Ultra Soft Thermal Pad: Features Application
Ultra Soft Thermal Pad: Features Application
Ultra Soft Thermal Pad: Features Application
TG-A1250
Ultra Soft Thermal Pad
REACH Compliant RoHS Compliant UL Compliant 2
Features Application:
• High thermal conductivity Best for high power applications
• Low thermal impedance
• High compressibility Electronic Components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive,
• Good electrical insulation Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy
Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power
Electronics, Robot, Servers, Smart Home, Telecom, etc.
※For thicknesses less than 1.0mm, hardness will be adjusted to 50-75 Shore OO to facilitate effective removal of liner during production
※Different tolerances according to the selected thickness
※Die-cut for different shapes
Units 1-2 Cosford Business Park, Central Park, Lutterworth, Leicestershire, LE17 4QU, United Kingdom
T +44 (0)1455 553 510 E [email protected] W www.tglobaltechnology.com
NOTICE: The information contained herein is to the best of our knowledge true and accurate. Values stated in this technical data sheet represent typical values as not all tests are run on each lot of material
produced. All specifications are subject to change without notice. The protective film and release paper does not affect the function of the product. If there is no special requirement, the default depends on
T-Global. Since the varied conditions of potential use are beyond our control, all recommendations or suggestions are presented without guarantee or responsibility on our part and users should make their
own test to determine the suitability of our products in any specific situation. This product is sold without warranty either expressed or implied, of fitness for a particular purpose or otherwise, except that this
product shall be of standard quality, and except to the extent otherwise stated in T-Global Technology’s invoice, quotation, or order acknowledgment.
We disclaim any and all liabilities incurred in connection with the use of information contained herein, or otherwise. All risks of such are assumed by the user. Furthermore, nothing contained herein shall be
construed as a recommendation to use any process or to manufacture or to use any product in conflict with existing or future patents covering any product or material or its use.