74HC166

74HC166; 74HCT166
8-bit parallel-in/serial out shift register

Rev. 4 — 28 December 2015 Product data sheet
1. General description
The 74HC166; 74HCT166 is an 8-bit serial or parallel-in/serial-out shift register. The
device features a serial data input (DS), eight parallel data inputs (D0 to D7) and a serial
output (Q7). When the parallel enable input (PE) is LOW, the data from D0 to D7 is loaded
into the shift register on the next LOW-to-HIGH transition of the clock input (CP). When
PE is HIGH, data enters the register serially at DS with each LOW-to-HIGH transition of
CP. When the clock enable input (CE) is LOW data is shifted on the LOW-to-HIGH
transitions of CP. A HIGH on CE disables the CP input. Inputs include clamp diodes which
enable the use of current limiting resistors to interface inputs to voltages in excess of VCC.
2. Features and benefits

 Synchronous parallel-to-serial applications
 Synchronous serial input for easy expansion
 Complies with JEDEC standard no. 7A
 Input levels:
 For 74HC166: CMOS level
 For 74HCT166: TTL level
 ESD protection:
 HBM JESD22-A114F exceeds 2000 V
 MM JESD22-A115-A exceeds 200 V
 Multiple package options
 Specified from 40 C to +85 C and from 40 C to +125 C
3. Ordering information
Table 1. Ordering information
Type number Package
Temperature range Name Description Version
74HC166D 40 C to +125 C SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
74HCT166D
74HC166DB 40 C to +125 C SSOP16 plastic shrink small outline package; 16 leads; body width SOT338-1
74HCT166DB 5.3 mm
74HC166PW 40 C to +125 C TSSOP16 plastic thin shrink small outline package; 16 leads; body SOT403-1
width 4.4 mm
NXP Semiconductors 74HC166; 74HCT166
4. Functional diagram

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74HC_HCT166 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 4 — 28 December 2015 2 of 20

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Product data sheet
74HC_HCT166
NXP Semiconductors
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All information provided in this document is subject to legal disclaimers.
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Rev. 4 — 28 December 2015
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74HC166; 74HCT166
Fig 4. Logic diagram
© NXP Semiconductors N.V. 2015. All rights reserved.
3 of 20
5. Pinning information
5.1 Pinning
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Fig 5. Pin configuration SO16 and (T)SSOP16
5.2 Pin description

Table 2. Pin description
Symbol Pin Description
DS 1 serial data input
D0 to D7 2, 3, 4, 5, 10, 11, 12, 14 parallel data inputs
CE 6 clock enable input (active LOW)
CP 7 clock input (LOW-to-HIGH edge-triggered)
GND 8 ground (0 V)
MR 9 asynchronous master reset (active LOW)
Q7 13 serial output from the last stage
PE 15 parallel enable input (active LOW)
VCC 16 positive supply voltage

6. Functional description
Table 3. Function table[1]
Operating modes Inputs Qn registers Output
PE CE CP DS D0 to D7 Q0 Q1 to Q6 Q7
parallel load I I  X I L L to L L
I I  X h H H to H H
serial shift h I  l X L q0 to q5 q6
h I  h X H q0 to q5 q6
hold “do nothing” X H X X X q0 q1 to q6 q7
[1] H = HIGH voltage level;

h = HIGH voltage level one set-up time prior to the LOW-to-HIGH clock transition;
L = LOW voltage level;
l = LOW voltage level one set-up time prior to the LOW-to-HIGH clock transition;
q = state of the referenced output one set-up time prior to the LOW-to-HIGH clock transition;
X = don’t care;
 = LOW-to-HIGH clock transition.
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Fig 6. Typical clear, shift, load, inhibit, and shift sequences

7. Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V)
Symbol Parameter Conditions Min Max Unit
VCC supply voltage 0.5 +7 V
IIK input clamping current VI < 0.5 V or VI > VCC + 0.5 V [1] - 20 mA
IOK output clamping current VO < 0.5 V or VO > VCC + 0.5 V [1] - 20 mA
IO output current 0.5 V < VO < VCC + 0.5 V - 25 mA
ICC supply current - 50 mA
IGND ground current 50 - mA
Tstg storage temperature 65 +150 C
Ptot total power dissipation Tamb = 40 C to +125 C
SO16 package [2] - 500 mW
(T)SSOP16 package [3] - 500 mW
[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2] Ptot derates linearly with 8 mW/K above 70 C.
[3] Ptot derates linearly with 5.5 mW/K above 60 C.
8. Recommended operating conditions

Table 5. Recommended operating conditions
Voltages are referenced to GND (ground = 0 V)
Symbol Parameter Conditions 74HC166 74HCT166 Unit
Min Typ Max Min Typ Max
VCC supply voltage 2.0 5.0 6.0 4.5 5.0 5.5 V
VI input voltage 0 - VCC 0 - VCC V
VO output voltage 0 - VCC 0 - VCC V
Tamb ambient temperature 40 - +125 40 - +125 C
t/V input transition rise and fall rate VCC = 2.0 V - - 625 - - - ns/V
VCC = 4.5 V - 1.67 139 - 1.67 139 ns/V
VCC = 6.0 V - - 83 - - - ns/V

9. Static characteristics
Table 6. Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions 25 C 40 C to +85 C 40 C to +125 C Unit
Min Typ Max Min Max Min Max
74HC166
VIH HIGH-level VCC = 2.0 V 1.5 1.2 - 1.5 - 1.5 - V
input voltage VCC = 4.5 V 3.15 2.4 - 3.15 - 3.15 - V
VCC = 6.0 V 4.2 3.2 - 4.2 - 4.2 - V
VIL LOW-level VCC = 2.0 V - 0.8 0.5 - 0.5 - 0.5 V
input voltage VCC = 4.5 V - 2.1 1.35 - 1.35 - 1.35 V
VCC = 6.0 V - 2.8 1.8 - 1.8 - 1.8 V
VOH HIGH-level VI = VIH or VIL
output voltage IO = 20 A; VCC = 2.0 V 1.9 2.0 - 1.9 - 1.9 - V
IO = 20 A; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V
IO = 20 A; VCC = 6.0 V 5.9 6.0 - 5.9 - 5.9 - V
IO = 4.0 mA; VCC = 4.5 V 3.98 4.32 - 3.84 - 3.7 - V
IO = 5.2 mA; VCC = 6.0 V 5.48 5.81 - 5.34 - 5.2 - V
VOL LOW-level VI = VIH or VIL
output voltage IO = 20 A; VCC = 2.0 V - 0 0.1 - 0.1 - 0.1 V
IO = 20 A; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V
IO = 20 A; VCC = 6.0 V - 0 0.1 - 0.1 - 0.1 V
IO = 4.0 mA; VCC = 4.5 V - 0.15 0.26 - 0.33 - 0.4 V
IO = 5.2 mA; VCC = 6.0 V - 0.16 0.26 - 0.33 - 0.4 V
II input leakage VI = VCC or GND; - - 0.1 - 1 - 1 A
current VCC = 6.0 V
ICC supply current VI = VCC or GND; IO = 0 A; - - 8.0 - 80 - 160 A
VCC = 6.0 V
CI input - 3.5 - - - - - pF
capacitance

Table 6. Static characteristics …continued

At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
74HCT166
VIH HIGH-level VCC = 4.5 V to 5.5 V 2.0 1.6 - 2.0 - 2.0 - V
input voltage
VIL LOW-level VCC = 4.5 V to 5.5 V - 1.2 0.8 - 0.8 - 0.8 V
input voltage
VOH HIGH-level VI = VIH or VIL; VCC = 4.5 V
output voltage IO = 20 A 4.4 4.5 - 4.4 - 4.4 - V
IO = 4.0 mA 3.98 4.32 - 3.84 - 3.7 - V
VOL LOW-level VI = VIH or VIL; VCC = 4.5 V
output voltage IO = 20 A; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V
IO = 5.2 mA; VCC = 4.5 V - 0.16 0.26 - 0.33 - 0.4 V
II input leakage VI = VCC or GND; - - 0.1 - 1 - 1 A
current VCC = 4.5 V
ICC supply current VI = VCC or GND; IO = 0 A; - - 8.0 - 80 - 160 A
VCC = 4.5 V
ICC additional per input pin;
supply current VI = VCC  2.1 V;
other inputs at VCC or GND;
VCC = 4.5 V to 5.5 V
Dn and DS inputs - 35 126 - 157.5 - 171.5 A
CP and CE inputs - 80 288 - 360 - 392 A
MR input - 40 144 - 180 - 196 A
PE input - 60 216 - 270 - 294 A
CI input - 3.5 - - - - - pF
capacitance

10. Dynamic characteristics

Table 7. Dynamic characteristics
GND (ground = 0 V); tr = tf = 6 ns: CL = 50 pF unless otherwise specified; for test circuit, see Figure 10
74HC166
tpd propagation CP to Q7; see Figure 7 [1]
delay VCC = 2.0 V - 50 150 - 190 - 225 ns

VCC = 4.5 V - 18 30 - 38 - 45 ns
VCC = 5.0 V; CL = 15 pF - 15 - - - - - ns
VCC = 6.0 V - 14 26 - 33 - 38 ns
MR to Q7; see Figure 8
VCC = 2.0 V - 47 160 - 200 - 240 ns
VCC = 4.5 V - 17 32 - 40 - 48 ns
VCC = 5.0 V; CL = 15 pF - 14 - - - - - ns
VCC = 6.0 V - 14 27 - 34 - 41 ns
tt transition output; see Figure 7 [2]
time VCC = 2.0 V - 19 75 - 95 - 110 ns

VCC = 4.5 V - 7 15 - 19 - 22 ns
VCC = 6.0 V - 6 13 - 16 - 19 ns
tW pulse width CP input HIGH or LOW;
see Figure 7
VCC = 2.0 V 80 17 - 100 - 120 - ns
VCC = 4.5 V 16 6 - 20 - 24 - ns
VCC = 6.0 V 14 5 - 17 - 20 - ns
MR input LOW; see Figure 8
VCC = 2.0 V 100 25 - 125 - 150 - ns
VCC = 4.5 V 20 9 - 25 - 30 - ns
VCC = 6.0 V 17 7 - 21 - 26 - ns
trec recovery time MR to CP; see Figure 8
VCC = 2.0 V 0 19 - 0 - 0 - ns
VCC = 4.5 V 0 7 - 0 - 0 - ns
VCC = 6.0 V 0 6 - 0 - 0 - ns
tsu set-up time Dn, CE to CP; see Figure 9
VCC = 2.0 V 80 14 - 100 - 120 - ns
VCC = 4.5 V 16 5 - 20 - 24 - ns
VCC = 6.0 V 14 4 - 17 - 20 - ns
PE to CP; see Figure 9
VCC = 2.0 V 100 33 - 125 - 150 - ns
VCC = 4.5 V 20 12 - 25 - 30 - ns
VCC = 6.0 V 17 10 - 21 - 26 - ns

Table 7. Dynamic characteristics …continued

th hold time Dn, CE to CP; see Figure 9
VCC = 2.0 V 2 8 - 2 - 2 - ns
VCC = 4.5 V 2 3 - 2 - 2 - ns
VCC = 6.0 V 2 2 - 2 - 2 - ns
VCC = 2.0 V 0 28 - 0 - 0 - ns
VCC = 4.5 V 0 10 - 0 - 0 - ns
VCC = 6.0 V 0 8 - 0 - 0 - ns
fmax maximum CP input; see Figure 7
frequency VCC = 2.0 V 6 19 - 4.8 - 4 - MHz
VCC = 4.5 V 30 57 - 24 - 20 - MHz
VCC = 5.0 V; CL = 15 pF - 63 - - - - - MHz
VCC = 6.0 V 35 68 - 28 - 24 - MHz
CPD power per package; [3] - 41 - - - - - pF
dissipation VI = GND to VCC
capacitance
74HCT166
tpd propagation CP to Q7; see Figure 7 [1]
delay VCC = 4.5 V - 23 40 - 50 - 60 ns

VCC = 5.0 V; CL = 15 pF - 20 - - - - - ns
MR to Q7; see Figure 8
VCC = 4.5 V - 22 40 - 50 - 60 ns
VCC = 5.0 V; CL = 15 pF - 19 - - - - - ns
tt transition output; see Figure 7 [2]
time VCC = 4.5 V - 7 15 - 19 - 22 ns

tW pulse width CP input HIGH or LOW;
see Figure 7
VCC = 4.5 V 20 9 - 25 - 30 - ns
MR input LOW; see Figure 8
VCC = 4.5 V 25 11 - 31 - 38 - ns
trec recovery time MR to CP; see Figure 8
VCC = 4.5 V 0 7 - 0 - 0 - ns
tsu set-up time Dn, CE to CP; see Figure 9
VCC = 4.5 V 16 8 - 20 - 24 - ns
VCC = 4.5 V 30 15 - 38 - 45 - ns
th hold time Dn, CE to CP; see Figure 9
VCC = 4.5 V 0 3 - 0 - 0 - ns
VCC = 4.5 V 0 13 - 0 - 0 - ns

Table 7. Dynamic characteristics …continued

fmax maximum CP input; see Figure 7
frequency VCC = 4.5 V 25 45 - 20 - 17 - MHz
VCC = 5.0 V; CL = 15 pF - 50 - - - - - MHz
CPD power per package; [3] - 41 - - - - - pF
dissipation VI = GND to VCC
capacitance
[1] tpd is the same as tPHL and tPLH.

[2] tt is the same as tTHL and tTLH.
[3] CPD is used to determine the dynamic power dissipation (PD in W).
PD = CPD  VCC2  fi + (CL  VCC2  fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
 (CL  VCC2  fo) = sum of outputs;
CL = output load capacitance in pF;
VCC = supply voltage in V.
11. Waveforms
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Measurement points are given in Table 8.

VOL and VOH are typical voltage output levels that occur with the output load.
Fig 7. Clock (CP) to output (Q7) propagation delays, pulse width, output transition times and maximum
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VOL and VOH are typical voltage output levels that occur with the output load.
Fig 8. Master reset (MR) pulse width, MR to output (Q7) propagation delay and MR to clock (CP) recovery time.
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The shaded areas indicate when the input is permitted to change for predictable output performance
(1) CE may change only from HIGH-to-LOW while CP is LOW
Fig 9. Set-up and hold times

Table 8. Measurement points

Type Input Output
VI VM VM
74HC166 VCC 0.5VCC 0.5VCC
74HCT166 3V 1.3 V 1.3 V
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Test data is given in Table 10.

Definitions for test circuit:
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
CL = Load capacitance including jig and probe capacitance.
RL = Load resistance.
S1 = Test selection switch
Fig 10. Test circuit for measuring switching times
Table 9. Test data

Type Input Load S1 position
VI tr, tf CL RL tPHL, tPLH
74HC166 VCC 6 ns 15 pF, 50 pF 1 k open
74HCT166 3V 6 ns 15 pF, 50 pF 1 k open

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Fig 13. Package outline SOT403-1 (TSSOP16)

13. Abbreviations
Table 10. Abbreviations
Acronym Description
CMOS Complementary Metal-Oxide Semiconductor
DUT Device Under Test
ESD ElectroStatic Discharge
HBM Human Body Model
MM Machine Model
TTL Transistor-Transistor Logic
14. Revision history

Table 11. Revision history
Document ID Release date Data sheet status Change notice Supersedes
74HC_HCT166 v.4 20151228 Product data sheet - 74HC_HCT166 v.3
Modifications: • Type numbers 74HC166N and 74HCT166N (SOT38-4) removed.
74HC_HCT166 v.3 20130911 Product data sheet - 74HC_HCT166_CNV v.2
Modifications: • The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
• Family data added, see Section 9 “Static characteristics”
74HC_HCT166_CNV v.2 December 1990 Product specification - -

15. Legal information
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Product [short] data sheet Production This document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
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responsibility for the content in this document if provided by an information the Absolute Maximum Ratings System of IEC 60134) will cause permanent
source outside of NXP Semiconductors. damage to the device. Limiting values are stress ratings only and (proper)
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In no event shall NXP Semiconductors be liable for any indirect, incidental,
the Recommended operating conditions section (if present) or the
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Characteristics sections of this document is not warranted. Constant or
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repeated exposure to limiting values will permanently and irreversibly affect
replacement of any products or rework charges) whether or not such
the quality and reliability of the device.
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory. Terms and conditions of commercial sale — NXP Semiconductors
Notwithstanding any damages that customer might incur for any reason products are sold subject to the general terms and conditions of commercial
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards sale, as published at http://www.nxp.com/profile/terms, unless otherwise
customer for the products described herein shall be limited in accordance agreed in a valid written individual agreement. In case an individual
with the Terms and conditions of commercial sale of NXP Semiconductors. agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
Right to make changes — NXP Semiconductors reserves the right to make applying the customer’s general terms and conditions with regard to the
changes to information published in this document, including without purchase of NXP Semiconductors products by customer.
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior No offer to sell or license — Nothing in this document may be interpreted or
to the publication hereof. construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein NXP Semiconductors’ specifications such use shall be solely at customer’s
may be subject to export control regulations. Export might require a prior own risk, and (c) customer fully indemnifies NXP Semiconductors for any
authorization from competent authorities. liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
Non-automotive qualified products — Unless this data sheet expressly
standard warranty and NXP Semiconductors’ product specifications.
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested Translations — A non-English (translated) version of a document is for
in accordance with automotive testing or application requirements. NXP reference only. The English version shall prevail in case of any discrepancy
Semiconductors accepts no liability for inclusion and/or use of between the translated and English versions.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer 15.4 Trademarks
(a) shall use the product without NXP Semiconductors’ warranty of the
Notice: All referenced brands, product names, service names and trademarks
product for such automotive applications, use and specifications, and (b)
are the property of their respective owners.
whenever customer uses the product for automotive applications beyond
16. Contact information

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]

17. Contents
1 General description . . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1
4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
6 Functional description . . . . . . . . . . . . . . . . . . . 5
7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6
8 Recommended operating conditions. . . . . . . . 6
9 Static characteristics. . . . . . . . . . . . . . . . . . . . . 7
10 Dynamic characteristics . . . . . . . . . . . . . . . . . . 9
11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14
13 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 17
14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 17
15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 18
15.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18
15.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
15.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
15.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19
16 Contact information. . . . . . . . . . . . . . . . . . . . . 19
17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2015. All rights reserved.

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 28 December 2015
Document identifier: 74HC_HCT166

74HC166

Uploaded by

74HC166

Uploaded by

74HC166; 74HCT166

8-bit parallel-in/serial out shift register

2. Features and benefits

Fig 1. Logic symbol Fig 2. IEC logic symbol

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Fig 3. Functional diagram

Product data sheet Rev. 4 — 28 December 2015 2 of 20

Fig 5. Pin configuration SO16 and (T)SSOP16

5.2 Pin description

Product data sheet Rev. 4 — 28 December 2015 4 of 20

[1] H = HIGH voltage level;

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Fig 6. Typical clear, shift, load, inhibit, and shift sequences

Product data sheet Rev. 4 — 28 December 2015 5 of 20

8. Recommended operating conditions

Product data sheet Rev. 4 — 28 December 2015 6 of 20

Product data sheet Rev. 4 — 28 December 2015 7 of 20

Table 6. Static characteristics …continued

Product data sheet Rev. 4 — 28 December 2015 8 of 20

10. Dynamic characteristics

delay VCC = 2.0 V - 50 150 - 190 - 225 ns

time VCC = 2.0 V - 19 75 - 95 - 110 ns

Product data sheet Rev. 4 — 28 December 2015 9 of 20

Table 7. Dynamic characteristics …continued

delay VCC = 4.5 V - 23 40 - 50 - 60 ns

time VCC = 4.5 V - 7 15 - 19 - 22 ns

Product data sheet Rev. 4 — 28 December 2015 10 of 20

Table 7. Dynamic characteristics …continued

[1] tpd is the same as tPHL and tPLH.

Measurement points are given in Table 8.

Product data sheet Rev. 4 — 28 December 2015 11 of 20

Measurement points are given in Table 8.

Product data sheet Rev. 4 — 28 December 2015 12 of 20

Table 8. Measurement points

Test data is given in Table 10.

Table 9. Test data

Product data sheet Rev. 4 — 28 December 2015 13 of 20

12. Package outline

287/,1( 5()(5(1&(6 (8523($1

Fig 11. Package outline SOT109-1 (SO16)

Product data sheet Rev. 4 — 28 December 2015 14 of 20

287/,1( 5()(5(1&(6 (8523($1

Fig 12. Package outline SOT338-1 (SSOP16)

Product data sheet Rev. 4 — 28 December 2015 15 of 20

287/,1( 5()(5(1&(6 (8523($1

Fig 13. Package outline SOT403-1 (TSSOP16)

Product data sheet Rev. 4 — 28 December 2015 16 of 20

14. Revision history

Product data sheet Rev. 4 — 28 December 2015 17 of 20

15. Legal information

15.1 Data sheet status

Product data sheet Rev. 4 — 28 December 2015 18 of 20

16. Contact information

Product data sheet Rev. 4 — 28 December 2015 19 of 20

© NXP Semiconductors N.V. 2015. All rights reserved.

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