Pinfet: Ec 8252-Electronic Devices

Download as pptx, pdf, or txt
Download as pptx, pdf, or txt
You are on page 1of 15

EC 8252- ELECTRONIC DEVICES

PINFET

Jothibasu M
AP(Sr.Gr)/ECE
PSGiTech
PINFET
PINFET
PINFET--- p-intrinsic-n Field-Effect Transistor

 It is an optical receiver form by combining a postive-intrinsic-Negative (PIN)


phtotodiode and FET in a single housing

 The term “PINFET” (p-intrinsic-n, field-effect transistor) indicates the integration


of a PIN photodiode and a discrete, high-performance transimpedance amplifier
stage.
PINFET
 Photodiode in the PINFET has a large Intrinsic semiconductor region -
not doped or lightly doped

 It consists of a layer of intrinsic silicon sandwiched between heavily


doped P and N type Silicon materials

 The intrinsic silicon reduces the transit time of photo induced electron
hole pairs (distance travelled is less when compared to PN photodiode)

 Change in electrical conductivity - in accordance with the intensity of
incident light when photon is absorbed.
DEFINITION
 A monolithically integrated planar structure for an InP/InGaAs
optoelectronic circuit consisting of a pin photodiode and a
heterojunction field-effect transistor.

 (i.e.) PIN-FET integrated receiver formed by the combination of a PIN


photodiode and a Field Effect Transistor (FET) and packaged in single
housing.
INTRODUCTION
 The integration of multiple optical and electronic functions on a single

chip to achieve Opto-Electronic Integrated Circuits (OEIC), offers one

approach to low cost and high performance.

 using e.g. field-effect transistors (FET) has the potential of low

equivalent input noise current and improved receiver sensitivity.


Device design
 The monolithic integration of photodiode and FETs reveals the
difficulties of OEIC device technology.

 Optimized pin photodiodes requires a thick absorption layer with low


background doping concentration.

 In contrast FETs of high performance need a high doping


concentration in a thin channel layer.

 To integrate both components with respect to their optimized device


performances, different technologies have been developed on the basis
of "horizontal" and "vertical" integrated structures .

 Here we use a vertical integrated layer structure on a flat surface


substrate.
The layer structure consists of

 (i) a thick n-doped InP buffer layer, which reduces the series resistance and transit time
effects of the pin,

 (ii) a thick n-doped InGaAs absorption layer,

 (iii) a thin n-doped InGaAs channel layer and

 (iV) a thin n-doped InP window layer, which also enables good passivation by the SiN x
coating(to improve internal quantum efficiency).

 Beneath the region of the FET a buried p-layer has been incorporated. T

 The space charge region of this p-n junction reaches through the undoped InGaAs
absorption layer which acts as a buffer layer, and confines the lateral drain current to the
thin n-doped channel layer.
Structure of PINFET
Optimized performance of PINFET
To realize optimized performances for pin and FET the following conditions have
to be fulfilled:

 (i) For a high transconductance of the FET the doping level of the channel

layer should be high.

 (ii) In order to achieve high quantum efficiency in the pin, the absorption layer

thickness should be large.


ADVANTAGES
High sensitivity

Wide dynamic range


Application -

A basic optical communications link


 Light sources - Laser diode and LED

 Fiber acts as communication channel

 PIN photodiode at receiver end - converts modulated light in to

electrical signal

 Photodiode current is directly proportional to the incident optical

power

 PINFET pre-amplifiers provides low-noise pre-amplification


OTHER APPLICATIONS
1)Fiber optic gyro system
2) Fiber communication system
3)Fiber sensor system
4)Telecommunications line-terminating equipment or repeaters
5)Optical sensor systems
6) Fiber Optic Current Transformer (FOCT)
7) Fiber Optic Sensing
Thank you

You might also like