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2020 – today
- 2024
[j10]Zhenlin Pei
, Hsiao-Hsuan Liu, Mahta Mayahinia, Mehdi B. Tahoori, Francky Catthoor, Zsolt Tokei, Dawit Burusie Abdi, James Myers, Chenyun Pan:
Ultra-Scaled E-Tree-Based SRAM Design and Optimization With Interconnect Focus. IEEE Trans. Circuits Syst. I Regul. Pap. 71(10): 4597-4610 (2024)- [c27]Anshul Gupta, Shreya Kundu, Stefan Decoster, K. Sah, G. Delie, B. Truijen, Davide Tierno, Giulio Marti, O. Varela Pedreira, B. Kenens, Y. Hermans, C. Adelmann, B. de Wachter, Ivan Ciofi, G. Murdoch, A. Cross, Seongho Park, Zsolt Tokei:
Mitigating Line-Break Defectivity with a Sandwiched TiN or W Layer for Metal Pitch 18 NM Aspect Ratio 6 Semi-Damascene Interconnects. VLSI Technology and Circuits 2024: 1-2 - 2023
- [c26]Mahta Mayahinia, Hsiao-Hsuan Liu, Subrat Mishra, Zsolt Tokei, Francky Catthoor, Mehdi B. Tahoori:
Electromigration-aware design technology co-optimization for SRAM in advanced technology nodes. DATE 2023: 1-6 - [c25]Zhenlin Pei, Mahta Mayahinia, Hsiao-Hsuan Liu, Mehdi B. Tahoori, Francky Catthoor, Zsolt Tokei, Chenyun Pan:
Technology/Memory Co-Design and Co-Optimization Using E-Tree Interconnect. ACM Great Lakes Symposium on VLSI 2023: 159-162 - [c24]Melina Lofrano, Herman Oprins, Xinyue Chang, Bjorn Vermeersch, Olalla Varela Pedreira, Alicja Lesniewska, Vladimir Cherman, Ivan Ciofi, Kristof Croes, Seongho Park, Zsolt Tokei:
Towards accurate temperature prediction in BEOL for reliability assessment (Invited). IRPS 2023: 1-7 - [c23]Zhenlin Pei, Mahta Mayahinia, Hsiao-Hsuan Liu, Mehdi B. Tahoori, Shairfe Muhammad Salahuddin, Francky Catthoor, Zsolt Tokei, Chenyun Pan:
Emerging Interconnect Exploration for SRAM Application Using Nonconventional H-Tree and Center-Pin Access. ISQED 2023: 1 - [c22]Victor Vega-Gonzalez, D. Radisic, Bt Chan, S. Choudhury, S. Wang, A. Mingardi, Q. Toan Le, H. Decoster, Yusuke Oniki, P. Puttarame, Kevin Vandersmissen, J. P. Soulie, A. Peter, A. Sepulveda, D. Batuk, G. T. Martinez, Olivier Richard, Jürgen Bömmels, S. Biesemans, E. Dentoni Litta, Naoto Horiguchi, Seongho Park, Zsolt Tokei:
Integration of a Stacked Contact MOL for Monolithic CFET. VLSI Technology and Circuits 2023: 1-2 - 2022
- [c21]Zsolt Tokei:
Logic Scaling Options for the Next 10 Years: From FinFet to CFET, from Dual Damascene to Semi Damascene. FPGA 2022: 49 - [c20]Gayle Murdoch, Matin O'Toole, Giulio Marti, Ankit Pokhrel, Diana Tsvetanova, Stefan Decoster, Shreya Kundu, Yusuke Oniki, Arame Thiam, Quoc Toan Le, Olalla Varela Pedreira, Alicja Lesniewska, Gerardo Martinez-Alanis, Seongho Park, Zsolt Tokei:
First demonstration of Two Metal Level Semi-damascene Interconnects with Fully Self-aligned Vias at 18MP. VLSI Technology and Circuits 2022: 1-2 - 2021
- [c19]Stefan Nikolic, Francky Catthoor, Zsolt Tokei, Paolo Ienne:
Global Is the New Local: FPGA Architecture at 5nm and Beyond. FPGA 2021: 34-44 - [c18]Alicja Lesniewska, Olalla Varela Pedreira, Melina Lofrano, Gayle Murdoch, Marleen H. van der Veen, Anish Dangol, Naoto Horiguchi, Zsolt Tökei, Kris Croes:
Reliability of a DME Ru Semidamascene scheme with 16 nm wide Airgaps. IRPS 2021: 1-6 - [c17]Houman Zahedmanesh, Olalla Varela Pedreira, Zsolt Tokei, Kristof Croes:
Electromigration limits of copper nano-interconnects. IRPS 2021: 1-6 - 2020
- [c16]Alicja Lesniewska, Philippe J. Roussel, Davide Tierno, Victor Vega-Gonzalez, Marleen H. van der Veen, Patrick Verdonck, Nicolas Jourdan, Christopher J. Wilson, Zsolt Tökei, Kris Croes:
Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill. IRPS 2020: 1-6 - [c15]Olalla Varela Pedreira, Michele Stucchi, Anshul Gupta, Victor Vega-Gonzalez, Marleen van der Veen, Stephane Lariviere, Christopher J. Wilson, Zsolt Tökei, Kristof Croes:
Metal reliability mechanisms in Ruthenium interconnects. IRPS 2020: 1-7
2010 – 2019
- 2019
- [c14]Sofie Beyne, Olalla Varela Pedreira, Ingrid De Wolf, Zsolt Tökei, Kristof Croes:
Low-Frequency Noise Measurements to Characterize Cu-Electromigration Down to 44nm Metal Pitch. IRPS 2019: 1-6 - 2018
- [c13]Chen Wu, O. Varela Pedreira, Alicja Lesniewska, Yunlong Li, Ivan Ciofi, Zsolt Tökei, Kris Croes:
Insights into metal drift induced failure in MOL and BEOL. IRPS 2018: 3 - [c12]Kristof Croes, Vladimir Cherman, Melina Lofrano, Houman Zahedmanesh, Luka Kljucar, Mario Gonzalez, Ingrid De Wolf, Zsolt Tökei, Eric Beyne:
Stress mitigation of 3D-stacking/packaging induced stresses. IRPS 2018: 4 - [c11]Sofie Beyne, Shibesh Dutta, Olalla Varela Pedreira, Niels Bosman, Christoph Adelmann, Ingrid De Wolf, Zsolt Tökei, Kristof Croes:
The first observation of p-type electromigration failure in full ruthenium interconnects. IRPS 2018: 6 - 2017
- [j9]Luka Kljucar, Mario Gonzalez, Kristof Croes, Ingrid De Wolf, Joke De Messemaeker, Gayle Murdoch, Philip Nolmans, Joeri De Vos, Jürgen Bömmels, Eric Beyne, Zsolt Tökei:
Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects. Microelectron. Reliab. 79: 297-305 (2017) - [j8]Trong Huynh Bao, Julien Ryckaert, Zsolt Tokei, Abdelkarim Mercha, Diederik Verkest, Aaron Voon-Yew Thean, Piet Wambacq:
Statistical Timing Analysis Considering Device and Interconnect Variability for BEOL Requirements in the 5-nm Node and Beyond. IEEE Trans. Very Large Scale Integr. Syst. 25(5): 1669-1680 (2017) - 2016
- [j7]Luka Kljucar, Mario Gonzalez, Ingrid De Wolf, Kristof Croes, Jürgen Bömmels, Zsolt Tökei:
Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line. Microelectron. Reliab. 56: 93-100 (2016) - [j6]Houman Zahedmanesh, Mario Gonzalez, Ivan Ciofi, Kristof Croes, Jürgen Bömmels, Zsolt Tökei:
Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip-package interaction; a numerical investigation. Microelectron. Reliab. 59: 102-107 (2016) - 2015
- [c10]Praveen Raghavan, Marie Garcia Bardon, Doyoung Jang, P. Schuddinck, Dmitry Yakimets, Julien Ryckaert, Abdelkarim Mercha, Naoto Horiguchi, Nadine Collaert, Anda Mocuta, Dan Mocuta, Zsolt Tokei, Diederik Verkest, Aaron Thean, An Steegen:
Holisitic device exploration for 7nm node. CICC 2015: 1-5 - [c9]Ioannis Karageorgos, Michele Stucchi, Praveen Raghavan, Julien Ryckaert, Zsolt Tokei, Diederik Verkest, Rogier Baert, Sushil Sakhare, Wim Dehaene:
Impact of interconnect multiple-patterning variability on SRAMs. DATE 2015: 609-612 - [c8]Kris Croes, Alicja Lesniewska, Chen Wu, Ivan Ciofi, Agnieszka Banczerowska, B. Briggs, S. Demuynck, Zsolt Tökei, Jürgen Bömmels, Y. Saad, W. Gao:
Intrinsic reliability of local interconnects for N7 and beyond. IRPS 2015: 2 - [c7]Baojun Tang, Kris Croes, Nicolas Jourdan, Jürgen Bömmels, Zsolt Tökei, Ingrid De Wolf, Eric Wilcox, Timothy McMullen:
Constant voltage electromigration for advanced BEOL copper interconnects. IRPS 2015: 2 - [c6]Kris Croes, Deniz Kocaay, Ivan Ciofi, Jürgen Bömmels, Zsolt Tökei:
Impact of process variability on BEOL TDDB lifetime model assessment. IRPS 2015: 5 - [c5]Chenyun Pan, Praveen Raghavan, Francky Catthoor, Zsolt Tokei, Azad Naeemi:
Technology/circuit co-optimization and benchmarking for graphene interconnects at Sub-10nm technology node. ISQED 2015: 599-603 - 2014
- [j5]Bart Vandevelde, Andrej Ivankovic, B. Debecker, Melina Lofrano, Kris Vanstreels, Wei Guo, Vladimir Cherman, Marcel Gonzalez, Geert Van der Plas, Ingrid De Wolf, Eric Beyne, Zsolt Tokei:
Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling. Microelectron. Reliab. 54(6-7): 1200-1205 (2014) - [j4]Baojun Tang, Kris Croes, Yohan Barbarin, Yunqi Wang, Robin Degraeve, Yunlong Li, Maria Toledano-Luque, Thomas Kauerauf, Jürgen Bömmels, Zsolt Tökei, Ingrid De Wolf:
As-grown donor-like traps in low-k dielectrics and their impact on intrinsic TDDB reliability. Microelectron. Reliab. 54(9-10): 1675-1679 (2014) - [c4]Julien Ryckaert, Praveen Raghavan, Rogier Baert, Marie Garcia Bardon, Mircea Dusa, Arindam Mallik, Sushil Sakhare, Boris Vandewalle, Piet Wambacq, Bharani Chava, Kris Croes, Morin Dehan, Doyoung Jang, Philippe Leray, Tsung-Te Liu, Kenichi Miyaguchi, Bertrand Parvais, Pieter Schuddinck, Philippe Weemaes, Abdelkarim Mercha, Jürgen Bömmels, Naoto Horiguchi, Greg McIntyre, Aaron Thean, Zsolt Tökei, Shaunee Cheng, Diederik Verkest, An Steegen:
Design Technology co-optimization for N10. CICC 2014: 1-8 - [c3]Trong Huynh Bao, Dmitry Yakimets, Julien Ryckaert, Ivan Ciofi, Rogier Baert, Anabela Veloso, Jürgen Bömmels, Nadine Collaert, Philippe Roussel, S. Demuynck, Praveen Raghavan, Abdelkarim Mercha, Zsolt Tokei, Diederik Verkest, Aaron Thean, Piet Wambacq:
Circuit and process co-design with vertical gate-all-around nanowire FET technology to extend CMOS scaling for 5nm and beyond technologies. ESSDERC 2014: 102-105
2000 – 2009
- 2008
- [j3]Kristof Croes, G. Cannatá, L. Zhao, Zsolt Tökei:
Study of copper drift during TDDB of intermetal dielectrics by using fully passivated MOS capacitors as test vehicle. Microelectron. Reliab. 48(8-9): 1384-1387 (2008) - [c2]Jin Guo, Antonis Papanikolaou, Michele Stucchi, Kristof Croes, Zsolt Tokei, Francky Catthoor:
A tool flow for predicting system level timing failures due to interconnect reliability degradation. ACM Great Lakes Symposium on VLSI 2008: 291-296 - 2006
- [c1]Antonis Papanikolaou, Miguel Miranda, Hua Wang, Francky Catthoor, M. Satyakiran, Pol Marchal, Ben Kaczer, C. Bruynseraede, Zsolt Tokei:
Reliability issues in deep deep sub-micron technologies: time-dependent variability and its impact on embedded system design. VLSI-SoC 2006: 342-347 - 2005
- [j2]Yunlong Li, Zsolt Tökei, Philippe Roussel, Guido Groeseneken, Karen Maex:
Layout dependency induced deviation from Poisson area scaling in BEOL dielectric reliability. Microelectron. Reliab. 45(9-11): 1299-1304 (2005) - [j1]Zsolt Tökei, Yunlong Li, G. P. Beyer:
Reliability challenges for copper low-k dielectrics and copper diffusion barriers. Microelectron. Reliab. 45(9-11): 1436-1442 (2005)
Coauthor Index
aka: Kristof Croes
aka: Olalla Varela Pedreira
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