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Quickspecs: HP 280 G4 Microtower Business PC

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Quickspecs: HP 280 G4 Microtower Business PC

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mufcharova
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QuickSpecs HP 280 G4 Microtower Business PC

Overview
HP 280 G4 Microtower Business PC

Front
1. Slim-height Bay - supporting an optical disk drive (optional)
2. Power Button
3. Combo jack, Headphone/ Microphone
4. SD Card Reader
5. (2) USB 3.1 Gen1 Port
6. HDD LED Light

Not Shown
Slots (1) PCI Express x16
(1) PCI Express x1
(1) Legacy PCI (Optional)
(1) M.2 for WLAN
(1) M.2 2242/2280 storage

Bays (1) 3.5" internal HDD bay


(1) 3.5” or 2.5” internal HDD bay (share bay)
(1) 9.5mm internal optical drive bay

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QuickSpecs HP 280 G4 Microtower Business PC

Overview
HP 280 G4 Microtower Business PC

Back
1. Audio Mic in 7. Standard security lock slot
2. Audio Line out 8. (2) USB 2.0 port
3. Audio Link in 9. RJ-45 Network Connector
4. HDMI Port1 10. (2) USB 3.1 Gen1 Port (left) and (2) USB 2.0 port (right)
5. VGA Port1 11. Power Cord Connector
6. Serial Port (optional, and available on legacy PCA only) 12. Padlock Loop

Not Shown
(1) PS/2 Port (optional, and available on legacy PCA only)
(2) Parallel Port (Optional via PCIex1 slot)
(3) 4 Serial Port (Optional via PCIe slot)

1. Port will be covered up when discrete graphic card is configured on shipped machine

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QuickSpecs HP 280 G4 Microtower Business PC

Standard Features and Configurable Modules


AT A GLANCE
• Windows 10 Pro, Windows 10 Home or FreeDos 2.0
• Intel® H370 chipset supporting Intel® 8th and 9th processors featuring Intel® UHD Graphics
• Supports an optional discrete graphics card
• Integrated 10/100/1000 Ethernet Controller or 802.11ac (1x1) WiFi and Bluetooth® 4.2 Combo
• Up to 32GB DDR4-2666 Unbuffered Memory (UDIMM)
• Independent monitor support via VGA and HDMI interfaces
• TPM 2.0 support (either dTPM or fTPM)1
• Supports both Hard Disk Drives and SATA TLC / M.2 PCIe NVMe Solid State Drives
• Audio in, Audio out and Mic in support 5.1 channel
• 8 USB Ports (including 4 USB 3.1 Gen1 ports)
• 180W/310W 90% HE power supply
• Security cable lock supported (sold separately)
• ENERGY STAR® certified. EPEAT® 2019 registered where applicable. EPEAT ® registration varies by country.See
http://www.epeat.net for registration status by country.*
• Protected by HP Services; terms and conditions vary by country; certain restrictions and exclusions apply
• Dust filter available

TPM feature will not be supported on machine pre-configured with FreeDOS


In cases, machines pre-configured with Windows OS might ship with TPM turned off
*Based on US EPEAT® registration according to IEEE 1680.1-2018 EPEAT®. Status varies by country. Visit www.epeat.net for more
information.

NOTE: See important legal disclosures for all listed specs in their respective features sections.

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QuickSpecs HP 280 G4 Microtower Business PC

Standard Features and Configurable Modules

PRODUCT NAME
HP 280 G4 Microtower Business PC

OPERATING SYSTEM
Preinstalled Windows® 10 Pro 64*
Windows® 10 Home 64*
Pre-installed (other) FreeDOS

1. Not all features are available in all editions or versions of Windows. Systems may require upgraded and/or separately purchased
hardware, drivers, software or BIOS update to take full advantage of Windows functionality. Windows 10 is automatically updated, which is
always enabled. ISP fees may apply and additional requirements may apply over time for updates. See http://www.windows.com/

PROCESSORS
Intel® Celeron® Processors2,3
CPU Intel Celeron G4900 Dual Core 3.1GHz 2400MHz 54W (3.1GHz, 2 MB cache, 2 cores)
CPU Intel Celeron G4930 Dual Core 3.2GHz 2400MHz 54W (3.2GHz, 2 MB cache, 2 cores)
Intel® Pentium® Processors2,3
CPU Intel Pentium G5400 Dual Core 3.7GHz 2400MHz 54W (3.7GHz, 4 MB cache, 2 cores)
CPU Intel Pentium G5500 Dual Core 4.0GHz 2400MHz 54W (4.0GHz, 4 MB cache, 2 cores)
Intel® Pentium Gold®2,3
CPU Intel Pentium G5420 Dual Core 3.8GHz 2400MHz 54W (3.8GHz, 4 MB cache, 2 cores)
CPU Intel Pentium G5600 Dual Core 3.9Ghz 2400MHz 54W (3.9 GHz, 4 MB cache, 2 cores)
CPU Intel Pentium G5620 Dual Core 3.8GHz 2400MHz 54W (3.8GHz, 4 MB cache, 2 cores)
Intel 8th Processors
Intel® Core™ i32,3
CPU Intel Core i3-8100 Quad Core 3.6GHz 2400MHz 65W (3.6GHz, 6 MB cache, 4 cores)
Intel® Core™ i52,3
CPU Intel Core i5-8400 6C 2.8GHz 2666MHz 65W (2.8GHz, turbo up to 4GHz, 9 MB cache, 6 cores)
CPU Intel Core i5+ (Core i5 and Intel® Optane™ Memory4)
CPU Intel Core i5-8400 6C 2.8GHz 2666MHz 65W (2.8GHz, turbo up to 4GHz, 9 MB cache, 6 cores)
Intel® Core™ i52,3
CPU Intel Core i5-8500 6C 3.0GHz 2666MHz 65W (3GHz, turbo up to 4.1GHz, 9 MB cache, 6 cores)
CPU Intel Core i5+ (Core i5 and Intel® Optane™ Memory4)
CPU Intel Core i5-8500 6C 3.0GHz 2666MHz 65W (3GHz, turbo up to 4.1GHz, 9 MB cache, 6 cores)
Intel® Core™ i72,3
CPU Intel Core i7-8700 6C 3.2GHz 2666MHz 65W (3.2GHz, turbo up to 4.6GHz, 12 MB cache, 6 cores)
CPU Intel Core i7+ (Core i7 and Intel® Optane™ Memory4)
CPU Intel Core i7-8700 6C 3.2GHz 2666MHz 65W (3.2GHz, turbo up to 4.6GHz, 12 MB cache, 6 cores)
Intel 9th Processors
Intel® Core™ i32,3
CPU Intel Core i3-9100 4C 3.6GHz 2400MHz 65W (3.6GHz, turbo up to 4.2GHz, 6 MB cache, 4 cores)
CPU Intel Core i3-9300 4C 3.7GHz 2400MHz 62W (3.7GHz, turbo up to 4.3GHz, 8 MB cache, 4 cores)
Intel® Core™ i52,3
CPU Intel Core i5-9400 6C 2.9GHz 2666MHz 65W (2.9GHz, turbo up to 4.1GHz, 9 MB cache, 6 cores)*
CPU Intel Core i5-9400F 6C 2.9GHz 2666MHz 65W (2.9GHz, turbo up to 4.1GHz, 9 MB cache, 6 cores)

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Standard Features and Configurable Modules


CPU Intel Core i5-9500 6C 3GHz 2666MHz 65W (3GHz, turbo up to 4.4GHz, 9 MB cache, 6 cores)
CPU Intel Core i5-9500F 6C 3GHz 2666MHz 65W (3GHz, turbo up to 4.4GHz, 9 MB cache, 6 cores)
CPU Intel Core i5-9600 6C 3.1GHz 2666MHz 65W (3.1GHz, turbo up to 4.6GHz, 9 MB cache, 6 cores)
Intel® Core™ i72,3
CPU Intel Core i7-9700 8C 3GHz 2666MHz 65W (3GHz, turbo up to 4.7GHz, 12 MB cache, 8 cores)
2.Your product does not support Windows 8 or Windows 7, In accordance with Microsoft’s support policy, HP does not support the Windows®
8 or Windows 7 operating system on products configured with Intel 8th or 9th generation and forward processors or provide any Windows® 8
or Windows 7 drivers on http://www.support.hp.com
3. Multi-Core is designed to improve performance of certain software products. Not all customers or software applications will necessarily
benefit from use of this technology. 64-bit computing system required. Performance and clock frequency will vary depending on
application workload and your hardware and software configurations. Intel’s numbering is not a measurement of higher performance.
4 Intel® Optane™ memory (cache) is sold separately. Intel® Optane™ memory system acceleration does not replace or increase the DRAM in
your system. Available for HP commercial desktops and notebooks and for select HP workstations (HP Z240 Tower/SFF, Z2 Mini, ZBook
Studio, 15 and 17 G5) and requires a SATA HDD, 7th Gen or higher Intel® Core™ processor or Intel® Xeon® processor E3-1200 V6 product
family or higher, BIOS version with Intel® Optane™ supported, Windows 10 version 1703 or higher, M.2 type 2280-S1-B-M connector on a
PCH Remapped PCIe Controller and Lanes in a x2 or x4 configuration with B-M keys that meet NVMe™ Spec 1.1, and an Intel® Rapid Storage
Technology (Intel® RST) 15.5 driver.
*NOTE: Only available on selected region

CHIPSET
Intel® H370 Chipset

GRAPHICS
Integrated5,6
Intel® UHD
Graphics 630 (integrated on 8 th Core i7/i5/i3 processors and 9th i5 processors)
Intel® UHD
Graphics 610 (integrated on 8th and 9th Pentium and Celeron)

Discrete Graphics
AMD Radeon™ R7 430 2GB PCIe x16 GFX
AMD Radeon™ 520 1GB GFX
NVIDIA® GeForce® GT730 1GB GFX
NVIDIA® GeForce® GT730 2GB GFX
NVIDIA® GeForce® GT1060 3GB GFX*
NVIDIA® GeForce® GT1060 6GB GFX*
NVIDIA® GeForce® GTX 1650 4GB*

5. HD content required to view HD images.


6. Integrated Intel software is available on select models only and requires separately purchased projector, tv or computer monitor with an
integrated or external receiver. External receivers connect to the projector, tv or computer monitor via a standard VGA, HDMI cable, also sold
separately
NOTE*: Available for specific region

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Standard Features and Configurable Modules


MEMORY7
Form Factor Type Maximum # of Slots
Microtower DDR4 2666 (Transfer rates up 32 GB capacity 2 DIMM
to 2666 MT/s)
4GB DDR4-2666 UDIMM NECC (1x4GB)
8GB DDR4-2666 UDIMM NECC (1x8GB)
8GB DDR4-2666 UDIMM NECC (2x4GB)
16GB DDR4-2666 UDIMM NECC (1x16GB)
16GB DDR4-2666 UDIMM NECC (2x8GB)
7. Memory modules support data transfer rates up to 2666 MT/s; actual data rate is determined by the system’s configured processor. See
processor specifications for supported memory data rate.

STORAGE8
SATA3 - 3.5" or 2.5” 6Gb/s HDDs
2TB 7200 RPM SATA Hard Disk Drive
1TB 7200 RPM SATA Hard Disk Drive
500GB 7200 RPM SATA Hard Disk Drive
128GB 2.5” TLC SSD
256GB 2.5” TLC SSD

Solid State Drives


128GB M.2 NVMe
256GB M.2 NVMe
512GB M.2 NVMe

SD Card Reader9
SD/SDHC/SDXC SD Card Reader

Intel Optane Memory10


SSD Intel 16GB 2280 Optance Memory

8. For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36 GB (for Windows
10) of system disk is reserved for the system recovery software.
9. Card sold separately
10. Optional per configuration

OPTICAL DISC DRIVES11


DVD-ROM 9.5mm
DVD-Writer 9.5mm*
11. Optical drives are optional or add on features. Duplication of copyrighted material is strictly prohibited. Actual speeds may vary. Double
Layer media compatibility will widely vary with some home DVD players and DVD-ROM drives.

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Standard Features and Configurable Modules


NETWORKING 12
Ethernet (RJ-45)
Integrated 10/100/1000M GbE LAN

Wi-Fi and Bluetooth®


802.11ac (1x1) WiFi and Bluetooth® 4.2 Combo
12. Wireless cards are optional or add-on features and requires separately purchased wireless access point and internet service. Availability
of public wireless access points limited.

AUDIO / MULTIMEDIA
Integrated Hi-Definition Audio
Combo Jack, Headphone / Microphone
Line-in / Line-out / Mic-in jacks (3.5mm)

KEYBOARDS AND POINTING DEVICES13


Keyboard
USB Business Slim Wired Keyboard
HP USB Keyboard
Business Slim USB Antimicrobial Wired Keyboard (China)
Business Slim PS/2 Wired Keyboard
No KB Option

Mouse
Antimicrobial USB Mouse (China)
HP Optical USB Mouse
Universal Wired Mouse USB
USB Hardened Mouse (India)
HP PS/2 Mouse (for machine configured with PS/2 port)
No Mouse Option

13. Keyboards and mouse are optional or add-on features.

PORTS
Front
Slim-height Bay - supporting an optical disk drive (optional)
Power Button
Combo jack, Headphone / Microphone
SD Card Reader
(2) USB 3.1 Gen1 Port

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Standard Features and Configurable Modules


HDD LED Light

Not Shown
(1) PCI Express x16
(1) PCI Express x1 Accessory slot
(1) Full-height PCI (Optional)
(1) M.2 for WLAN
(1) M.2 2242/2280 storage

Rear
Audio Mic in
Audio Line out
Audio Link in
HDMI Port1
VGA Port1
Serial Port (optional, and available on legacy PCA only)
Standard lock slot
(2) USB 2.0 port
RJ-45 Network Connector
(2) USB 3.1 Gen1 Port and (2) USB 2.0 Port
Power Cord Connector
Padlock loop

Not Shown
(2) PS/2 Port (optional, and available on legacy PCA only)
(1) Parallel Port (Optional via PCIex1 slot)

1: Port will be covered up when discrete graphic card is configured on shipped machine

BAYS
(1) 9.5mm external slimline ODD bay (optional)
(1) 3.5" internal HDD bay
(1) 3.5 or 2.5” internal HDD bay (share bay)

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Standard Features and Configurable Modules


ENVIRONMENTAL AND INDUSTRY
Environmental Eco-Label This product has received or is in the process of being certified to the following
Data Certifications & approvals and may be labeled with one or more of these marks:
declarations • IT ECO declaration
• US ENERGY STAR®
• EPEAT® 2019 registered where applicable. EPEAT ® registration varies by
country.See http://www.epeat.net for registration status by country*. Search
keyword generator on HP’s 3rd party option store for solar generator accessories
at http://www.hp.com/go/options

*Based on US EPEAT® registration according to IEEE 1680.1-2018 EPEAT®. Status varies by


country. Visit http://www.epeat.net for more information.

System Configuration The configuration used for the Energy Consumption and Declared Noise
Emissions data for the Desktop model is based on a “Typically Configured
Desktop.
Energy Consumption
(in accordance with US
ENERGY STAR® test
method) 115VAC, 60Hz 230VAC, 50Hz 100VAC, 60Hz
Normal Operation 12.97 13.03 13.39
(Short idle)
Normal Operation 10.64 10.72 10.46
(Long idle)
Sleep 0.78 0.76 0.77
Off 0.42 0.41 0.42
Note: Energy efficiency data listed is for an ENERGY STAR® compliant product if
offered within the model family. HP computers marked with the ENERGY STAR®
Logo are compliant with the applicable U.S. Environmental Protection Agency
(EPA) ENERGY STAR® specifications for computers. If a model family does not
offer ENERGY STAR® compliant configurations, then energy efficiency data listed
is for a typically configured PC featuring a hard disk drive, a high efficiency power
supply, and a Microsoft Windows® operating system.
Heat Dissipation* 115VAC, 60Hz 230VAC, 50Hz 100VAC, 60Hz
Normal Operation 44.23 44.43 45.66
(Short idle)
Normal Operation 36.28 36.56 35.67
(Long idle)
Sleep 2.66 2.59 2.63
Off 1.43 1.4 1.43

*NOTE: Heat dissipation is calculated based on the measured watts, assuming the
service level is attained for one hour.

Declared Noise Sound Power Sound Pressure


Emissions (LWAd, bels) (LpAm, decibels)
(in accordance with
ISO 7779 and ISO
9296)
Typically Configured – 3.6 26.5
Idle
Fixed Disk – Random 3.6 26.5
writes

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Standard Features and Configurable Modules


Longevity and "This product can be upgraded, possibly extending its useful life by several
Upgrading years. Upgradeable features and/or components contained in the product may
include:

Spare parts are available throughout the warranty period and or for up to “5”
years after the end of production.
Batteries "This battery(s) in this product comply with EU Directive 2006/66/EC

Batteries used in the product do not contain:


Mercury greater the1ppm by weight
Cadmium greater than 20ppm by weight

Battery size: CR2032 (coin cell)


Battery type: Lithium
Additional • This product is in compliance with the Restrictions of Hazardous
Information Substances (RoHS) directive - 2011/65/EC.
• This HP product is designed to comply with the Waste Electrical and
Electronic Equipment (WEEE) Directive – 2002/96/EC.
• This product is in compliance with California Proposition 65 (State of
California; Safe Drinking Water and Toxic Enforcement Act of 1986).
• This product is in compliance with the IEEE 1680.1-2018 EPEAT®
standard, see http://www.epeat.net for registration status by country.
Search keyword generator on HP’s 3rd party option store for solar
generator accessories at http://www.hp.com/go/options
• Plastics parts weighing over 25 grams used in the product are marked
per ISO11469 and ISO1043.
• This product contains 0% post-consumer recycled plastic (by wt.)
• This product is 94.4% recycle-able when properly disposed of at end of
life."
Packaging Materials External: PAPER/Corrugated
Internal: PLASTIC/EPE (Expanded Polyethylene)
PLASTIC/Polyethylene low density - LDPE
The plastic packaging material contains at least 50% recycled content.
The corrugated paper packaging materials contains at least 75% recycled
content.
Material Usage This product does not contain any of the following substances in excess of
regulatory limits (refer to the HP General Specification for the Environment at
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/gse.pdf):

• Asbestos
• Certain Azo Colorants
• Certain Brominated Flame Retardants – may not be used as flame
retardants in plastics
• Cadmium
• Chlorinated Hydrocarbons
• Chlorinated Paraffins
• Formaldehyde
• Halogenated Diphenyl Methanes
• Lead carbonates and sulfates
• Lead and Lead compounds
• Mercuric Oxide Batteries
• Nickel – finishes must not be used on the external surface designed to
be frequently handled or carried by the user.
• Ozone Depleting Substances

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Standard Features and Configurable Modules


• Polybrominated Biphenyls (PBBs)
• Polybrominated Biphenyl Ethers (PBBEs)
• Polybrominated Biphenyl Oxides (PBBOs)
• Polychlorinated Biphenyl (PCB)
• Polychlorinated Terphenyls (PCT)
• Polyvinyl Chloride (PVC) – except for wires and cables, has been
voluntarily removed from most applications.
• Radioactive Substances
• Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)

Packaging Usage HP follows these guidelines to decrease the environmental impact of product
packaging:

• Eliminate the use of heavy metals such as lead, chromium, mercury and
cadmium in packaging materials.
• Eliminate the use of ozone-depleting substances (ODS) in packaging
materials.
• Design packaging materials for ease of disassembly.
• Maximize the use of post-consumer recycled content materials in
packaging materials.
• Use readily recyclable packaging materials such as paper and corrugated
materials.
• Reduce size and weight of packages to improve transportation fuel
efficiency.
• Plastic packaging materials are marked according to ISO 11469 and DIN
6120 standards.

End-of-life Hewlett-Packard offers end-of-life HP product return and recycling programs in


Management and many geographic areas. To recycle your product, please go to:
Recycling http://www.hp.com/go/reuse-recycle or contact your nearest HP sales office.
Products returned to HP will be recycled, recovered or disposed of in a
responsible manner.

The EU WEEE directive (2002/95/EC) requires manufacturers to provide


treatment information for each product type for use by treatment facilities. This
information (product disassembly instructions) is posted on the Hewlett Packard
web site at: http://www.hp.com/go/recyclers. These instructions may be used
by recyclers and other WEEE treatment facilities as well as HP OEM customers
who integrate and re-sell HP equipment.

HP, Inc. Corporate For more information about HP’s commitment to the environment:
Environmental
Information Global Citizenship Report
http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Eco-label certifications
http://www8.hp.com/us/en/hp-
information/environment/ecolabels.html
ISO 14001 certificates:
http://h20195.www2.hp.com/V2/GetDocument.aspx?docname=c04755842
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf

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Standard Features and Configurable Modules


SOFTWARE COMPONENTS AND APPLICATIONS WITH WINDOWS
Security and Protection
McAfee* LiveSafe™ 11

Productivity
Buy Office (sold separately)
Dropbox12

ODD Playback and TV Tuners


Power Media Player 14 for HP with DVD (ODD SKU only)13

Movies
Netflix14

App Stores and Content Purchasing


Amazon14

HP Utilities and Support


HP Documentation
HP JumpStarts
HP Audio Switch
HP Support Assistant15

BTB
HP Setup Integrated OOBE

Hardware Enabling Drivers or software utility


HP System Event Utility

*NOTE: Available for LA region only.


11. Free 1-year subscription of McAfee LiveSafe service included. Internet access required and not included. Subscription required after
expiration
12. New Dropbox users are eligible to get 25 GB of Dropbox space free for 12 months from date of registration. For complete details and
terms of use, including cancellation policies, visit the Dropbox website at https://www.dropbox.com/help/space/hp-promotion.
Internet service required and not included.
13. Actual speeds may vary. Don't copy copyright-protected materials
14. Internet access required and not included.
15. Easily switch between speaker and microphone sources with intuitive controls and a consistent app experience
17. HP ePrint Driver requires an Internet connection to HP web-enabled printer and HP ePrint account registration (for a list of eligible
printers, supported documents and image types and other HP ePrint details, see www.hp.com/go/eprintcenter). Print times and connection
speeds may vary.

POWER SUPPLY 16
180 W
ENERGY® STAR® Libra2 EPA90 (Gold) Full range 115V/230V
310 W
SFF ENTL EPA90 (Gold) Full range 115V/230V

16. All power supplies are not available in every region.

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DIMENSIONS AND WEIGHT
Dimensions
6.69 x 13.3 x 10.79 in
(170 x 338 x 274 mm)

Weight
11.9 lbs / 5.4 kg

UNIT ENVIRONMENT AND OPERATING CONDITIONS


General Unit Operating Guidelines
• Keep the computer away from excessive moisture, direct moisture and the extremes of heat and cold, to ensure that unit
is operated within the specified operating range.
• Leave a 10.2 cm (4 in) clearance on all vented sides of the computer to permit the required airflow.
• Never restrict airflow into the computer by blocking any vents or air intakes.
• Do not stack computers on top of each other or place computers so near each other that they are subject to each other's
re-circulated or preheated air.
• Occasionally clean the air vents on the front, back, and any other vented side of the computer. Lint, dust and other foreign
matter can block the vents and limit the airflow.
• If the computer is to be operated within a separate enclosure, intake and exhaust ventilation must be provided on the
enclosure, and the same operating guidelines listed above will still apply.

Temperature Range Operating: 32° to 104° F (0° to 40° C)17


Non-operating: -22° to 140° F(-30° to 60° C)
Relative Humidity Operating: 10% to 90% (non-condensing at ambient)
Non-operating: 0% to 95% (non-condensing at ambient)
Maximum Altitude (unpressurized) Operating: 10,000 ft (3048 m)
Non-operating: 30,000 ft (9144 m)
17. Operating temperature is de-rated 1.0 deg C per 300 m (1000 ft) to 3000 m (10,000 ft) above sea level, no direct sustained sunlight.
Maximum rate of change is 10 deg C/Hr. The upper limit may be limited by the type and number of options installed.

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SERVICE AND SUPPORT
On-site Warranty 1: Available three-year (3-3-3) or one-year (1-1-1) limited warranty (varies by country) delivers on-site, next
business day 2 service for parts and labor and complimentary limited technical support.3 Three-year onsite and labor are not
available in all countries. Service offers terms up to 5 years by choosing an optional HP Care Pack.4 To choose the right level of
service for your HP product, visit HP Care Pack Central: http://www.hp.com/go/cpc.

NOTE 1: Terms and conditions may vary by country. Certain restrictions and exclusions apply. Other warranty variations may be offered in
your region.
NOTE 2: On-site service may be provided pursuant to a service contract between HP and an authorized HP third-party provider, and is not
available in certain countries. Global service response times are based on commercially reasonable best effort and may vary by country.
NOTE 3: Technical support applies only to HP-configured and third-party HP qualified hardware and software.
NOTE 4: Service levels and response times for HP Care Packs may vary depending on your geographic location. Service starts on date of
hardware purchase. Restrictions and limitations apply. For details, visit http://www.hp.com/go/cpc. HP services are governed by the
applicable HP terms and conditions of service provided or indicated to Customer at the time of purchase. Customer may have additional
statutory rights according to applicable local laws, and such rights are not in any way affected by the HP terms and conditions of service or
the HP Limited Warranty provided with your HP Product.

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Technical Specifications - Graphics


GRAPHICS
Intel® UHD Graphics 630 (integrated on Core i7/i5/i3 processors)
Intel® UHD Graphics 610 (integrated on Pentium and Celeron)
Multimode capable; supports HDCP, DisplayPort™ Audio (2 streams), HBR2 link rates and
DisplayPort™
Multi-Stream Technology for a maximum of 3 displays (including the integrated panel)

Additional memory is allocated for graphics as needed using Intel's Dynamic Video Memory
Memory Technology (DVMT), to provide an optimal balance between graphics and system memory
use.

Maximum Graphics Memory Windows 10: >4 GB

Maximum Color Depth 32 bits/pixel


8 th and 9th Generation Intel® Core Processors
With Intel® UHD Graphics 630
Graphics/Video API Support
8 th and 9th Generation Pentium® G5400 and Celeron® G4900,
With Intel® UHD Graphics 610

Supported Display Resolutions and Refresh Rates


800x600 @ 60 Hz
1024x768 @ 60 Hz
1152x864 @ 60 Hz
1280x600 @ 60 Hz
1280x720 @ 60 Hz
1280x800 @ 60 Hz
1280x960 @ 60 Hz
1280x1024 @ 60 Hz
Resolution/ Refresh Rates 1360x768 @ 60 Hz
1366x768 @ 60 Hz
1400x1050 @ 60 Hz
1440x900 @ 60 Hz
1600x900 @ 60 Hz
1600x1200[1] @ 60 Hz
1680x1050 @ 60 Hz
1920x1080 @ 60 Hz
Note: The actual amount of maximum graphics memory can be less than the amounts listed above depending upon your computer’s
configuration.
Note: other resolutions may be available but are not recommended as they may not have been tested and qualified by HP
Only supported on displays connected to the external DisplayPort™ connector.

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Technical Specifications - Graphics


NVIDIA® GeForce® GTX 1060 3GB Graphics Card
Engine Clock 1506 MHz
Memory Clock 4004 MHz
Memory Size(width) 3GB(192-bit)
Memory Type 128M x 32 GDDR5 @6pcs
Max. Resolution(DVI) 2560x1600@60Hz
Max. Resolution(HDMI) 4096x2160@60Hz
Max. Resolution(DP) 5120x3200@60Hz
Multi Display Support 4 displays
HDCP Compliance Yes
Rear I/O connectors(bracket) DVI-D+HDMI+DPx3
Cooling(active/passive) Active fan-sink (Active cooling with dynamic speed)
Total power consumption(W) <120W
PCB form-factor with bracket ATX (Full height) PCB with ATX dual slot bracket

NVIDIA® GeForce® GTX 1060 6GB Graphics Card


Engine Clock 1506 MHz
Memory Clock 4004 MHz
Memory Size(width) 6GB(192-bit)
Memory Type 256M x 32 GDDR5 @6pcs
Max. Resolution(DVI) 2560x1600@60Hz
Max. Resolution(HDMI) 4096x2160@60Hz
Max. Resolution(DP) 5120x3200@60Hz
Multi Display Support 4 displays
HDCP Compliance Yes
Rear I/O connectors(bracket) DVI-D+HDMI+DPx3
Cooling(active/passive) Active fan-sink (Active cooling with dynamic speed)
Total power consumption(W) <120W
PCB form-factor with bracket ATX (Full height) PCB with ATX dual slot bracket

NVIDIA® GeForce® GTX 1650 4GB Graphics Card


Engine Clock 1665 MHz
Memory Clock 4000 MHz
Memory Size(width) 4GB(128-bit)
Memory Type 256M x 32 GDDR5 @4pcs
Max. Resolution(HDMI) 4096 x 2160 x 24bpp @ 60 Hz
Max. Resolution(DVI) 2560 x 1600 x 24bpp @ 60 Hz
Multi Display Support 2 displays
HDCP Compliance yes
Rear I/O connectors(bracket) HDMI + DVI

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Technical Specifications - Graphics


Cooling(active/passive) Active fan-sink
Total power consumption(W) <75W
PCB form-factor with bracket ATX (Full height) PCB with ATX dual slot bracket

NVIDIA® GeForce® GT730 1GB Graphics Card


Engine Clock 902 MHz
Memory Clock 1250 MHz
Memory Size(width) 1GB(64-bit)
Memory Type 128M x 32 GDDR5 @2pcs
Max. Resolution(DVI) 2560x1600@60Hz
Max. Resolution(HDMI) 4096x2160@24Hz
Multi Display Support 2 displays
HDCP Compliance yes
Rear I/O connectors(bracket) DVI+HDMI
Cooling(active/passive) Active fan-sink (Active cooling with dynamic speed)
Total power consumption(W) <35W
PCB form-factor with bracket LP PCB with FH/LP bracket

NVIDIA® GeForce® GT 730 2GB Graphics Card


Engine Clock 902 MHz
Memory Clock 1250 MHz
Memory Size(width) 2GB(64-bit)
Memory Type 256M x 32 GDDR5 @2pcs
Max. Resolution(DVI) 2560x1600@60Hz
Max. Resolution(DP) 4096x2160@60Hz
Multi Display Support 2 displays
HDCP Compliance yes
Rear I/O connectors(bracket) DVI+DP
Cooling(active/passive) Active fan-sink(Active cooling with dynamic speed)
Total power consumption(W) <35W
PCB form-factor with bracket LP PCB with FH/LP bracket

AMD Radeon™ R7 430 2GB Graphics Card


Engine Clock 780 MHz
Memory Clock 1100 MHz
Memory Size(width) 2GB(128-bit)
Memory Type 128M x 32 GDDR5 @4pcs
Max. Resolution(VGA) 2048x1536
Max. Resolution(DP) 4096x2160@60Hz

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Technical Specifications - Graphics


Multi Display Support 2 displays
HDCP Compliance yes
Rear I/O connectors(bracket) VGA+DP
Cooling(active/passive) Active fan-sink (Active cooling with dynamic speed)
Total power consumption(W) <50W
PCB form-factor with bracket LP PCB with FH/LP bracket

AMD Radeon™ 520 1GB Graphics Card


Engine Clock 780 MHz
Memory Clock 1100 MHz
Memory Size(width) 1GB(32-bit)
Memory Type 256M x 32 GDDR5
Max. Resolution(VGA) 2048x1536
Max. Resolution(DP) 4096x2160@60Hz
Multi Display Support 2 displays
HDCP Compliance yes
Rear I/O connectors(bracket) VGA+DP
Cooling(active/passive) Active fan-sink (Active cooling with dynamic speed)
Total power consumption(W) <50W
PCB form-factor with bracket LP PCB with FH/LP bracket

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Technical Specifications - Storage

STORAGE

HP 2 TB 7.2K rpm SATA 6.0Gb/s 3.5" Hard Disk Drive


Capacity 2 TB
Rotational Speed 7,200 rpm
Interface SATA 6Gb/s NCQ
Buffer Size 64 MB
Logical Blocks 3,907,029,168
Seek Time Read: <8.5 ms
Write: <9.5 ms
Height 1.028 in/26.11 mm
Width 4.0 in/101.6 mm
Operating Temperature 32° to 140° F (0° to 60° C)

NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to
36 GB (for Windows 10) of system disk is reserved for the system recovery software.

1 TB 7.2K rpm SATA 6.0Gb/s 3.5” Hard Disk Drive


Capacity 1 TB
Rotational Speed 7,200 rpm
Interface Serial ATA 3.0 (6.0 Gb/s)
Buffer Size 32 MB
Logical Blocks 1,953,525,168
Seek Time Single Track: 2.0 ms
Average: 11 ms
Full-Stroke: 21 ms
Height 1 in/2.54 cm
Width Media diameter: 3.5 in/8.89 cm
Physical size: 4 in/10.2 cm
Operating Temperature 41° to 131° F (5° to 55° C)

NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to
36 GB (for Windows 10) of system disk is reserved for the system recovery software.

500 GB 7.2K rpm SATA 6.0Gb/s 3.5” Hard Disk Drive


Capacity 500 GB
Rotational Speed 7,200 rpm
Interface Serial ATA 3.0 (6.0 Gb/s)
Buffer Size 32 MB
Logical Blocks 1,953,525,168
Seek Time Single Track: 2.0 ms
Average: 11 ms

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Technical Specifications - Storage


Full-Stroke: 21 ms
Height 1 in/2.54 cm
Width Media diameter: 3.5 in/8.89 cm
Physical size: 4 in/10.2 cm
Operating Temperature 41° to 131° F (5° to 55° C)

NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to
36 GB (for Windows 10) of system disk is reserved for the system recovery software.

HP 9.5mm Desktop G2 Slim DVD Writer Drive


Height 9.5 mm height
Orientation Either horizontal or vertical
Interface type SATA/ATAPI
Disc recording capacity Up to 8.5 GB DL or 4.7 GB standard
Dimensions (W x H x D) 5.04 x 0.37 x 5.0 in (128 x 9.5 x 127 mm) without bezel
Weight (max) 0.31 lb (140 g)
Read Speeds DVD-R DL Up to 6X
DVD+R Up to 8X
DVD+RW Up to 8X
DVD+R DL Up to 6X
DVD-R Up to 8X
DVD-RW Up to 6X
CD-R Up to 24X
CD-RW Up to 10X
DVD-RW, DVD+RW Up to 8X
DVD-R DL, DVD+R DL Up to 8X
DVD+R, DVD-R Up to 8X
DVD-ROM DL, DVD-ROM Up to 8X
CD-ROM, CD-R Up to 24X
CD-RW Up to 24X
Access time Random DVD-ROM: 170 ms (typical), CD-ROM: 170 ms (typical)
(typical reads, including Full Stroke DVD-ROM: 320 ms (typical), CD-ROM: 320 ms (typical)
settling) Stop Time 6 seconds (typical)
Power Source Slimline SATA DC power receptacle
DC Power Requirement 5 VDC ± 5%-100 mV ripple p-p
DC Current 5 VDC (< 1000 mA typical, 1600 mA maximum)
Environmental conditions Temperature 41° to 122° F (5° to 50° C)
(operating - non-condensing) Relative Humidity 10% to 80%
Maximum Wet Bulb Temperature 84° F (29° C)

HP 9.5mm Desktop G2 Slim DVD-ROM Drive


Height 9.5 mm height
Orientation Either horizontal or vertical
Interface type SATA/ATAPI
Disc recording capacity Up to 8.5 GB DL or 4.7 GB standard
Dimensions (W x H x D) 5.04 x 0.37 x 5.0 in (128 x 9.5 x 127 mm) without bezel

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Technical Specifications - Storage


Weight (max) 0.31 lb (140 g)
Read Speeds DVD-R DL Up to 6X
DVD+R Up to 8X
DVD+RW Up to 8X
DVD+R DL Up to 6X
DVD-R Up to 8X
DVD-RW Up to 6X
CD-R Up to 24X
CD-RW Up to 10X
DVD-RW, DVD+RW Up to 8X
DVD-R DL, DVD+R DL Up to 8X
DVD+R, DVD-R Up to 8X
DVD-ROM DL, DVD-ROM Up to 8X
CD-ROM, CD-R Up to 24X
CD-RW Up to 24X
Access time Random DVD-ROM: 170 ms (typical), CD-ROM: 170 ms (typical)
(typical reads, including Full Stroke DVD-ROM: 320 ms (typical), CD-ROM: 320 ms (typical)
settling) Stop Time 6 seconds (typical)
Power Source Slimline SATA DC power receptacle
DC Power Requirement 5 VDC ± 5%-100 mV ripple p-p
DC Current 5 VDC (< 1000 mA typical, 1600 mA maximum)
Environmental conditions Temperature 41° to 122° F (5° to 50° C)
(operating - non-condensing) Relative Humidity 10% to 80%
Maximum Wet Bulb Temperature 84° F (29° C)

128 GB M.2 2280 PCIe NVMe SSD


Drive Weight < 10g
Capacity 128GB
Height 2.38mm
Length 80mm
Width 22mm
Interface PCIE Gen3
Maximum Sequential Read Up to 1400MB/s
Maximum Sequential Write Up to 395MB/s
Logical Blocks 250,069,680
Operating Temperature 0° to 70°C (32° to 158°F) [ambient temp]
Features APST; ASPM L1.2; NVME spec 1.2

NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36 GB (for Windows
10) of system disk is reserved for the system recovery software.

256 GB M.2 2280 PCIe NVMe SSD


Drive Weight < 10g
Capacity 256 GB
Height 2.38mm
Length 80mm

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Technical Specifications - Storage


Width 22mm
Interface PCIE Gen3
Maximum Sequential Read Up to 1600MB/s
Maximum Sequential Write Up to 780MB/s
Logical Blocks 500,118,192
Operating Temperature 0° to 70°C (32° to 158°F) [ambient temp]
Features APST; ASPM L1.2; NVME spec 1.2

NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to
36 GB (for Windows 10) of system disk is reserved for the system recovery software.

512 GB M.2 2280 PCIe NVMe SSD


Drive Weight < 10g
Capacity 512 GB
Height 2.38mm
Length 80mm
Width 22mm
Interface PCIE Gen3
Maximum Sequential Read Up to 1600MB/s
Maximum Sequential Write Up to 860MB/s
Logical Blocks 1,000,215,216
Operating Temperature 0° to 70°C (32° to 158°F) [ambient temp]
Features APST; ASPM L1.2; NVME spec 1.2

NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to
36 GB (for Windows 10) of system disk is reserved for the system recovery software.

128GB 2.5in SATA Three Layer Cell SSD


Drive Weight <50g
Capacity 128GB
Height 7mm
Length 100.45mm
Width 69.85mm
Interface SATA 3.0 (6Gb/s)
Performance Up to Random Read/Write = 70K/40K IOPS
Maximum Sequential Read Up to 530MB/s
Maximum Sequential Write Up to 380MB/s
Logical Blocks 250,069,680
Operating Temperature 0° to 70°C (32° to 158°F) [ambient temp]
Features DIPM; TRIM

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Technical Specifications - Storage

NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to
36 GB (for Windows 10) of system disk is reserved for the system recovery software.

256GB 2.5in SATA Three Layer Cell SSD


Drive Weight <62g
Capacity 256GB
Height 7mm
Length 100.45mm
Width 69.85mm
Interface SATA 3.0 (6Gb/s)
Performance Up to Random Read/Write = 55K/68K IOPS
Maximum Sequential Read Up to 530MB/s
Maximum Sequential Write Up to 450MB/s
Logical Blocks 500,118,192
Operating Temperature 0° to 70°C (32° to 158°F) [ambient temp]
Features DIPM; TRIM
NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to
36 GB (for Windows 10) of system disk is reserved for the system recovery software.

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Technical Specifications – Networking

NETWORKING
10/100/1000 NIC Ethernet Features 10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14)
100 Mbit/s operation (100BASE-TX; IEEE 802.3u; IEEE 802.3 clauses 21-30)
1000 Mbit/s operation (1000BASE-T; IEEE 802.3ab; IEEE 8023 clauses 40)
Auto-Negotiation (Automatic Speed Selection)
Full Duplex Operation at all Speeds, Half Duplex operation at 10 and 100 Mbit/s
Power ACPI compliant – multiple power modes
Management Situation-sensitive features reduce power consumption
Advanced link down power saving for reducing link down power consumption
Performance TCP/IP/UDP Checksum Offload (configurable)
Features Protocol Offload (ARP & NS)
Large send offload and Giant send offload
Receiving Side Scaling
Jumbo Frame 9K
Manageability Wake-on-LAN from standby and hibernation (Magic Packet and Microsoft Wake-Up
Frame); Wake-on-LAN from off (Magic Packet only)
PXE 2.1 Remote Boot
Statistics Gathering (SNMP MIB II, Ethernet-like MIB, Ethernet MIB (802.3x, clause
30))
Comprehensive diagnostic and configuration software suite
Virtual Cable Doctor for Ethernet cable status
Interface PCIe + SMBus
NIC Device Driver Name PCIe GBE Ethernet Family Controller

Realtek 802.11ac (1x1) WiFi and Bluetooth® 4.2 Combo *


Wireless LAN Standards IEEE 802.11a
IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
IEEE 802.11ac

Interoperability Wi-Fi certification

Frequency Bands 802.11b/g/n • 2.402 – 2.482 GHz

802.11a/n • 4.9 – 4.95 GHz (Japan)


• 5.15 – 5.25 GHz
• 5.25 – 5.35 GHz
• 5.47 – 5.725 GHz
• 5.825 – 5.850 GHz

Data Rates • 802.11b: 1, 2, 5.5, 11 Mbps


• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11n: MCS 0 ~ MCS 15, (20MHz, and 40MHz)
• 802.11ac : MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz, and 80MHz)

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Technical Specifications – Networking

Modulation Direct Sequence Spread Spectrum


BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM

Security1 • IEEE and WiFi compliant 64 / 128 bit WEP encryption for a/b/g mode only
• AES-CCMP: 128 bit in hardware
• 802.1x authentication
• WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
• WPA2 certification
• IEEE 802.11i
• Cisco Certified Extensions, all versions through CCX4 and CCX Lite
• WAPI

Network Architecture Ad-hoc (Peer to Peer)


Models Infrastructure (Access Point Required)

Roaming IEEE 802.11 compliant roaming between access points

Output Power2 • 802.11b : +14dBm minimum


• 802.11g : +12dBm minimum
• 802.11a : +12dBm minimum
• 802.11n HT20(2.4GHz) : +12dBm minimum
• 802.11n HT40(2.4GHz) : +12dBm minimum
• 802.11n HT20(5GHz) : +10dBm minimum
• 802.11n HT40(5GHz) : +10dBm minimum
• 802.11ac VHT80(5GHz) : +10dBm minimum

Power Consumption • •Transmit mode2.0 W


• •Receive mode1.6 W
• •Idle mode (PSP)180 mW(WLAN Associated)
• •Idle mode50 mW(WLAN unassociated)
• •Connected Standby 10mW
• •Radio disabled8 mW

Power Management ACPI and PCI Express compliant power management


802.11 compliant power saving mode

Receiver Sensitivity3 • 802.11b, 1Mbps : -93.5dBm maximum


• 802.11b, 11Mbps : -84dBm maximum
• 802.11a/g, 6Mbps : -86dBm maximum
• 802.11a/g, 54Mbps : -72dBm maximum
• 802.11n, MCS07 : -67dBm maximum
• 802.11n, MCS15 : -64dBm maximum
• 802.11ac, MCS0 : -84dBm maximum
• 802.11ac, MCS9 : -59dBm maximum

Antenna type High efficiency antenna with spatial diversity, mounted in the display enclosure
Two embedded dual band 2.4/5 GHz antennas are provided to the card to support WLAN MIMO
communications and Bluetooth communications

Form Factors PCI-Express M.2 MiniCard

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Technical Specifications – Networking

Dimensions Type 2230 : 2.3 x 22.0 x 30.0 mm

Weight Type 2230 : 2.8g

Operating Voltage 3.3v +/- 9%

Temperature Operating: 14° to 158° F (-10° to 70° C)


Non-operating: -40° to 176° F (-40° to 80° C)

Humidity Operating: 10% to 90% (non-condensing)


Non-operating: 5% to 95% (non-condensing)

Altitude Operating: 0 to 10,000 ft (3,048 m)


Non-operating: 0 to 50,000 ft (15,240 m)

LED Activity LED Amber – Radio OFF; LED White – Radio ON

HP Integrated Module with Bluetooth 4.0/4.1/4.2 Wireless Technology

Bluetooth Specification 4.0/4.1/4.2 Compliant

Frequency Band 2402 to 2480 MHz

Number of Available Channels Legacy : 0~79 (1 MHz/CH)


BLE : 0~39 (2 MHz/CH)

Data Rates and Throughput Legacy : 3 Mbps data rate; throughput up to 2.17 Mbps

BLE : 1 Mbps data rate; throughput up to 0.2 Mbps


Legacy : Synchronous Connection Oriented links up to 3, 64 kbps, voice channels

Legacy : Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric (3-DH5) or
864 kbps symmetric (3-EV5)

Transmit Power The Bluetooth component shall operate as a Class II Bluetooth device with a maximum
transmit power of + 4 dBm for BR and EDR.

Receiver Sensitivity Legacy

Power Consumption Peak (Tx) 330 mW


Peak (Rx) 230 mW
Selective Suspend 17 mW

Range Legacy : 0~79 (1 MHz/CH)


BLE : 0~39 (2 MHz/CH)

Electrical Interface USB 2.0 compliant

Bluetooth Software Supported Microsoft Windows Bluetooth Software


Link Topology

Power Management ETS 300 328, ETS 300 826


Certifications Low Voltage Directive IEC950
UL, CSA, and CE Mark

Certifications FCC (47 CFR) Part 15C, Section 15.247 & 15.249
Bluetooth Profiles Supported

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Technical Specifications – Networking

Power Management Microsoft Windows ACPI, and USB Bus Support


Certifications

Certifications BT4.1-ESR 5/6/7 Compliance


Bluetooth Profiles Supported LE Link Layer Ping
LE Dual Mode
LE Link Layer
LE Low Duty Cycle Directed Advertising
LE L2CAP Connection Oriented Channels
Train Nudging & Interlaced Scan
BT4.2 ESR08 Compliance
LE Secure Connection- Basic/Full
LE Privacy 1.2 –Link Layer Privacy
LE Privacy 1.2 –Extended Scanner Filter Policies
LE Data Packet Length Extension
FAX Profile (FAX)
Basic Imaging Profile (BIP)2
Headset Profile (HSP)
Hands Free Profile (HFP)
Advanced Audio Distribution Profile (A2DP)
1. Mobile Broadband is an optional feature. Connection requires wireless data service contract, network support, and is not available in all areas.
Contact service provider to determine the coverage area and availability. Connection speeds will vary due to location, environment, network
conditions, and other factors. 4G LTE not available on all products or in all countries.
2. The FCC has declared products that utilize passive scanning on channel 12/13 and are capable of transmitting must fully comply with
requirements of 15.247 & 15.249 or otherwise disable those channels.
3. Check latest software/driver release for updates on supported security features.
4. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10% for 802.11a/g (OFDM
modulation).
5. Wireless access point and Internet service required and not included. Availability of public wireless access points limited.

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Technical Specifications - Audio

HIGH DEFINITION AUDIO


Type Integrated
HD Stereo Codec Realtek ALC3601
Audio I/O Ports Front side Combo jack for supporting CTIA, Rear side Line-in/ Line-out/ Mic-in jacks
Internal Speaker Amplifier 2W class D mono amplifier for the internal speaker only. External speakers must be powered
externally.
Multi-streaming Capable Playback multi-streaming can be enabled in the audio control panel to allow independent audio
streams to be sent to/from the front and rear jacks or integrated speaker.
HD Audio Codec Realtek ALC3601
Sampling Independent sampling rates for DAC’s and ADC’s; supports resolutions from 16 to 24-bit; 44.1K/
48 K/96K / 192K Hz for DAC and 44.1K/ 48K/ 96K/ 192K Hz Hz for ADC
Wavetable Syntheses Yes
Analog Audio Yes
# of Channels on Line-Out Stereo
Internal Speaker Yes
External Speaker Jack 2W class D mono amplifier for the internal speaker only. External speakers must be powered
externally.

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Technical Specifications - Power

POWER SUPPLY
Operating Voltage Range 90 – 264 VAC
Rated Voltage Range 100-240V AC
Rated Line Frequency 50/60 HZ
Operating Line Frequency 47 – 63 Hz
Rated Input Current 180W : <2.3A;
310W: <4A
Rated Input Current with 180W active PFC
Energy Efficient* Power 87/90/87% efficient at 20/50/100% load (115V)
Supply 88/91/88% efficient at 20/50/100% load (230V);
310W active PFC
87/90/87% efficient at 20/50/100% load (115V)
88/91/88% efficient at 20/50/100% load (230V)
DC Output +12.1V
Current Leakage (NFPA 99: Less than 500 microamps of leakage current at 120 Vac with the ground wire disconnected, as
2102) required for Non-patient Electrical Appliances and Equipment used in a patient care facility or
that contact patients in normal use. Per section 10.3.5.1.
Less than 100 microamps of leakage current at 120 Vac with the ground wire intact with normal
polarity, as required for Non-patient Electrical Appliances and Equipment used in a patient care
facility or that contact patients in normal use. Per section 10.3.5.1.
Power Supply Fan 70*25mm (linear type)

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Technical Specifications – Weights and Dimensions

WEIGHT AND DIMENSIONS


Chassis (W x H x D) 6.69 x 13.3 x 10.79 in (170 x 338 x 274 mm)
System Volume 960.06cu in
15.76L
System Weight* 11.9 lbs / 5.4 kg
Max Supported
Weight (desktop
orientation) N/A
Tower Stand
(H x W x D) 13.42 x 6.69 x 10.92 in (340.8 x 170 x 277.5 mm)
Packaged 11.46 x 15.35 x 19.65 in
(H x W x D) 291 x 390 x499 mm
Shipping Weight 17.64lb / 8 kg
Palletization 6 units per layer
Profile 7layer max
42 per pallet
Footprint
-85.31x39.37x47.24 in ( 2167 x 1000 x1200 mm)

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Technical Specifications – Miscellaneous Features


ADDITIONAL FEATURES
Description
SMART Technology (Self-Monitoring, Allows hard drives to monitor their own health and to raise flags if imminent failures
Analysis and Reporting Technology) were predicted

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After-Market Options (availability may vary by region)

AFTERMARKET OPTIONS
Type Description Part #
Memory HP 4GB DDR4-2666 DIMM 3TK85AA
HP 8GB DDR4-2666 DIMM 3TK87AA
HP 16GB DDR4-2666 DIMM 3TK83AA

Storage HP 500GB SATA 6.0Gb/s Hard Drive QK554AA


HP 1TB 7200rpm SATA 6Gbps Hard Drive QK555AA
HP Turbo Drive Gen2 256GB M.2 SSD Drive 1CA51AA
Intel Optane Memory 16GB (cache) **** 1WV97AA
HP 256GB SATA TLC Non-SED Solid State Drive P1N68AA
HP 9.5mm G3 8/6/4 SFF G4 400 SFF/MT DVD Writer 1CA53AA

Graphics NVIDIA® GT 730 2GB DP Card Z9H51AA


AMD Radeon™ R7 430 Card 1MX32AA

Security HP Business PC Security Lock V2 Kit N3R93AA


HP Keyed Cable Lock 10mm kit T1A62AA

Adapters HP USB to Serial Adapter J7B60AA


HP HDMI Standard Cable Kit T6F94AA
HP USB to Serial Port Adapter J7B60AA

Networking Intel Ethernet I210-T1 GbE NIC Card E0X95AA

Input HP USB Mouse QY777AA


HP USB Hardened Mouse P1N77AA
HP USB Keyboard QY776AA
HP PS/2 Business Slim Keyboard N3R86AA
HP USB Business Slim Keyboard N3R87AA
HP Conferencing Keyboard K8P74AA
HP USB Antimicrobial Slim Keyboard and Mouse Z9H50AA

Others HP Business Headset v2 T4E61AA


HP USB Business Speakers v2 N3R89AA

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QuickSpecs HP 280 G4 Microtower Business PC

Change Log
© Copyright 2020 HP Development Company, L.P. The information contained herein is subject to change without notice. The only
warranties for HP products are set forth in the express limited warranty statements accompanying such products. Nothing herein
should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions
contained herein. Microsoft and Windows are registered trademarks or trademarks of Microsoft Corporation in the U.S. and/or
other countries. Intel, Celeron®, Core, Pentium are registered trademarks or trademarks of Intel Corporation in the U.S. and/or
other countries. Bluetooth is a trademark of its proprietor, used by HP Inc. under license. NVIDIA, GeForce, Kepler and NVS are
trademarks and/or registered trademarks of NVIDIA Corporation in the U.S. and other countries. AMD and Radeon are trademarks
of Advanced Micro Devices, Inc. ENERGY STAR is a registered trademark owned by the U.S. Environmental Protection Agency.

Date of change: Version Change Description of change:


History:
May 3, 2018 From v1 to v2 Update Graphics Section
May 14, 2018 From V2 to V3 Added Environmental Tab
July 5, 2018 From V3 to V4 Added Call outs added to back and front images and redundant wording
removed from pages 1,2,4,6,7,8 and 22.
August 16, 2018 From V4 to V5 Update Call outs details updated
At A Glance disclaimer edited
Dicrete Graphics updated
Memory section footnote edited
Ports updated
Bays section moved under ports
Environmental and industry table updated
Certifications section removed
Nvidia GT 730 2GB x8 GC updated
128GB M.2 TLC SSD and 256G M.2 TLC SSD removed
128GB SATA2.5in TLC SSD and 256G SATA 2.5" TLC SSD added
August 21, 2018 From V5 to V6 Update Dimensions and weight / Weight and dimensions updated
October 17, 2018 From V6 to V7 Update Audio Line out and Audio Link in switched, pages 2 and 7
November 5, 2018 From V7 to V8 Update Note added for Security and Protection
“Wi-Di” removed from footnote 6
December 12, 2018 From V8 to V9 Update Memory section footnote added
March 13, 2019 From V9 to V10 Refresh Document Refresh
March 18, 2019 From V10 to V11 Update Processor i5-9400 removed
March 21 From V11 to V12 Update Processor i5-9400 put back on
April 23, 2019 From V12 to V13 Refresh Processors under embargo added to official QS refresh
April 25, 2019 From V13 to V14 Change Processors section corrected
May 14, 2019 From V14 to V15 Change i7-9700/i5-9400F/i5-9500F processors added
June 07, 2019 From V15 to V16 Update HP Recovery ManagerPBR and ePrint removed
Paging break out corrected
July 2, 2019 From V16 to V17 Update CPU Intel Core i3-9300, i5-9600 and Pentium gold G5620 added and
Intel® Core™ i7-9700 removed to/from processors section
August 1, 2019 From V17 to V18 Update GTX1650 added to graphics
Pentium G5600 added to processors.
August 16, 2019 From V18 to V19 Update PCIe x1 (2.0) corrected
AMD Radeon 520 1GB added
Standard security lock slot upgrade @ call outs
August 21, 2019 From V19 to V20 Update Intel® Core™ i7-9700 put it back to processors section
October 3, 2019 From v20 to v21 Update Miscellaneous Features added
November 13, 2019 From v21 to v22 Update EPEAT references updated
November 27, 2019 From v22 to v23 Update NVIDIA® GeForce® GT1060 6GB GFX reference added to footnote
December 2, 2019 From v23 to v24 Update NVIDIA® GeForce® GT1060 3GB GFX reference added to footnote
February 27, 2020 From v24 to v25 Update Processor i7-9700 Turbo boost tech spec corrected

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