Bd183x7efv m e

Datasheet
For Automotive, 40 V 150 mA 4ch

Constant Current LED Driver
BD18337EFV-M BD18347EFV-M
General Description Key Specifications
BD18337EFV-M / BD18347EFV-M are 40 ◼ Input Voltage Range: 5.5 V to 20.0 V
V-withstanding constant current LED driver for ◼ Maximum Output Current: 150 mA/ch
automotive applications. It is a 4 channel LED driver with ◼ Output Current Accuracy: ±5 %
the built-in energy sharing control which can realize to ◼ Relative Channel Accuracy: ±5 %
make the board size small. High reliability can be ◼ Operating Temperature Range: -40 °C to +125 °C
realized with LED Open Detection, the OUTx (all later
x=1 to 4) pin Short Circuit Protection, Over Voltage Mute Package W (Typ) x D (Typ) x H (Max)
and Thermal Shutdown Function. In case the output HTSSOP-B16 5.00 mm x 6.40 mm x 1.00 mm
OUTx pin has 3 LEDs in series, BD18337EFV-M has to
be used, in case of 2 LEDs in series, BD18347EFV-M
has to be used.
Features
◼ AEC-Q100 Qualified(Note 1)
◼ Energy Sharing Control
◼ PWM Dimming Function
◼ License Lamp Mode
◼ LED Open Detection
◼ OUTx pin Short Circuit Protection (SCP)
◼ Over Voltage Mute Function (OVM)
◼ Disable LED Open Detection Function
at Reduced-Voltage
◼ LED Failure Input / Output Functions (PBUS)
(Note 1) Grade1
Applications
◼ Automotive LED Exterior Lamp
(Rear Lamp, License Lamp, DRL / Position Lamp,
Fog Lamp etc.)
◼ Automotive LED Interior Lamp
(Air Conditioner Lamp, Interior Lamp, Cluster Light
etc.)
Typical Application Circuit
REXT
VINRES
PWM_in D1 OUT1
ZD1 CVIN1 CVIN2 VIN OUT2
D2 OUT3
CRT OUT4
DC_in D3 CCRT RCRT
DISC BD18337EFV-M COUT4 COUT3 COUT2 COUT1
+B BD18347EFV-M
MSET1
MSET2 SET1
RSET1
SET2
RSET2
PBUS SET3
RSET3
SET4
RSET4
GND
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays
www.rohm.com
©2019 ROHM Co., Ltd. All rights reserved. TSZ02201-0T3T0B300300-1-2
1/35
TSZ22111 • 14 • 001 8.Apr.2022 Rev.003
Pin Configuration
VINRES 1 16 OUT1
VIN 2 15 OUT2
PBUS 3 14 OUT3
CRT 4 13 OUT4
EXP- PAD
DISC 5 12 GND
MSET1 6 11 MSET2
SET1 7 10 SET3
SET2 8 9 SET4
(TOP VIEW)
Pin Description
Pin No. Pin Name Function
1 VINRES Energy sharing external resistor connection(Note 1)

2 VIN Supply voltage input
3 PBUS Output for fault flag / Input to disable output current
4 CRT CR TIMER setting1(Note 2)
5 DISC CR TIMER setting2(Note 3)
6 MSET1 Mode setting pin 1
7 SET1 Output current setting pin 1
11 MSET2 Mode setting pin 2
12 GND GND
13 OUT4 Current output pin 4
- EXP-PAD The EXP-PAD connect to GND.
(Note 1) Short the VINRES pin to the VIN pin when not in use.
(Note 2) Short the CRT pin to the VIN pin when not in use.
(Note 3) Open the DISC pin or connect it to GND when not in use.
www.rohm.com TSZ02201-0T3T0B300300-1-2
©2019 ROHM Co., Ltd. All rights reserved. 2/35
TSZ22111 • 15 • 001 8.Apr.2022 Rev.003
Block Diagram
V B G : Internal Reference Voltage
VINRES Energy
Sharing
V BG Control
VIN
Bandgap VREG OVM Current

Driver
VBG
to Current OUT1
VB G OPM Setting
Block
OPENLOAD VB G OUT2
PBUS
PBUS
VINRE S
VB G 0.05 V
OUT3
MSET1 Control
MSET2 Logic SCP OUT4
VRE G
VB G
0.6 V⇔0.8 V
CRT CR
VB G TIMER
DISC SETx from OVM
Block
Pin Current
Short Setting
VB G Detect V BG
GND SET1 SET2 SET3 SET4
TSZ22111 • 15 • 001 8.Apr.2022 Rev.003
Absolute Maximum Ratings (Ta=25 °C)

Parameter Symbol Rating Unit
Supply Voltage (VIN) VIN -0.3 to +40.0 V
Supply Voltage (VINRES) VINRES -0.3 to +40.0 < VIN V
VIN to VINRES Pin Voltage VVIN_VINRES -0.3 to +10.0 V
CRT, DISC Pin Voltage VCRT, VDISC -0.3 to +40.0 V
MSET1, MSET2 Pin Voltage VMSET1, VMSET2 -0.3 to +20.0 V
OUT1,OUT2,OUT3,OUT4 Pin Voltage VOUT1, VOUT2, VOUT3, VOUT4 -0.3 to VIN+0.3V V
PBUS Pin Voltage VPBUS -0.3 to +20.0 V
Storage Temperature Range Tstg -55 to +150 °C
Maximum Junction Temperature Tjmax 150 °C

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance(Note 1)
Thermal Resistance(Typ)
Parameter Symbol Unit
1s(Note 3) 2s2p(Note 4)
HTSSOP-B16
Junction to Ambient θJA 113 36 °C/W
Junction to Top Characterization Parameter(Note 2) ΨJT 13 9 °C/W
(Note 1) Based on JESD51-2A(Still-Air), using a BD18347EFV-M Chip.
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3) Using a PCB board based on JESD51-3.
(Note 4) Using a PCB board based on JESD51-5, 7.
Layer Number of
Material Board Size
Measurement Board
Single FR-4 114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern Thickness
Footprints and Traces 70 μm
Layer Number of Thermal Via(Note 5)
Material Board Size
Measurement Board Pitch Diameter
4 Layers FR-4 114.3 mm x 76.2 mm x 1.6 mmt 1.20 mm Φ0.30 mm
Top 2 Internal Layers Bottom
Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness
Footprints and Traces 70 μm 74.2 mm x 74.2 mm 35 μm 74.2 mm x 74.2 mm 70 μm
(Note 5) This thermal via connects with the copper pattern of all layers.
TSZ22111 • 15 • 001 8.Apr.2022 Rev.003
Recommended Operating Conditions

Parameter Symbol Min Typ Max Unit
Supply Voltage (VIN)(Note 1) VIN 5.5 13.0 20.0 V
Output Current (each channel) IOUTx - - 150 mA
CR Timer Frequency fPWM - - 750 Hz
PWM Minimum Pulse Width tMIN 100 - - µs
Operating Temperature Topr -40 - +125 °C

(Note 1) ASO should not be exceeded.
Operating Conditions
Parameter Symbol Min Max Unit
Capacitor
C VIN1 (Note 2) 1.0 - μF
Connecting VIN Pin 1
Capacitor
C VIN2 (Note 2) 0.047 - μF
Connecting VIN Pin 2
Capacitor C OUT1, C OUT2,
0.01 0.47 μF
Connecting LED Anode C OUT3, C OUT4 (Note 2)
Capacitor
C CRT (Note 2) 0.01 0.22 μF
for Setting CR Timer
Resistor
R CRT 0.1 50 kΩ
for Setting CR Timer
Resistor
R SET1, R SET2, R SET3, R SET4 12 36 kΩ
for Setting Output Current
(Note 2) Recommended ceramic capacitor.
TSZ22111 • 15 • 001 8.Apr.2022 Rev.003
Electrical Characteristics (Unless otherwise specified, Ta=-40 °C to +125 °C, VIN=13 V)

Limit
Parameter Symbol Unit Conditions
Min Typ Max
[Circuit Current IVIN]
Circuit Current
IVIN1 - 3.0 7.0 mA
in Normal Mode
Circuit Current
IVIN2 - 3.0 7.0 mA at LED Open Detection
when LED Open is Detected
Circuit Current
IVIN3 - 3.0 7.0 mA VPBUS=0 V
when PBUS is Low
[Output Current IOUTx]
VOUTx=2 V, VCRT=0 V,
OUTx OFF Current IOUTx_OFF - - 1 μA
Ta=25 °C
VINRES-OUTx Pin Drop Voltage VDR - - 1.0 V IOUTx=100 mA
LED Open Detection Output
IOUTx_OPEN - - 10 mA V OUTx =V INRES -100 mV
Current
[Energy Sharing Control]
VINRES-VOUTx_MAX,
Energy Sharing Control Voltage VES 1.3 2.0 3.0 V
VIN=13 V, VOUTx=9 V
ON Resistance Between the VIN RVIN

- 0.5 1.0 Ω IVIN=100 mA
Pin and the VINRES Pin _VINRES
[LED Open Detection]

OUTx Pin
VOPD 20 50 100 mV VINRES-VOUTx
LED Open Detection Voltage
[Disable LED Open Detection Function at Reduced-Voltage]
VIN Pin Voltage VIN_OPM 10.5 11.0 11.5 V BD18337EFV-M
VIN Pin Voltage VIN_OPM 7.30 7.65 8.00 V BD18347EFV-M
[OUTx pin Short Circuit Protection (SCP)]
OUTx Pin Short Circuit Current IOUTx_SCP 0.1 0.3 1.0 mA VOUTx=0.9 V
OUTx Pin Short Circuit

VSCP 0.5 0.6 0.7 V
Protection Voltage
OUTx Pin Short Circuit
VSCPR 0.7 0.8 0.9 V
Protection Release Voltage
SCP Detect Delay Time 1 tSCPD1 10 60 150 µs Refer to Figure 17
SCP Detect Delay Time 2 tSCPD2 - 20 - µs Refer to Figure 17
SCP Release Delay Time tSCPR - 40 - µs Refer to Figure 17
SCP Protection Disable Time at

tSCPPON - 140 - µs Refer to Figure 17
Power On
[Output Current Setting]
RSETx=12 kΩ to 18 kΩ,
1710 1800 1890 -
Output Current Setting IOUTx=KSET / RSETx [A]
KSET
Coefficient RSETx=18 kΩ to 36 kΩ,
1620 1800 1980 -
IOUTx=KSET / RSETx [A]
SETx Pin Voltage VSETx 1.08 1.20 1.32 V
SETx Pin Short Detection RSETx

1.0 2.4 5.0 kΩ
Resistance _SHORT
TSZ22111 • 15 • 001 8.Apr.2022 Rev.003
Electrical Characteristics – continued (Unless otherwise specified, Ta=-40 °C to +125 °C, VIN=13 V)
Limit
Parameter Symbol Unit Conditions
Min Typ Max
[CR TIMER]
CRT Pin Charge Current ICRT 36 40 44 μA
CRT Pin Charge Voltage VCRT_CHA 0.72 0.80 0.88 V
CRT Pin
VCRT_DIS1 1.80 2.00 2.20 V
Discharge Voltage 1
CRT Pin VCRT > VCRT_DIS2
VCRT_DIS2 2.10 2.40 3.00 V
Discharge Voltage 2 RDISC1 → RDISC2
CRT Pin
RCHA 28.5 30.0 31.5 kΩ
Charge Resistance
VCRT_CHA /
CRT Discharge Constant 0.38 0.4 0.42 V/V
VCRT_DIS1
DISC Pin ON Resistance 1 RDISC1 20 50 100 Ω IDISC=10 mA
DISC Pin ON Resistance 2 RDISC2 2.5 5 10 kΩ IDISC=100 μA
CRT Pin Leakage Current ICRT_LEAK - - 10 μA VCRT=VIN
[Over Voltage Mute Function (OVM)]

ΔIOUTx=-3 %
ΔIOUTx=
Over Voltage Mute Start Voltage VOVMS 20.0 22.0 24.0 V
IOUTx (@VIN=VOVM) /
IOUTx (@VIN=13 V) -1
Over Voltage Mute Gain IOVMG - -20 - %/V ΔIOUTx / ΔVIN
[PBUS]
Input High Voltage VPBUSH 2.4 - - V
Input Low Voltage VPBUSL - - 0.6 V
PBUS Pin Source Current IPBUS 75 150 300 μA
Source 3 mA
PBUS Pin Output Low Voltage VPBUS_OL - - 0.6 V
to the PBUS pin
Sink 10 μA
PBUS Pin Output High Voltage VPBUS_OH 3.5 4.5 5.5 V
from the PBUS pin
PBUS Pin Leakage Current IPBUS_LEAK - - 10 μA VPBUS=7 V
[UVLO VIN]
UVLO VIN
VUVLO_VIND 4.50 4.75 5.00 V VIN: Sweep down
Detection Voltage
UVLO VIN
VUVLO_VINR 5.00 5.25 5.50 V VIN: Sweep up
Release Voltage
[UVLO VINRES]
UVLO VINRES VUVLO
4.25 4.50 4.75 V VINRES: Sweep down
Detection Voltage _VINRESD
UVLO VINRES VUVLO

4.75 5.00 5.25 V VINRES: Sweep up
Release Voltage _VINRESR
[MSET1, MSET2]
MSET1, MSET2 Input H Voltage VMSETH 2.4 - - V
MSET1, MSET2 Input L Voltage VMSETL - - 0.6 V
MSET1, MSET2 Pin

IMSET 25 50 100 μA VMSET1=0 V, VMSET2=0 V
Outflow Current
TSZ22111 • 15 • 001 8.Apr.2022 Rev.003
Typical Performance Curves (Reference Data)

(Unless otherwise specified, Ta=25 °C, VIN=13 V)
7.0 160
Circuit Current in Normal Mode: IVIN1 [mA]
6.0 Ta=-40 °
C 140
Ta=+25 °
C
Output Current: IOUTx[mA]

5.0
Ta=+125 °
C 120
4.0
100
3.0
80
2.0
60
1.0
0.0 40
10 14 18 22 26 30 34 38
0 2 4 6 8 10 12 14 16 18 20
Supply Votage: VIN [V] Resistor for Setting Output Current: RSETx[kΩ]
Figure 1. Circuit Current in Normal Mode Figure 2. Output Current

vs Supply Voltage vs Resistor for Setting Output Current
180 120
RSETx=12 kΩ
115
150
110
120
105
RSETx=18 kΩ
90 100
95
60 RSETx=36 kΩ
90
30 85
80
0 -50 -25 0 25 50 75 100 125 150
0 5 10 15 20 25 30 35 40
Temperature[°C]
Supply Voltage: VIN[V]
Figure 3. Output Current vs Supply Voltage Figure 4. Output Current vs Temperature
TSZ22111 • 15 • 001 8.Apr.2022 Rev.003
Typical Performance Curves (Reference Data) – continued

120 31.5
CRT Pin Charge Resistance: RCHA[kΩ]

100 31.0
Ta=+125 °
C
80 30.5
Ta=+25 °
C
60 30.0
Ta=-40 °
C
40 29.5
29.0
20
28.5
0
-50 -25 0 25 50 75 100 125 150
6 11 16 21 26 31 36
Temperature[°C]
Supply Voltage: VIN[V]
Figure 5. Output Current vs Supply Voltage Figure 6. CRT Pin Charge Resistance vs Temperature
TSZ22111 • 15 • 001 8.Apr.2022 Rev.003
Description of Function
1. Output Current Setting and Power Control
Output current IOUTx can be set by the value of the output current setting resistor R SETx.
𝐾
𝐼𝑂𝑈𝑇𝑥 = 𝑅 𝑆𝐸𝑇 [A]
𝑆𝐸𝑇𝑥
where:
𝐾𝑆𝐸𝑇 is the output current setting coefficient 1800 (Typ).
𝑅𝑆𝐸𝑇𝑥 is the output current setting resistor.
When not to use the OUTx pin, open the SETx pin.
●Required VIN for set current to flow
Output Current IOUTx and minimum VIN should be set to satisfy the following relationship.
𝑉𝐼𝑁 ≥ 𝑉𝑓_𝐿𝐸𝐷 × 𝑁 + 𝑉𝐷𝑅 + 𝑅𝑉𝐼𝑁_𝑉𝐼𝑁𝑅𝐸𝑆 × 𝐼𝑂𝑈𝑇𝑥_𝑇𝑂𝑇𝐴𝐿 [V]
where:
𝑉𝐼𝑁 is the VIN pin voltage.
𝑉𝑓_𝐿𝐸𝐷 is the LED forward voltage.
𝑁 is the number of LED.
𝑉𝐷𝑅 is the VINRES - OUTx drop voltage.
𝑅𝑉𝐼𝑁_𝑉𝐼𝑁𝑅𝐸𝑆 is the ON resistance between the VIN pin and the VINRES pin.
𝐼𝑂𝑈𝑇𝑥_𝑇𝑂𝑇𝐴𝐿 is the total output current.
VINRES
Energy
Sharing
REXT VB G Control
VIN
Current
+B Driver
OUT1 IOUT1
Bandgap VREG OVM
I OUT2
OUT2
OUT3 I OUT3
OUT4 I OUT4
VB G Current
Setting
SETx GND
RSETx IOUTx_TOTAL=IOUT1+IOUT2+IOUT3+IOUT4
Figure 7. Output Current Setting
TSZ22111 • 15 • 001 8.Apr.2022 Rev.003
Description of Function – continued
2. Energy Sharing Control
Energy sharing is performed by connecting external resistor REXT between the VIN and VINRES pins. It makes possible
to distribute the heat generated by the IC to REXT. (When not in use, short the VINRES pin with the VIN pin.)
The IC controls the difference voltage to VES (2.0 V(Typ)) which is between the VINRES pin and the pin that has
maximum voltage among OUT1 to OUT4 pins.
Insert resistor in the anode of the LED, when the following expression is not satisfied.
𝑉𝑈𝑉𝐿𝑂_𝑉𝐼𝑁𝑅𝐸𝑆𝑅 ≤ 𝑉𝑂𝑈𝑇𝑥_𝑀𝐴𝑋
𝑉𝑂𝑈𝑇𝑥 = 𝐼𝑂𝑈𝑇𝑥 × 𝑅𝑂𝑈𝑇𝑥 + 𝑉𝑓_𝐿𝐸𝐷 × 𝑁

where:
𝑉𝑈𝑉𝐿𝑂_𝑉𝐼𝑁𝑅𝐸𝑆𝑅 is the VINRES pin UVLO release voltage, 5.00 V (Typ).
𝑉𝑂𝑈𝑇𝑥_𝑀𝐴𝑋 is the maximum voltage among the OUT1 to OUT4 pins
𝑉𝐸𝑆 is the Energy Sharing control voltage, 2.0 V (Typ).
𝑉𝑂𝑈𝑇𝑥 is the OUTx pin voltage.
𝐼𝑂𝑈𝑇𝑥 is the OUTx pin current.
𝑅𝑂𝑈𝑇𝑥 is the resistor inserted in the anode of LED.
𝑉𝑓_𝐿𝐸𝐷 is the LED forward voltage.
VINRES
Energy
REXT Sharing
V BG Control
VIN
Current
+B Driver
OUT1 IOUT1
Bandgap VREG
IOUT2
OUT2
OUT3 IOUT3
OUT4 IOUT4
ROUTx
GND
Figure 8. Energy Sharing Control
TSZ22111 • 15 • 001 8.Apr.2022 Rev.003
2. Energy Sharing Control – continued
The power consumption(Pc) across the IC and REXT when IOUT_TOTAL=200 mA, VOUTx=6 V (x=1 to 4),
REXT=30 Ω, 40 Ω or 50 Ω are shown below. (Reference data)
Pc(IC, REXT) vs VIN Voltage

4.0
(REXT=30 Ω)
Pc_IC(REXT=30
Pc_IC Ω)
3.5
Pc_REXT (R
Pc_REXT EXT=30 Ω)Ω)
(REXT=30
(REXT=40 Ω)
Pc_IC(REXT=40
Pc_IC Ω)
3.0
Pc_REXT (R
(REXT=40
2.5 (REXT=50 Ω)
Pc_IC(REXT=50
Pc_IC Ω)
Pc_REXT (R
(REXT=50
Pc[W]
2.0
1.5
1.0
0.5
0.0
5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
VIN Voltage[V]
Figure 9. Energy Sharing Control Operation Example 1

4.0
Pc_IC (REXT=20 Ω)
Pc_IC(REXT=20Ω)
3.5
Pc_REXT (REXT=20 Ω)
Pc_REXT(REXT=20Ω)
Pc_IC (REXT=30 Ω)
Pc_IC(REXT=30Ω)
3.0
Pc_REXT(REXT=30Ω)
2.5 Pc_IC (REXT=40 Ω)
Pc_IC(REXT=40Ω)
Pc_REXT(REXT=40Ω)
Pc[W]
2.0
1.5
1.0
0.5
0.0
5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
VIN Voltage[V]

4.0
Pc_IC (REXT=15 Ω)
Pc_IC(REXT=15Ω)
3.5 Pc_REXT (REXT=15 Ω)
Pc_REXT(REXT=15Ω)
Pc_IC (REXT=20 Ω)
Pc_IC(REXT=20Ω)
3.0
Pc_REXT(REXT=20Ω)
2.5 Pc_IC (REXT=25 Ω)
Pc_IC(REXT=25Ω)
Pc_REXT(REXT=25Ω)
Pc[W]
2.0
1.5
1.0
0.5
0.0
5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
VIN Voltage[V]
TSZ22111 • 15 • 001 8.Apr.2022 Rev.003
3. Table of Operations
Depending on the CRT pin voltage, the IC switches between DC mode and PWM mode. Switching conditions are shown
in the table below. When VIN > 22.0 V, output current is limited to reduce power dissipation across the IC. Detect LED
open and the OUTx pin short circuit then output current is turned OFF. When the PBUS pin is pulled low, all drivers are
turned OFF. This IC also has inbuilt Under Voltage Lockout (UVLO) and Thermal Shutdown function (TSD). The
correspondence table is given below. For details, refer to functional description of each block.
Operation Detecting Condition Output Current

CRT Pin PBUS Pin
Mode [Detect] [Release] (IOUTx)
VCRT ≥
DC - - 50 mA to 150 mA -
2.0 V (Typ)
See
See Description of
PWM Dimming Description of - - -
Function 4
Function 4
Over Voltage VIN > VIN ≤ See Description of

- -
Mute (OVM) 22.0 V (Typ) 22.0 V (Typ) Function 13
VOUTx ≥ VOUTx <

LED VINRES - 0.05 V VINRES - 0.05 V See Description of
- Low
Open Detection (Typ) and (Typ) or Function 11
VIN ≥ VIN_OPM (Typ) VIN < VIN_OPM (Typ)
OUTx Pin
VOUTx ≤ VOUTx ≥ See Description of
Short Circuit - Low
0.6 V (Typ) 0.8 V (Typ) Function 11
Protection (SCP)
SETx Pin Short

RSET ≤ 2.4 kΩ (Typ) RSET > 2.4 kΩ (Typ) OFF Low
Detection
PBUS Control VPBUS ≤

- VPBUS ≤ 0.6 V VPBUS ≥ 2.4 V OFF
OFF 0.6 V input
Under Voltage
Lockout - VIN ≤ 4.75 V (Typ) VIN ≥ 5.25 V (Typ) OFF High
(VIN UVLO)
Under Voltage
VINRES ≤ VINRES ≥ Power Control
Lockout - High
4.50 V (Typ) 5.00 V (Typ) OFF
(VINRES UVLO)
Tj ≥ Tj ≤
TSD - OFF High
175 C (Typ) 150 C (Typ)
TSZ22111 • 15 • 001 8.Apr.2022 Rev.003
4. PWM Dimming Operation
PWM Dimming is performed with the following circuit.

The dimming cycle and ON Duty Width can be set by values of the external components (CCRT, RCRT).
Connect the CRT pin to the VIN pin when not in use. Connect the DISC pin to GND or open when not in use.
The CR timer function is activated if DC SW is OPEN. To perform PWM dimming of output current, a triangular
waveform is generated at the CRT pin. The output current (IOUTx) is turned OFF while CRT voltage is ramp up, and
output current (IOUTx) is turned ON while CRT voltage is ramp down.
When VCRT ≥ VCRT_DIS1 (2.0 V (Typ)), dimming mode turns to DC Control. When VCRT > VCRT_DIS2 (2.4 V (Typ)), the DISC
pin ON resister changes from RDISC1 (50 Ω (Typ)) to RDISC2 (5 kΩ (Typ)), and the power consumption of the IC is reduced
by reducing the inflow current of the DISC pin.
VINRES Energy
Sharing
V BG Control
PWM_in VIN
Bandgap VREG Current

Driver
OUT1 IOUT1
DC_in
VRE G Control
Logic
OUT2
+B
CRT CR OUT3
VB G TIMER
CCRT RCRT
DISC OUT4
GND
CRT Voltage CRT Voltage

Ramp up Ramp down
VCRT_DIS1
2.0 V(Typ)
CRT Pin
Waveform ΔVCRT
VCRT_CHA
0.8 V(Typ)
t OFF t ON
ΔVCRT×CCRT VCRT_CHA
tOFF = =RCHA×CCRT tON= - (R CRT + RDISC1)×CCRT×ln
ICRT VCRT_DIS1
Output Current ILED ILED ILED I LED I LED I LED

IOUTx OFF ON OFF ON OFF ON
Figure 12. PWM Dimming Operation
TSZ22111 • 15 • 001 8.Apr.2022 Rev.003
4. PWM Dimming Operation – continued
(1) CRT ramp up time tOFF and CRT ramp down time tON
CRT ramp up time tOFF and CRT ramp down time tON can be defined from the following equations.
Make sure that tON is set PWM Minimum Pulse Width tMIN 100 μs or more.
∆𝑉𝐶𝑅𝑇 ×𝐶𝐶𝑅𝑇
𝑡𝑂𝐹𝐹 = = 𝑅𝐶𝐻𝐴 × 𝐶𝐶𝑅𝑇 [s]
𝐼𝐶𝑅𝑇
𝑉
𝑡𝑂𝑁 = −(𝑅𝐶𝑅𝑇 + 𝑅𝐷𝐼𝑆𝐶1 ) × 𝐶𝐶𝑅𝑇 × 𝐼𝑛 (𝑉 𝐶𝑅𝑇_𝐶𝐻𝐴 ) [s]
𝐶𝑅𝑇_𝐷𝐼𝑆1
where:
𝐼𝐶𝑅𝑇 is the CRT pin charge current, 40 μA (Typ).
𝑅𝐶𝐻𝐴 is the CRT pin charge resistor, 30 kΩ (Typ).
𝑅𝐷𝐼𝑆𝐶1 is the DISC pin ON resistor1, 50 Ω (Typ).
𝑉𝐶𝑅𝑇_𝐶𝐻𝐴 is the CRT pin charge voltage, 0.8 V (Typ).
𝑉𝐶𝑅𝑇_𝐷𝐼𝑆1 is the CRT pin discharge voltage1, 2.0 V (Typ).
(2) PWM Dimming Frequency (fPWM)

PWM Dimming Frequency is defined by tON and tOFF.
1
𝑓𝑃𝑊𝑀 = 𝑡 [Hz]
𝑂𝑁 +𝑡𝑂𝐹𝐹
(3) ON Duty (DON)

PWM ON duty is defined by tON and tOFF.
𝑡𝑂𝑁
𝐷𝑂𝑁 = 𝑡 [%]
𝑂𝑁 +𝑡𝑂𝐹𝐹
(Example) In case of RCRT=3.6 kΩ, CCRT=0.1 μF
𝑡𝑂𝐹𝐹 = 𝑅𝐶𝐻𝐴 × 𝐶𝐶𝑅𝑇 = 30 𝑘𝛺 × 0.1 µ𝐹 = 3.0 [ms]
𝑡𝑂𝑁 = −(𝑅𝐶𝑅𝑇 + 𝑅𝐷𝐼𝑆𝐶1 ) × 𝐶𝐶𝑅𝑇 × 𝐼𝑛(𝑉𝐶𝑅𝑇_𝐶𝐻𝐴 /𝑉𝐶𝑅𝑇_𝐷𝐼𝑆1 )

= −(3.6 𝑘𝛺 + 50 𝛺) × 0.1 µ𝐹 × 𝐼𝑛(0.8 𝑉/2.0 𝑉) = 0.334 [ms]
𝑓𝑃𝑊𝑀 = 1/(𝑡𝑂𝑁 + 𝑡𝑂𝐹𝐹 ) = 1/(3.0 𝑚𝑠 + 0.334 𝑚𝑠) = 300 [Hz]
𝐷𝑂𝑁 = 𝑡𝑂𝑁 /(𝑡𝑂𝑁 + 𝑡𝑂𝐹𝐹 ) = 0.334 𝑚𝑠/(3.0 𝑚𝑠 + 0.334 𝑚𝑠) = 10.0 [%]
●PWM Dimming Operation Using External Signal

In case external PWM input to the CRT pin, make sure that input pulse high voltage ≥ 2.2 V and pulse low voltage ≤ 0.6
V. Also open the DISC pin or connect to GND.
VIN
+B Bandgap VREG
VRE G
CRT CR Control
μ
-Con TIMER Logic
VB G
DISC
GND
Figure 13. PWM Dimming Operation Using External Signal
TSZ22111 • 15 • 001 8.Apr.2022 Rev.003
4. PWM Dimming Operation – continued
●About deviation of CRT ramp up/down time with a reverse connection protection diode
If this LSI is used to drive LED like below schematic, it is possible to occur CRT ramp up/down time deviation due to
characteristics of reverse current Ir diode (D2, D3).
Consider to choose a diode (D2, D3) which is recommended by Rohm or Ir value 1 μA (Max) or less.
Since reverse current flows even with the recommended diodes, connect a resistor RDCIN of 10 kΩ or less between
point A and GND so that the voltage at point A does not rise.
Mechanism of deviation of CRT ramp up/down time from set values.

(1) During the PWM dimming operation mode, Point A on Figure 14 is Hi-Z.
↓
(2) Reverse current Ir of D2 and D3 goes to Point A.
(Power supply voltage is being input into the cathode of D2, so mainly reverse current of D2 goes into C1.)
→Reverse current Ir of D3 is added to the CRT pin charge current and discharge current, so CRT ramp up/down
time deviates from the settings.
↓
(3) C1 gets charged, voltage at Point A rises.
↓
(4) Point A voltage ≥ the CRT pin voltage of each IC.
↓
(5) Vf occurs in the diodes D3.
↓
(6) D3 circulate forward current IF
→Forward current IF of D3 is added to the CRT pin charge current and discharge current, so CRT ramp up/down
time deviates from the settings.
↓
(7) Repetition of (2) to (6).
PWM_in D1 VIN
D2 OUTx
point A I OUTx
Ir BD18337EFV-M
DC_in BD18347EFV-M
D3 CRT
IF
RDCIN C1 GND
Vf DISC
Figure 14. How Reverse Protection Diode Affects the CRT pin Ramp Up / Down Time
TSZ22111 • 15 • 001 8.Apr.2022 Rev.003
5. The SETx pin Short Detection Function
When the SETx pin is shorted to GND, the IC detects that the SETx pin current has increased and turns off the output
current. The maximum resistance on the SETx pin short detection is RSETx ≤ 5.0 kΩ (Max). Fault is indicated by pulling
the PBUS pin low.
Note that the SETx pin short detection resistance value RSETx is 5 kΩ or less when the over voltage mute function is
active.
VINRES Energy
Sharing
V BG Control
VIN
+B Bandgap VREG OVM Current

Driver
VBG
to Current OUTx
VB G OPM Setting
Block
PBUS
Control
PBUS
Logic
VB G
SETx from OVM

Block
Pin Current
Short Setting
Detect V BG
GND SETx
RSETx
Figure 15. SETx pin Short Detection
TSZ22111 • 15 • 001 8.Apr.2022 Rev.003
6. LED Open Detection Function
When one of the LEDs is in the open state, the OUTx pin voltage rises. At VOUTx ≥ VINRES - 0.05 V (Typ), LED Open
Detection operation is performed. In case of LED Open Detection, fault is indicated by pulling the PBUS pin low.
7. Disable LED Open Detection Function at Reduced-Voltage
Built-in disable LED Open Detection function prevents erroneous detection of LED Open during voltage ramp up or
ramp down at the VIN pin. Open Detection is not performed until the VIN pin voltage is internal OPM threshold voltage
(VIN_OPM) or more. LED Open Detection remains disabled during power supply ramp up and ramp down, when VIN <
VIN_OPM.
For disable LED Open Detection function to work properly, LEDs must be selected according to the following formula:
𝑉𝑓_𝐿𝐸𝐷_𝑂𝑃𝐷 × 𝑁 + 100 𝑚𝑉 + 𝑅𝑉𝐼𝑁_𝑉𝐼𝑁𝑅𝐸𝑆 × 40 𝑚𝐴 < 𝑉𝐼𝑁_𝑂𝑃𝑀 [V]
where:
𝑉𝑓_𝐿𝐸𝐷_𝑂𝑃𝐷 is the LED Vf when IF=IOUT_OPEN (IOUT_OPEN=10 mA (Max))
𝑅𝑉𝐼𝑁_𝑉𝐼𝑁𝑅𝐸𝑆 is the ON resistance between the VIN pin and the VINRES pin.
VINRES Energy
Sharing
V BG
Control
VIN

VBG
Driver
OUTx
V BG OPM
LED OPEN
PBUS
Control
PBUS
Logic VI NRE S GND
0.05V
VIN_OPM VIN_OPM
VOPD VOPD
VIN
Disable VINRES Disable

LED Open LED Open
VOPD =VINRES -0.05V
Detection Detection
VOUTx Area VOUTx = V f_LED × N Area
LED Open LED Open

Detection Detection
Area IOUTx Area
IOUTx
VPBUS 4.5V
Figure 16. Disable LED Open Detection Voltage at Reduced-Voltage
TSZ22111 • 15 • 001 8.Apr.2022 Rev.003
8. OUTx pin Short Circuit Protection (SCP)
If the OUTx pin is shorted to GND, the OUTx voltage goes low. When the OUTx pin voltage VOUTx ≤ 0.6 V (Typ), then
SCP mechanism is enabled after a delay of tSCPD2 (20 μs (Typ)). In case of SCP, output current IOUT is turned off to
prevent thermal damage of the IC. Fault is indicated by pulling the PBUS pin low after a delay open tSCPD1 (60 μs (Typ)).
To prevent false SCP at power supply startup, the output SCP is disabled until VCRT > 2.0 V (Typ) once UVLO is
released. In case of power supply ramping up with the OUTx pin short circuit condition (VOUTx <0.6 V (Typ)), SCP
mechanism is enabled after tSCPPON (140 μs (Typ)), only if UVLO is released and VCRT > 2.0 V (Typ).
VINRES Energy
Sharing
V BG Control
VIN

Driver
VB G
OUTx SHORT
VB G OPM
PBUS
PBUS Control VIN
VB G
Logic
SCP
GND
0.6 V ⇔0.8 V
Short Circuit Short Circuit
4.5 V
VIN
2.0 V
VCRT
0.8 V 0.6 V 0.8 V

VOUTx
ON ON t SCPD2 ON
20 μs
OFF OFF OFF
IOUTx
High High High
tSCPR tSCPR
tSCPPON Lo w 40 μs t SCPD1 Lo w 40 μs
VPBUS 140 μs 60 μs
Figure 17. OUTx pin Short Circuit Protection (SCP)
●OUTx pin short circuit current

When VOUTx < 1.3 V, the OUTx pin short circuit current IOUTx_SCP flows to prevent malfunction of the OUTx pin short
circuit protection mechanism.
1.3 V
VOUTx 0.9 V
IOUTx_SCP 0.3 mA
0 mA
Figure 18. OUTx pin Short Circuit Current
TSZ22111 • 15 • 001 8.Apr.2022 Rev.003
9. Connection Method of LEDs to Output pins – Effect on Protection Functions
OUTx OUTx OUTx
・・・・・・
1 string in 2 or more strings 2 or more strings in

series in parallel parallel
(Matrix connection)
Figure 19. About the Capacitor of Connecting LED Anode
Connection method Output SCP LED Open Detection
1 string in Series Detectable Detectable
2 or more strings in parallel Detectable Not detectable(Note 1)
2 or more strings in parallel

Detectable Not detectable(Note 2)
(Matrix connection)
(Note 1) Detectable only when one or more LEDs are open in all columns.
(Note 2) Detectable only when all LEDs from any row are open.
TSZ22111 • 15 • 001 8.Apr.2022 Rev.003
10. LED Open Detection, SCP and OUTx pin Hi-Z in DC/PWM Dimming Modes
Operation of LED Open Detection and SCP sections differ in DC mode and PWM dimming mode.
In DC mode, LED Open Detection and SCP are enabled at all times.
In PWM dimming mode, the LED Open Detection function is valid only during the falling edge of CRT signal, whereas
SCP is valid at all times. There is a possibility of the OUTx pin becoming Hi-Z. False SCP may occur if the OUTx pin
voltage drops due to external noise(Note 1). Connect a capacitor (0.1 μF or more(Note 2)) to GND, close to the OUTx pin to
avoid erroneous output.
(Note 1) Propagation noise, radiation noise, interference between wires, interference between connectors, etc.
(Note 2) When connecting 0.1 μF or more, evaluate the delay time from the start of VIN until the IOUTx current flows. Also, evaluate the IOUTx pulse width in
the PWM dimming mode.
In DC mode In PWM dimming mode
VIN VIN
0V 0V
VCRT VCRT
0V
VOUTx VOUTx
0V 0V
IOUTx IOUTx
0 mA 0 mA
OUTx pin OUTx pin

None Hi-Z Hi-Z Hi-Z
Hi-Z state Hi-Z state
LED Op en LED Op en
Vali d Valid Valid Valid
Detection Detection
SCP Vali d SCP Vali d
Figure 20. LED Open Detection, SCP and the OUTx pin Hi-Z
VINRES
OUT1
VIN OUT2
OUT3
CRT OUT4
DISC BD18337EFV-M COUT4 COUT3 COUT2 COUT1

BD18347EFV-M
MSET1
MSET2 SET1
SET2
PBUS SET3
SET4
GND
Figure 21. Capacitor Connected to the OUTx pin
TSZ22111 • 15 • 001 8.Apr.2022 Rev.003
10. LED Open Detection, SCP and OUTx pin Hi-Z in DC/PWM Dimming Modes – continued
Evaluation example (ILED pulse width at PWM Dimming operation)

Condition: +B=13 V
Ta=25 °C
LED=1 Strings
CCRT=0.01 μF
RCRT=1.0 kΩ
PWM Dimming Mode
50 mA / ch 150 mA / ch
Rise Time Rise Time
VCRT VCRT
1 V / Div 1 V / Div
3.5 μs 2.5 μs
COUTx=0.01 μF VOUT1 VOUT1

2 V / Div Fall Time 2 V / Div Fall Time
IOUT1 IOUT1
20 mA / Div 50 mA / Div
0.8 μs 0.8 μs
Rise Time Rise Time
VCRT VCRT
1 V / Div 1 V / Div
7.7 μs 4.9 μs
COUTx=0.22 μF VOUT1 VOUT1

2 V/Div 2 V / Div
Fall Time Fall Time
IOUT1 IOUT1
20 mA / Div 50 mA / Div
12 μs 9.9 μs
TSZ22111 • 15 • 001 8.Apr.2022 Rev.003
11. Lamp Control Modes (MSET1, MSET2)
By connecting the MSET1 pin to ground or open, it is possible to change output channel operation mode on detecting an
LED error. The MSET2 pin can also be used to control CH4 operation.
MSET1=L (GND short) : If SCP or LED Open is detected in any one of 4 channels, all the channels are OFF.
MSET1=H (Pin open) : Remaining channels continue to operate even if one channel detects SCP or LED Open.
MSET2=L (GND short) : CH4 operates in the same way as CH1 to CH3
MSET2=H (Pin open) : CH4 ignores the PWM signal generated by CRTIMER and are always in DC mode. When CH4
detects SCP or LED Open, PBUS : H is maintained and CH1 to CH3 continue to operate (License
Lamp Mode).
Normal Mode (MSET2=L)

Remaining
OUT1 to OUT3 OUT1 to OUT3 OUT4 OUT4 LED Error CH4
MSET1 MSET2 CH1 to CH3 PBUS
OPEN Detect SCP OPEN Detect SCP CH Output Output
Output
Detect - - - ON OFF OFF
L
- Detect - - OFF OFF OFF L
All
- - Detect - ON OFF ON
CH OFF L
- - - Detect OFF OFF OFF
Normal
Detect - - - ON ON ON
H Mode
- Detect - - OFF ON ON L
IndividualCH
- - Detect - ON ON ON
OFF
- - - Detect OFF ON OFF
License Mode (MSET2=H)

Remaining
OUT1 to OUT3 OUT1 to OUT3 OUT4 OUT4 LED Error CH4
MSET1 MSET2 CH1 to CH3 PBUS
OPEN Detect SCP OPEN Detect SCP CH Output Output
Output
Detect - - - ON OFF ON
L L
- Detect - - OFF OFF ON
All
H - - Detect - ON ON ON
CH OFF H
License
Detect - - - ON ON ON
H Mode L
- Detect - - OFF ON ON
IndividualCH
- - Detect - ON ON ON
OFF H
Figure 22. Lamp Control Modes (MSET1, MSET2)
TSZ22111 • 15 • 001 8.Apr.2022 Rev.003
12. PBUS Function
The PBUS pin is the pin to input and output an error signal.
When abnormality such as LED Open or the OUTx pin short circuit occurs, it can notify the abnormality to the outside by
changing the PBUS pin output from high to low. In addition, by externally controlling the PBUS pin from high to low, the
output current is turned off. When using multiple LSIs to drive multiple LEDs, it is possible to turn off all LED lines at
once by connecting the PBUS pins of each CH as shown in the figure below, even if LED Open or the OUTx pin short
circuit occurs.
Caution of using the PBUS Pin

Do not connect to the PBUS pins other than below list items due to the difference of ratings, internal threshold voltages,
and so on. (BD18340FV-M, BD18341FV-M, BD18342FV-M, BD18343FV-M, BD18345EFV-M, BD18337EFV-M,
BD18347EFV-M)
PWM_in VIN OUTx VIN OUTx VIN OUTx
DC_in
CRT CRT CRT
IC1 LED
IC2 LED
IC3 LED
+B DISC OPEN DISC OFF DISC OFF
PBUS PBUS PBUS
GND GND GND
communication each other by PBUS
Figure 23. PBUS Function
▼Example of Protective Operation due to LED Open Circuit
①CH1 LED
Open
IC1 VOUTx
ON
IC1 IOUTx OFF
②V PBUS: High→Low
VPBUS
PBUS: When low, the OUTX pin of IC2, IC3 is
clamped to 1.4 V.
IC2, IC3 ON
VOUTX 1.4 V
ON
IC2, IC3
IOUTX OFF
Figure 24. Example of Protective Operation
In case of LED Open, VPBUS of IC1 goes from High to Low. As VPBUS goes low, IC2 and IC3 LED drivers turn off their
LEDs. When VPBUS goes low, the OUTx pins are clamped to 1.4 V (Typ), in order to prevent output ground protection
operation.
TSZ22111 • 15 • 001 8.Apr.2022 Rev.003
13. Over Voltage Mute Function (OVM)
When the VIN pin voltage exceeds 22.0 V (Typ), Over Voltage Mute function is activated to prevent thermal deterioration
to the IC. This is done by attenuating the output current (IOUTx). The output current (IOUTx) is attenuated at -20 %/V (Typ).
If the output current is attenuated less than 10 mA (Typ), output current is turned OFF.
VINRES Energy
Sharing I OUTx
Control
VIN
100 %
+B OVM
-20 %/V (Typ)
Current Current
Setting Driver
Output current is
OUTx muted during power
supply overvoltage
GND SETx
RSETx IOUTx
0 VOVMS VIN
Figure 25. Over Voltage Mute Function (OVM)
14. Under Voltage Lockout (UVLO)
UVLO circuit prevents the IC malfunction during times of power supply ramp up, ramp down or instantaneous power
interruptions. When the VIN pin voltage is 4.75 V (Typ) or less, VIN UVLO is activated and output current (IOUTx) is
turned OFF, and when the VIN pin voltage increases to 5.25 V (Typ) or more, VIN UVLO is deactivated and normal
operation resumes. The VINRES pin voltage is 4.50 V (Typ) or less, VINRES UVLO is activated and power control
function is turned OFF, and when The VINRES pin voltage increases to 5.00V (Typ) or more, VINRES UVLO is
deactivated and power control function is turned ON.
TSZ22111 • 15 • 001 8.Apr.2022 Rev.003
Application Examples
1. IOUTx=75 mA/ch License MODE,

PWM ON Duty:10 %, Pulse Width=0.334 ms, PWM Frequency=300 Hz
REXT 4
REXT 3
VINRES
PWM_in REXT 2
D1 OUT1
REXT 1
D2 OUT3
CRT OUT4
DC_in D3 CCRT RCRT
BD18337EFV-M COUT4 COUT3 COUT2 COUT1
DISC
BD18347EFV-M
VBAT U1
MSET1
MSET2 SET1
RSET1
SET2
RSET2
PBUS SET3
RSET3
SET4
RSET4
GND
Figure 26. Application Example 1
Recommended Parts List 1

Parts No. Parts Name Value Unit Product Maker
BD18337EFV-M
IC U1 - - ROHM
BD18347EFV-M
D1, D2 RFN2LAM6STF - - ROHM
Diode D3 RFN1LAM6STF - - ROHM

NIPPON
ZD1 TND12H-220KB00AAA0 - -
CHEMICON
RSET1, RSET2,
MCR03EZPFX2402 24 kΩ ROHM
RSET3, RSET4
Resistor REXT1, REXT2,
LTR100JZPJ101 100 Ω ROHM
REXT3, REXT4
RCRT MCR03EZPFX3601 3.6 kΩ ROHM
CVIN1 GCM32ER71H475KA40 4.7 μF murata
CVIN2 GCM155R71H104KE37 0.1 μF murata
Capacitor CCRT GCM155R71H104KE37 0.1 μF murata
COUT1, COUT2,
GCM155R71H104KE37 0.1 μF murata
COUT3, COUT4
About ZD1, place according to test standard of battery line.
TSZ22111 • 15 • 001 8.Apr.2022 Rev.003
Application Examples – continued
2. IOUTx=100 mA/ch, Tail / Stop application with MSET1=L

PWM ON Duty=10 %, Pulse Width=0.334 ms, PWM Frequency=300 Hz
REXT 4
REXT 3
VINRES
PWM_in REXT 2
D1 OUT1
REXT 1
D2 OUT3
CRT OUT4
DC_in D3 CCRT RCRT
DISC
BD18347EFV-M
VBAT U1
MSET1
MSET2 SET1
RSET1
SET2
RSET2
PBUS SET3
RSET3
SET4
RSET4
GND

BD18337EFV-M
IC U1 - - ROHM
BD18347EFV-M
D1, D2 RFN2LAM6STF - - ROHM
Diode D3 RFN1LAM6STF - - ROHM

NIPPON
CHEMICON
RSET1, RSET2,
RSET3, RSET4
Resistor REXT1, REXT2,
REXT3, REXT4
RCRT MCR03EZPFX3601 3.6 kΩ ROHM
CVIN2 GCM155R71H104KE37 0.1 μF murata
Capacitor CCRT GCM155R71H104KE37 0.1 μF murata
COUT1, COUT2,
COUT3, COUT4
TSZ22111 • 15 • 001 8.Apr.2022 Rev.003
Application Examples – continued
3. IOUTx=100 mA/ch, PWM Control Each Channel from External Signal
REXT 4
REXT 3
VINRES
DC_in REXT 2
D1 OUT1
REXT 1
OUT3
CRT OUT4

DISC
BD18347EFV-M
VBAT U1
MSET1
MSET2 SET1
RSET1
SET2
RSET2 Q1
PBUS SET3
RSET3 Q2
SET4 µ-Con
RSET4 Q3
GND
Q4

BD18337EFV-M
IC U1 - - ROHM
BD18347EFV-M
MOSFET Q1 to Q4 RJU003N03FRAT106 - - ROHM
D1 RFN2LAM6STF - - ROHM
Diode NIPPON
CHEMICON
RSET1, RSET2,
RSET3, RSET4
Resistor
REXT1, REXT2,
REXT3, REXT4
Capacitor CVIN2 GCM155R71H104KE37 0.1 μF murata
COUT1, COUT2,
COUT3, COUT4
TSZ22111 • 15 • 001 8.Apr.2022 Rev.003
Power Dissipation
Thermal design should meet the following equation.
𝑃𝑑 > 𝑃𝐶
𝑃𝑑 = (1/𝜃𝐽𝐴 ) × (𝑇𝑗𝑚𝑎𝑥 − 𝑇𝑎 )𝑜𝑟(1/𝛹𝐽𝑇 ) × (𝑇𝑗𝑚𝑎𝑥 − 𝑇𝑇 )

When don’t use Energy Sharing Control, refer to below equation.
𝑃𝐶 = (𝑉𝐼𝑁 × (𝐼𝑉𝐼𝑁1 + 𝐼𝐷𝐼𝑆𝐶 ) + (𝑉𝐼𝑁 − 𝑉𝑂𝑈𝑇1 ) × 𝐼𝑂𝑈𝑇1 + (𝑉𝐼𝑁 − 𝑉𝑂𝑈𝑇2 ) × 𝐼𝑂𝑈𝑇2

+ (𝑉𝐼𝑁 − 𝑉𝑂𝑈𝑇3 ) × 𝐼𝑂𝑈𝑇3 + (𝑉𝐼𝑁 − 𝑉𝑂𝑈𝑇4 ) × 𝐼𝑂𝑈𝑇4
When use Energy Sharing Control, refer to page 11 and 12.
where:
𝑃𝑑 is the power dissipation.
𝑃𝐶 is the power consumption.
𝑉𝐼𝑁 is the VIN pin voltage.
𝐼𝑉𝐼𝑁1 is the circuit current at normal mode.
𝐼𝐷𝐼𝑆𝐶 is the DISC pin input current.
𝐼𝑂𝑈𝑇1 to 𝐼𝑂𝑈𝑇4 is the output current through each channel.
𝑉𝑂𝑈𝑇1 to 𝑉𝑂𝑈𝑇4 is the OUTx pin voltage each channel.
𝜃𝐽𝐴 is the thermal resistance of junction to ambient.
𝛹𝐽𝑇 is the thermal characterization parameter of junction to center case surface.
𝑇𝑗𝑚𝑎𝑥 is the maximum junction temperature (150 °C).
𝑇𝑎 is the ambient temperature.
𝑇𝑇 is the case surface temperature.
TSZ22111 • 15 • 001 8.Apr.2022 Rev.003
I/O Equivalence Circuits
Pin Pin
No. I/O Equivalence Circuit No. I/O Equivalence Circuit
Name Name
VIN
MSET1
1 VINRES VINRES 6,11 MSETx
MSET2
GND GND
SET1
SETx
7 to SET2
3 PBUS PBUS
100 kΩ(Typ) 10 SET3
SET4
GND
GND
VINRES
OUT1
13 to OUT2
4 CRT CRT OUTx
16 OUT3
OUT4
GND
GND
DISC
5 DISC
5 kΩ
5.2 V (Typ)
(Typ)
GND
TSZ22111 • 15 • 001 8.Apr.2022 Rev.003
Operational Notes
1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Recommended Operating Conditions

The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
8. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
TSZ22111 • 15 • 001 8.Apr.2022 Rev.003
Operational Notes – continued
10. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor Transistor (NPN)
Pin A Pin B B Pin B
C
Pin A E
P B C
P+ P+ P+ N P P+
N N N N Parasitic N N N
E
Elements
Parasitic
P Substrate P Substrate
Elements
GND GND GND GND
Parasitic Parasitic N Region
Elements Elements close-by
Figure 29. Example of Monolithic IC Structure
11. Ceramic Capacitor

When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
12. Thermal Shutdown Circuit (TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
TSZ22111 • 15 • 001 8.Apr.2022 Rev.003
Ordering Information
B D 1 8 3 3 7 E F V - ME2
Package Product Rank

EFV: M: for Automotive
HTSSOP-B16 Packaging and forming specification
E2: Embossed tape and reel
B D 1 8 3 4 7 E F V - ME2
Package Product Rank

EFV: M: for Automotive
HTSSOP-B16 Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
HTSSOP-B16 (TOP VIEW)

Part Number Marking
1 8 3 3 7 LOT Number
Pin 1 Mark
HTSSOP-B16 (TOP VIEW)

Part Number Marking
1 8 3 4 7 LOT Number
Pin 1 Mark
TSZ22111 • 15 • 001 8.Apr.2022 Rev.003
Physical Dimension and Packing Information

Package Name HTSSOP-B16
TSZ22111 • 15 • 001 8.Apr.2022 Rev.003
Revision History
Date Revision Changes
21.Jan.2019 001 New Release
Page.6 Electrical Characteristics

Circuit current IVIN1, IVIN2, IVIN3 Typ 4 mA → Typ 3 mA
Page.10 L-9 Sentence Revise

Page.11 L-1 Sentence L2-3 Sentence Revise
Page.15 PWN dimming function Revise

↓
25.Jul.2019 002
Page.15 (Example) In case of RCRT=3.6 kΩ, CCRT=0.1 μF

Insert unit each formula.
Page.19 OUTx pin Short Circuit Protection(SCP) Revise

the PBUS pin low after a delay open tSCPR (40 μs (Typ))
↓
the PBUS pin low after a delay open tSCPD1 (60 μs (Typ))
Page.11 𝑉𝑈𝑉𝐿𝑂_𝑉𝐼𝑁𝑅𝐸𝑆𝑅 ≤ 𝑉𝑂𝑈𝑇𝑥_𝑀𝐴𝑋 + 𝑉𝐸𝑆

↓
𝑉𝑈𝑉𝐿𝑂_𝑉𝐼𝑁𝑅𝐸𝑆𝑅 ≤ 𝑉𝑂𝑈𝑇𝑥_𝑀𝐴𝑋
8.Apr.2022 003
Page.23 Figure 22 CH4 Output=OFF→ON
・MSET1=L, MSET2=H, OUT1 to OUT3 OPEN Detect=Detect.
・MSET1=L, MSET2=H, OUT1 to OUT3 SCP=Detect.
TSZ22111 • 15 • 001 8.Apr.2022 Rev.003
Notice
Precaution on using ROHM Products
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅡb
CLASSⅢ CLASSⅢ
CLASSⅣ CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE Rev.001

Bd183x7efv m e

Uploaded by

Copyright:

Available Formats

Bd183x7efv m e

Uploaded by

Document Information

Copyright

Available Formats

Share this document

Share or Embed Document

Sharing Options

Did you find this document useful?

Is this content inappropriate?

Copyright:

Available Formats

Bd183x7efv m e

Uploaded by

Copyright:

Available Formats

Datasheet

For Automotive, 40 V 150 mA 4ch

Typical Application Circuit

1 VINRES Energy sharing external resistor connection(Note 1)

V B G : Internal Reference Voltage

Bandgap VREG OVM Current

GND SET1 SET2 SET3 SET4

Absolute Maximum Ratings (Ta=25 °C)

Supply Voltage (VIN) VIN -0.3 to +40.0 V

Supply Voltage (VINRES) VINRES -0.3 to +40.0 < VIN V

VIN to VINRES Pin Voltage VVIN_VINRES -0.3 to +10.0 V

CRT, DISC Pin Voltage VCRT, VDISC -0.3 to +40.0 V

MSET1, MSET2 Pin Voltage VMSET1, VMSET2 -0.3 to +20.0 V

OUT1,OUT2,OUT3,OUT4 Pin Voltage VOUT1, VOUT2, VOUT3, VOUT4 -0.3 to VIN+0.3V V

PBUS Pin Voltage VPBUS -0.3 to +20.0 V

Storage Temperature Range Tstg -55 to +150 °C

Maximum Junction Temperature Tjmax 150 °C

Recommended Operating Conditions

Supply Voltage (VIN)(Note 1) VIN 5.5 13.0 20.0 V

Output Current (each channel) IOUTx - - 150 mA

CR Timer Frequency fPWM - - 750 Hz

PWM Minimum Pulse Width tMIN 100 - - µs

Operating Temperature Topr -40 - +125 °C

Electrical Characteristics (Unless otherwise specified, Ta=-40 °C to +125 °C, VIN=13 V)

ON Resistance Between the VIN RVIN

[LED Open Detection]

VIN Pin Voltage VIN_OPM 10.5 11.0 11.5 V BD18337EFV-M

VIN Pin Voltage VIN_OPM 7.30 7.65 8.00 V BD18347EFV-M

[OUTx pin Short Circuit Protection (SCP)]

OUTx Pin Short Circuit

SCP Detect Delay Time 1 tSCPD1 10 60 150 µs Refer to Figure 17

SCP Detect Delay Time 2 tSCPD2 - 20 - µs Refer to Figure 17

SCP Release Delay Time tSCPR - 40 - µs Refer to Figure 17

SCP Protection Disable Time at

SETx Pin Voltage VSETx 1.08 1.20 1.32 V

SETx Pin Short Detection RSETx

CRT Pin Charge Current ICRT 36 40 44 μA

CRT Pin Charge Voltage VCRT_CHA 0.72 0.80 0.88 V

DISC Pin ON Resistance 1 RDISC1 20 50 100 Ω IDISC=10 mA

DISC Pin ON Resistance 2 RDISC2 2.5 5 10 kΩ IDISC=100 μA

CRT Pin Leakage Current ICRT_LEAK - - 10 μA VCRT=VIN

[Over Voltage Mute Function (OVM)]

Input High Voltage VPBUSH 2.4 - - V

Input Low Voltage VPBUSL - - 0.6 V

PBUS Pin Source Current IPBUS 75 150 300 μA

PBUS Pin Leakage Current IPBUS_LEAK - - 10 μA VPBUS=7 V

UVLO VINRES VUVLO

MSET1, MSET2 Input H Voltage VMSETH 2.4 - - V

MSET1, MSET2 Input L Voltage VMSETL - - 0.6 V

MSET1, MSET2 Pin

Typical Performance Curves (Reference Data)

Output Current: IOUTx[mA]

Figure 1. Circuit Current in Normal Mode Figure 2. Output Current

Figure 3. Output Current vs Supply Voltage Figure 4. Output Current vs Temperature

Typical Performance Curves (Reference Data) – continued

CRT Pin Charge Resistance: RCHA[kΩ]

1. Output Current Setting and Power Control

●Required VIN for set current to flow

𝑉𝐼𝑁 ≥ 𝑉𝑓_𝐿𝐸𝐷 × 𝑁 + 𝑉𝐷𝑅 + 𝑅𝑉𝐼𝑁_𝑉𝐼𝑁𝑅𝐸𝑆 × 𝐼𝑂𝑈𝑇𝑥_𝑇𝑂𝑇𝐴𝐿 [V]

Figure 7. Output Current Setting