bits)
• Single 32-bit input register associated to an internal input FIFO of sixteen 32-bit words,
corresponding to one block size
• AHB slave peripheral, accessible through 32-bit word accesses only (else an AHB
error is generated)
• 8 × 32-bit words (H0 to H7) for output message digest
• Automatic data flow control with support of direct memory access (DMA) using one
channel. Single or fixed burst of 4 supported.
• Interruptible message digest computation, on a per-32-bit word basis
– Re-loadable digest registers
– Hashing computation suspend/resume mechanism, including using DMA
Any integer
Advanced Up, down,
TIM1, TIM8 16 bits between 1 and Yes 4 3
control Up/down
65536
Any integer
General- Up, down,
TIM2, TIM5 32 bits between 1 and Yes 4 No
purpose Up/down
65536
Any integer
General- Up, down,
TIM3, TIM4 16 bits between 1 and Yes 4 No
purpose Up/down
65536
Any integer
General- TIM12,
16 bits Up between 1 and Yes 2 1
purpose TIM15
65536
TIM13,
Any integer
General- TIM14,
16 bits Up between 1 and Yes 1 1
purpose TIM16,
65536
TIM17
Any integer
Basic TIM6, TIM7 16 bits Up between 1 and Yes 0 No
65536
When TrustZone is disabled, only one SysTick timer is available. This timer (secure or non-
secure) is dedicated to real-time operating systems, but can also be used as a standard
down counter. It features:
• A 24-bit down counter
• Autoreload capability
• Maskable system interrupt generation when the counter reaches 0
• Programmable clock source.
All RTC events (alarm, wakeup timer, timestamp) can generate an interrupt and wakeup the
device from the low-power modes.
• Monotonic counter
High-speed data communications up to 20 Mbauds are possible by using the DMA (direct
memory access) for multibuffer configuration.
The USART main features are:
• Full-duplex asynchronous communication
• NRZ standard format (mark/space)
• Configurable oversampling method by 16 or 8 to achieve the best compromise
between speed and clock tolerance
• Baud rate generator systems
• Two internal FIFOs for transmit and receive data
Each FIFO can be enabled/disabled by software and come with a status flag.
• A common programmable transmit and receive baud rate
• Dual-clock domain with dedicated kernel clock for peripherals independent from PCLK
• Auto baud rate detection
• Programmable data word length (7, 8 or 9 bits)
• Programmable data order with MSB-first or LSB-first shifting
• Configurable stop bits (1 or 2 stop bits)
• Synchronous Master/Slave mode and clock output/input for synchronous
communications
• SPI slave transmission underrun error flag
• Single-wire half-duplex communications
• Continuous communications using DMA
• Received/transmitted bytes are buffered in reserved SRAM using centralized DMA
• Separate enable bits for transmitter and receiver
• Separate signal polarity control for transmission and reception
• Swappable Tx/Rx pin configuration
• Hardware flow control for modem and RS-485 transceiver
• Communication control/error detection flags
• Parity control:
– Transmits parity bit
– Checks parity of received data byte
• Interrupt sources with flags
• Multiprocessor communications: wakeup from Mute mode by idle line detection or
address mark detection
• Autonomous functionality in Stop mode with wakeup from stop capability
• LIN master synchronous break send capability and LIN slave break detection capability
– 13-bit break generation and 10/11 bit break detection when USART is hardware
configured for LIN
• IrDA SIR encoder decoder supporting 3/16 bit duration for Normal mode
• Smartcard mode
– Supports the T=0 and T=1 asynchronous protocols for smartcards as defined in
the ISO/IEC 7816-3 standard
– 0.5 and 1.5 stop bits for Smartcard operation
• Support for Modbus communication
– Timeout feature
– CR/LF character recognition
– Parity error
• Interrupt sources with flags
• Multiprocessor communications: wakeup from Mute mode by idle line detection or
address mark detection
• Wakeup from Stop capability
BOOT0
VCAP
PC12
PC10
PC11
PA15
PA14
VDD
VSS
PD2
PB8
PB7
PB6
PB5
PB4
PB3
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
VBAT 1 48 VDD
PC13 2 47 VSS
PC14-OSC32_IN 3 46 PA13
PC15-OSC32_OUT 4 45 PA12
PH0-OSC_IN 5 44 PA11
PH1-OSC_OUT 6 43 PA10
NRST 7 42 PA9
PC0 8 41 PA8
PC1 9 LQFP64 40 PC9
PC2 10 39 PC8
PC3 11 38 PC7
VSSA 12 37 PC6
VDDA 13 36 PB15
PA0 14 35 PB14
PA1 15 34 PB13
PA2 16 33 PB12
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
VSS
VDD
PC4
PC5
PB0
PB1
PB2
VSS
PB10
VCAP
VDD
PA3
PA4
PA5
PA6
PA7
MSv67303V2
PC12
PC10
PC11
PA15
PA14
VDD
VSS
PE0
PB9
PB8
PB7
PB6
PB5
PB4
PB3
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
VBAT 1 51 VDD
PC13 2 50 VSS
PC14-OSC32_IN 3 49 PA13
PC15-OSC32_OUT 4 48 PA12
PH0-OSC_IN 5 47 PA11
PH1-OSC_OUT 6 46 PA10
NRST 7 45 PA9
PC0 8 44 PA8
PC1 9 VFQFPN68 43 PC9
PC2 10 42 PC8
PC3 11 41 PC7
VSSA 12 40 PC6
VDDA 13 39 PD12
PA0 14 38 PD11
PA1 15 37 PB15
PA2 16 36 PB14
PA3 17 35 PB13
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
VSS
VDD
PC4
PC5
PB0
PB1
PB2
PB10
VCAP
VSS
VDD
PB12
PA4
PA5
PA6
PA7
PB11
MSv67302V2
A A1 A3 A5 A7 A9
B B2 B4 B6 B8 B10
C C1 C3 C5 C7 C9
D D2 D4 D6 D8 D10
E E1 E3 E5 E7 E9
F F2 F4 F6 F8 F10
G G1 G3 G5 G7 G9
H H2 H4 H6 H8 H10
J J1 J3 J5 J7 J9
K K2 K4 K6 K8 K10
L L1 L3 L5 L7 L9
M M2 M4 M6 M8 M10
N N1 N3 N5 N7 N9
P P2 P4 P6 P8 P10
R R1 R3 R5 R7 R9
T T2 T4 T6 T8 T10
MSv69915V1
BOOT0
VCAP
PC10
PC12
PC11
PA14
PA15
VDD
VSS
PD0
PD1
PD2
PD3
PD4
PD5
PD6
PD7
PB3
PB4
PB5
PB6
PB7
PB8
PB9
PE0
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
PE2 1 75 VDD
PE3 2 74 VSS
PE4 3 73 VDDUSB
PE5 4 72 PA13
PE6 5 71 PA12
VBAT 6 70 PA11
PC13 7 69 PA10
PC14-OSC32_IN 8 68 PA9
PC15-OSC32_OUT 9 67 PA8
VSS 10 66 PC9
VDD 11 65 PC8
PH0-OSC_IN 12 64 PC7
PH1-OSC_OUT 13 LQFP100 63 PC6
NRST 14 62 PD15
PC0 15 61 PD14
PC1 16 60 PD13
PC2 17 59 PD12
PC3 18 58 PD11
VSSA 19 57 PD10
VREF- 20 56 PD9
VREF+ 21 55 PD8
VDDA 22 54 PB15
PA0 23 53 PB14
PA1 24 52 PB13
PA2 25 51 PB12
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
VDD
VSS
PB10
VCAP
PE15
PE14
PE13
PE12
PE10
PE8
PE9
PE7
PB1
PB2
PC5
PB0
PC4
VDD
VSS
PE11
PA7
PA5
PA6
PA4
PA3
BOOT0
VCAP
PC10
PC12
PC11
PA14
PA15
VDD
VSS
PD0
PD1
PD2
PD3
PD4
PD5
PD6
PD7
PB3
PB4
PB5
PB6
PB7
PB8
PB9
PE0
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
PE2 1 75 VDD
PE3 2 74 VSS
PE4 3 73 VDDUSB
PE5 4 72 PA13
PE6 5 71 PA12
VBAT 6 70 PA11
PC13 7 69 PA10
PC14-OSC32_IN 8 68 PA9
PC15-OSC32_OUT 9 67 PA8
VSS 10 66 PC9
VDD 11 65 PC8
PH0-OSC_IN 12 64 PC7
PH1-OSC_OUT 13 LQFP100 63 PC6
NRST 14 62 PD15
PC0 15 61 PD14
PC1 16 60 PD13
PC2 17 59 PD12
PC3 18 58 PD11
VSSA 19 57 PD10
VREF+ 20 56 PD9
VDDA 21 55 PD8
PA0 22 54 PB15
PA1 23 53 PB14
PA2 24 52 PB13
PA3 25 51 VDD
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
VSS
VCAP
VSSSMPS
VDDSMPS
VLXSMPS
PB10
PE15
PE14
PE13
PE12
PE10
PE9
PE8
PE7
PB2
PB1
PB0
VDD
VSS
PB11
PE11
PA7
PA6
PA5
PA4
MSv64012V3
VDDIO2
BOOT0
VCAP
PG15
PG14
PG13
PG12
PG10
PC12
PC10
PG11
PC11
PA15
PA14
VDD
VDD
VSS
VSS
PG9
VSS
PD7
PD6
PD5
PD4
PD3
PD2
PD1
PD0
PE0
PB9
PB8
PB7
PB6
PB5
PB4
PB3
144
143
142
141
140
139
138
137
136
135
134
133
132
131
130
129
128
127
126
125
124
123
122
121
120
109
119
118
117
116
115
114
113
112
110
111
PE2 1 108 VDD
PE3 2 107 VSS
PE4 3 106 VDDUSB
PE5 4 105 PA13
PE6 5 104 PA12
VBAT 6 103 PA11
PC13 7 102 PA10
PC14-OSC32_IN 8 101 PA9
PC15-OSC32_OUT 9 100 PA8
PF0 10 99 PC9
PF1 11 98 PC8
PF2 12 97 PC7
PF3 13 96 PC6
PF4 14 95 VDD
PF5 15 94 VSS
VSS 16 93 PG8
VDD 17 92 PG7
PF6 18 91 PG6
PF7 19 LQFP144 90 PG5
PF8 20 89 PG4
PF9 21 88 PG3
PF10 22 87 PG2
PH0-OSC_IN 23 86 PD15
PH1-OSC_OUT 24 85 PD14
NRST 25 84 VDD
PC0 26 83 VSS
PC1 27 82 PD13
PC2 28 81 PD12
PC3 29 80 PD11
VDD 30 79 PD10
VSSA 31 78 PD9
VREF+ 32 77 PD8
VDDA 33 76 PB15
PA0 34 75 PB14
PA1 35 74 PB13
PA2 36 73 PB12
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
VSS
PG0
PG1
VDD
PC4
PC5
PB0
PB1
PB2
PF12
VSS
VDD
PF13
PF14
PF15
PE7
PE8
PE9
VSS
VSS
VDD
PE10
PE12
PE13
PE14
PE15
PB10
VCAP
VDD
PA3
PA4
PA5
PA6
PA7
PF11
PE11
MSv67305V3
VDDIO2
BOOT0
VCAP
PG15
PG14
PG13
PG12
PG10
PC12
PC10
PC11
PA15
PA14
VDD
VDD
VSS
VSS
PG9
VSS
PD7
PD6
PD5
PD4
PD3
PD2
PD1
PD0
PE1
PE0
PB9
PB8
PB7
PB6
PB5
PB4
PB3
144
143
142
141
140
139
138
137
136
135
134
133
132
131
130
129
128
127
126
125
124
123
122
121
120
109
119
118
117
116
115
114
113
112
110
111
PE2 1 108 VDD
PE3 2 107 VSS
PE4 3 106 VDDUSB
PE5 4 105 PA13
PE6 5 104 PA12
VBAT 6 103 PA11
PC13 7 102 PA10
PC14-OSC32_IN 8 101 PA9
PC15-OSC32_OUT 9 100 PA8
PF0 10 99 PC9
PF1 11 98 PC8
PF2 12 97 PC7
PF3 13 96 PC6
PF4 14 95 VDD
PF5 15 94 VSS
VSS 16 93 PG8
VDD 17 92 PG7
PF6 18 91 PG6
PF7 19 LQFP144 90 PG5
PF8 20 89 PG4
PF9 21 88 PG3
PF10 22 87 PG2
PH0-OSC_IN 23 86 PD15
PH1-OSC_OUT 24 85 PD14
NRST 25 84 VDD
PC0 26 83 VSS
PC1 27 82 PD13
PC2 28 81 PD12
PC3 29 80 PD11
VSSA 30 79 PD10
VREF+ 31 78 PD9
VDDA 32 77 PD8
PA0 33 76 PB15
PA1 34 75 PB14
PA2 35 74 PB13
PA3 36 73 VDD
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
VSS
VSS
VDD
PB0
PB1
PB2
PF12
PF13
PE8
VSS
VDD
PF14
PF15
PG0
PG1
PE7
PE9
VLXSMPS
VDD
PE10
PE12
PE13
PE14
PE15
PB10
VDDSMPS
VSSSMPS
VCAP
VSS
PA4
PA5
PA6
PA7
PF11
PE11
PB11
MSv64013V3
1 2 3 4 5 6 7 8 9 10 11 12 13
A PE2 PI7 VDD PB9 PB6 PB4 VDDIO2 PG10 PD3 VDD PC11 PA14 PI2
PC14-
B OSC32 PE3 VSS VCAP BOOT0 PG15 VSS PD7 PC12 VSS PA15 PI1 PI0
_IN
PC15-
C OSC32 PE5 PI6 PI4 PE0 PB5 PG14 PG12 PD2 PC10 PI3 VSS VDD
_OUT
VDDUS
D VDD VSS PE6 PE4 PE1 PB7 PG13 PD5 PD0 PH14 PH15 PH13
B
E PF1 VBAT PI8 PC13 PB8 PB3 PG11 PD6 PD1 PA10 PA9 PA13 PA12
F PF4 PF2 PF0 PI11 PF3 PF5 PG9 PD4 PC6 PC7 PG8 PA8 PA11
G VDD VSS PF7 PF6 PF8 PF10 PE8 PG7 PG3 PG5 PG6 PC8 PC9
PH1-
PH0-
H OSC_IN
OSC_O PF9 NRST PC3 PC5 PF13 PE10 PD15 PD11 PD14 VSS VDD
UT
J PC0 PC1 PC2 PA0 PA1 PF11 PF15 PE14 PD9 PB15 PD10 PG2 PG4
K VREF- VSSA PH2 PA5 PA7 PB1 PG1 PE12 PB10 PH6 PB12 PD12 PD13
L VDDA VREF+ PA2 PA4 PB0 PB2 PG0 PE9 PE13 PH7 PB13 PD8 VDD
M VDD VSS PH5 VSS PA6 PF14 VSS PE11 PB11 PH8 PH10 VSS PB14
N PH4 PH3 PA3 VDD PC4 PF12 VDD PE7 PE15 VCAP VDD PH11 PH12
MSv68827V2
1 2 3 4 5 6 7 8 9 10 11 12 13
A PI7 PI6 VDD VCAP PB4 VDDIO2 PD5 VDD PC11 PC10 VDD PI3 PH15
B VDD VSS PI5 VSS BOOT0 PG15 PD7 VSS PD1 PA15 VSS PI0 PA12
C VBAT PE5 PE2 PI4 PE1 PB6 PG10 PD3 PD0 PA14 PI1 PH13 PA11
PC14-
D OSC32 PE6 PE4 PE3 PE0 PB7 PG12 PD4 PC12 PI2 PH14 PA13 VDD
_IN
PC15-
VDDUS
E OSC32 PF0 PC13 PI8 PB9 PB5 PG9 PD2 PC8 PA8 PA10 VSS
B
_OUT
F PF7 VSS PF1 PF2 PB8 PB3 PD6 PG5 PG7 PC6 PC7 PC9 PA9
G VDD PF9 PF5 PF8 PF4 PF3 PF6 PD13 PG3 PD15 PG4 PG6 PG8
PH0-
H OSC_IN
VSS NRST PF10 PA1 PB1 PF13 PD11 PD9 PB15 PD12 PD14 PG2
PH1-
J OSC_O PC0 PC1 PH2 PA5 PF11 PF15 PE8 PE14 PB14 PD8 VSS VDD
UT
K PC2 PC3 PA0 PA3 PA7 PF12 PG1 PE13 PB10 PH10 PB12 PB13 PD10
L VSSA VREF- PA2 PH5 PC4 PF14 PE7 PE10 PE15 PB11 PH7 PH12 PH11
VSSSM
M VDDA VREF+ VSS PA4 PC5 PG0 VSS PE11 PE12
PS
VSS PH8 PH9
VLXSM VDDSM
N PH4 PH3 VDD PA6 PB0 PB2 VDD PE9
PS PS
VCAP VDD PH6
MSv64014V3
VDDIO2
BOOT0
VCAP
PG13
PG12
PG10
PG11
PG15
PG14
PC12
PC10
PC11
PA15
PA14
VDD
VDD
VDD
PG9
VSS
PD7
PD6
PD5
PD4
PD3
VSS
VSS
PE1
PE0
PD2
PD1
PD0
PB9
PB8
PB7
PB6
PB5
PB4
PB3
PI7
PI6
PI5
PI4
PI3
PI2
176
175
174
173
172
171
170
169
168
167
166
165
164
163
162
161
160
159
158
157
156
155
154
153
152
151
150
149
148
147
146
145
144
143
142
141
140
139
138
137
136
135
134
133
PE2 1 132 PI1
PE3 2 131 PI0
PE4 3 130 PH15
PE5 4 129 PH14
PE6 5 128 PH13
VBAT 6 127 VDD
PI8 7 126 VSS
PC13 8 125 VDDUSB
PC14-OSC32_IN 9 124 PA13
PC15-OSC32_OUT 10 123 PA12
PI9 11 122 PA11
PI10 12 121 PA10
PI11 13 120 PA9
VSS 14 119 PA8
VDD 15 118 PC9
PF0 16 117 PC8
PF1 17 116 PC7
PF2 18 115 PC6
PF3 19 114 VDD
PF4 20 113 VSS
PF5 21 112 PG8
VSS 22 111 PG7
VDD 23 LQFP176 110 PG6
PF6 24 109 PG5
PF7 25 108 PG4
PF8 26 107 PG3
PF9 27 106 PG2
PF10 28 105 PD15
PH0-OSC_IN 29 104 PD14
PH1-OSC_OUT 30 103 VDD
NRST 31 102 VSS
PC0 32 101 PD13
PC1 33 100 PD12
PC2 34 99 PD11
PC3 35 98 PD10
VDD 36 97 PD9
VSSA 37 96 PD8
VREF+ 38 95 PB15
VDDA 39 94 PB14
PA0 40 93 PB13
PA1 41 92 PB12
PA2 42 91 VDD
PH2 43 90 PH12
PH3 44 89 PH11
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
PH4
PH5
VSS
VDD
PC4
PC5
PB0
PB1
PB2
PF12
VSS
VDD
PF13
PF14
PF15
PG0
PG1
PE7
PE8
PE9
VSS
VDD
PE10
PE12
PE13
PE14
PE15
PB10
VCAP
VSS
VDD
PH6
PH7
PH8
PH9
PH10
PA3
PA4
PA5
PA6
PA7
PF11
PE11
PB11
MSv67307V3
VDDIO2
BOOT0
VCAP
PG13
PG12
PG10
PG11
PG15
PG14
PC12
PC10
PC11
PA15
PA14
VDD
VDD
VDD
PG9
VSS
PD7
PD6
PD5
PD4
PD3
VSS
VSS
PE1
PE0
PD2
PD1
PD0
PB9
PB8
PB7
PB6
PB5
PB4
PB3
PI7
PI6
PI5
PI4
PI3
PI2
176
175
174
173
172
171
170
169
168
167
166
165
164
163
162
161
160
159
158
157
156
155
154
153
152
151
150
149
148
147
146
145
144
143
142
141
140
139
138
137
136
135
134
133
PE2 1 132 PI1
PE3 2 131 PI0
PE4 3 130 PH15
PE5 4 129 PH14
PE6 5 128 PH13
VBAT 6 127 VDD
PI8 7 126 VSS
PC13 8 125 VDDUSB
PC14-OSC32_IN 9 124 PA13
PC15-OSC32_OUT 10 123 PA12
PI9 11 122 PA11
PI10 12 121 PA10
PI11 13 120 PA9
VSS 14 119 PA8
VDD 15 118 PC9
PF0 16 117 PC8
PF1 17 116 PC7
PF2 18 115 PC6
PF3 19 114 VDD
PF4 20 113 VSS
PF5 21 112 PG8
VSS 22 111 PG7
VDD 23 LQFP176 110 PG6
PF6 24 109 PG5
PF7 25 108 PG4
PF8 26 107 PG3
PF9 27 106 PG2
PH0-OSC_IN 28 105 PD15
PH1-OSC_OUT 29 104 PD14
NRST 30 103 VDD
PC0 31 102 VSS
PC1 32 101 PD13
PC2 33 100 PD12
PC3 34 99 PD11
VDD 35 98 PD10
VSSA 36 97 PD9
VREF+ 37 96 PD8
VDDA 38 95 PB15
PA0 39 94 PB14
PA1 40 93 PB13
PA2 41 92 PB12
PH2 42 91 VDD
PH3 43 90 VSS
PA3 44 89 PH12
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
VSS
VDD
PC4
PC5
PB0
PB1
PB2
PF12
VSS
VDD
PF13
PF14
PF15
PG0
PG1
PE7
PE8
PE9
VSS
VDD
PE10
PE12
PE14
PB10
VLXSMPS
PE13
PE15
VDDSMPS
VSSSMPS
VCAP
VSS
VDD
PH6
PH7
PH9
PH10
PA4
PA5
PA6
PA7
PF11
PE11
PB11
PH11
MSv67301V3
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
A PE3 PE2 PE1 PE0 PB8 PB5 PG14 PG13 PB4 PB3 PD7 PC12 PA15 PA14 PA13
B PE4 PE5 PE6 PB9 PB7 PB6 PG15 PG12 PG11 PG10 PD6 PD0 PC11 PC10 PA12
C VBAT PI7 PI6 PI5 VDD VCAP VDD VDDIO2 VDD PG9 PD5 PD1 PI3 PI2 PA11
D PC13 PI8 PI9 PI4 VSS BOOT0 VSS VSS VSS PD4 PD3 PD2 PH15 PI1 PA10
PC14-
E OSC32_ PF0 PI10 PI11 PH13 PH14 PI0 PA9
IN
PC15-
F OSC32_ VSS VDD PH2 VSS VSS VSS VSS VSS VSS VDD PC9 PA8
OUT
PH0-
G OSC_IN
VSS VDD PH3 VSS VSS VSS VSS VSS VSS VDD PC8 PC7
PH1-
VDDUS
H OSC_O PF2 PF1 PH4 VSS VSS VSS VSS VSS VSS
B
PG8 PC6
UT
J NRST PF3 PF4 PH5 VSS VSS VSS VSS VSS VDD VDD PG7 PG6
K PF7 PF6 PF5 VDD VSS VSS VSS VSS VSS PH12 PG5 PG4 PG3
M VSSA PC0 PC1 PC2 PC3 PB2 PG1 VSS VSS VCAP PH6 PH8 PH9 PD14 PD13
N VREF- PA1 PA0 PA4 PC4 PF13 PG0 VDD VDD VDD PE13 PH7 PD12 PD11 PD10
P VREF+ PA2 PA6 PA5 PC5 PF12 PF15 PE8 PE9 PE11 PE14 PB12 PB13 PD9 PD8
R VDDA PA3 PA7 PB1 PB0 PF11 PF14 PE7 PE10 PE12 PE15 PB10 PB11 PB14 PB15
MSv67306V3
A PI7 PI5 VCAP PB9 BOOT0 PB5 PG15 PG13 PG10 PD7 PD5 PD3 PD1 PI3 PI1
B VBAT PE3 PI4 PE1 PB8 PB6 PB3 PG12 PG9 PD6 PD4 PD0 PA14 PI2 PH13
C VSS PE6 PE4 PI6 PE0 PB7 PB4 PG13 PG11 PD2 PC12 PC11 PA15 PH15 PA12
PC15- PC14-
D OSC32_ OSC32_ PE5 PE2 VDD VSS VDDIO2 VDD VSS VDD VSS PC10 PH14 VSS PA11
OUT IN
VDD33U
F PF1 PF0 PI11 PI10 VSS VSS VSS VSS VSS
SB
PC9 PC8 PA8
G PF4 PF3 PF2 VSS VSS VSS VSS VSS VSS VSS PC7 PC6 PG8
H PF6 PF8 PF5 VDD VSS VSS VSS VSS VSS VSS PG7 PG3 PG5
PH1-
PH0-
J OSC_IN
OSC_O PF9 PF10 VSS VSS VSS VSS VSS VDD PD15 PG6 PG4
UT
K VSS PF7 NRST PC2 VSS VSS VSS VSS VSS PD10 PD14 PD12 PG2
M VDDA VSSA PA2 VSS PA4 VDD VSS VDD VSS PB10 VDD PH9 PH12 PB15 PD8
N VREF+ VREF- PC3 PC4 PA3 PB1 PF12 PF15 PE9 PE14 PE15 PB11 PH8 PH10 PB14
VSSSM
P PH5 PA0 PH3 PC5 PA6 PB2 PF13 PG1 PE8 PE11 PE13
PS
PH6 PH7 PH11
VLXSM VDDSM
R PH4 PH2 PA5 PA7 PB0 PF11 PF14 PG0 PE7 PE10 PE12
PS PS
VCAP PB13
MSv67300V2
Unless otherwise specified in brackets below the pin name, the pin function during
Pin name
and after reset is the same as the actual pin name
S Supply pin
Pin type I Input only pin
I/O Input/output pin
FT 5V-tolerant I/O
TT 3.6V-tolerant I/O
Bidirectional reset pin with embedded weak pull-up
RST
resistor
Option for TT or FT I/Os(1)
_a I/O, with analog switch function supplied by VDDA
Additional functions
Alternate functions
UFBGA176+25 SMPS
I/O structure
UFBGA169 SMPS
WLCSP80 SMPS
LQFP100 SMPS
LQFP144 SMPS
LQFP176 SMPS
reset)(3)(4)
UFBGA176+25
Pin type
Notes
UFBGA169
VFQFPN68
LQFP100
LQFP144
LQFP176
LQFP64
TRACECLK, LPTIM1_IN2,
SAI1_CK1, SPI4_SCK,
SAI1_MCLK_A, USART10_RX,
- 1 1 C3 1 D4 - 1 1 A1 1 A2 - PE2 I/O FT_h - -
UART8_TX, OCTOSPI1_IO2,
ETH_MII_TXD3, FMC_A23,
DCMI_D3/PSSI_D3, EVENTOUT
DS14258 Rev 1
TRACED0, TIM15_BKIN,
- 2 2 D4 2 B2 - 2 2 B2 2 A1 - PE3 I/O FT_h - SAI1_SD_B, USART10_TX, TAMP_IN6/TAMP_OUT3
FMC_A19, EVENTOUT
TRACED1, SAI1_D2,
TIM15_CH1N, SPI4_NSS,
- 3 3 D3 3 C3 - 3 3 D4 3 B1 - PE4 I/O FT_h - TAMP_IN7/TAMP_OUT8
SAI1_FS_A, FMC_A20,
DCMI_D4/PSSI_D4, EVENTOUT
TRACED2, SAI1_CK2,
TIM15_CH1, SPI4_MISO,
TRACED3, TIM1_BKIN2,
SAI1_D1, TIM15_CH2,
- 5 5 D2 5 C2 - 5 5 D3 5 B3 - PE6 I/O FT_h - SPI4_MOSI, SAI1_SD_A, TAMP_IN3/TAMP_OUT6
SAI2_MCLK_B, FMC_A22,
DCMI_D7/PSSI_D7, EVENTOUT
A1 - - - - - - - - - - - - VDD S - - - -
B8 - - - - - - - - - - - - VSS S - - - -
B10 6 6 C1 6 B1 1 6 6 E2 6 C1 1 VBAT S - - - -
D2 - - - - - - - - - - - - VSS S - - - -
Table 14. STM32H562xx and STM32H563xx pin/ball definition (continued)
Additional functions
Alternate functions
UFBGA176+25 SMPS
I/O structure
UFBGA169 SMPS
WLCSP80 SMPS
LQFP100 SMPS
LQFP144 SMPS
LQFP176 SMPS
reset)(3)(4)
UFBGA176+25
Pin type
Notes
UFBGA169
VFQFPN68
LQFP100
LQFP144
LQFP176
LQFP64
(5) TAMP_IN2/TAMP_OUT3,
- - - E4 7 E2 - - - E3 7 D2 - PI8 I/O FT_t EVENTOUT
RTC_OUT2, WKUP3
TAMP_IN1/TAMP_OUT2/
(5)
C9 7 7 E3 8 E3 2 7 7 E4 8 D1 2 PC13 I/O FT_t EVENTOUT TAMP_OUT3, RTC_OUT1/
RTC_TS, WKUP4
G9 - - - - - - - - - - - - VSS S - - - -
DS14258 Rev 1
PC14-
OSC32_
D10 8 8 D1 9 D2 3 8 8 B1 9 E1 3 I/O FT - EVENTOUT OSC32_IN
IN
(OSC32_IN)
PC15-
OSC32_OU
F10 9 9 E1 10 D1 4 9 9 C1 10 F1 4 T I/O FT - EVENTOUT OSC32_OUT
(OSC32_O
UT)
UART4_RX, FDCAN1_RX,
- - - - 11 E1 - - - - 11 D3 - PI9 I/O FT_h - -
EVENTOUT
FDCAN1_RX, ETH_MII_RX_ER,
- - - - 12 F4 - - - - 12 E3 - PI10 I/O FT_h - -
PSSI_D14, EVENTOUT
- - - B2 14 C1 - - - D2 14 D5 - VSS S - - - -
- - - B1 15 D5 - - - D1 15 C5 - VDD S - - - -
I2C2_SDA, FMC_A0,
- - 10 E2 16 F2 - - 10 F3 16 E2 - PF0 I/O FT_f - -
LPTIM5_CH1, EVENTOUT
79/275
I2C2_SCL, FMC_A1,
- - 11 F3 17 F1 - - 11 E1 17 H3 - PF1 I/O FT_f - -
LPTIM5_CH2, EVENTOUT
Table 14. STM32H562xx and STM32H563xx pin/ball definition (continued)
80/275 Pin number(1)(2)
Additional functions
Alternate functions
UFBGA176+25 SMPS
I/O structure
UFBGA169 SMPS
WLCSP80 SMPS
LQFP100 SMPS
LQFP144 SMPS
LQFP176 SMPS
reset)(3)(4)
UFBGA176+25
Pin type
Notes
UFBGA169
VFQFPN68
LQFP100
LQFP144
LQFP176
LQFP64
LPTIM3_CH2, LPTIM3_IN2,
I2C2_SMBA, UART12_TX,
- - 12 F4 18 G3 - - 12 F2 18 H2 - PF2 I/O FT_h - -
USART11_CK, FMC_A2,
LPTIM5_IN1, EVENTOUT
LPTIM3_IN1, USART11_TX,
- - 13 G6 19 G2 - - 13 F5 19 J2 - PF3 I/O FT_h - FMC_A3, LPTIM5_IN2, -
EVENTOUT
DS14258 Rev 1
LPTIM3_ETR, USART11_RX,
- - 14 G5 20 G1 - - 14 F1 20 J3 - PF4 I/O FT_h - -
FMC_A4, EVENTOUT
LPTIM3_CH1, I2C4_SCL,
I3C1_SCL, UART12_RX,
- - 15 G3 21 H3 - - 15 F6 21 K3 - PF5 I/O FT_fh - USART11_CTS/USART11_NSS, -
FMC_A5, LPTIM3_IN1,
EVENTOUT
H2 10 16 F2 22 G4 - 10 16 G2 22 F2 - VSS S - - - -
TIM16_CH1, SPI5_NSS,
SAI1_SD_B, UART7_RX,
- - 18 G7 24 H1 - - 18 G4 24 K2 - PF6 I/O FT_h - -
OCTOSPI1_IO3, LPTIM5_CH1,
EVENTOUT
TIM17_CH1, SPI5_SCK,
SAI1_MCLK_B, UART7_TX,
- - 19 F1 25 K2 - - 19 G3 25 K1 - PF7 I/O FT_h - -
OCTOSPI1_IO2, LPTIM5_CH2,
EVENTOUT
Table 14. STM32H562xx and STM32H563xx pin/ball definition (continued)
Additional functions
Alternate functions
UFBGA176+25 SMPS
I/O structure
UFBGA169 SMPS
WLCSP80 SMPS
LQFP100 SMPS
LQFP144 SMPS
LQFP176 SMPS
reset)(3)(4)
UFBGA176+25
Pin type
Notes
UFBGA169
VFQFPN68
LQFP100
LQFP144
LQFP176
LQFP64
TIM16_CH1N, SPI5_MISO,
SAI1_SCK_B, UART7_RTS,
- - 20 G4 26 H2 - - 20 G5 26 L3 - PF8 I/O FT_h - -
TIM13_CH1, OCTOSPI1_IO0,
LPTIM5_IN1, EVENTOUT
TIM17_CH1N, SPI5_MOSI,
SAI1_FS_B, UART7_CTS,
- - 21 G2 27 J3 - - 21 H3 27 L2 - PF9 I/O FT_h - -
TIM14_CH1, OCTOSPI1_IO1,
DS14258 Rev 1
LPTIM5_IN2, EVENTOUT
TIM16_BKIN, SAI1_D3,
PSSI_D15, OCTOSPI1_CLK,
- - 22 H4 - J4 - - 22 G6 28 L1 - PF10 I/O FT_h - -
DCMI_D11/PSSI_D11,
EVENTOUT
PH0-
K10 12 23 H1 28 J1 5 12 23 H1 29 G1 5 OSC_IN(PH I/O FT - EVENTOUT OSC_IN
0)
PH1-
J9 13 24 J1 29 J2 6 13 24 H2 30 H1 6 OSC_OUT( I/O FT - EVENTOUT OSC_OUT
PH1)
Additional functions
Alternate functions
UFBGA176+25 SMPS
I/O structure
UFBGA169 SMPS
WLCSP80 SMPS
LQFP100 SMPS
LQFP144 SMPS
LQFP176 SMPS
reset)(3)(4)
UFBGA176+25
Pin type
Notes
UFBGA169
VFQFPN68
LQFP100
LQFP144
LQFP176
LQFP64
TRACED0, SAI1_D1,
SPI2_MOSI/I2S2_SDO, ADC12_INP11,
SAI1_SD_A, USART11_RTS, ADC12_INN10,
G7 16 27 J3 32 L2 9 16 27 J2 33 M3 9 PC1 I/O FT_ah -
SAI2_SD_A, SDMMC2_CK, TAMP_IN3/TAMP_OUT5,
OCTOSPI1_IO4, ETH_MDC, WKUP6
EVENTOUT
PWR_CSLEEP, TIM17_CH1,
DS14258 Rev 1
TIM4_CH4,
SPI2_MISO/I2S2_SDI,
ADC12_INP12,
M10 17 28 K1 33 K4 10 17 28 J3 34 M4 10 PC2 I/O FT_a - OCTOSPI1_IO5,
ADC12_INN11
OCTOSPI1_IO2,
ETH_MII_TXD2, FMC_SDNE0,
EVENTOUT
PWR_CSTOP, SAI1_D3,
LPTIM3_CH1,
SPI2_MOSI/I2S2_SDO,
ADC12_INP13,
L9 18 29 K2 34 N3 11 18 29 H5 35 M5 11 PC3 I/O FT_a - OCTOSPI1_IO6,
G1 - - - 35 H4 - - 30 M1 36 G3 - VDD S - - - -
P2 - - H2 - K1 - - - M2 - G2 - VSS S - - - -
N9 19 30 L1 36 M2 12 19 31 K2 37 M1 12 VSSA S - - - -
- - - L2 - N2 - 20 - K1 - N1 - VREF- S - - - -
- 20 31 M2 37 N1 - 21 32 L2 38 P1 - VREF+ S - - - -
P10 21 32 M1 38 M1 13 22 33 L1 39 R1 13 VDDA S - - - -
Table 14. STM32H562xx and STM32H563xx pin/ball definition (continued)
Additional functions
Alternate functions
UFBGA176+25 SMPS
I/O structure
UFBGA169 SMPS
WLCSP80 SMPS
LQFP100 SMPS
LQFP144 SMPS
LQFP176 SMPS
reset)(3)(4)
UFBGA176+25
Pin type
Notes
UFBGA169
VFQFPN68
LQFP100
LQFP144
LQFP176
LQFP64
TIM2_CH1, TIM5_CH1,
TIM8_ETR, TIM15_BKIN,
ADC12_INP0,
SPI6_NSS, SPI3_RDY,
(5) ADC12_INN1,
K8 22 33 K3 39 P2 14 23 34 J4 40 N3 14 PA0 I/O FT_at USART2_CTS/USART2_NSS,
TAMP_IN2/TAMP_OUT1,
UART4_TX, SDMMC2_CMD,
WKUP1
SAI2_SD_B, ETH_MII_CRS,
TIM2_ETR, EVENTOUT
DS14258 Rev 1
TIM2_CH2, TIM5_CH2,
TIM15_CH1N, LPTIM1_IN1,
OCTOSPI1_DQS,
(5) ADC12_INP1,
J7 23 34 H5 40 L3 15 24 35 J5 41 N2 15 PA1 I/O FT_aht USART2_RTS, UART4_RX,
TAMP_IN5/TAMP_OUT4
OCTOSPI1_IO3, SAI2_MCLK_B,
ETH_MII_RX_CLK/ETH_RMII_R
EF_CLK, EVENTOUT
TIM2_CH3, TIM5_CH3,
ADC12_INP14,
(5) TIM15_CH1, LPTIM1_IN2,
M8 24 35 L3 41 M3 16 25 36 L3 42 P2 16 PA2 I/O FT_hat TAMP_IN4/TAMP_OUT3,
USART2_TX, SAI2_SCK_B,
WKUP2
ETH_MDIO, EVENTOUT
LPTIM1_IN2, OCTOSPI1_IO4,
- - - J4 42 R2 - - - K3 43 F4 - PH2 I/O FT_h - SAI2_SCK_B, ETH_MII_CRS, -
FMC_SDCKE0, EVENTOUT
H10 - - - - L4 - - - - - K4 - VDD S - - - -
P8 - - - - M4 - - - - - L4 - VSS S - - - -
OCTOSPI1_IO5, SAI2_MCLK_B,
- - - N2 43 P3 - - - N2 44 G4 - PH3 I/O FT_ah - ETH_MII_COL, FMC_SDNE0, -
EVENTOUT
83/275
Table 14. STM32H562xx and STM32H563xx pin/ball definition (continued)
84/275 Pin number(1)(2)
Additional functions
Alternate functions
UFBGA176+25 SMPS
I/O structure
UFBGA169 SMPS
WLCSP80 SMPS
LQFP100 SMPS
LQFP144 SMPS
LQFP176 SMPS
reset)(3)(4)
UFBGA176+25
Pin type
Notes
UFBGA169
VFQFPN68
LQFP100
LQFP144
LQFP176
LQFP64
I2C2_SCL, SPI5_RDY,
- - - N1 - R1 - - - N1 45 H4 - PH4 I/O FT_fa - SPI6_RDY, PSSI_D14, -
EVENTOUT
I2C2_SDA, SPI5_NSS,
- - - L4 - P1 - - - M3 46 J4 - PH5 I/O FT_fa - SPI6_RDY, FMC_SDNWE, -
EVENTOUT
DS14258 Rev 1
TIM2_CH4, TIM5_CH4,
OCTOSPI1_CLK, TIM15_CH2,
T10 25 36 K4 44 N5 17 26 37 N3 47 R2 17 PA3 I/O FT_ah - SPI2_NSS/I2S2_WS, ADC12_INP15
SAI1_SD_B, USART2_RX,
ETH_MII_COL, EVENTOUT
- 26 37 M3 45 M7 18 27 38 M4 48 M8 18 VSS S - - - -
R1 27 38 N3 46 M6 19 28 39 N4 49 N8 19 VDD S - - - -
TIM5_ETR, LPTIM2_CH1,
SPI1_NSS/I2S1_WS,
TIM2_CH1, TIM8_CH1N,
SPI1_SCK/I2S1_CK, SPI6_SCK, ADC12_INP19,
L7 29 40 J5 48 R3 21 30 41 K4 51 P4 21 PA5 I/O TT_ah - ETH_MII_TX_EN/ETH_RMII_TX ADC12_INN18,
_EN, PSSI_D14, TIM2_ETR, DAC1_OUT2
EVENTOUT
Table 14. STM32H562xx and STM32H563xx pin/ball definition (continued)
Additional functions
Alternate functions
UFBGA176+25 SMPS
I/O structure
UFBGA169 SMPS
WLCSP80 SMPS
LQFP100 SMPS
LQFP144 SMPS
LQFP176 SMPS
reset)(3)(4)
UFBGA176+25
Pin type
Notes
UFBGA169
VFQFPN68
LQFP100
LQFP144
LQFP176
LQFP64
TIM1_BKIN, TIM3_CH1,
TIM8_BKIN,
SPI1_MISO/I2S1_SDI,
H6 30 41 N4 49 P5 22 31 42 M5 52 P3 22 PA6 I/O FT_ah - OCTOSPI1_IO3, USART11_TX, ADC12_INP3
SPI6_MISO, TIM13_CH1,
DCMI_PIXCLK/PSSI_PDCK,
EVENTOUT
DS14258 Rev 1
TIM1_CH1N, TIM3_CH2,
TIM8_CH1N,
SPI1_MOSI/I2S1_SDO,
USART11_RX, SPI6_MOSI, ADC12_INP7,
K6 31 42 K5 50 R4 23 32 43 K5 53 R3 23 PA7 I/O FT_ah -
TIM14_CH1, OCTOSPI1_IO2, ADC12_INN3
ETH_MII_RX_DV/ETH_RMII_CR
S_DV, FMC_SDNWE,
FMC_NWE, EVENTOUT
TIM2_CH4, SAI1_CK1,
LPTIM2_ETR, I2S1_MCK,
M6 - - L5 51 N4 24 33 44 N5 54 N5 24 PC4 I/O FT_a - USART3_RX, ADC12_INP4
ETH_MII_RXD0/ETH_RMII_RXD
0, FMC_SDNE0, EVENTOUT
TIM1_CH4N, SAI1_D3,
PSSI_D15, SAI1_FS_A,
UART12_RTS, ADC12_INP8,
N7 - - M5 52 P4 25 34 45 H6 55 P5 25 PC5 I/O FT_ah -
OCTOSPI1_DQS, ADC12_INN4
ETH_MII_RXD1/ETH_RMII_RXD
1, FMC_SDCKE0, EVENTOUT
T8 - - - - M8 - - - - - - - VDD S - - - -
85/275
Table 14. STM32H562xx and STM32H563xx pin/ball definition (continued)
86/275 Pin number(1)(2)
Additional functions
Alternate functions
UFBGA176+25 SMPS
I/O structure
UFBGA169 SMPS
WLCSP80 SMPS
LQFP100 SMPS
LQFP144 SMPS
LQFP176 SMPS
reset)(3)(4)
UFBGA176+25
Pin type
Notes
UFBGA169
VFQFPN68
LQFP100
LQFP144
LQFP176
LQFP64
TIM1_CH2N, TIM3_CH3,
TIM8_CH2N, OCTOSPI1_IO1,
ADC12_INP9,
R7 32 43 N5 53 R5 26 35 46 L5 56 R5 26 PB0 I/O FT_ah - USART11_CK, UART4_CTS,
ADC12_INN5
ETH_MII_RXD2, LPTIM3_CH1,
EVENTOUT
TIM1_CH3N, TIM3_CH4,
TIM8_CH3N, OCTOSPI1_IO0,
DS14258 Rev 1
RTC_OUT2, SAI1_D1,
TIM8_CH4N, SPI1_RDY,
LPTIM1_CH1, SAI1_SD_A,
SPI3_MOSI/I2S3_SDO,
L5 34 45 N6 55 P6 28 37 48 L6 58 M6 28 PB2 I/O FT_ah - LSCO
OCTOSPI1_CLK,
OCTOSPI1_DQS,
SDMMC1_CMD, LPTIM5_ETR,
EVENTOUT
FMC_A6, LPTIM6_CH2,
- - 47 K6 57 N7 - - 50 N6 60 P6 - PF12 I/O FT_ah - ADC1_INP6, ADC1_INN2
EVENTOUT
- - 48 M7 58 - - - 51 M7 61 - - VSS S - - - -
- - 49 N7 59 - - - 52 N7 62 N9 - VDD S - - - -
I2C4_SMBA, FMC_A7,
- - 50 H7 60 P7 - - 53 H7 63 N6 - PF13 I/O FT_ah - ADC2_INP2
LPTIM6_IN1, EVENTOUT
Table 14. STM32H562xx and STM32H563xx pin/ball definition (continued)
Additional functions
Alternate functions
UFBGA176+25 SMPS
I/O structure
UFBGA169 SMPS
WLCSP80 SMPS
LQFP100 SMPS
LQFP144 SMPS
LQFP176 SMPS
reset)(3)(4)
UFBGA176+25
Pin type
Notes
UFBGA169
VFQFPN68
LQFP100
LQFP144
LQFP176
LQFP64
FMC_A8, LPTIM6_IN2,
- - 51 L6 61 R7 - - 54 M6 64 R7 - PF14 I/O FT_fah - ADC2_INP6, ADC2_INN2
EVENTOUT
SPI2_MOSI/I2S2_SDO,
- - 54 K7 64 P8 - - 57 K7 67 M7 - PG1 I/O FT_h - UART9_TX, FMC_A11, -
EVENTOUT
TIM1_ETR, UART12_RTS,
UART7_RX, OCTOSPI1_IO4,
T6 35 55 L7 65 R9 - 38 58 N8 68 R8 - PE7 I/O FT_ah - -
FMC_D4/FMC_AD4,
EVENTOUT
TIM1_CH1N,
UART12_CTS/UART12_NSS,
N5 36 56 J8 66 P9 - 39 59 G7 69 P8 - PE8 I/O FT_ah - UART7_TX, OCTOSPI1_IO5, -
FMC_D5/FMC_AD5,
EVENTOUT
TIM1_CH1, UART12_RX,
UART7_RTS, OCTOSPI1_IO6,
R5 37 57 N8 67 N9 - 40 60 L8 70 P9 - PE9 I/O FT_ah - -
FMC_D6/FMC_AD6,
EVENTOUT
- - 58 - 68 - - - 61 - 71 - - VSS S - - - -
- - 59 - 69 - - - 62 - 72 - - VDD S - - - -
87/275
Table 14. STM32H562xx and STM32H563xx pin/ball definition (continued)
88/275 Pin number(1)(2)
Additional functions
Alternate functions
UFBGA176+25 SMPS
I/O structure
UFBGA169 SMPS
WLCSP80 SMPS
LQFP100 SMPS
LQFP144 SMPS
LQFP176 SMPS
reset)(3)(4)
UFBGA176+25
Pin type
Notes
UFBGA169
VFQFPN68
LQFP100
LQFP144
LQFP176
LQFP64
TIM1_CH2N, UART12_TX,
UART7_CTS, OCTOSPI1_IO7,
M4 38 60 L8 70 R10 - 41 63 H8 73 R9 - PE10 I/O FT_ah - -
FMC_D7/FMC_AD7,
EVENTOUT
TIM1_CH2, SPI1_RDY,
SPI4_NSS, OCTOSPI1_NCS,
- 39 61 M8 71 P10 - 42 64 M8 74 P10 - PE11 I/O FT_ah - SAI2_SD_B, -
DS14258 Rev 1
FMC_D8/FMC_AD8,
EVENTOUT
TIM1_CH3N, SPI4_SCK,
SAI2_SCK_B,
- 40 62 M9 72 R11 - 43 65 K8 75 R10 - PE12 I/O FT_h - -
FMC_D9/FMC_AD9,
EVENTOUT
TIM1_CH3, SPI4_MISO,
SAI2_FS_B,
- 41 63 K8 73 P11 - 44 66 L9 76 N11 - PE13 I/O FT_h - -
FMC_D10/FMC_AD10,
TIM1_CH4, SPI4_MOSI,
SAI2_MCLK_B,
- 42 64 J9 74 N10 - 45 67 J8 77 P11 - PE14 I/O FT_h - -
FMC_D11/FMC_AD11,
EVENTOUT
TIM1_BKIN, TIM1_CH4N,
USART10_CK,
- 43 65 L9 75 N11 - 46 68 N9 78 R11 - PE15 I/O FT_h - -
FMC_D12/FMC_AD12,
EVENTOUT
Table 14. STM32H562xx and STM32H563xx pin/ball definition (continued)
Additional functions
Alternate functions
UFBGA176+25 SMPS
I/O structure
UFBGA169 SMPS
WLCSP80 SMPS
LQFP100 SMPS
LQFP144 SMPS
LQFP176 SMPS
reset)(3)(4)
UFBGA176+25
Pin type
Notes
UFBGA169
VFQFPN68
LQFP100
LQFP144
LQFP176
LQFP64
TIM2_CH3, LPTIM3_CH1,
LPTIM2_IN1, I2C2_SCL,
P4 44 66 K9 76 M10 29 47 69 K9 79 R12 29 PB10 I/O FT_f - SPI2_SCK/I2S2_CK, -
USART3_TX, OCTOSPI1_NCS,
ETH_MII_RX_ER, EVENTOUT
TIM2_CH4, LPTIM2_ETR,
I2C2_SDA, SPI2_RDY,
DS14258 Rev 1
TIM1_CH3N, TIM12_CH1,
TIM8_CH1, I2C2_SMBA,
- - - N13 84 P13 - - - K10 84 M11 - PH6 I/O FT - SPI5_SCK, ETH_MII_RXD2, -
FMC_SDNE1,
DCMI_D8/PSSI_D8, EVENTOUT
TIM1_CH3, TIM8_CH1N,
I2C3_SCL, SPI5_MISO,
- - - L11 85 P14 - - - L10 85 N12 - PH7 I/O FT_f - -
ETH_MII_RXD3, FMC_SDCKE1,
DCMI_D9/PSSI_D9, EVENTOUT
89/275
Table 14. STM32H562xx and STM32H563xx pin/ball definition (continued)
90/275 Pin number(1)(2)
Additional functions
Alternate functions
UFBGA176+25 SMPS
I/O structure
UFBGA169 SMPS
WLCSP80 SMPS
LQFP100 SMPS
LQFP144 SMPS
LQFP176 SMPS
reset)(3)(4)
UFBGA176+25
Pin type
Notes
UFBGA169
VFQFPN68
LQFP100
LQFP144
LQFP176
LQFP64
TIM1_CH2N, TIM5_ETR,
TIM8_CH2, I2C3_SDA,
- - - M12 - N13 - - - M10 86 M12 - PH8 I/O FT_fh - SPI5_MOSI, -
DCMI_HSYNC/PSSI_DE,
EVENTOUT
TIM1_CH2, TIM12_CH2,
TIM8_CH2N, I2C3_SMBA,
DS14258 Rev 1
TIM1_CH1N, TIM5_CH1,
TIM8_CH3, I2C4_SMBA,
- - - K10 87 N14 - - - M11 88 L13 - PH10 I/O FT_h - -
SPI5_RDY, DCMI_D1/PSSI_D1,
EVENTOUT
TIM1_CH1, TIM5_CH2,
TIM8_CH3N, I2C4_SCL,
- - - L13 88 P15 - - - N12 89 L12 - PH11 I/O FT_fh - -
I3C1_SCL, DCMI_D2/PSSI_D2,
TIM1_BKIN, TIM5_CH3,
TIM8_BKIN, I2C4_SDA,
- - - L12 89 M13 - - - N13 90 K12 - PH12 I/O FT_fh - -
I3C1_SDA, TIM8_CH4N,
DCMI_D3/PSSI_D3, EVENTOUT
- - - - 90 H12 - - - - - - - VSS S - - - -
Additional functions
Alternate functions
UFBGA176+25 SMPS
I/O structure
UFBGA169 SMPS
WLCSP80 SMPS
LQFP100 SMPS
LQFP144 SMPS
LQFP176 SMPS
reset)(3)(4)
UFBGA176+25
Pin type
Notes
UFBGA169
VFQFPN68
LQFP100
LQFP144
LQFP176
LQFP64
TIM1_BKIN, OCTOSPI1_NCLK,
I2C2_SDA, SPI2_NSS/I2S2_WS,
UCPD1_FRSTX, USART3_CK,
L3 - - K11 92 L12 33 51 73 K11 92 P12 34 PB12 I/O FT_fh - -
FDCAN2_RX,
ETH_MII_TXD0/ETH_RMII_TXD
0, UART5_RX, EVENTOUT
TIM1_CH1N, LPTIM3_IN1,
DS14258 Rev 1
LPTIM2_CH1, I2C2_SMBA,
SPI2_SCK/I2S2_CK,
M2 52 74 K12 93 R15 34 52 74 L11 93 P13 35 PB13 I/O FT_c - UCPD1_CC1
USART3_CTS/USART3_NSS,
FDCAN2_TX, SDMMC1_D0,
UART5_TX, EVENTOUT
TIM1_CH2N, TIM12_CH1,
TIM8_CH2N, USART1_TX,
SPI2_MISO/I2S2_SDI,
N1 53 75 J10 94 N15 35 53 75 M13 94 R14 36 PB14 I/O FT_c - UCPD1_CC2
USART3_RTS, UART4_RTS,
SDMMC2_D0, LPTIM3_ETR,
EVENTOUT
RTC_REFIN, TIM1_CH3N,
TIM12_CH2, TIM8_CH3N,
USART1_RX,
SPI2_MOSI/I2S2_SDO,
USART11_CTS/USART11_NSS,
L1 54 76 H10 95 M14 36 54 76 J10 95 R15 37 PB15 I/O FT_h - PVD_IN
UART4_CTS, SDMMC2_D1,
OCTOSPI1_CLK,
ETH_MII_TXD1/ETH_RMII_TXD
1, DCMI_D2/PSSI_D2,
UART5_RX, EVENTOUT
91/275
Table 14. STM32H562xx and STM32H563xx pin/ball definition (continued)
92/275 Pin number(1)(2)
Additional functions
Alternate functions
UFBGA176+25 SMPS
I/O structure
UFBGA169 SMPS
WLCSP80 SMPS
LQFP100 SMPS
LQFP144 SMPS
LQFP176 SMPS
reset)(3)(4)
UFBGA176+25
Pin type
Notes
UFBGA169
VFQFPN68
LQFP100
LQFP144
LQFP176
LQFP64
USART3_TX,
- 55 77 J11 96 M15 - 55 77 L12 96 P15 - PD8 I/O FT_h - FMC_D13/FMC_AD13, -
EVENTOUT
- - - - - G12 - - - - - - - VSS S - - - -
USART3_RX, FDCAN2_RX,
- 56 78 H9 97 L13 - 56 78 J9 97 P14 - PD9 I/O FT_h - FMC_D14/FMC_AD14, -
DS14258 Rev 1
EVENTOUT
LPTIM2_CH2, USART3_CK,
- 57 79 K13 98 K12 - 57 79 J11 98 N15 - PD10 I/O FT_h - FMC_D15/FMC_AD15, -
EVENTOUT
SAI1_CK1, LPTIM2_IN2,
I2C4_SMBA,
USART3_CTS/USART3_NSS,
- 58 80 H8 99 L14 - 58 80 H10 99 N14 38 PD11 I/O FT_h - UART4_RX, OCTOSPI1_IO0, -
SAI2_SD_A,
LPTIM1_IN1, TIM4_CH1,
LPTIM2_IN1, I2C4_SCL,
I3C1_SCL, SAI1_D1,
USART3_RTS, UART4_TX,
- 59 81 H11 100 K14 - 59 81 K12 100 N13 39 PD12 I/O FT_fh - -
OCTOSPI1_IO1, SAI2_FS_A,
FMC_A17/FMC_ALE,
DCMI_D12/PSSI_D12,
EVENTOUT
Table 14. STM32H562xx and STM32H563xx pin/ball definition (continued)
Additional functions
Alternate functions
UFBGA176+25 SMPS
I/O structure
UFBGA169 SMPS
WLCSP80 SMPS
LQFP100 SMPS
LQFP144 SMPS
LQFP176 SMPS
reset)(3)(4)
UFBGA176+25
Pin type
Notes
UFBGA169
VFQFPN68
LQFP100
LQFP144
LQFP176
LQFP64
LPTIM1_CH1, TIM4_CH2,
LPTIM2_CH1, I2C4_SDA,
I3C1_SDA, OCTOSPI1_IO3,
- 60 82 G8 101 L15 - 60 82 K13 101 M15 - PD13 I/O FT_fh - SAI2_SCK_A, UART9_RTS, -
FMC_A18,
DCMI_D13/PSSI_D13,
LPTIM4_IN1, EVENTOUT
DS14258 Rev 1
TIM4_CH3, UART8_CTS,
UART9_RX,
K2 61 85 H12 104 K13 - 61 85 H11 104 M14 - PD14 I/O FT_h - -
FMC_D0/FMC_AD0,
EVENTOUT
TIM4_CH4, UART8_RTS,
J1 62 86 G10 105 J13 - 62 86 H9 105 L14 - PD15 I/O FT_h - UART9_TX, FMC_D1/FMC_AD1, -
EVENTOUT
- - - - - - - - - - - - - VDD S - - - -
- - - - - - - - - - - - - VSS S - - - -
TIM8_BKIN, UART12_RX,
- - 87 H13 106 K15 - - 87 J12 106 L15 - PG2 I/O FT_h - FMC_A12, LPTIM6_ETR, -
EVENTOUT
TIM8_BKIN2, UART12_TX,
- - 88 G9 107 H14 - - 88 G9 107 K15 - PG3 I/O FT_h - FMC_A13, LPTIM5_ETR, -
EVENTOUT
TIM1_BKIN2,
93/275
- - 89 G11 108 J15 - - 89 J13 108 K14 - PG4 I/O FT_h - FMC_A14/FMC_BA0, -
LPTIM4_ETR, EVENTOUT
Table 14. STM32H562xx and STM32H563xx pin/ball definition (continued)
94/275 Pin number(1)(2)
Additional functions
Alternate functions
UFBGA176+25 SMPS
I/O structure
UFBGA169 SMPS
WLCSP80 SMPS
LQFP100 SMPS
LQFP144 SMPS
LQFP176 SMPS
reset)(3)(4)
UFBGA176+25
Pin type
Notes
UFBGA169
VFQFPN68
LQFP100
LQFP144
LQFP176
LQFP64
TIM1_ETR,
- - 90 F8 109 H15 - - 90 G10 109 K13 - PG5 I/O FT_h - FMC_A15/FMC_BA1, -
EVENTOUT
TIM17_BKIN, I3C1_SDA,
I2C4_SDA, SPI1_RDY,
OCTOSPI1_NCS,
- - 91 G12 110 J14 - - 91 G11 110 J15 - PG6 I/O FT_fh - -
UCPD1_FRSTX, FMC_NE3,
DS14258 Rev 1
DCMI_D12/PSSI_D12,
EVENTOUT
SAI1_CK2, I3C1_SCL,
I2C4_SCL, SAI1_MCLK_A,
USART6_CK, UCPD1_FRSTX,
- - 92 F9 111 H13 - - 92 G8 111 J14 - PG7 I/O FT_fh - -
FMC_INT,
DCMI_D13/PSSI_D13,
EVENTOUT
TIM8_ETR, SPI6_NSS,
TIM3_CH1, TIM8_CH1,
I2S2_MCK, SAI1_SCK_A,
USART6_TX, SDMMC1_D0DIR,
J3 63 96 F10 115 G14 37 63 96 F9 115 H15 40 PC6 I/O FT_h - -
FMC_NWAIT, SDMMC2_D6,
OCTOSPI1_IO5, SDMMC1_D6,
DCMI_D0/PSSI_D0, EVENTOUT
Table 14. STM32H562xx and STM32H563xx pin/ball definition (continued)
Additional functions
Alternate functions
UFBGA176+25 SMPS
I/O structure
UFBGA169 SMPS
WLCSP80 SMPS
LQFP100 SMPS
LQFP144 SMPS
LQFP176 SMPS
reset)(3)(4)
UFBGA176+25
Pin type
Notes
UFBGA169
VFQFPN68
LQFP100
LQFP144
LQFP176
LQFP64
TRGIO, TIM3_CH2, TIM8_CH2,
I2S3_MCK, USART6_RX,
SDMMC1_D123DIR, FMC_NE1,
K4 64 97 F11 116 G13 38 64 97 F10 116 G15 41 PC7 I/O FT_h - -
SDMMC2_D7, OCTOSPI1_IO6,
SDMMC1_D7,
DCMI_D1/PSSI_D1, EVENTOUT
TRACED1, TIM3_CH3,
DS14258 Rev 1
TIM8_CH3, USART6_CK,
UART5_RTS,
J5 65 98 E9 117 F14 39 65 98 G12 117 G14 42 PC8 I/O FT_h - -
FMC_NE2/FMC_NCE, FMC_INT,
FMC_ALE, SDMMC1_D0,
DCMI_D2/PSSI_D2, EVENTOUT
- - - - - - - - - - - G12 - VSS S - - - -
- - - - - - - - - - - G13 - VDD S - - - -
Additional functions
Alternate functions
UFBGA176+25 SMPS
I/O structure
UFBGA169 SMPS
WLCSP80 SMPS
LQFP100 SMPS
LQFP144 SMPS
LQFP176 SMPS
reset)(3)(4)
UFBGA176+25
Pin type
Notes
UFBGA169
VFQFPN68
LQFP100
LQFP144
LQFP176
LQFP64
TIM1_CH2, LPUART1_TX,
I2C3_SMBA,
SPI2_SCK/I2S2_CK,
H4 68 101 F13 120 E15 42 68 101 E11 120 E15 45 PA9 I/O FT_d - UCPD1_DB1
USART1_TX, ETH_MII_TX_ER,
FMC_NWE, DCMI_D0/PSSI_D0,
EVENTOUT
TIM1_CH3, LPUART1_RX,
DS14258 Rev 1
LPTIM2_IN2, UCPD1_FRSTX,
G5 69 102 E11 121 E14 43 69 102 E10 121 D15 46 PA10 I/O FT_h - USART1_RX, FDCAN2_TX, -
SDMMC1_D0,
DCMI_D1/PSSI_D1, EVENTOUT
TIM1_CH4, LPUART1_CTS,
SPI2_NSS/I2S2_WS,
UART4_RX,
E1 70 103 C13 122 D15 44 70 103 F13 122 C15 47 PA11 I/O FT_u - -
USART1_CTS/USART1_NSS,
FDCAN1_RX, USB_DM,
EVENTOUT
PA13(JTMS (6)
F4 72 105 D12 124 E13 46 72 105 E12 124 A15 49 I/O FT JTMS/SWDIO, EVENTOUT -
/SWDIO)
Additional functions
Alternate functions
UFBGA176+25 SMPS
I/O structure
UFBGA169 SMPS
WLCSP80 SMPS
LQFP100 SMPS
LQFP144 SMPS
LQFP176 SMPS
reset)(3)(4)
UFBGA176+25
Pin type
Notes
UFBGA169
VFQFPN68
LQFP100
LQFP144
LQFP176
LQFP64
LPTIM1_IN2, TIM8_CH1N,
UART8_TX, UART4_TX,
- - - C12 128 B15 - - - D12 128 E12 - PH13 I/O FT_h - -
FDCAN1_TX,
DCMI_D3/PSSI_D3, EVENTOUT
TIM8_CH2N, UART4_RX,
- - - D11 129 D13 - - - D10 129 E13 - PH14 I/O FT_h - FDCAN1_RX, -
DCMI_D4/PSSI_D4, EVENTOUT
DS14258 Rev 1
TIM8_CH3N,
- - - A13 130 C14 - - - D11 130 D13 - PH15 I/O FT_h - DCMI_D11/PSSI_D11, -
EVENTOUT
TIM5_CH4,
SPI2_NSS/I2S2_WS,
- - - B12 131 - - - - B13 131 E14 - PI0 I/O FT_h - -
DCMI_D13/PSSI_D13,
EVENTOUT
TIM8_BKIN2,
- - - C11 132 A15 - - - B12 132 D14 - PI1 I/O FT_h - SPI2_SCK/I2S2_CK, -
DCMI_D8/PSSI_D8, EVENTOUT
TIM8_CH4,
- - - D10 133 B14 - - - A13 133 C14 - PI2 I/O FT_h - SPI2_MISO/I2S2_SDI, -
DCMI_D9/PSSI_D9, EVENTOUT
TIM8_ETR,
SPI2_MOSI/I2S2_SDO,
- - - A12 134 A14 - - - C11 134 C13 - PI3 I/O FT_h - -
DCMI_D10/PSSI_D10,
EVENTOUT
Additional functions
Alternate functions
UFBGA176+25 SMPS
I/O structure
UFBGA169 SMPS
WLCSP80 SMPS
LQFP100 SMPS
LQFP144 SMPS
LQFP176 SMPS
reset)(3)(4)
UFBGA176+25
Pin type
Notes
UFBGA169
VFQFPN68
LQFP100
LQFP144
LQFP176
LQFP64
PA14(JTCK/ (6)
E3 76 109 C10 137 B13 49 76 109 A12 137 A14 52 I/O FT JTCK/SWCLK, EVENTOUT -
SWCLK)
UART7_TX, FMC_NBL1,
DCMI_D11/PSSI_D11,
TIM2_ETR, EVENTOUT
LPTIM3_ETR,
SPI3_SCK/I2S3_CK,
USART3_TX, UART4_TX,
C3 78 111 A10 139 D12 51 78 111 C10 139 B14 54 PC10 I/O FT_h - OCTOSPI1_IO1, -
ETH_MII_TXD0/ETH_RMII_TXD
0, SDMMC1_D2,
DCMI_D8/PSSI_D8, EVENTOUT
TRACED3, TIM15_CH1,
SPI6_SCK,
SPI3_MOSI/I2S3_SDO,
F6 80 113 D9 141 C11 53 80 113 B9 141 A12 56 PC12 I/O FT_h - -
USART3_CK, UART5_TX,
SDMMC1_CK,
DCMI_D9/PSSI_D9, EVENTOUT
Additional functions
Alternate functions
UFBGA176+25 SMPS
I/O structure
UFBGA169 SMPS
WLCSP80 SMPS
LQFP100 SMPS
LQFP144 SMPS
LQFP176 SMPS
reset)(3)(4)
UFBGA176+25
Pin type
Notes
UFBGA169
VFQFPN68
LQFP100
LQFP144
LQFP176
LQFP64
- - - A11 - D10 - - - - - - - VDD S - - - -
TIM8_CH4N, UART4_RX,
FDCAN1_RX, UART9_CTS,
A3 81 114 C9 142 B12 - 81 114 D9 142 B12 - PD0 I/O FT_h - -
FMC_D2/FMC_AD2,
EVENTOUT
UART4_TX, FDCAN1_TX,
DS14258 Rev 1
B4 82 115 B9 143 A13 - 82 115 E9 143 C12 - PD1 I/O FT_h - FMC_D3/FMC_AD3, -
EVENTOUT
TRACED2, TIM3_ETR,
TIM15_BKIN, UART5_RX,
A5 83 116 E8 144 C10 54 83 116 C9 144 D12 - PD2 I/O FT_h - SDMMC1_CMD, WKUP7
DCMI_D11/PSSI_D11,
LPTIM4_ETR, EVENTOUT
SPI2_SCK/I2S2_CK,
USART2_CTS/USART2_NSS,
- 84 117 C8 145 A12 - 84 117 A9 145 D11 - PD3 I/O FT_h - WKUP8
FMC_CLK, DCMI_D5/PSSI_D5,
EVENTOUT
USART2_RTS, OCTOSPI1_IO4,
- 85 118 D8 146 B11 - 85 118 F8 146 D10 - PD4 I/O FT_h - -
FMC_NOE, EVENTOUT
TIM1_CH4N, SPI2_RDY,
USART2_TX, FDCAN1_TX,
- 86 119 A7 147 A11 - 86 119 D8 147 C11 - PD5 I/O FT_h - -
OCTOSPI1_IO5, FMC_NWE,
EVENTOUT
Additional functions
Alternate functions
UFBGA176+25 SMPS
I/O structure
UFBGA169 SMPS
WLCSP80 SMPS
LQFP100 SMPS
LQFP144 SMPS
LQFP176 SMPS
reset)(3)(4)
UFBGA176+25
Pin type
Notes
UFBGA169
VFQFPN68
LQFP100
LQFP144
LQFP176
LQFP64
SAI1_D1,
SPI3_MOSI/I2S3_SDO,
SAI1_SD_A, USART2_RX,
- 87 122 F7 150 B10 - 87 122 E8 150 B11 - PD6 I/O FT_sh - OCTOSPI1_IO6, SDMMC2_CK, -
FMC_NWAIT,
DCMI_D10/PSSI_D10,
EVENTOUT
DS14258 Rev 1
SPI1_MOSI/I2S1_SDO,
USART2_CK, OCTOSPI1_IO7,
- 88 123 B7 151 A10 - 88 123 B8 151 A11 - PD7 I/O FT_sh - SDMMC2_CMD, -
FMC_NE1/FMC_NCE,
LPTIM4_OUT, EVENTOUT
- - - - - D6 - - - - - - - VSS S - - - -
SPI1_MISO/I2S1_SDI,
USART6_RX, OCTOSPI1_IO6,
SAI2_FS_B, SDMMC2_D0,
SPI1_NSS/I2S1_WS,
SAI2_SD_B, SDMMC2_D1,
- - 125 C7 153 A9 - - 125 A8 153 B10 - PG10 I/O FT_sh - -
FMC_NE3, DCMI_D2/PSSI_D2,
EVENTOUT
Table 14. STM32H562xx and STM32H563xx pin/ball definition (continued)
Additional functions
Alternate functions
UFBGA176+25 SMPS
I/O structure
UFBGA169 SMPS
WLCSP80 SMPS
LQFP100 SMPS
LQFP144 SMPS
LQFP176 SMPS
reset)(3)(4)
UFBGA176+25
Pin type
Notes
UFBGA169
VFQFPN68
LQFP100
LQFP144
LQFP176
LQFP64
LPTIM1_IN2,
SPI1_SCK/I2S1_CK,
USART10_RX, USART11_RTS,
- - - - 154 C9 - - 126 E7 154 B9 - PG11 I/O FT_sh - SDMMC2_D2, -
ETH_MII_TX_EN/ETH_RMII_TX
_EN, DCMI_D3/PSSI_D3,
EVENTOUT
DS14258 Rev 1
LPTIM1_IN1, PSSI_D15,
SPI6_MISO, USART10_TX,
USART6_RTS, SDMMC2_D3,
- - 126 D7 155 B8 - - 127 C8 155 B8 - PG12 I/O FT_sh - ETH_MII_TXD1/ETH_RMII_TXD -
1, FMC_NE4,
DCMI_D11/PSSI_D11,
LPTIM5_CH1, EVENTOUT
TRACED0, LPTIM1_CH1,
SPI6_SCK,
USART10_CTS/USART10_NSS,
USART6_CTS/USART6_NSS,
- - 127 - 156 C8 - - 128 D7 156 A8 - PG13 I/O FT_sh - -
SDMMC2_D6,
ETH_MII_TXD0/ETH_RMII_TXD
0, FMC_A24, LPTIM5_CH2,
EVENTOUT
TRACED1, LPTIM1_ETR,
LPTIM1_CH2, SPI6_MOSI,
USART10_RTS, USART6_TX,
- - 128 - 157 A8 - - 129 C7 157 A7 - PG14 I/O FT_sh - OCTOSPI1_IO7, SDMMC2_D7, -
ETH_MII_TXD1/ETH_RMII_TXD
1, FMC_A25, LPTIM5_IN1,
101/275
EVENTOUT
Additional functions
Alternate functions
UFBGA176+25 SMPS
I/O structure
UFBGA169 SMPS
WLCSP80 SMPS
LQFP100 SMPS
LQFP144 SMPS
LQFP176 SMPS
reset)(3)(4)
UFBGA176+25
Pin type
Notes
UFBGA169
VFQFPN68
LQFP100
LQFP144
LQFP176
LQFP64
- - 130 A3 159 - - - 131 - 159 C7 - VDD S - - - -
SPI4_RDY, USART10_CK,
USART6_CTS/USART6_NSS,
- - 131 B6 160 A7 - - 132 B6 160 B7 - PG15 I/O FT_h - FMC_NCAS, -
DCMI_D13/PSSI_D13,
EVENTOUT
DS14258 Rev 1
JTDO/TRACESWO, TIM2_CH2,
I2C2_SDA, SPI1_SCK/I2S1_CK,
PB3(JTDO/ SPI3_SCK/I2S3_CK,
C5 89 132 F6 161 B7 55 89 133 E6 161 A10 57 TRACESW I/O FT_fh - UART12_CTS/UART12_NSS, -
O) SPI6_SCK, SDMMC2_D2,
CRS_SYNC, UART7_RX,
LPTIM6_ETR, EVENTOUT
NJTRST, TIM16_BKIN,
TIM3_CH1, OCTOSPI1_CLK,
LPTIM1_CH2,
Additional functions
Alternate functions
UFBGA176+25 SMPS
I/O structure
UFBGA169 SMPS
WLCSP80 SMPS
LQFP100 SMPS
LQFP144 SMPS
LQFP176 SMPS
reset)(3)(4)
UFBGA176+25
Pin type
Notes
UFBGA169
VFQFPN68
LQFP100
LQFP144
LQFP176
LQFP64
TIM17_BKIN, TIM3_CH2,
OCTOSPI1_NCLK, I2C1_SMBA,
SPI1_MOSI/I2S1_SDO,
I2C4_SMBA,
D6 91 134 E6 163 A6 57 91 135 C6 163 A6 59 PB5 I/O FT_h - SPI3_MOSI/I2S3_SDO, -
SPI6_MOSI, FDCAN2_RX,
ETH_PPS_OUT, FMC_SDCKE1,
DS14258 Rev 1
DCMI_D10/PSSI_D10,
UART5_RX, EVENTOUT
TIM16_CH1N, TIM4_CH1,
I3C1_SCL, I2C1_SCL,
HDMI_CEC, I2C4_SCL,
USART1_TX, LPUART1_TX,
E7 92 135 C6 164 B6 58 92 136 A5 164 B6 60 PB6 I/O FT_f - -
FDCAN2_TX, OCTOSPI1_NCS,
FMC_SDNE1,
DCMI_D5/PSSI_D5, UART5_TX,
EVENTOUT
TIM17_CH1N, TIM4_CH2,
I3C1_SDA, I2C1_SDA,
I2C4_SDA, USART1_RX,
LPUART1_RX, FDCAN1_TX,
C7 93 136 D6 165 C6 59 93 137 D6 165 B5 61 PB7 I/O FT_fa - WKUP5
SDMMC2_D5, SDMMC2_CKIN,
FMC_NL,
DCMI_VSYNC/PSSI_RDY,
EVENTOUT
Additional functions
Alternate functions
UFBGA176+25 SMPS
I/O structure
UFBGA169 SMPS
WLCSP80 SMPS
LQFP100 SMPS
LQFP144 SMPS
LQFP176 SMPS
reset)(3)(4)
UFBGA176+25
Pin type
Notes
UFBGA169
VFQFPN68
LQFP100
LQFP144
LQFP176
LQFP64
TIM16_CH1, TIM4_CH3,
I3C1_SCL, I2C1_SCL,
SPI4_RDY, I2C4_SCL,
E9 95 138 F5 167 B5 61 95 139 E5 167 A5 63 PB8 I/O FT_fh - SDMMC1_CKIN, UART4_RX, -
FDCAN1_RX, SDMMC2_D4,
ETH_MII_TXD3, SDMMC1_D4,
DCMI_D6/PSSI_D6, EVENTOUT
DS14258 Rev 1
TIM17_CH1, TIM4_CH4,
I3C1_SDA, I2C1_SDA,
SPI2_NSS/I2S2_WS, I2C4_SDA,
- 96 139 E5 168 A4 - 96 140 A4 168 B4 64 PB9 I/O FT_fh - SDMMC1_CDIR, UART4_TX, -
FDCAN1_TX, SDMMC2_D5,
SDMMC2_CKIN, SDMMC1_D5,
DCMI_D7/PSSI_D7, EVENTOUT
LPTIM1_ETR, TIM4_ETR,
LPTIM2_CH2, LPTIM2_ETR,
SPI3_RDY, UART8_RX,
LPTIM1_IN2, UART8_TX,
- - 141 C5 170 B4 - - - D5 170 A3 - PE1 I/O FT_h - FDCAN1_TX, FMC_NBL1, -
DCMI_D3/PSSI_D3, EVENTOUT
Additional functions
Alternate functions
UFBGA176+25 SMPS
I/O structure
UFBGA169 SMPS
WLCSP80 SMPS
LQFP100 SMPS
LQFP144 SMPS
LQFP176 SMPS
reset)(3)(4)
UFBGA176+25
Pin type
Notes
UFBGA169
VFQFPN68
LQFP100
LQFP144
LQFP176
LQFP64
TIM8_BKIN, SPI2_RDY,
- - - C4 173 B3 - - - C4 173 D4 - PI4 I/O FT_h - SAI2_MCLK_A, -
DCMI_D5/PSSI_D5, EVENTOUT
TIM8_CH1, SAI2_SCK_A,
- - - B3 174 A2 - - - - 174 C4 - PI5 I/O FT_h - DCMI_VSYNC/PSSI_RDY, -
EVENTOUT
DS14258 Rev 1
TIM8_CH2, SAI2_SD_A,
- - - A2 175 C4 - - - C3 175 C3 - PI6 I/O FT_h - -
DCMI_D6/PSSI_D6, EVENTOUT
TIM8_CH3, SAI2_FS_A,
- - - A1 176 A1 - - - A2 176 C2 - PI7 I/O FT_h - -
DCMI_D7/PSSI_D7, EVENTOUT
- - - - - F6 - - - - - F6 - VSS S - - - -
- - - - - F7 - - - - - F7 - VSS S - - - -
- - - - - F8 - - - - - F8 - VSS S - - - -
- - - - - F9 - - - - - F9 - VSS S - - - -
- - - - - G6 - - - - - G6 - VSS S - - - -
- - - - - G7 - - - - - G7 - VSS S - - - -
- - - - - G8 - - - - - G8 - VSS S - - - -
- - - - - G9 - - - - - G9 - VSS S - - - -
- - - - - G10 - - - - - G10 - VSS S - - - -
- - - - - H6 - - - - - H6 - VSS S - - - -
105/275
- - - - - H7 - - - - - H7 - VSS S - - - -
- - - - - H8 - - - - - H8 - VSS S - - - -
Table 14. STM32H562xx and STM32H563xx pin/ball definition (continued)
106/275 Pin number(1)(2)
Additional functions
Alternate functions
UFBGA176+25 SMPS
I/O structure
UFBGA169 SMPS
WLCSP80 SMPS
LQFP100 SMPS
LQFP144 SMPS
LQFP176 SMPS
reset)(3)(4)
UFBGA176+25
Pin type
Notes
UFBGA169
VFQFPN68
LQFP100
LQFP144
LQFP176
LQFP64
- - - - - H9 - - - - - H9 - VSS S - - - -
- - - - - J6 - - - - - J6 - VSS S - - - -
- - - - - J7 - - - - - J7 - VSS S - - - -
- - - - - J8 - - - - - J8 - VSS S - - - -
DS14258 Rev 1
- - - - - J9 - - - - - J9 - VSS S - - - -
- - - - - K6 - - - - - K6 - VSS S - - - -
- - - - - K7 - - - - - K7 - VSS S - - - -
- - - - - K8 - - - - - K8 - VSS S - - - -
- - - - - K9 - - - - - K9 - VSS S - - - -
I2C4/OCTOSPI/ SDMMC1/SPI2/I
CEC/DCMI/I2C1/
Port LPTIM3/PDM_ I3C1/LPTIM2/3/LP CEC/I3C1/LPTIM1/SPI SAI1/SPI3/I2S3/ 2S2/SPI3/I2S3/S
LPTIM1/TIM1/2/1 2/3/4/LPTIM1/2/
SYS SAI1/TIM3/4/5/ UART1/OCTOSPI/ 1/I2S1/SPI2/I2S2/SPI3/ SPI4/UART4/12/ PI6/UART7/8/12/
6/17 SPI1/I2S1/TIM15
12/15 TIM1/8 I2S3/SPI4/5/6 USART10/USB_ USART1/2/3/6/1
/USART1
PD 0/11
USART2_CTS/U
PA0 - TIM2_CH1 TIM5_CH1 TIM8_ETR TIM15_BKIN SPI6_NSS SPI3_RDY
SART2_NSS
PA1 - TIM2_CH2 TIM5_CH2 - TIM15_CH1N LPTIM1_IN1 OCTOSPI1_DQS USART2_RTS
PA2 - TIM2_CH3 TIM5_CH3 - TIM15_CH1 LPTIM1_IN2 - USART2_TX
PA3 - TIM2_CH4 TIM5_CH4 OCTOSPI1_CLK TIM15_CH2 SPI2_NSS/I2S2_WS SAI1_SD_B USART2_RX
DS14258 Rev 1
SPI3_NSS/I2S3_
PA4 - - TIM5_ETR LPTIM2_CH1 - SPI1_NSS/I2S1_WS USART2_CK
WS
PA5 - TIM2_CH1 - TIM8_CH1N - SPI1_SCK/I2S1_CK - -
PA6 - TIM1_BKIN TIM3_CH1 TIM8_BKIN - SPI1_MISO/I2S1_SDI OCTOSPI1_IO3 USART11_TX
PA7 - TIM1_CH1N TIM3_CH2 TIM8_CH1N - SPI1_MOSI/I2S1_SDO - USART11_RX
Port A
I2C4/OCTOSPI/ SDMMC1/SPI2/I
CEC/DCMI/I2C1/
Port LPTIM3/PDM_ I3C1/LPTIM2/3/LP CEC/I3C1/LPTIM1/SPI SAI1/SPI3/I2S3/ 2S2/SPI3/I2S3/S
LPTIM1/TIM1/2/1 2/3/4/LPTIM1/2/
SYS SAI1/TIM3/4/5/ UART1/OCTOSPI/ 1/I2S1/SPI2/I2S2/SPI3/ SPI4/UART4/12/ PI6/UART7/8/12/
6/17 SPI1/I2S1/TIM15
12/15 TIM1/8 I2S3/SPI4/5/6 USART10/USB_ USART1/2/3/6/1
/USART1
PD 0/11
SPI3_MOSI/I2S3
PB5 - TIM17_BKIN TIM3_CH2 OCTOSPI1_NCLK I2C1_SMBA SPI1_MOSI/I2S1_SDO I2C4_SMBA
_SDO
PB6 - TIM16_CH1N TIM4_CH1 I3C1_SCL I2C1_SCL HDMI_CEC I2C4_SCL USART1_TX
Port B
I2C4/OCTOSPI/ SDMMC1/SPI2/I
CEC/DCMI/I2C1/
Port LPTIM3/PDM_ I3C1/LPTIM2/3/LP CEC/I3C1/LPTIM1/SPI SAI1/SPI3/I2S3/ 2S2/SPI3/I2S3/S
LPTIM1/TIM1/2/1 2/3/4/LPTIM1/2/
SYS SAI1/TIM3/4/5/ UART1/OCTOSPI/ 1/I2S1/SPI2/I2S2/SPI3/ SPI4/UART4/12/ PI6/UART7/8/12/
6/17 SPI1/I2S1/TIM15
12/15 TIM1/8 I2S3/SPI4/5/6 USART10/USB_ USART1/2/3/6/1
/USART1
PD 0/11
I2C4/OCTOSPI/ SDMMC1/SPI2/I
CEC/DCMI/I2C1/
Port LPTIM3/PDM_ I3C1/LPTIM2/3/LP CEC/I3C1/LPTIM1/SPI SAI1/SPI3/I2S3/ 2S2/SPI3/I2S3/S
LPTIM1/TIM1/2/1 2/3/4/LPTIM1/2/
SYS SAI1/TIM3/4/5/ UART1/OCTOSPI/ 1/I2S1/SPI2/I2S2/SPI3/ SPI4/UART4/12/ PI6/UART7/8/12/
6/17 SPI1/I2S1/TIM15
12/15 TIM1/8 I2S3/SPI4/5/6 USART10/USB_ USART1/2/3/6/1
/USART1
PD 0/11
PD0 - - - TIM8_CH4N - - - -
PD1 - - - - - - - -
PD2 TRACED2 - TIM3_ETR - TIM15_BKIN - - -
USART2_CTS/U
PD3 - - - - - SPI2_SCK/I2S2_CK -
SART2_NSS
PD4 - - - - - - - USART2_RTS
PD5 - TIM1_CH4N - - - SPI2_RDY - USART2_TX
DS14258 Rev 1
PD8 - - - - - - - USART3_TX
PD9 - - - - - - - USART3_RX
PD10 - - - LPTIM2_CH2 - - - USART3_CK
USART3_CTS/U
PD11 - - SAI1_CK1 LPTIM2_IN2 I2C4_SMBA - -
SART3_NSS
I2C4/OCTOSPI/ SDMMC1/SPI2/I
CEC/DCMI/I2C1/
Port LPTIM3/PDM_ I3C1/LPTIM2/3/LP CEC/I3C1/LPTIM1/SPI SAI1/SPI3/I2S3/ 2S2/SPI3/I2S3/S
LPTIM1/TIM1/2/1 2/3/4/LPTIM1/2/
SYS SAI1/TIM3/4/5/ UART1/OCTOSPI/ 1/I2S1/SPI2/I2S2/SPI3/ SPI4/UART4/12/ PI6/UART7/8/12/
6/17 SPI1/I2S1/TIM15
12/15 TIM1/8 I2S3/SPI4/5/6 USART10/USB_ USART1/2/3/6/1
/USART1
PD 0/11
UART12_CTS/U
PE8 - TIM1_CH1N - - - - UART7_TX
ART12_NSS
PE9 - TIM1_CH1 - - - - UART12_RX UART7_RTS
PE10 - TIM1_CH2N - - - - UART12_TX UART7_CTS
PE11 - TIM1_CH2 - - SPI1_RDY SPI4_NSS OCTOSPI1_NCS -
PE12 - TIM1_CH3N - - - SPI4_SCK - -
PE13 - TIM1_CH3 - - - SPI4_MISO - -
PE14 - TIM1_CH4 - - - SPI4_MOSI - -
PE15 - TIM1_BKIN - TIM1_CH4N - - - USART10_CK
111/275
Table 15. Alternate function AF0 to AF7(1)
112/275 AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7
I2C4/OCTOSPI/ SDMMC1/SPI2/I
CEC/DCMI/I2C1/
Port LPTIM3/PDM_ I3C1/LPTIM2/3/LP CEC/I3C1/LPTIM1/SPI SAI1/SPI3/I2S3/ 2S2/SPI3/I2S3/S
LPTIM1/TIM1/2/1 2/3/4/LPTIM1/2/
SYS SAI1/TIM3/4/5/ UART1/OCTOSPI/ 1/I2S1/SPI2/I2S2/SPI3/ SPI4/UART4/12/ PI6/UART7/8/12/
6/17 SPI1/I2S1/TIM15
12/15 TIM1/8 I2S3/SPI4/5/6 USART10/USB_ USART1/2/3/6/1
/USART1
PD 0/11
PF0 - - - - I2C2_SDA - - -
PF1 - - - - I2C2_SCL - - -
PF2 - - LPTIM3_CH2 LPTIM3_IN2 I2C2_SMBA - UART12_TX USART11_CK
PF3 - - LPTIM3_IN1 - - - - USART11_TX
PF4 - - LPTIM3_ETR - - - - USART11_RX
USART11_CTS/
PF5 - - LPTIM3_CH1 - I2C4_SCL I3C1_SCL UART12_RX
USART11_NSS
DS14258 Rev 1
I2C4/OCTOSPI/ SDMMC1/SPI2/I
CEC/DCMI/I2C1/
Port LPTIM3/PDM_ I3C1/LPTIM2/3/LP CEC/I3C1/LPTIM1/SPI SAI1/SPI3/I2S3/ 2S2/SPI3/I2S3/S
LPTIM1/TIM1/2/1 2/3/4/LPTIM1/2/
SYS SAI1/TIM3/4/5/ UART1/OCTOSPI/ 1/I2S1/SPI2/I2S2/SPI3/ SPI4/UART4/12/ PI6/UART7/8/12/
6/17 SPI1/I2S1/TIM15
12/15 TIM1/8 I2S3/SPI4/5/6 USART10/USB_ USART1/2/3/6/1
/USART1
PD 0/11
PG0 - - - - - - - -
SPI2_MOSI/I2S2
PG1 - - - - - - -
_SDO
PG2 - - - TIM8_BKIN - - - UART12_RX
PG3 - - - TIM8_BKIN2 - - - UART12_TX
PG4 - TIM1_BKIN2 - - - - - -
PG5 - TIM1_ETR - - - - - -
DS14258 Rev 1
I2C4/OCTOSPI/ SDMMC1/SPI2/I
CEC/DCMI/I2C1/
Port LPTIM3/PDM_ I3C1/LPTIM2/3/LP CEC/I3C1/LPTIM1/SPI SAI1/SPI3/I2S3/ 2S2/SPI3/I2S3/S
LPTIM1/TIM1/2/1 2/3/4/LPTIM1/2/
SYS SAI1/TIM3/4/5/ UART1/OCTOSPI/ 1/I2S1/SPI2/I2S2/SPI3/ SPI4/UART4/12/ PI6/UART7/8/12/
6/17 SPI1/I2S1/TIM15
12/15 TIM1/8 I2S3/SPI4/5/6 USART10/USB_ USART1/2/3/6/1
/USART1
PD 0/11
PH0 - - - - - - - -
PH1 - - - - - - - -
PH2 - LPTIM1_IN2 - - - - - -
PH3 - - - - - - - -
PH4 - - - - I2C2_SCL SPI5_RDY - SPI6_RDY
PH5 - - - - I2C2_SDA SPI5_NSS - SPI6_RDY
PH6 - TIM1_CH3N TIM12_CH1 TIM8_CH1 I2C2_SMBA SPI5_SCK - -
DS14258 Rev 1
I2C4/OCTOSPI/ SDMMC1/SPI2/I
CEC/DCMI/I2C1/
Port LPTIM3/PDM_ I3C1/LPTIM2/3/LP CEC/I3C1/LPTIM1/SPI SAI1/SPI3/I2S3/ 2S2/SPI3/I2S3/S
LPTIM1/TIM1/2/1 2/3/4/LPTIM1/2/
SYS SAI1/TIM3/4/5/ UART1/OCTOSPI/ 1/I2S1/SPI2/I2S2/SPI3/ SPI4/UART4/12/ PI6/UART7/8/12/
6/17 SPI1/I2S1/TIM15
12/15 TIM1/8 I2S3/SPI4/5/6 USART10/USB_ USART1/2/3/6/1
/USART1
PD 0/11
PI6 - - - TIM8_CH2 - - - -
DS14258 Rev 1
PI7 - - - TIM8_CH3 - - - -
PI8 - - - - - - - -
PI9 - - - - - - - -
PI10 - - - - - - - -
PI11 - - - - - - - -
1. Refer to the next table for AF8 to AF15.
115/275
Table 16. Alternate function AF8 to AF15(1)
116/275 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15
FDCAN1/2/FMC[
NAND16)/FMC[ CRS/FMC[NAN ETH[MII/RMII)/FM FMC[NAND16)/FMC
Port LPUART1/SAI2 DCMI/FMC[NAND16)/
NORmux)/FMC[ D16)/OCTOSPI/ C[NAND16)/OCT [NORmux)/FMC[NO LPTIM3/4/5/6/T
/SDMMC1/SPI6 FMC[NORmux)/FMC[ SYS
NOR_RAM)/OC SAI2/SDMMC2/T OSPI/SDMMC2/U R_RAM)/FMC[SDRA IM2/UART5
/UART4/5/8 NOR_RAM)/LPTIM5
TOSPI/SDMMC2 IM8/USB_ ART7/9/USB_PD M_16bit)/SDMMC1
/TIM13/14
ETH_MII_RX_DV/
PA7 SPI6_MOSI TIM14_CH1 OCTOSPI1_IO2 ETH_RMII_CRS_ FMC_SDNWE FMC_NWE - EVENTOUT
DV
FDCAN1/2/FMC[
NAND16)/FMC[ CRS/FMC[NAN ETH[MII/RMII)/FM FMC[NAND16)/FMC
Port LPUART1/SAI2 DCMI/FMC[NAND16)/
NORmux)/FMC[ D16)/OCTOSPI/ C[NAND16)/OCT [NORmux)/FMC[NO LPTIM3/4/5/6/T
/SDMMC1/SPI6 FMC[NORmux)/FMC[ SYS
NOR_RAM)/OC SAI2/SDMMC2/T OSPI/SDMMC2/U R_RAM)/FMC[SDRA IM2/UART5
/UART4/5/8 NOR_RAM)/LPTIM5
TOSPI/SDMMC2 IM8/USB_ ART7/9/USB_PD M_16bit)/SDMMC1
/TIM13/14
FDCAN1/2/FMC[
NAND16)/FMC[ CRS/FMC[NAN ETH[MII/RMII)/FM FMC[NAND16)/FMC
Port LPUART1/SAI2 DCMI/FMC[NAND16)/
NORmux)/FMC[ D16)/OCTOSPI/ C[NAND16)/OCT [NORmux)/FMC[NO LPTIM3/4/5/6/T
/SDMMC1/SPI6 FMC[NORmux)/FMC[ SYS
NOR_RAM)/OC SAI2/SDMMC2/T OSPI/SDMMC2/U R_RAM)/FMC[SDRA IM2/UART5
/UART4/5/8 NOR_RAM)/LPTIM5
TOSPI/SDMMC2 IM8/USB_ ART7/9/USB_PD M_16bit)/SDMMC1
/TIM13/14
OCTOSPI1_DQ ETH_MII_RXD1/E
PC5 - - FMC_SDCKE0 - - EVENTOUT
S TH_RMII_RXD1
SDMMC1_D0D
PC6 FMC_NWAIT SDMMC2_D6 OCTOSPI1_IO5 SDMMC1_D6 DCMI_D0/PSSI_D0 - EVENTOUT
IR
SDMMC1_D12
Port C
FDCAN1/2/FMC[
NAND16)/FMC[ CRS/FMC[NAN ETH[MII/RMII)/FM FMC[NAND16)/FMC
Port LPUART1/SAI2 DCMI/FMC[NAND16)/
NORmux)/FMC[ D16)/OCTOSPI/ C[NAND16)/OCT [NORmux)/FMC[NO LPTIM3/4/5/6/T
/SDMMC1/SPI6 FMC[NORmux)/FMC[ SYS
NOR_RAM)/OC SAI2/SDMMC2/T OSPI/SDMMC2/U R_RAM)/FMC[SDRA IM2/UART5
/UART4/5/8 NOR_RAM)/LPTIM5
TOSPI/SDMMC2 IM8/USB_ ART7/9/USB_PD M_16bit)/SDMMC1
/TIM13/14
FMC_D13/FMC_AD1
PD8 - - - - - - EVENTOUT
3
FMC_D14/FMC_AD1
PD9 - FDCAN2_RX - - - - EVENTOUT
4
FMC_D15/FMC_AD1
PD10 - - - - - - EVENTOUT
5
PD11 UART4_RX OCTOSPI1_IO0 SAI2_SD_A - FMC_A16/FMC_CLE - - EVENTOUT
PD12 UART4_TX OCTOSPI1_IO1 SAI2_FS_A - FMC_A17/FMC_ALE DCMI_D12/PSSI_D12 - EVENTOUT
PD13 - OCTOSPI1_IO3 SAI2_SCK_A UART9_RTS FMC_A18 DCMI_D13/PSSI_D13 LPTIM4_IN1 EVENTOUT
PD14 UART8_CTS - - UART9_RX FMC_D0/FMC_AD0 - - EVENTOUT
PD15 UART8_RTS - - UART9_TX FMC_D1/FMC_AD1 - - EVENTOUT
119/275
Table 16. Alternate function AF8 to AF15(1) (continued)
120/275 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15
FDCAN1/2/FMC[
NAND16)/FMC[ CRS/FMC[NAN ETH[MII/RMII)/FM FMC[NAND16)/FMC
Port LPUART1/SAI2 DCMI/FMC[NAND16)/
NORmux)/FMC[ D16)/OCTOSPI/ C[NAND16)/OCT [NORmux)/FMC[NO LPTIM3/4/5/6/T
/SDMMC1/SPI6 FMC[NORmux)/FMC[ SYS
NOR_RAM)/OC SAI2/SDMMC2/T OSPI/SDMMC2/U R_RAM)/FMC[SDRA IM2/UART5
/UART4/5/8 NOR_RAM)/LPTIM5
TOSPI/SDMMC2 IM8/USB_ ART7/9/USB_PD M_16bit)/SDMMC1
/TIM13/14
FDCAN1/2/FMC[
NAND16)/FMC[ CRS/FMC[NAN ETH[MII/RMII)/FM FMC[NAND16)/FMC
Port LPUART1/SAI2 DCMI/FMC[NAND16)/
NORmux)/FMC[ D16)/OCTOSPI/ C[NAND16)/OCT [NORmux)/FMC[NO LPTIM3/4/5/6/T
/SDMMC1/SPI6 FMC[NORmux)/FMC[ SYS
NOR_RAM)/OC SAI2/SDMMC2/T OSPI/SDMMC2/U R_RAM)/FMC[SDRA IM2/UART5
/UART4/5/8 NOR_RAM)/LPTIM5
TOSPI/SDMMC2 IM8/USB_ ART7/9/USB_PD M_16bit)/SDMMC1
/TIM13/14
FDCAN1/2/FMC[
NAND16)/FMC[ CRS/FMC[NAN ETH[MII/RMII)/FM FMC[NAND16)/FMC
Port LPUART1/SAI2 DCMI/FMC[NAND16)/
NORmux)/FMC[ D16)/OCTOSPI/ C[NAND16)/OCT [NORmux)/FMC[NO LPTIM3/4/5/6/T
/SDMMC1/SPI6 FMC[NORmux)/FMC[ SYS
NOR_RAM)/OC SAI2/SDMMC2/T OSPI/SDMMC2/U R_RAM)/FMC[SDRA IM2/UART5
/UART4/5/8 NOR_RAM)/LPTIM5
TOSPI/SDMMC2 IM8/USB_ ART7/9/USB_PD M_16bit)/SDMMC1
/TIM13/14
FMC_NE2/FMC_NC DCMI_VSYNC/PSSI_
PG9 - OCTOSPI1_IO6 SAI2_FS_B SDMMC2_D0 - EVENTOUT
E RDY
PG10 - - SAI2_SD_B SDMMC2_D1 FMC_NE3 DCMI_D2/PSSI_D2 - EVENTOUT
ETH_MII_TX_EN/
FDCAN1/2/FMC[
NAND16)/FMC[ CRS/FMC[NAN ETH[MII/RMII)/FM FMC[NAND16)/FMC
Port LPUART1/SAI2 DCMI/FMC[NAND16)/
NORmux)/FMC[ D16)/OCTOSPI/ C[NAND16)/OCT [NORmux)/FMC[NO LPTIM3/4/5/6/T
/SDMMC1/SPI6 FMC[NORmux)/FMC[ SYS
NOR_RAM)/OC SAI2/SDMMC2/T OSPI/SDMMC2/U R_RAM)/FMC[SDRA IM2/UART5
/UART4/5/8 NOR_RAM)/LPTIM5
TOSPI/SDMMC2 IM8/USB_ ART7/9/USB_PD M_16bit)/SDMMC1
/TIM13/14
PH0 - - - - - - - EVENTOUT
PH1 - - - - - - - EVENTOUT
PH2 - OCTOSPI1_IO4 SAI2_SCK_B ETH_MII_CRS FMC_SDCKE0 - - EVENTOUT
PH3 - OCTOSPI1_IO5 SAI2_MCLK_B ETH_MII_COL FMC_SDNE0 - - EVENTOUT
PH4 - - - - - PSSI_D14 - EVENTOUT
PH5 - - - - FMC_SDNWE - - EVENTOUT
DS14258 Rev 1
DCMI_HSYNC/PSSI_
PH8 - - - - - - EVENTOUT
DE
PH9 - - - - - DCMI_D0/PSSI_D0 - EVENTOUT
PH10 - - - - - DCMI_D1/PSSI_D1 - EVENTOUT
PH11 - - - - - DCMI_D2/PSSI_D2 - EVENTOUT
PH12 - - TIM8_CH4N - - DCMI_D3/PSSI_D3 - EVENTOUT
PH13 UART4_TX FDCAN1_TX - - - DCMI_D3/PSSI_D3 - EVENTOUT
PH14 UART4_RX FDCAN1_RX - - - DCMI_D4/PSSI_D4 - EVENTOUT
PH15 - - - - - DCMI_D11/PSSI_D11 - EVENTOUT
123/275
Table 16. Alternate function AF8 to AF15(1) (continued)
124/275 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15
FDCAN1/2/FMC[
NAND16)/FMC[ CRS/FMC[NAN ETH[MII/RMII)/FM FMC[NAND16)/FMC
Port LPUART1/SAI2 DCMI/FMC[NAND16)/
NORmux)/FMC[ D16)/OCTOSPI/ C[NAND16)/OCT [NORmux)/FMC[NO LPTIM3/4/5/6/T
/SDMMC1/SPI6 FMC[NORmux)/FMC[ SYS
NOR_RAM)/OC SAI2/SDMMC2/T OSPI/SDMMC2/U R_RAM)/FMC[SDRA IM2/UART5
/UART4/5/8 NOR_RAM)/LPTIM5
TOSPI/SDMMC2 IM8/USB_ ART7/9/USB_PD M_16bit)/SDMMC1
/TIM13/14
Port I
RDY
PI6 - - SAI2_SD_A - - DCMI_D6/PSSI_D6 - EVENTOUT
PI7 - - SAI2_FS_A - - DCMI_D7/PSSI_D7 - EVENTOUT
PI8 - - - - - - - EVENTOUT
PI9 UART4_RX FDCAN1_RX - - - - - EVENTOUT
PI10 - FDCAN1_RX - ETH_MII_RX_ER - PSSI_D14 - EVENTOUT
PI11 - - - - - PSSI_D15 - EVENTOUT
5 Electrical characteristics
Figure 18. Pin loading conditions Figure 19. Pin input voltage
C = 50 pF VIN
MS19210V MS19211V
ȝ)
100 nF VDDIO2
IOs
BKUP
IOs
VDD
Two different possible use cases
VDDUSB VDDUSB
VDDA VDDA
Analog domain
ȝ) 100 nF
VREF+
VREF+ 100 nF VREF-
ȝ)
VSSA
Three different possible use cases ȝ) Defines different use case options
Internal VREFBUF
enabled Define power domaines
MSv71967V3
STM32H5
LDO packages
VDDSMPS
SMPS
VLXSMPS Switched Mode
Power Supply
step down
VSSSMPS converter
VCAP1/2
[ȝ) 100 nF
Core domain
LDO enabled LDO disabled LDO
Voltage
VDDLDO
regulator
VDDIO2 VDDIO2
ȝ) 100 nF
VDDIO2
IOs
BKUP
IOs
VDD
Two different possible use cases
VDDUSB VDDUSB
ȝ) 100 nF
USB FS
IOs
VDDA VDDA
ȝ) 100 nF
VREF+ Analog domain
100 nF
VREF+ VREF-
ȝ) VSSA
ȝ)
Three different possible use cases
Defines different use case options
Internal VREFBUF
enabled
Define power domaines
MSv71966V3
Note: Refer to “Getting started with STM32H5 Series hardware development” (AN5711) for more
details.
Caution: Each power supply pair must be decoupled with filtering ceramic capacitors as shown
above. These capacitors must be placed as close as possible to, or below, the appropriate
pins on the underside of the PCB to ensure the good functionality of the device.It is not
recommended to remove filtering capacitors to reduce PCB size or cost. This might cause
incorrect operation of the device.
∑IVDD Total current into sum of all VDD power lines (source)(1) 350
∑IVSS Total current out of sum of all VSS ground lines (sink)(1) 350
IVDD Maximum current into each VDD power pin (source)(1) 100
IVSS Maximum current out of each VSS ground pin (sink)(1) 100
IIO(PIN) Output current sourced by any I/O and control pin 20 mA
(2)
Total output current sunk by sum of all I/Os and control pins 140
∑IIO(PIN)
(2)
Total output current sourced by sum of all I/Os and control pins 140
IINJ(PIN)(3)(4) Injected current on FT_xxx, TT_xx, NRST pins -5 / 0
∑|IINJ(PIN)| Total injected current (sum of all I/Os and control pins)(5) ±25
1. All main power (VDD, VDDA, VDDIO2, and VBAT) and ground (VSS, VSSA) pins must always be connected to
the external power supplies, in the permitted range.
2. This current consumption must be correctly distributed over all I/Os and control pins. The total output
current must not be sunk/sourced between two consecutive power supply pins referring to high pin count
LQFP packages.
3. Positive injection (when VIN > VDDIOx) is not possible on these I/Os and does not occur for input voltages
lower than the specified maximum value.
4. A negative injection is induced by VIN < VSS. IINJ(PIN) must never be exceeded. Refer also to Table 17:
Voltage characteristics for the minimum allowed input voltage values.
5. When several inputs are submitted to a current injection, the maximum ∑|IINJ(PIN)| is the absolute sum of
the negative injected currents (instantaneous values).
SVOS3 - 1.0 -
Stop mode SVOS4 - 0.9 - V
SVOS5 - 0.74 -
(5)
VOS0 - - 250
VOS1 - - 200
fHCLK AHB clock frequency MHz
VOS2 - - 150
VOS3 - - 100
VOS0(5) - - 250
- HDMI_CEC 4 4 4 4
ffdcan_ker_ck FDCAN 250 200 150 100
fI2C_ker_ck I2C[1:4] 250 200 150 100
fI3C_ker_ck I3C 250 200 150 100
flptim_ker_ck LPTIM[1:6] 250 200 150 100
TIM[1:8] TIM[12:17] 250 200 150 100
ftim_ker_ck
TIM6/17 64 64 64 64
MHz
frng_clk RNG 50 50 50 50
fsai_a_ker_ck
SAI1/2 250 200 150 100
fsai_b_ker_ck
SPI(I2S)1,2,3 125 100 75 50
fspi_ker_ck
SPI 4,5,6 125 100 75 50
flpuart_ker_ck LPUART1 250 200 150 100
fusart_ker_ck USART/UART 250 200 150 100
fusb_ker_ck USB2FS 50 50 50 50
fadc_ker_ck ADC/DAC 125 100 75 50
fdac_pclk DAC 250 200 150 100
fusb_ker_ck USBPD 64 64 64 64
frtc_ker_ck RTC 1 1 1 1
- DCMI 250 200 150 100
1. Specified by design - Not tested in production.
2. The maximum kernel clock frequencies can be limited by the maximum peripheral clock frequency
(refer to each peripheral electrical characteristics).
ESR
R Leak
MS19044V2
The SMPS current consumption can be determined using the following formula based on
the maximum LDO current consumption provided in Section 5.3.7: Supply current
characteristics:
IDDSMPS=IDDLDO×(VCORE÷(VDD×efficency))
Where: IDDLDO is the current in LDO configuration given in the following tables, VCORE is
the digital core supply (VCAP), and efficiency is defined in the following curves.
Figure 23. SMPS efficiency versus load current in run, sleep and stop mode
with SVOS3 mode, TJ = 30 °C
Efficiency (%)
100
90
50
40
30
Current (mA)
1 10 100 1000
MSv71968V1
Figure 24. SMPS efficiency versus load current in Run, Sleep and Stop mode
with SVOS3 mode, TJ = 130 °C
Efficiency (%)
100
90
40
30 Current (mA)
1 10 100 1000 MSv71969V1
Figure 25. SMPS efficiency versus load current in stop SVOV4, SVOS5, TJ = 30 °C
Figure 26. SMPS efficiency versus load current in stop SVOV4, SVOS5, TJ = 130 °C
Table 25. Embedded reset and power control block characteristics(1) (continued)
Symbol Parameter Conditions Min Typ Max Unit
VREFINT(1) Internal reference voltage -40 °C < TJ < +130 °C 1.180 1.216 1.255 V
ADC sampling time when reading the
tS_vrefint(2)(3) - 4.3 - -
internal reference voltage
VBAT sampling time when reading the
tS_vbat 9 - - µs
internal VBAT voltage
Start time of reference voltage buffer
tstart_vrefint(3) - - - 4.4
when the ADC is enabled
Irefbuf(3) Reference buffer consumption for ADC VDD = 3.3 V 9 13.5 23 µA
Internal reference voltage spread
∆VREFINT(3) -40°C < TJ < +130 °C - 5 15 mV
over the temperature range
Average temperature
TCoeff Average temperature coefficient - 20 70 ppm/°C
coefficient
VDDcoeff Average voltage coefficient 3.0 V < VDD < 3.6 V - 10 1370 ppm/V
VREFINT_CAL Raw data acquired at temperature of 30 °C, VDDA = 3.3 V 0x08FF F810 - 0x08FF F811
Table 28. Typical and maximum current consumption in run mode, code with data processing
running from flash memory, 2-ways instruction cache ON, PREFETCH ON
Parameter Max(1)(2)
Symbol
Table 29. Typical and maximum current consumption in run mode, code with data processing
running from flash memory, 1-way instruction cache ON, PREFETCH ON
Parameter Max(1)(2)
Symbol
Table 30. Typical and maximum current consumption in run mode, code with data processing
running from SRAM with cache 1-WAY
Max(1)(2)
Parameter
Symbol
Table 31. Typical and maximum current consumption in run mode, code with data processing
running from SRAM with cache 2-WAY
Parameter Max(1)(2)
Symbol
Table 33. Typical consumption in run mode with SecureMark running from
flash memory and SRAM(1)
Parameter
Conditions
Symbol
Max(1) (2)
Parameter
Symbol
Typ Typ
Conditions Unit
LDO SMPS TJ = TJ = TJ = TJ =
25°C 85°C 105°C 130°C
vv
Unit
RTC
Backup TJ = TJ = TJ = TJ =
and 1.8 V 2.4 V 3V 3.3 V
RAM 25 (°C) 85 (°C) 105 (°C) 130 (°C)
LSE(2)
Supply OFF OFF 2.58 2.78 3.01 3.19 4.3 8.8 16.5 42.6
current in ON OFF 3.79 4.05 4.38 4.63 6 17 30 75
IDD
standby μA
(standby) mode, OFF ON 2.91 3.15 3.47 3.67 - - - -
IWDG OFF ON ON 4.16 4.46 4.85 5.12 - - - -
1. Evaluated by characterization - Not tested in production.
2. LSE is in medium-low drive mode.
Parameter
Symbol
Unit
RTC
Backup TJ = TJ = TJ = TJ =
and 1.62 2 3 3.3
RAM 25 85 105 130
LSE(2)
OFF OFF 0.01 0.01 0.02 0.02 0.2 2.0 4.9 14.9
I SW = V DDx × f SW × C L
where
ISW is the current sunk by a switching I/O to charge/discharge the capacitive load
VDDx is the MCU supply voltage
fSW is the I/O switching frequency
CL is the total capacitance seen by the I/O pin: C = CINT+ CEXT + CS
The test pin is configured in push-pull output mode and is toggled by software at a fixed
frequency.
Wakeup time from SVOS5, HSI 64MHz, flash memory in low-power mode 31.4 36.8
tWUSTOP
stop mode SVOS3, CSI 4MHz, flash memory in normal mode 25.5 31.0 µs
SVOS3, CSI 4MHz, flash memory in low power mode 27.7 34.2
SVOS4, CSI 4MHz, flash memory in normal mode 35.3 40.8
SVOS4, CSI 4 MHz, flash memory in low-power mode 37.5 44.0
SVOS5, CSI 4 MHz, flash memory in low-power mode 51.2 58.9
Wakeup time from
tWUSTBY VCAP capacitors discharged 506.0 653.6
standby mode
1. Evaluated by characterization - Not tested in production.
Analog low-swing
Visw(HSEH)
OSC_IN peak-to- 0.2 - 2/3 VDD V
(VHSEH -VHSEH)(3) External analog low
peak amplitude
swing clock
Analog low-swing
DuCyHSE 45 50 55 %
OSC_IN duty cycle
Analog low-swing
External analog low
tr(HSE)/tf(HSE) OSC_IN rise and fall 0.05 / fHSE_ext - 0.3 / fHSE_ext ns
swing clock, 10% to 90%
times
1. Specified by design - Not tested in production.
2. The rise and fall times for a digital input signal are not specified. However the VHSEH and VHSEL conditions must be
fulfilled.
3. The DC component of the signal must ensure that the signal peaks are located between VDD and VSS.
VHSEH
90 %
10 %
VHSEL
tr(HSE) tf(HSE) tW(HSE) tW(HSE) t
THSE
External fHSE_ext
IL
clock source OSC_IN
STM32
ai17528b
Note: For information on selecting the crystal, refer to the application note AN2867 “Oscillator
design guide for ST microcontrollers” available from the ST website www.st.com.
VLSEH
90%
10%
VLSEL
tr(LSE) tf(LSE) tW(LSE) tW(LSE) t
TLSE
External fLSE_ext
OSC32_IN IL
clock source
STM32
ai17529b
For CL1 and CL2, it is recommended to use high-quality external ceramic capacitors in the
5 pF to 20 pF range (typ.), designed for high-frequency applications, and selected to match
the requirements of the crystal or resonator (see Figure 29). CL1 and CL2 are usually the
same size. The crystal manufacturer typically specifies a load capacitance which is the
series combination of CL1 and CL2. PCB and MCU pin capacitance must be included (10 pF
can be used as a rough estimate of the combined pin and board capacitance) when sizing
CL1 and CL2.
Note: For information on selecting the crystal, refer to the application note AN2867 “Oscillator
design guide for ST microcontrollers” available from the ST website www.st.com.
Resonator with
integrated capacitors
CL1
OSC_IN fHSE
Bias
8 MHz RF controlled
resonator
gain
Note: For information on selecting the crystal, refer to the application note AN2867 “Oscillator
design guide for ST microcontrollers” available from the ST website www.st.com.
Bias
32.768 kHz
RF controlled
resonator
gain
OSC32_OUT
STM32
CL2
ai17531c
Note: An external resistor is not required between OSC32_IN and OSC32_OUT and it is forbidden
to add one.
2. Data is evaluated with a write of 50% of the programmed bits equals to '0' .
Endurance
NPEND TJ = -40 to +130 °C 10 kcycles
program memory
Endurance
NDEND TJ = -40 to +130 °C 100 kcycles
data memory
Program memory,
1 kcycle at TA = 125 °C 10
Data retention
tPRET Years
- 1 kcycles at TA = 85 °C 30
- 10 kcycles at TA = 55 °C 30
Data retention for
100 kcycle at TA = 125 °C 1
data memory
tDRET Years
- 100 kcycles at TA = 85 °C 10
- 100 kcycles at TA = 55 °C 10
1. Evaluated by characterization - Not tested in production, unless otherwise specified.
Prequalification trials
Most of the common failures (unexpected reset and program counter corruption) can be
reproduced by manually forcing a low state on the NRST pin or the Oscillator pins for 1
second.
To complete these trials, ESD stress can be applied directly on the device, over the range of
specification values. When unexpected behavior is detected, the software can be hardened
to prevent unrecoverable errors occurring (see application note AN1015 “Software
techniques for improving microcontrollers EMC performance”).
0.1 to 30 MHz 8
30 to 130 MHz 0
Peak VDD = 3.6 V, TA = 25 °C, LQFP144 package, dBµV
SEMI 130 MHz to 1 GHz 24
level(1) conforming to IEC61967-2
1 GHz to 2 GHz 19
EMI level 4 -
1. Refer to the EMI radiated test chapter of application note AN1709 “EMC design guide for STM8, STM32 and Legacy
MCUs” available from the ST website www.st.com.
Packages with
Electrostatic discharge 1C 1000(2)
TA = 25 °C conforming to SMPS
VESD(HBM) voltage (human body
ANSI/ESDA/JEDEC JS-001 Packages
model) 2 2000
without SMPS
All LQFP V
Electrostatic discharge packages and C1 250
TA = +25 °C conforming to WLCSP
VESD(CDM) voltage (charge device
ANSI/ESDA/JEDEC JS-002
model) All BGA
C2a 500
packages
1. Evaluated by characterization - not tested in production.
2. The electrostatic discharge is 2000 V for all pins, except VFBSMPS, for which the test fails at 2000 V and passes at 1600 V.
Static latchup
Two complementary static tests are required on six parts to assess the latchup
performance:
• A supply overvoltage is applied to each power supply pin
• A current injection is applied to each input, output and configurable I/O pin
These tests are compliant with JESD78 IC latchup standard.
All I/Os are CMOS and TTL compliant (no software configuration required). Their
characteristics cover more than the strict CMOS-technology or TTL parameters. The
coverage of these requirements for FT I/Os is shown in Figure 31.
Table 58. Output voltage characteristics for all I/Os except PC13, PC14, PC15, and PI8
Symbol Parameter Conditions(1) Min Max Unit
CMOS port(2)
VOL Output low level voltage IIO = 8 mA - 0.4
2.7 V≤ VDD ≤3.6 V
CMOS port(2)
VOH Output high level voltage IIO = -8 mA VDD−0.4 -
2.7 V≤ VDD ≤3.6 V
TTL port(2)
VOL(3) Output low level voltage IIO = 8 mA - 0.4
2.7 V≤ VDD ≤ 3.6 V
TTL port(2)
VOH (3) Output high level voltage IIO = -8 mA 2.4 -
2.7 V≤ VDD ≤ 3.6 V
IIO = 20 mA
VOL(3) Output low level voltage - 1.3
2.7 V≤ VDD ≤ 3.6 V
IIO = -20 mA
VOH(3) Output high level voltage VDD - 1.3 - V
2.7 V≤ VDD ≤ 3.6 V
IIO = 4 mA
VOL(3) Output low level voltage - 0.4
1.71 V≤ VDD ≤ 3.6 V
IIO = -4 mA
VOH (3) Output high level voltage VDD - 0.4 -
1.71 V≤VDD <3.6 V
IIO = 2 mA
VOL(3) Output low level voltage - 0.3 x VDDIO2
1.08 V≤ VDD ≤ 1.32 V
IIO = -2 mA
VOH (3) Output high level voltage 0.7 x VDDIO2 -
1.71 V≤VDD < 1.32 V
IIO = 20 mA
- 0.4
2.3 V≤ VDD ≤3.6 V
Output low level voltage for an IIO = 10 mA
VOLFM+(3) - 0.4
FTf I/O pin in (FT I/O with “f” option) 1.71 V≤ VDD ≤ 3.6 V
IIO = 4.5 mA
- 0.4
1.08 V≤ VDD ≤ 3.6 V
1. The IIO current sourced or sunk by the device must always respect the absolute maximum rating specified in Table 17:
Voltage characteristics, and the sum of the currents sourced or sunk by all the I/Os (I/O ports and control pins) must always
respect the absolute maximum ratings ΣIIO.
2. TTL and CMOS outputs are compatible with JEDEC standards JESD36 and JESD52.
3. Specified by design - Not tested in production.
Table 63. Output timing characteristics VDDIO2 1.2 V range (HSLV OFF)(1)
Speed Symbol Parameter conditions Min Max Unit
Table 63. Output timing characteristics VDDIO2 1.2 V range (HSLV OFF)(1) (continued)
Speed Symbol Parameter conditions Min Max Unit
Table 64. Output timing characteristics VDDIO2 1.2 V (HSLV ON)(1) (continued)
Speed Symbol Parameter conditions Min Max Unit
VDD
External
reset circuit (1)
RPU
NRST (2) Internal Reset
Filter
0.1 μF
STM32
ai14132d
tw(NE)
FMC_NE
FMC_NOE
FMC_NWE
tv(A_NE) t h(A_NOE)
FMC_A[25:0] Address
tv(BL_NE) t h(BL_NOE)
FMC_NBL[1:0]
t h(Data_NE)
t su(Data_NOE) th(Data_NOE)
t su(Data_NE)
FMC_D[15:0] Data
t v(NADV_NE)
tw(NADV)
FMC_NADV (1)
FMC_NWAIT
th(NE_NWAIT)
tsu(NWAIT_NE)
MS32753V1
FMC_NEx
FMC_NOE
tv(NWE_NE) tw(NWE) t h(NE_NWE)
FMC_NWE
tv(A_NE) th(A_NWE)
FMC_A[25:0] Address
tv(BL_NE) th(BL_NWE)
FMC_NBL[1:0] NBL
tv(Data_NE) th(Data_NWE)
FMC_D[15:0] Data
t v(NADV_NE)
tw(NADV)
FMC_NADV (1)
FMC_NWAIT
th(NE_NWAIT)
tsu(NWAIT_NE)
MS32754V1
FMC_ NE
tv(NOE_NE) t h(NE_NOE)
FMC_NOE
t w(NOE)
FMC_NWE
tv(A_NE) th(A_NOE)
t v(NADV_NE) th(AD_NADV)
tw(NADV)
FMC_NADV
FMC_NWAIT
th(NE_NWAIT)
tsu(NWAIT_NE)
MS32755V1
FMC_CLK
Data latency = 0
td(CLKL-NExL) td(CLKH-NExH)
FMC_NEx
t d(CLKL-NADVL) td(CLKL-NADVH)
FMC_NADV
td(CLKL-AV) td(CLKH-AIV)
FMC_A[25:16]
td(CLKL-NOEL) td(CLKH-NOEH)
FMC_NOE
td(CLKL-ADIV) th(CLKH-ADV)
t d(CLKL-ADV) tsu(ADV-CLKH) tsu(ADV-CLKH) th(CLKH-ADV)
FMC_AD[15:0] AD[15:0] D1 D2
tsu(NWAITV-CLKH) th(CLKH-NWAITV)
FMC_NWAIT
(WAITCFG = 1b,
WAITPOL + 0b)
tsu(NWAITV-CLKH) th(CLKH-NWAITV)
FMC_NWAIT
(WAITCFG = 0b,
WAITPOL + 0b) tsu(NWAITV-CLKH) th(CLKH-NWAITV)
MS32757V1
FMC_CLK
Data latency = 0
td(CLKL-NExL) td(CLKH-NExH)
FMC_NEx
td(CLKL-NADVL) td(CLKL-NADVH)
FMC_NADV
td(CLKL-AV) td(CLKH-AIV)
FMC_A[25:16]
td(CLKL-NWEL) td(CLKH-NWEH)
FMC_NWE
td(CLKL-ADIV) td(CLKL-Data)
td(CLKL-ADV) td(CLKL-Data)
FMC_AD[15:0] AD[15:0] D1 D2
FMC_NWAIT
(WAITCFG = 0b,
WAITPOL + 0b) tsu(NWAITV-CLKH) th(CLKH-NWAITV)
td(CLKH-NBLH)
FMC_NBL
MS32758V1
tw(CLK) tw(CLK)
FMC_CLK
td(CLKL-NExL) td(CLKH-NExH)
Data latency = 0
FMC_NEx
td(CLKL-NADVL) td(CLKL-NADVH)
FMC_NADV
td(CLKL-AV) td(CLKH-AIV)
FMC_A[25:0]
td(CLKL-NOEL) td(CLKH-NOEH)
FMC_NOE
tsu(DV-CLKH) th(CLKH-DV)
tsu(DV-CLKH) th(CLKH-DV)
FMC_D[15:0] D1 D2
tsu(NWAITV-CLKH) th(CLKH-NWAITV)
FMC_NWAIT
(WAITCFG = 1b,
WAITPOL + 0b)
tsu(NWAITV-CLKH) t h(CLKH-NWAITV)
FMC_NWAIT
(WAITCFG = 0b,
WAITPOL + 0b)
tsu(NWAITV-CLKH) th(CLKH-NWAITV)
MS32759V1
FMC_CLK
td(CLKL-NExL) td(CLKH-NExH)
Data latency = 0
FMC_NEx
td(CLKL-NADVL) td(CLKL-NADVH)
FMC_NADV
td(CLKL-AV) td(CLKH-AIV)
FMC_A[25:0]
td(CLKL-NWEL) td(CLKH-NWEH)
FMC_NWE
td(CLKL-Data) td(CLKL-Data)
FMC_D[15:0] D1 D2
FMC_NWAIT
(WAITCFG = 0b, WAITPOL + 0b) tsu(NWAITV-CLKH) td(CLKH-NBLH)
th(CLKH-NWAITV)
FMC_NBL
MS32760V1
FMC_NCEx
ALE (FMC_A17)
CLE (FMC_A16)
FMC_NWE
td(ALE-NOE) th(NOE-ALE)
FMC_NOE (NRE)
tsu(D-NOE) th(NOE-D)
FMC_D[15:0]
MS32767V1
FMC_NCEx
ALE (FMC_A17)
CLE (FMC_A16)
td(ALE-NWE) th(NWE-AL
FMC_NWE
FMC_NOE (NRE)
tv(NWE-D) th(NWE-D)
FMC_D[15:0]
MS327
Figure 42. NAND controller waveforms for common memory read access
FMC_NCEx
ALE (FMC_A17)
CLE (FMC_A16)
td(ALE-NOE) th(NOE-ALE)
FMC_NWE
tw(NOE)
FMC_NOE
tsu(D-NOE) th(NOE-D)
FMC_D[15:0]
MS32769V1
Figure 43. NAND controller waveforms for common memory write access
FMC_NCEx
ALE (FMC_A17)
CLE (FMC_A16)
td(ALE-NOE) tw(NWE) th(NOE-ALE)
FMC_NWE
FMC_N OE
td(D-NWE)
tv(NWE-D) th(NWE-D)
FMC_D[15:0]
MS32770V1
FMC_SDCLK
td(SDCLKL_AddC)
td(SDCLKL_AddR) th(SDCLKL_AddR)
th(SDCLKL_AddC)
td(SDCLKL_SNDE) th(SDCLKL_SNDE)
FMC_SDNE[1:0]
td(SDCLKL_NRAS) th(SDCLKL_NRAS)
FMC_SDNRAS
td(SDCLKL_NCAS) th(SDCLKL_NCAS)
FMC_SDNCAS
FMC_SDNWE
tsu(SDCLKH_Data) th(SDCLKH_Data)
MS32751V2
FMC_SDCLK
td(SDCLKL_AddC)
td(SDCLKL_AddR) th(SDCLKL_AddR)
th(SDCLKL_AddC)
td(SDCLKL_SNDE) th(SDCLKL_SNDE)
FMC_SDNE[1:0]
td(SDCLKL_NRAS) th(SDCLKL_NRAS)
FMC_SDNRAS
td(SDCLKL_NCAS) th(SDCLKL_NCAS)
FMC_SDNCAS
td(SDCLKL_NWE) th(SDCLKL_NWE)
FMC_SDNWE
td(SDCLKL_Data)
td(SDCLKL_NBL) th(SDCLKL_Data)
FMC_NBL[3:0]
MS32752V2
tw(CLKH) OCTOSPI clock high and PRESCALER[7:0] = n t(CLK)/2 - 0.5 - t(CLK)/2 + 0.5
tw(CLKL) low time, even division = 0,1,3,5.3... 255 t(CLK)/2 - 0.5 - t(CK)/2 + 0.5
(n/2)*t(CLK)/ (n/2)*t(CLK)/
tw(CLKH) -
OCTOSPI clock high and PRESCALER[7:0] = n (n+1)-0.5 (n+1) + 0.5
low time, odd division = 2,4,6,....254 (n/2+1)*t(CLK)/ (n/2+1)*t(CLK)/
tw(CLKL) - ns
(n+1)-0.5 (n+1) + 0.5
ts(IN) Data input setup time - 4 - -
th(IN) Data input hold time - 1 - -
tv(OUT) Data output valid time - - 0.5 1
th(OUT) Data output hold time - 0 - -
1. All values apply to Octal and Quad-SPI mode.
2. Evaluated by characterization - not tested in production.
3. At VOS1, these values are degraded by up to 5%.
Clock
tv(OUT) th(OUT)
Data output D0 D1 D2
ts(IN) th(IN)
Data input D0 D1 D2
MSv36878V3
tsr(IN),
Data input setup time - 4 - -
tsf(IN)
thr(IN),
Data input hold time - 1.5 - -
thf(IN)
DHQC = 0 - 2.5 3.5
tvr(OUT) DHQC = 1,
Data output valid time - t(CLK)/4 ns
tvf(OUT) Prescaler[7 - t(CLK)/4+1
+0.5
:0] = 1,2...
DHQC = 0 1.5 - -
thr(OUT) DHQC = 1,
Data output hold time -
thf(OUT) Prescaler[7 t(CLK)/4 - 1 - -
:0] = 1,2...
1. All values apply to Octal and Quad-SPI mode.
2. Evaluated by characterization not tested in production.
3. Delay block bypassed.
4. DHQC must be set to reach the mentioned frequency.
Table 87. OCTOSPI characteristics in DTR mode (with DQS)/ hyperbus(1)(2) (continued)
Symbol Parameter Conditions Min Typ Max Unit
Clock
tvf(OUT) thr(OUT) tvr(OUT) thf(OUT)
Data output D0 D1 D2 D3 D4 D5
Data input D0 D1 D2 D3 D4 D5
MSv36879V4
NCLK
VOD(CLK)
CLK
MSv47732V3
tw(CS)
NCS
CLK, NCLK
RWDS
Command address
Memory drives DQ[7:0] and RWDS.
Host drives DQ[7:0] and the memory drives RWDS. MSv47733V3
tw(CS)
NCS
CLK, NCLK
Latency count
tv(OUT) th(OUT) tv(OUT) th(OUT)
Dn Dn Dn+1 Dn+1
DQ[7:0] 47:40 39:32 31:24 23:16 15:8 7:0
A B A B
DCMI_PIXCLK
tsu(HSYNC) th(HSYNC)
DCMI_HSYNC
tsu(VSYNC) th(HSYNC)
DCMI_VSYNC
tsu(DATA) th(DATA)
DATA[0:13]
MS32414V2
Frequency ratio
- - - 0.4 -
PSSI_PDCK/fHCLK
2.7 V≤VDD ≤3.6 V. - 90(2)
PSSI_PDCK PSSI Clock input MHz
1.71 V≤VDD ≤3.6 V. - 86
Dpixel PSSI Clock input duty cycle 30 70 %
Frequency ratio
- - 0.4 -
PSSI_PDCK/fHCLK
PSSI_PDCK PSSI Clock input 1.71 V≤VDD ≤3.6 V. - 100 MHz
Dpixel PSSI Clock input duty cycle - 30 70 %
tsu(DATA) Data input setup time 2 -
th(DATA) Data input hold time 2.5 -
tsu((DE) DE input setup time 1.5 -
1.71 V≤VDD ≤3.6 V. ns
th(DE) DE input hold time 2 -
tov(RDY) RDY output valid time - 16.5
toh(RDY) RDY output hold time 5.5 -
1. Evaluated by characterization - Not tested in production.
tc(PDCK)
tw(PDCKH) tw(PDCKL)
tf(PDCK) tr(PDCK)
PSSI_PDCK
CKPOL = 0
(input)
CKPOL = 1
tov(DATA) toh(DATA)
PSSI D[15:0]
Invalid data OUT Valid data OUT Invalid data OUT
(output)
PSSI_DE
(output)
DEPOL = 0
tov(DE) toh(DE)
DEPOL = 1
PSSI_RDY
RDYPOL = 0
(input)
tsu(RDY) th(RDY)
RDYPOL = 1
MSv65388V1
tc(PDCK)
tw(PDCKH) tw(PDCKL)
tf(PDCK) tr(PDCK)
PSSI_PDCK
CKPOL = 0
(input)
CKPOL = 1
tsu(DATA)
thDATA)
PSSI D[15:0]
Invalid data IN Valid data IN Invalid data IN
(input)
tsu(DE)
th(DE)
PSSI_DE
DEPOL = 0
(output)
DEPOL = 1
tov(RDY) toh(RDY)
PSSI_RDY
RDYPOL = 0
(input)
RDYPOL = 1
Analog
supply
VDDA - 1.62 - 3.6 V
voltage for
ADC ON
Positive
VREF+ reference - 1.62 - VDDA
voltage
V
Negative
VREF- reference - VSSA
voltage
ADC clock
fADC 1.62V ≤ VDDA ≤ 3.6 V 1.5 - 75 MHz
frequency
fADC=
1.8V≤VDDA≤3.6V - 5.00 -
75MHz
Continuous
Mode fADC=
1.6V≤VDDA≤3.6V 70 MH 4.66
z
Resolution SMP
-40°C ≤ TJ ≤ 130°C
= 12 bits =2.5
fADC=
2.4V≤VDDA≤3.6V 4.00 -
Single or 60MHz
Discontinuous
Mode fADC=
1.6V≤VDDA≤3.6V 3.33 -
50MHz
Sampling
rate for fast Continuous fADC=
1.6V≤VDDA≤3.6V - 5.77 -
channels Mode 75MHz
(VIN[0:5])
Resolution fADC= SMP
2.4V≤VDDA≤3.6V -40°C ≤ TJ ≤ 130°C 5.77 -
= 10 bits Single or 75MHz =2.5
Discontinuous
fS(3)
with
Mode fADC=
RAIN=47Ω 1.6V≤VDDA≤3.6V 5.00 -
65MHz MSPS
and
CPCB=22pF
Resolution fADC=
All Modes 1.6V≤VDDA≤3.6V -40°C ≤ TJ ≤ 130°C - 6.82 -
= 8 bits 75MHz
SMP
=2.5
Resolution fADC=
All Modes 1.6V≤VDDA≤3.6V -40°C ≤ TJ ≤ 130°C - 8.33 -
= 6 bits 75MHz
Resolution fADC=
- 2.30 -
= 12 bits 35MHz
Resolution fADC=
- 2.70 -
Sampling = 10 bits 35MHz
(4) SMP
rate for slow All modes 1.6V≤VDDA≤3.6V -40°C ≤ TJ ≤ 130°C
=2.5
channels Resolution fADC=
- 4.50 -
= 8 bits 50MHz
Resolution fADC=
- 5.50 -
= 6 bits 50MHz
External
tTRIG Resolution = 12 bits - - 15 1/fADC
trigger period
Conversion
VAIN(2) voltage - 0 - VREF+
range
V
Common
VREF/2− VREF/2+
VCMIV mode input - VREF/2
10% 10%
voltage
Internal
sample and
CADC - - 3 - pF
hold
capacitor
ADC
conversion
tSTAB power-up LDO already started 1 - -
cycle
time
Offset
tOFF_CAL calibration - 1335
time
Sampling
tS - 2.5 - 640.5
time
Total
conversion
time tS + 0.5
tCONV N-bits resolution
(including +N
sampling
time)
fADC=75MHz - 265 -
fADC=50MHz 175 -
ADC fADC=25MHz - 90 -
IDD(ADC) consumption
on VDD fADC=12.5MHz - 45 -
fADC=6.25MHz - 22 -
fADC=3.125MHz - 11 -
47 3.75E-08 6.12E-08
68 3.94E-08 6.25E-08
100 4.36E-08 6.51E-08
150 5.11E-08 7.00E-08
12 bits
220 6.54E-08 7.86E-08
330 8.80E-08 9.57E-08
470 1.17E-07 1.23E-07
680 1.60E-07 1.65E-07
47 3.19E-08 5.17E-08
68 3.35E-08 5.28E-08
100 3.66E-08 5.45E-08
150 4.35E-08 5.83E-08
220 5.43E-08 6.50E-08
330 7.18E-08 7.89E-08
10 bits
470 9.46E-08 1.00E-07
680 1.28E-07 1.33E-07
1000 1.81E-07 1.83E-07
1500 2.63E-07 2.63E-07
2200 3.79E-07 3.76E-07
3300 5.57E-07 5.52E-07
47 2.64E-08 4.17E-08
68 2.76E-08 4.24E-08
100 3.02E-08 4.39E-08
150 3.51E-08 4.66E-08
220 4.27E-08 5.13E-08
330 5.52E-08 6.19E-08
470 7.17E-08 7.72E-08
680 9.68E-08 1.00E-07
8 bits
1000 1.34E-07 1.37E-07
1500 1.93E-07 1.94E-07
2200 2.76E-07 2.74E-07
3300 4.06E-07 4.01E-07
4700 5.73E-07 5.62E-07
6800 8.21E-07 7.99E-07
10000 1.20E-06 1.17E-06
15000 1.79E-06 1.74E-06
47 2.14E-08 3.16E-08
68 2.23E-08 3.21E-08
100 2.40E-08 3.31E-08
150 2.68E-08 3.52E-08
220 3.13E-08 3.87E-08
330 3.89E-08 4.51E-08
470 4.88E-08 5.39E-08
680 6.38E-08 6.79E-08
6 bits
1000 8.70E-08 8.97E-08
1500 1.23E-07 1.24E-07
2200 1.73E-07 1.73E-07
3300 2.53E-07 2.49E-07
4700 3.53E-07 3.45E-07
6800 5.04E-07 4.90E-07
10000 7.34E-07 7.11E-07
15000 1.09E-06 1.05E-06
1. Specified by design - Not tested in production.
2. Data valid up to 130 °C, with a 22 pF PCB capacitor, and VDDA = 1.6 V.
3. Slow channels correspond to all ADC inputs except for the fast channels.
CLK
Mux Sampling(1) 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
1. The sampling time defines the minimum sampling clock cycles (SMP) to be programmed in the ADC (refer to the product reference manual for details).
Note: ADC accuracy vs. negative injection current: injecting a negative current on any analog
input pins should be avoided as this significantly reduces the accuracy of the conversion
being performed on another analog input. It is recommended to add a Schottky diode (pin to
ground) to analog pins which may potentially inject negative currents.
VREF+ VDDA
[1LSB = (or )]
Output code 2n 2n
EG
(1) Example of an actual transfer curve
2n-1 (2) Ideal transfer curve
2n-2 (3) End-point correlation line
2n-3 (2)
n = ADC resolution
ET = total unadjusted error: maximum deviation
(3) between the actual and ideal transfer curves
ET
7 (1) EO = offset error: maximum deviation between the first
actual transition and the first ideal one
6
EL EG = gain error: deviation between the last ideal
5 EO
transition and the last actual one
4 ED = differential linearity error: maximum deviation
ED between actual steps and the ideal one
3
2 EL = integral linearity error: maximum deviation between
1 any actual transition and the end point correlation line
1 LSB ideal
0 VREF+ (VDDA)
(1/2n)*VREF+
(2/2n)*VREF+
(3/2n)*VREF+
(4/2n)*VREF+
(5/2n)*VREF+
(6/2n)*VREF+
(7/2n)*VREF+
(2n-3/2n)*VREF+
(2n-2/2n)*VREF+
(2n-1/2n)*VREF+
(2n/2n)*VREF+
VSSA
MSv19880V6
Figure 56. Typical connection diagram when using the ADC with FT/TT pins
featuring analog switch function
VDDA(4) VREF+(4)
MSv67871V3
1. Refer to Table 92: 12-bit ADC characteristics for the values of RAIN, and CADC.
2. Cparasitic represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the
pad capacitance (refer to Table 57: I/O static characteristics). A high Cparasitic value downgrades
conversion accuracy. To remedy this, fADC should be reduced.
3. Refer to Table 57: I/O static characteristics for the value of Ilkg.
4. Refer to Figure 20: STM32H563 power supply scheme with SMPS.
Figure 57. Power supply and reference decoupling (VREF+ not connected to VDDA)
STM32
VREF+(1)
1 μF // 100 nF
VDDA
1 μF // 100 nF
VSSA/VREF-(1)
MSv50648V2
1. VREF+ input is not available on all package (refer to Table 14: STM32H562xx and STM32H563xx pin/ball
definition) whereas VREF- is available only on UFBGA176+25, UFBGA169 with SMPS, LQFP100,
UFBGA169, and UFBGA176+25. When VREF- is not available, it is internally connected to VSSA.
Figure 58. Power supply and reference decoupling (VREF+ connected to VDDA)
STM32
VREF+/VDDA(1)
1 μF // 100 nF
VREF-/VSSA(1)
MSv50649V1
1. VREF+ input is not available on all package (refer to Table 14: STM32H562xx and STM32H563xx pin/ball
definition) whereas VREF- is available only on UFBGA176+25, UFBGA169 with SMPS, LQFP100,
UFBGA169, and UFBGA176+25. When VREF- is not available, it is internally connected to VSSA.
No load,
middle code - 170 - µA
DAC output buffer (0x800)
ON No load,
worst code - 170 -
(0xF1C)
No load,
DAC consumption from DAC output buffer middle/
IDDV(DAC) - 160 -
VREF+ OFF worst code
(0x800)
170*TON/
Sample and Hold mode, Buffer
- (TON+TOFF) -
ON, CSH=100 nF (worst code) (5)
160*TON/
Sample and Hold mode, Buffer
- (TON+TOFF) -
OFF, CSH=100 nF (worst code) (5)
2. In buffered mode, the output can overshoot above the final value for low input code (starting from the minimum value).
3. DACx_OUT pin is not connected externally (internal connection only).
4. Refer to Table 57: I/O static characteristics.
5. TON is the refresh phase duration, while TOFF is the hold phase duration. Refer to the product reference manual for more
details.
Buffered/Non-buffered DAC
Buffer(1)
RL
12-bit DAC_OUTx
digital to
analog
converter
CL
ai17157V3
1. The DAC integrates an output buffer that can be used to reduce the output impedance and to drive external loads directly
without the use of an external operational amplifier. The buffer can be bypassed by configuring the BOFFx bit in the
DAC_CR register.
VBRS in PWR_CR3= 0 - 5 -
RBC Battery charging resistor KΩ
VBRS in PWR_CR3= 1 1.5 -
Equivalent serial
esr - - - - 2 Ω
resistor of CL
Iload Static load current - - - - 4 mA
ppm/
Iload = 500 µA - 200 -
V
Iline_reg Line regulation 2.8 V ≤ VDDA ≤ 3.6 V
Iload = 4 mA - 100 -
ppm/
Iload_reg Load regulation 500 µA ≤ Iload ≤ 4 mA Normal Mode - 50 -
mA
Tcoeff
Temperature ppm/
Tcoeff -40 °C < TJ < +130 °C - - - VREFINT
coefficient °C
+ 100
Power supply DC - - 60 - dB
PSRR
rejection 100 KHz - - 40 -
CL=0.5 µF - - 300 - µs
CL=1.5 µF - - 650 -
Control of
maximum DC
current drive on
IINRUSH - - 8 - mA
VREFBUF_OUT
during startup
phase(4)(4)
ILOAD = 0 µA - - 15 25 µA
VREFBUF
IDDA(VREF
consumption from ILOAD = 500 µA - - 16 30
BUF) VDDA
ILOAD = 4 mA - - 32 50
AHB/APBx prescaler=1
or 2 or 4, fTIMxCLK = 1 - tTIMxCLK
250 MHz
tres(TIM) Timer resolution time
AHB/APBx
prescaler>4, fTIMxCLK = 1 - tTIMxCLK
125 MHz
ter characteristics:
tAF Maximum pulse width of spikes that are suppressed by analog filter 50(3) 160(4) ns
1. Evaluated by characterization - Not tested in production.
2. Measurement points are done at 50% VDD.
3. Spikes with widths below tAF(min) are filtered.
4. Spikes with widths above tAF(max) are not filtered.
Master receiver
31
1.71 V < VDD < 3.6 V
Master transmitter
31/6(2)
1.71 V < VDD < 3.6 V
Master transmitter
31/6(2)
2.7 V < VDD < 3.6 V
fCK USART clock frequency - - MHz
Slave receiver
83
1.71 V < VDD < 3.6 V
Slave transmitter
32/6(2)
1.71 V < VDD < 3.6 V
Slave transmitter
35/6(2)
2.7 V < VDD < 3.6 V
1/fCK
CK output
CPHA = 0
CPOL = 0
CPHA = 0
CPOL = 1
CK output
CPHA = 1
CPOL = 0
CPHA = 1
CPOL = 1
tw(CKH)
tsu(RX) tw(CKL)
RX
INPUT MSB IN BIT6 IN LSB IN
th(RX)
TX
OUTPUT MSB OUT BIT1 OUT LSB OUT
tv(TX) th(TX)
MSv65386V4
NSS
input
1/fCK th(NSS)
tsu(NSS) tw(CKH)
CPHA = 0
CK input
CPOL = 0
CPHA = 0
CPOL = 1
TX output First bit OUT Next bits OUT Last bit OUT
th(RX)
tsu(RX)
Slave mode,
- 8.5/25(3) 11.5/33(3)
2.7 V < VDD < 3.6 V
tv(SO)
Data output valid time Slave mode,
- 10/59(3) 12/76(3)
1.71 V < VDD < 3.6 V
Slave mode,
th(SO) 6.5/20.5(3) - -
1.71 V < VDD < 3.6 V
Data output hold time
th(MO) Master mode 0 - -
High
NSS input
tc(SCK)
SCK Output
CPHA=0
CPOL=0
CPHA=0
CPOL=1
SCK Output
CPHA=1
CPOL=0
CPHA=1
CPOL=1
tw(SCKH) tr(SCK)
tsu(MI) tw(SCKL) tf(SCK)
MISO
INPUT MSB IN BIT6 IN LSB IN
th(MI)
MOSI
OUTPUT MSB OUT BIT1 OUT LSB OUT
tv(MO) th(MO)
ai14136c
NSS input
tc(SCK) th(NSS)
CPOL=0
CPHA=0
CPOL=1
ta(SO) tw(SCKL) tv(SO) th(SO) tf(SCK) tdis(SO)
MISO output First bit OUT Next bits OUT Last bit OUT
th(SI)
tsu(SI)
MSv41658V1
Figure 64. SPI timing diagram - slave mode and CPHA = 1(1)
NSS input
tc(SCK)
CPOL=0
CPHA=1
CPOL=1
ta(SO) tw(SCKL) tv(SO) th(SO) tr(SCK) tdis(SO)
MISO output First bit OUT Next bits OUT Last bit OUT
tsu(SI) th(SI)
MSv41659V1
Slave transmitter
tv(SD_ST) - 14
(after enable edge)
Data output valid time
Master transmitter
tv(SD_MT) - 1
(after enable edge)
Slave transmitter
th(SD_ST) 5.5 -
(after enable edge)
Data output hold time
Master transmitter
th(SD_MT) 0 -
(after enable edge)
1. Evaluated by characterization - Not tested in production.
1. LSB transmit/receive of the previously transmitted byte. No LSB transmit/receive is sent before the first
byte.
1. LSB transmit/receive of the previously transmitted byte. No LSB transmit/receive is sent before the first
byte.
SAI characteristics
Unless otherwise specified, the parameters given in Table 114 for SAI are derived from tests
performed under the ambient temperature, fPCLKx frequency and VDD supply voltage
conditions summarized in Table 20: General operating conditions, with the following
configuration:
• Output speed is set to OSPEEDRy[1:0] = 10
• Capacitive load CL = 30 pF
• IO Compensation cell activated.
• Measurement points are done at CMOS levels: 0.5VDD
• VOS level set to VOS0
Refer to Section 5.3.14: I/O port characteristics for more details on the input/output
alternate function characteristics (SCK,SD,WS).
SAI_SCK_X
th(FS)
SAI_FS_X
(output) tv(FS) tv(SD_MT) th(SD_MT)
SAI_SD_X
Slot n Slot n+2
(transmit)
tsu(SD_MR) th(SD_MR)
SAI_SD_X Slot n
(receive)
MS32771V1
SAI_SCK_X
tw(CKH_X) tw(CKL_X) th(FS)
SAI_FS_X
(input) tsu(FS) tv(SD_ST) th(SD_ST)
SAI_SD_X
Slot n Slot n+2
(transmit)
tsu(SD_SR) th(SD_SR)
SAI_SD_X Slot n
(receive)
MS32772V1
MSv72345V1
CK
tOV tOH
tW(CKH)
CK
tW(CKL)
tOV tOV
tOH tOH
MSv69158V1
Table 117. Dynamics characteristics: Ethernet MAC signals for SMI (1)
Symbol Parameter Min Typ Max Unit
Table 118. Dynamics characteristics: Ethernet MAC signals for RMII (1)
Symbol Parameter Min Typ Max Unit
Table 119. Dynamics characteristics: Ethernet MAC signals for MII (1)
Symbol Parameter Min Typ Max Unit
RMII_REF_CLK
td(TXEN)
td(TXD)
RMII_TX_EN
RMII_TXD[1:0]
tsu(RXD) tih(RXD)
tsu(CRS) tih(CRS)
RMII_RXD[1:0]
RMII_CRS_DV
ai15667b
MII_RX_CLK
tsu(RXD) tih(RXD)
tsu(ER) tih(ER)
tsu(DV) tih(DV)
MII_RXD[3:0]
MII_RX_DV
MII_RX_ER
MII_TX_CLK
td(TXEN)
td(TXD)
MII_TX_EN
MII_TXD[3:0]
ai15668b
ETH_MDC
td(MDIO)
ETH_MDIO(O)
tsu(MDIO) th(MDIO)
ETH_MDIO(I)
MS31384V1
TCK
tsu(TMS/TDI) th(TMS/TDI)
tw(TCKL) tw(TCKH)
TDI/TMS
tov(TDO) toh(TDO)
TDO
MSv40458V1
tc(SWCLK)
SWCLK
tov(SWDIO) toh(SWDIO)
SWDIO
(transmit)
MSv40459V1
6 Package information
2 1
(2)
R1
H
R2
B
B-
N
O
TI
C
SE
B GAUGE PLANE
D 1/4
0.25
(6)
S
B
L
4x N/4 TIPS
E 1/4 3
(L1)
aaa C A-B D (1) (11)
bbb H A-B D 4x
SECTION A-A
(13) (N – 4)x e
C
A
0.05
A2 A1 (12)
b
ddd C A-B D ccc C
D (4)
(10)
D (3) b WITH PLATING
N (4)
A A SECTION B-B
(Section A-A)
Notes:
1. Dimensioning and tolerancing schemes conform to ASME Y14.5M-1994.
2. The Top package body size may be smaller than the bottom package size by as much
as 0.15 mm.
3. Datums A-B and D to be determined at datum plane H.
4. To be determined at seating datum plane C.
5. Dimensions D1 and E1 do not include mold flash or protrusions. Allowable mold flash
or protrusions is “0.25 mm” per side. D1 and E1 are Maximum plastic body size
dimensions including mold mismatch.
6. Details of pin 1 identifier are optional but must be located within the zone indicated.
7. All Dimensions are in millimeters.
8. No intrusion allowed inwards the leads.
9. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall
not cause the lead width to exceed the maximum “b” dimension by more than 0.08 mm.
Dambar cannot be located on the lower radius or the foot. Minimum space between
protrusion and an adjacent lead is 0.07 mm for 0.4 mm and 0.5 mm pitch packages.
10. Exact shape of each corner is optional.
11. These dimensions apply to the flat section of the lead between 0.10 mm and 0.25 mm
from the lead tip.
12. A1 is defined as the distance from the seating plane to the lowest point on the package
body.
13. “N” is the number of terminal positions for the specified body size.
14. Values in inches are converted from mm and rounded to 4 decimal digits.
15. Drawing is not to scale.
48 33
0.30
49 0.5 32
12.70
10.30
10.30
64 17
1.20
1 16
7.80
12.70
5W_LQFP64_FP_V2
E E
(2X) 0.10 C
SEATING
C PLANE
E2
2
1
PIN 1 ID
C 0.30 X 45'
68 67 b
e
EXPOSED PAD AREA
BOTTOM VIEW B029_VFQFPN68_ME_V1
1. VFQFPN stands for Thermally Enhanced Very thin Fine pitch Quad Flat Packages No lead. Sawed
version. Very thin profile: 0.80 < A ≤ 1.00mm.
2. The pin #1 identifier must be existed on the top surface of the package by using indentation mark or other
feature of package body. Exact shape and size of this feature is optional.
0.15 6.40
6.65
7.00
8.30
6.40
0.25
0.82
0.65
0.40
B029_VFQFPN68_FP_V2
K e e
e
e2
DETAIL B
BACKSIDE CODE
BOTTOM VIEW
A
bbb C
A3 A2 SIDE VIEW
SIDE VIEW
DETAIL A
BUMP
D
A1
eee Z
E
b (80x)
ccc Z X Y
ddd Z
A1 Orientation SEATING
ref DETAIL A PLANE
4x aaa C ROTATED 90
TOP VIEW
B0D4_WLCSP80_ME_V1
Dpad
Dsm
BGA_WLCSP_FT_V1
Pitch 0.35 mm
Dpad 0.225 mm
Dsm 0.290 mm typ. (depends on soldermask registration tolerance)
Stencil opening 0.235 mm
Stencil thickness 0.080 mm
ș2 ș
(2)
R1
H
R2
B
B-
N
O
(6)
TI
C
SE
D1/4 B GAUGE PLANE
S
E1/4
B ș
4x N/4 TIPS
ș L
4x (L1)
aaa C A-B D
bbb H A-B D (1) (11)
(N-4) x e (13)
C
A (9) (11)
0.05
ccc C b WITH PLATING
A2 A1 b aaa C A-BD
(12)
SIDE VIEW
D (4)
(11) c
(2) (5) D1 c1 (11)
D (3)
(10) (4)
N
b1 BASE METAL
1 (11)
2
3 E1/4 SECTION B-B
E1 E
SECTION A-A
A A
θ1 0° - - 0° - -
Notes:
1. Dimensioning and tolerancing schemes conform to ASME Y14.5M-1994.
2. The Top package body size may be smaller than the bottom package size by as much
as 0.15 mm.
3. Datums A-B and D to be determined at datum plane H.
4. To be determined at seating datum plane C.
5. Dimensions D1 and E1 do not include mold flash or protrusions. Allowable mold flash
or protrusions is “0.25 mm” per side. D1 and E1 are Maximum plastic body size
dimensions including mold mismatch.
6. Details of pin 1 identifier are optional but must be located within the zone indicated.
7. All Dimensions are in millimeters.
8. No intrusion allowed inwards the leads.
9. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall
not cause the lead width to exceed the maximum “b” dimension by more than 0.08 mm.
Dambar cannot be located on the lower radius or the foot. Minimum space between
protrusion and an adjacent lead is 0.07 mm for 0.4 mm and 0.5 mm pitch packages.
10. Exact shape of each corner is optional.
11. These dimensions apply to the flat section of the lead between 0.10 mm and 0.25 mm
from the lead tip.
12. A1 is defined as the distance from the seating plane to the lowest point on the package
body.
13. “N” is the number of terminal positions for the specified body size.
14. Values in inches are converted from mm and rounded to 4 decimal digits.
15. Drawing is not to scale.
76 50
0.5
0.3
16.7 14.3
100 26
1.2
1 25
12.3
16.7
1L_LQFP100_FP_V1
BOTTOM VIEW
2 1
(2)
R1
H
R2
B
B-
N
O
TI
C
SE
(6) B GAUGE PLANE
0.25
D 1/4
S
B
L
3
E 1/4 (L1)
(1) (11)
4x N/4 TIPS
aaa C A-B D SECTION A-A
bbb H A-B D 4x
(N-4)x e
C
A
0.05 (12) ddd C A-B D
A2 A1 b ccc C
D (4)
D1 (2) (5)
(10) (3) D (9) (11)
N (4)
b WITH PLATING
1
2
3 E 1/4
(11) (11)
c c1
(6)
D 1/4 (2)
(3) A B (3) (5)
E1 E b1 BASE METAL
(11)
SECTION B-B
A A
(Section A-A)
TOP VIEW
1A_LQFP144_ME_V2
A - - 1.60 - - 0.0630
(12)
A1 0.05 - 0.15 0.0020 - 0.0059
A2 1.35 1.40 1.45 0.0531 0.0551 0.0571
(9)(11)
b 0.17 0.22 0.27 0.0067 0.0087 0.0106
(11)
b1 0.17 0.20 0.23 0.0067 0.0079 0.0090
(11)
c 0.09 - 0.20 0.0035 - 0.0079
c1(11) 0.09 - 0.16 0.0035 - 0.0063
(4)
D 22.00 BSC 0.8661 BSC
(2)(5)
D1 20.00 BSC 0.7874 BSC
E(4) 22.00 BSC 0.8661 BSC
E1(2)(5) 20.00 BSC 0.7874 BSC
e 0.50 BSC 0.0197 BSC
L 0.45 0.60 0.75 0.0177 0.0236 0.0295
L1 1.00 REF 0.0394 REF
N(13) 144
θ 0° 3.5° 7° 0° 3.5° 7°
θ1 0° - - 0° - -
Notes:
1. Dimensioning and tolerancing schemes conform to ASME Y14.5M-1994.
2. The Top package body size may be smaller than the bottom package size by as much
as 0.15 mm.
3. Datums A-B and D to be determined at datum plane H.
4. To be determined at seating datum plane C.
5. Dimensions D1 and E1 do not include mold flash or protrusions. Allowable mold flash
or protrusions is “0.25 mm” per side. D1 and E1 are Maximum plastic body size
dimensions including mold mismatch.
6. Details of pin 1 identifier are optional but must be located within the zone indicated.
7. All Dimensions are in millimeters.
8. No intrusion allowed inwards the leads.
9. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall
not cause the lead width to exceed the maximum “b” dimension by more than 0.08 mm.
Dambar cannot be located on the lower radius or the foot. Minimum space between
protrusion and an adjacent lead is 0.07 mm for 0.4 mm and 0.5 mm pitch packages.
10. Exact shape of each corner is optional.
11. These dimensions apply to the flat section of the lead between 0.10 mm and 0.25 mm
from the lead tip.
12. A1 is defined as the distance from the seating plane to the lowest point on the package
body.
13. “N” is the number of terminal positions for the specified body size.
14. Values in inches are converted from mm and rounded to 4 decimal digits.
15. Drawing is not to scale.
108 73
1.35
109 0.35 72
0.50
19.90 17.85
22.60
144 37
1 36
19.90
22.60
1A_LQFP144_FP
Z Seating plane
A2 A4
ddd Z
A
A3 A1
b
SIDE VIEW A1 ball A1 ball
identifier index area X
E
E1
e F
A
F
D1 D
e
Y
N
13 1
Dpad
Dsm
BGA_WLCSP_FT_V1
Table 129. UFBGA169 - Example of PCB design rules (0.5 mm pitch BGA)
Dimension Values
Pitch 0.5 mm
Dpad 0.27 mm
0.35 mm typ. (depends on the soldermask
Dsm
registration tolerance)
Solder paste 0.27 mm aperture diameter.
ș2 ș1
(2) R1
H R2
A2 0.05
(N-4) x e
C
A
A1 (12) ddd C A-BD ccc C
b
SIDE VIEW
D (4)
(2) (5) D1
D (9) (11)
(10) N
(4) b WITH PLATING
E1/4
(11) c c1 (11)
D1/4 (6) (5)
A B (2)
E1 E b1 BASE METAL
(11)
SECTION A-A
A A
SECTION B-B
Notes:
1. Dimensioning and tolerancing schemes conform to ASME Y14.5M-1994.
2. The Top package body size may be smaller than the bottom package size by as much
as 0.15 mm.
3. Datums A-B and D to be determined at datum plane H.
4. To be determined at seating datum plane C.
5. Dimensions D1 and E1 do not include mold flash or protrusions. Allowable mold flash
or protrusions is “0.25 mm” per side. D1 and E1 are Maximum plastic body size
dimensions including mold mismatch.
6. Details of pin 1 identifier are optional but must be located within the zone indicated.
7. All Dimensions are in millimeters.
8. No intrusion allowed inwards the leads.
9. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall
not cause the lead width to exceed the maximum “b” dimension by more than 0.08 mm.
Dambar cannot be located on the lower radius or the foot. Minimum space between
protrusion and an adjacent lead is 0.07 mm for 0.4 mm and 0.5 mm pitch packages.
10. Exact shape of each corner is optional.
11. These dimensions apply to the flat section of the lead between 0.10 mm and 0.25 mm
from the lead tip.
12. A1 is defined as the distance from the seating plane to the lowest point on the package
body.
13. “N” is the number of terminal positions for the specified body size.
14. Values in inches are converted from mm and rounded to 4 decimal digits.
15. Drawing is not to scale.
1.2
176 133
1 0.5 132
0.3
26.7
21.8
44 89
45 88
1.2
21.8
26.7
1T_FP_V1
A
A2 A3 b A1
A1 ball A
A1 ball index E
identifier area
E1
e F
A
F
D1 D
e
B
R
15 1
Øb (176 + 25 balls)
BOTTOM VIEW TOP VIEW
Ø eee M C A B
Ø fff M C
A0E7_ME_V10
A - - 0.600 - - 0.0236
A1 0.050 0.080 0.110 0.0020 0.0031 0.0043
A2 - 0.450 - - 0.0177 -
A3 - 0.130 - - 0.0051 -
A4 - 0.320 - - 0.0126 -
b 0.240 0.290 0.340 0.0094 0.0114 0.0134
D 9.850 10.000 10.150 0.3878 0.3937 0.3996
D1 - 9.100 - - 0.3583 -
E 9.850 10.000 10.150 0.3878 0.3937 0.3996
E1 - 9.100 - - 0.3583 -
e - 0.650 - - 0.0256 -
F - 0.450 - - 0.0177 -
ddd - - 0.080 - - 0.0031
Dpad
Dsm
BGA_WLCSP_FT_V1
Table 132. UFBGA(176+25) - Example of PCB design rules (0.65 mm pitch BGA)
Dimension Values
Pitch 0.65 mm
Dpad 0.300 mm
0.400 mm typ. (depends on the soldermask
Dsm
registration tolerance)
Stencil opening 0.300 mm
Stencil thickness Between 0.100 mm and 0.125 mm
Pad trace width 0.100 mm
7 Ordering information
Product type
H = high performance
Device subfamily
Pin count
R = 64 pins / 68 pins
M = 80 pins
V = 100 pins
Z = 144 pins
A = 169 balls
I = 176 pins
G = 1 Mbyte
I = 2 Mbytes
Package
V = VFQFPN
T = LQFP
I = UFBGA (7 x 7 mm)
K= UFBGA (10 x 10)
Y = WLCSP
Temperature range
Dedicated pinout
Packing
For a list of available options (such as speed or package) or for further information on any
aspect of this device, contact the nearest ST sales office.
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