TECHNICAL BULLETIN

ALPHA® SLS 65
No Clean Flux

DESCRIPTION

ALPHA SLS 65 is an active, low solid, no-clean flux. It is formulated with a proprietary mixture
of organic activators. Several proprietary additives are formulated into ALPHA SLS 65, which
act to reduce the surface tension between the solder resist and the solder, thereby dramatically
reducing the tendency of solder ball generation. The formulation of ALPHA SLS 65 is also
designed to be more thermally stable, thereby reducing the occurrence of solder bridging.

ALPHA SLS 65 was specifically developed to eliminate the tendency for solder balling and
solder bridging – two defects which are normally associated with the use of the chip wave. Of
all low solids (<4% solids), no-clean fluxes, ALPHA SLS 65 exhibits the lowest tendency for
solder ball generation over a wide variety of solder masks. ALPHA SLS 65 should be
considered for use by any assembler who has board designs which are sensitive to solder
bridging, performs pin testing, and / or whose specification requires an extremely low frequency
of solder balls.

READ ENTIRE TECHNICAL DATA SHEET BEFORE USING THIS PRODUCT

FEATURES & BENEFITS

• Thermally stable activators provide the lowest solder bridging in a low-solids, no-clean flux.
• Reduces the surface tension between solder and resist to provide the lowest solder ball
frequency of any low solids, no-clean flux.
• Very low level of non-tacky residue to reduce interference with pin testing and exhibit no
visible residue.
• Cleaning is not required which reduces operating costs.
• Bellcore Compliant for long term electrical reliability.

APPLICATION GUIDELINES

Preparation: In order to maintain consistent soldering performance and electrical reliability, it is

important to begin the process with circuit boards and components that meet established
requirements for solderability and ionic cleanliness. It is suggested that assemblers establish
specifications on these items with their suppliers and that suppliers provide Certificates of
Analysis with shipments and / or assemblers perform incoming inspection. A common
specification for the ionic cleanliness of incoming boards and components is 0.77μg/cm2
(5μg/in2) maximum, as measured by an Omegameter with heated solution. Care should be

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taken in handling the circuit boards throughout the process. Boards should always be held at
the edges. The use of clean, lint-free gloves is also recommended. When switching from one
flux to another, the use of a new foam stone is recommended (for foam fluxing). Conveyors,
fingers and pallets should be cleaned. ALPHA SM110 Solvent Cleaner has been found very
useful for these cleaning applications. When foam fluxing, do not use hot fixtures or pallets.
Hot fixtures or pallets will deteriorate the foam head.

Flux Application: ALPHA SLS 65 is formulated to be applied by foam, wave or spray methods.
When foam fluxing, the foam fluxer should be supplied with compressed air which is free of oil
and water. Keep the flux tank full at all times. The flux level should be maintained 25 to 40mm
(1 to 1½”) above the top of the stone. Adjust the air pressure to produce the optimum foam
height with a fine, uniform foam head. A uniform coating of flux is essential to successful
soldering. When using the foam or wave method of application, an air knife is recommended
after the fluxing operation, an air knife will help ensure that the flux is uniformly distributed
across the board and will remove the excess flux. When spray fluxing, the uniformity of the
coating can be visually checked by running a piece of cardboard over the spray fluxer or by
processing a board-sized piece of tempered glass through the spray and then through the
preheat section.

Operating Parameter Recommendation

Foam, Wave: 155 to 232 µg/cm2 of solids
Amount of flux to be applied
Spray: 70 to 125 µg/cm2 of solids
When foam fluxing:
Foam Stone Pore Size 20 to 50μm
Distance that top of stone is submerged below 25 to 38mm
flux
Foam Fluxer Chimney Opening 10 to 13mm
When foam fluxing, use an air knife:
Air knife hole diameter:
1 to 1.5mm
Distance between holes
4 to 5mm
Distance from Fluxer to Air knife
10 to 15cm
Air knife angle back toward fluxer from
3 to 5°
perpendicular
Topside Preheat Temperature 100 to 120 °C
Bottom side Preheat Temperature about 35 °C higher than topside
Maximum ramp rate of topside temperature
2 °C/second maximum
(to avoid component damage)
Conveyor angle 5 to 8 °C (6 °C most common)

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Operating Parameter Recommendation

Conveyor speed 1.00 to 2.00 meters/minute
Contact time in the solder 1.5 to 3.5 seconds (2½ to 3 seconds most
(includes chip wave and primary wave) common)
Solder pot temperature 235 to 260°C
These are general guidelines, which have proven to yield excellent results; however, depending
upon your equipment, components and circuit boards; your optimal settings may be different. In
order to optimize your process, it is recommended to perform a designed experiment, optimizing
the most important variables (amount of flux applied, conveyor speed, topside preheat
temperature, solder pot temperature and board orientation).

Flux Solids Control: If foam, wave, or rotary drums spray fluxing, the flux solids will need to be
controlled via thinner addition to replace evaporative losses of the flux solvent. As with any flux
with less than 5% solids content, specific gravity is not an effective measurement for assessing
and controlling the solids content. Monitoring and controlling the acid number is recommended
for maintaining the solids content. The acid number should be controlled between 17 and 19.
When operating the foam fluxer continuously, the acid number should be checked every two to
four hours.

Over time, debris and contaminants will accumulate in recirculating type flux applicators. After
emptying the flux, the reservoir and foam stone should be thoroughly cleaned with flux thinner.

Residue Removal: ALPHA SLS 65 is a no-clean flux and the residues are designed to be left
on the board. However, if desired, ALPHA SLS 65 residues can be removed with ALPHA 2110
Saponifier.

Touch-Up/Rework: Use of ALPHA Cleanline Write Flux Applicator with ALPHA NR205 flux,
and ALPHA Telecore Plus cored solder wire is recommended for hand soldering applications.

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TECHNICAL DATA

Item Typical Values Item Typical Values

Appearance Clear, colorless liquid Flash Point (T.C.C.) 12 °C (53 °F)

Solids Content, wt/wt 2.3% Recommended Thinner ALPHA 425
Specific Gravity @
Bellcore TR-NWT-000078,
(77±1 °F) 0.801 ± 0.003 Yes
Issue 3 compliant
(25 °C ±1.8 °C)
Acid Number
18 +/-1 IPC J-STD-004 Designation ORL0
(mg KOH/g)
pH (5% aqueous Shelf Life
3.36 +/- 0.30 360 days
solution) (from Date of Mfg.)

CORROSION & ELECTRICAL TESTING

Corrosion Test
Test Requirement for ROL0 Results
Silver Chromate Paper
No detection of halide PASS
IPC-TM 650 Test Method 2.3.33
Copper Mirror Test
IPC No complete removal of copper PASS
IPC-TM 650 Test Method 2.3.32
Copper Corrosion Test
No evidence of corrosion PASS
IPC-TM650 Test Method 2.6.15

IPC-J-STD-004A Surface Insulation Resistance (All values shown are in ohms)

Test Conditions Requirements Results
“Comb down” – Uncleaned 85 °C/85% RH, 7 days > 1.0 x 108 2.1 x 109
“Comb up” – Uncleaned 85 °C/85% RH, 7 days > 1.0 x 108 1.5 x 109
Control Board 85 °C/85% RH, 7 days >1.0 x 109 1.1 x 1010
IPC Test Condition (per J-STD-004A): --50V, measurement @ 100V/IPC B-24 board (0.4 mm
lines, 0.5 mm spacing).

Bellcore Surface Insulation Resistance (All values shown are in ohms)

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Test Condition Requirements Results

Bellcore “Comb-Down” – uncleaned > 1.0 x 1011 4.5 x 1011
Bellcore “Comb-Up” – Uncleaned > 1.0 x 1011 1.4 x 1011
Bellcore Control Board > 2.0 x 1011 9.3 x 1011
Bellcore Test Condition (per TR NWT-000078, Issue 3): 48 Volts, measurement @ 100V/25 mil
lines/50 mil spacing.

Bellcore Electromigration
Visual
Test SIR (Initial) SIR (Final) Requirement Result
Result
"Comb-Up"
6.8 x 109 Ω 2.1 x 109 Ω SIR(Initial) / SIR(Final) <10 Pass Pass
Uncleaned
"Comb-Down"
1.0 x 1011 Ω 3.2 x 1011 Ω SIR(Initial) / SIR(Final) <10 Pass Pass
Uncleaned
Bellcore Test Condition (per GR 78-CORE, Issue1): 65 °C/85% RH/500 Hours/10V,
measurement @ 100V/IPC B-25B Pattern (12.5 mil lines, 12.5 mil spacing).

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SAFETY & WARNING

It is recommended that the company/operator read and review the Safety Data Sheets for the
appropriate health and safety warnings before use. Safety Data Sheets are available at
MacdermidAlpha.com/assembly-solutions/knowledge-base

CONTACT INFORMATION

To confirm this document is the most recent version, please contact

[email protected]
www.macdermidalpha.com

North America Europe Asia

109 Corporate Blvd. Unit 2, Genesis Business Park 8/F., Paul Y. Centre
South Plainfield, NJ 07080, USA Albert Drive 51 Hung To Road
800.367.5460 Woking, Surrey, GU21 5RW, UK Kwun Tong, Kowloon, Hong Kong
01483.758400 852.3190.3100

Also read carefully warning and safety information on the Safety Data Sheet. This data sheet contains technical information required for safe and economical operation of this product. READ IT
THOROUGHLY PRIOR TO PRODUCT USE . Emergency safety directory assistance: US 1 202 464 2554, Europe + 44 1235 239 670, Asia + 65 3158 1074, Brazil 0800 707 7022 and 0800
172 020, Mexico 01800 002 1400 and (55) 5559 1588

DISCLAIMER: All statements, technical information and recommendations contained herein are based on tests we believe to be reliable, but the accuracy or completeness thereof is not
guaranteed. No statement or recommendation shall constitute a representation unless set forth in an agreement signed by officers of seller and manufacturer. NO WARRANTY OF
MERCHANTABILITY, WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE OR ANY IMPLIED WARRANTY IS MADE. The following warranty is made in lieu of such warranties and all
other warranties, express, implied, or statutory. Products are warranted to be free from defects in material and workmanship at the time sold. The sole obligation of seller and manufacturer
under this warranty shall be to replace any noncompliant product at the time sold. Under no circumstances shall manufacturer or seller be liable for any loss, damage or expense, direct,
indirect, incidental or consequential, arising out of the inability to use the product. Notwithstanding the foregoing, if products are supplied in response to a customer request that specifies
operating parameters beyond those stated above, or if products are used under conditions exceeding said parameters, the customer by acceptance or use thereof assumes all risk of product
failure and of all direct, indirect, incidental and consequential damages that may result from use of the products under such conditions, and agrees to exonerate, indemnify, defend and hold
harmless MacDermid, Incorporated and its affiliates therefrom. No suggestion for product use nor anything contained herein shall be construed as a recommendation to use any product in a
manner that infringes any patent or other intellectual property rights, and seller and manufacturer assume no responsibility or liability for any such infringement.

© 2019 MacDermid, Inc. and its group of companies. All rights reserved. “(R)” and “TM” are registered trademarks or trademarks of MacDermid, Inc. and its group of companies in the United States and/or
other countries.

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