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Feng-Wei Kuo
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2020 – today
- 2023
- [j6]Sze-Teng Liong, Feng-Wei Kuo, Yee Siang Gan, Yu-Ting Sheng, Shih-Yuan Wang:
Predicting trajectory of crane-lifted load using LSTM network: A comparative study of simulated and real-world scenarios. Expert Syst. Appl. 228: 120215 (2023)
2010 – 2019
- 2019
- [j5]Kai Xu, Feng-Wei Kuo, Huan-Neng Ron Chen, Lan-Chou Cho, Chewnpu Jou, Mark Chen, Robert Bogdan Staszewski:
A 0.85mm2 51%-Efficient 11-dBm Compact DCO-DPA in 16-nm FinFET for Sub-Gigahertz IoT TX Using HD2 Self-Suppression and Pulling Mitigation. IEEE J. Solid State Circuits 54(7): 2028-2037 (2019) - [c5]Feng-Wei Kuo, Zhirui Zong, Huan-Neng Ron Chen, Lan-Chou Cho, Chewnpu Jou, Mark Chen, Robert Bogdan Staszewski:
A 77/79-GHz Frequency Generator in 16-nm CMOS for FMCW Radar Applications Based on a 26-GHz Oscillator with Co-Generated Third Harmonic. ESSCIRC 2019: 53-56 - 2018
- [j4]Naser Pourmousavian, Feng-Wei Kuo, Teerachot Siriburanon, Masoud Babaie, Robert Bogdan Staszewski:
A 0.5-V 1.6-mW 2.4-GHz Fractional-N All-Digital PLL for Bluetooth LE With PVT-Insensitive TDC Using Switched-Capacitor Doubler in 28-nm CMOS. IEEE J. Solid State Circuits 53(9): 2572-2583 (2018) - [j3]Feng-Wei Kuo, Masoud Babaie, Huan-Neng Ron Chen, Lan-Chou Cho, Chewnpu Jou, Mark Chen, Robert Bogdan Staszewski:
An All-Digital PLL for Cellular Mobile Phones in 28-nm CMOS with -55 dBc Fractional and -91 dBc Reference Spurs. IEEE Trans. Circuits Syst. I Regul. Pap. 65-I(11): 3756-3768 (2018) - 2017
- [j2]Feng-Wei Kuo, Sandro Binsfeld Ferreira, Huan-Neng Ron Chen, Lan-Chou Cho, Chewnpu Jou, Fu-Lung Hsueh, Iman Madadi, Massoud Tohidian, Mina Shahmohammadi, Masoud Babaie, Robert Bogdan Staszewski:
A Bluetooth Low-Energy Transceiver With 3.7-mW All-Digital Transmitter, 2.75-mW High-IF Discrete-Time Receiver, and TX/RX Switchable On-Chip Matching Network. IEEE J. Solid State Circuits 52(4): 1144-1162 (2017) - 2016
- [j1]Masoud Babaie, Feng-Wei Kuo, Huan-Neng Ron Chen, Lan-Chou Cho, Chewnpu Jou, Fu-Lung Hsueh, Mina Shahmohammadi, Robert Bogdan Staszewski:
A Fully Integrated Bluetooth Low-Energy Transmitter in 28 nm CMOS With 36% System Efficiency at 3 dBm. IEEE J. Solid State Circuits 51(7): 1547-1565 (2016) - [c4]Feng-Wei Kuo, Sandro Binsfeld Ferreira, Masoud Babaie, Huan-Neng Ron Chen, Lan-chou Cho, Chewnpu Jou, Fu-Lung Hsueh, Guanzhong Huang, Iman Madadi, Massoud Tohidian, Robert Bogdan Staszewski:
A Bluetooth low-energy (BLE) transceiver with TX/RX switchable on-chip matching network, 2.75mW high-IF discrete-time receiver, and 3.6mW all-digital transmitter. VLSI Circuits 2016: 1-2 - 2015
- [c3]Chuei-Tang Wang, Jeng-Shien Hsieh, Victor C. Y. Chang, En-Hsiang Yeh, Feng-Wei Kuo, Hsu-Hsien Chen, Chih-Hua Chen, Huan-Neng Ron Chen, Ying-Ta Lu, Chewnpu Jou, Hao-Yi Tsai, C. S. Liu, Doug C. H. Yu:
Power saving and noise reduction of 28nm CMOS RF system integration using integrated fan-out wafer level packaging (InFO-WLP) technology. 3DIC 2015: TS6.3.1-TS6.3.4 - [c2]Feng-Wei Kuo, Masoud Babaie, Huan-Neng Ron Chen, Kyle Yen, Jinn-Yeh Chien, Lanchou Cho, Fred Kuo, Chewnpu Jou, Fu-Lung Hsueh, Robert Bogdan Staszewski:
A fully integrated 28nm Bluetooth Low-Energy transmitter with 36% system efficiency at 3dBm. ESSCIRC 2015: 356-359 - 2014
- [c1]Feng-Wei Kuo, Huan-Neng Ron Chen, Kyle Yen, Hsien-Yuan Liao, Chewnpu Jou, Fu-Lung Hsueh, Masoud Babaie, Robert Bogdan Staszewski:
A 12mW all-digital PLL based on class-F DCO for 4G phones in 28nm CMOS. VLSIC 2014: 1-2
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