LabInstr EE221L Lab5
LabInstr EE221L Lab5
LabInstr EE221L Lab5
OBJECTIVE
To learn how to solder circuits on Printed Circuit Board (PCB).
WARNINGS!!!
This lab involves hot soldering irons and components. USE EXTREME CAUTION!!!
a) This is a general procedure for performance typical soldering or de-soldering operations.
It does not apply to specialized soldering processes or equipment.
b) Many solders used in laboratories may contain lead. DO NOT breathe fumes generated
while soldering.
c) Beware of hot soldering irons and components. Make sure others are aware of hot tools.
d) Be aware of the location of your soldering iron or iron while it is hot, or cooling. Make
sure you place the hot iron in an appropriate holder to prevent heat or fire damage.
e) Switch off and/or unplug soldering tools when not in use. g. Allow soldering tool to cool
before storing.
f) Wash your hands after using solder and soldering tools.
BACKGROUND
Properties of Solder:
Solder used for electronics is a metal alloy, made by combining tin and lead in different
proportions. You can usually find these proportions marked on the various types of solders.
With most tin/lead solder combinations, melting does not take place all at once. Fifty-fifty
solder begins to melt at 183 C (361 F), but it is not fully melted until the temperature reaches 216 C
(420 F). Between these two temperatures, the solder exists in a plastic or semi-liquid state.
The plastic range of a solder varies, depending upon the ratio of tin to lead. With 60/40 solder,
the range is much smaller than it is for 50/50 solder. The 63/37 ratio, known as eutectic solder has
practically no plastic range, and melts almost instantly at 183 C (361 F).
Flux
Reliable solder connections can only be accomplished with truly cleaned surfaces. Solvents
can be used to clean the surfaces prior to soldering but are insufficient due to the extremely rapid
rate at which oxides form on the surface of heated metals. To overcome this oxide film, it becomes
necessary in electronic soldering to use materials called fluxes. Fluxes consist of natural or
synthetic rosins and sometimes-chemical additives called activators to remove oxides and keep
them removed during the soldering operation. The flux action is very corrosive at solder melt
temperatures and accounts for removing metal oxides. In its unheated state, however, rosin flux is
non-corrosive and non-conductive and thus will not affect the circuitry.
Controlling Heat
Although controlling soldering iron tip temperature is not the key element in soldering, the
advised soldering iron tip temperature is in range of 650 ~ 750 F. More importantly, the key
element is controlling the heat cycle of the work, i.e. how fast the work gets hot, how hot it gets,
and how long it stays hot is the element to control for reliable solder connections.
Thermal Mass
Each joint, has its own particular thermal mass, and how this combined mass compares with
the mass of the iron tip determines the time and temperature rise of the work.
Surface Condition
A second factor of importance when soldering is the surface condition. If there are any oxides
or other contaminants covering the pads or leads, there will be a barrier to the flow of heat. Even
though the iron tip is the right size and temperature, it may not be able to supply enough heat to
the joint to melt the solder.
Thermal Linkage
This is the area of contact between the iron tip and the work. Figure 2 shows a view of a
soldering iron tip soldering a component lead. Heat is transferred through the small contact area
between the soldering iron tip and pad. The thermal linkage area is small.
Figure 2: Minimal thermal linkage due to Figure 3: A solder bridge provides thermal
insufficient solder between the pad and linkage to transfer heat into the pad and
soldering iron tip. component lead.
Figure 3 also shows a view of a soldering iron tip soldering a component lead. In this case, the
contact area is greatly increased by having a small amount of solder at the point of contact. The
tip is also in contact with both the pad and component further improving the thermal linkage. This
solder bridge provides thermal linkage and assures the rapid transfer of heat into the work.
Re-soldering
Care should be taken to avoid the need for re-soldering. When re-soldering is required, quality
standards for the re-soldered connection should be the same as for the original connection.
Workmanship
Solder joints should have a smooth appearance. A satin luster is permissible. The joints should
be free from scratches, sharp edges, grittiness, looseness, blistering, or other evidence of poor
workmanship. Probe marks from test pins are acceptable providing that they do not affect the
integrity of the solder joint.
An acceptable solder connection should indicate evidence of wetting and adherence when the
solder blends to the soldered surface. The solder should form a small contact angle; this indicates
the presence of a metallurgical bond and metallic continuity from solder to surface. (See Figure 4).
Figure 4: Solder blends to the soldered surface, forming a small contact angle.
LAB DELIVERIES
PRELAB:
LAB EXPERIMENTS:
2. Preparing Workpiece.
a. Clamp work securely while performing soldering or de-soldering. Use a vise, a helping hand
or other approved clamping systems to keep your hands free to work.
b. Use heat sinks to protect thermally-sensitive circuit components.
c. When soldering wire connections, make sure the wires are tightly connected. Use appropriate
covering like heat shrink tubing or twist-on connectors to protect the splice. Do not use wires
with melted insulation or exposed conductors.
5. Soldering
a. Hold the soldering iron like a pen, near the base of the handle.
b. Touch the soldering iron onto the joint to be made. b. Make sure it touches both the component
lead and the track. Hold the tip there for a few seconds to heat the joint.
c. Unroll the solder and bring the end to the joint to be soldered near the soldering iron tip. The
solder should melt and smoothly flow onto the components to be soldered (component lead,
pcb trace, etc). Be sure to apply the solder to the joint, not the iron.
d. Remove the solder, then the iron, while keeping the joint still. Allow the joint a few seconds to
cool before you move the circuit board.
e. Inspect the joint closely. Be sure that the solder joint is good, as described below.
f. Solder joints may be cleaned after they have cooled using isopropyl alcohol and a Q-tip or
similar cotton swab.
7. De-soldering
De-soldering is done to remove components that have been soldered together. Two common forms
of de-soldering are done through the use of a vacuum plunger device (solder sucker) or by applying
a braided wick to the joint that pulls solder away through capillary action.
POSTLAB REPORT:
I appreciate the help from faculty members and TAs during the composing of this instruction
manual. I would also thank students who provide valuable feedback so that we can offer better
higher education to the students.