Microelectromechanical Assignment Help: Problem 2.6: Dynamics With Matlab and Simulink
Microelectromechanical Assignment Help: Problem 2.6: Dynamics With Matlab and Simulink
Microelectromechanical Assignment Help: Problem 2.6: Dynamics With Matlab and Simulink
You are a young junior faculty member who has just hired your
first graduate student, Wayford Roppar. You have developed an
idea for using a sealed-cavity pressure-sensing silicon
diaphragm (1 mm across and 15 μm thick) that you’re sure will
make you famous and assure your tenure. You ask Wayford to
design a process flow for creating this simple structure, and
Wayford returns with the process flow detailed in Figure 1.
Then recreate a correct process flow along with the device cross
sections at each step and the associated mask set (with
dimensions).
Figure 1: Process flow for a pressure-sensing silicon diaphragm.
Process steps:
1. Start with a double-side-polished n-type silicon wafer.
2. Perform photolithography using 1-μm-thick positive
photoresist to define the diaphragm area.
3. Deep-reactive-ion etch the silicon to form the diaphragm; ash
resist.
4. Anodically bond the silicon wafer to a pyrex wafer.
we have,
S2y1(s)+2sy1(s)+4y1(s)= X(s)
function dy = fnc(t,y)
dy = zeros (2,1)
% create a column vector of all zeros
% to define the [y1; y2] array dy(1) = y(2) ;
% then define the state derivatives
dy(1) = y(2) ;
dy(2) = -4*y(1) - 2*y(2) + 1;
The full MATLAB script for the problem is posted at the end of the
solution. Note that the program fnc.m (which defines the function
fnc) and the program p2_6a.m must be in the same directory when
p2_6a.m is called.
H=tf(1,[1 2 4])
step(H)
bode(H)
to plot the step response of the above transfer function and its
Bode plot. The step response is the same as Figure 1; the bode plot
is shown in Figure 2.
The device cross sections at different steps and the mask needed
are shown in Figure 5 below. The side of the square on the mask is
calculated from equation 1 in Problem 3.8 above.
Figure 5: Corrected process flow and mask for a pressure-sensing silicon
diaphragm
Problem 4.13 : Crayon engineering: Create process and mask
set for a DEP trap
Step Description
1 Clean Piranha
2 Photolithography Using image reversal resist
and Mask 1. Thickness of
resist at least 1.5 µm (3 times
that of the layer to be lifted
off). Image reversal
(negative) resist necessary
for lift off process later on
%----------------------fnc.m------------------
function dy = fnc(t,y)
dy = zeros (2,1) % create a column vector of all
zeros
% to define the [y1;y2] array
dy(1) = y(2) ; % then define the state
derivatives
dy(2) = -4*y(1) - 2*y(2) + 1;
%----------------------END OF PROGRAM---------------
%-----------------------p2_6a.m-------------------
%MATLAB code for Problem 2.6a
%Use the code below to call the defined function fnc and plot the
response
%over 10 sec
%-----------------END OF PROGRAM------------------
%-------------------p2_6b.m----------------
%MATLAB code for Problem 2.6b
%----------------------------END OF
PROGRAM---------------------------