SG5 SERIES SSD

CLIENT SSD
SG5 series are Client SSDs using Toshiba TLC NAND flash memory.
Delivering a storage capacity up to 1,024GB and a 6.0 Gbit/s SATA interface, the SG5 SSDs
are engineered for desktop and notebook PCs.
Further features of the series include QSBC ECC technology from Toshiba for error
correction and reliability.
The versatile SG5 SSD family is also available in thin, space saving M.2 2280 form factor
and standard 2.5-inch type case.
Product image may represent a design model

KEY FEATURES APPLICATIONS

• Capacities up to 1024GB • Desktop PCs
• 3-bit-per-cell NAND Flash Memory • Notebook PCs
• SATA 6.0 Gbit/s interface
• 2.5-inch and M.2 2280 form factor options
• Toshiba Proprietary Quadruple Swing-By Code
(QSBC) ECC

SPECIFICATIONS
M.2 2280-S2 M.2 2280-D2
Standard Models 2.5-inch
(Single-sided) (Double-Sided)
Memory TOSHIBA TLC NAND Flash Memory
Interface SATA revision 3.2
Maximum Speed 6 Gbit/s, 3 Gbit/s, 1.5 Gbit/s
Connector Type Standard SATA M.2 B-M
Formatted Capacity1) 128/256/512/1024 GB 128/256/512 GB 1024 GB
Command ACS-3
Sequential
up to 545 MB/s {520 MiB/s}
Performance Read
1),2)
Sequential
up to 387 MB/s {370 MiB/s}
Write
Sector Size Advanced Format: 4K physical sectors with 512 byte emulation (512e)
Supply Voltage 5.0 V ±5 % 3.3 V ±5 %
Active: 5.6 W typ. Active: 4.0 W typ. Active: 5.5 W typ.
Power Consumption
Idle: 70 mW typ. Idle: 65 mW typ. Idle: 65 mW typ.
Operating: 0 °C - 70 °C Operating: 0 °C - 80 °C
Temperature (case temperature) (components temperature)
Non-operating: -40 °C - 85 °C Non-operating: -40 °C - 85 °C
Mean Time to Failure (MTTF): 1,500,000 hours
Reliability3)
Product Life: Approximately 5 years
100.0 mm x 69.85 mm 80.0 mm x 22.0 mm 80.0 mm x 22.0 mm
Size
x 7.0 mm x 2.23 mm x 3.58 mm
Weight 48 – 51 g typ. 7 g typ. 8.7 g typ.
Toshiba's proprietary error-correction technology, QSBC support.
More Features
Read only mode supported for emergency.
Compliance UL/cUL, TÜV, KC, FCC, BSMI, CE, RCM, ISED, VCCI
Refer to the notes on the next page

Products and specifications discussed herein are for reference purposes

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herein is provided on an “as is” basis, without warranties of any kind.
Client SSD SG5 Series Brochure Rev.1.00
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1) Definition of capacity: Toshiba defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000
bytes and a terabyte (TB) as 1,000,000,000,000 bytes. A computer operating system, however, reports
storage capacity using powers of 2 for the definition of 1GB = 230 = 1,073,741,824 bytes and therefore
shows less storage capacity. Available storage capacity (including examples of various media files) will vary
based on file size, formatting, settings, software and operating system, such as Microsoft Operating System
and/or pre-installed software applications, or media content. Actual formatted capacity may vary.

2) A kibibyte (KiB) means 210, or 1,024 bytes, a mebibyte (MiB) means 220, or 1,048,576 bytes, and a gibibyte
(GiB) means 230, or 1,073,471,824 bytes.

3) MTTF (Mean Time to Failure) is not a guarantee or estimate of product life; it is a statistical value related to
mean failure rates for a large number of products which may not accurately reflect actual operation. Actual
operating life of the product may be different from the MTTF.

* Product image may represent a design model.

* Read and write speed may vary depending on the host device, read and write conditions, and file size.

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 ORDERING INFORMATION

THN SX X XXXX X X X
1 2 3 4 5 6 7

1. Model Name THN: Toshiba NAND drive

2. Model Type SN: Non-SED

3. Controller Type K: Type K

4. Capacity 128G / 256G / 512G / 1T02

128G is 128 GB, 256G is 256 GB, 512G is 512 GB and 1T02 is 1024 GB
(1 GB = 1,000,000,000 bytes)
5. Form Factor C: 2.5-inch (7.0 mm height)

V: M.2 2280-S2 Module type (Single Side)

D: M.2 2280-D2 Module type (Double Side)

6. Host I/F Type S: Standard SATA, N: M.2 B-M SATA type

7. NAND Type 8: TLC

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 PRODUCT LINE UP

Formatted Function
Model Number Interface
Capacity Note
THNSNK128GCS8 128 GB
THNSNK256GCS8 256 GB 2.5-inch
THNSNK512GCS8 512 GB Specification Revision
THNSNK1T02CS8 1024GB
Non-SED
THNSNK128GVN8 128 GB
THNSNK256GVN8 256 GB M.2 Type 2280-S21)-B-M module
THNSNK512GVN8 512 GB
THNSNK1T02DN8 1024GB M.2 Type 2280-D2 2)-B-M module
1) Single Side, 2) Double Side

CAPACITY

Capacity Total Number of User Addressable Sectors in LBA Mode

128 GB 250,069,680
256 GB 500,118,192
512 GB 1,000,215,216
1024 GB 2,000,409,264
Note: 1 GB (Gigabyte) = 1,000,000,000 bytes, Bytes per sector: 512 bytes

PERFORMANCE
THNSNK256GCS8 THNSNK512GCS8
THNSNK128GCS8
THNSNK256GVN8 THNSNK1T02CS8
THNSNK128GVN8
THNSNK512GVN8 THNSNK1T02DN8
Interface Speed 6 Gbit/s max.
Sequential Read1) up to 545 MB/s {520 MiB/s}

up to 136 MB/s up to 262 MB/s up to 387 MB/s

Sequential Write1)
{130 MiB/s} {250 MiB/s} {370 MiB/s}
1) Under the condition of measurement with 128 KiB unit sequential access (1 KiB = 1024 bytes)

Products and specifications discussed herein are for reference purposes

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herein is provided on an “as is” basis, without warranties of any kind.
Client SSD SG5 Series Brochure Rev.1.00
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 SUPPLY VOLTAGE
2.5-inch M.2 2280 Module

Allowable voltage 5.0 V ±5 % 3.3 V ±5 %

Allowable noise/ripple 100 mV p-p or less
Allowable supply rise time 2 –100 ms
Note: These drives have over current protection circuit. (Rated current: 3.15A)

POWER CONSUMPTION
Operation 2.5-inch
(Ta 1)=25°C)
THNSNK128GCS8 THNSNK256GCS8 THNSNK512GCS8 THNSNK1T02CS8
Read2) 2.5 W typ. 2.5 W typ. 2.6 W typ. 2.7 W typ.
Write2) 2.8 W typ. 4.3 W typ. 5.5 W typ. 5.6 W typ.
3) 4)
Idle 65 mW typ. 65 mW typ. 65 mW typ. 70 mW typ.
Standby3) 4) 60 mW typ. 60 mW typ. 65 mW typ. 70 mW typ.
Sleep3) 60 mW typ. 60 mW typ. 65 mW typ. 70 mW typ.
DevSleep 6 mW max. 6 mW max. 6 mW max. 6 mW max.

Operation M.2 2280 Module

(Ta 1)=25°C)
THNSNK128GVN8 THNSNK256GVN8 THNSNK512GVN8 THNSNK1T02DN8
Read2) 2.3 W typ. 2.4 W typ. 2.5 W typ. 2.5 W typ.
Write2) 2.7 W typ. 3.8 W typ. 4.0 W typ. 5.5 W typ.
Idle3) 4) 65 mW typ. 65 mW typ. 65 mW typ. 65 mW typ.
Standby3) 4) 60 mW typ. 60 mW typ. 60 mW typ. 60 mW typ.
Sleep3) 60 mW typ. 60 mW typ. 60 mW typ. 60 mW typ.
DevSleep 5 mW max. 5 mW max. 5 mW max. 5 mW max.
1) Ambient Temperature
2) The values are specified at the condition causing maximum power consumption.
3) The values are based on using SATA power management features. The Slumber mode is used for the
power consumption measurements.
4) The drive may internally write to NAND flash memory, while the drive is in idle or standby. Therefore,
drive power consumption may temporally change up to write power.

Products and specifications discussed herein are for reference purposes

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only and are subject to change without notice. All information discussed
Copyright © 2016 Toshiba Corporation. All Rights Reserved.
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Client SSD SG5 Series Brochure Rev.1.00
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 ENVIRONMENTAL CONDITIONS

TEMPERATURE
Range
Condition Gradient
2.5-inch M.2 2280 Module
Operating 1) 0 °C (Tc) – 70 °C (Tc) 0°C (Tc) – 80°C (Tc) 30 °C (Ta) / h maximum
Non-operating -40 °C – 85 °C 30 °C / h maximum
Under Shipment 2) -40 °C – 85 °C 30 °C / h maximum
1) Ta: Ambient Temperature, Tc: Case or Components Temperature
2) Packaged in Toshiba’s original shipping package

HUMIDITY
Condition Range
Operating 8 % – 90 % R.H. (No condensation)
Non-operating 8 % – 95 % R.H. (No condensation)
Under Shipment 1) 5 % – 95 % R.H.
1) Packaged in Toshiba’s original shipping package

SHOCK
Condition Range
Operating
14.709 km/s2 {1500 G}, 0.5 ms, half sine wave
Non-operating
Under Shipment 1) 100 cm free drop
1) Apply shocks in each direction of the drive’s three mutually perpendicular axes, one axis at a time.
Packaged in Toshiba’s original shipping package.

VIBRATION
Condition Range
Operating 196 m/s2 {20 G} Peak, 10 - 2,000 Hz
Non-operating (20 minutes per axis) x 3 axis

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 COMPLIANCE

SAFETY / EMI STANDARDS

Title Description Region

UL
UL 60950-1 USA
(Underwriters Laboratories)
cUL
CSA-C22.2 No.60950-1 Canada
(Underwriters Laboratories of Canada)
TÜV
EN 60950-1 EURO
(Technischer Überwachungs Verein)
KC KN22, KN24 Korea
FCC FCC part 15 Subpart B USA
BSMI
CNS13438(CISPR Pub. 22) Taiwan
(Bureau of Standards, Metrology and Inspection)
CE EN 55022, EN 55024 EURO
AS/NZS CISPR Pub. 22 Australia,
RCM
New Zealand
ISED ICES-003 Canada
VCCI Class B Japan

RELIABILITY

Parameter Value
Mean Time to Failure 1,500,000 hours
Product Life Approximately 5 years

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 MECHANICAL SPECIFICATIONS

2.5-INCH

Model Weight Width Height Length

THNSNK128GCS8 48 g typ.
THNSNK256GCS8 50 g typ.
7.0 mm 69.85 mm 7.0 mm 100.0 mm
THNSNK512GCS8
51 g typ.
THNSNK1T02CS8

Figure 1: 2.5-inch Drive Dimension

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 2.5-INCH DIMENSIONS

SFF-8200 Rev3.2 1)
Toshiba SG5 SSD
SFF-8201 Rev3.3
Dimension (Differences only)
SFF-8223 Rev2.5
Millimeters Inches Millimeters Inches
A1 7.00 0.276
A2 0.20 0.008
A3 0.50 0.020
A4 69.85 2.750
A5 0.25 0.010
A6 2) 100.45 * 3.955 * 100.00 ± 0.41 3.937 ± 0.016
A7 3.5 0.138
A8 9.40 0.370 9.40 ± 0.51 0.370 ± 0.020
A10 3) - - 30.125 ± 0.28 1.186 ± 0.011
A12 0.38 0.015
A23 3.00 0.118 3.00 ± 0.20 0.118 ± 0.007
A26 M3 N/A
A28 4.07 0.160 4.07 + 0.295/-0.305 0.060 +0.011/-0.012
A29 61.72 2.430 61.72 ± 0.25 2.430 ± 0.010
A32 M3 N/A
A38 3# 3#
A41 2.5 # 2.5 #
A50 2) 14.00 0.551 14.00 ± 0.25 0.551 ± 0.010
A51 2) 90.60 3.567 90.60 ± 0.30 3.567 ± 0.012
2)
A52 14.00 0.551 14.00 ± 0.25 0.551 ± 0.010
2)
A53 90.60 3.567 90.60 ± 0.30 3.567 ± 0.012
* = maximum
# = minimum number of threads

1) SFF-8200: Small Form Factor Standard

2) PCB, Connector not included
3) Connector center defined is the same as SFF-8223

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 M.2 2280 MODULE

Model Weight Width Height Length

THNSNK128GVN8
THNSNK256GVN8 7.0 g typ. 2.23 mm
22.0 mm 80.0 mm
THNSNK512GVN8
THNSNK1T02DN8 8.7 g typ. 3.58 mm

Figure 2: M.2 2280-S2 Module Dimension

Unit:mm

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 Figure 3: M.2 2280-D2 Module Dimension

Unit:mm

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INTERFACE CONNECTOR

2.5-inch Case Serial ATA Interface Connector

Figure 4: 2.5-inch Case Serial ATA Interface Connector

Unit:mm

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 2.5-INCH DRIVE CONNECTER PIN ASSIGNMENT1)
Pin
Segment Name Description
Position
S1 GND 2nd Mate
S2 A+
Differential Signal Pair A (Device Rx), 3rd Mate
S3 A-
Signal
S4 GND 2nd Mate
Segment
S5 B-
Differential Signal Pair B (Device Tx), 3rd Mate
S6 B+
S7 GND 2nd Mate
Signal segment “L”
Central connector polarizer
Power segment “L”
P1 Retired 2)
P2 Retired 2)
P3 DEVSLP 2) Enter/Exit DevSleep
P4 GND 1st Mate
P5 GND 2nd Mate
P6 GND 2nd Mate
P7 V5 5 V power, pre-charge 3), 2nd Mate
Power
P8 V5 5 V power, 3rd Mate
Segment
P9 V5 5 V power, 3rd Mate
P10 GND 2nd Mate
P11 DAS/DSS Drive Activity Signal / Disable Staggered Spin-up, 3rd Mate
P12 GND 1st Mate
P13 V12 12 V power, pre-charge, 2nd Mate (Unused)
P14 V12 12 V power (Unused), 3rd Mate
P15 V12 12 V power (Unused), 3rd Mate
Power segment key

U1 N.C. Not connected

U2 TX For test use, Not connected
U3 UX For test use, Not connected
U4 GND
1) The Mate orders are for backplane usage. Hot-Plug and OS-Aware Hot Removal are supported when using
with a backplane connector.
2) Previously, 3.3 V was assigned to pins P1, P2 and P3 by Serial ATA International Organization.
3) Direct connect to non pre-charge pins.

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 M.2 2280 MODULE INTERFACE CONNECTOR

Figure 5: M.2 2280 Module Interface Connector

Unit:mm

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 PIN ASSIGNMENT ON M.2 2280 MODULE CONNECTOR

Pin Pin
Name Description Name Description
# #
1 CONFIG_3 Defines module type(GND) 2 +3.3V 3.3 V Source
3 GND GND 4 +3.3V 3.3 V Source
5 Reserved NC 6 Reserved NC
7 Reserved NC 8 Reserved NC
Drive Activity Signal /
9 Reserved NC 10 DAS/DSS
Disable Staggered Spin-up
11 Reserved NC
Notch
Notch
20 Reserved NC
21 CONFIG_0 Defines module type(GND) 22 Reserved NC
23 Reserved NC 24 Reserved NC
25 Reserved NC 26 Reserved NC
27 GND GND 28 Reserved NC
29 Reserved NC 30 Reserved NC
31 Reserved NC 32 Reserved NC
33 GND GND 34 Reserved NC
35 Reserved NC 36 Reserved NC
37 Reserved NC 38 DEVSLP DEVSLP signal
39 GND GND 40 Reserved NC
41 B+ Host Receiver Differential 42 Reserved NC
43 B- Signal Pair 44 Reserved NC
45 GND GND 46 Reserved NC
47 A- Host Transmitter 48 Reserved NC
49 A+ Differential Signal Pair 50 Reserved NC
51 GND GND 52 Reserved NC
53 Reserved NC 54 Reserved NC
55 Reserved NC 56 MFG1 Manufacturing pin. Must be a
57 GND GND 58 MFG2 no-connect on the host board.

Notch Notch

67 Reserved NC 68 Reserved NC
69 CONGIG_1 Defines module type(GND) 70 +3.3V 3.3 V Source
71 GND GND 72 +3.3V 3.3 V Source
73 GND GND 74 +3.3V 3.3 V Source
75 CONGIG_2 Defines module type(GND)

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 COMMAND TABLE
ADMIN Command set
Op-Code Command Name
00h NOP
06h DATA SET MANAGEMENT
10h RECALIBRATE
20h READ SECTOR(S)
21h READ SECTOR(S) without retries
24h READ SECTOR(S) EXT
25h READ DMA EXT
27h READ NATIVE MAX ADDRESS EXT
29h READ MULTIPLE EXT
2Fh READ LOG EXT
30h WRITE SECTOR(S)
31h WRITE SECTOR(S) without retries
34h WRITE SECTOR(S) EXT
35h WRITE DMA EXT
37h SET MAX ADDRESS EXT
39h WRITE MULTIPLE EXT
3Dh WRITE DMA FUA EXT
3Fh WRITE LOG EXT
40h READ VERIFY SECTOR(S)
41h READ VERIFY SECTOR(S) without retries
42h READ VERIFY SECTOR(S) EXT
45h WRITE UNCORRECTABLE EXT
45h 55h Create a pseudo-uncorrectable error with logging
45h AAh Create a flagged error without logging
47h READ LOG DMA EXT
57h WRITE LOG DMA EXT
5Bh TRUSTED NON-DATA
5Ch TRUSTED RECEIVE
5Dh TRUSTED RECEIVE DMA
5Eh TRUSTED SEND
5Fh TRUSTED SEND DMA
60h READ FPDMA QUEUED
61h WRITE FPDMA QUEUED

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 Op-Code Feature Name
70h SEEK
90h EXECUTE DEVICE DIAGNOSTIC
91h INITIALIZE DEVICE PARAMETERS
92h DOWNLOAD MICROCODE
92h 03h Download with offsets and save microcode for immediate and future use
92h 07h Download and save microcode for immediate and future use
92h 0Eb Download with offsets and save microcode for future use
92h 0Fb Activate downloaded microcode
93h DOWNLOAD MICROCODE DMA
93h 03h Download with offsets and save microcode for immediate and future use
93h 07h Download and save microcode for immediate and future use
93h 0Eb Download with offsets and save microcode for future use
93h 0Fb Activate downloaded microcode
B0h SMART
B0h D0h SMART READ DATA
B0h D1h SMART READ ATTRIBUTE THRESHOLDS
B0h D2h SMART ENABLE/DISABLE ATTRIBUTE AUTOSAVE
B0h D3h SMART SAVE ATTRIBUTE VALUES
B0h D4h SMART EXECUTE OFF-LINE IMMEDIATE
B0h D4h 00h Execute SMART off-line routine in off-line mode
B0h D4h 01h Execute SMART Short self-test routine in off-line mode
B0h D4h 02h Execute SMART Extended self-test routine in off-line mode
B0h D4h 04h Execute SMART Selective self-test routine in off-line mode
B0h D4h 7Fh Abort off-line mode self-test routine
B0h D4h 81h Execute SMART Short self-test routine in captive mode
B0h D4h 82h Execute SMART Extended self-test routine in captive mode
B0h D4h 84h Execute SMART Selective self-test routine in captive mode
B0h D5h SMART READ LOG
B0h D6h SMART WRITE LOG
B0h D8h SMART ENABLE OPERATIONS
B0h D9h SMART DISABLE OPERATIONS
B0h DAh SMART RETURN STATUS
B0h DBh SMART ENABLE/DISABLE AUTOMATIC OFF-LINE
B1h DEVICE CONFIGURATION OVERLAY
B1h C0h DEVICE CONFIGURATION RESTORE
B1h C1h DEVICE CONFIGURATION FREEZE LOCK
B1h C2h DEVICE CONFIGURATION IDENTIFY

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 Op-Code Feature Name
B1h C3h DEVICE CONFIGURATION SET
B1h C4h DEVICE CONFIGURATION IDENTIFY DMA
B1h C5h DEVICE CONFIGURATION SET DMA
B4h SANITIZE DEVICE
B4h 00h SANITIZE STATUS EXT
B4h 11h CRYPTO SCRAMBLE EXT
B4h 12h BLOCK ERASE EXT
B4h 20h SANITIZE FREEZE LOCK EXT
C4h READ MULTILE
C5h WRITE MULTIPLE
C6h SET MULTIPLE MODE
C8h READ DMA
C9h READ DMA without retries
CAh WRITE DMA
CBh WRITE DMA without retries
CEh WRITE MULTIPLE FUA EXT
E0h STANDBY IMMEDIATE
E1h IDLE IMMEDIATE
E2h STANDBY
E3h IDLE
E4h READ BUFFER
E5h CHECK POWER MODE
E6h SLEEP
E7h FLUSH CACHE
E8h WRITE BUFFER
E9h READ BUFFER DMA
EAh FLUSH CACHE EXT
EBh WRITE BUFFER DMA
ECh IDENTIFY DEVICE
EFh SET FEATURES
EFh 02h Enable volatile write cache
EFh 03h Set transfer mode
EFh 05h Enable the APM feature set
EFh 10h Enable use of SATA feature set
EFh 10h 02h Enable DMA Setup FIS Auto-Activate optimization
EFh 10h 03h Enable Device-initiated interface power state (DIPM) transitions
EFh 10h 06h Enable Software Settings Preservation(SSP)

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 Op-Code Feature Name
EFh 10h 07h Enable Device Automatic Partial to Slumber transitions
EFh 10h 09h Enable Device Sleep
EFh 55h Disable read look-ahead
EFh 66h Disable reverting to power-on defaults
EFh 82h Disable volatile write cache
EFh 85h Disable the APM feature set
EFh 90h Disable use of SATA feature set
EFh 90h 02h Disable DMA Setup FIS Auto-Activate optimization
EFh 90h 03h Disable Device-initiated interface power state (DIPM) transitions
EFh 90h 06h Disable Software Settings Preservation(SSP)
EFh 90h 07h Disable Device Automatic Partial to Slumber transitions
EFh 90h 09h Disable Device Sleep
EFh AAh Enable read look-ahead
EFh CCh Enable reverting to power-on defaults
F1h SECURITY SET PASSWORD
F2h SECURITY UNLOCK
F3h SECURITY ERASE PREPARE
F4h SECURITY ERASE UNIT
F5h SECURITY FREEZE LOCK
F6h SECURITY DISABLE PASSWORD
F8h READ NATIVE MAX ADDRESS
F9h SET MAX ADDRESS
F9h 01h SET MAX SET PASSWORD
F9h 02h SET MAX LOCK
F9h 03h SET MAX UNLOCK
F9h 04h SET MAX FREEZE LOCK
F9h 05h SET MAX SET PASSWORD DMA
F9h 06h SET MAX UNLOCK DMA

Products and specifications discussed herein are for reference purposes

19 / 20
only and are subject to change without notice. All information discussed
Copyright © 2016 Toshiba Corporation. All Rights Reserved.
herein is provided on an “as is” basis, without warranties of any kind.
Client SSD SG5 Series Brochure Rev.1.00
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.
 RESTRICTIONS ON PRODUCT USE

• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make
changes to the information in this document, and related hardware, software and systems (collectively
"Product") without notice.
• This document and any information herein may not be reproduced without prior written permission from
TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without
alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail.
Customers are responsible for complying with safety standards and for providing adequate designs and
safeguards for their hardware, software and systems which minimize risk and avoid situations in which a
malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including
data loss or corruption. Before customers use the Product, create designs including the Product, or
incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest
versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the
data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA
Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be
used with or for. Customers are solely responsible for all aspects of their own product design or applications,
including but not limited to (a) determining the appropriateness of the use of this Product in such design or
applications; (b) evaluating and determining the applicability of any information contained in this document, or
in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents;
and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO
LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT
REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A
MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY,
SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). Except for
specific applications as expressly stated in this document, Unintended Use includes, without limitation,
equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment
used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to
control combustions or explosions, safety devices, elevators and escalators, devices related to electric power,
and equipment used in finance-related fields. IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA
ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales representative.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in
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• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is
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• The information contained herein is presented only as guidance for Product use. No responsibility is assumed
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whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND
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TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT,
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LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS
OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS
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INFORMATION, OR NONINFRINGEMENT.
• Do not use or otherwise make available Product or related software or technology for any military purposes,
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related software and technology may be controlled under the applicable export laws and regulations including,
without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration
Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in
compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS
compatibility of Product. Please use Product in compliance with all applicable laws and regulations that
regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive.
TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF
NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.

Products and specifications discussed herein are for reference purposes

20 / 20
only and are subject to change without notice. All information discussed
Copyright © 2016 Toshiba Corporation. All Rights Reserved.
herein is provided on an “as is” basis, without warranties of any kind.
Client SSD SG5 Series Brochure Rev.1.00
Before creating and producing designs and using, customers must refer to
and comply with the latest versions of the product specifications.