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    Presentation RTN 950 A Hardware

    Uploaded by

    Sanwal Khushabi
    This document provides an overview of the RTN 950 A microwave system hardware. [1] It consists of an indoor unit (IDU) and outdoor unit (ODU) connected via an IF cable to provide seamless microwave transmission. [2] The IDU performs multiplexing, processing, control and system communication functions using various boards like the CSHO system control board and IF boards that support modulation schemes up to 4096 QAM. [3] The ODU converts frequencies, amplifies power and is available in two models: the XMC2 and newer XMC3 with compact size and higher modulation support.

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    © All Rights Reserved
    Download as PPTX, PDF, TXT or read online from Scribd

    Presentation RTN 950 A Hardware

    Uploaded by

    Sanwal Khushabi
    44 views20 pages
    This document provides an overview of the RTN 950 A microwave system hardware. [1] It consists of an indoor unit (IDU) and outdoor unit (ODU) connected via an IF cable to provide seamless microwave transmission. [2] The IDU performs multiplexing, processing, control and system communication functions using various boards like the CSHO system control board and IF boards that support modulation schemes up to 4096 QAM. [3] The ODU converts frequencies, amplifies power and is available in two models: the XMC2 and newer XMC3 with compact size and higher modulation support.

    Original Description:

    Huawei Radio RTN 950A

    Original Title

    Presentation RTN 950 a Hardware

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    This document provides an overview of the RTN 950 A microwave system hardware. [1] It consists of an indoor unit (IDU) and outdoor unit (ODU) connected via an IF cable to provide seamless microwave transmission. [2] The IDU performs multiplexing, processing, control and system communication functions using various boards like the CSHO system control board and IF boards that support modulation schemes up to 4096 QAM. [3] The ODU converts frequencies, amplifies power and is available in two models: the XMC2 and newer XMC3 with compact size and higher modulation support.

    Copyright:

    © All Rights Reserved
    Download as PPTX, PDF, TXT or read online from Scribd
    Download as pptx, pdf, or txt
    44 views20 pages

    Presentation RTN 950 A Hardware

    Uploaded by

    Sanwal Khushabi
    This document provides an overview of the RTN 950 A microwave system hardware. [1] It consists of an indoor unit (IDU) and outdoor unit (ODU) connected via an IF cable to provide seamless microwave transmission. [2] The IDU performs multiplexing, processing, control and system communication functions using various boards like the CSHO system control board and IF boards that support modulation schemes up to 4096 QAM. [3] The ODU converts frequencies, amplifies power and is available in two models: the XMC2 and newer XMC3 with compact size and higher modulation support.

    Copyright:

    © All Rights Reserved
    Download as PPTX, PDF, TXT or read online from Scribd
    Download as pptx, pdf, or txt
    of 20

    Microwave

    RTN 950 A HARDWARE


    Contents

     System Components
     Indoor Unit
     Outdoor Unit
     System Configuration
     Technical Specifications
    System Components

     Hardware Consists of an IDU and ODUs connected through an


    IF cable. It provide seamless microwave transmission solution
    for mobile communication or private networks
    Indoor Unit

     It performs service access


     Multiplexing
     IF Processing
     System Communication
     Control
    IDU Boards

     CSHO (System Control switching and Timing Board)


     IF Boards (IFU2, ISU2/ISX2, ISV3, ISM6)
     Ethernet Boards (EG4/EG4P)
     Ethernet Processing Boards (EM6D, EMS6, EFP8)
     TDM Interference Board (SL1DA, SP35/SP3D) Native
     TDM Interference Board (CQ1,ML1/MD1) Packet
     Multi-protocol processing Board (MN1)
     Auxiliary Interference Board
    CSHO

     System Hybrid control Switching and timing Board


     It provide system control, TDM cross connection, packet
    switching, clock processing and power functions
     Switching Capacity 10 Gbps
    IF Boards (IFU2, ISU2/ISX2, ISV3, ISM6)

     IFU2 Universal IF Board


    Mod Scheme: Up to 256 QAM
    Service Types: E1+Ethernet
    Air Interface Feature: ATPC, AM
     ISU2/ISX2:
    Supports XPIC , Mod Scheme: Up to 256 QAM
     ISV3:
    Mod Scheme: Up to 2048 QAM
     ISM6:
    Mod Scheme: Up to 4096 QAM
    Service Types: E1+Ethernet, 1xSTM or 2XSTM
    Air Interface Feature: ATPC, AM, XPIC,PLA/EPLA
    Ethernet service/processing Boards

     EG4/EG4P
    Four port GE-Interface Board that supports power over Ethernet
     EM6D
    It provides two 10 GE, 2.5GE ports and two GE ports
    SDB, E-Line, E-LAN
     EMS6
    FE/GE processing board that supports switching function
     EFP8
    8 port FE processing board that provide 8 FE ports
    Cont..

     SL1DA
    STM-1 interface board that provides two STM-1 optical/Electrical ports
     SP3S/SP3D
    E1 Tributary boards, SP3S provides 16-75 ohm or 120 ohm E1 ports.
    SP3D provides 32-75 ohm or 120 ohm E1 ports.
     CQ1
    STM-1 interface boards provides four STM-1 optical/ Electrical Ports
     MN1
    Multi-protocol processing board that provides CES service processing
    for E1 or STM 1 port on system control board.
    Aux interface Board

     Auxillary Interface Board


    Aux and management interface port it provides an order wire
    phone port, a synchronous data port and a 4-input/22-output
    port external alarm port.
    Outdoor unit

    Two Types of outdoor units used in RTN950 A:


    1. XMC2
    2. XMC3
     XMC2
     Converts the frequency and amplify the power of signals
     Operate at IS2 and IS3 modes
    Ports XMC2
    XMC3 Front

     New generation ODU with compact size, lower power


    consumption and higher modulation schemes
     Operate at IS3 or IS6 modes
    XMC3 ports

    XMC3 antenna port can adapt the polarization direction of antenna and does not need to be adjusted.
    Installation

    There are two techniques


     Direct Mounting
    Split Mounting
    System Configuration
    Cont..
    Technical Specifications
    Cont..

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