Huawei FusionServer RH8100 V3 Technical Presentation
Huawei FusionServer RH8100 V3 Technical Presentation
Huawei FusionServer RH8100 V3 Technical Presentation
Technical Presentation
www.huawei.com
3 Click to
RH8100 V3 Feature add Title
Highlights
4 Global References
In-Memory In-memory
Database reliability and u ptime
+
+99.99% scalability
Computing
Hot-plug Memory
RH8100
8P server
Updated to E7 v3 in 2015Q3
RH5885 V3 and
RH5885 V2(8S) RH5885H V3
Updated to E7 v3 in 2015Q3
RH5885 V2(4S)
Boxboro-EX Brickland
Intel® Xeon® Intel® Xeon® processor Intel® Xeon® processor
Intel® Xeon® processor E7-
processor E7-8800/4800/2800 v2 E7-8800/4800/2800 v3 Future
8800/4800/2800 product families
7500/6500 series product families product families Xeon® E7
(NHM-EX) (WSM-EX) (HSW-EX)
(IVB-EX)
3 Click to
RH8100 V3 Feature add Title
Highlights
4 Global References
RAS 2.0 technologies onsite demo, including hot-swappable memory and PCIe
• High reliability:60 RAS features, support memory module hot swappable and hardware partition
Highlights
HDD
3 optional front modules:
8,12 or 24 HDD s
Multiple RAID functions
Diagnostics panel
PSU
4 PSUs
94%,platinum PSU
Support 2 + 2, or 1 + 1
Support power capping
4 PCIe slots, 6 PCIe slots, not
Ethernet Mezz card
hot-swappable hot-swappable
3 Click to
RH8100 V3 Feature add Title
Highlights
4 Global References
Reliable Easy
Performance
maintenance
Redundancy 1 Minute
Memory hot-plug Maintenance
Intel E7 v3 RAS
60+
RAS features
features
RAS 2.0
Technologies 40℃
Environment
Step by Step
High performance Fusion Console
HFC
step1_b: Report to
step1_c: User take Hot-swao
user
action
IVB-EX IVB-EX IVB-EX
step 3:data in memory
MEM-15
is online relocated
MEM-1
MEM-3
New -3
step 4&5:Swap
memory module
warnings
MEM-2
MEM-4
Sparing memory
module star PCT patent:PCT/CN2013/087XXX
working Applicant:Huawei Technologies Co. Ltd
Subject:A memory data migration method, computer and device
Running Error Sparing
PFA: Predictive Failure
Analysis
Hardware Partition-FusionPar
Total Partition-A Partition-B
• RH8100 V3 can be configured as
8 CPU CPU CPU CPU CPU CPU CPU CPU CPU
two 4-socket servers
96 DIMM
192 DIMM 96 DIMM • The users can configure it through
LCD panel or BMC management
6 HDD 6 HDD
12 HDD module
8 PCIe 8 PCIe • A gigabit Ethernet heartbeat
16 PCIe
locates between the two 4-socket
HFC-1 HFC-2
partitions
Single 8S Two 4S
mode mode
step1: Customer can partition it through BMC web UI or a button on LCD panel
step2: RH8100 V3 would automatically finish the remaining actions
SPECint_rate_base2006
SPECfp_rate_base2006
7000
5000
6000 5740
3960 3870
4000
5000
4170
4000 3000
2280
3000 2440 2000
2000
1000
1000
0
0 Power 780 Power E880 RH8100 V3
Power 780 Power E880 RH8100 V3
3600 5300
3400 5200
5100
3200
5000
3000
RH8100 V3 2800E2 x3960 X6 Superdome X
RH8100 V3 2800E2 Superdome X x3960 X6
3 Click to
RH8100 V3 Feature add Title
Highlights
4 Global References
Saudi STC Finland SAP China ICBC Italy San Matteo Italy
Hospital
China Telecom Singapore Bilot, Oy, Finland Russia Central Bank Kazakhstan Copaco Netherland
Requirements
An open and universal architecture is required to
reduce the costs.
The platform must be flexibly scalable to meet E-Business
development requirements for new services.
Application
servers
Solution
x86 8-socket servers are used to construct a cluster. x86 cluster DB Server
Based on universal, commercial software, the service substitute for
rollout is fast. midrange
Rich RAS features ensure high reliability.
computers
Benefits
The platform TCO is reduced by 50%.
The system running is stable, and mission-critical "The Huawei x86 servers used for constructing the travel e-commerce
applications run properly. platform greatly reduce the cost, shorten the service rollout time."
Solution
Huawei high-end 8-socket servers are used to run altered x86 server systems.
The scale-out architecture is introduced and services are migrated to Linux from AIX.
Huawei provides x86 servers, which feature low cost and high scale-out, and uses the
cluster, load balancing, etc..
Customer Benefits
Low TCO: The hardware procurement cost is reduced, expenditure is under control,
and the maintenance cost is reduced by 60%.
Optimized architecture: Simplified IT system facilitates scalability and a loose-couple
architecture meets service development requirements.
High performance: Performance of real-time accounting-related services is improved
by more than 50%
The existing chip simulation platform provides poor performance that cannot meet
simulation service requirements, impacting chip design verification and test tasks.
The chip simulation software provides poor concurrent capability and cannot be improved
through distributed deployment. To prevent the simulation process from being interrupted,
each single server must deliver high performance without breakdown.
Customer Benefits
The new chip simulation platform enables the calculation tasks, formerly require one day to
handle, to be completed within 1 hour.