"Power saving and noise reduction of 28nm CMOS RF system integration using ..."

Chuei-Tang Wang et al. (2015)

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DOI: 10.1109/3DIC.2015.7334573

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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Chuei-Tang Wang, Jeng-Shien Hsieh, Victor C. Y. Chang, En-Hsiang Yeh, Feng-Wei Kuo, Hsu-Hsien Chen, Chih-Hua Chen, Huan-Neng Ron Chen, Ying-Ta Lu, Chewnpu Jou, Hao-Yi Tsai, C. S. Liu, Doug C. H. Yu:
Power saving and noise reduction of 28nm CMOS RF system integration using integrated fan-out wafer level packaging (InFO-WLP) technology. 3DIC 2015: TS6.3.1-TS6.3.4

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