INTRODUCTION Final
INTRODUCTION Final
INTRODUCTION Final
As the days pass on, people’s usage of wireless handheld devices is increasing along
with the requirement for high-speed networks, i.e., 5G wireless communication. With the
advent of new wireless technologies, there is a growing need for faster communication which
led to the proposal of 5G technology. 5G (Fifth Generation) has many advantages over the
current generations. The main advantage is that the 5G will provide the better speeds and
coverage than the 4G. And it also provides several thousands of simultaneous connections of
wireless sensors. There are some major technological break- troughs that will assist in the
development of 5G wireless networks which includes Millimeter wave spectrum, massive
MIMO, IOT, Big data and mobile cloud computing etc. Among these technologies,
millimeter wave frequencies have many advantages such as larger bandwidth to provide
higher transmission rate, immunity to interference and simple hardware structure 5G wireless
systems operate in the millimeter wave bands of 28, 38 and 60GHz. Data mobile traffic will
be increased by an order of about one thousand times as expected compared to what is
experienced today. To meet this dramatic traffic growth, the fifth Generation is being
deployed to fulfill exceedingly rapid growth and promising commercial deployment in the
next few years.
Since 2015, the International Telecommunication Union (ITU) has approved three
major scenarios for standardization: enhanced Mobile Broadband (eMBB), ultra Reliable Low
Latency Communication (uRLLC), and massive Machine Type Communications (mMTC).
Despite challenges like limited hardware resources and slow battery performance, 5G will
play a crucial role in enabling the Internet of Things (IoT) by connecting a vast number of
objects. Future smart devices will form local networks using various access methods,
allowing them to connect independently of a specific network infrastructure. With advantages
like better data rate, wider channel bandwidth, improved reliability, scalability, flexibility,
efficiency, and service coverage in crowded areas, 5G, utilizing millimeter-wave frequencies,
addresses the growing need for higher bandwidth and data transfer rates[2].
The microstrip patch antenna is chosen due to its simplicity, ease of fabrication, and
suitability for arrays. It falls under the category of single-element resonant antennas.
Microstrips are printed circuits that operate in the microwave range, specifically in the
gigahertz region of the electromagnetic spectrum. Created through the photolithographic
process, they enable designers to reduce the size, weight, and cost of components and systems
for low signal-level applications by replacing bulkier waveguide components and assemblies.
These low-profile antennas are utilized in high-performance aircraft, spacecraft, satellites, and
missile applications where constraints such as size, weight, cost, performance, ease of
installation, and aerodynamic profile are crucial. Microstrip antennas represent one of the
most advanced technologies in the field of antennas and electromagnetic applications, suitable
for a wide range of applications from simple to highly demanding[1].
The Patch Antenna is a design that consists of four main parts: the patch, ground plane,
substrate, and feeding part. It is classified as a single-element resonant antenna. Microstrips
are printed circuits that operate in the microwave range of the electromagnetic spectrum,
specifically in the gigahertz region. These circuits are created through the photolithographic
process, allowing designers to reduce the size, weight, and cost of components and systems
for low signal-level applications. They replace the bulkier waveguide components and
assemblies. The fabrication process is ideal for series production of circuits and antennas, as it
allows for easy combination of lumped circuit and active devices with transmission line
sections. Microstrip devices are planar components used in microwaves and high frequency
electronics. They can replace waveguides when the frequency or power level of signals
permits. At low frequencies, open structures are used, while at high frequencies, metal
enclosures are employed to prevent radiation. The patch, a thin radiating metal strip, is
located on one side of a thin non-conductive substrate. The ground plane, made of the same
metal, is located on the other side of the substrate. The metallic patch is typically made of thin
copper foil plated with a corrosion-resistant metal like gold, tin, or nickel. It serves to provide
proper spacing and mechanical support between the patch and its ground plane. It is often
used with high dielectric constant material to load the patch and reduce its size.[3].
The dielectric constant of 2.2 is utilized in the paper to enhance gain and facilitate
operation at the specified frequency. It can adjust the radiation pattern to match the desired
coverage area, electronically alter the radiation pattern through phase and amplitude control
of the signal to each element, boost transmission capacity by optimizing radio resources, and
reducing interference. While various substrates are available, most dielectric constants are
below 10GHz, except for Rogers’s substrate, making it the ideal choice for millimeter wave
applications. Rogers’s substrate is particularly well-suited for UHF due to its low dielectric
loss and dispersion, along with characteristics such as low water absorption, minimal electric
loss, and low moisture absorption[4].
ANSYS HFSS software is utilized for the design and simulation of antennas. HFSS is a
3-Dimensional EM software specifically designed for high-frequency electronic products
such as antenna arrays, antennas, RF or microwave components, IC packages, connectors,
filters, and printed circuit boards. The High Frequency Structure Simulator (HFSS) offers an
intuitive GUI and versatile solvers, providing exceptional performance and a comprehensive
understanding of all 3-Dimensional EM issues. HFSS enables a thorough analysis of
electronic devices, ensuring their structural and thermal reliability. In this project, we employ
a copper substrate with one side functioning as the ground and the other side as the radiator
patch. The use of copper as the material for both sides is essential. The primary objective of
this project is to analyze and design a microstrip antenna, which can enhance communication
reliability by achieving higher gain, canceling interference from specific directions,
electronically steering the radio beam in different directions, and facilitating radio direction
finding.