MS5611 01BA03 Measurement

MS5611-01BA03 Barometric Pressure Sensor, with stainless steel cap
• High resolution module, 10 cm

• Fast conversion down to 1 ms
• Low power, 1 µA (standby < 0.15 µA)
•
3
QFN package 5.0 x 3.0 x 1.0 mm
• Supply voltage 1.8 to 3.6 V
• Integrated digital pressure sensor (24 bit ΔΣ ADC)
• Operating range: 10 to 1200 mbar, -40 to +85 °C
•
2
I C and SPI interface up to 20 MHz
• No external components (Internal oscillator)
• Excellent long term stability
DESCRIPTION
The MS5611-01BA is a new generation of high resolution altimeter sensors from MEAS Switzerland with SPI
2
and I C bus interface. This barometric pressure sensor is optimized for altimeters and variometers with an
altitude resolution of 10 cm. The sensor module includes a high linearity pressure sensor and an ultra low power
24 bit ΔΣ ADC with internal factory calibrated coefficients. It provides a precise digital 24 Bit pressure and
temperature value and different operation modes that allow the user to optimize for conversion speed and
current consumption. A high resolution temperature output allows the implementation of an
altimeter/thermometer function without any additional sensor. The MS5611-01BA can be interfaced to virtually
any microcontroller. The communication protocol is simple, without the need of programming internal registers in
the device. Small dimensions of only 5.0 mm x 3.0 mm and a height of only 1.0 mm allow for integration in
mobile devices. This new sensor module generation is based on leading MEMS technology and latest benefits
from MEAS Switzerland proven experience and know-how in high volume manufacturing of altimeter modules,
which have been widely used for over a decade. The sensing principle employed leads to very low hysteresis
and high stability of both pressure and temperature signal.
FEATURES
FIELD OF APPLICATION TECHNICAL DATA

• Mobile altimeter / barometer systems Sensor Performances (V DD = 3 V)
• Bike computers Pressure Min Typ Max Unit
• Variometers Range 10 1200 mbar
• Height sensing for medical alarms ADC 24 bit
• Indoor navigation Resolution (1)
0.065 / 0.042 / 0.027
mbar
/ 0.018 / 0.012
Accuracy 25°C, 750 mbar -1.5 +1.5 mbar
Error band, -20°C to +85°C
FUNCTIONAL BLOCK DIAGRAM -2.5 +2.5 mbar
450 to 1100 mbar (2)
0.5 / 1.1 / 2.1 / 4.1 /
VDD Response time (1) ms
8.22
PS
Meas. MUX
CSB Long term stability ±1 mbar/yr
SENSOR +IN Digital
Interface SDI/SDA
PGA ADC dig. SDO Temperature Min Typ Max Unit

-IN Filter SCLK
Range -40 +85 °C

Sensor Memory
Interface IC (PROM) Resolution <0.01 °C
128 bits
SGND
Accuracy -0.8 +0.8 °C
GND
Notes: (1) Oversampling Ratio: 256 / 512 / 1024 / 2048 / 4096
(2) With autozero at one pressure point
DA5611-01BA03_011 www.meas-spec.com Oct. 26, 2012

000056111624 ECN1742 1/20
PERFORMANCE SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS

Parameter Symbol Conditions Min. Typ. Max Unit
Supply voltage V DD -0.3 +4.0 V
Storage temperature TS -40 +125 °C
Overpressure P max 6 bar
Maximum Soldering
T max 40 sec max 250 °C
Temperature
Human Body
ESD rating -4 +4 kV
Model
JEDEC standard
Latch up -100 +100 mA
No 78
ELECTRICAL CHARACTERISTICS
Operating Supply voltage V DD 1.8 3.0 3.6 V
Operating Temperature T -40 +25 +85 °C
OSR 4096 12.5
2048 6.3
Supply current
I DD 1024 3.2 µA
(1 sample per sec.)
512 1.7
256 0.9
Peak supply current during conversion 1.4 mA
Standby supply current at 25°C 0.02 0.14 µA
VDD Capacitor From VDD to GND 100 nF
ANALOG DIGITAL CONVERTER (ADC)

Output Word 24 bit
OSR 4096 7.40 8.22 9.04
2048 3.72 4.13 4.54
Conversion time tc 1024 1.88 2.08 2.28 ms
512 0.95 1.06 1.17
256 0.48 0.54 0.60

000056111624 ECN1742 2/20
PERFORMANCE SPECIFICATIONS (CONTINUED)
PRESSURE OUTPUT CHARACTERISTICS (V DD = 3 V, T = 25°C UNLESS OTHERWISE NOTED)

Parameter Conditions Min. Typ. Max Unit
Operating Pressure Range P range Full Accuracy 450 1100 mbar
Linear Range of
Extended Pressure Range P ext 10 1200 mbar
ADC
at 25°C, 700..1100 mbar -1.5 +1.5
at 0..50°C, 450..1100 mbar -2.0 +2.0
Total Error Band, no autozero mbar
at -20..85°C, 450..1100 mbar -3.5 +3.5
at -40..85°C, 450..1100 mbar -6.0 +6.0
at 25°C, 700..1100 mbar -0.5 +0.5
Total Error Band, autozero at at 10..50°C, 450..1100 mbar -1.0 +1.0
mbar
one pressure point at -20..85°C, 450..1100 mbar -2.5 +2.5
at -40..85°C, 450..1100 mbar -5.0 +5.0
Maximum error with supply
V DD = 1.8 V … 3.6 V ±2.5 mbar
voltage
Long-term stability ±1 mbar/yr
Recovering time after reflow (1) 7 days
OSR 4096 0.012
2048 0.018
Resolution RMS 1024 0.027 mbar
512 0.042
256 0.065
(1) Time to recovering at least 66% of the reflow impact
TEMPERATURE OUTPUT CHARACTERISTICS (V DD = 3 V, T = 25°C UNLESS OTHERWISE NOTED)

Parameter Conditions Min. Typ. Max Unit
at 25°C -0.8 +0.8
Absolute Accuracy -20..85°C -2.0 +2.0 °C
-40..85°C -4.0 +4.0
Maximum error with supply
V DD = 1.8 V … 3.6 V ±0.5 °C
voltage
OSR 4096 0.002
2048 0.003
Resolution RMS 1024 0.005 °C
512 0.008
256 0.012

000056111624 ECN1742 3/20
PERFORMANCE SPECIFICATIONS (CONTINUED)

2
DIGITAL INPUTS (CSB, I C, DIN, SCLK)
Serial data clock SCLK SPI protocol 20 MHz
Input high voltage V IH Pins CSB 80% V DD 100% V DD V
Input low voltage V IL 0% V DD 20% V DD V
I leak25°C
Input leakage current at 25°C 0.15 µA
I leak85°C
2
PRESSURE OUTPUTS (I C, DOUT)
Output high voltage V OH I source = 1.0 mA 80% V DD 100% V DD V
Output low voltage V OL I sink = 1.0 mA 0% V DD 20% V DD V
Load capacitance C LOAD 16 pF

000056111624 ECN1742 4/20
FUNCTIONAL DESCRIPTION
VDD
PS
Meas. MUX
CSB
SENSOR +IN Digital
Interface SDI/SDA
dig. SDO
PGA ADC
-IN Filter SCLK
Sensor Memory
Interface IC (PROM)
128 bits
SGND
GND
Figure 1: Block diagram of MS5611-01BA

GENERAL
The MS5611-01BA consists of a piezo-resistive sensor and a sensor interface IC. The main function of the
MS5611-01BA is to convert the uncompensated analogue output voltage from the piezo-resistive pressure
sensor to a 24-bit digital value, as well as providing a 24-bit digital value for the temperature of the sensor.
FACTORY CALIBRATION
Every module is individually factory calibrated at two temperatures and two pressures. As a result, 6 coefficients
necessary to compensate for process variations and temperature variations are calculated and stored in the
128-bit PROM of each module. These bits (partitioned into 6 coefficients) must be read by the microcontroller
software and used in the program converting D1 and D2 into compensated pressure and temperature values.
SERIAL INTERFACE
2
The MS5611-01BA has built in two types of serial interfaces: SPI and I C. Pulling the Protocol Select pin PS to
2
low selects the SPI protocol, pulling PS to high activates the I C bus protocol.
Pin PS Mode Pins used

2
High IC SDA
Low SPI SDI, SDO, CSB
SPI MODE
The external microcontroller clocks in the data through the input SCLK (Serial CLocK) and SDI (Serial Data In).
In the SPI mode module can accept both mode 0 and mode 3 for the clock polarity and phase. The sensor
responds on the output SDO (Serial Data Out). The pin CSB (Chip Select) is used to enable/disable the
interface, so that other devices can talk on the same SPI bus. The CSB pin can be pulled high after the
command is sent or after the end of the command execution (for example end of conversion). The best noise
performance from the module is obtained when the SPI bus is idle and without communication to other devices
during the ADC conversion.

000056111624 ECN1742 5/20
2
I C MODE
The external microcontroller clocks in the data through the input SCLK (Serial CLocK) and SDA (Serial DAta).
2
The sensor responds on the same pin SDA which is bidirectional for the I C bus interface. So this interface type
uses only 2 signal lines and does not require a chip select, which can be favorable to reduce board space. In
2 2
I C-Mode the complement of the pin CSB (Chip Select) represents the LSB of the I C address. It is possible to
2
use two sensors with two different addresses on the I C bus. The pin CSB shall be connected to VDD or GND
(do not leave unconnected!).
COMMANDS
The MS5611-01BA has only five basic commands:
1. Reset
2. Read PROM (128 bit of calibration words)
3. D1 conversion
4. D2 conversion
5. Read ADC result (24 bit pressure / temperature)

000056111624 ECN1742 6/20
PRESSURE AND TEMPERATURE CALCULATION
Start
Maximum values for calculation results:
PMIN = 10mbar PMAX = 1200mbar
TMIN = -40°C TMAX = 85°C TREF = 20°C
Convert
Readcalibration datadata
calibration into coefficients (see bit pattern
(factory calibrated) from of W1 to W4)
PROM
Recommended Size [1] Value Example /

Variable Description | Equation
variable type [bit] min max Typical
C1 Pressure sensitivity | SENST1 unsigned int 16 16 0 65535 40127

C2 Pressure offset | OFFT1 unsigned int 16 16 0 65535 36924
C3 Temperature coefficient of pressure sensitivity | TCS unsigned int 16 16 0 65535 23317
C4 Temperature coefficient of pressure offset | TCO unsigned int 16 16 0 65535 23282
C5 Reference temperature | TREF unsigned int 16 16 0 65535 33464
C6 Temperature coefficient of the temperature | TEMPSENS unsigned int 16 16 0 65535 28312
Read
Read digitalpressure
digital pressure and
and temperature
temperaturedata
data
D1 Digital pressure value unsigned int 32 24 0 16777216 9085466

D2 Digital temperature value unsigned int 32 24 0 16777216 8569150
Calculate temperature
Difference between actual and reference temperature [2]

dT signed int 32 25 -16776960 16777216 2366
dT = D2 - TREF = D2 - C5 * 2 8
Actual temperature (-40…85°C with 0.01°C resolution) 2007
TEMP signed int 32 41 -4000 8500
TEMP = 20°C + dT * TEMPSENS = 2000 + dT * C6 / 223 = 20.07 °C
Calculate
Calculate temperature compensated
temperature compensated pressure
pressure
Offset at actual temperature [3]

OFF signed int 64 41 -8589672450 12884705280 2420281617
OFF = OFFT1 + TCO * dT = C2 * 216 + (C4 * dT ) / 27
Sensitivity at actual temperature [4]

SENS signed int 64 41 -4294836225 6442352640 1315097036
SENS = SENST1 + TCS * dT = C1 * 2 15 + (C3 * dT ) / 28
Temperature compensated pressure (10…1200mbar with 100009
P 0.01mbar resolution) signed int 32 58 1000 120000
P = D1 * SENS - OFF = (D1 * SENS / 2 21 - OFF) / 2 15 = 1000.09 mbar
Display pressure and temperature value
Notes
[1] Maximal size of intermediate result during evaluation of variable
[2] min and max have to be defined
Figure 2: Flow chart for pressure and temperature reading and software compensation.

000056111624 ECN1742 7/20
SECOND ORDER TEMPERATURE COMPENSATION
Yes No
TEMP<20°C
Low temperature
Low temperature High temperature
2 31
T2 = dT / 2 T2 = 0
OFF2 = 5 ⋅ (TEMP – 2000) / 2
2 1
OFF2 = 0
SENS2 = 5 ⋅ (TEMP – 2000)2/ 22 SENS2 = 0
Yes No
TEMP<-15°C
Low temperature
Very low temperature
OFF2 = OFF2 + 7 ⋅ (TEMP + 1500)2
SENS2 = SENS2 + 11 ⋅ (TEMP + 1500) / 2
2 1
Calculate pressure and temperature
TEMP = TEMP - T2
OFF = OFF - OFF2
SENS = SENS - SENS2
Figure 3: Flow chart for pressure and temperature to the optimum accuracy.

000056111624 ECN1742 8/20
SPI INTERFACE
COMMANDS
Size of each command is 1 byte (8 bits) as described in the table below. After ADC read commands the device
will return 24 bit result and after the PROM read 16bit result. The address of the PROM is embedded inside of
the PROM read command using the a2, a1 and a0 bits.
Command byte hex value

Bit number 0 1 2 3 4 5 6 7
Bit name PR COV - Typ Ad2/ Ad1/ Ad0/ Stop
M Os2 Os1 Os0
Command
Reset 0 0 0 1 1 1 1 0 0x1E
Convert D1 (OSR=256) 0 1 0 0 0 0 0 0 0x40
Convert D1 (OSR=512) 0 1 0 0 0 0 1 0 0x42
Convert D1 (OSR=1024) 0 1 0 0 0 1 0 0 0x44
Convert D1 (OSR=2048) 0 1 0 0 0 1 1 0 0x46
Convert D1 (OSR=4096) 0 1 0 0 1 0 0 0 0x48
Convert D2 (OSR=256) 0 1 0 1 0 0 0 0 0x50
Convert D2 (OSR=512) 0 1 0 1 0 0 1 0 0x52
Convert D2 (OSR=1024) 0 1 0 1 0 1 0 0 0x54
Convert D2 (OSR=2048) 0 1 0 1 0 1 1 0 0x56
Convert D2 (OSR=4096) 0 1 0 1 1 0 0 0 0x58
ADC Read 0 0 0 0 0 0 0 0 0x00
PROM Read 1 0 1 0 Ad2 Ad1 Ad0 0 0xA0 to
0xAE
Figure 4: Command structure
RESET SEQUENCE
The Reset sequence shall be sent once after power-on to make sure that the calibration PROM gets loaded into
the internal register. It can be also used to reset the device ROM from an unknown condition
Figure 5: Reset command sequence SPI mode 0

000056111624 ECN1742 9/20
0 1 2 3 4 5 6 7
SCLK
CSB
SDI
2.8ms RELOAD
SDO
PS
Figure 6: Reset command sequence SPI mode 3
CONVERSION SEQUENCE
The conversion command is used to initiate uncompensated pressure (D1) or uncompensated temperature (D2)
conversion. The chip select can be disabled during this time to communicate with other devices.
After the conversion, using ADC read command the result is clocked out with the MSB first. If the conversion is
not executed before the ADC read command, or the ADC read command is repeated, it will give 0 as the output
result. If the ADC read command is sent during conversion the result will be 0, the conversion will not stop and
the final result will be wrong. Conversion sequence sent during the already started conversion process will yield
incorrect result as well.
0 1 2 3 4 5 6 7
SCLK
CSB
SDI
8.22ms ADC CONVERSION
SDO
PS
Figure 7: Conversion out sequence, Typ=d1, OSR = 4096
Figure 8: ADC Read sequence
PROM READ SEQUENCE

The read command for PROM shall be executed once after reset by the user to read the content of the
calibration PROM and to calculate the calibration coefficients. There are in total 8 addresses resulting in a total
memory of 128 bit. Address 0 contains factory data and the setup, addresses 1-6 calibration coefficients and
address 7 contains the serial code and CRC. The command sequence is 8 bits long with a 16 bit result which is
clocked with the MSB first.

000056111624 ECN1742 10/20
Figure 9: PROM Read sequence, address = 011 (Coefficient 3).
I2C INTERFACE
COMMANDS
2
Each I C communication message starts with the start condition and it is ended with the stop condition. The
MS5611-01BA address is 111011Cx, where C is the complementary value of the pin CSB. Since the IC does
2
not have a microcontroller inside, the commands for I C and SPI are quite similar.
RESET SEQUENCE
The reset can be sent at any time. In the event that there is not a successful power on reset this may be caused
by the SDA being blocked by the module in the acknowledge state. The only way to get the MS5611-01BA to
function is to send several SCLKs followed by a reset sequence or to repeat power on reset.
1 1 1 0 1 1 CSB 0 0 0 0 0 1 1 1 1 0 0
Device Address command
S Device Address W A cmd byte A P
From Master S = Start Condition W = Write A = Acknowledge

From Slave P = Stop Condition R = Read N = Not Acknowledge
2
Figure 10: I C Reset Command
PROM READ SEQUENCE

The PROM Read command consists of two parts. First command sets up the system into PROM read mode.
The second part gets the data from the system.
2
Figure 11: I C Command to read memory address= 011 (Coefficient 3)
1 1 1 0 1 1 CSB 1 0 1 1 0 0 X X X X 0 X X X X X X X X 0
Device Address data data
S Device Address R A Memory bit 15 - 8 A Memory bit 7 - 0 N P

2
Figure 12: I C answer from MS5611-01BA

000056111624 ECN1742 11/20
CONVERSION SEQUENCE
A conversion can be started by sending the command to MS5611-01BA. When command is sent to the system
it stays busy until conversion is done. When conversion is finished the data can be accessed by sending a Read
command, when an acknowledge appears from the MS5611-01BA, 24 SCLK cycles may be sent to receive all
result bits. Every 8 bit the system waits for an acknowledge signal.
1 1 1 0 1 1 CSB 0 0 0 1 0 0 1 0 0 0 0

2
Figure 13: I C Command to initiate a pressure conversion (OSR=4096, typ=D1)
1 1 1 0 1 1 CSB 0 0 0 0 0 0 0 0 0 0 0

2
Figure 14: I C ADC read sequence
1 1 1 0 1 1 CSB 1 0 X X X X X X X X 0 X X X X X X X X 0 X X X X X X X X 0
Device Address data data data
S Device Address R A Data 23-16 A Data 8 - 15 A Data 7 - 0 N P

2
Figure 15: I C answer from MS5611-01BA
CYCLIC REDUNDANCY CHECK (CRC)

MS5611-01BA contains a PROM memory with 128-Bit. A 4-bit CRC has been implemented to check the data
validity in memory. The application note AN520 describes in detail CRC-4 code used.
A D D D D D D
D D D D D D D D D D
B B B B B B
d 1 1 1 1 1 1
B B B B B B B B B B
d 9 8 7 6 5 4 3 2 1 0
5 4 3 2 1 0
0 16 bit reserved for manufacturer
1 Coefficient 1 (16 bit unsigned)
7 CRC
Figure 16: Memory PROM mapping

000056111624 ECN1742 12/20
APPLICATION CIRCUIT
The MS5611-01BA is a circuit that can be used in conjunction with a microcontroller in mobile altimeter
applications. It is designed for low-voltage systems with a supply voltage of 3 V.
MS5611-01BA
MS5611-01BA
2
Figure 17: Typical application circuit with SPI / I C protocol communication

000056111624 ECN1742 13/20
PIN CONFIGURATION
Pin Name Type Function

1 VDD P Positive supply voltage
Protocol select
2
2 PS I PS high (VDD)  I C
PS low (GND)  SPI
3 GND G Ground
4 Chip select (active low),
CSB I
5 internal connection
6 SDO O Serial data output
SDI / Serial data input /
7 I / IO 2
SDA I C data IO
8 SCLK I Serial data clock
DEVICE PACKAGE OUTLINE
Figure 18: MS5611-01BA03 package outline

000056111624 ECN1742 14/20
RECOMMENDED PAD LAYOUT
Pad layout for bottom side of the MS5611-01BA soldered onto printed circuit board.
Reserved area:
Please do not route
tracks between pads
SHIPPING PACKAGE

000056111624 ECN1742 15/20
MOUNTING AND ASSEMBLY CONSIDERATIONS
SOLDERING
Please refer to the application note AN808 available on our website for all soldering issues.
MOUNTING
The MS5611-01BA can be placed with automatic Pick & Place equipment using vacuum nozzles. It will not be
damaged by the vacuum. Due to the low stress assembly the sensor does not show pressure hysteresis effects.
It is important to solder all contact pads.
CONNECTION TO PCB
The package outline of the module allows the use of a flexible PCB for interconnection. This can be important
for applications in watches and other special devices.
CLEANING
The MS5611-01BA has been manufactured under cleanroom conditions. It is therefore recommended to
assemble the sensor under class 10’000 or better conditions. Should this not be possible, it is recommended to
protect the sensor opening during assembly from entering particles and dust. To avoid cleaning of the PCB,
solder paste of type “no-clean” shall be used. Cleaning might damage the sensor!
ESD PRECAUTIONS
The electrical contact pads are protected against ESD up to 4 kV HBM (human body model). It is therefore
essential to ground machines and personnel properly during assembly and handling of the device. The
MS5611-01BA is shipped in antistatic transport boxes. Any test adapters or production transport boxes used
during the assembly of the sensor shall be of an equivalent antistatic material.
DECOUPLING CAPACITOR
Particular care must be taken when connecting the device to the power supply. A 100 nF ceramic capacitor
must be placed as close as possible to the MS5611-01BA VDD pin. This capacitor will stabilize the power
supply during data conversion and thus, provide the highest possible accuracy.

000056111624 ECN1742 16/20
TYPICAL PERFORMANCE CHARACTERISTICS
ADC-value D1 vs Pressure (typical)
10000000
9000000
8000000
ADC-value D1 (LSB)
7000000 -40°C
20°C
85°C
6000000
5000000
4000000
3000000
0 100 200 300 400 500 600 700 800 900 1000 1100
Pressure (mbar)
ADC-value D2 vs Temperature (typical)
12000000
11000000
10000000
9000000
ADC-value D2 (LSB)
8000000
7000000
6000000
5000000
4000000
-40 -20 0 20 40 60 80 100 120
Temperature (°C)

000056111624 ECN1742 17/20
TYPICAL PERFORMANCE CHARACTERISTICS (CONTINUED)

Absolute Pressure Accuracy after Calibration, 2nd order compensation
1.5
85°C
60°C
1 20°C
0°C
-40°C
85°C(85°C)
Pressure error (mbar)
0.5 Poly.
60°C(60°C)
Poly.
20°C(20°C)
Poly.
0 0°C (0°C)
Poly.
300 400 500 600 700 800 900 1000 1100 -40°C
Poly. (-40°C)
-0.5
-1
-1.5
-2
Pressure (mbar)
Pressure Error Accuracy vs temperature (typical)
28
26
24
22
20
18
Pressure error (mbar)
16
Perror(1000,1st order)
14 Perror(1000,2nd order)
12 Perror(800,1st order)
Perror(800,2nd order)
10
Perror(450,1st order)
8
Perror(450,2nd order)
6
-2
-4
-40 -20 0 20 40 60 80
Temperature (°C)
Temperature Error Accuracy vs temperature (typical)
15
10
Temperature error (°C)
Temperature error (standard

calculation)
Temperature error (with 2nd

5 order calculation)
-5
-40 -20 0 20 40 60 80 100 120
Temperature (°C)
000056111624 ECN1742 18/20
TYPICAL PERFORMANCE CHARACTERISTICS (CONTINUED)

000056111624 ECN1742 19/20
ORDERING INFORMATION
Product Code Product Art. No Delivery Form

Barometric Pressure Sensor
MS5611-01BA03 MS561101BA03-00 Waffle pack
Thin Metal Cap
Barometric Pressure Sensor
MS5611-01BA03 MS561101BA03-50 Tape and reel
Thin Metal Cap
FACTORY CONTACTS
NORTH AMERICA EUROPE ASIA

Measurement Specialties (China), Ltd.
Measurement Specialties MEAS Switzerland Sàrl No. 26 Langshan Road
45738 Northport Loop West Ch. Chapons-des-Prés 11 Shenzhen High-Tech Park (North)
Fremont, CA 94538 CH-2022 Bevaix Nanshan District, Shenzhen, 518057
China
Tel: +1 800 767 1888 Tel: +41 32 847 9550 Tel: +86 755 3330 5088
Fax: +1 510 498 1578 Fax: + 41 32 847 9569 Fax: +86 755 3330 5099
e-mail: pfg.cs.amerameas-spec.com e-mail: sales.chameas-spec.com e-mail: pfg.cs.asiaameas-spec.com
Website: www.meas-spec.com Website: www.meas-spec.com Website: www.meas-spec.com
The information in this sheet has been carefully reviewed and is believed to be accurate; however, no responsibility is assumed for
inaccuracies. Furthermore, this information does not convey to the purchaser of such devices any license under the patent rights to the
manufacturer. Measurement Specialties, Inc. reserves the right to make changes without further notice to any product herein. Measurement
Specialties, Inc. makes no warranty, representation or guarantee regarding the suitability of its product for any particular purpose, nor does
Measurement Specialties, Inc. assume any liability arising out of the application or use of any product or circuit and specifically disclaims
any and all liability, including without limitation consequential or incidental damages. Typical parameters can and do vary in different
applications. All operating parameters must be validated for each customer application by customer’s technical experts. Measurement
Specialties, Inc. does not convey any license under its patent rights nor the rights of others.

000056111624 ECN1742 20/20

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MS5611-01BA03 Barometric Pressure Sensor, with stainless steel cap

• High resolution module, 10 cm

FIELD OF APPLICATION TECHNICAL DATA

PGA ADC dig. SDO Temperature Min Typ Max Unit

Range -40 +85 °C

DA5611-01BA03_011 www.meas-spec.com Oct. 26, 2012

ABSOLUTE MAXIMUM RATINGS

ANALOG DIGITAL CONVERTER (ADC)

DA5611-01BA03_011 www.meas-spec.com Oct. 26, 2012

PERFORMANCE SPECIFICATIONS (CONTINUED)

PRESSURE OUTPUT CHARACTERISTICS (V DD = 3 V, T = 25°C UNLESS OTHERWISE NOTED)

TEMPERATURE OUTPUT CHARACTERISTICS (V DD = 3 V, T = 25°C UNLESS OTHERWISE NOTED)

DA5611-01BA03_011 www.meas-spec.com Oct. 26, 2012

PERFORMANCE SPECIFICATIONS (CONTINUED)

DA5611-01BA03_011 www.meas-spec.com Oct. 26, 2012

Figure 1: Block diagram of MS5611-01BA

Pin PS Mode Pins used

DA5611-01BA03_011 www.meas-spec.com Oct. 26, 2012

DA5611-01BA03_011 www.meas-spec.com Oct. 26, 2012

PRESSURE AND TEMPERATURE CALCULATION

Recommended Size [1] Value Example /

C1 Pressure sensitivity | SENST1 unsigned int 16 16 0 65535 40127

D1 Digital pressure value unsigned int 32 24 0 16777216 9085466

Difference between actual and reference temperature [2]

Offset at actual temperature [3]

Sensitivity at actual temperature [4]

Display pressure and temperature value

DA5611-01BA03_011 www.meas-spec.com Oct. 26, 2012

SECOND ORDER TEMPERATURE COMPENSATION

Calculate pressure and temperature

DA5611-01BA03_011 www.meas-spec.com Oct. 26, 2012

Command byte hex value

Figure 4: Command structure

Figure 5: Reset command sequence SPI mode 0

DA5611-01BA03_011 www.meas-spec.com Oct. 26, 2012

Figure 6: Reset command sequence SPI mode 3

Figure 8: ADC Read sequence

PROM READ SEQUENCE

DA5611-01BA03_011 www.meas-spec.com Oct. 26, 2012

Figure 9: PROM Read sequence, address = 011 (Coefficient 3).

From Master S = Start Condition W = Write A = Acknowledge

PROM READ SEQUENCE

From Master S = Start Condition W = Write A = Acknowledge

DA5611-01BA03_011 www.meas-spec.com Oct. 26, 2012

From Master S = Start Condition W = Write A = Acknowledge

From Master S = Start Condition W = Write A = Acknowledge

From Master S = Start Condition W = Write A = Acknowledge

CYCLIC REDUNDANCY CHECK (CRC)

Figure 16: Memory PROM mapping

DA5611-01BA03_011 www.meas-spec.com Oct. 26, 2012

DA5611-01BA03_011 www.meas-spec.com Oct. 26, 2012

Pin Name Type Function

DEVICE PACKAGE OUTLINE

Figure 18: MS5611-01BA03 package outline

DA5611-01BA03_011 www.meas-spec.com Oct. 26, 2012

RECOMMENDED PAD LAYOUT

DA5611-01BA03_011 www.meas-spec.com Oct. 26, 2012

MOUNTING AND ASSEMBLY CONSIDERATIONS

DA5611-01BA03_011 www.meas-spec.com Oct. 26, 2012