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2020 – today
- 2024
[c9]Anshul Varma, Sumanth Gururajarao, HsinChen Chen, Tao Chen, Gordon Gammie, Hugh Mair, Jen-Hang Yang, Hao-Hsiang Yu, Shun-Chieh Chang, Cheng-Hao Yang, Li-An Huang, Kumar Ramanathan, Ramesh Halli, Efron Ho, Ta-Wen Hung, Sung S.-Y. Hsueh, LiangChe Li, Achuta Thippana, Ericbill Wang, Sa Hwang:
2.1 A 4nm 3.4GHz Tri-Gear Fully Out-of-Order ARMv9.2 CPU Subsystem-Based 5G Mobile SoC. ISSCC 2024: 36-38- [c8]Chien-Yu Lu, Bo-Jr Huang, Min-Chieh Chen, Ollie Tsai, Alfred Tsai, Eric Jia-Wei Fang, Yuju Cho, Harry H. Chen, Ping Kao, Ericbill Wang, Hugh Mair, Shih-Arn Hwang:
14.4 A Fully Digital Current Sensor Offering Per-Core Runtime Power for System Budgeting in a 4nm-Plus Octa-Core CPU. ISSCC 2024: 260-262 - 2023
- [c7]Bo-Jr Huang, Alfred Tsai, Lear Hsieh, Kathleen Chang, C.-J. Tsai, Jia-Ming Chen, Eric Jia-Wei Fang, Sung S.-Y. Hsueh, Jack Ciao, Barry Chen, Chuck Chang, Ping Kao, Ericbill Wang, Harry H. Chen, Hugh Mair, Shih-Arn Hwang:
A 5G Mobile Gaming-Centric SoC with High-Performance Thermal Management in 4nm FinFET. ISSCC 2023: 40-41 - 2022
- [c6]Ashish Nayak, HsinChen Chen, Hugh Mair, Rolf Lagerquist, Tao Chen, Anand Rajagopalan, Gordon Gammie, Ramu Madhavaram, Madhur Jagota, C. J. Chung, Jenny Wiedemeier, Bala Meera, Chao-Yang Yeh, Maverick Lin, Curtis Lin, Vincent Lin, Jiun Lin, Y. S. Chen, Barry Chen, Cheng-Yuh Wu, Ryan ChangChien, Ray Tzeng, Kelvin Yang, Achuta Thippana, Ericbill Wang, Shih-Arn Hwang:
A 5nm 3.4GHz Tri-Gear ARMv9 CPU Subsystem in a Fully Integrated 5G Flagship Mobile SoC. ISSCC 2022: 50-52 - 2021
- [c5]HsinChen Chen, Rolf Lagerquist, Ashish Nayak, Hugh Mair, Gokulakrishnan Manoharan, Ericbill Wang, Gordon Gammie, Efron Ho, Anand Rajagopalan, Lee-Kee Yong, Ramu Madhavaram, Madhur Jagota, Chi-Jui Chung, Sudhakar Maruthi, Jenny Wiedemeier, Tao Chen, Henry Hsieh, Daniel Dia, Amjad Sikiligiri, Manzur Rahman, Barry Chen, Curtis Lin, Vincent Lin, Elly Chiang, Cheng-Yuh Wu, Po-Yang Hsu, Jason Tsai, Wade Wu, Achuta Thippana, S. A. Huang:
A 7nm 5G Mobile SoC Featuring a 3.0GHz Tri-Gear Application Processor Subsystem. ISSCC 2021: 54-56 - [c4]Bo-Jr Huang, Eric Jia-Wei Fang, Sung S.-Y. Hsueh, Rory Huang, Angus Lin, Chi-Hsun Chiang, Yi-Hsuan Lin, Wen-Wen Hsieh, Barry Chen, Yi-Chang Zhuang, Cheng-Yuh Wu, Jia-Ming Chen, Y. S. Chen, Cheng-Tien Wan, Ericbill Wang, Alex Chiou, Ping Kao, Yuwen Tsai, Harry H. Chen, Shih-Arn Hwang:
35.1 An Octa-Core 2.8/2GHz Dual-Gear Sensor-Assisted High-Speed and Power-Efficient CPU in 7nm FinFET 5G Smartphone SoC. ISSCC 2021: 490-492 - 2020
- [c3]Hugh Mair, Ericbill Wang, Ashish Nayak, Rolf Lagerquist, Loda Chou, Gordon Gammie, HsinChen Chen, Lee-Kee Yong, Manzur Rahman, Jenny Wiedemeier, Ramu Madhavaram, Alex Chiou, Blundt Li, Vincent Lin, Rory Huang, Michael Yanq, Achuta Thippana, Osric Su, S. A. Huang:
2.5 A 7nm FinFET 2.5GHz/2.0GHz Dual-Gear Octa-Core CPU Subsystem with Power/Performance Enhancements for a Fully Integrated 5G Smartphone SoC. ISSCC 2020: 50-52
2010 – 2019
- 2017
- [c2]Hugh Mair, Ericbill Wang, Alice Wang, Ping Kao, Yuwen Tsai, Sumanth Gururajarao, Rolf Lagerquist, Jin Son, Gordon Gammie, Gordon Lin, Achuta Thippana, Kent Li, Manzur Rahman, Wuan Kuo, David Yen, Yi-Chang Zhuang, Ue Fu, Hung-Wei Wang, Mark Peng, Cheng-Yuh Wu, Taner Dosluoglu
, Anatoly Gelman, Daniel Dia, Girishankar Gurumurthy, Tony Hsieh, W. X. Lin, Ray Tzeng, Jengding Wu, C. H. Wang, Uming Ko:
3.4 A 10nm FinFET 2.8GHz tri-gear deca-core CPU complex with optimized power-delivery network for mobile SoC performance. ISSCC 2017: 56-57 - 2016
- [c1]Hugh Mair, Gordon Gammie, Alice Wang, Rolf Lagerquist, C. J. Chung, Sumanth Gururajarao, Ping Kao, Anand Rajagopalan, Anirban Saha, Amit Jain, Ericbill Wang, Shichin Ouyang, Huajun Wen, Achuta Thippana, HsinChen Chen, Syed Rahman, Minh Chau, Anshul Varma, Brian Flachs, Mark Peng, Alfred Tsai, Vincent Lin, Ue Fu, Wuan Kuo, Lee-Kee Yong, Clavin Peng, Leo Shieh, Jengding Wu, Uming Ko:
4.3 A 20nm 2.5GHz ultra-low-power tri-cluster CPU subsystem with adaptive power allocation for optimal mobile SoC performance. ISSCC 2016: 76-77
Coauthor Index
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