Intro

Thermal
Management
Assoc. Prof. Dr. Azizan Aziz
EBB 526 Electronic Packaging
Introduction
School of Materials and Mineral Resources

14 August 2007 Engineering
Why Thermal Management
Thermal management encompasses the

technology of the generation and control of heat
in electronics circuit
Heat is an unavoidable by-product of every

electronic device and circuit
Heat is detrimental to performance and reliability
Size Reduction,increase performance and placing

more functions make thermal management a
priority in the design cycle in order to maintain
system performance and reliability
There are three fundamental questions to be
considered in thermal management :
How and where is heat generated

Many sources of heat in electronic circuit all of which must be
considered
How is the temperature at a given point in the

circuit determined
Thermal analysis is not an exact science. Heat conduction is
reasonably well defined but most thermal models relating to
radiation and convection are empirically determined for all but
the simplest of geometries

How is heat removed
The generated heat must be carried away from the device
and dissipated safely
Requires design and construction of an efficient heat path
from the device through the mounting surface(s) to the
outside world
Can be a simple clip-on heat sink or as complicated as
thermoelectric cooler attached to finned heat sink with
circulating liquid nitrogen.

Thermal Effects on Electronic Circuits
Both the performance and reliability of electronic

circuits are strongly influenced by temperature
Exposure to temperature above the maximum

operating and storage temperature might lead to
failure to perform certain specification or complete
failure.

The detrimental effect to excessive temperature may
classified into 3 types
Failure Mode Characteristic

Soft failures Circuit continues to operate but does not meet specification
when the temperature is elevated beyond the maximum
operating temperature.
Circuits return to normal operation when temperature is
lowered
Failure is due to change in component parameters with
temperature
Hard failures (short Circuit doesn not operate

term) Circuit may or may not return to normal operation when
temperature is lowered
Failure is likely due to component or interconnection
breakdown, but may also be due to changes in component
parameters with temperature.

The detrimental effect to excessive temperature may
classified into 3 types (continue)
Failure Mode Characteristic

Hard failures (long Circuit dos not operate at any temperature
term) Failure irreversible
Failure may be caused by corrosion, intermetallic formation or
similar phenomena
Failure may also be caused by mechanical stresses due to
differences in temperature coefficient of expansion (TCE)
between a component and the substrate
Soft failures happen as a result of the tendency of

the parameters of both active and passive
components to exhibit a degree of sensitivity to
temperature

As the temperature increases, the cumulatives
effects of component parameter drift may eventually
cause he circuit output to deviate from the
specification
Hard failures (short term) may occur as a result

component overload because of excessive heat or
breakdown of component attach or packaging
materials.
Hard failures (long term) due a variety of reasons

such as corrosion,chemical reactions, intermetallic
compound formation (all accelarated by elevated
temp).or to mechanical stresses because of CTE
mismatch

To maximise circuit performance and reliability, it is
important
to be able to predict the maximum operating

and storage temperatures
To design and package electronic circuits

which minimize the heat generated during
operation
To minimize circuit temperature by

employing adequate thermal management

Temperature Effects on Passive Components
Passive components are:

- Resistors
-capacitors (Ceramic chip,MOS,tantalum solid
electrolytic)
-Inductors and Transformers
The fundamental materials properties such as conductivity,

permittivity or permeability which determine the parameters of
passive components exhibit a dependence on temperature to a
greater or lesser degree

These changes may be +ve or ve, linear or
nonlinear,permanent or temporary,
May be due to a variety of factors including physical

changes in the materials or variation in the lattice
structure.
Conductivity vs temp

Dissipation factor vs.temperature

Temperature Effects on Active Semiconductors
Devices
Active components are:

- Diodes
- Bipolar Transistors
- Field Effect Transistor

Thermal Properties
Selecting the right materials can be a key

element of practicing good thermal
management
Thermal conductivity, specific heat, CTE,

together with density,modulus of elasticity and
tensile strength are among the properties that
has to be evaluate

Thermal Conductivity
Thermal conductivity,k is defined by time rate of thermal energy

(heat) transfer as it conducts between opposite faces of a cubic
volume of materials and the temperature varies by 1 K
Thermal conductivity indicates the efficiency of a material when

heat flows flows from cooler to warmer region is defined as
dT (1)
q k
dx
Where q = heat flux in W/m2
k = thermal conductivity in W/m-K
dT/dx = temperature gradient, K/m in steady state

-ve sign denotes heat flows from areas of higher temperature to
areas of lower temp
Lower k values poor thermal performance
Measurement of k direct or indirect methods

ASTM direct method C408-88 while E1461-92 indirect using
thermal pulse or heat flash
Thermal conductivity can be calculated from the thermal

diffusivity,density and specific heat capacity
C P (2)
Where = thermal conductivity in W/m-K

= density g/m3
= thermal diffusivity in m2/s
CP = spesific heat capacity (W-s)/(g-K)
Thermal Capacity and Specific Heat
Materials can absorb energy in the form of heat and release it
Thermal capacity is defined as the amount of thermal energy

required required to raise the temperature of one mole of material
by 1 kelvin
dQ
C (3)
dT
where C=heat capacity in W-s/mol-K
Q= energy in W-s
T = temperature in K

Thermal Coefficient of Expansion (TCE)
TCE is a result of asymmetrical changes in the interatomic spacing

of atoms due to the increased energy content in the form of heat
Most metals and ceramics exhibits a linear,isotropic relationship in

the temperature range of interest while polymers are anisotropic in
nature due to behaviors above and below Tg
TCE values for polymers are several times larger above Tg than
below it
TCE is defined as
L(T2 ) L(T1 )
(4)
L(T1 )(T2 T1 )

where =TCE, 1/oC
T1 = initial temperature
T2= final temperature
L (T1) = length at initial temperature
L(T2) = length at final temperature
is often multiplied by 106 with corresponding units of parts per
million length change per kelvin, ppm/K

Modulus of Elasticity (E)
Modulus of elasticity is the measure of rigidity or stiffness of a

material, which can be described as the plastic deformation under
load
E, is the ratio of stress below the proportional limit,compared to the

corresponding strain and can be represented by the slope of the
initial stress-strain curve.
E can be reprsented by Ee (5)
where = stress in psi or N/m2

E = modulus of elasticity in psi or N/m2
e = strain in m/m, the net elongation
The units of E are generally listed as GPa

Tensile Strength
Tensile strength is the amount of stress applied to stretch a

material to its breaking point
Both tensile strength and E depend upon the purity depend upon
the purity and processing of seemingly equivalent materials
Scan a tensile-strain curve

END


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Thermal

Assoc. Prof. Dr. Azizan Aziz

EBB 526 Electronic Packaging

School of Materials and Mineral Resources

Thermal management encompasses the

Heat is an unavoidable by-product of every

Heat is detrimental to performance and reliability

Size Reduction,increase performance and placing

How and where is heat generated

How is the temperature at a given point in the

School of Materials and Mineral Resources

School of Materials and Mineral Resources

Both the performance and reliability of electronic

Exposure to temperature above the maximum

School of Materials and Mineral Resources

Failure Mode Characteristic

Hard failures (short Circuit doesn not operate

School of Materials and Mineral Resources

Failure Mode Characteristic

Soft failures happen as a result of the tendency of

School of Materials and Mineral Resources

Hard failures (short term) may occur as a result

Hard failures (long term) due a variety of reasons

School of Materials and Mineral Resources

to be able to predict the maximum operating

To design and package electronic circuits

To minimize circuit temperature by

School of Materials and Mineral Resources

Passive components are:

The fundamental materials properties such as conductivity,

School of Materials and Mineral Resources

May be due to a variety of factors including physical

School of Materials and Mineral Resources

School of Materials and Mineral Resources

Active components are:

School of Materials and Mineral Resources

Selecting the right materials can be a key

Thermal conductivity, specific heat, CTE,

School of Materials and Mineral Resources

Thermal conductivity,k is defined by time rate of thermal energy

Thermal conductivity indicates the efficiency of a material when

School of Materials and Mineral Resources

Measurement of k direct or indirect methods

Thermal conductivity can be calculated from the thermal

Where = thermal conductivity in W/m-K

Thermal capacity is defined as the amount of thermal energy

School of Materials and Mineral Resources

TCE is a result of asymmetrical changes in the interatomic spacing

Most metals and ceramics exhibits a linear,isotropic relationship in

School of Materials and Mineral Resources

School of Materials and Mineral Resources

Modulus of elasticity is the measure of rigidity or stiffness of a

E, is the ratio of stress below the proportional limit,compared to the

E can be reprsented by Ee (5)

where = stress in psi or N/m2

The units of E are generally listed as GPa

Tensile strength is the amount of stress applied to stretch a

Scan a tensile-strain curve

School of Materials and Mineral Resources