615R Series

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Vishay Cera-Mite
High Voltage Ceramic DC Disc Capacitors
10 kVDC and 15 kVDC
FEATURES
• 20 kV rated voltage available on request
• Low losses
• High capacitance in small sizes
• High stability
• Radial leads
• Ceramic singlelayer capacitor
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
LINKS TO ADDITIONAL RESOURCES
APPLICATIONS
3D 3D • High voltage power supplies
3D Models
• DC and pulse high voltage
• X-ray equipment, baggage scanner, air purifier, ionizer
QUICK REFERENCE DATA
DESCRIPTION VALUE DESIGN
Ceramic Class 1 2 The capacitors consist of a ceramic disc of which both sides
Ceramic Dielectric T3M (N4700) X5F, Y5R, Y5U, Z5U are silver-plated. Connection leads are made of tinned
Voltage (VDC) 10 000 15 000 10 000 15 000 copper having diameters of 0.032" (0.81 mm).
Min. Capacitance (pF) 250 100 100 100 The capacitors may be supplied with straight leads having
Max. Capacitance (pF) 1000 750 3300 2500 lead spacing of 0.375" (9.5 mm), 0.500" (12.7 mm) or 0.750"
Mounting Radial (19.2 mm).
Coating is made of flame retardant epoxy resin in
INSULATION RESISTANCE accordance with “UL 94 V-0”.
Min. 1000 ΩF or 200 000 MΩ CAPACITANCE RANGE
TOLERANCE ON CAPACITANCE 100 pF to 3300 pF

± 20 % or + 80 % / - 20 % DIELECTRIC STRENGTH BETWEEN LEADS

10 kVDC 15 000 VDC, 2 s
DISSIPATION FACTOR
15 kVDC 24 000 VDC, 2 s
0.2 % max. at 1 kHz; 1 V (Class 1) (in dielectric fluid)
2.0 % max. at 1 kHz; 1 V (Class 2)
CERAMIC DIELECTRIC
CATEGORY TEMPERATURE RANGE T3M (Class 1)
-25 °C to +85 °C X5F, Y5R, Y5U, Z5U (Class 2)

CLIMATIC CATEGORY ACC. TO EN 60068-1

25 / 85 / 21

OPERATING TEMPERATURE RANGE

-25 °C to +105 °C (1)
Note
(1) For explanation about the difference of operating temperature
range and temperature characteristic of capacitance, please see
www.vishay.com/doc?48299

Revision: 25-Mar-2024 1 Document Number: 23119

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DIMENSIONS in inches (millimeters)

1.250 min. LO
(32)
D Tinned copper leads LS
max.
Ø

0.250 (6.4) T
max.

ORDERING INFORMATION, CERAMIC 10 kVDC

LS LO WIRE SIZE
C TOL. Dmax. Tmax. LEAD SPACE LEAD OFFSET ORDERING
DIAMETER THICKNESS
(pF) (%) INCH (mm) INCH (mm) INCH (mm) INCH (mm) AWG INCH (mm) CODE
± 0.040" (± 1 mm) ± 0.020" (± 0.5 mm)
T3M (N4700)
250 0.490 (12.4) 0.290 (7.4) 0.375 (9.5) 0.193 (4.9) 615R100GATT25
500 0.680 (17.3) 0.272 (6.9) 0.173 (4.4) 615R100GATT50
680 ± 20 0.750 (19.1) 0.181 (4.6) 20 0.032 (0.81) 615R100GATT68
0.300 (7.6) 0.500 (12.7)
820 0.810 (20.6) 0.181 (4.6) 615R100GATT82
1000 0.980 (24.9) 0.320 (8.1) 0.189 (4.8) 615R100GATD10
X5F
100 0.382 (9.7) 0.283 (7.2) 615R100GAT10
250 ± 20 0.680 (17.3) 0.300 (7.6) 0.500 (12.7) 0.201 (5.1) 20 0.032 (0.81) 615R100GAT25
500 0.345 (8.8) 0.248 (6.3) 615R100GAT50
Y5R
100 0.320 (8.1) 0.220 (5.6) 615R100GAST10
250 0.490 (12.4) 0.331 (8.4) 0.375 (9.5) 0.232 (5.9) 615R100GAST25
± 20 20 0.032 (0.81)
500 0.310 (7.9) 0.213 (5.4) 615R100GAST50
1000 0.750 (19.1) 0.320 (8.1) 0.500 (12.7) 0.220 (5.6) 615R100GAD10
Y5U
1000 + 80 / - 20 0.680 (17.3) 615R100GASD10
0.330 (8.4) 0.500 (12.7) 0.232 (5.9) 20 0.032 (0.81)
2500 ± 20 0.980 (24.9) 615R100GATD25
Z5U
2500 0.750 (19.1) 0.350 (8.9) 0.256 (6.5) 615R100GAD25
+ 80 / - 20 0.500 (12.7) 20 0.032 (0.81)
3300 0.980 (24.9) 0.390 (9.9) 0.303 (7.7) 615R100GAD33

ORDERING INFORMATION, CERAMIC 15 kVDC

LS LO WIRE SIZE
C TOL. Dmax. Tmax. LEAD SPACE LEAD OFFSET ORDERING
DIAMETER THICKNESS
(pF) (%) INCH (mm) INCH (mm) INCH (mm) INCH (mm) AWG INCH (mm) CODE
± 0.040" (± 1 mm) ± 0.020" (± 0.5 mm)
T3M (N4700)
100 0.490 (12.4) 0.470 (11.9) 0.500 (12.7) 0.370 (9.4) 615R150GATT10
250 0.670 (17.0) 0.460 (11.7) 0.362 (9.2) 615R150GATT25
390 ± 20 0.750 (19.1) 0.425 (10.8) 0.283 (7.2) 20 0.032 (0.81) 615R150GATT39
0.750 (19.1)
500 0.810 (20.6) 0.382 (9.7) 0.283 (7.2) 615R150GATT50
750 1.063 (27.0) 0.430 (10.9) 0.331 (8.4) 615R150GATT75
X5F
100 0.430 (10.9) 0.331 (8.4) 615R150GAT10
± 20 0.670 (17.0) 0.750 (19.1) 20 0.032 (0.81)
250 0.455 (11.6) 0.358 (9.1) 615R150GAT25
Y5R
100 0.449 (11.4) 0.350 (8.9) 615R150GAST10
0.490 (12.4) 0.500 (12.7)
250 0.480 (12.2) 0.382 (9.7) 615R150GAST25
± 20 20 0.032 (0.81)
500 0.670 (17.0) 0.450 (11.4) 0.331 (8.4) 615R150GAT50
0.750 (19.1)
1000 0.980 (24.9) 0.460 (11.7) 0.362 (9.2) 615R150GATD10
Y5U
500 0.490 (12.4) 0.375 (9.5) 0.500 (12.7) 0.276 (7.0) 615R150GAST50
+ 80 / - 20 20 0.032 (0.81)
1000 0.670 (17.0) 0.420 (10.7) 0.750 (19.1) 0.323 (8.2) 615R150GAD10
Z5U
2200 0.510 (13.0) 0.413 (10.5) 615R150GAD22
+ 80 / - 20 0.980 (24.9) 0.750 (19.1) 20 0.032 (0.81)
2500 0.450 (11.4) 0.350 (8.9) 615R150GAD25

Revision: 25-Mar-2024 2 Document Number: 23119

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CAPACITANCE CHANGE VS. TEMPERATURE (TYPICAL)
Axis Title Axis Title
50 10000 30 10000
Temperature dependence of the capacitance
40 N4700 25
20
Capacitance Change ΔC/C (%)

Capacitance Change ΔC/C (%)

30
20 15
1000 10 1000
10
5

2nd line

2nd line
1st line

1st line
2nd line

2nd line
0
0 Y5R
-10
-5
-20
100 -10 100
-30 -15
-40 -20
-50 -25
Temperature dependence of the capacitance
-60 10 -30 10
-55 -35 -15 5 25 45 65 85 105 125 -55 -35 -15 5 25 45 65 85 105 125
Temperature (°C) Temperature (°C)

Axis Title Axis Title

20 10000 60 10000
Temperature dependence of the capacitance
15 40
Capacitance Change ΔC/C (%)

Capacitance Change ΔC/C (%)

10 20
Y5U
1000 1000
5 0
X5F
2nd line

2nd line
1st line

1st line
2nd line

2nd line

0 -20

-5 -40
100 100
-10 -60

-15 -80
Temperature dependence of the capacitance
-20 10 -100 10
-55 -35 -15 5 25 45 65 85 105 125 -55 -35 -15 5 25 45 65 85 105 125
Temperature (°C) Temperature (°C)

Axis Title
60 10000
Temperature dependence of the capacitance
40
Capacitance Change ΔC/C (%)

Z5U
20
1000
0
2nd line
1st line
2nd line

-20

-40
100
-60

-80

-100 10
-15 5 25 45 65 85 105 125
Temperature (°C)

Revision: 25-Mar-2024 3 Document Number: 23119

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CAPACITANCE CHANGE VS. VOLTAGE (TYPICAL)
Axis Title
10 10000
0
Y5R / X5F

ΔC/C - Capacitance Change (%)

-10
-20
T3M (N4700)
1000
-30

2nd line
1st line
2nd line
-40 Y5U
-50
-60 Z5U
100
-70
-80
-90 ΔC/C = f (UR)
-100 10
0 10 20 30 40 50 60 70 80 90 100
UR - Rated Voltage (%)

1. QUALIFICATION
1.1 BASICS
All components are tested according to the related testing plan, which you find in series datasheet. We do not guarantee if any
limit is exceeded. Internal test procedures are more severe than noted in the table “Performance” because of aging and storage
effects of the components.

1.2 LIMITS OF APPLICATION

Please take care whilst designing our parts into one of these applications, which require highest reliability and possible errors
might harm life, body or property of a third party.
- Transportation (aerospace, aircraft, train, ship, submarine, etc.)
- Medical equipment
- Critical control equipment (power plant, traffic signals, disaster prevention)
- Other application requiring similar reliability characteristics

2. STORAGE
2.1 ORIGINAL PACKAGING
Storing in the sealed original packages is preferred.

2.2 STORING CONDITIONS

Epoxy coating does not protect perfectly from all environmental conditions. Some materials can penetrate the epoxy and harm
the performance of the parts. Therefore it is not recommended to use or store the parts in corrosive or humid atmosphere.
Optimal storing conditions should not exceed +10 °C to +35 °C and relative humidity up to 60 %.

3. ASSEMBLY
3.1 WIRE FORMING
If wire forming is needed, excessive mechanical force to the component body must be avoided as it might cause cracks in the
ceramic element.
Do not crack coating extension of the epoxy layer, when applying force onto the wire.
3.2 SOLDERING
For best performance it is recommended to dry the components at 125 °C for 2 hours before assembly.
Do not exceed resistance to soldering heat specification of the component. Subjecting this product to excessive heating could
melt the internal junction solder and may result in thermal shocks that can crack the ceramic element.
Manual Soldering / Rework
Set the soldering iron (50 W max.) to less than 300 °C and solder the wires within 4 seconds onto the PCB. Exceeding that
recommendations might reduce the electrical performance of the component.

Revision: 25-Mar-2024 4 Document Number: 23119

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Wave Soldering
Most common way to assemble these kind of components is carried out in 4 steps:
1. Increasing temperature to 120 °C within about 20 s
2. Preheating at 120 °C for about 60 s
3. Soldering at 260 °C in less than 10 s
4. Gradual air cooling in constant air flow
Reflow Soldering
It is not recommended to use reflow soldering with these components.

3.3 MOLDING AND COATING

Molding and / or applying another coating material might harm the performance of the components. Therefore it is
recommended to test the electrical characteristics of the molded / coated part in advance.
Typical error is a reduced withstand voltage because of an inadequate solvent in the molding material, which penetrates the
epoxy coating (please see recommendations for cleaning and drying in section 4.1 to 4.3). A similar result can be caused by an
inadequate coating material, which might pull the original epoxy off the ceramic element.

4. CLEANING AND DRYING

4.1 CLEANING AGENTS
Cleaning agents might have an influence to the performance of the components after washing and after unsuitable drying. The
following agents have been tested and classified:
Recommended Not Recommended
• DI water • Acetone
• Isopropanol • ...
• Ethanol
• Ehtyl alcohol
• ...

4.2 ULTRASONIC
Settings for ultrasonic cleaning
Rinse bath capacity: output of 20 Watts per liter or less
Rinsing time: 300 s max.
Do not vibrate the PCB / PWB directly.
Excessive ultrasonic cleaning may lead to permanent destruction of the component.

4.3 DRYING
In case of cleaning the assembled PCB with cleaning agents a proper drying is recommended. It is recommended to properly
insulate the assembled PCB (see section 5.2) after drying.

5. TESTING AND OPERATION

5.1 SHORT CIRCUIT
Avoid repetitive zero-ohm-short circuits because they might harm the components core construction, such as arcs between
lead wires because of inadequate insulation material (e.g air).
5.2 INSULATION
During operation, components should be surrounded by adequate insulating material (silicone oil, epoxy, or molding material).
Voltage breakdowns or leakage current through this material (between lead wires or to ground) is not acceptable. It is
recommended to properly clean and dry the assembled PCB (see section 4.1 to 4.3) before enclosing in insulating material.
5.3 APPLIED VOLTAGE
When using DC-rated components in AC applications (also ripple) the peak-to-peak voltage should not exceed the nominal
DC-rating of the component.

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6. CAUTION
6.1 OPERATING VOLTAGE AND FREQUENCY CHARACTERISTIC
When sinusoidal or ripple voltage applied to DC ceramic disc capacitors, be sure to maintain the peak-to-peak value or the peak
value of the sum of both AC + DC within the rated voltage.
When start or stop applying the voltage, resonance may generate irregular voltage.
When rectangular or pulse wave voltage is applied to DC ceramic disc capacitors, the self-heating generated by the capacitor
is higher than the sinusoidal application with the same frequency. The allowable voltage rating for the rectangular or pulse wave
corresponds approximately with the allowable voltage of a sinusoidal wave with the double fundamental frequency.
The allowable voltage varies, depending on the voltage and the waveform.
Diagrams of the limiting values are available for each capacitor series on request.

VOLTAGE DC DC + AC AC

Waveform figure V0-p V0-p Vp-p

0

0 0

6.2 OPERATING TEMPERATURE AND SELF-GENERATED HEAT

The surface temperature of the capacitors must not exceed the upper limit of its rated operating temperature.
During operation in a high frequency circuit or a pulse signal circuit, the capacitor itself generate heat due to dielectric losses.
Applied voltage should be the load such as self-generated heat is within 20 °C on the condition of environmental temperature
25 °C.
Note, that excessive heat may lead to deterioration of the capacitor’s characteristics.

RELATED DOCUMENTS
General Information www.vishay.com/doc?23140

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