3 SF 21
3 SF 21
3 SF 21
PC3SF21YVZ Series
VDRM : 600V, Reinforced insulation type Zero cross type DIP 6pin Phototriac Coupler for triggering
Description
PC3SF21YVZ Series reinforced insulation type Phototriac Coupler include an infrared emitting diode (IRED) optically coupled to an output Phototriac. These devices feature full wave control and are ideal isolated drivers for medium to high current Triacs. DIP package provides 5.0kV isolation from input to output with superior commutative noise immunity.
Agency approvals/Compliance
1. Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. 3SF21) 2. Approved by CSA, file No. CA95323 (as model No. 3SF21) 3. Approved by BSI : BS-EN60065, file No. 6690/BSEN60950, file No. 7421, (as model No. 3SF21) 4. Approved by SEMKO, EN60065/EN60950, file No. 0033029 (as model No. 3SF21) 5. Approved by DEMKO, EN60065/EN60950, file No. 310107 (as model No. 3SF21) 6. Approved by FIMKO, EN60065/EN60950, file No. 15795 (as model No. 3SF21) 7. Approved by VDE ( ) (DIN EN 60747-5-2), file No. 40008189 (as model No. 3SF21) 8. Package resin : UL flammability grade (94V-0)
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Features
1. High repetitive peak off-state voltage (VDRM : 600V) 2. Zero crossing functionality (VOX : MAX. 20V) 3. IFT ranks available (see Model Line-up section in this datasheet) 4. 6 pin DIP package 5. Reinforced insulation type (MIN. 0.4mm internal separation) 6. Superior noise immunity (dV/dt : MIN. 1 000V/s) 7. Lead-free components are also available (see Model Line-up section in this datasheet) 8. Double transfer mold construction (Ideal for Flow Soldering) 9. High isolation voltage between input and output (Viso(rms) : 5.0kV)
DIN EN60747-5-2 : successor standard of DIN VDE0884 Up to Date code "RD" (December 2003), approval of DIN VDE0884. From Date code "S1" (January 2004), approval of DIN EN60747-5-2.
Applications
1. Triggering for Triacs used to switch on and off devices which require AC Loads. For example heaters, fans, motors, solenoids, and valves. 2. AC line control in power supply applications.
Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Outline Dimensions
1. Through-Hole [ex. PC3SF21YTZ]
1.20.3 0.60.2 SHARP mark "S" Anode mark
1 6 5 4
1.20.3
4
6.50.5
4
2 3
4
1 2 3
Date code (2 digit) Factory identification mark 7.620.3 0.5TYP. 3.50.5 VDE identification mark
7.120.5
7.120.5
2.90.5
3SF21
3SF21
Epoxy resin
0.1
2.90.5
Epoxy resin
0.5
2.540.25
0.5
3.250.5
: 0 to 13
2.540.25
0.50.1
10.16
0.26
0.1
Product mass : approx. 0.35g 4. Wide SMT Gullwing Lead-Form [ex. PC3SF21YWP]
0.60.2 1.20.3
5 4
1.20.3
4
6.50.5
4
1 2 3
0.26
6.50.5
3SF21
3SF21
2.540.25
1.0+0.4 0
1.0+0.4 0
2.540.25
Epoxy resin
0.75
0.25
10.160.5 12.0
MAX.
0.750.25
A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001
Mark P R S T U V W X A B C
Country of origin
Rank mark
Refer to the Model Line-up table
PC3SF21YVZ Series
Absolute Maximum Ratings
Parameter Symbol Rating IF 50 Forward current Input VR 6 Reverse voltage IT(rms) 0.1 RMS ON-state current *3 Output Peak one cycle surge current 1.2 Isurge 600 Repetitive peak OFF-state voltage VDRM *1 5.0 Viso (rms) Isolation voltage 30 to +100 Topr Operating temperature 55 to +125 Tstg Storage temperature *2 270 *4 Tsol Soldering temperature
*1 40 to 60%RH, AC for 1minute, f=60Hz *2 For 10s *3 f=50Hz sine wave *4 Lead solder plating models: 260C
(Ta=25C) Unit mA V A A V kV C C C
Soldering area
Electro-optical Characteristics
Parameter Forward voltage Input Reverse current Repentitive peak OFF-state current ON-state voltage Output Holding current Critical rate of rise of OFF-state voltage Zero cross voltage Transfer Minimum trigger current characteristics Isolation resistance Turn-on time Rank A Rank B Symbol VF IR IDRM VT IH dV/dt VOX IFT RISO ton Conditions IF=20mA VR=3V VD=VDRM IT=0.1A VD=4V VD=1/2 VDRM IF=15mA, Resistance load VD=4V, RL=100 DC500V,40 to 60%RH VD=4V, RL=100, IF=20mA MIN. TYP. 1.2 0.1 1 000 2 000 51010 1011
1mm
PC3SF21YVZ Series
Model Line-up (1) (Lead-free components)
Lead Form Shipping Package DIN EN60747-5-2 Model No. Approved PC3SF21YTZAF PC3SF21YTZBF Through-Hole SMT Gullwing Sleeve 50pcs/sleeve Approved PC3SF21YXZAF PC3SF21YXZBF Wide Through-Hole Rank mark Approved PC3SF21YVZAF PC3SF21YVZBF A B MAX.10 MAX.7 IFT[mA] (VD=4V, RL=100)
SMT Gullwing
Wide SMT Gullwing Taping 1 000pcs/reel Rank mark Approved PC3SF21YWPAF PC3SF21YWPBF A B MAX.10 MAX.7 IFT[mA] (VD=4V, RL=100)
SMT Gullwing
Rank mark
A B
Please contact a local SHARP sales representative to inquire about production status.
8 7 6 5 4 3 2 1
0C
25C
1 0.9
1.1
1.2
1.3
1.4
1.5
0 40
20
20
40
60
80
100
20
20
40
60
80
100
0.1
107
108
0.01 40
20
20
40
60
80
100
109 40
20
20
40
60
80
100
10
0 40
20
20
40
60
80
100
Remarks : Please be aware that all data in the graph are just for reference.
Degradation
In general, the emission of the IRED used in Phototriac Couplers will degrade over time. In the case where long term operation and / or constant extreme temperature fluctuations will be applied to the devices, please allow for a worst case scenario of 50% degradation over 5years. Therefore in order to maintain proper operation, a design implementing these Phototriac Couplers should provide at least twice the minimum required triggering current from initial operation.
2.54
2.54
2.54
2.54
1.7
2.2
2.2
1.7
(Unit : mm)
Zero Crossing Circuit Note) Please add the snubber circuit according to a condition. Any snubber or varistor used for the above mentioned scenarios should be located as close to the main output triac as possible.
For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Sheet No.: D2-A08101EN
PC3SF21YVZ Series
Manufacturing Guidelines Soldering Method Reflow Soldering:
Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice.
(C) 300
200
Reflow 220C or more, 60s or less 100 Preheat 150 to 180C, 120s or less
(min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 270C and within 10s. Preheating is within the bounds of 100 to 150C and 30 to 80s. Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400C. Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions.
10
Ultrasonic cleaning :
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production.
Presence of ODC
This product shall not contain the following materials. And they are not used in the production process for this device. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
11
PC3SF21YVZ Series Package specification Sleeve package 1. Through-Hole or SMT Gullwing Package materials
Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer
Package method
MAX. 50pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its anode mark on the tabless stopper side. MAX. 20 sleeves in one case.
520
6.7
5.8
10.8
(Unit : mm)
Package method
MAX. 50pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its anode mark on the tabless stopper side. MAX. 20 sleeves in one case.
6.35
5.9
10.8
520
(Unit : mm)
Sheet No.: D2-A08101EN
12
PC3SF21YVZ Series Tape and Reel package 1. SMT Gullwing Package materials
Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS
B H A K H
X. MA
C 1.750.1 J 4.20.1
D 12.00.1 K 7.80.1
E 2.00.1
F 4.00.1
Dimensions List a b
f a b
330 e 231.0
17.51.5 f 2.00.5
Pull-out direction
[Packing : 1 000pcs/reel]
13
B A H
C 1.750.1 J 4.150.1
D 12.00.1 K 7.60.1
E 2.00.1
MA
X.
f b
Pull-out direction
[Packing : 1 000pcs/reel]
14
15