Scribd
Upload
39 views10 pages

Group 2

The document discusses MEMS microphones, including their fabrication process using silicon wafers, working principle which converts sound into electrical signals, packaging, advantages like low power and small size, applications in devices like phones and hearing aids, and key performance parameters.

Uploaded by

Phenias Manyasha
Copyright
© © All Rights Reserved
Available Formats
Download as PPTX, PDF, TXT or read online on Scribd
Download as pptx, pdf, or txt
39 views10 pages

Group 2

The document discusses MEMS microphones, including their fabrication process using silicon wafers, working principle which converts sound into electrical signals, packaging, advantages like low power and small size, applications in devices like phones and hearing aids, and key performance parameters.

Uploaded by

Phenias Manyasha
Copyright
© © All Rights Reserved
Available Formats
Download as PPTX, PDF, TXT or read online on Scribd
Download as pptx, pdf, or txt
Download as pptx, pdf, or txt
You are on page 1/ 10

MICROPHONES

GROUP 2
BELOVED MARIDZANYERE C17130229K
ASHLEY HWANDI C17131222G
RYNN MASHONGANYIKA C171308333V
NOMSA NYAMHANZA C17131846N
ZVIKOMBORERO RUSERE C17130900F
INTRODUCTION.
• The application of MEMS to microphones to
microphones has led to the development of small
microphones with very high performance.
• They exhibit almost no change in performance after
reflow soldering and have excellent temperature
characteristics.
• DEFINITION: Microphone is a device or transducer
that converts sound into electrical signal.
• is a transducer, which translates a perturbation of
the atmospheric pressure, i.e., sound, into an
electrical quantity.
FABRICATION AND WORKING PRINCIPLE

• . MEMS microphones use acoustic sensors that are


fabricated on semiconductor production lines using
silicon wafers and highly automated processes.
• Layers of different materials are deposited on top of a
silicon wafer and then the unwanted material is then
etched away, creating a moveable membrane and a
fixed back plate over a cavity in the base wafer.
• The sensor back plate is a stiff perforated structure
that allows air to move easily through it, while the
membrane is a thin solid structure that flexes in
response to the change in air pressure caused by
FABRICATION AND WORKING PRINCIPLE
• Changes in air pressure created by sound waves
cause the thin membrane to flex while the thicker
back plate remains stationary as the air moves
through its perforations.
• The movement of the membrane creates a change
in the amount of capacitance between the
membrane and the back plate, which is translated
into an electrical signal by the ASIC
WORKING PRINCIPLE
• The pressure variation leads to the vibration of
a mechanical mass, which, in turn, is
transformed into a capacitance variation.
• Sound pressure is typically expressed in Db
MEMS microphone packages
• MEMS microphone have hollow packages that consist of a substrate
with pads that can be soldered to a circuit board or flex circuit, and a
lid that creates a cavity where the acoustic sensor and the ASIC are
located.
• Most MEMS microphones use separate die for the MEMS sensor
and the interface ASIC, which allows the MEMS process to be
optimized for creating moving structures while a using a standard
CMOS process to fabricate the ASIC.
• The ASIC is wire bonded to sensor and the substrate, and a lid is then
placed over them and sealed to the substrate.
• MEMS microphones need to have a hole in their
package to allow sound to reach the acoustic
sensor. The sound inlet can be located either in the
lid (top port) or on the bottom next to the solder
• pads (bottom port). Bottom port microphones also
require a hole in the circuit board they are mounted
on to allow sound to reach the sound inlet.
ADVANTANTAGES
• MEMS microphones offer high SNR
• Low power consumption
• Good sensitivity
• Available in very small packages that are fully
compatible
• MEMS microphones exhibit almost no change in
performance after reflow soldering and have
excellent temperature characteristics
APPLICATIONS
• Hearing aids
• Telephones
• Public address systems
• Motion picture production
• Two ways radios
• Ultrasonic sensors
CONCLUSION
• The desire for better audio quality is pushing MEMS
microphones to higher performance levels.
• The following parameters are normally the most
important indicators of microphone performance:
• Signal-to-noise ratio (SNR)
• Sensitivity
• Noise floor
• Distortion (THD)
• Acoustic Overload Point (AOP)
• Frequency response
• Power supply rejection (PSR)

You might also like