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Thibault Buisson
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2010 – 2019
- 2012
- [c4]Wei Guo, Geert Van der Plas, Andrej Ivankovic, Geert Eneman, Vladimir Cherman, Bart De Wachter, Abdelkarim Mercha, Mario Gonzalez, Yann Civale, Augusto Redolfi, Thibault Buisson, A. Jourdan, Bart Vandevelde, Kenneth J. Rebibis, Ingrid De Wolf, Antonio La Manna, Gerald Beyer, Eric Beyne, Bart Swinnen:
3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps. ICICDT 2012: 1-4 - 2011
- [c3]Andrej Ivankovic, Geert Van der Plas, V. Moroz, M. Choi, Vladimir Cherman, Abdelkarim Mercha, Paul Marchal, Marcel Gonzalez, Geert Eneman, Wenqi Zhang, Thibault Buisson, Mikael Detalle, Antonio La Manna, Diederik Verkest, Gerald Beyer, Eric Beyne, Bart Vandevelde, Ingrid De Wolf, Dirk Vandepitte:
Analysis of microbump induced stress effects in 3D stacked IC technologies. 3DIC 2011: 1-5 - [c2]Antonio La Manna, Dimitrios Velenis, Thibault Buisson, Mikael Detalle, Kenneth J. Rebibis, Wenqi Zhang, Eric Beyne:
3D stacking using ultra thin dies. 3DIC 2011: 1-5 - 2010
- [c1]Anne Jourdain, Thibault Buisson, Alain Phommahaxay, Mark Privett, Dan Wallace, Sumant Sood, Peter Bisson, Eric Beyne, Youssef Travaly, Bart Swinnen:
300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications. 3DIC 2010: 1-4
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last updated on 2024-04-25 05:43 CEST by the dblp team
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