Scribd
Upload
5 views20 pages

Electronic Circuits 2: EC 432 - Lecture # 10

Service manual

Uploaded by

karamsobieh
Copyright
© © All Rights Reserved
Available Formats
Download as PPS, PDF, TXT or read online on Scribd
Download as pps, pdf, or txt
5 views20 pages

Electronic Circuits 2: EC 432 - Lecture # 10

Service manual

Uploaded by

karamsobieh
Copyright
© © All Rights Reserved
Available Formats
Download as PPS, PDF, TXT or read online on Scribd
Download as pps, pdf, or txt
Download as pps, pdf, or txt
You are on page 1/ 20

EC 432 - Lecture # 10

ELECTRONIC CIRCUITS 2

Intro
duct
Tech ion to I
nolo C
gies

Hani Fikry – Khaled Shehata


What is an Integrated Circuit ?

•A combination of interconnected
elements (components and
devices) inseparably fabricated
on a single crystal substrate
(mostly silicon).
Types of Integrated Circuits

Standard Custom

Logic Families
(mostly TTL and CMOS)
Application-Specific
HW Programmable Integrated Circuits :
(mostly PLA and ROM) ASICs
(mixed analog/digital)
SW Programmable
(mostly EPROM, P)

Analog
(mostly Opamps, Regulators)
Types of Integrated Circuits

Custom

Application-Specific
Integrated Circuits :
ASICs
(mixed analog/digital)
The complete
application-
specific board
is integrated
in a single chip
Why Integrated Circuits ? (1)

• Better reliability (lower failure rate)


• More than 50 to 60 % of failures  dry solder joints
Example: 20 bit register (TTL: 1FF=6 gates, 1 Gate=5 Tr + 4 resistances)

solution Discrete TTL IC Single


# joints at Chip
Package 1800 160 24

PCB 1600 180 Non

PCB 180 Non Non


Racks
Total 3580 340 24
Why Integrated Circuits ? (2)

• Higher performance
• Lower power consumption
• Lower cost
• Simpler testing and troubleshooting
• Higher security (hard reverse engineering)
• Faster design
• Small size
DEFINING TERMS

* Wafer
• Chip (Die)
• System
• Electronic-Grade (EG) Silicon
•Single-Crystalline EG Silicon
• Silicon ingot
• Batch processing for mass production
* Packaged Chip (IC)
* Die Bonding
* Wire Bonding
* Production Cycle
WHAT IS A WAFER ?

* A large circular sheet of single


crystalline silicon
( = 8”, 10” or 12”, thickness =
0.5 - 1 mm, resistivity 0.1- 20 
cm, p-type or n-type, CZ grown,
mirror-like polished surface).
* Many identical chips are to be
fabricated on a single wafer
( typically 500 chip/wafer).
* Many wafers are to be
processed simultaneously (batch
processing).
WHAT IS A CHIP ?

*A small piece of silicon (nearly square) on


which the entire circuit is fabricated.

* Typical size = many mms to few cms per


side

* Standard P Chip in the year 2005:


size 0.95” per side
# of transistors 200 Million
Transistor channel length 0.1 m
Clk frequency 2 - 3.5 GHz
Supply voltage 1 V
Power dissipation 160 W
WHAT IS A SYSTEM ?

A chip set
in a given
application
Electronic Grade (EG) Silicon from Sand

*Starting raw material = Quartzite (relatively pure sand)


*Carbon reduction at 1200oC:
SiO2(impure)+2C=Si(MG)+2CO

*Purification (Siemens process) at 300oC:


Si(MG)+3HCl(g)= H2(g)+ SiHCl3(g)+imp. chlorides
*SiHCl3 (TCS: Tri-Chloro-Silane) boiling pt.=32oC
*Multiple fractional distillation gives EG pure TCS
*Back hydrogen reduction at 1000oC:
H2(g)+ SiHCl3(pure gas) = Si(EG polycrystals)+3HCl(g)

* Load a crucible by EG polycrstalline Si


* Melt the EG Si (1430oC)
* Crystallization from the melt (Czochralski Method):
Liquid (melt) Solid by cooling
Liquid (melt) Crystal by slow cooling + seed
CZOCHRALSKI
CRYSTAL PULLER

Pull rate = 2 mm/mn


Seed holder
Rotation speed = 2 rpm
seed

crystal
Silicon melt
Silicon melt
TYPICAL
CRYSTAL
FAB
FACILITY
Wafer
slicing

8”
(200mm)
to
12” >3m
(300mm)

Weight > 60 kg
Potential for Mass
Production

Batch Processing
Batch= 50 - 250 wafer

Die (Chip) Slicing


Wafer = 100-500 chips
Packaged Chip (IC) (DIP: Dual In-line Package)

Bonding Wire

Chip
L
Mounting
Cavity

L’ Lead Frame

Pin
Through-Hole

SM
Make Rise- and Fall Times as slow as possible
Die Bonding

* Fixing a chip inside a


package cavity.

* Apply a glue on the


cavity surface and
press
the chip backside
down
Connecting chip terminals (pads)
To
Package terminals (pins)

Package
Chip
Wire Bonding

A special sewing machine


is
used for wire bonding
using
Production Cycle

Market study - Idea - Feasibility study - Design - Prototype fabrication -


Packaging - Testing and evaluation - Mass production

Design
Fabrication
Packaging
Final Product

You might also like